CN115608568A - Dispensing equipment for manufacturing LED semiconductor - Google Patents

Dispensing equipment for manufacturing LED semiconductor Download PDF

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Publication number
CN115608568A
CN115608568A CN202211416788.5A CN202211416788A CN115608568A CN 115608568 A CN115608568 A CN 115608568A CN 202211416788 A CN202211416788 A CN 202211416788A CN 115608568 A CN115608568 A CN 115608568A
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CN
China
Prior art keywords
glue
fixedly connected
head
seat
air outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202211416788.5A
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Chinese (zh)
Inventor
韩博宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nantong Getai Semiconductor Technology Co ltd
Original Assignee
Nantong Getai Semiconductor Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nantong Getai Semiconductor Technology Co ltd filed Critical Nantong Getai Semiconductor Technology Co ltd
Priority to CN202211416788.5A priority Critical patent/CN115608568A/en
Publication of CN115608568A publication Critical patent/CN115608568A/en
Withdrawn legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1042Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02Means for manipulating or holding work, e.g. for separate articles for particular articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/001Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material

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  • Coating Apparatus (AREA)

Abstract

The invention discloses dispensing equipment for manufacturing an LED semiconductor, which comprises a dispenser body, wherein the top of the inner wall of the dispenser body is fixedly connected with a glue storage cylinder, the bottom of the glue storage cylinder is communicated with a glue outlet mechanism, the bottom of the glue outlet mechanism is communicated with a glue head fixing seat, the bottom of the glue head fixing seat is communicated with a glue outlet head, and the bottom of the glue head fixing seat is fixedly connected with a processing device; glue first fixing base and include: the positioning seat is provided with an annular structure and a positioning groove arranged at the bottom of the positioning seat, and a buffer cavity is fixedly connected inside the positioning seat above the positioning groove; the invention relates to the technical field of dispenser, in particular to a heating cavity with an annular structure. This LED is dispensing equipment for semiconductor manufacturing, when needs are changed out and are glued the head, directly will go out to glue the head and follow the inside extraction of communicating pipe, then insert new play glue the head can, change easy operation, conveniently improve work efficiency.

Description

Dispensing equipment for manufacturing LED semiconductor
Technical Field
The invention relates to the technical field of dispensing machines, in particular to dispensing equipment for manufacturing an LED semiconductor.
Background
The dispensing machine is also called a glue spreader, a glue dispenser, a glue filling machine and the like, is specially used for controlling fluid and dripping and coating the fluid on the surface of a product or in the product, can realize three-dimensional and four-dimensional path dispensing, accurate positioning, accurate glue control, no wire drawing, no glue leakage and no glue dripping, is mainly used for accurately dispensing, injecting, coating and dripping glue, paint and other liquids in the product process to each accurate position of the product, can be used for realizing dispensing, line drawing, circular or arc, has the function of replacing manual operation, realizes mechanized production, can be operated by a single machine, is simple and convenient, has high-speed and accurate storage mode, is convenient for data management and file transmission between machines, and can carry a pumping system by two components to form a double-liquid full-automatic dispensing machine; can be additionally provided with a dispensing controller, a dispensing valve and other accessories to form floor type dispensing equipment and the like.
But the point gum machine that uses at present breaks down at equipment, when shutting down the maintenance temporarily, goes out the inside glue of gluey syringe needle and cools off easily, makes out gluey syringe needle and takes place to block up, need change out gluey syringe needle when reusing, goes out gluey syringe needle and more trades the operation inconvenience, influences production efficiency, the condition of the wire drawing appears after the completion of gluing simultaneously easily.
Disclosure of Invention
In order to achieve the purpose, the invention is realized by the following technical scheme: a glue dispensing device for manufacturing an LED semiconductor comprises a glue dispenser body, wherein a glue storage cylinder is fixedly connected to the top of the inner wall of the glue dispenser body, the bottom of the glue storage cylinder is communicated with a glue discharging mechanism, the bottom of the glue discharging mechanism is communicated with a glue head fixing seat, the bottom of the glue head fixing seat is communicated with a glue discharging head, and the bottom of the glue head fixing seat is fixedly connected with a processing device;
glue first fixing base and include:
the positioning seat is provided with an annular structure and a positioning groove arranged at the bottom of the positioning seat, and a buffer cavity is fixedly connected inside the positioning seat above the positioning groove;
the heating cavity is of an annular structure, and an electric heating sheet is arranged in the heating cavity;
communicating pipe, this communicating pipe have funnel-shaped structure to and set up the sealing washer of communicating pipe inner wall bottom, communicating pipe top and the inside intercommunication of heating cavity, inside the bottom of communicating pipe extended to the constant head tank, when needs are changed out and are glued the head, directly will go out to glue the head and follow communicating pipe inside and extract, then insert new play glue the head can, change easy operation, conveniently improve work efficiency.
Preferably, the positioning seat top communicates with play gluey mechanism, go out the glued joint top extend to inside the communicating tube and with communicating tube inner wall sliding connection, go out the glued joint top outside and offer the seal groove with sealing washer looks adaptation.
Preferably, the heating cavity bottom has been seted up the air outlet, air outlet bottom intercommunication has the tuber pipe, the one end inner wall fixedly connected with exhaust fan that the air outlet was kept away from to the tuber pipe, the part intercommunication that heating cavity bottom is located air outlet one side has the air-supply line, can avoid out the inside glue temperature drop of gluing head to lead to out the condition of gluing head jam, avoids leading to out the condition that glues head jam influence machining efficiency because of shutting down the maintenance.
Preferably, the end of the air outlet pipe, which is far away from the air outlet, is opposite to the glue outlet head, and the air outlet and the air inlet pipe are provided with a plurality of groups and are uniformly distributed at the bottom of the heating cavity.
Preferably, processing apparatus is including handling the support, handle support inner wall top fixedly connected with driving motor, driving motor's drive shaft fixedly connected with rotates the seat, it rotates and is connected with the helical gear to rotate seat one side, the meshing of helical gear bottom has the bevel gear, bevel gear one side and processing support inner wall fixed connection, bevel gear side central point puts fixedly connected with clearance ware, can twine the wire drawing of going out between gluey head and the work piece, again because the clearance ware can the rotation for the speed of clearance ware winding wire drawing is faster, avoids the wire drawing to cause the pollution on work piece and the table surface.
Preferably, the top of the processing support is fixedly connected with the bottom of the positioning seat, and the cleaner extends to the position right below the glue outlet head.
Preferably, the clearance ware includes the axostylus axostyle, an axostylus axostyle pot head is established and fixedly connected with axle sleeve, axle sleeve side fixedly connected with winding pole, the winding pole, an axle sleeve pot head is established and sliding connection has the clearance ring, clearance intra-annular wall set up with the groove of scraping of winding pole looks adaptation, when the clearance ware twines the wire, accessible winding pole increase winding diameter, through the glue that comes on the clearance storage more twines between the winding pole when conveniently improving winding speed, when winding pole and axle sleeve go up winding glue more, slip clearance ring, the winding pole can strike off the glue on the winding pole and between each winding pole through scraping of scraping the groove, conveniently clears up the glue on the winding pole.
Preferably, one end of the shaft rod, which is far away from the shaft sleeve, is fixedly connected with the bevel gear, and the winding rod is an elastic soft rod.
Preferably, the inside part fixedly connected with stop device that is located under the head is glued out of point gum machine body, stop device includes limiting base, connecting rod fixedly connected with annular slide is passed through to limiting base side, inside through removing slider fixedly connected with sliding seat of annular slide, sliding seat top fixedly connected with gag lever post, the gag lever post is gone up the cover and is established and sliding connection has the stop collar, the equal fixedly connected with arc spring in stop collar both sides, the one end and the sliding seat top fixed connection of stop collar are kept away from to the arc spring, connecting rod fixedly connected with pressure head is passed through to stop collar one side, gag lever post top threaded connection has the extrusion cover, can move the pressure head to the position that corresponds can push down according to the different shapes of work piece and push down spacingly, avoids the inconvenient circumstances that carries out spacingly to the work piece after the work piece shape changes or changes another kind of work piece, and the suitability is better.
Preferably, limiting base bottom and point gum machine body fixed connection, the sliding seat is provided with the multiunit and evenly distributed on annular slide.
The invention provides dispensing equipment for manufacturing an LED semiconductor. The method has the following beneficial effects:
1. this a LED is dispensing equipment for semiconductor manufacturing, be provided with gluey first fixing base, glue when storing up the packing element inside gets into after the inside buffering cavity of positioning seat through going out gluey mechanism, heating buffering through buffering cavity, make glue get into out gluey first inside more easily, avoid glue to reduce at the in-process temperature of carrying and lead to the mobility to deteriorate and influence the normal volume of gluing, the cooling rate of the inside glue of head is glued in convenient effective slowing down out, it realizes fixedly to go out the cooperation through sealing washer and seal groove between gluey head and the communicating pipe simultaneously, when needs change out gluey head, directly will go out gluey head and follow communicating pipe inside extraction, then insert new gluey head of going out can, change easy operation, conveniently improve work efficiency.
2. This LED is dispensing equipment for semiconductor manufacturing, when dispensing equipment breaks down and need maintain the maintenance, the inside exhaust fan of air-out pipe can discharge the inside hot-air of heating cavity to going out glue on the head, heats the inside glue of play glue head, avoids going out the inside glue temperature decline of glue head and leads to going out the condition that the glue head blockked up, avoids leading to out the condition that the glue head blockked up influence machining efficiency because of shutting down the maintenance.
3. This a LED is glue dispensing equipment for semiconductor manufacturing, be provided with processing apparatus, after a point was glued and is accomplished, drive helical gear through driving motor and rotate, because helical gear and the meshing of the helical gear circle of below, make the helical gear carry out the rotation when revoluting the revolution of rotation seat, drive the clearance ware and rotate, when the clearance ware rotated the position of going out between gluey head and the below work piece, can get up the wire drawing winding of going out between gluey head and the work piece, again because the clearance ware can the rotation, make the speed of clearance ware winding wire drawing faster, avoid the wire drawing to cause the pollution on work piece and the table surface.
4. This LED is glue dispensing equipment for semiconductor manufacturing, when the clearance ware twines the acting as go-between, accessible winding pole increase winding diameter, glue that comes on more twines is saved through the clearance between the winding pole in the time of conveniently improving the winding speed, when winding pole and axle sleeve go up winding glue when more, slip clearance ring, the winding pole can strike off the glue on the winding pole and between each winding pole through scraping of scraping the groove, the glue of convenient on to the winding pole is cleared up.
5. This a LED is adhesive deposite equipment for semiconductor manufacturing, be provided with stop device, when needs fix the work piece, can place the mounting on the spacing base, it removes to drive the stop collar through removing the sliding seat, thereby it removes to drive the pressure head, when the pressure head removes to the position that can push down, rotate the extrusion cover, the extrusion cover extrudees the stop collar in the downstream, stop collar extrusion arc spring and drive the pressure head and press on the work piece, can be according to the different shapes of work piece, it is spacing to push down to the position that corresponds can push down with the pressure head removal, avoid the work piece shape to change or change inconvenient the work piece after another kind of work piece carry out spacing condition, the suitability is better.
Drawings
FIG. 1 is a schematic view of a dispensing apparatus for manufacturing an LED semiconductor according to the present invention;
FIG. 2 is a schematic view of a rubber head fixing base according to the present invention;
FIG. 3 is a schematic view of the internal structure of the rubber head fixing base according to the present invention;
FIG. 4 is a schematic cross-sectional view of the rubber head fixing base of the present invention;
FIG. 5 is a schematic view of the bottom structure of the rubber head fixing base according to the present invention;
FIG. 6 is a schematic view of a processing apparatus according to the present invention;
FIG. 7 is a schematic view of the structure of the cleaner of the present invention;
fig. 8 is a schematic structural view of the limiting device of the present invention.
In the figure: 1. a dispenser body; 2. a glue storage cylinder; 3. a glue discharging mechanism; 4. a rubber head fixing seat; 41. positioning seats; 42. positioning a groove; 43. a buffer cavity; 44. heating the cavity; 441. an air outlet; 442. an air outlet pipe; 443. an exhaust fan; 444. an air inlet pipe; 45. an electrical heating sheet; 46. a communicating pipe; 47. a seal ring; 5. discharging the rubber head; 6. a processing device; 61. treating the stent; 62. a drive motor; 63. a rotating seat; 64. a helical gear; 65. a bevel gear ring; 66. a cleaner; 661. a shaft lever; 662. a shaft sleeve; 663. a winding rod; 664. cleaning a ring; 665. scraping the groove; 7. a limiting device; 71. a limiting base; 72. an annular chute; 73. a sliding seat; 74. a limiting rod; 75. a limiting sleeve; 76. an arc-shaped spring; 77. a pressure head; 78. and (5) extruding the sleeve.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1-4, the present invention provides a technical solution: a glue dispensing device for manufacturing an LED semiconductor comprises a glue dispenser body 1, wherein the top of the inner wall of the glue dispenser body 1 is fixedly connected with a glue storage cylinder 2, the bottom of the glue storage cylinder 2 is communicated with a glue outlet mechanism 3, the bottom of the glue outlet mechanism 3 is communicated with a glue head fixing seat 4, the bottom of the glue head fixing seat 4 is communicated with a glue outlet head 5, and the bottom of the glue head fixing seat 4 is fixedly connected with a processing device 6;
glue first fixing base 4 and include:
the positioning seat 41 is provided with an annular structure and a positioning groove 42 arranged at the bottom of the positioning seat 41, and a buffer cavity 43 is fixedly connected inside the positioning seat 41 and above the positioning groove 42;
a heating cavity 44, wherein the heating cavity 44 has an annular structure, and an electric heating sheet 45 is arranged inside the heating cavity 44, a heat conducting sheet is fixedly connected inside the heating cavity 44, and one end of the heat conducting sheet inside the heating cavity 44 penetrates through and extends into the buffer cavity 43;
and the communicating pipe 46, the communicating pipe 46 having a funnel-shaped structure, and the sealing ring 47 disposed at the bottom of the inner wall of the communicating pipe 46, wherein the top of the communicating pipe 46 is communicated with the inside of the heating cavity 44, and the bottom of the communicating pipe 46 extends to the inside of the positioning groove 42.
The top of the positioning seat 41 is communicated with the glue outlet mechanism 3, the top of the glue outlet head 5 extends to the inside of the communicating pipe 46 and is in sliding connection with the inner wall of the communicating pipe 46, and a sealing groove matched with the sealing ring 47 is formed in the outer side of the top of the glue outlet head 5.
Be provided with gluey head fixing base 4, after glue inside storing up packing element 2 gets into the inside buffering cavity 43 of positioning seat 41 through going out gluey mechanism 3, heating buffering through buffering cavity 43, make glue get into out gluey head 5 inside more easily, avoid glue to lead to the mobility variation to influence the normal volume of gluing in the in-process temperature reduction of carrying, the cooling rate of the inside glue of convenient 5 inside of gluing head of effectively slowing down, it realizes fixedly to go out the cooperation through sealing washer 47 and seal groove between gluey head 5 and the communicating pipe 46 simultaneously, when needs change out gluey head 5, directly will go out gluey head 5 from the communicating pipe 46 is inside to be extracted, then insert new gluey head 5 can, change easy operation, conveniently improve work efficiency.
Example two:
referring to fig. 1-5, the present invention provides a technical solution based on the first embodiment: the air outlet 441 has been seted up to heating cavity 44 bottom, air outlet 441 bottom intercommunication has out tuber pipe 442, the one end inner wall fixedly connected with exhaust fan 443 that the air outlet 441 was kept away from to the play tuber pipe 442, the part that heating cavity 44 bottom was located air outlet 441 one side communicates there is the air-supply line 444, the one end that the air outlet 441 was kept away from to the play tuber pipe 442 is just to going out gluey head 5, air outlet 441 and air-supply line 444 all are provided with the multiunit and evenly distributed in heating cavity 44 bottom, be provided with air outlet 441 and air-supply line 444, when some adhesive deposite equipment broke down and need the maintenance and repair, the inside exhaust fan 443 of play tuber pipe 442 can discharge the inside hot-air of heating cavity 44 to going out gluey head 5 on, heat the inside glue of going out gluey head 5, avoid going out the inside glue temperature decline of gluey head 5 and lead to going out the condition that gluey head 5 blockked up because of machine maintenance, avoid leading to going out gluey head jam and influence the condition of machining efficiency because of shut down.
Example three:
referring to fig. 1-7, the present invention provides a technical solution based on the first embodiment and the second embodiment: the processing device 6 comprises a processing bracket 61, a driving motor 62 is fixedly connected to the top of the inner wall of the processing bracket 61, a driving shaft of the driving motor 62 is fixedly connected with a rotating seat 63, one side of the rotating seat 63 is rotatably connected with a helical gear 64, the bottom of the helical gear 64 is meshed with a helical gear ring 65, one side of the helical gear ring 65 is fixedly connected with the inner wall of the processing bracket 61, the central position of the side surface of the helical gear 65 is fixedly connected with a cleaner 66, the top of the processing bracket 61 is fixedly connected with the bottom of the positioning seat 41, the cleaner 66 extends to the position right below the glue discharging head 5, the processing device 6 is arranged, after one-time glue dispensing is completed, the helical gear 64 is driven to rotate by the driving motor 62, as the helical gear 64 is meshed with the helical gear ring 65 below, the helical gear 64 rotates while revolving around the rotating seat 63, the cleaner 66 is driven to rotate, when the cleaner 66 rotates to the position between the glue discharging head 5 and the workpiece below, the wire drawing between the glue discharging head 5 and the workpiece can be wound, and the wire drawing can be wound due to the cleaner 66 can rotate, the wire drawing speed of the cleaner 66 is higher, and the pollution to the workpiece and the working table top is avoided;
cleaner 66 includes axostylus axostyle 661, axostylus axostyle 661 pot head is established and fixedly connected with axle sleeve 662, axle sleeve 662 side fixedly connected with winding pole 663, axle sleeve 662 pot head is established and sliding connection has clearance ring 664, clearance ring 664 inside wall sets up scrapes groove 665 with winding pole 663 looks adaptation, the one end and the helical gear 64 fixed connection of axle sleeve 662 are kept away from to axostylus axostyle 661, winding pole 663 sets up to the flexible soft pole, when cleaner 66 twines the wire, accessible winding pole 663 increases winding diameter, conveniently improve winding speed when storing more glue that comes in through the clearance between winding pole 663, when winding pole 663 and the epaxial winding glue of axle sleeve 662 more, slip clearance ring 664, winding pole 663 is through scraping the groove 665, can be with the glue on winding pole 663 and between each winding pole 663, conveniently scrape the glue on winding pole 663 and scrape off.
Example four:
referring to fig. 1 to 8, the present invention provides a technical solution based on the first embodiment, the second embodiment and the third embodiment: the part of the inside of the dispenser body 1 which is located under the dispensing head 5 is fixedly connected with a limiting device 7, the limiting device 7 comprises a limiting base 71, the side surface of the limiting base 71 is fixedly connected with an annular slide way 72 through a connecting rod, the inside of the annular slide way 72 is fixedly connected with a slide seat 73 through a movable sliding block, the top of the slide seat 73 is fixedly connected with a limiting rod 74, the limiting rod 74 is sleeved with a limiting sleeve 75 and is slidably connected with an arc spring 76, two sides of the limiting sleeve 75 are fixedly connected with an arc spring 76, one end of the arc spring 76 far away from the limiting sleeve 75 is fixedly connected with the top of the slide seat 73, one side of the limiting sleeve 75 is fixedly connected with a pressure head 77 through a connecting rod, the top of the limiting rod 74 is in threaded connection with an extrusion sleeve 78, the bottom of the limiting base 71 is fixedly connected with the dispenser body 1, the slide seat 73 is provided with a plurality of groups and is uniformly distributed on the annular slide way 72, the limiting device 7 is arranged, when the workpiece needs to be fixed, the workpiece, the fixing piece can be placed on the limiting base 71, the limiting sleeve 75 is driven to move by moving the sliding seat 73, the pressure head 77, the workpiece can be changed according to the shape of the pressing head 75, and the pressing head can be changed according to the pressing situation that the workpiece can be changed.
It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by one of ordinary skill in this and related arts based on the embodiments of the present invention without creative efforts, shall fall within the protection scope of the present invention. Structures, devices, and methods of operation not specifically described or illustrated herein are generally practiced in the art without specific recitation or limitation.

Claims (10)

1. The utility model provides a LED is dispensing equipment for semiconductor manufacturing, includes point gum machine body (1), its characterized in that: the glue dispenser comprises a glue dispenser body (1), a glue storage cylinder (2) is fixedly connected to the top of the inner wall of the glue dispenser body (1), the bottom of the glue storage cylinder (2) is communicated with a glue outlet mechanism (3), the bottom of the glue outlet mechanism (3) is communicated with a glue head fixing seat (4), the bottom of the glue head fixing seat (4) is communicated with a glue outlet head (5), and the bottom of the glue head fixing seat (4) is fixedly connected with a processing device (6);
glue first fixing base (4) and include:
the positioning seat (41) is provided with an annular structure and a positioning groove (42) arranged at the bottom of the positioning seat (41), and a buffer cavity (43) is fixedly connected inside the positioning seat (41) and positioned above the positioning groove (42);
the heating cavity (44) is of an annular structure, and an electric heating sheet (45) is arranged inside the heating cavity (44), a heat conducting sheet is fixedly connected inside the heating cavity (44), and one end of the heat conducting sheet inside the heating cavity (44) penetrates through and extends into the buffer cavity (43);
communicating pipe (46), this communicating pipe (46) have funnel shaped structure, and set up sealing washer (47) of communicating pipe (46) inner wall bottom, communicating pipe (46) top and the inside intercommunication of heating cavity (44), communicating pipe (46) bottom extends to inside constant head tank (42).
2. The dispensing apparatus for manufacturing LED semiconductor according to claim 1, wherein: positioning seat (41) top and play gluey mechanism (3) intercommunication, go out to glue head (5) top and extend to communicating pipe (46) inside and with communicating pipe (46) inner wall sliding connection, go out to glue head (5) top outside and offer the seal groove with sealing washer (47) looks adaptation.
3. The dispensing apparatus for manufacturing LED semiconductor device according to claim 1, wherein: an air outlet (441) is formed in the bottom of the heating cavity (44), an air outlet pipe (442) is communicated with the bottom of the air outlet (441), an exhaust fan (443) is fixedly connected to the inner wall of one end, away from the air outlet (441), of the air outlet pipe (442), and a portion, located on one side of the air outlet (441), of the bottom of the heating cavity (44) is communicated with an air inlet pipe (444).
4. The dispensing apparatus for manufacturing LED semiconductor according to claim 3, wherein: the end, far away from the air outlet (441), of the air outlet pipe (442) is opposite to the glue outlet head (5), and the air outlet (441) and the air inlet pipe (444) are provided with multiple groups and are uniformly distributed at the bottom of the heating cavity (44).
5. The dispensing apparatus for manufacturing LED semiconductor according to claim 1, wherein: processing apparatus (6) are including handling support (61), handle support (61) inner wall top fixedly connected with driving motor (62), driving shaft fixedly connected with of driving motor (62) rotates seat (63), it is connected with helical gear (64) to rotate seat (63) one side rotation, helical gear (64) bottom meshing has helical gear circle (65), helical gear circle (65) one side and handle support (61) inner wall fixed connection, helical gear (64) side central point puts fixedly connected with clearance ware (66).
6. The dispensing apparatus for manufacturing LED semiconductor according to claim 5, wherein: the top of the processing support (61) is fixedly connected with the bottom of the positioning seat (41), and the cleaner (66) extends to the position right below the glue outlet head (5).
7. The dispensing apparatus for manufacturing LED semiconductor according to claim 5, wherein: clearance ware (66) include axostylus axostyle (661), fixedly connected with axle sleeve (662) is established to axostylus axostyle (661) pot head, axle sleeve (662) side fixedly connected with winding pole (663), sliding connection is established and has clearance ring (664) in axle sleeve (662) pot head, clearance ring (664) inside wall offer with the groove of scraping (665) of winding pole (663) looks adaptation.
8. The dispensing apparatus for manufacturing LED semiconductor according to claim 7, wherein: one end of the shaft rod (661), which is far away from the shaft sleeve (662), is fixedly connected with the helical gear (64), and the winding rod (663) is set to be an elastic soft rod.
9. The dispensing apparatus for manufacturing LED semiconductor according to claim 1, wherein: the utility model discloses a glue dispenser, including point gum machine body (1), the inside part fixedly connected with stop device (7) that is located out under gluey head (5), stop device (7) are including limit base (71), connecting rod fixedly connected with annular slide (72) are passed through to limit base (71) side, annular slide (72) are inside through removing slider fixedly connected with sliding seat (73), sliding seat (73) top fixedly connected with gag lever post (74), gag lever post (74) are gone up the cover and are established and sliding connection has gag lever post (75), the equal fixedly connected with arc spring (76) in gag lever post (75) both sides, the one end and sliding seat (73) top fixed connection of gag lever post (75) are kept away from gag lever post (75) one side, gag lever post (74) top threaded connection has extrusion cover (78).
10. The dispensing apparatus for manufacturing LED semiconductor device according to claim 9, wherein: spacing base (71) bottom and point gum machine body (1) fixed connection, sliding seat (73) are provided with the multiunit and evenly distributed on annular slide (72).
CN202211416788.5A 2022-11-14 2022-11-14 Dispensing equipment for manufacturing LED semiconductor Withdrawn CN115608568A (en)

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Application Number Priority Date Filing Date Title
CN202211416788.5A CN115608568A (en) 2022-11-14 2022-11-14 Dispensing equipment for manufacturing LED semiconductor

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Application Number Priority Date Filing Date Title
CN202211416788.5A CN115608568A (en) 2022-11-14 2022-11-14 Dispensing equipment for manufacturing LED semiconductor

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CN115608568A true CN115608568A (en) 2023-01-17

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116759515A (en) * 2023-08-21 2023-09-15 山西星心半导体科技有限公司 Packaging structure of combined LED lamp bead

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116759515A (en) * 2023-08-21 2023-09-15 山西星心半导体科技有限公司 Packaging structure of combined LED lamp bead
CN116759515B (en) * 2023-08-21 2023-10-27 山西星心半导体科技有限公司 Packaging structure of combined LED lamp bead

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