CN115616815A - Backlight module, display device and preparation method of backlight module - Google Patents
Backlight module, display device and preparation method of backlight module Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 102
- 238000000034 method Methods 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000004973 liquid crystal related substance Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 210000002858 crystal cell Anatomy 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
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- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133611—Direct backlight including means for improving the brightness uniformity
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0756—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The application discloses a backlight module, a display device and a preparation method of the backlight module. The backlight module comprises a driving substrate and a light emitting device group arranged on the driving substrate. The driving substrate comprises a plurality of through holes distributed in an array, so that light emitted by the light emitting device group positioned on the driving substrate can pass through the through holes to reach the other side of the driving substrate. The light emitting device group is at least partially overlapped with the through hole in the orthographic projection of the driving substrate, and the light emitting device group can emit light from two sides, so that the light emitting device group can directly emit light to the other side of the driving substrate through the through hole, the backlight module can emit light on one side of the driving substrate, which is far away from the light emitting device group, and one side of the driving substrate, which is towards the light emitting device group, and the two sides of the backlight module can uniformly emit light.
Description
Technical Field
The application relates to the field of display, in particular to a backlight module, a display device and a preparation method of the backlight module.
Background
With the continuous development of communication technology, the functions of electronic devices are diversified more and more. In order to meet the needs of users in various aspects such as office work, film watching and the like, more and more electronic devices are increasingly provided with display areas, such as screens of double-sided screens, pole screens, full-sided screens, folding screens and the like. The double-sided display makes two display screens connected on the same computer run simultaneously or asynchronously, and then the personnel on both sides of the display screen can share information or mutual information simultaneously.
In the prior art, a single backlight is generally adopted for a double-sided display screen, and the double-sided display screen with the single backlight has the problem of uneven double-sided light emission.
Disclosure of Invention
The embodiment of the application provides a backlight module, a display device and a preparation method of the backlight module, and aims to solve the problem of uneven light emission.
An embodiment of a first aspect of the present application provides a backlight module, including: the driving substrate comprises a plurality of through holes distributed in an array along a first direction and a second direction, and the first direction and the second direction are intersected; and the light-emitting device groups are arranged on the driving substrate, orthographic projections of the light-emitting device groups on the driving substrate are at least partially overlapped with the through holes, and the light-emitting device groups can emit light at least along the direction towards the driving substrate and the direction away from the driving backboard.
An embodiment of a second aspect of the present application provides a display device, which includes the backlight module according to any one of the above embodiments.
An embodiment of a third aspect of the present application provides a method for manufacturing a backlight module, where the method for manufacturing a backlight module is used to manufacture a backlight module of any one of the foregoing apparatuses, and the method includes:
preparing a driving substrate, wherein the driving substrate comprises a plurality of through holes distributed in an array manner along a first direction and a second direction, and the first direction and the second direction are intersected;
and preparing light emitting device groups on the driving substrate, wherein orthographic projections of the light emitting device groups on the driving substrate at least partially overlap the through holes, and the light emitting device groups can emit light at least in the direction towards the driving substrate and away from the driving back plate.
According to the backlight module of the embodiment of the application, the backlight module comprises a driving substrate and a light emitting device group arranged on the driving substrate. The driving substrate comprises a plurality of through holes distributed in an array mode, so that light emitted by the light emitting device group positioned on the driving substrate can pass through the through holes to reach the other side of the driving substrate. The light emitting device group is at least partially overlapped with the through hole in the orthographic projection of the driving substrate, and the light emitting device group can emit light from two sides, so that the light emitting device group can directly emit light to the other side of the driving substrate through the through hole, and the backlight module can emit light on one side of the driving substrate, which is far away from the light emitting device group, and one side of the driving substrate, which is towards the light emitting device group, so that the two sides of the backlight module can uniformly emit light.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, when taken in conjunction with the accompanying drawings in which like or similar reference characters identify like or similar features and which are not necessarily drawn to scale.
Fig. 1 is a schematic structural diagram of a backlight module according to an embodiment of the first aspect of the present disclosure;
FIG. 2 is an enlarged view of a portion of FIG. 1 at Q;
FIG. 3 is a partial cross-sectional view of a backlight module in an embodiment of the first aspect of the present application;
FIG. 4 is an enlarged fragmentary view at Q of FIG. 1 provided with another embodiment;
FIG. 5 is a partial cross-sectional view of a backlight module in another embodiment;
FIG. 6 is a partial cross-sectional view of a backlight module in a further embodiment;
FIG. 7 is a partial cross-sectional view of a backlight module in still another embodiment;
FIG. 8 is a partial cross-sectional view of a backlight module in a further embodiment;
fig. 9 is a schematic structural diagram of a display device according to an embodiment of the second aspect of the present application;
FIG. 10 is a schematic flowchart illustrating a method for manufacturing a backlight module according to an embodiment of the third aspect of the present disclosure;
description of the reference numerals:
10. a backlight module; 20. a display device;
100. a drive substrate; 101. a first drive circuit; 102. a second drive circuit; 110. a through hole;
200. a light emitting device group; 210. a first chip; 220. a second chip; 221. a first section; 222. a second subsection;
300. connecting the electrodes; 310. a first set of connection electrodes; 311. a first positive electrode; 312. a first negative electrode; 320. a second group of connection electrodes 321, a second positive electrode; 322. a second negative electrode;
400. a light diffusing structure; 410. a first portion; 420. a second portion;
510. a first liquid crystal cell; 520. a second liquid crystal cell;
x, a first direction; y, a second direction; z, third direction.
Detailed Description
Features of various aspects and exemplary embodiments of the present application will be described in detail below, and in order to make objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely configured to explain the present application and are not configured to limit the present application. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprises 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
It will be understood that when an element is referred to as being "on" or "over" another layer, region or layer in describing its structure, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
Can only the single face display problem for solving common display, satisfy needs double-sided display such as high-end official working, high-end commercial advertisement, intelligent house and produce by oneself, double-sided display makes two display screens of connecting on same computer host computer or asynchronous operation simultaneously, and then realizes that the personnel on display screen both sides can share information or mutual information simultaneously.
The backlight module of the current double-sided display comprises a reflector plate and a back plate, and the double-sided display is thicker and heavier and is far from the requirements of the current gradually thinned display. In order to make the dual-sided display thinner, it is necessary to design a new dual-sided display device.
In some related technologies, a dual-sided display includes a conventional backlight module and a display panel, and has a structure of a light guide plate, an upper polarizer, an upper reflector, a lower polarizer, a lower reflector, and the like, and an iron frame is disposed on a side of the backlight module away from the display panel. In order to realize the function of double-sided display, the iron frame on the back is hollowed to form an opening so as to perform double-sided display, and the reflectivity of the iron frame body and the reflectivity of the opening region are not consistent, so that the problem of uneven light emission on the back is solved.
In order to solve the above problems, embodiments of the present application provide a backlight module, a display device, and a method for manufacturing the backlight module, and embodiments of a display panel, the display device, and the method for manufacturing the display panel will be described below with reference to the accompanying drawings.
Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic structural diagram of a backlight module according to an embodiment of the first aspect of the present application; fig. 2 is a partial enlarged view at Q in fig. 1.
An embodiment of the first aspect of the present application provides a backlight module 10, including: a driving substrate 100 including a plurality of through holes 110 arrayed in a first direction and a second direction, the first direction and the second direction intersecting each other; and the light-emitting device groups 200 are arranged on the driving substrate 100, the orthographic projection of each light-emitting device group 200 on the driving substrate 100 at least partially overlaps each through hole 110, and the light-emitting device groups 200 can emit light at least along the direction towards the driving substrate 100 and away from the driving backboard.
According to the backlight module 10 of the embodiment of the present application, the backlight module 10 includes a driving substrate 100 and a light emitting device group 200 disposed on the driving substrate 100. The driving substrate 100 includes a plurality of through holes 110 distributed in an array, so that light emitted from the light emitting device group 200 located on the driving substrate 100 can pass through the through holes 110 to the other side of the driving substrate 100. The light emitting device group 200 is at least partially overlapped with the through hole 110 in the orthographic projection of the driving substrate 100, and the light emitting device group 200 can emit light on both sides, so that the light emitting device group 200 can directly emit light to the other side of the driving substrate 100 through the through hole 110, and thus the backlight module 10 can emit light on both the side of the driving substrate 100 departing from the light emitting device group 200 and the side facing the light emitting device group 200, and the double-sided uniform light emission of the backlight module 10 is realized.
Referring to fig. 2 and fig. 3 together, fig. 3 is a partial cross-sectional view of a backlight module according to an embodiment of the first aspect of the present application.
In some alternative embodiments, the backlight module 10 includes a connection electrode 300, the connection electrode 300 is located at a peripheral side of the through hole 110, the driving substrate 100 includes a driving circuit, and the light emitting device group 200 is connected to the driving circuit through the connection electrode 300.
In these alternative embodiments, the light emitting device group 200 is located on the driving substrate 100, and is connected to the driving circuit through the connection electrode 300, so that the light emitting device group 200 is controlled to emit light by the driving circuit, and the connection electrode 300 is located on the circumferential side of the through hole 110, so that the light emitting device group 200 located at the position of the through hole 110 is directly connected to the connection electrode 300, and the design is simple and the fabrication is convenient.
Referring to fig. 4 to 7, fig. 4 is a partial enlarged view of a portion Q in fig. 1 according to another embodiment; FIG. 5 is a partial cross-sectional view of a backlight module in another embodiment; FIG. 6 is a partial cross-sectional view of a backlight module according to yet another embodiment; FIG. 7 is a partial cross-sectional view of a backlight module in a further embodiment.
In some alternative embodiments, the light emitting device group 200 includes a first chip 210 and a second chip 220, the first chip 210 and the second chip 220 are stacked in a third direction, and the first chip 210 and the second chip 220 are arranged with a shift, and the third direction intersects with both the first direction and the second direction.
The first chip 210 and the second chip 220 are disposed in a staggered manner, for example, an orthographic projection of the first chip 210 on the driving substrate 100 and an orthographic projection of the second chip 220 on the driving substrate 100 only partially overlap, or an orthographic projection of the second chip 220 on the driving substrate 100 is located within the orthographic projection of the first chip 210 on the driving substrate 100, so that a part of the first chip 210 is exposed by an edge of the second chip 220 in the first direction X or the second direction Y.
In these alternative embodiments, the first chip 210 and the second chip 220 are stacked in the third direction, and the first chip 210 and the second chip 220 are controlled independently of each other, thereby enabling single-sided or double-sided light emission control of the light emitting device group 200. The first chip 210 and the second chip 220 are disposed in a staggered manner, so that both the first chip 210 and the second chip 220 can be connected to the connection electrode 300, so as to control light emission of the first chip 210 and the second chip 220.
As shown in fig. 4, in some alternative embodiments, the connection electrodes 300 include a first set of connection electrodes 310 and a second set of connection electrodes 320, the driving circuit includes a first driving circuit 101 and a second driving circuit 102, the first chip 210 is connected to the first driving circuit 101 through the first set of connection electrodes 310, and the second chip 220 is connected to the second driving circuit 102 through the second set of connection electrodes 320.
In these alternative embodiments, the first driving circuit 101 is connected to the first chip 210 through the first group of connection electrodes 310 to realize the light emission control of the first driving circuit 101 on the first chip 210, and the second driving circuit 102 is connected to the second chip 220 through the second group of connection electrodes 320 to realize the light emission control of the second driving circuit 102 on the second chip 220. The first and second driving circuits 101 and 102 independently control the first and second chips 210 and 220, respectively, to realize one-sided or two-sided light emission of the light emitting device group 200.
In some alternative embodiments, the first set of connecting electrodes 310 includes a first positive pole 311 and a first negative pole 312, and the second set of connecting electrodes 320300 includes a second positive pole 321 and a second negative pole 322.
In these alternative embodiments, the first chip 210 is connected to the first positive electrode 311 and the second negative electrode 322 to form a path, so as to implement the light emission control of the first chip 210, and the second chip 220 is connected to the second positive electrode 321 and the second negative electrode 322 to form a path, so as to implement the light emission control of the second chip 220.
With continued reference to fig. 4, in some alternative embodiments, the first set of connecting electrodes 310 includes a first positive electrode 311, the second set of connecting electrodes 320 includes a second positive electrode 321, and the first set of connecting electrodes 310 and the second set of connecting electrodes 320 share a third negative electrode.
In these alternative embodiments, the first chip 210 is connected to the first positive electrode 311 and the third negative electrode to form a path, so as to implement the light emission control of the first chip 210, and the second chip 220 is connected to the second positive electrode 321 and the third negative electrode to form a path, so as to implement the light emission control of the second chip 220. The first chip 210 and the second chip 220 share the third cathode, so that the preparation process is simplified while the light emission control is realized.
As shown in fig. 6, in some alternative embodiments, the first set of connecting electrodes 310 and the first chip 210 are located on one side of the substrate, and the second set of connecting electrodes 320300 and the second chip 220 are located on the other side of the substrate.
In these alternative embodiments, the first chip 210 and the second chip 220 are located on two sides of the substrate, and the first group of connection electrodes 310 is connected to the first chip 210 to implement the light emission control of the first driving circuit 101 on the first chip 210, and the second group of connection electrodes 320300 is connected to the second chip 220 to implement the light emission control of the second driving circuit 102 on the second chip 220. The first and second driving circuits 101 and 102 independently control the first and second chips 210 and 220, respectively, to achieve single-sided or double-sided light emission of the light emitting device group 200.
In some alternative embodiments, uniform light emission on both sides of the backlight module 10 is achieved. When the first chip 210 and the second chip 220 are located on two sides of the driving substrate, the number and size of the first chip 210 and the second chip 220 are determined according to actual requirements, for example, the orthographic projection areas of the first chip 210 and the second chip 220 on the driving substrate 100 are the same, or the number of the first chip 210 is greater than the number of the second chip 220, and the orthographic projection area of the second chip 220 on the driving substrate 100 is greater than the orthographic projection area of the first chip 210 on the driving substrate 100.
Optionally, the number of the second chips 220 is greater than the number of the first chips 210, and the orthographic projection area of the first chips 210 on the driving substrate 100 is greater than the orthographic projection area of the second chips 220 on the driving substrate 100
In these alternative embodiments, the first chip 210 and the second chip 220 have the same area, so that the first chip 210 and the second chip 220 have the same light emitting area. The number of the first chips 210 is greater than that of the second chips 220, and the area of the second chips 220 is greater than that of the first chips 210, so that the light emitted from the side of the driving substrate 100 facing the first chips 210 has a similar intensity as the light emitted from the side of the driving substrate 100 facing the second chips 220. Alternatively, the number of the second chips 220 is greater than that of the first chips 210, and the area of the first chips 210 is greater than that of the second chips 220, so that the light emitted from the side of the driving substrate 100 facing the first chips 210 has a similar intensity as the light emitted from the side of the driving substrate 100 facing the second chips 220. Both sides of the backlight module 10 can uniformly emit light.
Referring to fig. 7, in some alternative embodiments, the first chip 210 is located on a side of the connection electrode 300 facing away from the substrate, the second chip 220 includes a first portion 221 and a second portion 222, the first portion 221 is located on a side of the connection electrode 300 facing away from the substrate and connected to the second group of connection electrodes 320, and the second portion 222 is located in the through hole 110.
In these alternative embodiments, the first chip 210 is connected to the first group of connecting electrodes 310 at a side of the connecting electrode 300 away from the substrate, the second chip 220 is connected to the second group of connecting electrodes 320 through the first subsection 221, and the second subsection 222 is located in the through hole 110, so that the second chip 220 emits light toward the side of the substrate away from the first chip 210, and uniform light emission from both sides of the backlight module 10 is achieved.
In some alternative embodiments, the first chip 210 emits light in a direction away from the second chip 220, and the second chip 220 emits light in a direction away from the first chip 210; alternatively, the first chip 210 emits light in a direction toward and away from the second chip 220, and the second chip 220 emits light in a direction toward and away from the first chip 210.
In these alternative embodiments, the first chip 210 emits light in a direction away from the second chip 220, the second chip 220 emits light in a direction away from the first chip 210, and one of the first chip 210 and the second chip 220 emits light toward a side away from the other, so that double-sided light emission of the backlight module 10 is realized. One of the first chip 210 and the second chip 220 emits light toward the other, so that the light emission intensity when the first chip 210 or the second chip 220 emits light can be increased to improve the luminance of each other.
Optionally, the first chip 210 and the second chip 220 are transparent chips, the transparent chips are light-permeable, and when ultra-high brightness is required, the double-sided chips are both lighted up, which can be mutually lighted up
Referring to fig. 8, fig. 8 is a partial cross-sectional view of a backlight module in a further embodiment.
In some optional embodiments, the backlight module 10 further includes a light diffusing structure 400, and at least a portion of the light diffusing structure 400 is located in the through hole 110.
In these alternative embodiments, the light diffusion structure 400 is located in the through hole 110, and when the light emitted from the light emitting device group 200 passes through the through hole 110, the light enters the light diffusion structure 400, and the light diffusion structure 400 diffuses the light, thereby increasing the light emitting intensity.
In some alternative embodiments, the light diffusing structure 400 includes a first portion 410 and a second portion 420, the first portion 410 is located in the through hole 110, the second portion 420 is located on a surface of the driving substrate 100 facing away from the light emitting device group 200, and a surface of the second portion 420 facing away from the first portion 410 is convex in a curved surface in a direction away from the first portion 410.
In these alternative embodiments, the first portion 410 is located in the through hole 110, so that the light entering the through hole 110 from the light emitting device group 200 completely enters the light diffusing structure 400, and the surface of the second portion 420 facing away from the first portion 410 is convex in a curved surface in a direction away from the first portion 410, and the light is diffused by the curved surface to increase the light emitting area, thereby increasing the light emitting intensity.
In some alternative embodiments, the surface of the second portion 420 facing away from the first portion 410 is part of a spherical surface.
In these alternative embodiments, the second sub-portion 222 is disposed as a part of the spherical surface, which is simple in structure and facilitates the preparation of the light diffusing structure 400, and the spherical surface can effectively diffuse light, increase the light emitting area, and thus increase the light emitting intensity.
Referring to fig. 9, fig. 9 is a schematic structural diagram of a display device according to a second aspect of the present application.
The embodiment of the second aspect of the present invention further provides a display device 20, which includes the backlight module 10, the first liquid crystal cell 510, and the second liquid crystal cell 520 of any of the embodiments of the first aspect. The first liquid crystal cell 510 is located on one side of the light emitting device group 200 in a third direction, which intersects with both the first direction and the second direction. The second liquid crystal cell 520 is positioned at the other side of the light emitting device group 200 in the third direction.
According to the display device 20 of the second embodiment of the present application, the backlight module 10 includes the driving substrate 100 and the light emitting device group 200 disposed on the driving substrate 100. The driving substrate 100 includes a plurality of through holes 110 distributed in an array, so that light emitted from the light emitting device group 200 located on the driving substrate 100 can pass through the through holes 110 to the other side of the driving substrate 100. The light emitting device group 200 is at least partially overlapped with the through hole 110 in the orthographic projection of the driving substrate 100, and the light emitting device group 200 can emit light from both sides, so that the light emitting device group 200 can directly emit light to the other side of the driving substrate 100 through the through hole 110, and thus the backlight module 10 can emit light on both the side of the driving substrate 100 departing from the light emitting device group 200 and the side facing the light emitting device group 200, and the double-sided uniform light emission of the backlight module 10 is realized. The light emitted from the first chip 210 passes through the first liquid crystal cell 510 to realize the color display of the display device 20 at the side close to the first chip 210, and the light emitted from the second chip 220 passes through the second liquid crystal cell 520 to realize the color display of the display device 20 at the side close to the second chip 220, so as to achieve the purpose of double-sided color display of the display device 20.
Since the display device 20 provided in the second aspect of the present invention includes the backlight module 10 in any of the embodiments of the first aspect, the display device 20 provided in the second aspect of the present invention has the beneficial effects of the backlight module 10 in any of the embodiments of the first aspect, and details thereof are not repeated herein.
The display device 20 in the embodiment of the present invention includes, but is not limited to, a mobile phone, a Personal Digital Assistant (PDA), a tablet computer, an electronic book, a television, a door lock, a smart phone, a console, and other devices having a display function.
Referring to fig. 10, fig. 10 is a schematic flow chart illustrating a method for manufacturing a backlight module according to an embodiment of the third aspect of the present application.
A third aspect of the present invention provides a method for manufacturing a backlight module 10, for manufacturing the backlight module 10 as described above, the method for manufacturing the backlight module 10 includes:
step S01: the driving substrate 100 is prepared to include a plurality of through holes 110 arrayed in a first direction and a second direction, the first direction and the second direction intersecting each other.
Step S02: the light emitting device groups 200 are prepared on the driving substrate 100, orthographic projections of the light emitting device groups 200 on the driving substrate 100 at least partially overlap the through holes 110, and the light emitting device groups 200 are capable of emitting light at least in a direction toward the driving substrate 100 and away from the driving backplane.
In the method for manufacturing the backlight module 10 according to the embodiment of the present application, the driving substrate 100 can be manufactured through the step S01. The light emitting device group 200 is then prepared on the driving substrate 100 through step S02. The driving substrate 100 includes a plurality of through holes 110 distributed in an array, so that light emitted from the light emitting device group 200 located on the driving substrate 100 can pass through the through holes 110 to the other side of the driving substrate 100. The light emitting device group 200 is at least partially overlapped with the through hole 110 in the orthographic projection of the driving substrate 100, and the light emitting device group 200 can emit light on both sides, so that the light emitting device group 200 can directly emit light to the other side of the driving substrate 100 through the through hole 110, and thus the backlight module 10 can emit light on both the side of the driving substrate 100 departing from the light emitting device group 200 and the side facing the light emitting device group 200, and double-sided uniform light emission of the backlight module 10 is realized.
In accordance with the embodiments described herein above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and its practical application, to thereby enable others skilled in the art to best utilize the application and its various modifications as are suited to the particular use contemplated. The application is limited only by the claims and their full scope and equivalents.
Claims (15)
1. A backlight module, comprising:
the driving substrate comprises a plurality of through holes distributed in an array along a first direction and a second direction, and the first direction and the second direction are intersected;
the light-emitting device groups are arranged on the driving substrate, orthographic projections of the light-emitting device groups on the driving substrate are at least partially overlapped with the through holes, and the light-emitting device groups can emit light at least along the direction towards the driving substrate and the direction away from the driving back plate.
2. The backlight module according to claim 1, comprising a connection electrode located on a peripheral side of the through hole,
the driving substrate includes a driving circuit, and the light emitting device group is connected to the driving circuit through the connection electrode.
3. The backlight module according to claim 2, wherein the light emitting device group comprises a first chip and a second chip, the first chip and the second chip are stacked in a third direction, the first chip and the second chip are disposed in a staggered manner, and the third direction intersects with both the first direction and the second direction.
4. The backlight module according to claim 3, wherein the connection electrodes comprise a first set of connection electrodes and a second set of connection electrodes,
the driving circuit comprises a first driving circuit and a second driving circuit, the first chip is connected with the first driving circuit through the first group of connecting electrodes, and the second chip is connected with the second driving circuit through the second group of connecting electrodes.
5. A backlight module according to claim 4, wherein the first set of connecting electrodes comprises a first positive electrode and a first negative electrode, and the second set of connecting electrodes comprises a second positive electrode and a second negative electrode.
6. The backlight module according to claim 4, wherein the first set of connecting electrodes comprises a first positive electrode, the second set of connecting electrodes comprises a second positive electrode, and the first set of connecting electrodes and the second set of connecting electrodes share a third negative electrode.
7. The backlight module according to claim 4, wherein the first set of connecting electrodes and the first chip are located on one side of the substrate, and the second set of connecting electrodes and the second chip are located on the other side of the substrate.
8. The backlight module as claimed in claim 7, wherein the first chip and the second chip have the same orthographic projection area on the driving substrate,
or the number of the first chips is larger than that of the second chips, and the orthographic projection area of the second chips on the driving substrate is larger than that of the first chips on the driving substrate.
9. The backlight module as claimed in claim 4, wherein the first chip is located on a side of the connection electrodes facing away from the substrate, and the second chip comprises a first section and a second section, the first section is located on a side of the connection electrodes facing away from the substrate and connected to the second group of connection electrodes, and the second section is located in the through holes.
10. The backlight module according to claim 3, wherein the first chip emits light in a direction away from the second chip, and the second chip emits light in a direction away from the first chip;
or, the first chip emits light in a direction towards and away from the second chip, and the second chip emits light in a direction towards and away from the first chip.
11. The backlight module according to claim 1, further comprising a light diffusing structure, wherein at least a portion of the light diffusing structure is located in the through hole.
12. The backlight module according to claim 11, wherein the light diffusing structure comprises a first portion and a second portion, the first portion is disposed in the through hole, the second portion is disposed on a surface of the driving substrate facing away from the light emitting device group, and a surface of the second portion facing away from the first portion is convex in a curved surface in a direction away from the first portion.
13. A backlight module according to claim 12, wherein the surface of the second portion facing away from the first portion is part of a spherical surface.
14. A display device, comprising:
a backlight module according to any one of claims 1 to 13;
the first liquid crystal box is positioned on one side of the light-emitting device group in a third direction, and the third direction is intersected with the first direction and the second direction;
and the second liquid crystal box is positioned on the other side of the light-emitting device group in the third direction.
15. A method for manufacturing a backlight module according to any one of claims 1 to 13, the method comprising:
preparing a driving substrate, wherein the driving substrate comprises a plurality of through holes distributed along a first direction and a second direction in an array mode, and the first direction and the second direction are intersected;
preparing light emitting device groups on the driving substrate, wherein orthographic projections of the light emitting device groups on the driving substrate at least partially overlap the through holes, and the light emitting device groups can emit light at least in the direction towards the driving substrate and away from the driving back plate.
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| CN115616815B (en) | 2024-03-22 |
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