CN108165010A - Low dielectric polyphenyl thioether composite material of a kind of high heat conduction and preparation method thereof - Google Patents

Low dielectric polyphenyl thioether composite material of a kind of high heat conduction and preparation method thereof Download PDF

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CN108165010A
CN108165010A CN201611120414.3A CN201611120414A CN108165010A CN 108165010 A CN108165010 A CN 108165010A CN 201611120414 A CN201611120414 A CN 201611120414A CN 108165010 A CN108165010 A CN 108165010A
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parts
composite material
polyphenyl thioether
temperature
boron nitride
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杨桂生
赵敏
李兰杰
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Shanghai Genius Advanced Materials Group Co Ltd
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Shanghai Genius Advanced Materials Group Co Ltd
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02Polythioethers; Polythioether-ethers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/08Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers

Abstract

The present invention provides low dielectric polyphenyl thioether composite materials of a kind of high heat conduction and preparation method thereof, and composite material includes:100 parts of polyphenylene sulfides, 10-40 parts of glass fibres, 30-60 parts of boron nitride, 5-15 parts of compatilizers, 0.8-3.0 parts of coupling agents, 1.0-5.0 parts of dispersants, 0.4-1.2 parts of antioxidant;Method includes:The first mixture is obtained after boron nitride and coupling agent are mixed, dispersant is added in the first mixture, the second mixture is obtained after mixing;It is added in after polyphenylene sulfide, compatilizer and antioxidant are mixed from the main spout of screw extruder, second mixture is added in from the side spout of screw extruder, glass fibre is added in mouth from the glass fibre of screw extruder to add in, through screw extruder extruding pelletization, the polyphenyl thioether composite material in pelletized form is obtained;The polyphenyl thioether composite material of the present invention has the advantages that thermal conductivity factor height and dielectric loss are low, suitable for the application in electronic communication field.

Description

Low dielectric polyphenyl thioether composite material of a kind of high heat conduction and preparation method thereof
Technical field
The invention belongs to technical field of polymer materials, are related to a kind of modified polyphenyl thioether composite material and its preparation side Method.
Background technology
Polyphenylene sulfide is due to having the characteristics that high temperature resistant, fire-retardant, mechanical performance is high, mobility is excellent, dimensionally stable, very It is suitble to electronic communication product to heatproof, fire-retardant, precise injection molding requirement, therefore is widely used in electronic communication industry;However, polyphenyl The heat conductivility of thioether in itself is bad, needs to be modified it.Current method of modifying is mostly using metallic fiber, oxidation The heat fillings such as aluminium, silicon carbide carry out modified polyphenyl thioether, although its heat conductivility can be improved, but increase to some extent The dielectric loss of final composite material and influence its wave, so as to be unfavorable for the transmission of communication signal, which has limited its Communication field is further applied.
Invention content
In view of the deficiencies of the prior art, main purpose is to provide a kind of modified polyphenyl thioether composite material to the present invention, same When with relatively low dielectric loss, higher thermal conductivity factor and preferable mechanical property, especially suitable in the field of communications should With.
Second object of the present invention is to provide a kind of preparation method of above-mentioned modified polyphenyl thioether composite material.
In order to achieve the above objectives, solution of the invention is:
A kind of polyphenyl thioether composite material, raw materials for production include the component with following parts by weight:
Wherein, the melt index of above-mentioned polyphenylene sulfide is 500-1200g/10min, can be preferably 600- 1000g/10min。
Above-mentioned glass fibre be dielectric glass fibre, dielectric constant≤5.0, dielectric loss≤0.005.Above-mentioned Boron nitride can be spherical boron nitride, purity > 98%.The grain size of the spherical boron nitride can be 10-150 μm, can also be excellent It is selected as 30-100 μm.
Above-mentioned boron nitride may be boron nitride fiber, purity > 98%.The diameter of the boron nitride fiber can be 4‐9μm。
Above-mentioned compatilizer is hydrogenated styrene-butadiene block copolymer (SEBS), maleic anhydride is grafted hydrogenation of benzene second Alkene-butadiene block copolymer (SEBS-g-MAH), glycidyl methacrylate graft hydrogenated styrene-butadiene block Copolymer (SEBS-g-GMA), maleic anhydride grafted propylene acid-butadiene-styrene (MBS-g-MAH) or ethylene-metering system One or more of acid-acrylic ternary copolymer.
Above-mentioned coupling agent is selected from vinyltriethoxysilane (KH-151), gamma-aminopropyl-triethoxy-silane (KH- 550), γ-glycidyl ether oxygen propyl trimethoxy silicane (KH-560), γ-glycidoxypropyltrietandysilane andysilane (KH-561) or one or more of γ-methacryloxypropyl trimethoxy silane (KH570).
Above-mentioned dispersant is selected from pentaerythritol stearate (PETS), ethylene acrylic acid co polymer, ethylene stearic bicine diester One or more of amine (EBS), PE waxes or silicone powder.
Above-mentioned antioxidant is selected from four [β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester (antioxidant 1010), 1,3,5- tri- (4- tertiary butyl -3- hydroxyls -2,6- dimethyl benzyl) -1,3,5-triazines -2,4,6- (1H, 3H, 5H)-three Ketone (antioxidant 1790), three [2,4- di-tert-butyl-phenyl] phosphite esters (irgasfos 168), bis- (2,4-DTBP) seasons Penta tetrol diphosphites (antioxidant 626) or bis- (2,4- dicumylphenyl) pentaerythritol diphosphites (antioxidant One or more of S9228).
A kind of preparation method of polyphenyl thioether composite material, includes the following steps:
(1), 30-60 parts of boron nitride and 0.8-3.0 parts of coupling agents are mixed, obtains the first mixture;
(2), 1.0-5.0 parts of dispersants are added in the first mixture, the second mixture is obtained after mixing;
(3), from Screw Extrusion after 100 parts of polyphenylene sulfides, 5-15 parts of compatilizers and 0.4-1.2 parts of antioxidant being mixed The main spout of machine adds in, and the second mixture is added in from the side spout of screw extruder, by 10-40 parts of glass fibres from spiral shell The glass fibre of bar extruder adds in mouth and adds in, and through screw extruder extruding pelletization, obtains the modified polyphenyl sulphur in pelletized form Ether composite material.
Wherein, the mixing in step (1) is carried out in high-speed mixer, and the rotating speed of high-speed mixer is 200- 500rpm, the temperature of mixing is 30-60 DEG C, and the time of mixing is 3-6min.
Mixing in step (2) is carried out in high-speed mixer, and the rotating speed of high-speed mixer is 600-1000rpm, is mixed The temperature of conjunction is 70-120 DEG C, and the time of mixing is 5-15min.
Mixing in step (3) is carried out in high-speed mixer, and the rotating speed of high-speed mixer is 100-400rpm, is mixed Temperature for 30-60 DEG C, the time of mixing is 1-3min.
Screw extruder is double screw extruder in step (2), and the temperature in each area is 280-320 DEG C.
By adopting the above scheme, the beneficial effects of the invention are as follows:
Firstth, the present invention using spherical boron nitride or boron nitride fiber come modified polyphenyl thioether because boron nitride has pole High heat conductivility, while the characteristics of dielectric loss is low is had both again, it can not only assign polyphenylene sulfide good thermal conductivity, also not Can increase its dielectric loss, composite material that can be final its can keep excellent low-dielectric.
Secondth, the present invention is also added to glass fibre in material system, in the heat conductivility for not influencing composite material Mechanical property with composite material is improved while low-dielectric energy, disclosure satisfy that the application in electronic communication industry.
Specific embodiment
The present invention provides a kind of modified polyphenyl thioether composite materials and preparation method thereof.
<Modified polyphenyl thioether composite material>
A kind of modified polyphenyl thioether composite material, raw materials for production include the component with following parts by weight:
Wherein, the melt index of above-mentioned polyphenylene sulfide (PPS resin) can be 500-1200g/10min, also may be used Think 600-1000g/10min, can also be 700-900g/10min, can also be 800-850g/10min.Testing standard ASTM D1238,316 DEG C of test condition, 5Kg.The PPS of high fusion index is more preferable to the wellability of filler so that PPS is with filling out Interface cohesion between material is more preferable, and mechanical property is more preferable, and heat-conducting effect is more preferable.And melt index it is too high PPS molecular weight it is too small, power Learning performance can be poor, therefore considers and select melt index as 500-1200g/10min.
Above-mentioned glass fibre be dielectric glass fibre (D glass fibre), dielectric constant≤5.0, dielectric loss≤ 0.005。
The purity of above-mentioned boron nitride>98%.
Above-mentioned boron nitride can be spherical boron nitride, and grain size is 10-150 μm, preferably 30-100 μm.Wherein nitrogenize The grain size of boron refers to the distribution of boron nitride grain size, and the boron nitride accumulation of different-grain diameter is more close, can preferably be formed and led The passage of heat.After common boron nitride is added in resin system, the viscosity of material steeply rises, resin to the effect of impregnation of boron nitride not Good, processing and manufacturing is difficult big to equipment damage, while later stage injection molding is also more difficult, and the present invention is using spherical boron nitride, ball Shape boron nitride is easily flowed due to its spherical structure, can effectively be reduced the viscosity during processing and manufacturing, be conducive to resin base Infiltration of the body to boron nitride, later stage injection molding mobility are also more preferable.
Above-mentioned boron nitride may be boron nitride fiber, a diameter of 4-9 μm.Boron nitride fiber is threadiness, is more easy to In formation passage of heat, while also have both certain enhancing effect.
Above-mentioned compatilizer is hydrogenated styrene-butadiene block copolymer (SEBS), maleic anhydride is grafted hydrogenation of benzene second Alkene-butadiene block copolymer (SEBS-g-MAH), glycidyl methacrylate graft hydrogenated styrene-butadiene block Copolymer (SEBS-g-GMA), maleic anhydride grafted propylene acid-butadiene-styrene (MBS-g-MAH) or ethylene-metering system One or more of acid-acrylic ternary copolymer.
Above-mentioned coupling agent is selected from vinyltriethoxysilane (KH-151), gamma-aminopropyl-triethoxy-silane (KH- 550), γ-glycidyl ether oxygen propyl trimethoxy silicane (KH-560), γ-glycidoxypropyltrietandysilane andysilane (KH-561) or one or more of γ-methacryloxypropyl trimethoxy silane (KH570).
Above-mentioned dispersant is selected from pentaerythritol stearate (PETS), ethylene acrylic acid co polymer (Ethylene Acrylic Acid, EAA), ethylene bis stearamide (EBS), one or more of PE waxes or silicone powder.
Above-mentioned antioxidant is selected from four [β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester (antioxidant 1010), 1,3,5- tri- (4- tertiary butyl -3- hydroxyls -2,6- dimethyl benzyl) -1,3,5-triazines -2,4,6- (1H, 3H, 5H)-three Ketone (antioxidant 1790), three [2,4- di-tert-butyl-phenyl] phosphite esters (irgasfos 168), bis- (2,4-DTBP) seasons Penta tetrol diphosphites (antioxidant 626) or bis- (2,4- dicumylphenyl) pentaerythritol diphosphites (antioxidant One or more of S9228).
<The preparation method of modified polyphenyl thioether composite material>
A kind of preparation method of modified polyphenyl thioether composite material, includes the following steps:
(1), 30-60 parts of boron nitride and 0.8-3.0 parts of coupling agents are mixed, obtains the first mixture;
(2), 1.0-5.0 parts of dispersants are added in the first mixture, the second mixture is obtained after mixing;
(3), from Screw Extrusion after 100 parts of polyphenylene sulfides, 5-15 parts of compatilizers and 0.4-1.2 parts of antioxidant being mixed The main spout of machine adds in, and the second mixture is added in from the side spout of screw extruder, by 10-40 parts of glass fibres from spiral shell The glass fibre of bar extruder adds in mouth and adds in, and through screw extruder extruding pelletization, obtains the modified polyphenyl sulphur in pelletized form Ether composite material.Wherein main spout is located at the firstth area of machine barrel, and glass fiber opening is located at machine barrel third area, and side spout is located at machine barrel 4th area.
Wherein, the mixing in step (1) is carried out in high-speed mixer, and the rotating speed of high-speed mixer is 200- 500rpm, the temperature of mixing is 30-60 DEG C, and the time of mixing is 3-6min.The effect of mixing is to make surface coupling to boron nitride Processing generates one layer of coupling agent layer in nitridation boron surface, improves the interface interaction of material and resin.
Mixing in step (2) is carried out in high-speed mixer, and the rotating speed of high-speed mixer is 600-1000rpm, is mixed The temperature of conjunction is 70-120 DEG C, and the time of mixing is 5-15min.Higher temperature, higher rotating speed are conducive to the molten of dispersant Melt, forming clad in nitridation boron surface plays better dispersion effect, therefore the rotating speed of this step high mixer, temperature and mixed The conjunction time is higher than step (1).
Mixing in step (3) is carried out in high-speed mixer, and the rotating speed of high-speed mixer is 100-400rpm, is mixed Temperature for 30-60 DEG C, the time of mixing is 1-3min.This step is in order to which material is uniformly mixed, while prevents material temperature mistake Height causes material to be sticked together to be unfavorable for the stability of blanking, therefore uses relatively low rotating speed, temperature and mixing time.
Screw extruder is double screw extruder in step (2), and the temperature in each area is all fallen in the range of 280-320 DEG C. Each area's temperature gradually rises, and promotes resin melting, reduces system viscosity, promotes infiltration of the resin to boron nitride, is formed good Interface, while temperature is suitably reduced at die head, pressure is formed, makes material more closely knit.Wherein, first area's temperature is 280- 290 DEG C, second area's temperature be 285-295 DEG C, third area temperature be 290-300 DEG C, the 4th area's temperature be 300-310 DEG C, the 5th Area's temperature is 310-320 DEG C, and the 6th area's temperature is 300-310 DEG C.
Below in conjunction with illustrated embodiment, the present invention is further illustrated.
Embodiment 1:
A kind of modified polyphenyl thioether composite material is present embodiments provided, raw materials for production include following components:
Wherein, the melt index of above-mentioned polyphenylene sulfide is 500g/10min.
<The preparation method of modified polyphenyl thioether composite material>
The present embodiment additionally provides a kind of preparation method of modified polyphenyl thioether composite material, includes the following steps:
(1), 60 parts of boron nitride (spherical boron nitride) and 3.0 parts of coupling agents (KH-570) are added in high-speed mixer, with The rotating speed of 500rpm mixes 6min at a temperature of 60 DEG C, obtains the first mixture;
(2), 5.0 parts of dispersants (PETS) are added in the first mixture in step (1), continued with 1000rpm's Rotating speed mixes 15min at a temperature of 120 DEG C, obtains the second mixture;
(3), by 100 parts of polyphenylene sulfides, 15 parts of compatilizers (SEBS-g-MAH) and 1.2 parts of antioxidant (1010/168 =1/2) 3min is mixed at a temperature of 60 DEG C with the rotating speed of 400rpm, is then added in from the main spout of screw extruder, it will Second mixture is added in from the side spout of screw extruder, and 10 parts of glass fibres are added in from the glass fibre of screw extruder Mouth adds in, and through screw extruder extruding pelletization, obtains the modified polyphenyl thioether composite material in pelletized form.
Wherein, in step (3), each area's temperature for controlling screw extruder is:The temperature of main spout and side spout For 280 DEG C, first area's temperature be 290 DEG C, second area's temperature is 290 DEG C, third area temperature is 300 DEG C, the 4th area's temperature is 310 DEG C, the die head temperature of screw extruder be 300 DEG C, engine speed 50Hz.
Embodiment 2:
A kind of modified polyphenyl thioether composite material is present embodiments provided, raw materials for production include following components:
Wherein, the melt index of above-mentioned polyphenylene sulfide is 900g/10min.
<The preparation method of modified polyphenyl thioether composite material>
The present embodiment additionally provides a kind of preparation method of modified polyphenyl thioether composite material, includes the following steps:
(1), 30 parts of boron nitride (boron nitride fiber) and 0.8 part of coupling agent (KH-550) are added in high-speed mixer, with The rotating speed of 200rpm mixes 3min at a temperature of 30 DEG C, obtains the first mixture;
(2), 1.0 parts of dispersants (EBS) are added in the first mixture in step (1), continue to turn with 600rpm Speed mixes 5min at a temperature of 70 DEG C, obtains the second mixture;
(3), by 100 parts of polyphenylene sulfides, 5 parts of compatilizers (SEBS) and 0.4 part of antioxidant (1790/168=1/2) with The rotating speed of 100rpm mixes 1min at a temperature of 30 DEG C, is then added in from the main spout of screw extruder, by the second mixing Object is added in from the side spout of screw extruder, and 40 parts of glass fibres are added in mouth from the glass fibre of screw extruder adds in, Through screw extruder extruding pelletization, the modified polyphenyl thioether composite material in pelletized form is obtained.
Wherein, in step (3), each area's temperature for controlling screw extruder is:The temperature of main spout and side spout For 285 DEG C, first area's temperature be 290 DEG C, second area's temperature is 295 DEG C, third area temperature is 305 DEG C, the 4th area's temperature is 315 DEG C, the die head temperature of screw extruder be 310 DEG C, engine speed 50Hz.
Embodiment 3:
A kind of modified polyphenyl thioether composite material is present embodiments provided, raw materials for production include following components:
Wherein, the melt index of above-mentioned polyphenylene sulfide is 1200g/10min.
<The preparation method of modified polyphenyl thioether composite material>
The present embodiment additionally provides a kind of preparation method of modified polyphenyl thioether composite material, includes the following steps:
(1), 45 parts of boron nitride (boron nitride fiber) and 2 parts of coupling agents (KH-560) are added in high-speed mixer, with The rotating speed of 200rpm mixes 3min at a temperature of 30 DEG C, obtains the first mixture;
(2), 3.0 parts of dispersants (silicone powder) are added in the first mixture in step (1), continued with 600rpm's Rotating speed mixes 5min at a temperature of 70 DEG C, obtains the second mixture;
(3), by 100 parts of polyphenylene sulfides, 10 parts of compatilizers (SEBS-g-GMA) and 0.8 part of antioxidant (1010/ S9228=1/2 1min) is mixed at a temperature of 30 DEG C with the rotating speed of 100rpm to add in from the main spout of screw extruder, it will Second mixture is added in from the side spout of screw extruder, and 25 parts of glass fibres are added in from the glass fibre of screw extruder Mouth adds in, and through screw extruder extruding pelletization, obtains the modified polyphenyl thioether composite material in pelletized form.
Wherein, in step (3), each area's temperature for controlling screw extruder is:The temperature of main spout and side spout For 290 DEG C, first area's temperature be 295 DEG C, second area's temperature is 295 DEG C, third area temperature is 300 DEG C, the 4th area's temperature is 310 DEG C, the die head temperature of screw extruder be 305 DEG C, engine speed 50Hz.
Embodiment 4:
A kind of modified polyphenyl thioether composite material is present embodiments provided, raw materials for production include following components:
Wherein, the melt index of above-mentioned polyphenylene sulfide is 1000g/10min.
<The preparation method of modified polyphenyl thioether composite material>
The present embodiment additionally provides a kind of preparation method of modified polyphenyl thioether composite material, includes the following steps:
(1), 55 parts of boron nitride (spherical boron nitride) and 2.5 parts of coupling agents (KH-561) are added in high-speed mixer, with The rotating speed of 200rpm mixes 3min at a temperature of 30 DEG C, obtains the first mixture;
(2), 4.0 parts of dispersants (PE waxes) are added in the first mixture in step (1), continue to turn with 600rpm Speed mixes 5min at a temperature of 70 DEG C, obtains the second mixture;
(3), by 100 parts of polyphenylene sulfides, 12 parts of compatilizers (MBS-g-MAH) and 1.0 parts of antioxidant (1790/S9228 =1/2) 1min is mixed at a temperature of 30 DEG C with the rotating speed of 100rpm, is then added in from the main spout of screw extruder, it will Second mixture is added in from the side spout of screw extruder, and 18 parts of glass fibres are added in from the glass fibre of screw extruder Mouth adds in, and through screw extruder extruding pelletization, obtains the modified polyphenyl thioether composite material in pelletized form.
Wherein, in step (3), each area's temperature for controlling screw extruder is:The temperature of main spout and side spout For 280 DEG C, first area's temperature be 290 DEG C, second area's temperature is 295 DEG C, third area temperature is 305 DEG C, the 4th area's temperature is 315 DEG C, the die head temperature of screw extruder be 310 DEG C, engine speed 50Hz.
Embodiment 5:
A kind of modified polyphenyl thioether composite material is present embodiments provided, raw materials for production include following components:
Wherein, the melt index of above-mentioned polyphenylene sulfide is 700g/10min.
<The preparation method of modified polyphenyl thioether composite material>
The present embodiment additionally provides a kind of preparation method of modified polyphenyl thioether composite material, includes the following steps:
(1), 38 parts of boron nitride (boron nitride fiber) and 1.3 parts of coupling agents (KH-151) are added in high-speed mixer, with The rotating speed of 200rpm mixes 3min at a temperature of 30 DEG C, obtains the first mixture;
(2), 2.0 parts of dispersants (ethylene acrylic acid co polymer) are added in the first mixture in step (1), continued 5min is mixed at a temperature of 70 DEG C with the rotating speed of 600rpm, obtains the second mixture;
(3), by 100 parts of polyphenylene sulfides, 7 parts of compatilizers (ethylene-methyl methacrylate-acrylic ternary copolymer) and 0.6 part of antioxidant (1010/626=1/2) mixes 1min with the rotating speed of 100rpm at a temperature of 30 DEG C, then from Screw Extrusion The main spout of machine adds in, and the second mixture is added in from the side spout of screw extruder, by 32 parts of glass fibres from screw rod The glass fibre of extruder adds in mouth and adds in, and through screw extruder extruding pelletization, obtains the modified polyphenyl thioether in pelletized form Composite material.
Wherein, in step (3), each area's temperature for controlling screw extruder is:The temperature of main spout and side spout For 280 DEG C, first area's temperature be 290 DEG C, second area's temperature is 300 DEG C, third area temperature is 310 DEG C, the 4th area's temperature is 320 DEG C, the die head temperature of screw extruder be 310 DEG C, engine speed 50Hz.
The component additive amount of above-mentioned each embodiment is as shown in table 1:
The component addition scale of 1 each embodiment of table
The hybrid parameter of above-mentioned each embodiment is as shown in table 2.
The hybrid parameter table of 2 each embodiment of table
Each area's temperature parameter of above-mentioned each embodiment is as shown in table 3.
Each area's temperature parameter table of 3 each embodiment of table
Type First area's temperature Second area's temperature Third area temperature 4th area's temperature 5th area's temperature 6th area's temperature
Embodiment 1 280℃ 290℃ 290℃ 300℃ 310℃ 300℃
Embodiment 2 285℃ 290℃ 295℃ 305℃ 315℃ 310℃
Embodiment 3 290℃ 295℃ 295℃ 300℃ 310℃ 305℃
Embodiment 4 280℃ 290℃ 295℃ 305℃ 315℃ 310℃
Embodiment 5 280℃ 290℃ 300℃ 310℃ 320℃ 310℃
It is molded into after the product of embodiment 1 to embodiment 5 is dried 5 hours in convection oven in 130 DEG C with injection molding machine Type, injection temperature are 305 DEG C.The batten of injection formed in 50% relative humidity, 23 DEG C place 24 hours after be tested for the property, survey Test result is shown in Table 4.
The performance test results table of 4 each embodiment products obtained therefrom of table
Wherein, the performance test methods of above-mentioned each embodiment resulting product are as shown in table 5:
5 performance test methods table of table
Number Test method
Tensile strength (Mpa) ASTM D638, tensile speed 5mm/min.
Bending modulus (Mpa) ASTM D790, rate of bending 2mm/min
Notch impact strength (KJ/m2) ASTM D256
Unnotched impact strength (KJ/m2) ASTM D256
Thermal conductivity factor (W/ (m.K)) ASTM E1461
Dielectric loss factor ASTM D150(1.1GHz)
As seen from the above table, the low dielectric polyphenyl thioether material of high heat conduction that prepared by the present invention has thermal conductivity factor height, dielectric damage The characteristics of low is consumed, while also good shock resistance, anti-flammability, heat-resisting quantity, telecommunications can be widely used in Industry.
The above-mentioned description to embodiment is that this hair is understood that and used for the ease of those skilled in the art It is bright.Those skilled in the art obviously can readily make these embodiments various modifications, and described herein one As principle be applied in other embodiment, without having to go through creative labor.Therefore, the present invention is not limited to above-described embodiments. Those skilled in the art's principle according to the present invention, does not depart from improvement that scope of the invention made and modification all should be at this Within the protection domain of invention.

Claims (10)

1. a kind of polyphenyl thioether composite material, it is characterised in that:Its raw materials for production includes the component with following parts by weight:
2. polyphenyl thioether composite material according to claim 1, it is characterised in that:The melting of the polyphenylene sulfide Index is 500-1200g/10min, preferably 600-1000g/10min.
3. polyphenyl thioether composite material according to claim 1, it is characterised in that:The glass fibre is low dielectric glass Glass fiber;
Preferably, dielectric constant≤5.0 of the glass fibre, dielectric loss≤0.005.
4. polyphenyl thioether composite material according to claim 1, it is characterised in that:The boron nitride is nitrogenized to be spherical Boron, purity > 98%;
Preferably, the grain size of the spherical boron nitride is 10-150 μm;
It is highly preferred that the grain size of the spherical boron nitride is 30-100 μm.
5. polyphenyl thioether composite material according to claim 1, it is characterised in that:The boron nitride is fine for boron nitride Dimension, purity > 98%;
Preferably, a diameter of 4-9 μm of the boron nitride fiber.
6. polyphenyl thioether composite material according to claim 1, it is characterised in that:The compatilizer is hydrogenation of benzene second Alkene-butadiene block copolymer (SEBS), maleic anhydride grafting hydrogenated styrene-butadiene block copolymer (SEBS-g- MAH), glycidyl methacrylate graft hydrogenated styrene-butadiene block copolymer (SEBS-g-GMA), maleic anhydride One kind in grafted propylene acid-butadiene-styrene (MBS-g-MAH) or ethylene-methyl methacrylate-acrylic ternary copolymer More than.
7. polyphenyl thioether composite material according to claim 1, it is characterised in that:The coupling agent is selected from vinyl three Ethoxysilane (KH-151), gamma-aminopropyl-triethoxy-silane (KH-550), γ-glycidyl ether oxygen propyl trimethoxy Silane (KH-560), γ-glycidoxypropyltrietandysilane andysilane (KH-561) or γ-methacryloxypropyl three One or more of methoxy silane (KH570);And/or
The dispersant is selected from pentaerythritol stearate (PETS), ethylene acrylic acid co polymer, ethylene bis stearamide (EBS), one or more of PE waxes or silicone powder;And/or
The antioxidant is selected from four [β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester (antioxidant 1010), 1,3,5- tri- (4- tertiary butyl -3- hydroxyls -2,6- dimethyl benzyl) -1,3,5-triazines -2,4,6- (1H, 3H, 5H)-three Ketone (antioxidant 1790), three [2,4- di-tert-butyl-phenyl] phosphite esters (irgasfos 168), bis- (2,4-DTBP) seasons Penta tetrol diphosphites (antioxidant 626) or bis- (2,4- dicumylphenyl) pentaerythritol diphosphites (antioxidant One or more of S9228).
8. the preparation method of any polyphenyl thioether composite material of claim 1 to 7, it is characterised in that:It includes following Step:
(1), 30-60 parts of boron nitride and 0.8-3.0 parts of coupling agents are mixed, obtains the first mixture;
(2), 1.0-5.0 parts of dispersants are added in the first mixture, the second mixture is obtained after mixing;
(3), from screw extruder after 100 parts of polyphenylene sulfides, 5-15 parts of compatilizers and 0.4-1.2 parts of antioxidant being mixed Main spout adds in, and the second mixture from the side spout of screw extruder is added in, 10-40 parts of glass fibres are squeezed from screw rod The glass fibre for going out machine adds in mouth addition, through screw extruder extruding pelletization, obtains answering in the modified polyphenyl thioether of pelletized form Condensation material.
9. the preparation method of polyphenyl thioether composite material according to claim 8, it is characterised in that:It is mixed in step (1) Conjunction is carried out in high-speed mixer, and the rotating speed of high-speed mixer is 200-500rpm, and the temperature of mixing is 30-60 DEG C, mixing Time be 3-6min;And/or
Mixing in step (2) is carried out in high-speed mixer, and the rotating speed of high-speed mixer is 600-1000rpm, mixing Temperature is 70-120 DEG C, and the time of mixing is 5-15min;And/or
Mixing in step (3) is carried out in high-speed mixer, and the rotating speed of high-speed mixer is 100-400rpm, the temperature of mixing It is 30-60 DEG C to spend, and the time of mixing is 1-3min.
10. the preparation method of polyphenyl thioether composite material according to claim 8, it is characterised in that:Screw rod in step (2) Extruder is double screw extruder, and the temperature in each area is 280-320 DEG C.
CN201611120414.3A 2016-12-07 2016-12-07 Low dielectric polyphenyl thioether composite material of a kind of high heat conduction and preparation method thereof Pending CN108165010A (en)

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CN109135634A (en) * 2018-07-27 2019-01-04 四川大学 A method of preparing high thermal conductivity low-dielectric loss compound sticking film
CN109233279A (en) * 2018-08-31 2019-01-18 长春云创空间科技有限公司 Thermal-conducting electric-insulating polyphenyl thioether composite material and preparation method
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CN111718581B (en) * 2020-05-20 2022-07-05 中广核俊尔(浙江)新材料有限公司 Low-dielectric-constant low-dielectric-loss reinforced polyphenylene sulfide composite material special for 5G antenna oscillator and preparation method and application thereof
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