CN115606329A

CN115606329A - Display substrate, preparation method thereof and display device

Info

Publication number: CN115606329A
Application number: CN202180000486.7A
Authority: CN
Inventors: 黄耀; 黄炜赟
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2021-03-12
Filing date: 2021-03-12
Publication date: 2023-01-13
Also published as: WO2022188168A1

Abstract

The disclosure provides a display substrate, a preparation method thereof and a display device. The display substrate comprises a normal resolution display area and a low resolution display area, wherein the low resolution display area comprises a light-transmitting display area and a non-light-transmitting display area positioned on the periphery of the light-transmitting display area; the light-transmitting display area comprises a pixel area and a blank area, the pixel area comprises a plurality of pixel islands configured to display a picture, and the blank area comprises a plurality of blank islands configured to transmit light; in a plane perpendicular to the display substrate, the pixel island comprises a display structure layer arranged on one side of the substrate facing emergent light, the display structure layer at least comprises a light-emitting device, and the blank island comprises a blank structure layer arranged on one side of the substrate facing the emergent light and a light hole arranged on the substrate; the orthographic projection of the light-transmitting holes on the plane of the display substrate and the orthographic projection of the light-emitting devices on the plane of the display substrate have no overlapping area.

Description

Display substrate, preparation method thereof and display device

Technical Field

The present disclosure relates to but not limited to the field of display technologies, and in particular, to a display substrate, a manufacturing method thereof, and a display device.

Background

An Organic Light Emitting Diode (OLED) is an active Light Emitting display device, and has the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, very high response speed, thinness, flexibility, and low cost. With the continuous development of Display technology, a Flexible Display device (Flexible Display) using an OLED as a light emitting device and using a Thin Film Transistor (TFT) for signal control has become a mainstream product in the Display field at present, and has been widely applied to the fields of mobile phones, computers, televisions, vehicles, intelligent wearable devices, and the like.

Disclosure of Invention

The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

An exemplary embodiment of the present disclosure provides a display substrate including a normal resolution display area and a low resolution display area, a resolution of the low resolution display area being smaller than a resolution of the normal resolution display area; the low-resolution display area comprises a light-transmitting display area and a non-light-transmitting display area positioned on the periphery of the light-transmitting display area; the light-transmitting display area comprises a pixel area and a blank area, the pixel area comprises a plurality of pixel islands configured to display a picture, and the blank area comprises a plurality of blank islands configured to transmit light; in a plane perpendicular to the display substrate, the pixel island comprises a display structure layer arranged on one side of the substrate facing emergent light, the display structure layer at least comprises a light-emitting device, and the blank island comprises a blank structure layer arranged on one side of the substrate facing the emergent light and a light hole arranged on the substrate; the orthographic projection of the light-transmitting holes on the plane of the display substrate and the orthographic projection of the light-emitting devices on the plane of the display substrate have no overlapping area.

In an exemplary embodiment, the orthographic projection of the blank islands on the plane of the display substrate comprises the orthographic projection of the light-transmissive holes on the plane of the display substrate.

In an exemplary embodiment, the plurality of pixel islands form a plurality of display columns, the plurality of blank islands form a plurality of blank columns, and the display columns and the blank columns are alternately arranged in a row direction; the light trap is the strip light trap that extends along the direction of being listed as, a plurality of strip light traps interval sets up in the direction of being listed as, blank orthographic projection of being listed as on the display substrate plane contains the orthographic projection of strip light trap on the display substrate plane.

In an exemplary embodiment, the plurality of pixel islands form a plurality of display rows, the plurality of blank islands form a plurality of blank rows, and the display rows and the blank rows are alternately arranged in a column direction; the light trap is the strip light trap that extends along the line direction, a plurality of strip light traps interval sets up in the direction of being listed as, blank line orthographic projection on the display substrate plane contains the orthographic projection of strip light trap on the display substrate plane.

In an exemplary embodiment, the plurality of pixel islands are alternately arranged in a row direction and a column direction, and the plurality of blank islands are alternately arranged in the row direction and the column direction; the light holes are block-shaped light holes, the block-shaped light holes are arranged at intervals in the row direction and the column direction, and the orthographic projection of the blank island on the plane of the display substrate comprises the orthographic projection of the block-shaped light holes on the plane of the display substrate.

In an exemplary embodiment, the pixel island includes a plurality of display sub-pixels, a display structure layer of at least one display sub-pixel includes a driving circuit layer disposed on the substrate, a light emitting structure layer disposed on the driving circuit layer, and an encapsulation layer disposed on the light emitting structure layer, the driving circuit layer includes a transistor and a storage capacitor constituting the pixel driving circuit, the light emitting structure layer includes an anode, an organic light emitting layer, and a cathode constituting the light emitting device; the blank island comprises a plurality of blank sub-pixels, and the blank structure layer of at least one blank sub-pixel comprises a composite insulating layer arranged on the substrate and an inorganic packaging layer arranged on the composite insulating layer.

In an exemplary embodiment, the substrate comprises a first flexible layer, and the light-transmitting hole is arranged on the side of the substrate away from the blank structure layer; the depth of the light hole is smaller than or equal to the thickness of the first flexible layer.

In an exemplary embodiment, the substrate comprises a first flexible layer, a first inorganic layer and a second flexible layer which are stacked, and the light transmission hole is arranged on one side of the substrate, which is far away from the blank structure layer; the depth of the light hole is less than or equal to the thickness of the first flexible layer, or the depth of the light hole is less than or equal to the total thickness of the first flexible layer and the first inorganic layer, or the depth of the light hole is less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer.

In an exemplary embodiment, the substrate comprises a first flexible layer, a first inorganic layer, a second flexible layer and a second inorganic layer which are stacked, and the light transmission hole is arranged on one side of the substrate away from the blank structure layer; the depth of the light transmission hole is less than or equal to the thickness of the first flexible layer, or the depth of the light transmission hole is less than or equal to the total thickness of the first flexible layer and the first inorganic layer, or the depth of the light transmission hole is less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer, or the depth of the light transmission hole is less than or equal to the total thickness of the first flexible layer, the first inorganic layer, the second flexible layer and the second inorganic layer.

The exemplary embodiment of the present disclosure also provides a display device, which includes the aforementioned display substrate.

The exemplary embodiment of the present disclosure also provides a method for manufacturing a display substrate, where the display substrate includes a normal resolution display area and a low resolution display area, and a resolution of the low resolution display area is smaller than a resolution of the normal resolution display area; the low-resolution display area comprises a light-transmitting display area and a non-light-transmitting display area positioned at the periphery of the light-transmitting display area; the light-transmitting display area comprises a pixel area and a blank area, the pixel area comprises a plurality of pixel islands configured to display a picture, and the blank area comprises a plurality of blank islands configured to transmit light; the preparation method comprises the following steps:

forming a display structure layer arranged on the substrate in the pixel area, and forming a blank structure layer arranged on the substrate in the blank area; the display structure layer at least comprises a light emitting device;

forming a light transmission hole on a substrate; the orthographic projection of the light-transmitting hole on the plane of the display substrate and the orthographic projection of the light-emitting device on the plane of the display substrate have no overlapping area.

In an exemplary embodiment, the plurality of pixel islands form a plurality of display columns, the plurality of blank islands form a plurality of blank columns, and the display columns and the blank columns are alternately arranged in a row direction;

forming a light transmissive hole on a substrate, comprising: the display substrate comprises a substrate, a plurality of strip-shaped light holes extending in the row direction are formed in the substrate, the strip-shaped light holes are arranged at intervals in the row direction, and the orthographic projection of the blank row on the plane of the display substrate comprises the orthographic projection of the strip-shaped light holes on the plane of the display substrate.

In an exemplary embodiment, the plurality of pixel islands form a plurality of display rows, the plurality of blank islands form a plurality of blank rows, and the display rows and the blank rows are alternately arranged in a column direction;

forming a light transmissive hole on a substrate, comprising: the display substrate comprises a substrate, a plurality of strip-shaped light holes extending along the row direction are formed in the substrate, the strip-shaped light holes are arranged at intervals in the column direction, and the orthographic projection of the blank row on the plane of the display substrate comprises the orthographic projection of the strip-shaped light holes on the plane of the display substrate.

In an exemplary embodiment, the plurality of pixel islands are alternately arranged in the row direction and the column direction, and the plurality of blank islands are alternately arranged in the row direction and the column direction;

forming a light transmissive hole on a substrate, comprising: and a plurality of block-shaped light holes are formed in the substrate, the block-shaped light holes are arranged at intervals in the row direction and the column direction, and the orthographic projection of the blank island on the plane of the display substrate comprises the orthographic projection of the block-shaped light holes on the plane of the display substrate.

In an exemplary embodiment, forming a light transmissive hole on a substrate includes:

stripping the glass carrier plate from the substrate;

attaching a back film to one side of the substrate far away from the display structure layer and the blank structure layer;

and irradiating one side of the back film, which is far away from the substrate, by adopting laser to form the light hole.

In the case of the exemplary embodiment, it is,

forming a blank structure layer disposed on the substrate in the blank region, including:

forming a stripping layer on a glass carrier plate;

forming a first flexible layer covering the stripping layer, wherein the first flexible layer positioned on one side of the stripping layer away from the glass carrier plate is used as a stripping substrate, and the first flexible layer in other areas is used as a substrate;

forming a blank structure layer on the substrate;

forming a light transmissive hole on a substrate, comprising:

irradiating the first flexible layer in the junction area of the substrate and the stripped substrate by laser through the glass carrier plate;

and peeling the glass carrier plate and the substrate, wherein the glass carrier plate drives the peeling layer and the peeling substrate to peel together, and a light hole is formed on the substrate.

In the case of the exemplary embodiment, it is,

forming a peeling layer on a glass carrier;

sequentially forming a first flexible layer, a first inorganic layer and a second flexible layer; an inorganic opening is arranged on the first inorganic layer, the orthographic projection of the inorganic opening on the glass carrier plate comprises the orthographic projection of the stripping layer on the glass carrier plate, and the second flexible layer fills the inorganic opening; the first flexible layer and the second flexible layer which are positioned on one side of the stripping layer away from the glass carrier plate are used as stripping substrates, and the first flexible layer, the first inorganic layer and the second flexible layer in other areas are used as substrates;

forming a blank structure layer on the substrate;

forming a light transmissive hole on a substrate, comprising:

irradiating the first flexible layer and the second flexible layer of the interface area of the substrate and the stripped substrate by laser through the glass carrier plate;

Other aspects will be apparent upon reading and understanding the attached drawings and detailed description.

Drawings

The accompanying drawings are included to provide a further understanding of the disclosed embodiments and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the example serve to explain the principles of the disclosure and not to limit the disclosure. The shapes and sizes of the various elements in the drawings are not to be considered as true proportions, but are merely intended to illustrate the present disclosure.

FIG. 1 is a schematic diagram of a display device;

FIG. 2 is a schematic plan view of a display substrate;

FIG. 3 is a schematic cross-sectional view of a display substrate;

FIG. 4 is a schematic diagram of an equivalent circuit of a pixel driving circuit;

FIG. 5 is a timing diagram illustrating operation of a pixel driving circuit;

FIG. 6 is a schematic plan view of a resolution display area in a display substrate;

FIGS. 7a to 7e are front views of several light-transmissive display regions of a display substrate;

fig. 8 is a schematic cross-sectional view illustrating a light-transmissive display region according to an exemplary embodiment of the disclosure;

FIGS. 9a to 9e are rear views of several light transmissive display regions according to exemplary embodiments of the present disclosure;

FIG. 10 is a schematic view of a substrate after patterning the substrate according to one embodiment of the present disclosure;

FIG. 11 is a schematic diagram illustrating a method of forming a driving circuit layer pattern according to the present disclosure;

fig. 12 is a schematic view after forming a light emitting structure and an encapsulation layer pattern in a manufacturing method according to the present disclosure;

FIG. 13 is a schematic view of a glass carrier being peeled off in a manufacturing method according to the disclosure;

FIG. 14 is a schematic view of a back film attached in a method of making according to the present disclosure;

fig. 15a to 15e are schematic views illustrating a light hole formed in a manufacturing method according to the present disclosure;

FIG. 16 is a schematic view of a release layer patterned according to another method of forming the present disclosure;

FIG. 17 is a schematic view of a substrate after patterning the substrate according to another method of the present disclosure;

FIG. 18 is a schematic view of a display structure layer after patterning the display structure layer according to another method of the present disclosure;

FIG. 19 is a schematic view of another method of forming a pattern of light-transmissive holes in accordance with the present disclosure;

FIG. 20 is a schematic view after a release layer pattern is formed in still another manufacturing method according to the present disclosure;

FIG. 21 is a schematic view of a substrate after patterning according to yet another method of the present disclosure;

FIG. 22 is a schematic view of a display structure layer after patterning the display structure layer according to still another method of the present disclosure;

FIG. 23 is a schematic diagram of another method for forming a pattern of light-transmissive holes according to the present disclosure.

Description of reference numerals:

1-a glass carrier plate; 2-a back membrane; 10-a substrate;

10A — a first flexible layer; 10B — a first inorganic layer; 10C — a second flexible layer;

10D — a second inorganic layer; 31-an anode; 32-pixel definition layer;

33 — an organic light-emitting layer; 34-a cathode; 41 — first encapsulation layer;

42-organic encapsulation layer; 43 — second encapsulation layer; 90-a release layer;

91-peeling off the substrate; 101-a transistor; 101A-storage capacitance;

102-a driver circuit layer; 103-light emitting structure layer; 104-an encapsulation layer;

202-composite insulating layer; 210 — normal resolution display area; 220-low resolution display area;

221-a light transmissive display region; 222-a non-transmissive display region; 300-pixel islands;

310-displaying a structural layer; 400-blank islands; 410-blank structure layer;

500-light hole; 501-light transmission hole group.

Detailed Description

To make the objects, technical solutions and advantages of the present disclosure more apparent, embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. Note that the embodiments may be implemented in a plurality of different forms. Those skilled in the art can readily appreciate the fact that the forms and details may be varied into a variety of forms without departing from the spirit and scope of the present disclosure. Therefore, the present disclosure should not be construed as being limited to the contents described in the following embodiments. The embodiments and features of the embodiments in the present disclosure may be arbitrarily combined with each other without conflict.

In the drawings, the size of each component, the thickness of layers, or regions may be exaggerated for clarity. Therefore, one aspect of the present disclosure is not necessarily limited to the dimensions, and the shapes and sizes of the respective components in the drawings do not reflect a true scale. Further, the drawings schematically show ideal examples, and one embodiment of the present disclosure is not limited to the shapes, numerical values, and the like shown in the drawings.

The ordinal numbers such as "first", "second", "third", and the like in the present specification are provided for avoiding confusion among the constituent elements, and are not limited in number.

In this specification, for convenience, words such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicating orientations or positional relationships are used to explain positional relationships of constituent elements with reference to the drawings, only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present disclosure. The positional relationship of the components is changed as appropriate in accordance with the direction in which each component is described. Therefore, the words described in the specification are not limited to the words described in the specification, and may be replaced as appropriate.

In this specification, the terms "mounted," "connected," and "connected" are to be construed broadly unless otherwise explicitly specified or limited. For example, it may be a fixed connection, or a removable connection, or an integral connection; can be a mechanical connection, or an electrical connection; either directly or indirectly through intervening components, or both may be interconnected. The specific meaning of the above terms in the present disclosure can be understood in specific instances by those of ordinary skill in the art.

In this specification, a transistor refers to an element including at least three terminals, that is, a gate electrode, a drain electrode, and a source electrode. The transistor has a channel region between a drain electrode (drain electrode terminal, drain region, or drain electrode) and a source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this specification, a channel region refers to a region where current mainly flows.

In this specification, the first electrode may be a drain electrode and the second electrode may be a source electrode, or the first electrode may be a source electrode and the second electrode may be a drain electrode. In the case of using transistors of opposite polarities, or in the case of changing the direction of current flow during circuit operation, the functions of the "source electrode" and the "drain electrode" may be interchanged. Therefore, in this specification, "source electrode" and "drain electrode" may be exchanged with each other.

In this specification, "electrically connected" includes a case where constituent elements are connected together by an element having some kind of electrical action. The "element having some kind of electrical function" is not particularly limited as long as it can transmit and receive an electrical signal between connected components. Examples of the "element having some kind of electric function" include not only an electrode and a wiring but also a switching element such as a transistor, a resistor, an inductor, a capacitor, other elements having various functions, and the like.

In the present specification, "parallel" means a state in which an angle formed by two straight lines is-10 ° or more and 10 ° or less, and therefore, includes a state in which the angle is-5 ° or more and 5 ° or less. The term "perpendicular" refers to a state in which the angle formed by two straight lines is 80 ° or more and 100 ° or less, and therefore includes a state in which the angle is 85 ° or more and 95 ° or less.

In the present specification, "film" and "layer" may be interchanged with each other. For example, the "conductive layer" may be sometimes replaced with a "conductive film". Similarly, the "insulating film" may be replaced with an "insulating layer".

"about" in this disclosure means that the limits are not strictly defined, and that the numerical values are within the tolerances allowed for the process and measurement.

Fig. 1 is a schematic structural diagram of a display device. As shown in fig. 1, the OLED display device may include a timing controller, a data signal driver, a scan signal driver, a light emitting signal driver, and a pixel array, and the pixel array may include a plurality of scan signal lines (S1 to Sm), a plurality of data signal lines (D1 to Dn), a plurality of light emitting signal lines (E1 to Eo), and a plurality of sub-pixels Pxij. In an exemplary embodiment, the timing controller may supply a gray value and a control signal suitable for the specification of the data signal driver to the data signal driver, may supply a clock signal, a scan start signal, and the like suitable for the specification of the scan signal driver to the scan signal driver, and may supply a clock signal, an emission stop signal, and the like suitable for the specification of the light emission signal driver to the light emission signal driver. The data signal driver may generate data voltages to be supplied to the data signal lines D1, D2, D3, \8230 \ 8230, and Dn using the gray scale value and the control signal received from the timing controller. For example, the data signal driver may sample a gray value using a clock signal and apply a data voltage corresponding to the gray value to the data signal lines D1 to Dn in units of pixel rows, and n may be a natural number. The scan signal driver may generate a scan signal to be supplied to the scan signal lines S1, S2, S3, \8230 \ 8230;, and Sm by receiving a clock signal, a scan start signal, and the like from the timing controller. For example, the scan signal driver may sequentially supply scan signals having on-level pulses to the scan signal lines S1 to Sm. For example, the scan signal driver may be constructed in the form of a shift register, and may generate the scan signals in such a manner that scan start signals provided in the form of on-level pulses are sequentially transmitted to the next stage circuit under the control of a clock signal, and m may be a natural number. The light emitting signal driver may generate an emission signal to be supplied to the light emitting signal lines E1, E2, E3, \8230;, and Eo by receiving a clock signal, an emission stop signal, and the like from the timing controller. For example, the light emitting signal driver may sequentially supply the emission signals having off-level pulses to the light emitting signal lines E1 to Eo. For example, the light emitting signal driver may be configured in the form of a shift register, and the emission signal may be generated in such a manner that the emission stop signal provided in the form of an off-level pulse is sequentially transmitted to the next stage circuit under the control of a clock signal, and o may be a natural number. The pixel array may include a plurality of subpixels PXij. Each subpixel PXij may be connected to a corresponding data signal line, a corresponding scan signal line and a corresponding light emitting signal line, and i and j may be natural numbers. The subpixel PXij may refer to a subpixel in which a transistor is connected to an ith scan signal line and to a jth data signal line.

Fig. 2 is a schematic plan view of a display substrate. As shown in fig. 2, the display substrate may include a plurality of pixel units P arranged in a matrix, at least one of the plurality of pixel units P includes a first light emitting unit (sub-pixel) P1 emitting light of a first color, a second light emitting unit P2 emitting light of a second color, and a third light emitting unit P3 emitting light of a third color, and the first light emitting unit P1, the second light emitting unit P2, and the third light emitting unit P3 may each include a pixel driving circuit and a light emitting device. The pixel driving circuits in the first, second, and third light emitting units P1, P2, and P3 are respectively connected to the scan signal line, the data signal line, and the light emitting signal line, and the pixel driving circuits are configured to receive the data voltage transmitted from the data signal line and output corresponding currents to the light emitting devices under the control of the scan signal line and the light emitting signal line. The light emitting devices in the first light emitting unit P1, the second light emitting unit P2 and the third light emitting unit P3 are respectively connected to the pixel driving circuit of the corresponding light emitting unit, and the light emitting devices are configured to emit light with corresponding brightness in response to a current output by the pixel driving circuit of the corresponding light emitting unit.

In an exemplary embodiment, the pixel unit P may include a red (R) light emitting unit, a green (G) light emitting unit, and a blue (B) light emitting unit therein, or may include a red light emitting unit, a green light emitting unit, a blue light emitting unit, and a white light emitting unit therein, and the disclosure is not limited thereto. In an exemplary embodiment, the shape of the light emitting cell in the pixel unit may be a rectangular shape, a diamond shape, a pentagon shape, or a hexagon shape. When the pixel unit includes three light emitting units, the three light emitting units may be arranged in a horizontal parallel manner, a vertical parallel manner, or a delta-shaped manner, and when the pixel unit includes four light emitting units, the four light emitting units may be arranged in a horizontal parallel manner, a vertical parallel manner, or a Square (Square) manner, which is not limited herein.

Fig. 3 is a schematic cross-sectional structure diagram of a display substrate, illustrating the structure of three sub-pixels of an OLED display substrate. As shown in fig. 3, the display substrate may include a driving circuit layer 102 disposed on the substrate 10, a light emitting structure layer 103 disposed on a side of the driving circuit layer 102 away from the substrate 10, and an encapsulation layer 104 disposed on a side of the light emitting structure layer 103 away from the substrate 10, in a plane perpendicular to the display substrate. In some possible implementations, the display substrate may include other film layers, such as spacer pillars, and the like, which are not limited in this disclosure.

In exemplary embodiments, the substrate 10 may be a flexible substrate, or may be a rigid substrate. The driving circuit layer 102 of each sub-pixel may include a plurality of transistors and storage capacitors constituting a pixel driving circuit, and each sub-pixel in fig. 3 shows only one transistor 101 and one storage capacitor 101A as an example. The light emitting structure layer 103 may include an anode 31, a pixel defining layer 32, an organic light emitting layer 33, and a cathode 34, the anode 31 is connected to the drain electrode of the transistor 101 through a via hole, the organic light emitting layer 33 is connected to the anode 31, the cathode 34 is connected to the organic light emitting layer 33, and the organic light emitting layer 33 emits light of a corresponding color by being driven by the anode 31 and the cathode 34. The encapsulation layer 104 may include a first encapsulation layer 41, a second encapsulation layer 42, and a third encapsulation layer 43 that are stacked, the first encapsulation layer 41 and the third encapsulation layer 43 may be made of inorganic materials, the second encapsulation layer 42 may be made of organic materials, and the second encapsulation layer 42 is disposed between the first encapsulation layer 41 and the third encapsulation layer 43, which may ensure that external moisture cannot enter the light emitting structure layer 103.

In an exemplary embodiment, the organic light Emitting Layer may include a light Emitting Layer (EML), and any one or more of: a Hole Injection Layer (HIL), a Hole Transport Layer (HTL), an Electron Blocking Layer (EBL), a Hole Blocking Layer (HBL), an Electron Transport Layer (ETL), and an Electron Injection Layer (EIL). In an exemplary embodiment, the organic light emitting layer may be formed by evaporation using a Fine Metal Mask (FMM) or an Open Mask (Open Mask), or by an inkjet process. In an exemplary embodiment, the hole injection layers of all the sub-pixels may be a common layer connected together, the electron injection layers of all the sub-pixels may be a common layer connected together, the hole transport layers of all the sub-pixels may be a common layer connected together, the electron transport layers of all the sub-pixels may be a common layer connected together, the hole blocking layers of all the sub-pixels may be a common layer connected together, the light emitting layers of adjacent sub-pixels may have a small amount of overlap, or may be isolated, and the electron blocking layers of adjacent sub-pixels may have a small amount of overlap, or may be isolated.

In an exemplary embodiment, the pixel driving circuit may be a 3T1C, 4T1C, 5T2C, 6T1C, or 7T1C structure. Fig. 4 is an equivalent circuit diagram of a pixel driving circuit. As shown in fig. 4, the pixel driving circuit may include 7 thin film transistors (first to seventh transistors T1 to T7), 1 storage capacitor C, and 7 signal lines (a data signal line D, a first scanning signal line S1, a second scanning signal line S2, a light emitting signal line E, an initial signal line INIT, a first power supply line VDD, and a second power supply line VSS).

In an exemplary embodiment, a first terminal of the storage capacitor C is connected to the first power line VDD, and a second terminal of the storage capacitor C is connected to the second node N2, that is, the second terminal of the storage capacitor C is connected to the control electrode of the third transistor T3.

A control electrode of the first transistor T1 is connected to the second scanning signal line S2, a first electrode of the first transistor T1 is connected to the initial signal line INIT, and a second electrode of the first transistor is connected to the second node N2. When the on-level scan signal is applied to the second scan signal line S2, the first transistor T1 transfers an initialization voltage to the control electrode of the third transistor T3 to initialize the charge amount of the control electrode of the third transistor T3.

A control electrode of the second transistor T2 is connected to the first scan signal line S1, a first electrode of the second transistor T2 is connected to the second node N2, and a second electrode of the second transistor T2 is connected to the third node N3. When the on-level scan signal is applied to the first scan signal line S1, the second transistor T2 connects the control electrode of the third transistor T3 with the second electrode.

A control electrode of the third transistor T3 is connected to the second node N2, that is, the control electrode of the third transistor T3 is connected to the second end of the storage capacitor C, a first electrode of the third transistor T3 is connected to the first node N1, and a second electrode of the third transistor T3 is connected to the third node N3. The third transistor T3 may be referred to as a driving transistor, and the third transistor T3 determines an amount of driving current flowing between the first power supply line VDD and the second power supply line VSS according to a potential difference between a control electrode and a first electrode thereof.

A control electrode of the fourth transistor T4 is connected to the first scan signal line S1, a first electrode of the fourth transistor T4 is connected to the data signal line D, and a second electrode of the fourth transistor T4 is connected to the first node N1. The fourth transistor T4 may be referred to as a switching transistor, a scan transistor, or the like, and when an on-level scan signal is applied to the first scan signal line S1, the fourth transistor T4 causes the data voltage of the data signal line D to be input to the pixel driving circuit.

A control electrode of the fifth transistor T5 is connected to the light emitting signal line E, a first electrode of the fifth transistor T5 is connected to the first power supply line VDD, and a second electrode of the fifth transistor T5 is connected to the first node N1. A control electrode of the sixth transistor T6 is connected to the light emitting signal line E, a first electrode of the sixth transistor T6 is connected to the third node N3, and a second electrode of the sixth transistor T6 is connected to the first electrode of the light emitting device. The fifth transistor T5 and the sixth transistor T6 may be referred to as light emitting transistors. When an on-level light emission signal is applied to the light emission signal line E, the fifth transistor T5 and the sixth transistor T6 cause the light emitting device to emit light by forming a driving current path between the first power line VDD and the second power line VSS.

A control electrode of the seventh transistor T7 is connected to the first scan signal line S1, a first electrode of the seventh transistor T7 is connected to the initial signal line INIT, and a second electrode of the seventh transistor T7 is connected to the first electrode of the light emitting device. When the on-level scan signal is applied to the first scan signal line S1, the seventh transistor T7 transmits an initialization voltage to the first pole of the light emitting device to initialize or release the amount of charge accumulated in the first pole of the light emitting device.

In an exemplary embodiment, the second pole of the light emitting device is connected to a second power line VSS, the second power line VSS being a low level signal, and the first power line VDD being a high level signal. The first scanning signal line S1 is a scanning signal line in the pixel driving circuit of the display line, the second scanning signal line S2 is a scanning signal line in the pixel driving circuit of the previous display line, that is, for the nth display line, the first scanning signal line S1 is S (n), the second scanning signal line S2 is S (n-1), and the second scanning signal line S2 of the display line and the first scanning signal line S1 in the pixel driving circuit of the previous display line are the same signal line, so that signal lines of the display substrate can be reduced, and a narrow frame of the display substrate can be realized.

In an exemplary embodiment, the first to seventh transistors T1 to T7 may be P-type transistors or may be N-type transistors. The same type of transistors are adopted in the pixel driving circuit, so that the process flow can be simplified, the process difficulty of the display substrate is reduced, and the yield of products is improved. In some possible implementations, the first to seventh transistors T1 to T7 may include P-type transistors and N-type transistors.

In an exemplary embodiment, the first scan signal line S1, the second scan signal line S2, the light emitting signal line E, and the initial signal line INIT extend in a horizontal direction, and the second power supply line VSS, the first power supply line VDD, and the data signal line D extend in a vertical direction.

In an exemplary embodiment, the light emitting device may be an organic electroluminescent diode (OLED) including a first electrode (anode), an organic light emitting layer, and a second electrode (cathode) stacked.

Fig. 5 is a timing diagram of an operation of a pixel driving circuit. The exemplary embodiment of the present disclosure will be described below by way of an operation process of the pixel driving circuit illustrated in fig. 4, where the pixel driving circuit in fig. 4 includes 7 thin film transistors (first to sixth transistors T1 to T7), 1 storage capacitor C, and 7 signal lines (data signal line D, first scanning signal line S1, second scanning signal line S2, light emission signal line E, initial signal line INIT, first power line VDD, and second power line VSS), and the 7 transistors are all P-type transistors.

In an exemplary embodiment, the operation of the pixel driving circuit may include:

in the first phase A1, referred to as a reset phase, the signal of the second scanning signal line S2 is a low-level signal, and the signals of the first scanning signal line S1 and the light-emitting signal line E are high-level signals. The signal of the second scanning signal line S2 is a low level signal, so that the first transistor T1 is turned on, the signal of the initial signal line INIT is provided to the second node N2, the storage capacitor C is initialized, and the original data voltage in the storage capacitor is cleared. The signals of the first scanning signal line S1 and the light emitting signal line E are high level signals, turning off the second transistor T2, the fourth transistor T4, the fifth transistor T5, the sixth transistor T6, and the seventh transistor T7, and the OLED does not emit light at this stage.

In the second stage A2, which is referred to as a data writing stage or a threshold compensation stage, the signal of the first scanning signal line S1 is a low level signal, the signals of the second scanning signal line S2 and the light-emitting signal line E are high level signals, and the data signal line D outputs a data voltage. At this stage, the second terminal of the storage capacitor C is at a low level, so the third transistor T3 is turned on. The signal of the first scan signal line S1 is a low level signal to turn on the second transistor T2, the fourth transistor T4, and the seventh transistor T7. The second transistor T2 and the fourth transistor T4 are turned on so that the data voltage output by the data signal line D is provided to the second node N2 through the first node N1, the turned-on third transistor T3, the turned-on third node N3, and the turned-on second transistor T2, and a difference between the data voltage output by the data signal line D and the threshold voltage of the third transistor T3 is charged into the storage capacitor C, the voltage of the second end (the second node N2) of the storage capacitor C is Vd- | Vth |, vd is the data voltage output by the data signal line D, and Vth is the threshold voltage of the third transistor T3. The seventh transistor T7 is turned on to supply the initial voltage of the initial signal line INIT to the first electrode of the OLED, initialize (reset) the first electrode of the OLED, clear the pre-stored voltage therein, complete the initialization, and ensure that the OLED does not emit light. The signal of the second scanning signal line S2 is a high level signal, turning off the first transistor T1. The signal of the light emitting signal line E is a high level signal, turning off the fifth transistor T5 and the sixth transistor T6.

In the third stage A3, referred to as a light-emitting stage, a signal of the light-emitting signal line E is a low-level signal, and signals of the first scanning signal line S1 and the second scanning signal line S2 are high-level signals. The signal of the light emitting signal line E is a low level signal, the fifth transistor T5 and the sixth transistor T6 are turned on, and the power supply voltage output by the first power line VDD supplies a driving voltage to the first electrode of the OLED through the turned-on fifth transistor T5, the turned-on third transistor T3, and the turned-on sixth transistor T6, so as to drive the OLED to emit light.

During driving of the pixel driving circuit, a driving current flowing through the third transistor T3 (driving transistor) is determined by a voltage difference between the gate electrode and the first electrode thereof. Since the voltage of the second node N2 is Vdata- | Vth |, the driving current of the third transistor T3 is:

I＝K*(Vgs-Vth) ² ＝K*[(Vdd-Vd+|Vth|)-Vth] ² ＝K*[(Vdd-Vd] ²

where I is a driving current flowing through the third transistor T3, that is, a driving current driving the OLED, K is a constant, vgs is a voltage difference between the gate electrode and the first electrode of the third transistor T3, vth is a threshold voltage of the third transistor T3, vd is a data voltage output from the data signal line D, and Vdd is a power voltage output from the first power line Vdd.

With the development of display technology, the full-screen has gradually become the development trend of display products with a larger screen ratio and an ultra-narrow frame. The comprehensive screen product usually adopts the sensing technology under the screen, places sensors such as camera, 3D formation of image and fingerprint identification in the screen below, and the screen area of placing the sensor has sufficient light penetration rate and realizes sensing under the screen, and this screen area has the display function and realizes real comprehensive screen display. In order to improve the sensing effect of the under-screen sensing area, the area needs to have high light transmittance. At present, a rigid display panel adopts polyethylene terephthalate (PET) as a substrate material, the transmittance of the PET can be about 90%, the optical loss caused by the substrate is small, and the requirement of light transmittance can be met. However, since PET folding causes obvious creases, polyimide (PI) or the like is generally used as a base material in the current flexible display panel. Researches show that the PI substrate has great influence on the light transmittance, and particularly has the transmittance of only about 20 to 60 percent at the wavelength of 420 to 450nm for a blue light wave band.

FIG. 6 is a schematic plan view of a resolution display area on a display substrate. As shown in fig. 6, in an exemplary embodiment, the display substrate may include a normal resolution display area 210 and a low resolution display area 220, the normal resolution display area 210 is located at the periphery of the low resolution display area 220, the normal resolution display area 210 and the low resolution display area 220 each include a plurality of regularly arranged pixels, but the resolution of the low resolution display area 220 is less than that of the normal resolution display area 210. The resolution (PPI) refers to the number of Pixels in a unit area, and may be referred to as pixel density, where a higher PPI value indicates that the display substrate can display a picture with a higher density, and the details of the picture are richer.

In an exemplary embodiment, the low resolution display region 220 may include a light-transmissive display region 221 and a non-light-transmissive display region 222, and the non-light-transmissive display region 222 is located at a periphery of the light-transmissive display region 221. In an exemplary embodiment, the position of the light-transmissive display region 221 may correspond to the position of an optical device, and has functions of displaying a picture and transmitting light, which is received by the optical device. The non-transparent display area 222 has functions of displaying images and configuring signal traces, and the signal traces are connected to the signal lines in the transparent display area to lead out the signal lines.

In an exemplary embodiment, the shape of the light-transmissive display region 221 in a plane parallel to the display substrate may be any one or more of: rectangular, polygonal, circular and oval, the optical device may be a fingerprint recognition device, a camera device or an optical sensor such as 3D imaging, and the disclosure is not limited herein. For example, when the shape of the light-transmissive display region 221 is a circle, the diameter of the circle may be about 3mm to 5mm. For another example, when the light-transmitting display region 221 has a rectangular shape, the side length of the rectangular shape may be about 3mm to 5mm.

In an exemplary embodiment, the shape of the non-light-transmissive display region 222 in a plane parallel to the display substrate may be any one or more of: rectangular, polygonal, circular, and elliptical.

Fig. 7a to 7e are front views of several transparent display regions in a display substrate, which illustrate the planar structure of the light-emitting surface side of the display substrate. In an exemplary embodiment, the light-transmissive display region may include a pixel region configured to display a picture including a plurality of pixel islands 300 distributed in an array and spaced apart from each other, and a blank region configured to transmit light including a plurality of blank islands 400 distributed in an array and spaced apart from each other. In an exemplary embodiment, at least one of the pixel islands 300 may include one or more display pixels, one of the display pixels may include 3 display sub-pixels emitting lights of different colors (e.g., red, green, blue, and blue) or 4 display sub-pixels emitting lights of different colors (e.g., red, green, blue, and white), and at least one of the display sub-pixels may include at least a light emitting device configured to emit light of corresponding brightness in response to a current output from a corresponding pixel driving circuit, so that the display sub-pixel performs a picture display. The at least one blank island 400 may include one or more blank subpixels not emitting light, in which neither the pixel driving circuit nor the light emitting device is disposed, nor a picture is displayed. In an exemplary embodiment, the shape, size, arrangement, and the like of the display sub-pixels may be the same as those of the sub-pixels in the normal resolution display area, and the shape and size of the blank sub-pixels may be the same as those of the sub-pixels in the normal resolution display area.

In some possible exemplary embodiments, the display sub-pixel may include both the pixel driving circuit and the light emitting device, and the light emitting device of the display sub-pixel is driven by the driving circuit of the display sub-pixel to emit light. In other possible exemplary embodiments, the display sub-pixel may be provided with only a light emitting device without a pixel driving circuit, the light emitting device is connected to a pixel driving circuit provided in the non-light-transmitting display region 222, and the pixel driving circuit of the non-light-transmitting display region 222 drives the light emitting device to emit light, which is not limited herein.

In an exemplary embodiment, the plurality of pixel islands 300 and the plurality of blank islands 400 may be alternately disposed in a row direction (first direction X), the plurality of pixel islands 300 are sequentially disposed in a column direction (second direction Y), and the plurality of blank islands 400 are sequentially disposed in the column direction, such that the plurality of pixel islands 300 form a plurality of display columns, the plurality of blank islands 400 form a plurality of blank columns, and the display columns and the blank columns are alternately disposed in the row direction, as shown in fig. 7 a.

In an exemplary embodiment, the plurality of pixel islands 300 and the plurality of blank islands 400 may be alternately disposed in the column direction (second direction Y), the plurality of pixel islands 300 are sequentially disposed in the row direction (first direction X), and the plurality of blank islands 400 are sequentially disposed in the row direction, such that the plurality of pixel islands 300 form a plurality of display rows, the plurality of blank islands 400 form a plurality of blank rows, and the display rows and the blank rows are alternately disposed in the column direction, as shown in fig. 7 b.

In an exemplary embodiment, the plurality of pixel islands 300 may be alternately arranged in the row direction (first direction X) and in the column direction (second direction Y), and the plurality of blank islands 400 may be alternately arranged in the row direction and in the column direction, such that the pixel islands 300 are adjacent to the blank islands 400 and the blank islands 400 are adjacent to the pixel islands 300, and the plurality of pixel islands 300 and the plurality of blank islands 400 form a checkerboard arrangement, as shown in fig. 7c, regardless of the row direction or the column direction.

In an exemplary embodiment, for the arrangement shown in fig. 7a, 7b and 7c, since the number of pixel islands 300 is substantially the same as the number of blank islands 400, the resolution of the light-transmissive display region is about 50% of the resolution of the normal-resolution display region.

In an exemplary embodiment, in the pixel island and blank island arrangement shown in fig. 7c, the number of blank islands 400 may be increased and resolution may be reduced by replacing portions of the pixel island 300 with blank islands 400, as shown in fig. 7 d. Alternatively, the number of pixel islands 300 may be increased, increasing resolution, by replacing the blank islands 400 with pixel islands 300, as shown in fig. 7 e.

In an exemplary embodiment, the arrangement of the pixel islands and the blank islands in the light-transmissive display area, the arrangement of the sub-pixels in the pixel islands, the shapes and sizes of the sub-pixels, and the like may be set according to requirements of an application scenario, a resolution, a transmittance, and the like, and the disclosure is not limited herein.

Fig. 8 isbase:Sub>A schematic cross-sectional structure view ofbase:Sub>A light-transmitting display region according to an exemplary embodiment of the disclosure, which isbase:Sub>A cross-sectional view taken along the directionbase:Sub>A-base:Sub>A in fig. 7base:Sub>A. The light-transmissive display region may include a plurality of pixel islands 300 and a plurality of blank islands 400 in a plane parallel to the display substrate, the pixel islands 300 may include a plurality of display sub-pixels, and the blank islands 400 may include a plurality of blank sub-pixels. As shown in fig. 8, the pixel island 300 may include a display structure layer 310 disposed on a side of the substrate 10 facing the outgoing light in a plane perpendicular to the display substrate, and the display structure layer 310 may include a light emitting device, or a pixel driving circuit and a light emitting device. The blank island 400 may include a blank structure layer 410 disposed on a side of the substrate 10 facing the exit light and a light-transmitting hole 500 disposed on a side of the substrate 10 facing away from the exit light. In an exemplary embodiment, there is no overlapping area of the orthographic projection of the light-transmissive hole 500 on the plane of the display substrate with the orthographic projection of the light-emitting devices in the pixel islands on the plane of the display substrate.

In an exemplary embodiment, the light hole 500 is disposed on a surface of the substrate 10 on a side away from the blank structure layer 410, the substrate with a depth H inside the light hole 500 is removed, and a blind via structure is formed on a back surface of the display substrate.

In an exemplary embodiment, the depth H of the light transmission hole 500 may be less than or equal to the thickness D of the substrate 10.

In an exemplary embodiment, the shape of the light-transmitting hole 500 may correspond to the shape of the blank island 400, the width L1 of the light-transmitting hole 500 may be less than or equal to the width L2 of the blank island 400, and the orthographic projection of the blank island 400 on the plane of the display substrate may include the orthographic projection of the light-transmitting hole 500 on the plane of the display substrate. In an exemplary embodiment, the width may be a dimension of the first direction X, or may be a dimension of the second direction Y.

In an exemplary embodiment, the display structure layer 310 of the pixel island 300 may include a driving circuit layer disposed on the substrate 10, a light emitting structure layer disposed on a side of the driving circuit layer away from the substrate, and an encapsulation layer disposed on a side of the light emitting structure layer away from the substrate, the driving circuit layer may include a transistor and a storage capacitor constituting the pixel driving circuit, or include a signal line configured to connect the light emitting device, the light emitting structure layer may include an anode, an organic light emitting layer, and a cathode constituting the light emitting device, and the encapsulation layer may include a first encapsulation layer, an organic encapsulation layer, and a second encapsulation layer stacked.

In an exemplary embodiment, for the driving circuit layer including the pixel driving circuit, the driving circuit layer may include: an active layer disposed on the substrate 10, a first insulating layer covering the active layer, a gate electrode and a first capacitor electrode disposed on the first insulating layer, a second insulating layer covering the gate electrode and the first capacitor electrode, a second capacitor electrode disposed on the second insulating layer, a third insulating layer covering the second capacitor electrode, a source electrode and a drain electrode disposed on the third insulating layer, and a fourth insulating layer covering the source electrode and the drain electrode. The active layer, the gate electrode, the source electrode and the drain electrode form a transistor, and the first capacitor electrode and the second capacitor electrode form a storage capacitor.

In an exemplary embodiment, the blank structure layer 410 of the blank island 400 does not contain a light emitting device, the blank structure layer 410 may include a composite insulating layer disposed on the substrate 10 and an inorganic encapsulation layer disposed on a side of the composite insulating layer away from the substrate, the composite insulating layer may include a plurality of inorganic insulating layers, and the inorganic encapsulation layer may include a first inorganic encapsulation layer and a second inorganic encapsulation layer. In an exemplary embodiment, the plurality of inorganic insulating layers may be disposed on the same layer as the first, second, third, and fourth insulating layers in the driving circuit layer in the pixel island 300, and formed at the same time through the same process, and the first and second inorganic encapsulation layers may be disposed on the same layer as the first and second encapsulation layers of the encapsulation layer in the pixel island 300, and formed at the same time through the same process.

In an exemplary embodiment, the substrate may include a first flexible layer on which the display structure layer and the blank structure layer are disposed. The light-transmitting hole may be disposed on the first flexible layer, and a depth of the light-transmitting hole may be less than or equal to a thickness of the first flexible layer.

In an exemplary embodiment, the substrate may include a first flexible layer, a first inorganic layer, and a second flexible layer stacked, and the display structure layer and the blank structure layer are disposed on the second flexible layer. The light-transmitting hole may be disposed on the first flexible layer, and a depth of the light-transmitting hole may be less than or equal to a thickness of the first flexible layer. Alternatively, the light-transmitting holes may be provided on the first flexible layer and the first inorganic layer, and a depth of the light-transmitting holes may be less than or equal to a total thickness of the first flexible layer and the first inorganic layer. Alternatively, the light-transmitting holes may be provided on the first flexible layer, the first inorganic layer, and the second flexible layer, and a depth of the light-transmitting holes may be less than or equal to a total thickness of the first flexible layer, the first inorganic layer, and the second flexible layer.

In an exemplary embodiment, the substrate may include a first flexible layer, a first inorganic layer, a second flexible layer, and a second inorganic layer stacked, and the display structure layer and the blank structure layer are disposed on the second inorganic layer. The light-transmitting hole may be disposed on the first flexible layer, and a depth of the light-transmitting hole may be less than or equal to a thickness of the first flexible layer. Alternatively, the light-transmitting holes may be provided on the first flexible layer and the first inorganic layer, and a depth of the light-transmitting holes may be less than or equal to a total thickness of the first flexible layer and the first inorganic layer. Alternatively, the light-transmitting holes may be provided on the first flexible layer, the first inorganic layer, and the second flexible layer, and a depth of the light-transmitting holes may be less than or equal to a total thickness of the first flexible layer, the first inorganic layer, and the second flexible layer. Alternatively, the light-transmitting holes may be disposed on the first flexible layer, the first inorganic layer, the second flexible layer, and the second inorganic layer, and a depth of the light-transmitting holes may be less than or equal to a total thickness of the first flexible layer, the first inorganic layer, the second flexible layer, and the second inorganic layer.

In an exemplary embodiment, the substrate may include a first flexible layer, a first inorganic layer, a semiconductor layer, a second flexible layer, and a second inorganic layer stacked, and the display structure layer and the blank structure layer are disposed on the second inorganic layer. The light-transmitting hole may be disposed on the first flexible layer, and a depth of the light-transmitting hole may be less than or equal to a thickness of the first flexible layer. Alternatively, the light-transmitting holes may be provided on the first flexible layer and the first inorganic layer, and a depth of the light-transmitting holes may be less than or equal to a total thickness of the first flexible layer and the first inorganic layer. Alternatively, the light-transmitting hole may be provided on the first flexible layer, the first inorganic layer, and the semiconductor layer, and a depth of the light-transmitting hole may be less than or equal to a total thickness of the first flexible layer, the first inorganic layer, and the semiconductor layer. Alternatively, the light transmission hole may be disposed on the first flexible layer, the first inorganic layer, the semiconductor layer, and the second flexible layer, and a depth of the light transmission hole may be less than or equal to a total thickness of the first flexible layer, the first inorganic layer, the semiconductor layer, and the second flexible layer. Alternatively, the light transmission hole may be disposed on the first flexible layer, the first inorganic layer, the semiconductor layer, the second flexible layer, and the second inorganic layer, and a depth of the light transmission hole may be less than or equal to a total thickness of the first flexible layer, the first inorganic layer, the semiconductor layer, the second flexible layer, and the second inorganic layer.

Fig. 9a to 9e are rear views of several light-transmitting display regions according to exemplary embodiments of the disclosure, illustrating a planar structure of a side of the display substrate away from the light-emitting surface. In an exemplary embodiment, the light-transmitting holes 500 are disposed at a side of the substrate 10 facing away from the outgoing light, and the shape and position of the light-transmitting holes 500 substantially correspond to those of the blank island 400.

In an exemplary embodiment, for the light-transmissive display region with a plurality of blank columns as shown in fig. 7a, a plurality of strip-shaped light-transmissive holes 500 may be disposed on the substrate 10 of the light-transmissive display region, each light-transmissive hole 500 extends along the second direction Y (column direction), and the light-transmissive holes 500 are spaced along the first direction X (row direction), as shown in fig. 9 a. The position of each strip-shaped light-transmitting hole 500 corresponds to the position of a blank row on the light-transmitting display area, and the orthographic projection of the blank row on the substrate comprises the orthographic projection of the corresponding strip-shaped light-transmitting hole on the substrate.

In an exemplary embodiment, for a plurality of light-transmitting display regions arranged in a blank row as shown in fig. 7b, a plurality of light-transmitting holes 500 in a stripe shape may be disposed on the substrate 10 of the light-transmitting display region, each light-transmitting hole 500 extending along the first direction X (row direction), and the plurality of light-transmitting holes 500 being spaced along the second direction Y (column direction), as shown in fig. 9 b. The position of each strip-shaped light-transmitting hole 500 corresponds to the position of a blank line on the light-transmitting display area, and the orthographic projection of the blank line on the substrate comprises the orthographic projection of the corresponding strip-shaped light-transmitting hole on the substrate.

In an exemplary embodiment, for the light-transmitting display region in the checkerboard arrangement as shown in fig. 7c, a plurality of block-shaped light-transmitting holes 500 may be disposed on the substrate 10 of the light-transmitting display region, and the plurality of block-shaped light-transmitting holes 500 are disposed at intervals in the first direction X (row direction) and at intervals in the second direction Y (column direction), as shown in fig. 9 c. The position of each block-shaped light-transmitting hole 500 corresponds to the position of a blank island on the light-transmitting display area, and the orthographic projection of the blank island on the substrate comprises the orthographic projection of the corresponding block-shaped light-transmitting hole on the substrate.

In an exemplary embodiment, for the light-transmissive display region arranged as shown in fig. 7d, a grid-shaped light-transmissive holes 500 may be disposed on the substrate 10 of the light-transmissive display region, wherein a portion of the light-transmissive holes 500 extends along the first direction X (row direction) and is spaced along the second direction Y (column direction), and another portion of the light-transmissive holes 500 extends along the second direction Y and is spaced along the first direction X to form a grid shape, as shown in fig. 9 d. The positions of the grid-shaped light holes correspond to the positions of the grid-shaped blank islands on the light-transmitting display area, and the orthographic projection of the grid-shaped blank islands on the substrate comprises the orthographic projection of the grid-shaped light holes on the substrate.

In an exemplary embodiment, for the light-transmitting display region with a plurality of blank columns arranged as shown in fig. 7a, a plurality of light-transmitting hole sets 501 may be disposed on the substrate 10 of the light-transmitting display region, each light-transmitting hole set 501 includes a plurality of strip-shaped light-transmitting holes 500, and the plurality of strip-shaped light-transmitting holes 500 extend along the second direction Y (column direction) and are spaced along the first direction X (row direction), as shown in fig. 9 e. The position of each light-transmitting hole group 501 corresponds to the position of a blank column on the light-transmitting display area, and the orthographic projection of the blank column on the substrate comprises the orthographic projection of the corresponding light-transmitting hole group 501 on the substrate. In an exemplary embodiment, the shape and arrangement of the plurality of light-transmitting holes in the light-transmitting hole group may be set according to actual needs, and the disclosure is not limited herein.

In a display substrate, in order to improve the light transmittance of a light-transmissive display region, the base of the entire light-transmissive display region is usually removed. For example, for a circular light-transmissive display region having a diameter of about 4mm, a light-transmissive hole having a diameter of about 4mm is formed in the substrate of the light-transmissive display region. Research shows that the scheme of completely removing the substrate of the light-transmitting display area enables the display structure of the display sub-pixels in the light-transmitting display area to lose support, the light-transmitting display area with poor support performance can not only cause the deformation of the display structure and reduce the quality of a display picture, but also influence the packaging effect of the display structure, the water and oxygen blocking performance of a packaging layer is reduced, and the service life of the display substrate is shortened.

In the display substrate of the exemplary embodiment of the present disclosure, the light-transmitting holes are only disposed in the blank island region not participating in the image display in the light-transmitting display region, and the light-transmitting holes are not disposed in the pixel island region performing the image display in the light-transmitting display region, that is, the substrate of the pixel island region is retained, not only the light transmittance of the light-transmitting display region is equivalent to the light transmittance of the light-transmitting display region integrally provided with the light-transmitting holes, but also the light transmittance of the light-transmitting display region is ensured, and the substrate retained in the pixel island region provides an effective support for the display structure of the display sub-pixel, thereby avoiding the deformation of the display structure, avoiding the influence on the encapsulation effect, and thus effectively ensuring the quality of the display image and prolonging the service life.

The following is an exemplary description through one manufacturing process of the display substrate. The "patterning process" referred to in the present disclosure includes processes of coating a photoresist, mask exposure, development, etching, stripping a photoresist, and the like, for a metal material, an inorganic material, or a transparent conductive material, and processes of coating an organic material, mask exposure, development, and the like, for an organic material. The deposition can be any one or more of sputtering, evaporation and chemical vapor deposition, the coating can be any one or more of spraying, spin coating and ink-jet printing, and the etching can be any one or more of dry etching and wet etching, and the disclosure is not limited. "thin film" refers to a layer of a material deposited, coated, or otherwise formed on a substrate. The "thin film" may also be referred to as a "layer" if it does not require a patterning process throughout the fabrication process. If the "thin film" requires a patterning process during the entire fabrication process, it is referred to as "thin film" before the patterning process and "layer" after the patterning process. The "layer" after the patterning process comprises at least one "pattern". The term "a and B are disposed on the same layer" in the present disclosure means that a and B are formed simultaneously by the same patterning process, and the "thickness" of the film layer is the dimension of the film layer in the direction perpendicular to the display substrate. In the exemplary embodiments of the present disclosure, the phrase "the orthographic projection of a includes the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary range of the orthographic projection of a, or the boundary of the orthographic projection of a overlaps with the boundary of the orthographic projection of B.

In an exemplary embodiment, taking 2

pixel islands

300 and 1 blank island 400 in a transmissive display area of a display substrate as an example, one fabrication process of the display substrate may include the following operations. Wherein the pixel island 300 includes three display sub-pixels, the pixel driving circuit of each display sub-pixel is exemplified by one transistor and a storage capacitor, and the size of the empty sub-pixel in the blank island 400 is substantially the same as the size of the display sub-pixel in the pixel island 300.

(11) A flexible substrate pattern is formed. In an exemplary embodiment, forming the flexible substrate pattern may include: firstly, coating a first flexible film on a glass carrier plate 1, and forming a first flexible layer 10A after curing and film forming; subsequently depositing a first inorganic thin film on the first flexible layer 10A to form a first inorganic layer 10B; then coating a second flexible film on the first inorganic layer 10B, and curing to form a second flexible layer 10C; a second inorganic thin film is then deposited on the second flexible layer 10C to form a second inorganic layer 10D, completing the fabrication of the substrate 10, as shown in fig. 10.

In an exemplary embodiment, the first flexible layer and the second flexible layer may be made of Polyimide (PI) or a surface-treated polymer film, the first inorganic layer and the second inorganic layer may be made of silicon nitride (SiNx) or silicon oxide (SiOx), and the first inorganic layer and the second inorganic layer may be referred to as a Barrier (Barrier) layer or a Buffer (Buffer) layer.

In an exemplary embodiment, the first and second flexible layers may have a thickness of about 5 μm to 10 μm, and the first and second inorganic layers may have a thickness of about 0.3 μm to 1.0 μm. For example, the first flexible layer may have a thickness of about 8.5 μm, the second flexible layer may have a thickness of about 8.5 μm, the first inorganic layer may have a thickness of about 0.6 μm, and the second inorganic layer may have a thickness of about 0.6 μm.

After the process, the pixel island 300 area and the blank island 400 area both include a substrate 10, and the substrate 10 includes a first flexible layer, a first inorganic layer, a second flexible layer, and a second inorganic layer stacked on the glass carrier 1.

In the exemplary embodiments of the present disclosure, the substrate may include only the first flexible layer, or may include the first flexible layer, the first inorganic layer, and the second flexible layer stacked, or may include other film layers, such as the first flexible layer, the first inorganic layer, the semiconductor layer, the second flexible layer, and the second inorganic layer stacked, which is not limited herein.

(12) Forming a driving circuit layer pattern. In an exemplary embodiment, the driving circuit layer may include a transistor and a storage capacitor constituting the pixel driving circuit. In an exemplary embodiment, the forming of the driving circuit layer pattern may include:

a first insulating film and a semiconductor film are sequentially deposited on the substrate 10, and the semiconductor film is patterned through a patterning process to form a first insulating layer covering the substrate 10 and a semiconductor layer pattern disposed on the first insulating layer, the semiconductor layer pattern being formed in the pixel island 300 region and including at least an active layer in each display sub-pixel. After the process, the semiconductor film in the area of the blank island 400 is etched away to expose the first insulating layer.

Subsequently, a second insulating film and a first metal film are sequentially deposited, the first metal film is patterned through a patterning process to form a second insulating layer covering the semiconductor layer pattern, and a first conductive layer pattern disposed on the second insulating layer, the first conductive layer pattern is formed in the pixel island 300 region and includes at least a gate electrode and a first capacitor electrode in each display sub-pixel, and an orthographic projection of the gate electrode on the substrate is within an orthographic projection range of the active layer on the substrate. After the process, the first metal film in the blank island 400 region is etched away, and the second insulating layer is remained, i.e., the blank island 400 region includes the first insulating layer and the second insulating layer stacked on the substrate 10.

Subsequently, a third insulating film and a second metal film are sequentially deposited, and the second metal film is patterned through a patterning process to form a third insulating layer covering the first conductive layer pattern and a second conductive layer pattern disposed on the third insulating layer, the second conductive layer pattern being formed in the pixel island 300 region and including at least a second capacitor electrode in each display sub-pixel, the second capacitor electrode corresponding to the first capacitor electrode. After the process, the second metal film in the blank island 400 region is etched away, and the third insulating layer is remained, i.e., the blank island 400 region includes the first insulating layer, the second insulating layer, and the third insulating layer stacked on the substrate 10.

And depositing a fourth insulating film, patterning the fourth insulating film through a patterning process to form a fourth insulating layer covering the second conductive layer pattern, forming via holes in the pixel island 300 region, wherein the via holes are respectively located at two ends of the active layer in each display sub-pixel, and the fourth insulating layer, the third insulating layer and the second insulating layer in the via holes are etched to respectively expose the surface of the active layer. After this process, the blank island 400 region includes a first insulating layer, a second insulating layer, a third insulating layer, and a fourth insulating layer stacked on the substrate 10.

Subsequently, a third metal film is deposited, and the third metal film is patterned through a patterning process to form a third conductive layer pattern on the fourth insulating layer, the third conductive layer pattern being formed in the pixel island 300 region and including at least a source electrode and a drain electrode in each display sub-pixel, the source electrode and the drain electrode being connected to the active layer through via holes, respectively. After the process, the third metal film in the blank island 400 region is etched away, and the blank island 400 region includes the first insulating layer, the second insulating layer, the third insulating layer, and the fourth insulating layer stacked on the substrate 10.

And depositing a flat film, patterning the flat film by a patterning process, forming a flat layer covering the third conductive layer pattern in the pixel island 300 area, forming an anode via hole on the flat layer in each display sub-pixel, and removing the flat layer in the anode via hole to expose the surface of the drain electrode. After this process, the flat film in the area of the blank island 400 is removed, and the area of the blank island 400 includes the first insulating layer, the second insulating layer, the third insulating layer, and the fourth insulating layer stacked on the substrate 10.

To this end, the driving circuit layer 102 and the composite insulating layer 202 are prepared separately in the pixel island 300 area and the blank island 400 area, as shown in fig. 11. In an exemplary embodiment, the driving circuit layer 102 may include a transistor and a storage capacitor, the transistor may include an active layer, a gate electrode, a source electrode, and a drain electrode, the storage capacitor may include a first capacitor electrode and a second capacitor electrode, the transistor may be a driving transistor in a pixel driving circuit, and the driving transistor may be a thin film transistor. In an exemplary embodiment, the composite insulation layer 202 may include a first insulation layer, a second insulation layer, a third insulation layer, and a fourth insulation layer stacked.

In example embodiments, the first, second, third, and fourth insulating layers may employ any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, a multi-layer, or a composite layer. The first insulating layer is referred to as a Buffer (Buffer) layer, the second and third insulating layers are referred to as (GI) layers, and the fourth insulating layer is referred to as an interlayer Insulating (ILD) layer. The flat film may be made of an organic material such as resin. The first conductive layer, the second conductive layer, and the third conductive layer may employ a metal material, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or an alloy material of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and may be a single-layer structure, or a multi-layer composite structure, such as Ti/Al/Ti, or the like. The active layer may be made of various materials such as amorphous indium gallium zinc Oxide (a-IGZO), zinc oxynitride (ZnON), indium Zinc Tin Oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), hexathiophene, polythiophene, etc., that is, the present disclosure is applicable to transistors manufactured based on Oxide technology, silicon technology, and organic technology.

In an exemplary embodiment, the display substrate may include a fifth insulating layer, which may cover the third conductive layer pattern, and the planarization layer is disposed on the fifth insulating layer, which is referred to as a Passivation (PVX) layer.

(13) And forming a light emitting structure layer and an encapsulation layer pattern. In an exemplary embodiment, the patterning of the light emitting structure layer may include:

a conductive film is deposited on the substrate on which the aforementioned patterns are formed, and the conductive film is patterned through a patterning process to form an anode pattern, an anode is formed in each display sub-pixel of the pixel island 300 region, and the anode is connected to the drain electrode through an anode via hole. After the process, the conductive film deposited in the blank island 400 region is etched away, and the structure of the blank island 400 region is the same as that after the previous process.

Then, a pixel definition film is coated on the substrate on which the pattern is formed, the pixel definition film is patterned through a patterning process, a pixel definition layer pattern is formed in the pixel island 300 area, a pixel opening is formed in the pixel definition layer in each display sub-pixel, the pixel definition layer in the pixel opening is removed, and the surface of the anode is exposed. After the process, the pixel definition film coated on the blank island 400 region is removed, and the structure of the blank island 400 region is the same as that after the previous process.

Subsequently, on the substrate on which the aforementioned pattern is formed, an organic light emitting layer pattern is formed in the pixel island 300 region by an evaporation method or an inkjet printing method, and the organic light emitting layer located in each display sub-pixel is connected to the anode through a pixel opening. After this process, the structure of the blank island 400 area is the same as that after the previous process.

Subsequently, on the substrate on which the aforementioned pattern is formed, a cathode pattern is formed by evaporation, the cathode is formed in the pixel island 300 area and connected with the organic light emitting layer in each display sub-pixel, and the cathode may be an integral structure connected together. After this process, the structure of the blank island 400 area is the same as that after the previous process.

Then, on the substrate with the patterns, a first packaging film is deposited first, and a first packaging layer is formed in the pixel island 300 and the blank island 400 areas; then, ink-jet printing is carried out on the organic packaging material on the first packaging layer 31 in the pixel island 300 area by using an ink-jet printing process, and after curing and film forming, an organic packaging layer is formed; a second encapsulation film is then deposited to form a second encapsulation layer in the pixel island 300 and blank island 400 areas. The first encapsulation layer, the organic encapsulation layer and the second encapsulation layer of the pixel island 300 region constitute an encapsulation layer, and the first encapsulation layer as the first inorganic encapsulation layer and the second encapsulation layer as the second inorganic encapsulation layer of the blank island 400 region constitute an inorganic encapsulation layer.

To this end, patterns of the light emitting structure layer 103 and the encapsulation layer 104 are prepared, the pixel island 300 region includes the display structure layer 310 disposed on the substrate 10, the blank island 400 region includes the blank structure layer 410 disposed on the substrate 10, the display structure layer 310 includes the driving circuit layer 102, the light emitting structure layer 103 and the encapsulation layer 104, and the blank structure layer 410 includes the composite insulating layer 202 and the inorganic encapsulation layer, as shown in fig. 12.

In an exemplary embodiment, the conductive thin film may be a metal material including any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or an alloy material of the above metals, or a transparent conductive material including Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO). In exemplary embodiments, the conductive thin film may be a single layer structure, or a multi-layer composite structure such as ITO/Al/ITO, etc.

In an exemplary embodiment, the pixel defining layer may employ polyimide, acryl, or polyethylene terephthalate, or the like. The shape of the pixel opening in a plane parallel to the display substrate may be triangular, rectangular, polygonal, circular, or elliptical, etc. The cross-sectional shape of the pixel opening in a plane perpendicular to the display substrate may be rectangular, trapezoidal, or the like.

In an exemplary embodiment, the first encapsulation layer and the second encapsulation layer may be one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, a multilayer, or a composite layer, the organic encapsulation layer may be a resin material, a stacked structure of inorganic material/organic material/inorganic material is formed in the pixel island 300 region, the organic material layer is disposed between the two inorganic material layers, and a stacked structure of inorganic material/inorganic material is formed in the blank island 400 region, so that it may be ensured that external moisture cannot enter the light emitting structure layer.

In an exemplary embodiment, after the encapsulation layer is prepared, a touch structure layer (TSP) may be formed on the encapsulation layer in the area of the pixel island 300, and the touch structure layer may include a touch electrode layer, or a touch electrode layer and a touch insulation layer. In an exemplary embodiment, after the encapsulation layer or the touch structure layer is formed, a film layer such as a polarizer may be attached to the display substrate, which is not limited herein.

(14) And stripping the glass carrier plate. In an exemplary embodiment, peeling the glass carrier plate may include: the glass carrier and the display substrate are peeled off by a peeling process, as shown in fig. 13.

In an exemplary embodiment, the lift-off process may employ a laser lift-off process. The laser stripping process is to scan the back of the glass carrier (the side of the glass carrier not provided with the display substrate) by using high-energy laser beams emitted by laser equipment to denature the film layer of the flexible substrate and reduce the adhesion performance so as to destroy the adhesive force of the contact surface between the flexible substrate and the glass carrier, and then strip the display substrate from the hard glass carrier by using physical means such as lifting, drawing, cutting and the like. In an exemplary embodiment, the stripping process may adopt a mechanical stripping manner, and the disclosure is not limited herein.

(15) And attaching the back film. In an exemplary embodiment, attaching the back film may include: the back film 2 is attached to the back surface of the display substrate by an attaching process, as shown in fig. 14.

In an exemplary embodiment, the attaching process may adopt a roller attaching manner, the lower table fixes the display substrate, the upper table fixes the back film, the lower table 1 and the upper table are turned over and then oppositely covered, and the back film and the display substrate are attached to each other into a whole by applying a rolling force to the back film through a rolling mechanism.

In an exemplary embodiment, the back film may include one or more film layers of an organic material to protect the display substrate from scratches. In an exemplary embodiment, the thickness of the back film may be about 30 μm to 100 μm. For example, the backing film may be about 38 μm, or 75 μm thick.

In an exemplary embodiment, a heat dissipation film (scftape) may be attached to a side of the back film away from the display substrate, and the disclosure is not limited thereto.

(16) Forming a light hole. In an exemplary embodiment, the forming of the light transmission hole may include: laser irradiation is performed from the side of the back film 2 away from the display substrate, the back film 2 and the substrate 10 are removed in the blank island 400 area, and a pattern of light-transmitting holes 500 is formed, as shown in fig. 15a to 15 e.

In an exemplary embodiment, the laser irradiation process may use a nanosecond solid-state ultraviolet laser, the wavelength is about 355nm, the single photon energy is higher, the material absorption rate is higher, the generated thermal influence is smaller, the focused light spot may be only ten microns or more, and higher processing precision can be achieved. The pulse ultraviolet laser cutting utilizes the physical principle of light, and when the single photon energy of the laser is lower than the chemical bond energy of the material, the single photon energy of the laser exceeds the gasification threshold of the material by means of the very high energy density at a focusing light spot, so that the material is gasified instantly, and the material is removed.

In an exemplary embodiment, the position of the light-transmissive holes 500 corresponds to the position of the blank islands 400, and the orthographic projection of the blank islands 400 on the plane of the display substrate includes the orthographic projection of the light-transmissive holes 500 on the plane of the display substrate.

In an exemplary embodiment, the depth H of the light-transmitting hole 500 may be controlled by adjusting the laser energy and the irradiation time, thereby adjusting the transmittance of the light-transmitting display region. For example, the depth H of the light-transmissive hole 500 may be less than or equal to the thickness of the first flexible layer, as shown in fig. 15 a. For another example, the depth H of the light-transmitting hole 500 may be less than or equal to the total thickness of the first flexible layer and the first inorganic layer, as shown in fig. 15 b. As another example, the depth H of the light-transmitting hole 500 may be greater than the total thickness of the first flexible layer and the first inorganic layer, but less than the total thickness of the first flexible layer, the first inorganic layer, and the second flexible layer, as shown in fig. 15 c. As another example, the depth H of the light-transmitting hole 500 may be equal to the total thickness of the first flexible layer, the first inorganic layer, and the second flexible layer, as shown in fig. 15 d. As another example, the depth H of the light-transmitting hole 500 may be greater than the total thickness of the first flexible layer, the first inorganic layer, and the second flexible layer, but less than the total thickness of the first flexible layer, the first inorganic layer, the second flexible layer, and the second inorganic layer, as shown in fig. 15 e.

In the display substrate, light holes are formed by a patterning process during substrate preparation, and then corresponding structural film layers are formed. Because the light hole pattern formed first has a step difference and the support of the substrate becomes poor, the formation quality of the subsequent film layer is reduced and the display quality is reduced.

According to the structure and the preparation process of the display substrate of the exemplary embodiment of the disclosure, the substrate and the corresponding film layer are formed on the glass carrier plate, and then the light hole is formed after the back film is attached, so that the flatness of the substrate is ensured, the substrate can provide good support, the formation quality of the subsequent film layer is improved, and the display quality is improved.

This is disclosed through forming the light trap in the blank island region in printing opacity display area, and keeps the regional basement of pixel island in printing opacity display area, has not only guaranteed the holistic high luminousness in printing opacity display area, and the regional basement that keeps of pixel island provides effectual support for the display structure who shows sub-pixel moreover, has avoided the display structure to warp, has avoided influencing the encapsulation effect, therefore has effectively guaranteed display picture quality and life.

The preparation method disclosed by the invention can be well compatible with the existing preparation process, is simple in process implementation, easy to implement and high in production efficiency, and has the advantages of easiness in process implementation, low production cost, high yield and the like.

Fig. 16 to 19 are another manufacturing process of a display substrate according to an exemplary embodiment of the present disclosure. In an exemplary embodiment, another process of manufacturing a display substrate may include the following operations.

(21) A release layer pattern is formed. In an exemplary embodiment, forming the peeling layer pattern may include: a release film is deposited on the glass carrier 1, and the release film is patterned by a patterning process to form a plurality of release layer 90 patterns on the glass carrier 1, wherein the plurality of release layer 90 patterns are disposed in the blank island 400 region, as shown in fig. 16. After the process, the peeling film in the pixel island 300 region is etched away to expose the glass carrier 1. In an exemplary embodiment, the peeling layer 90 is configured to form a light-transmitting hole on a subsequently formed substrate.

In an exemplary embodiment, the release film may be made of a material having a high adhesive force with the glass carrier and the flexible layer to be formed later, so as to ensure that the release layer can be peeled off together with the glass carrier when the glass carrier is peeled later. For example, amorphous silicon (a-Si) material may be used for the lift-off film.

In an exemplary embodiment, the width of the exfoliation layer may be less than or equal to the width of the blank islands 400, i.e. the orthographic projection of the blank islands 400 on the glass support plate comprises the orthographic projection of the exfoliation layer 90 on the glass support plate.

(22) Forming a substrate pattern. In an exemplary embodiment, the forming of the base pattern may include: a first flexible film is coated on the glass carrier 1 with the pattern formed thereon, and a first flexible layer 10A covering the release layer 90 is formed after curing and film forming, as shown in fig. 17. The first flexible layer 10A covering the peeling layer 90 may comprise two parts, one part of the first flexible layer 10A being provided on the glass carrier plate 1 as the substrate 10 and the other part of the first flexible layer 10A being provided on the peeling layer 90 as the peeling substrate 91, i.e. the area at the side of the peeling layer 90 remote from the glass carrier plate 1 as the peeling area, the first flexible layer in the peeling area being the peeling substrate 91. After this process, the pixel island 300 region includes the first flexible layer 10A as the substrate 10, and the blank island 400 region includes the peeling layer 90 and the peeling substrate 91 provided on the peeling layer 90.

In an exemplary embodiment, the material of the first flexible layer may be Polyimide (PI) or a surface-treated polymer film.

In an exemplary embodiment, the thickness of the peeling layer may be set according to parameters such as the thickness of the first flexible layer (the depth of the formed light-transmitting hole) and the adhesion of the peeling layer to the glass carrier and the first flexible layer. In an exemplary embodiment, the thickness of the peeling layer may be about 0.3 μm to 1.0 μm.

(23) The display structure layer 310 is formed in the pixel island 300 area, the blank structure layer 410 is formed in the blank island 400 area, the display structure layer 310 may include the driving circuit layer 102, the light emitting structure layer 103 and the encapsulation layer 104, which are sequentially formed, the driving circuit layer may include a transistor and a storage capacitor constituting a pixel driving circuit, and the blank structure layer 410 may include a composite insulating layer and an inorganic encapsulation layer, which are sequentially formed, as shown in fig. 18.

In an exemplary embodiment, the process of forming the display structure layer and the blank structure layer may be the same as steps (12) to (13) in the foregoing embodiment, and details are not repeated here.

(24) And forming a light-transmitting hole pattern when the glass carrier plate is stripped. In an exemplary embodiment, forming the light transmission hole pattern when peeling the glass carrier plate may include: the boundary area between the substrate 10 and the release substrate 91 is irradiated with laser through the glass carrier 1, and the link bond of the first flexible layer in the boundary area is cut off by the laser irradiation. Subsequently, the glass carrier 1 is peeled from the substrate 10 by a laser lift-off process. When the glass carrier 1 is peeled off, since the adhesion between the peeling layer 90 and the glass carrier 1 and the adhesion between the peeling layer 90 and the peeling substrate 91 are large and larger than the connection force between the substrate 10 and the peeling substrate 91, the glass carrier 1 drives the peeling layer 90 and the peeling substrate 91 thereon to peel off together, and the light transmission hole 500 is formed on the substrate 10, and the depth of the light transmission hole 500 is about the thickness of the first flexible layer 10A, as shown in fig. 19.

In an exemplary embodiment, the polyimide PI comprises a polymer with imide ring (-CO-NH-CO-) on the main chain, and the laser irradiation can be used for cutting off the link bond of the PI film by adopting the photochemical principle, and the laser single photon energy reaches or exceeds the material chemical bond energy to break the main chain of the material. For example, in the chemical bond structure of the PI film, the bond energy of a C-C bond and a C-N bond in a normal state is 3.45eV and 3.17eV respectively, the single photon energy of a 355nm ultraviolet laser cutting device is 3.49eV, and the chemical bond of the material can be directly destroyed by being higher than the bond energy of the C-C bond and the C-N bond in the normal state.

In an exemplary embodiment, after the glass carrier is peeled to form the light transmission holes, a high transparent material may be filled in the light transmission holes by using a coating or inkjet printing method, and the high transparent material may be polyethylene terephthalate (PET) or the like.

In an exemplary embodiment, the manufacturing process of the display substrate may include processes of attaching a back film, cutting, and the like, and the disclosure is not limited thereto.

A display substrate is characterized in that light holes are formed through a patterning process when a substrate is prepared, and then corresponding structural film layers are formed. Because the light hole pattern formed first has a step difference and the support of the substrate becomes poor, the formation quality of the subsequent film layer is reduced and the display quality is reduced. According to the embodiment of the disclosure, the stripping layer is formed on the glass carrier plate firstly, then the substrate and the corresponding film layer are formed, and then the stripping layer is utilized to form the light hole in the stripping process, so that not only is the smoothness of the substrate ensured, but also the substrate can provide good support, the formation quality of the subsequent film layer is improved, and the display quality is improved.

In order to improve the film quality of the display substrate, the display substrate is prepared, and then the light holes are formed on the substrate in a manner of forming holes on the substrate by adopting a laser process. The light holes formed by the laser process have the phenomena of irregular boundaries, uneven inner walls, large depth difference of the light holes and the like, so that the optical performance of the sensor is influenced. The light transmission holes are formed by the stripping layer, have the advantages of being neat in boundary, flat in inner wall, uniform in depth of the light transmission holes and the like, light transmission performance of the light transmission holes is improved, and improvement of optical performance of the sensor is facilitated.

Fig. 20 to 23 are still another manufacturing process of a display substrate according to an exemplary embodiment of the present disclosure. In an exemplary embodiment, yet another manufacturing process of the display substrate may include the following operations.

(31) A release layer pattern is formed as shown in fig. 20. In an exemplary embodiment, a process of forming a peeling layer pattern may be the same as the previous embodiment, and a material and a structure of the peeling layer may be the same as the previous embodiment.

(32) A base pattern is formed. In an exemplary embodiment, the forming of the base pattern may include: the glass carrier 1 with the pattern is coated with a first flexible film, and after curing and film forming, a first flexible layer 10A covering the release layer 90 is formed. Subsequently, a first inorganic film is deposited and patterned by a patterning process to form a first inorganic layer 10B, wherein inorganic openings are formed on the first inorganic layer 10B and located in the blank island 400 region, and an orthographic projection of the inorganic openings on the glass carrier includes an orthographic projection of the peeling layer 90 on the glass carrier. Subsequently, a second flexible film is coated, and a second flexible layer 10C is formed after curing to form a film, the second flexible layer 10C fills the inorganic opening on the first inorganic layer 10B, and the second flexible layer 10C in the inorganic opening is in direct contact with the first flexible layer 10A. Subsequently, a second inorganic thin film is deposited to form a second inorganic layer 10D, completing the preparation of the substrate 10, as shown in fig. 21.

In an exemplary embodiment, the first flexible layer 10A and the second flexible layer 10C positioned above the peeling layer 90 may include two parts, the first flexible layer 10A, the first inorganic layer 10B, the second flexible layer 10C, and the second inorganic layer 10D provided on the glass carrier sheet 1 as the substrate 10, and the first flexible layer 10A and the second flexible layer 10C provided on the peeling layer 90 as the peeling substrate 91.

In an exemplary embodiment, the material of the first flexible layer and the second flexible layer may be Polyimide (PI) or a surface-treated polymer film.

(33) A display structure layer 310 is formed in the pixel island 300 region and a blank structure layer 410 is formed in the blank island 400 region, as shown in fig. 22. In an exemplary embodiment, the related process may be the same as the previous embodiment.

(34) And forming a light-transmitting hole pattern when the glass carrier plate is stripped. In an exemplary embodiment, forming the light transmission hole pattern when peeling the glass carrier may include: the boundary area between the substrate 10 and the release substrate 91 is irradiated with laser through the glass carrier 1, and the link bond between the first flexible layer and the second flexible layer in the boundary area is cut by the laser irradiation. Subsequently, the glass carrier 1 is peeled from the substrate 10 by a laser lift-off process. When the glass carrier 1 is peeled, since the adhesion between the peeling layer 90 and the glass carrier 1 and the adhesion between the peeling layer 90 and the peeling substrate 91 are relatively large and larger than the bonding force between the substrate 10 and the peeling substrate 91, the glass carrier 1 drives the peeling layer 90 and the peeling substrate 91 on which the peeling layer 90 drives to peel off together, and the light-transmitting hole 500 is formed on the substrate 10, and the depth of the light-transmitting hole 500 is about the sum of the thicknesses of the first flexible layer 10A, the first inorganic layer 10B and the second flexible layer 10C, as shown in fig. 23.

According to the embodiment of the disclosure, the stripping layer is formed on the glass carrier plate firstly, then the substrate and the corresponding film layer are formed, and then the stripping layer is utilized to form the light hole in the stripping process, so that not only is the smoothness of the substrate ensured, but also the substrate can provide good support, the formation quality of the subsequent film layer is improved, and the display quality is improved. The light transmission holes are formed by the stripping layer, the light transmission holes have the advantages of being neat in boundary, flat in inner wall, uniform in depth of the light transmission holes and the like, light transmission performance of the light transmission holes is improved, and improvement of optical performance of the sensor is facilitated.

It should be noted that the structure and the manufacturing process thereof shown in the exemplary embodiment of the present disclosure are only an exemplary illustration, and the corresponding structure may be changed and the patterning process may be increased or decreased according to actual needs, and the present disclosure is not limited herein.

The exemplary embodiment of the present disclosure also provides a method for manufacturing a display substrate, where the display substrate includes a normal resolution display area and a low resolution display area, and a resolution of the low resolution display area is smaller than a resolution of the normal resolution display area; the low-resolution display area comprises a light-transmitting display area and a non-light-transmitting display area positioned at the periphery of the light-transmitting display area; the light-transmitting display area comprises a pixel area and a blank area, the pixel area comprises a plurality of pixel islands configured to display a picture, and the blank area comprises a plurality of blank islands configured to transmit light; in an exemplary embodiment, the preparation method may include:

s1, forming a display structure layer arranged on a substrate in a pixel area, and forming a blank structure layer arranged on the substrate in a blank area; the display structure layer comprises a light emitting device;

s2, forming light holes in the substrate; the orthographic projection of the light-transmitting holes on the plane of the display substrate and the orthographic projection of the light-emitting devices on the plane of the display substrate have no overlapping area.

In an exemplary embodiment, the plurality of pixel islands form a plurality of display columns, the plurality of blank islands form a plurality of blank columns, and the display columns and the blank columns are alternately arranged in a row direction; step S2 may include:

forming a light-transmissive hole on a substrate, comprising: the method comprises the steps that a plurality of strip-shaped light holes extending along the column direction are formed in a substrate, the strip-shaped light holes are arranged at intervals in the row direction, and the orthographic projection of a blank column on a display substrate plane comprises the orthographic projection of the strip-shaped light holes on the display substrate plane.

In an exemplary embodiment, the plurality of pixel islands form a plurality of display rows, the plurality of blank islands form a plurality of blank rows, and the display rows and the blank rows are alternately arranged in the column direction; step S2 may include:

the display substrate comprises a substrate, a plurality of strip-shaped light holes extending along the row direction are formed in the substrate, the strip-shaped light holes are arranged at intervals in the column direction, and the orthographic projection of the blank row on the plane of the display substrate comprises the orthographic projection of the strip-shaped light holes on the plane of the display substrate.

In an exemplary embodiment, the plurality of pixel islands are alternately arranged in the row direction and the column direction, and the plurality of blank islands are alternately arranged in the row direction and the column direction; step S2 may include:

and a plurality of block-shaped light holes are formed in the substrate, the block-shaped light holes are arranged at intervals in the row direction and the column direction, and the orthographic projection of the blank island on the plane of the display substrate comprises the orthographic projection of the block-shaped light holes on the plane of the display substrate.

In an exemplary embodiment, step S2 may include:

stripping the glass carrier plate from the substrate;

attaching a back film to one side of the substrate, which is far away from the display structure layer and the blank structure layer;

In an exemplary embodiment, the forming a blank structure layer disposed on the substrate in the blank region in step S1 may include:

forming a stripping layer on a glass carrier plate;

forming a first flexible layer, wherein the first flexible layer positioned on one side of the stripping layer away from the glass carrier plate is used as a stripping substrate, and the first flexible layers in other areas are used as substrates;

forming a blank structure layer on the substrate;

in an exemplary embodiment, step S2 may include:

irradiating the first flexible layer of the interface area of the substrate and the stripped substrate by laser through the glass carrier plate;

forming a stripping layer on a glass carrier plate;

sequentially forming a first flexible layer, a first inorganic layer and a second flexible layer; an inorganic opening is arranged on the first inorganic layer, the orthographic projection of the inorganic opening on the glass support plate comprises the orthographic projection of the stripping layer on the glass support plate, and the second flexible layer fills the inorganic opening; the first flexible layer and the second flexible layer which are positioned on one side of the stripping layer away from the glass carrier plate are used as stripping substrates, and the first flexible layer, the first inorganic layer and the second flexible layer in other areas are used as substrates;

forming a blank structure layer on the substrate;

in an exemplary embodiment, step S2 may include:

and peeling the glass carrier plate from the substrate, wherein the glass carrier plate drives the peeling layer and the peeling substrate to peel together, and a light hole is formed in the substrate.

In the exemplary embodiment, the structure, material, related parameters and detailed preparation process of each film layer have been described in detail in the foregoing embodiments, and are not described herein again.

The exemplary embodiments of the present disclosure also provide a display device including the display substrate of the foregoing embodiments. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

Although the embodiments disclosed in the present disclosure are described above, the descriptions are only for the convenience of understanding the present disclosure, and are not intended to limit the present disclosure. It will be understood by those skilled in the art of the present disclosure that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure, and that the scope of the present disclosure shall be limited only by the terms of the appended claims.

Claims

A display substrate comprises a normal resolution display area and a low resolution display area, wherein the resolution of the low resolution display area is smaller than that of the normal resolution display area; the low-resolution display area comprises a light-transmitting display area and a non-light-transmitting display area positioned on the periphery of the light-transmitting display area; the light-transmitting display area comprises a pixel area and a blank area, the pixel area comprises a plurality of pixel islands configured to display a picture, and the blank area comprises a plurality of blank islands configured to transmit light; in a plane vertical to the display substrate, the pixel island comprises a display structure layer arranged on one side of the substrate facing the emergent light, the display structure layer at least comprises a light-emitting device, and the blank island comprises a blank structure layer arranged on one side of the substrate facing the emergent light and a light hole arranged on the substrate; the orthographic projection of the light-transmitting holes on the plane of the display substrate and the orthographic projection of the light-emitting devices on the plane of the display substrate have no overlapping area.
The display substrate of claim 1, wherein the orthographic projection of the blank islands on the plane of the display substrate comprises orthographic projection of the light-transmissive holes on the plane of the display substrate.
The display substrate of claim 1, wherein the plurality of pixel islands form a plurality of display columns, the plurality of blank islands form a plurality of blank columns, and the display columns and the blank columns are alternately arranged in a row direction; the light trap is the strip light trap that extends along the direction of being listed as, a plurality of strip light traps interval sets up in the direction of being listed as, blank orthographic projection of being listed as on the display substrate plane contains the orthographic projection of strip light trap on the display substrate plane.
The display substrate according to claim 1, wherein the plurality of pixel islands form a plurality of display rows, the plurality of blank islands form a plurality of blank rows, and the display rows and the blank rows are alternately arranged in a column direction; the light trap is the strip light trap that extends along the line direction, a plurality of strip light traps interval sets up in the direction of being listed as, blank line orthographic projection on the display substrate plane contains the orthographic projection of strip light trap on the display substrate plane.
The display substrate according to claim 1, wherein the plurality of pixel islands are alternately arranged in a row direction and a column direction, and the plurality of blank islands are alternately arranged in the row direction and the column direction; the light holes are block-shaped light holes, the block-shaped light holes are arranged at intervals in the row direction and the column direction, and the orthographic projection of the blank island on the plane of the display substrate comprises the orthographic projection of the block-shaped light holes on the plane of the display substrate.
The display substrate according to any one of claims 1 to 5, wherein the pixel island includes a plurality of display sub-pixels, a display structure layer of at least one display sub-pixel includes a driving circuit layer disposed on the substrate, a light emitting structure layer disposed on the driving circuit layer, and an encapsulation layer disposed on the light emitting structure layer, the driving circuit layer includes a transistor and a storage capacitor constituting a pixel driving circuit, the light emitting structure layer includes an anode, an organic light emitting layer, and a cathode constituting the light emitting device; the blank island comprises a plurality of blank sub-pixels, and the blank structure layer of at least one blank sub-pixel comprises a composite insulating layer arranged on the substrate and an inorganic packaging layer arranged on the composite insulating layer.
The display substrate of any one of claims 1 to 5, wherein the base comprises a first flexible layer, and the light-transmitting hole is disposed on a side of the base away from the blank structure layer; the depth of the light hole is smaller than or equal to the thickness of the first flexible layer.
The display substrate according to any one of claims 1 to 5, wherein the substrate comprises a first flexible layer, a first inorganic layer and a second flexible layer which are stacked, and the light transmission hole is arranged on one side of the substrate away from the blank structure layer; the depth of the light-transmitting hole is smaller than or equal to the thickness of the first flexible layer, or the depth of the light-transmitting hole is smaller than or equal to the total thickness of the first flexible layer and the first inorganic layer, or the depth of the light-transmitting hole is smaller than or equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer.
The display substrate according to any one of claims 1 to 5, wherein the substrate comprises a first flexible layer, a first inorganic layer, a second flexible layer and a second inorganic layer which are stacked, and the light transmission hole is arranged on a side of the substrate away from the blank structure layer; the depth of the light transmission hole is less than or equal to the thickness of the first flexible layer, or the depth of the light transmission hole is less than or equal to the total thickness of the first flexible layer and the first inorganic layer, or the depth of the light transmission hole is less than or equal to the total thickness of the first flexible layer, the first inorganic layer and the second flexible layer, or the depth of the light transmission hole is less than or equal to the total thickness of the first flexible layer, the first inorganic layer, the second flexible layer and the second inorganic layer.
A display device comprising the display substrate of any one of claims 1 to 9.
A preparation method of a display substrate comprises a normal resolution display area and a low resolution display area, wherein the resolution of the low resolution display area is smaller than that of the normal resolution display area; the low-resolution display area comprises a light-transmitting display area and a non-light-transmitting display area positioned on the periphery of the light-transmitting display area; the light-transmitting display area comprises a pixel area and a blank area, the pixel area comprises a plurality of pixel islands configured to display a picture, and the blank area comprises a plurality of blank islands configured to transmit light; the preparation method comprises the following steps:

forming a display structure layer arranged on the substrate in the pixel region, and forming a blank structure layer arranged on the substrate in the blank region; the display structure layer at least comprises a light emitting device;

forming a light-transmitting hole on a substrate; the orthographic projection of the light-transmitting hole on the plane of the display substrate and the orthographic projection of the light-emitting device on the plane of the display substrate have no overlapping area.
The manufacturing method according to claim 11, wherein the plurality of pixel islands form a plurality of display columns, the plurality of blank islands form a plurality of blank columns, and the display columns and the blank columns are alternately arranged in a row direction;

forming a light transmissive hole on a substrate, comprising: the method comprises the steps that a plurality of strip-shaped light holes extending along the column direction are formed in a substrate, the strip-shaped light holes are arranged at intervals in the row direction, and the orthographic projection of a blank column on a display substrate plane comprises the orthographic projection of the strip-shaped light holes on the display substrate plane.
The manufacturing method according to claim 11, wherein the plurality of pixel islands form a plurality of display lines, the plurality of blank islands form a plurality of blank lines, and the display lines and the blank lines are alternately arranged in a column direction;

forming a light-transmissive hole on a substrate, comprising: the display substrate comprises a substrate, a plurality of strip-shaped light holes extending along the row direction are formed in the substrate, the strip-shaped light holes are arranged at intervals in the column direction, and the orthographic projection of the blank row on the plane of the display substrate comprises the orthographic projection of the strip-shaped light holes on the plane of the display substrate.
The manufacturing method according to claim 11, wherein the plurality of pixel islands are alternately arranged in a row direction and a column direction, and the plurality of blank islands are alternately arranged in the row direction and the column direction;

forming a light transmissive hole on a substrate, comprising: and forming a plurality of block-shaped light holes on the substrate, wherein the block-shaped light holes are arranged at intervals in the row direction and the column direction, and the orthographic projection of the blank island on the plane of the display substrate comprises the orthographic projection of the block-shaped light holes on the plane of the display substrate.
The production method according to any one of claims 11 to 14, wherein forming the light-transmitting hole on the substrate includes:

stripping the glass carrier plate from the substrate;

attaching a back film to one side of the substrate far away from the display structure layer and the blank structure layer;

and irradiating one side of the back film, which is far away from the substrate, by adopting laser to form the light hole.
The production method according to any one of claims 11 to 14,

forming a blank structure layer arranged on the substrate in the blank area, comprising:

forming a stripping layer on a glass carrier plate;

forming a first flexible layer covering the stripping layer, wherein the first flexible layer positioned on one side of the stripping layer away from the glass carrier plate is used as a stripping substrate, and the first flexible layer in other areas is used as a substrate;

forming a blank structure layer on the substrate;

forming a light-transmissive hole on a substrate, comprising:

irradiating the first flexible layer of the interface area of the substrate and the stripped substrate by laser through the glass carrier plate;

and peeling the glass carrier plate and the substrate, wherein the glass carrier plate drives the peeling layer and the peeling substrate to peel together, and a light hole is formed on the substrate.
The production method according to any one of claims 11 to 14,

forming a blank structure layer disposed on the substrate in the blank region, including:

forming a stripping layer on a glass carrier plate;

sequentially forming a first flexible layer, a first inorganic layer and a second flexible layer; an inorganic opening is arranged on the first inorganic layer, the orthographic projection of the inorganic opening on the glass carrier plate comprises the orthographic projection of the stripping layer on the glass carrier plate, and the second flexible layer fills the inorganic opening; the first flexible layer and the second flexible layer which are positioned on one side of the stripping layer away from the glass carrier plate are used as stripping substrates, and the first flexible layer, the first inorganic layer and the second flexible layer in other areas are used as substrates;

forming a blank structure layer on the substrate;

forming a light-transmissive hole on a substrate, comprising:

irradiating the first flexible layer and the second flexible layer of the interface area of the substrate and the stripped substrate by laser through the glass carrier plate;

and peeling the glass carrier plate and the substrate, wherein the glass carrier plate drives the peeling layer and the peeling substrate to peel together, and a light hole is formed on the substrate.