CN115615914A

CN115615914A - Adapter plate

Info

Publication number: CN115615914A
Application number: CN202211349708.9A
Authority: CN
Inventors: 杜韦慷; 刘建辉; 周德祥; 杨建�; 曾泉; 陈杰; 汪静; 周子林
Original assignee: Sky Chip Interconnection Technology Co Ltd
Current assignee: Sky Chip Interconnection Technology Co Ltd
Priority date: 2022-10-31
Filing date: 2022-10-31
Publication date: 2023-01-17

Abstract

The invention discloses an adapter plate, wherein the adapter plate comprises: the circuit board comprises a circuit board main body, a circuit board main body and a circuit board control module, wherein the circuit board main body comprises at least two sub circuit boards which are connected side by side and can be separately arranged to form the circuit board main body; the first connector is welded and fixed with one end of the circuit board main body and is electrically connected with the circuit board main body; the second connector is fixedly welded with the other end of the circuit board main body and is electrically connected with the other end of the circuit board main body; the heating device is fixed and attached to two opposite sides of each sub circuit board; and the anti-condensation layer covers the corresponding heating device and is respectively attached to two opposite sides of each sub circuit board. Through the structure, the surface of the circuit board main body can be kept dry without being influenced by condensation, the sub-circuit boards are convenient to replace and maintain, and the maintenance cost is reduced.

Description

Adapter plate

Technical Field

The invention is applied to the technical field of test board switching, in particular to a switching board.

Background

In the high-low temperature aging test box, the aging test board at the high-low temperature area in the aging chamber inside the aging box needs to be electrically connected with the drive board at the normal temperature area of the high-low temperature aging box, so that the test function of the aging test board is realized.

The keysets realizes the electrical connection of ageing tests board in the high low temperature ageing oven high temperature district and normal atmospheric temperature district drive plate, guarantees the leakproofness of ageing oven high low temperature district simultaneously, does not influence the electrical function of normal atmospheric temperature district drive plate.

The circuit board top layer of ageing oven keysets at low temperature during operation keysets produces the condensation easily, influences the electrical properties of keysets, and the single passageway of current keysets goes wrong and need all change whole circuit board, and cost of maintenance is higher.

Disclosure of Invention

The invention provides an adapter plate, which aims to solve the problem that the surface layer of the adapter plate is easy to generate condensation, so that the maintenance cost is high.

In order to solve the above technical problem, the present invention provides an adapter plate, including: the circuit board comprises a circuit board main body, a circuit board main body and a circuit board control unit, wherein the circuit board main body comprises at least two sub circuit boards which are connected in parallel and can be separated to form the circuit board main body; the first connector is fixedly welded and electrically connected with one end of the circuit board main body; the second connector is fixedly welded with the other end of the circuit board main body and is electrically connected with the other end of the circuit board main body; the heating device is fixed and attached to two opposite sides of each sub circuit board; and the anti-condensation layer covers the corresponding heating device and is respectively attached to two opposite sides of each sub-circuit board.

Wherein, heating device includes: a plurality of heating wires; the heating wires are respectively fixed and attached to at least partial areas of two opposite sides of the corresponding sub circuit boards; the anti-condensation layer comprises two layers, and each anti-condensation layer is respectively attached to two opposite sides of the circuit board main body so as to be respectively attached to at least partial areas of two opposite sides of each sub-circuit board and cover the corresponding heating wires.

The heating wires are respectively fixed and attached to one ends, close to the first connector, of the two opposite sides of the corresponding sub circuit boards; the anti-condensation layer is respectively attached to one end, close to the first connector, of the two opposite sides of the circuit board main body and covers the corresponding heating wires.

Wherein, the keysets still includes: a fixed back plate and a plurality of fixed parts; a groove is formed on the fixed back plate, a through hole is formed at the bottom of the groove, and the circuit board main body is inserted into the through hole; the first connector at one end of the circuit board main body is fixed and contained in the groove through a plurality of fixing pieces.

The plurality of fixing pieces comprise two edge fixing pieces and a plurality of middle-end fixing pieces; the two edge fixing pieces are respectively arranged at two opposite ends of the first connector so as to fix the first connector and the fixed back plate; the middle fixing pieces are uniformly arranged between the two opposite ends of the first connector at intervals so as to fix the first connector and the fixed back plate.

Wherein the first connector comprises: at least two first sub-connectors, wherein each first sub-connector is welded and fixed with one side of the corresponding sub-circuit board main body and is electrically connected with the corresponding sub-circuit board main body; the edge end points of the at least two first sub-connectors are fixedly arranged with the fixed back plate through edge fixing pieces. The middle endpoints of the at least two first sub-connectors are fixedly arranged with the fixed back plate through the middle end fixing piece.

And a plurality of mounting holes are formed on one side of the fixed backboard, which is far away from the second connector, so as to be fixedly connected with the burn-in board.

At least one fixing hole is formed in one end, far away from the first connector, of each sub circuit board, and the fixing holes are fixedly connected with the driving board.

Wherein, the anti-condensation layer includes: one or more of a sponge layer, a cotton layer, a chemical fiber layer, a fluff wood pulp layer and a resin layer.

Wherein the second connector comprises: and each second sub-connector is welded and fixed with the other side of the corresponding sub-circuit board main body and is electrically connected with the other side of the corresponding sub-circuit board main body.

In order to solve the technical problem, the adapter plate is formed into the circuit board main body by connecting and detachably arranging at least two sub circuit boards side by side, so that the electrical function of the circuit board main body can be commonly borne by at least two sub circuit boards, and the sub circuit boards can be independently replaced when a certain sub circuit board fails, thereby avoiding the replacement of the whole circuit board main body, facilitating the replacement and maintenance and reducing the maintenance cost. The surface of each sub circuit board of the circuit board main body is prevented from generating condensation easily due to temperature difference and being attached to the surface of the circuit board main body through the arrangement of the condensation preventing layer. And in time avoid the difference in temperature of circuit board main part face through heating device, prevent the production of condensation, and even the condensation produces can be through heating evaporation condensation and keep apart the condensation through preventing the condensation layer for the surface of each sub-circuit board of circuit board main part keeps dry, does not receive the condensation influence. Even if the electrical performance of the sub-circuit board is affected, the sub-circuit board can be replaced independently, so that replacement and maintenance are facilitated, and the maintenance cost is reduced.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of an interposer provided in the present invention;

fig. 2 is a partial structural schematic diagram of the first connector 110 in the embodiment of fig. 1.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, back, 8230; etc.) are involved in the embodiment of the present invention, the directional indications are only used for explaining the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the figure), and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of an interposer provided in the present invention. The schematic diagram shows an example in which the circuit board main body includes 3 sub-circuit boards, and when the circuit board main body includes other numbers of sub-circuit boards, the structure is similar, and the description is omitted.

The interposer 100 of the present embodiment includes a circuit board body 130, a first connector 110, a second connector 120, a heating device 160, and a condensation preventing layer 170.

The adapter plate 100 is used for realizing the electrical connection between the aging test board in the high-temperature area of the high-temperature and low-temperature aging box and the drive board in the normal-temperature area, and meanwhile, the sealing performance of the high-temperature and low-temperature area of the aging box is guaranteed, and the electrical function of the drive board in the normal-temperature area is not influenced.

The circuit board main body 130 is used to implement an electrical connection function of the interposer 100, and has a circuit formed thereon for electrical connection. The circuit board main body 130 includes at least two sub-circuit boards 131, and the sub-circuit boards 131 are connected side by side and are detachably disposed to form the circuit board main body 130. That is, the sub-circuit boards 131 are arranged side by side on the same plane to form the circuit board main body 130. Specifically, the number of the sub circuit boards 131 of the circuit board main body 130 may include 2, 3, 5, or 6, and the like, which are specifically set based on actual requirements.

The electrical function of the circuit board main body 130 is shared by at least two sub-circuit boards 131, so that when one sub-circuit board 131 fails, the sub-circuit board 131 can be replaced independently, thereby avoiding the replacement of the whole circuit board main body 130, facilitating the replacement and maintenance and reducing the maintenance cost.

The sub circuit boards 131 may be connected side by side and detachably connected by conductive adhesive, contact connection, and the like, which is not limited herein.

The first connector 110 is fixed to and electrically connected to one end of the circuit board main body 130, and the first connector 110 is used for the burn-in board to be inserted and connected.

The second connector 120 is welded to and electrically connected to the other end of the circuit board main body 130, and is used for inserting and connecting a driving board. Wherein, the other end of the circuit board main body 130 may be opposite to or adjacent to one end of the circuit board main body 130.

The first connector 110 and the second connector 120 may include a gold finger slot, a gold finger or other electrical connection, and the like, which may be determined based on actual situations.

The heating device 160 is fixed and attached to the opposite sides of each sub-circuit board 131 to heat the opposite side surfaces of each sub-circuit board 131, thereby evaporating the condensation and preventing the condensation from affecting the performance of the interposer 100.

The heating device 160 may include a heating wire, a heating plate, a hot air blower, and the like, which are not limited herein.

The anti-condensation layer 170 covers the corresponding heating device 160 and is attached to two opposite sides of each sub-circuit board 131. The anti-condensation layer 170 is used for isolating heat transfer to a normal temperature area, preventing condensation from being adsorbed on the surface of the adapter plate 100, and meanwhile has a sealing effect, so that the sealing performance of the high and low temperature areas of the aging box is ensured.

The provision of the anti-condensation layer 170 can prevent the surface of each sub-circuit board 131 of the circuit board main body 130 from being easily condensed and attached to the surface of the circuit board main body 130 due to a temperature difference. And heating device 160 can in time avoid the difference in temperature of circuit board main part 130 face, prevents the production of condensation, and even the condensation production can be through heating evaporation condensation and keep apart the condensation through preventing congealing layer 170 for the surface of each sub circuit board 131 of circuit board main part 130 keeps dry, does not receive the condensation influence.

The interposer 100 of the embodiment can be applied to the fields of the aging test of the memory chip, the aging test of the semiconductor device, and the like, and is not limited herein.

Through the above structure, the interposer 100 of the embodiment is connected side by side and detachably disposed through the at least two sub circuit boards 131 to form the circuit board main body 130, so that the electrical function of the circuit board main body 130 can be jointly assumed by the at least two sub circuit boards 131, and thus when a certain sub circuit board 131 fails, the sub circuit board 131 can be replaced independently, thereby avoiding replacement of the whole circuit board main body 130, facilitating replacement and maintenance and reducing maintenance cost. The provision of the condensation preventing layer 170 prevents the surface of each sub-circuit board 131 of the circuit board main body 130 from being easily exposed to condensation due to a temperature difference and adhering to the surface of the circuit board main body 130. And the temperature difference of the board surface of the circuit board main body 130 is avoided in time through the heating device 160, the generation of condensation is prevented, and the condensation can be isolated through the heating evaporation condensation and the condensation prevention layer 170 even if the condensation is generated, so that the surface of each sub-circuit board 131 of the circuit board main body 130 is kept dry and is not influenced by the condensation. Even if the electrical performance of the sub circuit board 131 is affected, the sub circuit board 131 can be replaced independently, which facilitates replacement and maintenance and reduces maintenance cost.

In other embodiments, the heating device 160 includes: a plurality of heating wires 161; the plurality of heating wires 161 are respectively fixed and attached to at least partial regions of opposite sides of the corresponding sub circuit board 131; wherein, part or all of the opposite sides of the sub circuit board 131 may be attached and fixedly provided with the heating wire 161.

The anti-coagulation layer 170 includes two layers, each anti-coagulation layer 170 is respectively attached to two opposite sides of the circuit board main body 130, that is, one side of the circuit board main body 130 is attached to one anti-coagulation layer 170, so as to be respectively attached to at least partial areas of two opposite sides of each sub-circuit board 131 and cover the corresponding heating wires 161. Thereby performing anti-condensation protection on the upper and lower side surfaces of each sub-circuit board 131. Wherein, partial areas or all areas of two opposite sides of the sub circuit board 131 can be attached and fixedly provided with the anti-condensation layer 170.

Wherein, the heating wire 161 may be overlapped with the condensation preventing layer 170 to diffuse the heat of the heating wire 161 to the whole covered portion of the condensation preventing layer 170 by the condensation preventing layer 170, thereby improving the heating efficiency.

In other embodiments, the plurality of heating wires 161 are respectively fixed and attached to two opposite sides of the corresponding sub circuit board 131 near one end of the first connector 110; the anti-condensation layers 170 are respectively attached to two opposite sides of the circuit board main body 130 near one end of the first connector 110 and cover the corresponding heating wires 161.

That is, the heating wires 161 and the corresponding anti-condensation layers 170 are overlapped and disposed at two opposite sides of the circuit board main body 130 near one end of the first connector 110, so that heat can be isolated by the anti-condensation layers 170 and transferred to a normal temperature region, condensation is prevented from being adsorbed on the surface of the circuit board main body 130 of the interposer 100, meanwhile, the sealing effect is achieved, and the phenomenon that condensation generated on the surface of the interposer 100 affects the performance of the interposer 100 during low-temperature operation is effectively prevented by the heating wires 161.

The anti-condensation layer 170 may cover the corresponding heating wire 161 and be attached to the surface of the corresponding circuit board main body 130 by adhesion or absorption.

The heating wire 161 is arranged on the surface of the circuit board main body 130 of the adapter plate 100 of the heat insulation layer part between the high-temperature area and the low-temperature area of the high-temperature and low-temperature aging box, the temperature range of the heating wire 161 during working is 60-80 ℃, and the phenomenon that condensation generated on the surface of the adapter plate 100 during low-temperature working affects the performance of the adapter plate 100 can be effectively prevented. The surface mounting anti-condensation layer 170 of the circuit board main body 130 is used for isolating heat transfer to a normal temperature area, preventing condensation from being adsorbed on the surface of the circuit board main body 130, and meanwhile, has a sealing effect and ensures the sealing performance of the high and low temperature areas of the aging box.

In other embodiments, the interposer 100 further comprises: a fixed back plate 150 and a plurality of fixing members 140; the fixing back plate 150 is used for fixing the adapter plate 100 and the metal back plate in the cavity of the high and low temperature aging box, and the fixing member 140 is used for fixing the adapter plate 100 and the fixing back plate 150.

A groove 151 is formed on the fixed backplate 150, a through hole (not shown) is formed at the bottom of the groove 151, and the circuit board main body 130 is inserted into the through hole; the first connector 110 at one end of the circuit board main body 130 is fixed and received in the groove 151 by a plurality of fixing members 140.

That is, the circuit board main body 130 is inserted into the through hole, such that one end of the circuit board main body 130 can be accommodated in the corresponding groove 151, and the first connector 110 welded and fixed to one end of the circuit board main body 130 is accommodated in the groove 151. Further, the first connector 110 is fixed to the fixing back plate 150 by a plurality of fixing members 140.

The circuit board main body 130 may be welded and fixed to the inner wall of the through hole, so as to enhance the connection stability between the circuit board main body 130 and the fixing back plate 150 and enhance the structural stability of the interposer 100.

In other embodiments, the plurality of fixing members 140 includes two edge fixing members 141 and a plurality of middle fixing members 142; the edge fastener 141 is used to fasten the edge end of the first connector 110, and the middle fastener 142 is used to fasten the middle region of the first connector 110.

Specifically, two edge fasteners 141 are respectively disposed at two opposite ends of the first connector 110 to fasten the first connector 110 and the fixing back plate 150; the middle fixing members 142 are uniformly and alternately disposed between two opposite ends of the first connector 110 to fix the first connector 110 and the fixing back plate 150.

Referring to fig. 2, fig. 2 is a partial schematic structural diagram of the first connector 110 in the embodiment of fig. 1.

In other embodiments, the first connector 110 includes: at least two first sub-connectors 111, each first sub-connector 111 is soldered and fixed to and electrically connected to one side of the main body 130 of the corresponding sub-circuit board 131. I.e. at least two first sub-connectors 111 are also arranged side by side.

The opposite ends of each first sub-connector 111 are fixed to the fixing back plate 150 by the corresponding fixing members 140.

Wherein, the edge end points of at least two first sub-connectors 111 are fixed with the fixing back plate 150 by the edge fixing member 141. The middle terminals of the at least two first sub-connectors 111 are fixed to the fixed backplane 150 by the middle fixing member 142.

Here, the edge endpoint refers to an endpoint located at the edge most among the at least two first sub-connectors 111, which is not adjacent to the endpoints of the other first sub-connectors 111, and the middle endpoint refers to an endpoint adjacent to the endpoints of the other first sub-connectors 111 among the at least two first sub-connectors 111.

In a specific application scenario, the edge fixing element 141 is formed with a fixing groove (not labeled) for fixing the edge end point separately, and the middle fixing element 142 is formed with two fixing grooves for fixing two adjacent middle end points respectively.

In a specific application scenario, when the circuit board main body 130 includes 3 sub-circuit boards 131, there are two edge fasteners 141 and two middle end fasteners 142. In another specific application scenario, when the circuit board main body 130 includes 5 sub-circuit boards 131, there are two edge fasteners 141 and 4 middle fasteners 142. When the circuit board body 130 includes other numbers of sub-circuit boards 131, and so on.

In other embodiments, a plurality of mounting holes 190 are formed on a side of the fixing back plate 150 away from the second connector 120 to be fixedly connected with the burn-in board. Wherein, a plurality of mounting holes 190 can evenly set up in fixed backplate 150 and keep away from one side of second connector 120 to realize that adapter plate 100 and high low temperature burn-in box cavity internal metal backplate's accurate location and fixed, thereby be convenient for first connector 110 and burn-in test board fixed connection.

The number of the mounting holes 190 may be 4, 6, 8, 10, etc., and may be specifically set based on actual requirements.

Through fixing first connector 110 on fixed backplate 150, metal backplate in a plurality of mounting holes 190 on the rethread fixed backplate 150 and the high low temperature ageing oven cavity is fixed, and then make first connector 110 can be accurate with the connecting device fixed connection of ageing testing board, guarantee the stability of being connected between keysets 100 and the ageing testing board.

In other embodiments, at least one fixing hole 180 is formed on a side of each sub circuit board 131 away from the first connector 110 to be fixedly connected with a bracket of the driving board in the constant temperature region, so as to facilitate the fixed connection between the interposer 100 and the driving board.

In a specific application scenario, two fixing holes 180 are formed on one end of each sub circuit board 131 far away from the first connector 110, and the two fixing holes 180 are respectively disposed on two opposite edges of one side of each sub circuit board 131 far away from the first connector 110, so as to facilitate uniform fixing.

The interposer 100 of the embodiment directly realizes the fixed connection with the bracket of the driving board in the normal temperature region through the fixing holes 180 arranged on each sub circuit board 131, so that the size of the interposer 100 can be reduced, and the miniaturization is facilitated.

Wherein, one end of each sub circuit board 131 far away from the first connector 110 is exposed by one end heating wire 161 and the corresponding anti-condensation layer 170 which are arranged on two opposite sides of the circuit board main body 130 and close to the first connector 110, so as to form a fixing hole 180 thereon for realizing the fixed connection with the driving board.

In other embodiments, the second connector 120 includes: at least two second sub-connectors (not shown), each of which is soldered and fixed to and electrically connected to the other side of the main body 130 of the corresponding sub-circuit board 131. I.e. at least two second sub-connectors are also arranged side by side.

When the sub circuit board corresponding to the second sub connector needs to be replaced, the sub circuit board 131 and the corresponding first sub connector 111 and second sub connector can be replaced entirely, thereby implementing the individual replacement of the sub circuit board 131. Specifically, the sub circuit board 131 and the position where the first sub connector 111 and the fixed back plate 150 are fixedly connected can be separated by mechanical cutting or chemical partial etching, so as to realize separation and replacement.

In other embodiments, the anti-condensation layer 170 includes: one or more of water-absorbing and heat-insulating materials such as a sponge layer, a cotton layer, a chemical fiber layer, a fluff wood pulp layer, a resin layer and the like.

The water-absorbing and heat-insulating material can realize the condensation-preventing and heat-insulating functions of the condensation-preventing layer 170, and ensure that the surfaces of the sub circuit boards 131 of the circuit board main body 130 are kept dry and are not affected by condensation.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. An interposer, comprising:

the circuit board comprises a circuit board main body, a circuit board main body and a circuit board control unit, wherein the circuit board main body comprises at least two sub circuit boards, and the sub circuit boards are connected side by side and can be separated to form the circuit board main body;

the first connector is fixedly welded with one end of the circuit board main body and is electrically connected with the circuit board main body;

the second connector is fixedly welded with the other end of the circuit board main body and is electrically connected with the other end of the circuit board main body;

the heating device is fixed and attached to two opposite sides of each sub circuit board;

and the anti-condensation layer covers the corresponding heating devices and is respectively attached to two opposite sides of each sub-circuit board.

2. An interposer as recited in claim 1, wherein the heating device comprises: a plurality of heating wires; the heating wires are respectively fixed and attached to at least partial areas of two opposite sides of the corresponding sub circuit board;

the anti-condensation layers comprise two layers, and each anti-condensation layer is respectively attached to two opposite sides of the circuit board main body so as to be respectively attached to at least partial areas of two opposite sides of each sub-circuit board and cover the corresponding heating wires.

3. The adapter plate according to claim 2, wherein the plurality of heating wires are respectively fixed and attached to one end of the corresponding sub circuit board close to the first connector on two opposite sides;

the anti-condensation layer is respectively attached to the two opposite sides of the circuit board main body and close to one end of the first connector, and the heating wires are correspondingly covered.

4. The interposer as recited in claim 1, further comprising: a fixed back plate and a plurality of fixed parts;

a groove is formed in the fixed back plate, a through hole is formed at the bottom of the groove, and the circuit board main body is inserted into the through hole;

the first connector at one end of the circuit board main body is fixed and contained in the groove through a plurality of fixing pieces.

5. The patch panel of claim 4, wherein the plurality of fasteners includes two edge fasteners and a plurality of mid-end fasteners;

the two edge fixing pieces are respectively arranged at two opposite ends of the first connector so as to fix the first connector and the fixed back plate;

the middle-end fixing pieces are uniformly arranged between the two opposite ends of the first connector at intervals so as to fix the first connector and the fixed back plate.

6. The patch panel of claim 5, wherein the first connector comprises: the first sub-connectors are respectively welded and fixed with one side of the corresponding sub-circuit board main body and are electrically connected with the corresponding sub-circuit board main body;

the edge end points of the at least two first sub-connectors are fixedly arranged with the fixed back plate through the edge fixing pieces. The middle end points of the at least two first sub-connectors are fixedly arranged with the fixed back plate through the middle-end fixing piece.

7. The interposer as claimed in claim 4, wherein the fixing back plate has a plurality of mounting holes formed on a side thereof away from the second connector for fixedly connecting with the burn-in board.

8. The interposer as recited in claim 1, wherein each of said daughter circuit boards has at least one securing hole formed at an end thereof remote from said first connector for securing connection to a driver board.

9. The interposer as recited in claim 1, wherein the anti-condensation layer comprises: one or more of a sponge layer, a cotton layer, a chemical fiber layer, a fluff wood pulp layer and a resin layer.

10. The patch panel of claim 1, wherein the second connector comprises: and each second sub-connector is welded and fixed with the other side of the corresponding sub-circuit board main body and is electrically connected with the other side of the corresponding sub-circuit board main body.