CN115612298A - Preparation process of low-dielectric high-heat-conductivity LCP/PPS composite material for communication equipment - Google Patents
Preparation process of low-dielectric high-heat-conductivity LCP/PPS composite material for communication equipment Download PDFInfo
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- CN115612298A CN115612298A CN202210531579.9A CN202210531579A CN115612298A CN 115612298 A CN115612298 A CN 115612298A CN 202210531579 A CN202210531579 A CN 202210531579A CN 115612298 A CN115612298 A CN 115612298A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/02—Polythioethers; Polythioether-ethers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Abstract
The application discloses communication equipment is with preparation technology of low dielectric high heat conduction LCP/PPS combined material includes following step in proper order: s1, preparing the following raw materials in parts by weight: 45 to 75 portions of polyphenylene sulfide, 25 to 55 portions of liquid crystal polymer, 30 to 40 portions of ceramic powder, 10 to 20 portions of inorganic fiber, 5 to 10 portions of PTFE and 0.5 to 2 portions of processing aid; s2, mixing the polyphenylene sulfide, the liquid crystal polymer, the PTFE and the processing aid by a rotary mixer, then feeding the mixture from a main feed opening of a double-screw extruder, mixing the ceramic powder and the inorganic fiber by the mixer, and then feeding the mixture from a side feed opening of the double-screw extruder; and S3, carrying out melt mixing extrusion granulation, wherein the rotating speed of the rotary mixer is 60-120 rpm, the mixing time is 5-10 min, the discharge amount of the double-screw extruder is 100-200 Kg/h, the rotating speed is 200-400 rpm, the temperature of each section of the machine barrel is 330 +/-20 ℃, the temperature of the machine head is 340 +/-10 ℃, and the extraction pressure of the vacuum section is-0.08 +/-0.02 MPa. The invention improves the defect that PPS is easy to stress crack, and widens the application of PPS in low dielectric materials in electronic parts.
Description
Technical Field
The invention relates to the field of composite materials, in particular to a preparation process of a low-dielectric high-heat-conductivity LCP/PPS composite material for communication equipment.
Background
With the rapid development of communication technology, people have higher and higher demands on communication equipment, and communication equipment chips are continuously upgraded and updated; the increasing screen resolution makes the hardware configuration of the smart device higher. The heat generation is more and more serious along with the hardware improvement of the mobile phone. In the field of communication equipment, the requirements for the electron transport speed and the loss of device materials are further increased.
Polyphenylene Sulfide (PPS) is a thermoplastic engineering plastic with excellent comprehensive performance, and a large number of benzene rings exist in a molecular structure, so that the PPS has good rigidity, thermal stability and chemical resistance. Meanwhile, the dielectric constant and the dielectric loss of PPS are one of the smallest varieties among engineering plastics, and are hardly affected by temperature and humidity. Liquid Crystal Polymers (LCP) have excellent processing flowability, mechanical strength, thermal stability and lower dielectric constant, and LCP is increasingly studied as a component of polymer alloys.
In order to meet the requirements of the market on the heat conductivity and the dielectricity of the communication equipment device material, the invention aims to prepare the low-dielectric high-heat-conductivity LCP/PPS composite material which has excellent heat conductivity, dielectric property and molding processability.
PPS itself has a low dielectric constant and dielectric loss, and thus, many studies have been made on low dielectric materials based on PPS. However, PPS is brittle and easily broken due to its brittleness, which limits the wide use of PPS. Blending PPS with other polymers and functional fillers is an important method for preparing PPS composite materials, and meanwhile, excellent thermal conductivity is also a performance requirement required by communication equipment and device materials.
CN111548557A relates to a low-dielectric high-thermal-conductivity polypropylene alloy and a preparation method thereof, compatibility with PP is enhanced by modified LCP, and a large benzene ring structure on an LCP branched chain is utilized to increase molecular chain spacing and improve molecular free volume, so that dielectric constant and dielectric loss of a matrix are reduced, and the alloy has excellent dielectric property and mechanical strength. PP is used as a general plastic, the heat resistance of the PP is far lower than that of LCP, so that the difficulty of melt blending of PP and LCP is increased, the dielectric property of PP is general, and the high-performance low-dielectric high-heat-conductivity composite material is difficult to prepare.
Disclosure of Invention
The invention aims to provide a preparation process of a low-dielectric high-heat-conductivity LCP/PPS composite material for communication equipment.
In order to achieve the above object, the present invention provides the following technical solutions.
The embodiment of the application discloses preparation technology of low-dielectric high-heat-conductivity LCP/PPS composite material for communication equipment, which comprises the following steps in sequence:
s1, preparing the following raw materials in parts by mass: 45-75 parts of polyphenylene sulfide, 25-55 parts of liquid crystal polymer, 30-40 parts of ceramic powder, 10-20 parts of inorganic fiber, 5-10 parts of PTFE and 0.5-2 parts of processing aid;
s2, mixing the polyphenylene sulfide, the liquid crystal polymer, the PTFE and the processing aid by a rotary mixer, then feeding the mixture from a main feed opening of a double-screw extruder, mixing the ceramic powder and the inorganic fiber by the mixer, and then feeding the mixture from a side feed opening of the double-screw extruder;
and S3, carrying out melt mixing extrusion granulation, wherein the rotating speed of the rotary mixer is 60-120 rpm, the mixing time is 5-10 min, the output of the double-screw extruder is 100-200 Kg/h, the rotating speed is 200-400 rpm, the temperature of each section of the machine barrel is 330 +/-20 ℃, the temperature of the machine head is 340 +/-10 ℃, and the extraction pressure of the vacuum section is-0.08 +/-0.02 MPa.
Preferably, in the preparation process of the low-dielectric high-thermal-conductivity LCP/PPS composite material for communication equipment, the sum of the parts by mass of the polyphenylene sulfide and the liquid crystal polymer is 100 parts.
Preferably, in the preparation process of the low-dielectric high-thermal-conductivity LCP/PPS composite material for the communication equipment, the melting temperature of the polyphenylene sulfide is 260-300 ℃, and the melt index is 25-50 g/10min.
Preferably, in the preparation process of the low-dielectric high-thermal-conductivity LCP/PPS composite material for the communication equipment, the liquid crystal polymer is aromatic polyester and polyester amide with the melting point of 300-360 ℃.
Preferably, in the preparation process of the low-dielectric high-thermal-conductivity LCP/PPS composite material for communication equipment, the ceramic powder is at least one of titanate, nitride, and alumina, and is surface-treated in advance, and the particle diameter is 1 to 30 micrometers.
Preferably, in the preparation process of the low-dielectric high-thermal-conductivity LCP/PPS composite material for communication equipment, the inorganic fiber includes at least one of a surface-treated glass fiber, a wollastonite fiber, and a potassium titanate fiber.
Preferably, in the preparation process of the low-dielectric high-thermal-conductivity LCP/PPS composite material for the communication equipment, the PTFE characteristic density is 2.1-2.3 g/cm 3 The grain diameter is 20-35 microns.
Preferably, in the preparation process of the low-dielectric high-thermal-conductivity LCP/PPS composite material for communication equipment, the processing aid comprises a lubricant and an antioxidant, the lubricant comprises at least one of silicone powder, pentaerythritol stearate, calcium stearate and zinc stearate, and the antioxidant comprises at least one of hindered phenol, phosphite ester and thioester.
Preferably, in the preparation process of the low-dielectric high-thermal-conductivity LCP/PPS composite material for communication equipment, the surface treatment sequentially comprises the following steps: dispersing the surface treatment agent in a dispersing agent to prepare a coupling agent dispersion liquid, spraying the coupling agent dispersion liquid on the ceramic powder or the inorganic fiber at a constant speed, continuously stirring, and drying to obtain the surface-treated ceramic powder or the inorganic fiber.
Preferably, in the preparation process of the low-dielectric high-thermal-conductivity LCP/PPS composite material for communication equipment, the surface treatment agent includes at least one of KH550, KH560, and KH580, the dispersing agent is anhydrous methanol, the ratio of the surface treatment agent to the dispersing agent in parts by mass is 1.
Compared with the prior art, the invention has the advantages that materials PPS and LCP with low dielectric constant are adopted as base materials, and the method of alloying the PPS and the LCP improves the defect that the PPS is easy to stress crack, and widens the application of the PPS in low dielectric materials in electronic parts; and through the improvement of the thermal conductivity, the material has excellent thermal conductivity at the same time, and can meet the requirements of the communication equipment field on the thermal conductivity of the device material.
Detailed Description
Technical solutions in the embodiments of the present invention will be described in detail below, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Example 1
Firstly, uniformly dispersing 1 part of KH580 in 10 parts of anhydrous methanol according to the mass fraction to prepare a coupling agent dispersion solution, then uniformly spraying the coupling agent dispersion solution in a mixing reaction kettle filled with boron nitride powder according to the addition amount of 1wt%, spraying liquid while stirring to ensure that the coupling agent is uniformly dispersed in the powder, continuously stirring and mixing for 10min, and drying to obtain the surface-treated powder. The surface treatment was performed on the low dielectric constant glass fiber in the same manner.
75 parts of PPS, 25 parts of LCP resin, 5 parts of PTFE, 1 part of silicone powder and 0.5 part of phosphite ester are mixed in a rotary mixer, and then the mixture is fed from a main feed opening of a double-screw extruder, and 20 parts of boron nitride and 20 parts of glass fiber are mixed in the rotary mixer, and then the mixture is fed from a side feed opening of the extruder through a screw feeder, and is subjected to melt mixing, extrusion and granulation. The rotary mixer was rotated at 60rpm for a mixing time of 10min. The output of the double-screw extruder is 150Kg/h, the rotating speed is 250rpm, the temperature of each section of the machine barrel is 330 ℃, the head temperature is 340 ℃, and the extraction pressure of the vacuum section is-0.1 MPa.
Example 2
Uniformly dispersing 1 part of KH580 in 10 parts of anhydrous methanol according to the mass fraction to prepare a coupling agent dispersion solution, uniformly spraying the coupling agent in a mixing reaction kettle filled with boron nitride according to the addition amount of 1Wt%, spraying liquid while stirring to ensure that the coupling agent is uniformly dispersed in the powder, continuously stirring and mixing for 10min, and drying to obtain the surface-treated powder. The potassium titanate fibers were treated in the same manner.
75 parts of PPS, 25 parts of LCP resin, 5 parts of PTFE, 1 part of silicone powder and 0.5 part of phosphite ester are mixed in a rotary mixer, and then are fed from a main feed opening of a twin-screw extruder, and 20 parts of boron nitride and 20 parts of potassium titanate fiber are mixed in the rotary mixer, and then are fed from a side feed opening of the extruder through a screw feeder, and are subjected to melt mixing, extrusion and granulation. The rotary mixer was rotated at 60rpm for a mixing time of 10min. The discharge rate of the double-screw extruder is 150Kg/h, the rotating speed is 250rpm, the temperature of each section of the machine barrel is 330 ℃, the temperature of the machine head is 340 ℃, and the extraction pressure of the vacuum section is-0.1 MPa.
The performance of the composite material prepared by the invention reaches the following level, the heat conductivity coefficient, the dielectric constant and the dielectric loss are all higher than the indexes of the friction performance (PPS/30 percent low dielectric constant glass fiber)
| Item | Example 1 | Example 2 | Comparative example |
| Dielectric constant 1MHz | 2.3 | 2.1 | 2.9 |
| Dielectric loss 1MHz | 0.015 | 0.009 | 0.018 |
| Coefficient of thermal conductivity (W/m X K) | 4.2 | 4.7 | 1.6 |
| Tensile strength MPa | 130 | 120 | 135 |
| Bending strength MPa | 165 | 160 | 170 |
| Coefficient of dynamic friction | 0.27 | 0.15 | 0.40 |
| Specific abrasion 10 -1 mm 3 /N.km | 0.410 | 0.080 | 0.765 |
The present embodiments are to be considered as illustrative and not restrictive, and modifications may be made by those skilled in the art without departing from the spirit of the invention and the scope of the appended claims.
Claims (10)
1. A preparation process of a low-dielectric high-heat-conductivity LCP/PPS composite material for communication equipment is characterized by sequentially comprising the following steps:
s1, preparing the following raw materials in parts by mass: 45-75 parts of polyphenylene sulfide, 25-55 parts of liquid crystal polymer, 30-40 parts of ceramic powder, 10-20 parts of inorganic fiber, 5-10 parts of PTFE and 0.5-2 parts of processing aid;
s2, mixing the polyphenylene sulfide, the liquid crystal polymer, the PTFE and the processing aid by a rotary mixer, then feeding the mixture from a main feed opening of a double-screw extruder, mixing the ceramic powder and the inorganic fiber by the mixer, and then feeding the mixture from a side feed opening of the double-screw extruder;
and S3, carrying out melt mixing extrusion granulation, wherein the rotating speed of the rotary mixer is 60-120 rpm, the mixing time is 5-10 min, the discharge amount of the double-screw extruder is 100-200 Kg/h, the rotating speed is 200-400 rpm, the temperature of each section of the machine barrel is 330 +/-20 ℃, the temperature of the machine head is 340 +/-10 ℃, and the extraction pressure of the vacuum section is-0.08 +/-0.02 MPa.
2. The preparation process of the low-dielectric high-thermal-conductivity LCP/PPS composite material for the communication equipment as claimed in claim 1, wherein the sum of the parts by mass of the polyphenylene sulfide and the liquid crystal polymer is 100 parts.
3. The preparation process of the low-dielectric high-thermal-conductivity LCP/PPS composite material for the communication equipment as claimed in claim 1, wherein the melting temperature of the polyphenylene sulfide is 260-300 ℃ and the melt index is 25-50 g/10min.
4. The preparation process of the LCP/PPS composite material with low dielectric constant and high thermal conductivity for communication equipment as claimed in claim 1, wherein the liquid crystal polymer is aromatic polyester and polyester amide with melting point of 300-360 ℃.
5. The process for preparing the LCP/PPS composite material with low dielectric constant and high thermal conductivity for communication equipment as claimed in claim 1, wherein the ceramic powder is at least one of titanate, nitride and alumina, and is surface-treated in advance, and the particle diameter is 1-30 μm.
6. The process for preparing the LCP/PPS composite material with low dielectric constant and high thermal conductivity for communication equipment as claimed in claim 1, wherein the inorganic fiber comprises at least one of glass fiber, wollastonite fiber and potassium titanate fiber after surface treatment.
7. The preparation process of the LCP/PPS composite material with low dielectric constant and high thermal conductivity for communication equipment as claimed in claim 1, wherein the PTFE characteristic density is 2.1-2.3 g/cm 3 The grain size is 20-35 microns.
8. The process for preparing a low-dielectric high-thermal-conductivity LCP/PPS composite material for communication equipment as claimed in claim 1, wherein the processing aid comprises a lubricant and an antioxidant, the lubricant comprises at least one of silicone powder, pentaerythritol stearate, calcium stearate and zinc stearate, and the antioxidant comprises at least one of hindered phenol, phosphite and thioester.
9. The preparation process of the LCP/PPS composite material with low dielectric constant and high thermal conductivity for communication equipment as claimed in claim 5 or 6, wherein the surface treatment comprises the following steps in sequence: dispersing a surface treatment agent in a dispersing agent to prepare a coupling agent dispersion liquid, spraying the coupling agent dispersion liquid on the ceramic powder or the inorganic fiber at a constant speed, continuously stirring, and drying to obtain the surface-treated ceramic powder or the inorganic fiber.
10. The process for preparing a low-dielectric high-thermal-conductivity LCP/PPS composite material for communication equipment as claimed in claim 9, wherein the surface treatment agent comprises at least one of KH550, KH560 and KH580, the dispersant is absolute methanol, the ratio of the mass parts of the surface treatment agent to the mass parts of the dispersant is 1.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116376198A (en) * | 2023-05-22 | 2023-07-04 | 湖北龙腾电子科技股份有限公司 | High-thermal-conductivity microwave composite dielectric material for circuit board and preparation method thereof |
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| CN102558863A (en) * | 2012-01-04 | 2012-07-11 | 四川华通特种工程塑料研究中心有限公司 | Low-dielectric-property polyphenylene sulphide composite material and preparation method thereof |
| CN107400361A (en) * | 2017-08-25 | 2017-11-28 | 广东壹豪新材料科技股份有限公司 | A kind of LCP/PPS composites and preparation method thereof |
| CN108165010A (en) * | 2016-12-07 | 2018-06-15 | 上海杰事杰新材料(集团)股份有限公司 | Low dielectric polyphenyl thioether composite material of a kind of high heat conduction and preparation method thereof |
| CN112646373A (en) * | 2020-12-12 | 2021-04-13 | 张家港大塚化学有限公司 | Preparation method of high-performance polyphenylene sulfide composite material for intelligent wearable equipment |
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- 2022-05-17 CN CN202210531579.9A patent/CN115612298A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101768358A (en) * | 2008-12-31 | 2010-07-07 | 深圳市科聚新材料有限公司 | PPS (polyphenylene sulfite)/LCP (liquid crystal polymer) composite material and preparation method thereof |
| CN102558863A (en) * | 2012-01-04 | 2012-07-11 | 四川华通特种工程塑料研究中心有限公司 | Low-dielectric-property polyphenylene sulphide composite material and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116376198A (en) * | 2023-05-22 | 2023-07-04 | 湖北龙腾电子科技股份有限公司 | High-thermal-conductivity microwave composite dielectric material for circuit board and preparation method thereof |
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