CN115615541A - A Photoelectric Sensor with Dual Emission Wavelength Light Source Design - Google Patents

A Photoelectric Sensor with Dual Emission Wavelength Light Source Design Download PDF

Info

Publication number
CN115615541A
CN115615541A CN202211134243.5A CN202211134243A CN115615541A CN 115615541 A CN115615541 A CN 115615541A CN 202211134243 A CN202211134243 A CN 202211134243A CN 115615541 A CN115615541 A CN 115615541A
Authority
CN
China
Prior art keywords
light
lens
emitting
light source
wavelength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211134243.5A
Other languages
Chinese (zh)
Inventor
赵爱伦
叶立平
唐可信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Akusense Technology Co Ltd
Original Assignee
Shenzhen Akusense Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Akusense Technology Co Ltd filed Critical Shenzhen Akusense Technology Co Ltd
Priority to CN202211134243.5A priority Critical patent/CN115615541A/en
Publication of CN115615541A publication Critical patent/CN115615541A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details
    • G01J1/0295Constructional arrangements for removing other types of optical noise or for performing calibration
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details
    • G01J1/04Optical or mechanical part supplementary adjustable parts
    • G01J1/0407Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/42Photometry, e.g. photographic exposure meter using electric radiation detectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

本发明涉及一种反射型和对射型光电传感器技术领域,尤其涉及一种具有双发射波长光源设计的光电传感器技术。本发明主要针对光发射单元的光源和光接收单元进行特殊设计,使传感器同时具有较强的抗环境光干扰能力和调试安装的便捷性准确性。

Figure 202211134243

The invention relates to the technical field of reflective and through-beam photoelectric sensors, in particular to a photoelectric sensor technology with dual emission wavelength light source design. The invention is mainly specially designed for the light source of the light emitting unit and the light receiving unit, so that the sensor has strong anti-environmental light interference ability and the convenience and accuracy of debugging and installation.

Figure 202211134243

Description

一种具有双发射波长光源设计的光电传感器A Photoelectric Sensor with Dual Emission Wavelength Light Source Design

【技术领域】【Technical field】

本发明涉及一种反射型和对射型光电传感器技术领域,尤其涉及一种具有双发射波长光源设计的光电传感器技术。The invention relates to the technical field of reflective and through-beam photoelectric sensors, in particular to a photoelectric sensor technology with dual emission wavelength light source design.

【背景技术】【Background technique】

反射型光电传感器工作原理如图1所示,现有的光接收单元12和现有的光发射单元13都在传感器的封闭的空间内,传感器光发射单元会发出光线,当设定的检测范围内出现物体15时,传感器发射单元发出的光会被该物体反射,部分反射光会被光接收单元接收并产生电信号,然后电信号会被信号输出线14传送到处理电路,然后传感器发出指令信号。The working principle of the reflective photoelectric sensor is shown in Figure 1. The existing light receiving unit 12 and the existing light emitting unit 13 are all in the closed space of the sensor, and the sensor light emitting unit will emit light. When the set detection range When an object 15 appears inside, the light emitted by the sensor emitting unit will be reflected by the object, and part of the reflected light will be received by the light receiving unit to generate an electrical signal, and then the electrical signal will be transmitted to the processing circuit by the signal output line 14, and then the sensor will issue an instruction Signal.

对射型光电传感器原理如图2所示,现有的的光发射单元12和现有的光接收单元13是分开的,光发射单元和光接收单元中间没有物体15时,光接收单元可以接收到光,当待检测物体进入到检测范围内,会遮挡光束使光接收单元无法接收光发射单元发出的光,通过信号输出线14传送到处理电路,从而检测到光信号的变化,接收端做出反应。The principle of the through-beam photoelectric sensor is shown in Figure 2. The existing light-emitting unit 12 and the existing light-receiving unit 13 are separated. When there is no object 15 between the light-emitting unit and the light-receiving unit, the light-receiving unit can receive Light, when the object to be detected enters the detection range, it will block the light beam so that the light receiving unit cannot receive the light emitted by the light emitting unit, and transmit it to the processing circuit through the signal output line 14, thereby detecting the change of the light signal, and the receiving end makes a reaction.

现有的光电传感器发射端光源普遍采用单波长的红光或者近红外光,较常用的波长为650nm左右,850nm左右或者940nm。采用红光作为光源是因为光束照射到物体上时很容易识别,同时也是工业自动化领域内通常的做法。但是采用红光作为发射端光源的光电传感器较容易受到环境中各种光源的干扰,因为环境光中一般都包含650nm左右的光波,尤其是近年来LED照明的普及,LED照明光源亮度高,更容易造成干扰。而采用近红外光作为发射端光源传感器,由于是不可见光,无法用肉眼看到传感器射出的光斑,调试安装的时候,无法准确找到光斑的中心部分,不容易对检测物体或者准接收器,另外传感器发光元件是否正常工作也无法直观的判断。Existing light sources at the emitting end of photoelectric sensors generally use single-wavelength red light or near-infrared light, and the more commonly used wavelengths are around 650nm, around 850nm or 940nm. Red light is used as the light source because it is easy to identify when the beam hits the object, and it is also a common practice in the field of industrial automation. However, photoelectric sensors that use red light as the light source at the transmitting end are more susceptible to interference from various light sources in the environment, because the ambient light generally contains light waves around 650nm, especially in recent years with the popularization of LED lighting, and the brightness of LED lighting sources is high. It is easy to cause disturbance. However, the near-infrared light is used as the light source sensor at the transmitting end. Since it is invisible light, the light spot emitted by the sensor cannot be seen with the naked eye. When debugging and installing, it is impossible to accurately find the center of the light spot, and it is not easy to detect objects or quasi-receivers. In addition Whether the light-emitting element of the sensor is working normally cannot be judged intuitively.

【发明内容】【Content of invention】

针对上述问题,本发明主要针对光发射单元的光源和光接收单元进行特殊设计,使传感器同时具有较强的抗环境光干扰能力和调试安装的便捷性及准确性。发光元件采用发射两种波长的光源,包含可见光和近红外光两种独立的发光芯片,发光芯片可以是LED。本发明的显著特征在于通过对两种发射不同波长的发光芯片的特殊布局,如图4和图5所示,光源的发光芯片采用在空间上紧密接触堆叠的方式,其中红外发光芯片在靠近透镜一侧,红光发光芯片在另一侧,两个发光芯片的发光面朝向发射透镜,红光芯片的面积大于近红外光芯片的面积,同时两个发光芯片中心轴线重合,或者中心轴线距离误差要小于5mm,目的是使光束经过透镜后的光斑中心重合或者接近重合;In view of the above problems, the present invention mainly focuses on the special design of the light source and light receiving unit of the light emitting unit, so that the sensor has a strong ability to resist ambient light interference and the convenience and accuracy of debugging and installation. The light-emitting element adopts a light source emitting two wavelengths, including two independent light-emitting chips of visible light and near-infrared light, and the light-emitting chip may be an LED. The notable feature of the present invention is that through the special layout of two light-emitting chips emitting different wavelengths, as shown in Figure 4 and Figure 5, the light-emitting chips of the light source are stacked in close contact in space, and the infrared light-emitting chips are close to the lens. On one side, the red light-emitting chip is on the other side. The light-emitting surfaces of the two light-emitting chips face the emitting lens. The area of the red light chip is larger than that of the near-infrared light chip. At the same time, the central axis of the two light-emitting chips coincides, or the center axis distance error It should be less than 5mm, the purpose is to make the center of the spot after the beam passes through the lens coincide or close to coincide;

本发明采用能发射两种波长的光作为光源,发射出的两种波长光束即包含可见光和近红外光,可见光和近红外光的光斑中心重合或者接近重合。这样在安装调试过程中可以通过观察可见光的光斑非常方便的找到光照射的准确位置,使被测物正确放置在传感器探测范围内,同时由于近红外光的光斑中心和可见光光斑的中心重合或者接近,可以以可见光光斑作为近红外光光斑范围的参考。此外,光接收单元中在光接收元件(一般为硅基感光元件,视需求采用不同器件)前加窄带滤镜,过滤近红外光源以外的光,采用近红外光作为接收探测光,避免了使用环境中可见光的干扰,达到稳定检测的目的。The present invention uses light capable of emitting two wavelengths as a light source, and the emitted light beams of two wavelengths include visible light and near-infrared light, and the centers of the spots of visible light and near-infrared light coincide or nearly coincide. In this way, during the installation and debugging process, it is very convenient to find the exact position of the light irradiation by observing the visible light spot, so that the measured object is correctly placed within the detection range of the sensor. , the visible light spot can be used as a reference for the range of the near-infrared light spot. In addition, in the light-receiving unit, a narrow-band filter is added in front of the light-receiving element (usually a silicon-based photosensitive element, and different devices are used according to requirements) to filter light other than the near-infrared light source, and the near-infrared light is used as the receiving detection light, avoiding the use of The interference of visible light in the environment can achieve the purpose of stable detection.

本发明涉及一种具有双发射波长光源设计的光电传感器技术领域,尤其涉及一种反射型和对射型光电传感器技术领域,一种具有双发射波长光源设计的光电传感器的结构包括光发射单元,光接收单元和信号处理单元,其中:The present invention relates to the technical field of a photoelectric sensor with a dual emission wavelength light source design, and in particular to the technical field of a reflective and through-beam photoelectric sensor. The structure of a photoelectric sensor with a dual emission wavelength light source design includes a light emitting unit, An optical receiving unit and a signal processing unit, wherein:

光发射单元由驱动电源电路、双波长发射光源和发射透镜组成,驱动电源电路与双波长发射光源相连接,双波长发射光源由两种发射不同波长的发光芯片的特殊布局,双波长发射光源与发射透镜通过固定装置连接固定,根据需要保持一定的距离,其中驱动电路给光源提供电源;The light emitting unit is composed of a driving power circuit, a dual-wavelength emitting light source and a emitting lens. The driving power circuit is connected to the dual-wavelength emitting light source. The dual-wavelength emitting light source is composed of two special layouts of light-emitting chips emitting different wavelengths. The emitting lens is connected and fixed by a fixing device, and a certain distance is kept as required, and the driving circuit provides power to the light source;

光接收单元包括光束接收透镜,光学滤镜和感光元件组成,光束接收透镜,光学滤镜和感光元件由固定装置连接固定,光束接收透镜的功能是收集被测物体反射回来的光或者发射器发出的光,并使之汇聚到感光元件的光接收面,光学滤镜的功能是过滤掉可见光波长范围内的光,只允许近红外光通过,排除可见光干扰;考虑到传感器内空间有限,接收单元的的滤镜也可以去掉,改为在接收透镜的表面镀过滤膜的方式,起到过滤发射光波长以外的光的作用;The light receiving unit consists of a beam receiving lens, an optical filter and a photosensitive element. The beam receiving lens, optical filter and photosensitive element are connected and fixed by a fixing device. The function of the beam receiving lens is to collect the light reflected back from the measured object or emitted by the transmitter. and make it converge to the light-receiving surface of the photosensitive element. The function of the optical filter is to filter out the light in the wavelength range of visible light, only allowing near-infrared light to pass through, and eliminating the interference of visible light; considering the limited space in the sensor, the receiving unit The filter can also be removed, and the surface of the receiving lens can be coated with a filter film to filter light other than the wavelength of the emitted light;

信号处理单元包括一系列的电信号处理元件,通过电极与光接收单元连接,信号处理单元功能是将感光元件输出的电信号进行放大并处理成可以与传感器外部通信的标准信号;The signal processing unit includes a series of electrical signal processing elements, which are connected to the light receiving unit through electrodes. The function of the signal processing unit is to amplify the electrical signal output by the photosensitive element and process it into a standard signal that can communicate with the outside of the sensor;

进一步地,其特征在于:双波长发射光源包含可见光波长光源和近红外波长光源,包含可见光和近红外光两种独立的发光芯片,其中发光芯片可以是LED;Further, it is characterized in that: the dual-wavelength emission light source includes a visible light wavelength light source and a near-infrared wavelength light source, and includes two independent light-emitting chips for visible light and near-infrared light, wherein the light-emitting chip can be an LED;

进一步地,其特征在于:通过对两种发射不同波长的发光芯片的特殊布局,光源的发光芯片采用在空间上堆叠的方式,其中红外发光芯片在靠近透镜一侧,红光发光芯片在另一侧,红光芯片的直径大于红外光芯片的直径,同时两个发光芯片光束轴心线(104)重合,中心轴线距离小于5mm;Further, it is characterized in that: through the special layout of two light-emitting chips emitting different wavelengths, the light-emitting chips of the light source are stacked in space, wherein the infrared light-emitting chip is on the side close to the lens, and the red light-emitting chip is on the other side. On the other hand, the diameter of the red light chip is larger than the diameter of the infrared light chip, and at the same time, the beam axes (104) of the two light-emitting chips coincide, and the distance between the central axes is less than 5mm;

进一步地,两种发射不同波长的发光芯片的特殊布局,红光芯片的直径为D1,红外芯片的直径为D2,发射透镜的直径为D3,发射透镜的功能是根据使用场景需要对光源发出的光进行汇聚,使光束能量集中到需要检测的范围内;其中D1,D2,D3必须满足以下条件:Further, the special layout of two light-emitting chips emitting different wavelengths, the diameter of the red chip is D1, the diameter of the infrared chip is D2, and the diameter of the emitting lens is D3. The function of the emitting lens is to emit light to the light source according to the needs of the usage scene The light is converged so that the beam energy is concentrated within the range to be detected; where D1, D2, and D3 must meet the following conditions:

D1≤D3/10,因为透镜设计的时候是把LED视作点光源的,前提条件是光源的直径必须小于透镜的1/10;D1≤D3/10, because the LED is regarded as a point light source when the lens is designed, the prerequisite is that the diameter of the light source must be less than 1/10 of the lens;

D1-D2≥2μm,根据实验发现,红光发光区域过小的话则无法观察到红光光斑;D1-D2≥2μm, according to experiments, if the red light-emitting area is too small, the red light spot cannot be observed;

D2≥10μm,是为了保证红外光发出来的强度足够检测物体,实际测试发现,发光芯片直径小于该值的时候,由于传感器接收单元接收到的信号太弱,传感器无法正常工作,也就是光源的发出的辐射通量不足;D2≥10μm is to ensure that the intensity of infrared light is enough to detect objects. The actual test found that when the diameter of the light-emitting chip is smaller than this value, the sensor cannot work normally because the signal received by the sensor receiving unit is too weak, that is, the light source. Insufficient radiant flux emitted;

其中这里讨论的D1,D2,D3的范围是值限于实际使用中的光电传感器,在该类光电传感器结构中光源发光芯片和透镜中心点的距离在2-30mm范围内。The ranges of D1, D2, and D3 discussed here are limited to photoelectric sensors in actual use. In this type of photoelectric sensor structure, the distance between the light source chip and the center point of the lens is within the range of 2-30mm.

进一步地,其特征在于:发射端透镜的设计应该遵循焦距关系f红光<f设计<f红外,因为,发射端透镜(103)的焦距公式如下:Further, it is characterized in that: the design of the transmitting end lens should follow the focal length relationship f red <f design <f infrared , because the focal length formula of the emitting end lens (103) is as follows:

Figure BDA0003849167290000041
Figure BDA0003849167290000041

n为玻璃的折射率,d为透镜的中心厚度,当d=0时,即为薄透镜,f为焦距,r为透镜球面半径。由于不同波长在玻璃中的传播速度不同,折射率也不同,所以焦距也不同,即同一个透镜,不同的波长情况下焦距不同。根据柯西公式,波长越长,折射率越小;根据透镜焦距公式,折射率越小,焦距越长。n is the refractive index of the glass, d is the center thickness of the lens, when d=0, it is a thin lens, f is the focal length, and r is the spherical radius of the lens. Because different wavelengths have different propagation speeds in the glass, the refractive index is also different, so the focal length is also different, that is, the same lens has different focal lengths at different wavelengths. According to Cauchy's formula, the longer the wavelength, the smaller the refractive index; according to the lens focal length formula, the smaller the refractive index, the longer the focal length.

垂轴放大率β和焦距f的关系是,其中x为像的距离The relationship between the vertical axis magnification β and the focal length f is, where x is the distance of the image

Figure BDA0003849167290000051
Figure BDA0003849167290000051

为了使红光和近红外的光经过透镜后光斑中心重合,同时光斑范围尽量减少重叠,因此,发射端透镜(103)的设计应该遵循f红光<f设计<f红外In order to make the red light and the near-infrared light coincide after the light spot centers after passing through the lens, and reduce the overlapping of the light spot range as much as possible, therefore, the design of the transmitting end lens (103) should follow f red light <f design <f infrared .

相对于现有技术,本发明具有如下优点:Compared with the prior art, the present invention has the following advantages:

本发明是针对上述情况而研发的,考虑到光源为红光和近红外光两种波长,经过光发射单元的透镜会产生轴向色差和横向色差,尤其是横向色差对光斑覆盖范围影响比较大。透镜的焦距公式如下The present invention is developed in view of the above situation. Considering that the light source has two wavelengths of red light and near-infrared light, the lens passing through the light emitting unit will produce axial chromatic aberration and lateral chromatic aberration, especially the lateral chromatic aberration has a relatively large impact on the coverage of the spot . The focal length formula of the lens is as follows

Figure BDA0003849167290000052
Figure BDA0003849167290000052

n为玻璃的折射率,d为透镜的中心厚度,当d=0时,即为薄透镜,f为焦距,r为透镜球面半径。由于不同波长在玻璃中的传播速度不同,折射率也不同,所以焦距也不同,即同一个透镜,不同的波长情况下焦距不同。根据柯西公式,波长越长,折射率越小;根据透镜焦距公式,折射率越小,焦距越长。n is the refractive index of the glass, d is the center thickness of the lens, when d=0, it is a thin lens, f is the focal length, and r is the spherical radius of the lens. Because different wavelengths have different propagation speeds in the glass, the refractive index is also different, so the focal length is also different, that is, the same lens has different focal lengths at different wavelengths. According to Cauchy's formula, the longer the wavelength, the smaller the refractive index; according to the lens focal length formula, the smaller the refractive index, the longer the focal length.

垂轴放大率β和焦距f的关系是,其中x为像的距离The relationship between the vertical axis magnification β and the focal length f is, where x is the distance of the image

Figure BDA0003849167290000061
Figure BDA0003849167290000061

为了使红光和近红外的光经过透镜后光斑中心重合,同时光斑范围尽量减少重叠,透镜的设计应该遵循焦距f红光<f设计<f红外。因此传感器发射部分的透镜也是经过特殊消色差设计的,使出射的红光的光斑中心和近红外光的光斑中心重合或者接近重合。光接收单元部分则加装窄带滤镜,只允许光源所发出的近红外光能到达光电探测器。这样设计的目的可以在安装调试过程中,光斑的位置始终可见,具有定位的作用,方便调试,同时在传感器实际使用过程中又不受环境中照明设备可见光的干扰。In order to make the center of the spot of red light and near-infrared light coincide after passing through the lens, and at the same time minimize the overlapping of the spot range, the design of the lens should follow the focal length f red light < f design < f infrared . Therefore, the lens of the emitting part of the sensor is also designed through a special achromatic design, so that the center of the spot of the emitted red light and the center of the near-infrared light coincide or nearly coincide. The light-receiving unit part is equipped with a narrow-band filter to allow only the near-infrared light emitted by the light source to reach the photodetector. The purpose of this design is that the position of the light spot is always visible during the installation and debugging process, which has the function of positioning and is convenient for debugging. At the same time, the sensor is not disturbed by the visible light of the lighting equipment in the environment during the actual use of the sensor.

【附图说明】【Description of drawings】

图1是现有的反射型传感器原理图;Figure 1 is a schematic diagram of an existing reflective sensor;

图2是现有的对射型传感器原理图;以投射的光线是否被遮挡阻断为检测依据;Figure 2 is the schematic diagram of the existing through-beam sensor; the detection basis is based on whether the projected light is blocked or not;

图3是本发明一种具有双发射波长光源设计的光电传感器原理图;Fig. 3 is a kind of schematic diagram of the photoelectric sensor with dual emission wavelength light source design of the present invention;

图4是本发明双波长发射单元采用在空间上堆叠的方式俯视图;Fig. 4 is a top view of the dual-wavelength transmitting units of the present invention in a spatially stacked manner;

图5是本发明双波长发射单元采用在空间上堆叠的方式立体图;Fig. 5 is a perspective view of the dual-wavelength transmitting units of the present invention in a spatially stacked manner;

图6是本发明双波长发射单元的工作示意图。Fig. 6 is a working diagram of the dual-wavelength emitting unit of the present invention.

【具体实施方式】【detailed description】

为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施实例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅用于解释本发明,并不用于限定本发明。In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

请参阅图3-图6,本发明提供了一种具有双发射波长光源设计的光电传感器,包括如下步骤:Please refer to Fig. 3-Fig. 6, the present invention provides a kind of photoelectric sensor with double emission wavelength light source design, comprises the following steps:

一种具有双发射波长光源设计的光电传感器1的结构包括光发射单元10,光接收单元20和信号处理单元30,其中:A structure of a photoelectric sensor 1 with a dual emission wavelength light source design includes a light emitting unit 10, a light receiving unit 20 and a signal processing unit 30, wherein:

所述光发射单元10由驱动电源电路101、双波发射光源102和发射透镜103组成,双波长发射光源102、驱动电源电路101与双波长发射光源102相连接,双波长发射光源102与发射透镜103通过固定装置连接固定,其中驱动电路101给光源提供电源;Described light emitting unit 10 is made up of driving power supply circuit 101, double-wave emitting light source 102 and emitting lens 103, double-wavelength emitting light source 102, driving power supply circuit 101 are connected with double-wavelength emitting light source 102, double-wavelength emitting light source 102 and emitting lens 103 is connected and fixed by a fixing device, wherein the drive circuit 101 provides power to the light source;

所述光接收单元20包括光束接收透镜201,光学滤镜202和感光元件203组成,光束接收透镜201,光学滤镜202和感光元件203由固定装置连接固定,光束接收透镜201的功能是收集被测物体反射回来的光或者发射器发出的光,并使之汇聚到感光元件203的光接收面,光学滤镜202的功能是过滤掉可见光波长范围内的光,只允许近红外光通过,排除可见光干扰;Described light receiving unit 20 comprises light beam receiving lens 201, optical filter 202 and photosensitive element 203 are formed, and light beam receiving lens 201, optical filter 202 and photosensitive element 203 are connected and fixed by fixing device, and the function of light beam receiving lens 201 is to collect the The light reflected back by the measured object or the light emitted by the emitter is converged to the light-receiving surface of the photosensitive element 203. The function of the optical filter 202 is to filter out the light in the wavelength range of visible light, and only allow near-infrared light to pass through. Visible light interference;

所述信号处理单元30包括一系列的电信号处理元件,通过电极301与光接收单元20连接,功能是将感光元件203输出的电信号进行放大并处理成可以与传感器外部通信的标准信号。The signal processing unit 30 includes a series of electrical signal processing elements, which are connected to the light receiving unit 20 through the electrodes 301 . The function is to amplify the electrical signal output by the photosensitive element 203 and process it into a standard signal that can communicate with the outside of the sensor.

双波长发射光源102包括可见光波长光源104和近红外波长光源105,可见光波长光源104和近红外波长光源105采用独立的发光芯片发光。可见光波长光源104采用红光发光芯片发出可见光,近红外波长光源105采用红外发光芯片发出近红外光;发光芯片可以是LED。本发明的显著特征在于通过对两种发射不同波长的发光芯片的特殊布局,光源的发光芯片采用在空间上堆叠的方式,其中红外发光芯片在靠近透镜一侧,红光发光芯片在另一侧,红光芯片的直径大于红外光芯片的直径,同时两个发光芯片中心轴线重合,红光发光芯片中心与红外发光芯片的中心轴线距离小于5mm。The dual-wavelength emitting light source 102 includes a visible light wavelength light source 104 and a near-infrared wavelength light source 105, and the visible light wavelength light source 104 and the near-infrared wavelength light source 105 use independent light-emitting chips to emit light. The visible light wavelength light source 104 uses a red light-emitting chip to emit visible light, and the near-infrared wavelength light source 105 uses an infrared light-emitting chip to emit near-infrared light; the light-emitting chip can be an LED. The remarkable feature of the present invention is that through the special layout of two light-emitting chips emitting different wavelengths, the light-emitting chips of the light source are stacked in space, wherein the infrared light-emitting chip is on the side close to the lens, and the red light-emitting chip is on the other side , the diameter of the red light-emitting chip is greater than that of the infrared light-emitting chip, and the central axes of the two light-emitting chips coincide, and the distance between the center of the red light-emitting chip and the central axis of the infrared light-emitting chip is less than 5mm.

红光发光芯片的直径为D1,红外发光芯片的直径为D2,发射透镜103的直径为D3,其中D1,D2,D3必须满足以下条件:The diameter of the red light-emitting chip is D1, the diameter of the infrared light-emitting chip is D2, and the diameter of the emitting lens 103 is D3, wherein D1, D2, and D3 must meet the following conditions:

D1≤D3/10,因为透镜设计的时候是把发光芯片视作点光源的,前提条件是光源的直径必须小于透镜的1/10;D1≤D3/10, because the light-emitting chip is regarded as a point light source when the lens is designed, and the prerequisite is that the diameter of the light source must be smaller than 1/10 of the lens;

D1-D2≥2μm,因为根据实际测试经验发现,红光发光区域过小的话则无法观察到红光光斑;D1-D2≥2μm, because according to the actual test experience, if the red light emitting area is too small, the red light spot cannot be observed;

D2≥10μm,是为了保证红外光发出来的强度足够检测物体,实际测试发现,发光芯片直径小于该值的时候,传感器无法正常工作,也就是光源的发光强度不足;D2≥10μm is to ensure that the intensity of the infrared light is sufficient to detect objects. The actual test found that when the diameter of the light-emitting chip is smaller than this value, the sensor cannot work normally, that is, the luminous intensity of the light source is insufficient;

其中这里讨论的D1,D2,D3的范围是只限于实际使用中的光电传感器,在该类光电传感器结构中光源发光芯片和透镜中心点的距离在2-30mm范围内。The ranges of D1, D2, and D3 discussed here are limited to photoelectric sensors in actual use. In this type of photoelectric sensor structure, the distance between the light source chip and the center point of the lens is within the range of 2-30mm.

透镜的功能是根据使用场景需要对光源发出的光进行汇聚,使光束能量集中到需要检测的范围内;The function of the lens is to converge the light emitted by the light source according to the needs of the use scene, so that the beam energy can be concentrated within the range that needs to be detected;

1、第一具体实施例:1. The first specific embodiment:

本发明的结构包括光发射单元10,光接收单元20和信号处理单元30。The structure of the present invention includes a light emitting unit 10 , a light receiving unit 20 and a signal processing unit 30 .

其中,红光发光芯片的直径D1为0.5mm,红外发光芯片的直径为D2为0.3mm,发射透镜103的直径为D3为6mm。Wherein, the diameter D1 of the red light emitting chip is 0.5 mm, the diameter D2 of the infrared light emitting chip is 0.3 mm, and the diameter D3 of the emitting lens 103 is 6 mm.

包含可见光和近红外光两种独立的发光芯片,其中可见光波长为650nm,近红外波长为850nm。根据LED光源特性以及使用需求,同时考虑消色差以后,实际设计的发射端透镜103焦距f设计=5.2mmContains two independent light-emitting chips for visible light and near-infrared light, wherein the wavelength of visible light is 650nm, and the wavelength of near-infrared light is 850nm. According to the characteristics of the LED light source and the use requirements, and after considering the achromatic aberration, the actual design of the focal length f of the lens 103 at the transmitting end is designed to be 5.2mm

2、第二具体实施例:2. The second specific embodiment:

红光发光芯片为正方形,边长D1为0.6mm,红外发光芯片也为正方形,边长D2位0.3mm,发射透镜直径D3位6mm,其中红光发光芯片发射波长为660nm,红外发光芯片发射波长为910nm。根据LED光源特性以及使用需求,同时考虑消色差以后,实际设计的发射端透镜103焦距f设计=5.2mmThe red light-emitting chip is square, the side length D1 is 0.6mm, the infrared light-emitting chip is also square, the side length D2 is 0.3mm, and the diameter of the emitting lens D3 is 6mm. The emission wavelength of the red light-emitting chip is 660nm, and the emission wavelength of the infrared light-emitting chip is 910nm. According to the characteristics of the LED light source and the use requirements, and after considering the achromatic aberration, the actual design of the focal length f of the lens 103 at the transmitting end is designed to be 5.2mm

3、第三具体实施例:3. The third specific embodiment:

当需要检测较大物体,且物体局部有小面积的空洞或者反射率非常低的(例如5%以下)时,红光发光芯片为正方形,边长D1为1mm,红外发光芯片为圆形,直径D2为0.8mm,透镜直径10mm。When it is necessary to detect a large object, and the object has a small area of holes locally or the reflectivity is very low (for example, below 5%), the red light-emitting chip is a square, the side length D1 is 1mm, and the infrared light-emitting chip is circular, with a diameter of D2 is 0.8mm, and the lens diameter is 10mm.

其中红光发光芯片发射波长为620nm,红外发光芯片发射波长为880nm。The emission wavelength of the red light-emitting chip is 620nm, and the emission wavelength of the infrared light-emitting chip is 880nm.

根据LED光源特性以及使用需求,同时考虑消色差以后,实际设计的发射端透镜(103)焦距f设计=5.5mm。According to the characteristics of the LED light source and the use requirements, and after considering the achromatic aberration, the actual design of the focal length f of the emitting end lens (103) is designed to be 5.5 mm.

4、第四具体实施例:4. The fourth specific embodiment:

当检测面积较小或者细小的物体时,需要较小的光斑。红光发光芯片为圆形,直径为0.3mm,红外发光芯片为圆形,直径为0.2mm,发射透镜103的直径为5mm。When detecting small or tiny objects, a smaller spot size is required. The red light-emitting chip is circular with a diameter of 0.3 mm, the infrared light-emitting chip is circular with a diameter of 0.2 mm, and the diameter of the emitting lens 103 is 5 mm.

其中红光发光芯片的发射波长为640nm,红外发光芯片的发射波长为930nm。The emission wavelength of the red light-emitting chip is 640nm, and the emission wavelength of the infrared light-emitting chip is 930nm.

根据LED光源特性以及使用需求,同时考虑消色差以后,实际设计的发射端透镜103焦距f设计=5.2mm。According to the characteristics of the LED light source and the use requirements, and after considering the achromatic aberration, the focal length f of the lens 103 at the transmitting end is actually designed to be 5.2 mm.

相对于现有技术,本发明具有如下优点:Compared with the prior art, the present invention has the following advantages:

本发明是针对上述情况而研发的,考虑到光源为红光和近红外光两种波长,经过光发射单元的透镜会产生轴向色差和横向色差,尤其是横向色差影响比较大。透镜的焦距公式如下The present invention is developed in view of the above situation. Considering that the light source has two wavelengths of red light and near-infrared light, axial chromatic aberration and lateral chromatic aberration will occur through the lens of the light emitting unit, especially lateral chromatic aberration has a relatively large impact. The focal length formula of the lens is as follows

Figure BDA0003849167290000101
Figure BDA0003849167290000101

n为玻璃的折射率,d为透镜的中心厚度,当d=0时,即为薄透镜,f为焦距,r为透镜球面半径。由于不同波长在玻璃中的传播速度不同,折射率也不同,所以焦距也不同,即同一个透镜,不同的波长情况下焦距不同。根据柯西公式,波长越长,折射率越小;根据透镜焦距公式,折射率越小,焦距越长。n is the refractive index of the glass, d is the center thickness of the lens, when d=0, it is a thin lens, f is the focal length, and r is the spherical radius of the lens. Because different wavelengths have different propagation speeds in the glass, the refractive index is also different, so the focal length is also different, that is, the same lens has different focal lengths at different wavelengths. According to Cauchy's formula, the longer the wavelength, the smaller the refractive index; according to the lens focal length formula, the smaller the refractive index, the longer the focal length.

垂轴放大率β和焦距f的关系是,其中x为像的距离The relationship between the vertical axis magnification β and the focal length f is, where x is the distance of the image

Figure BDA0003849167290000102
Figure BDA0003849167290000102

为了使红光和近红外的光经过透镜后光斑中心重合,同时光斑范围尽量减少重叠,透镜的设计应该遵循f红光<f设计<f红外。其中f红光是红光发光芯片的焦距,f设计是发射端透镜103的焦距,f红外是红外发光芯片的焦距;因此传感器发射部分的透镜也是经过特殊消色差设计的,使出射的红光的光斑中心和近红外光的光斑中心重合或者接近重合。光接收单元部分则加装窄带滤镜,只允许光源所发出的近红外光能到达光电探测器。这样设计的目的可以在安装调试过程中,光斑的位置始终可见,具有定位的作用,方便调试,同时在传感器实际使用过程中又不受环境中照明设备可见光的干扰。In order to make the red light and near-infrared light coincide with the center of the spot after passing through the lens, and at the same time minimize the overlapping of the spot range, the design of the lens should follow fred light <fdesign< finfrared . Wherein f red light is the focal length of the red light-emitting chip, f design is the focal length of the emitting end lens 103, and f infrared is the focal length of the infrared light-emitting chip; therefore the lens of the sensor emitting part is also designed through a special achromatic aberration, so that the emitted red light The spot center of the near-infrared light coincides or nearly coincides with the spot center of the near-infrared light. The light-receiving unit part is equipped with a narrow-band filter to allow only the near-infrared light emitted by the light source to reach the photodetector. The purpose of this design is that the position of the light spot is always visible during the installation and debugging process, which has the function of positioning and is convenient for debugging. At the same time, the sensor is not disturbed by the visible light of the lighting equipment in the environment during the actual use of the sensor.

以上所述仅为本发明的较佳实施例,并非因此限制本发明的专利范围,凡是在本发明的构思之内所作的任何修改,等同替换和改进等均应包含在本发明的专利保护范围内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any modifications made within the concept of the present invention, equivalent replacements and improvements, etc. should be included in the scope of patent protection of the present invention. Inside.

Claims (5)

1. A photosensor with a dual emission wavelength light source design comprising a light emitting unit (10), a light receiving unit (20) and a signal processing unit (30), characterized by the following further comprising the features:
the light emitting unit (10) is composed of a driving power circuit (101), a dual-wavelength light emitting source (102) and an emitting lens (103), the driving power circuit (101) is connected with the dual-wavelength light emitting source (102), the dual-wavelength light emitting source (102) is composed of two light emitting chips emitting different wavelengths, the dual-wavelength light emitting source (102) and the emitting lens (103) are fixedly connected through a fixing device, and the dual-wavelength light emitting source (102) and the emitting lens (103) are arranged at intervals.
The light receiving unit (20) comprises a light beam receiving lens (201), an optical filter (202) and a photosensitive element (203), the light beam receiving lens (201), the optical filter (202) and the photosensitive element (203) are fixedly connected through a fixing device, the light beam receiving lens (201) has the function of collecting light reflected by a measured object or light emitted by a transmitter and enabling the light to be converged on a light receiving surface of the photosensitive element (203), and the optical filter (202) has the function of filtering light in a visible light wavelength range, only allowing near infrared light to pass through and eliminating visible light interference;
the signal processing unit (30) is connected with the light receiving unit (20) through electrodes, and the signal processing unit (30) amplifies and processes the electric signals output by the photosensitive element (203) into standard signals capable of communicating with the outside of the sensor.
2. A photosensor having a dual emission wavelength light source design according to claim 1 wherein:
the dual-wavelength emission light source (102) comprises a visible light wavelength light source (104) and a near infrared wavelength light source (105), and the visible light wavelength light source (104) and the near infrared wavelength light source (105) adopt independent light emitting chips to emit light.
3. The photosensor with dual emission wavelength light source design of claim 2, wherein the visible light wavelength light source (104) emits visible light using a red light emitting chip and the near infrared wavelength light source (105) emits near infrared light using an infrared light emitting chip; the infrared light-emitting chip is close to one side of the emission lens (103), the red light-emitting chip is arranged on the other side, the diameter of the red light-emitting chip is larger than that of the infrared light-emitting chip, the beam axes of the two light-emitting chips are coincided, and the distance between the center of the red light-emitting chip and the center of the infrared light-emitting chip is smaller than 5mm.
4. A photosensor having a dual emission wavelength light source design as claimed in claim 2 wherein: the diameter of the red light emitting chip is D1, the diameter of the infrared light emitting chip is D2, the diameter of the transmitting lens (103) is D3, and the transmitting lens has the function of converging light emitted by a light source according to the use scene so that the energy of light beams is concentrated in the range needing to be detected; wherein D1, D2 and D3 satisfy the following conditions:
d1 is less than or equal to D3/10, because the light-emitting chip is regarded as a point light source when the lens is designed, wherein the diameter of the light source must be less than 1/10 of the lens;
d2 is more than or equal to 10 mu m, which is used for ensuring that the intensity of infrared light emitted by the infrared light-emitting chip is enough to detect an object, and if the diameter of the light-emitting chip is smaller than the value, the sensor cannot work normally because the signal received by the sensor receiving unit is too weak, namely the radiation flux emitted by the light source is insufficient;
D1-D2 is more than or equal to 2 mu m, and if the area of the red light emitting chip is too small, red light spots cannot be observed;
d1 The range of D2 and D3 is limited to the photoelectric sensor in practical use, and the distance between the light source light-emitting chip and the central point of the lens in the photoelectric sensor structure is in the range of 2-30 mm.
5. A photosensor having a dual emission wavelength light source design as claimed in claim 2 wherein: the design of the emission lens (103) should follow f Red light <f Design of <f Infrared ray Wherein f is Red light Is the focal length of the red light emitting chip, f Design of Is the focal length of the emitting end lens (103), f Infrared ray Is the focal length of the infrared light emitting chip;
the focal length formula of the transmitting end lens (103) is as follows:
Figure FDA0003849167280000031
n is the refractive index of the glass, d is the central thickness of the lens, f is the focal length, r is the spherical radius of the lens, and the focal lengths are different because the propagation speeds of different wavelengths in the glass are different and the refractive indexes are also different, namely the focal lengths of the same lens are different under different wavelengths; according to the Cauchy's formula, the longer the wavelength, the smaller the refractive index; according to a lens focal length formula, the smaller the refractive index is, the longer the focal length is;
the relationship between the vertical axis magnification β and the focal length f is that, where x is the distance of the image
Figure FDA0003849167280000032
In order to ensure that the centers of light spots of the visible light wavelength light source (104) and the near infrared wavelength light source (105) are superposed after light passes through the lens, and simultaneously, the light spot ranges are reduced to the greatest extent,therefore, the design requirement f of the emission end lens (103) Red light <f Design of <f Infrared ray
CN202211134243.5A 2022-09-16 2022-09-16 A Photoelectric Sensor with Dual Emission Wavelength Light Source Design Pending CN115615541A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211134243.5A CN115615541A (en) 2022-09-16 2022-09-16 A Photoelectric Sensor with Dual Emission Wavelength Light Source Design

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211134243.5A CN115615541A (en) 2022-09-16 2022-09-16 A Photoelectric Sensor with Dual Emission Wavelength Light Source Design

Publications (1)

Publication Number Publication Date
CN115615541A true CN115615541A (en) 2023-01-17

Family

ID=84857778

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211134243.5A Pending CN115615541A (en) 2022-09-16 2022-09-16 A Photoelectric Sensor with Dual Emission Wavelength Light Source Design

Country Status (1)

Country Link
CN (1) CN115615541A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170016763A1 (en) * 2015-07-14 2017-01-19 Sick Ag Optoelectronic sensor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170016763A1 (en) * 2015-07-14 2017-01-19 Sick Ag Optoelectronic sensor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
《光学仪器设计手册》编辑组: "光学仪器设计手册 上 光学设计与光学测量", 31 October 1971, 北京:国防工业出版社, pages: 11 - 12 *

Similar Documents

Publication Publication Date Title
CN101858758B (en) Photoelectric sensor
US9459352B2 (en) Multi-sensor proximity sensing using a near zone light sensor and a far zone light sensor
TWI578049B (en) Optical electronic coupled module
JP5614957B2 (en) Optical sensor device for paper sheet discrimination
TWI497142B (en) Optical fiber connector
WO2016148645A1 (en) Optoelectronic module for spectral and proximity data acquisition
CN107845627B (en) Multiple proximity detection light sensor
CN104913796A (en) Long-distance correlated photoelectric sensor based on aspheric lens
JP2011525239A (en) Photoelectric switch and method for detecting objects
EP3572716A1 (en) Color acquisition apparatus and remote control capable of color acquisition
TW439357B (en) Optical unit, photoelectric switch, fiber-type photoelectric switch, and color discrimination sensor
TWI468650B (en) Optical detecting system and optical detecting device thereof
CN103676029A (en) Photoelectric coupling module
CN216670775U (en) A device based on reflective photosensitive automatic identification filter
TW201423187A (en) Photoelectric conversion device
CN115615541A (en) A Photoelectric Sensor with Dual Emission Wavelength Light Source Design
CN117192634B (en) Correlation photoelectric sensor and assembly method thereof
CN105572058A (en) Sample analyzer and absorbance measurement device thereof
CN114930191A (en) Laser measuring device and movable platform
JP6079599B2 (en) Board unit
CN114067127A (en) Device and method for automatically identifying filter based on reflective sensitization
TWI495850B (en) Optical sensing device
CN205666813U (en) Retro -reflection formula photoelectric switch
JPWO2008105025A1 (en) Photoelectric sensor
CN204154641U (en) Sample analyser and absorbance measuring device thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination