CN115602199A

CN115602199A - Hard disk magnetic head, preparation method thereof and hard disk

Info

Publication number: CN115602199A
Application number: CN202211183107.5A
Authority: CN
Inventors: 李腾飞; 彭德利; 郑泉水
Original assignee: Tsinghua University; Shenzhen Research Institute Tsinghua University
Current assignee: Tsinghua University; Shenzhen Research Institute Tsinghua University
Priority date: 2022-09-27
Filing date: 2022-09-27
Publication date: 2023-01-13

Abstract

The embodiment of the application discloses a hard disk magnetic head, a preparation method thereof and a hard disk, wherein the preparation method comprises the following steps: processing the ultra-smooth base material to obtain an inner groove for embedding the magnetic sensing element; and placing the magnetic sensing element in the inner groove to obtain the hard disk magnetic head comprising the ultra-smooth base material and the magnetic sensing element, wherein the magnetic sensing element has a magnetic field electric effect under the action of a magnetic field of a magnetic disk. With adhere to super smooth gasket in magnetic sensing element below to the realization compares to the traditional scheme of high regulation and control of flying, this application need not the flow of preparation and bonding traditional super smooth gasket etc. and the operation process is simple and convenient and easily realize large-scale integrated manufacturing. The magnetic sensor is embedded in the ultra-smooth substrate to manufacture the hard disk magnetic head, so that the hard disk magnetic head and the magnetic disk can be in close-range and wear-free direct contact, the head-disk distance is effectively reduced, parallel sliding of the magnetic sensor on the upper surface of the magnetic disk can be realized, and the storage density of the magnetic disk and the read-write speed of the hard disk magnetic head are effectively improved.

Description

Hard disk magnetic head, preparation method thereof and hard disk

Technical Field

The embodiment of the application relates to the technical field of storage equipment, in particular to a hard disk magnetic head, a manufacturing method thereof and a hard disk.

Background

With the continuous development of information technology, people have higher and higher requirements on the storage capacity of a hard disk and the read-write efficiency of the hard disk. At present, magnetic head sliders (sliders) are mostly used for supporting read-write heads to form the whole front end structure of a magnetic head arm, namely, a commonly-known hard disk magnetic head, so that the magnetic head is suspended above a disk body of a magnetic disk to perform read-write at a height of several nanometers (flying height, which can be referred to as flying height for short), and the magnetic field intensity shows secondary attenuation along with the increase of the distance between the magnetic head and a magnetic medium when magnetic information is read and written.

When a traditional hard disk magnetic head reads and writes data, a rotary motor drives a magnetic disk to rotate at a high speed, airflow on the surface of the disk changes, the magnetic head is suspended (equivalent to flying) on the upper surface of the disk under the action of the airflow and the supporting action of an ultra-smooth gasket attached to the lower part, and a voice coil motor drives the magnetic head to move above the rotating disk through a magnetic head arm, so that the read-write head can read and write data on different magnetic tracks (which can be regarded as circles with different radiuses on the disk).

In order to improve the storage density of the hard disk and ensure fast and accurate reading and writing of magnetic information on the disk, the requirement of the direct distance between the read-write head and the disk is smaller and better, but the flying height is difficult to further reduce based on the existing structure, and meanwhile, in order to maintain the lower flying height, higher aerodynamic force regulation and control difficulty and processing requirement are generated.

Therefore, there is a need to provide an effective solution to the above technical problems.

Disclosure of Invention

The embodiment of the application provides a hard disk magnetic head, a preparation method thereof and a hard disk, which are used for improving the read-write efficiency of the hard disk magnetic head.

A first aspect of an embodiment of the present application provides a hard disk magnetic head, including: a super-slip base material and a magnetic sensor element;

an inner groove is formed in the ultra-smooth base material;

the magnetic sensing element is arranged in the inner groove, and the magnetic sensing element has a magnetic field electric effect under the action of a magnetic field of a magnetic disk.

A second aspect of the embodiments of the present application provides a method for manufacturing a hard disk magnetic head, including:

processing the ultra-smooth base material to obtain an inner groove for embedding the magnetic sensing element;

placing the magnetic sensor element in the inner recess to obtain a hard disk head as described in the first aspect above.

A hard disk provided in a third aspect of an embodiment of the present application includes a magnetic disk, a head arm, and the hard disk head described in the first aspect or the second aspect, where an upper surface of the magnetic disk is coated with a lubricating layer; the head arm is connected to one end of the magnetic disk head.

According to the technical scheme, the embodiment of the application has at least the following advantages:

with adhere to super smooth gasket in magnetic sensing element below to the realization compares to the traditional scheme of high regulation and control of flying, this application need not the flow of preparation and bonding traditional super smooth gasket etc. and the operation process is simple and convenient and easily realize large-scale integrated manufacturing. The magnetic sensor is embedded in the ultra-smooth substrate to manufacture the hard disk magnetic head, so that the hard disk magnetic head and the magnetic disk can be in close-range and wear-free direct contact, the head-disk distance is effectively reduced, parallel sliding of the magnetic sensor on the upper surface of the magnetic disk can be realized, and the storage density of the magnetic disk and the read-write speed of the hard disk magnetic head are effectively improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art according to these drawings.

FIG. 1 is a schematic structural diagram of a magnetic head of a hard disk according to an embodiment of the present application;

FIG. 2 is a schematic flow chart of a preparation method according to an embodiment of the present application;

FIG. 3 is another schematic flow chart of a manufacturing process according to an embodiment of the present application;

FIG. 4 is a schematic view of a hard disk head in contact with a magnetic disk according to an embodiment of the present invention;

FIG. 5 is a schematic view of another structure of a magnetic head of a hard disk according to an embodiment of the present application;

FIG. 6 is a schematic view of another contact between a magnetic head of a hard disk and a magnetic disk according to an embodiment of the present invention;

wherein the reference numerals are:

1. an ultra-smooth substrate; 2. an inner groove; 3. an ultra-smooth base station; 4. a first electrode layer; 51. a free layer; 52. a tunnel barrier layer; 53. a pinning layer; 54. an insulating layer; 61. a power supply module; 62. a signal measurement module; 7. a magnetic disk; 71. a lubricating layer; 72. a magnetic medium layer; 73. a magnetic disk substrate; 8. a head arm.

Detailed Description

In order to make those skilled in the art better understand the technical solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like (if any) indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only used for convenience in describing the embodiments of the present application and for simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be configured in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present application. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and not for purposes of indicating or implying relative importance or order.

In the description of the embodiments of the present application, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless explicitly stated or limited otherwise; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. Specific meanings of the above terms in the embodiments of the present application can be understood in specific cases by those of ordinary skill in the art.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of the present application only and is not intended to be limiting of the application.

For convenience of understanding and explanation, before the present application is explained in further detail, terms and expressions referred to in the embodiments of the present application will be explained, and the terms and expressions referred to in the embodiments of the present application will be applied to the explanations below.

1) Structural superlubricity (structural super smoothness): it is understood that the friction force is almost zero and the abrasion is zero when the two solid surfaces in direct contact (without adding lubricant) slide relatively, and the friction coefficient is generally as small as 10^ -3 or less in the state. In this application, specifically, the bottom surface of the super-slip base material is in contact with the upper surface of the magnetic disk, which is not provided with the liquid lubricant, without abrasion and with almost no friction.

2) Atomic contact: the two atomically flat surfaces are parallel to each other, no other impurities are present between the interfaces of the two layers, no chemical bonds are formed between the atoms of the interfaces, and only the contact form of intermolecular action (van der waals action) exists between the interfaces.

3) Head-disk spacing: the distance between the reading and writing head and the surface of the magnetic medium material on the surface of the magnetic disk is an important factor for determining the storage surface density of the mechanical hard disk, and the smaller the head-disk spacing is, the higher the supportable storage density is; the conventional head-disk spacing often includes the flying height of the read-write head (the height difference or spacing between the read-write head and the upper surface of the disk), the thickness of the lubricating layer on the surface of the disk (such as a solid lubricating layer like a diamond-like carbon DLC layer), and the thickness of the protective layer of the disk. It should be noted that, in some words, magnetic heads (magnetic heads) and Disk read-and-write heads (Disk read-and-write heads) refer to the same thing, i.e., components that convert magnetic fields into electric currents and convert electric currents into magnetic fields; for ease of illustration and understanding, however, the term head as described herein, in the context of the Chinese language of the present application, refers primarily to the entire front end structure of the head arm, which may specifically include the ultra-smooth substrate of embodiments of the present application and the magnetic sensing element, which may include the MTJ element described below.

4) Van der waals materials: also called van der waals force layered material, has ultra-slip property, mainly consists of multiple atomic layers, and because of weak interaction force (van der waals force) between the layers, a user can obtain a single-layer two-dimensional material which keeps the components and structure of the bulk material through various stripping means, meanwhile, the ultra-slip of the structure is easily realized when the material is contacted with the surfaces of other materials, and in addition, because atoms in each layer of the material are saturated and connected by strong chemical bonds, and are difficult to combine with out-of-plane atoms to form new chemical bonds, the material is difficult to be worn; among them, van der waals force is a force widely existing between molecules or atoms, and van der waals materials include two-dimensional layered materials such as graphite.

5) Tunneling Magneto-Resistance (TMR): the sensor is a novel magneto-resistance effect sensor which utilizes the tunnel magneto-resistance effect of a magnetic multilayer film material to sense a magnetic field; the TMR element is also commonly referred to as a Magnetic Tunnel Junction (MTJ), and generally has a sandwich structure of ferromagnetic layer/nonmagnetic insulating layer/ferromagnetic layer, and under the action of an external magnetic field at one side, the relative magnetization directions of two ferromagnetic layers with different coercive forces change, so that the tunneling resistance of the nonmagnetic insulating layer changes, that is, the TMR effect occurs; these trilayer structures are also commonly referred to by function as a pinned layer (magnetic moment is relatively fixed under a magnetic field of a certain magnitude), a tunnel barrier layer (providing tunnel magnetoresistance), and a free layer (magnetic moment is freely rotatable with respect to the pinned layer, varying with external magnetic fields).

The embodiments of the present application will be described in further detail below.

Referring to fig. 1, fig. 2, fig. 4 to fig. 6, a first aspect of the present invention provides an embodiment of a hard disk magnetic head, which includes: a super-slip substrate and a magnetic sensor element;

an inner groove 2 is formed in the ultra-smooth base material 1; the magnetic sensor element is disposed in the inner recess, and the magnetic sensor element has a magneto-electric effect under the action of a magnetic field of the magnetic disk 7.

In some specific examples, the ultra-smooth substrate 1 includes Highly Oriented Pyrolytic Graphite (HOPG); the thickness of the ultra-smooth base station 3 which is made of highly oriented pyrolytic graphite and obtained by cutting is between 0.3nm and 3nm, and the ultra-smooth base station 3 is connected with the magnetic sensing element through the inner groove.

In some specific examples, the magnetic sensor element includes a magnetoresistive element and a first electrode layer 4 stacked; the magnetic resistance element is used for sensing the magnetic field of the magnetic disk; the ultra-smooth substrate is used as a second electrode layer, and the ultra-smooth substrate, the magnetic resistance element and the first electrode layer form a conducting loop of the hard disk magnetic head under an external electric signal. Specifically, the magnetoresistive element may be a Tunnel Magnetoresistive (TMR) element including a free layer 51, a tunnel barrier layer 52, and a pinned layer 53 laid one after another.

Furthermore, optionally, the magnetic sensor element may further comprise an insulating layer 54, which is laid around the magneto-resistive element, the insulating layer being adapted to block the passage of electrical signals between the magneto-resistive element and the surrounding ultra-smooth substrate.

In some specific examples, the magnetic sensor elements are multiple, and each magnetic sensor element is disposed in one of the inner grooves, i.e., the hard disk head may include multiple magnetic sensor elements disposed in each of the inner grooves, and a pitch between two adjacent magnetic sensor elements is a predetermined multiple of a track spacing of the magnetic disk, for example, the pitch between two adjacent magnetic sensor elements is equal to one or other integer multiple of the track spacing of the magnetic disk, and may be between 1 μm and 10 μm.

The composition and structure of the hard disk magnetic head are mainly described above, and the method for manufacturing the hard disk magnetic head will be described in detail below; for the contents of the hard disk magnetic head described in the foregoing first aspect, reference may be specifically made to the following description of the hard disk magnetic head in the second aspect, and details are not described herein.

Referring to fig. 1 to 6, a second aspect of the present application provides an embodiment of a method for manufacturing a hard disk magnetic head, the method embodiment includes steps 11 to 12:

11. the ultra-smooth substrate is processed to obtain an inner recess for embedding the magnetic sensor element.

For the sake of understanding, the present embodiment is illustrated by using highly oriented pyrolytic graphite as the ultra-smooth substrate, and it is understood that other van der waals materials besides HOPG can be used as the ultra-smooth substrate 1 of the present invention, such as graphite, molybdenum disulfide, hexagonal boron nitride, etc., to prepare the receiving profile of the read/write head structure (which can be understood as the ultra-smooth base 3 described later).

As shown in fig. 2, as a possible implementation manner, the specific implementation process of step 11 includes:

coating photoresist on the upper surface of the ultra-smooth base material 1 and performing spin coating treatment to ensure that the photoresist is more uniformly attached to the upper surface of the ultra-smooth base material; photoetching and developing the spin-coated ultra-smooth substrate 1 to determine a target view field of the ultra-smooth substrate 1, wherein the purpose of determining the target view field is to locate and distinguish the whole ultra-smooth substrate 1, and actually pre-execute which part of the substrate is subjected to subsequent alignment operation; the target view field region can be a non-exposure region or an exposure region which still retains photoresist after photoetching development, and is not limited specifically; taking the non-exposed area as the target viewing field area as an example, any one of the following overlay operations may be selected thereafter:

one of the overlay operations: etching a super-smooth base station 3 (such as an HOPG boss shown in figure 2) with a preset specification in a super-smooth base material 1 in a target view field area, and downwards sleeving and etching an inner groove 2 in the super-smooth base station according to a preset size; specifically, the sunken degree of depth of inner groovy is less than the protruding height of super smooth base station, sets up the 2 degree of depth of inner groovy so, helps follow-up evenly completely to cut off the super smooth base station for having inlayed the magnetic sensing element, guarantees the integrality of hard disk magnetic head. Of course, after etching out the HOPG boss, the photoresist attached thereon may be removed.

The second alignment operation: and (3) engraving an inner groove 2 in the ultra-smooth base material in the target view field region according to a preset size, and etching an ultra-smooth base station with a preset specification around the engraved inner groove.

It can be seen that, one of the above-mentioned overlay operations is to etch the shape (visible as a boss) of the super-smooth base 3 first, and then to overlay and etch the inner groove for carrying the magnetic sensor element downwards in the super-smooth base, and different from this, the other of the overlay operation is to overlay and etch the inner groove first, and then to etch the shape of the super-smooth base along the contour of the inner groove, which is equivalent to dig the inner groove from the whole super-smooth base material. Therefore, the sequence of machining the ultra-smooth base station and the inner groove can be unlimited, and the inner groove can be machined finally and can be conveniently dug and taken out.

It should be noted that, in the embodiment of the present application, a plurality of inner grooves may be processed in the whole ultra-smooth substrate (i.e., the van der waals material substrate) to receive the same number of magnetic sensing elements that work independently from each other, so that one head arm 8 may be connected to a plurality of magnetic sensing elements simultaneously, thereby implementing parallel reading and writing on the disk 7 and improving the reading and writing speed of the hard disk, where a distance between two adjacent inner grooves may be a preset multiple of a track interval of the disk.

12. The magnetic sensor element is placed in the inner recess.

And placing the magnetic sensing element in the inner groove to obtain the hard disk magnetic head comprising the ultra-smooth base material and the magnetic sensing element, wherein the magnetic sensing element has a magnetoelectric effect under the action of a magnetic field of a magnetic disk.

In some specific examples, the magnetic sensor element includes a magnetoresistive element for sensing a magnetic field of the magnetic disk and a first electrode layer; accordingly, as shown in fig. 3, the step 12 includes:

manufacturing a magnetic resistance element inside or outside the inner groove through a micro-machining process; if the magnetoresistive element is manufactured outside the inner groove, the process of step 12 specifically includes cutting and assembling the manufactured magnetoresistive element into the inner groove according to the size of the inner groove;

manufacturing a first electrode layer 4;

integrally processing and molding the magnetic resistance element and the first electrode layer 4 so that the magnetic resistance element generates a magnetic resistance effect under the action of an external electric signal of the ultra-smooth substrate and the first electrode layer; the ultra-smooth base station 3 is used as a second electrode layer to form a conducting loop of an external electric signal together with the magnetic resistance element and the first electrode layer 4.

Specifically, the process of manufacturing the magnetoresistive element outside the inner groove by the micromachining process includes: manufacturing a magnetic resistance element above the workpiece substrate; the magnetoresistive element thus produced is cut out from above the article substrate according to the size of the inner recess and assembled inside the inner recess. The substrate of the article may specifically be a silicon material.

The above-mentioned micro-processing process may specifically include coating, photolithography and etching processes, for example, for a magnetic sensor element with a thin film structure, the micro-processing process is specifically operated by coating a layer of material film (such as the free layer 51, the tunnel barrier layer 52 and the pinned layer 53 described later) on a substrate such as a super-smooth substrate, and unnecessary portions of the stacked and coated multi-layer films can be removed by photolithography development and etching processes to produce a film structure element capable of sensing a magnetic field and being embedded into the inner groove. It can be seen that the micro-processing process is equivalent to making a magnetoresistive element (e.g. MTJ) above the substrate, and of course, the micro-processing process can also be similarly used to make the magnetoresistive element outside the inner recess (in a second manner), but different from the first manner of making the magnetoresistive element directly inside the inner recess, the second manner is to make the magnetoresistive element above the substrate (e.g. silicon substrate) of the other fabricated part except the ultra-smooth substrate, and it is also necessary to cut the magnetoresistive element from the top of the fabricated part according to the size of the inner recess and assemble the magnetoresistive element into the inner recess, and the magnetoresistive element made in the first manner itself does not need to be assembled in the inner recess. Of course, the thin film layer-like structure such as the first electrode layer shown in fig. 3 may be prepared by the above-mentioned microfabrication process.

Therefore, in one mode, an inner groove may be first machined so as to directly place the magnetic sensor element in the inner groove; in the second method, the magnetic sensor element can be placed in the inner groove in a processing region outside the inner groove, and then the magnetic sensor element prepared in advance is cut and assembled into the inner groove.

Specifically, when the magnetoresistive element is a Tunnel Magnetoresistive (TMR) element, the process of manufacturing the magnetoresistive element includes: laying a free layer 51, a tunnel barrier layer 52 and a pinning layer 53 layer by layer according to the sequence from low to high to obtain a stacked and molded magnetoresistive element;

correspondingly, the process of integrally processing and molding the magnetic resistance element and the first electrode layer comprises the following steps: and laying the first electrode layer above the pinning layer so that the external electric signal longitudinally passes through the magnetoresistive element through the first electrode layer.

Illustratively, the free layer 51, the tunnel barrier layer 52, the pinning layer 53 and the top electrode layer (i.e., the first electrode layer 4) are fabricated in the inner groove layer by layer, and these layer structures may be made of one to several layers of thin film materials, and furthermore, the bottom HOPG material may be used as the bottom electrode layer (i.e., the second electrode layer), so as to form a tunnel magnetoresistive structure including two electrode layers and a tunnel magnetoresistive element, so that an external electrical signal of an external circuit can longitudinally flow through the middle tunnel magnetoresistive structure under the conduction of the two electrode layers, and the magnetic field of the magnetic disk can be induced by the magnetoresistive element. Optionally, the first electrode layer may be made of a metal material, and the thickness of each layer of the TMR element may be between 0.1 nm and 100nm, which may be specifically set according to actual requirements. The integral forming can be understood as stacking the film layers.

It should be noted that, compared with an Anisotropic Magnetoresistive (AMR) element and a Giant Magnetoresistive (GMR) element, the TMR element has a larger resistance change rate, and better stability and sensitivity, and can be widely applied to a hard disk magnetic sensing element. Of course, the magnetoresistive element can be other elements such as a GMR element or an AMR element, in particular, as long as the element can also sense the magnetic field of the magnetic disk.

In summary, the preparation method of the embodiment of the application is simple and convenient to operate, and compared with the traditional scheme that the ultra-smooth gasket is attached below the magnetic sensing element to achieve flying height regulation, the method does not need to manufacture and bond the traditional ultra-smooth gasket and other flows, is higher in controllability, can be compatible with the existing semiconductor manufacturing technology, and achieves large-scale integrated manufacturing. In addition, when the ultra-smooth base material is used for designing the contact type hard disk magnetic head, the direct contact without abrasion with a disk can be realized, the support of a traditional magnetic head sliding block is not needed, the traditional situation that the hard disk magnetic head needs to indirectly contact with the disk by means of an ultra-smooth gasket, the abrasion-free sliding can be realized is broken, and the head-disk distance is effectively reduced.

The distance between the magnetoresistive element and the hard disk can be accurately and reliably reduced by utilizing the layered structure of the Van der Waals material, and the manufactured hard disk magnetic head can be in direct contact with a magnetic disk and slide due to the ultra-smooth property of the Van der Waals material, so that the distance between a read-write head and a magnetic medium (namely the distance between the head and the disk) is lower than that of the conventional hard disk magnetic head; in addition, the hard disk magnetic head of the application does not need to maintain and regulate the aerodynamic force required by the flying height, so a plurality of magnetic sensing elements can be manufactured to be arranged under the same magnetic head arm 8 in parallel, and the magnetic sensing elements can slide on the upper surface of a magnetic disk without abrasion without being influenced by factors such as the deformation of the magnetic head arm, and the storage density of the hard disk and the read-write speed of the hard disk magnetic head are further improved.

Based on the above description of examples, some specific examples of possible implementations will be provided below, and in practical applications, the implementation contents between these examples can be implemented in combination according to the corresponding functional principles and application logic as needed.

In some specific examples, the magnetic sensor element may further include an insulating layer, and accordingly, the process of placing the magnetic sensor element in the inner recess may further include:

an insulating layer is manufactured according to the size of the magnetic resistance element and the size of the inner groove, and the insulating layer is formed around the magnetic resistance element and used for blocking the flow of electric signals between the magnetic resistance element and the peripheral ultra-smooth base material, so that the phenomenon that an electrode layer disturbs the induction of the magnetic field of the magnetic disk by the magnetic resistance element is avoided; optionally, choose for use silicon oxide as insulating layer system material, in addition, for producing effectual insulating effect and roughness, the upper surface height of insulating layer can level with the upper surface height on top motor layer.

Specifically, the process of forming the insulating layer around the magnetoresistive element includes:

if the magnetoresistive element is selectively arranged in the middle of the inner groove, an insulating layer is circumferentially laid between the magnetoresistive element and the inner wall of the inner groove, as shown in fig. 3 or 4;

on the contrary, as shown in fig. 5, if one side edge line of the inner groove is selected to be vertically aligned when the magnetoresistive element is disposed in the inner groove, an insulating layer is laid between the inner wall of the inner groove remote from the edge line and the magnetoresistive element.

For example, the insulating layer may be in direct contact with the inner wall of the inner recess, the magnetoresistive element, and the first electrode layer to assist an external electrical signal to longitudinally flow through the magnetoresistive element, so as to cause the magnetoresistive element to generate a magnetoresistive effect and an induced magnetic field, thereby enabling the read/write head to read/write a magnetic disk.

In some specific examples, if the magnetic resistance element is manufactured outside the inner groove, the process of assembling the magnetic sensor element manufactured outside into the inner groove may include: and packaging the magnetic sensing element paved with the insulating layer into the inner groove by adopting a bonding process.

In some embodiments, in order to effectively and reliably analyze the manufacturing effect and the working efficiency of the hard disk magnetic head, the ultra-smooth base station is externally connected with a power module 61 (which can be regarded as an external circuit), and the magnetic sensor element is externally connected with a signal measuring module 62; the power module 61 is configured to provide an external electrical signal flowing through the magnetic sensor, and the signal measurement module 62 is configured to measure a change of the electrical signal generated by the magnetic sensor under the action of a magnetic field.

In some specific examples, the preparation method of the present application may further include:

defining a cutting line lower than the bottom groove surface of the inner groove at the bottom of the ultra-smooth base material, wherein the cutting line is shown as a dotted line in figure 3; and intercepting the ultra-smooth base station from the ultra-smooth base material along an intercepting line, wherein the ultra-smooth base station is used for accommodating the magnetic sensing element through the inner groove. It should be noted that, in some specific application scenarios, when the intercepting operation is performed, the magnetic sensing element may not be embedded inside the inner groove temporarily.

Specifically, since the ultra-smooth base is a van der waals material with a layered structure, the ultra-smooth base can be cut or mechanically peeled from the dotted line, and thus the required hard disk magnetic head can be manufactured. However, in order to further reduce the head-disk spacing and improve the direct contact effect of the hard disk magnetic head when operating on the disk surface, so as to improve the storage density of the disk and the read-write speed of the hard disk magnetic head, in some specific examples, after the inner recess embedded with the magnetic sensing element is cut from the ultra-smooth substrate along the cut-off line, the preparation method may further include:

the bottom thickness of the ultra-smooth base station is reduced to the preset thickness of the base station, the preset thickness of the base station can be regarded as the distance between the bottom surface of the magnetic sensing element preset above the magnetic disk and the surface of the magnetic medium layer of the magnetic disk, and the preset thickness of the base station is determined according to the thickness of the material layer of the ultra-smooth base material.

Specifically, the bottom thickness of the super-smooth base station can be reduced to a preset thickness of the base station by means of mechanical peeling (tearing off the material layer of the super-smooth base station layer by layer) and the like, and the preset thickness of the base station can be specifically the thickness of a preset number of graphite atom layers (one layer of graphite is about 0.34nm thick), such as 0.3-3nm; then, the ultra-smooth base station (the ultra-smooth base station and the magnetic sensor element can be called as the target hard disk head as a whole) with reduced thickness is connected to the head arm with adjusted height, so as to realize the ultra-smooth type sliding of the target hard disk head on the upper surface of the magnetic disk.

In summary, the present embodiment can adopt van der waals materials as the ultra-smooth substrate and the magnetoresistive element as the component of the magnetic sensing element to combine to make the hard disk magnetic head; the hard disk magnetic head manufactured by the method can be in direct contact with a magnetic disk without abrasion due to the structural ultra-smooth property of Van der Waals materials, and meanwhile, the friction force in the sliding process is extremely low. In addition, because the whole magnetic head is in direct contact with the disk instead of being suspended as in the conventional method, the distance between the magnetic head and the magnetic medium layer is closer than that between the magnetic sensing element attached with the conventional ultra-smooth gasket, so that the disk can realize higher storage density. Meanwhile, the magnetic sensing element does not need to be adjusted and controlled in height, so that a plurality of magnetic sensing elements can be conveniently manufactured on a whole ultra-smooth substrate, one magnetic head arm can bear the plurality of magnetic sensing elements without deformation, parallel data reading and writing are realized, and the bandwidth of hard disk data reading and writing is greatly improved.

The hard disk magnetic head described in the second aspect of the present application is similar to the hard disk magnetic head described in the first aspect, and details are not repeated here.

As shown in fig. 4 or fig. 6, the third aspect of the present application provides an embodiment of a hard disk including a magnetic disk, a head arm, and the hard disk magnetic head as described in the foregoing first aspect, the upper surface of the magnetic disk 7 is coated with a lubricating layer 71, and the head arm 8 is connected to one end of the magnetic disk magnetic head.

The ultra-smooth structure needs extremely high flatness, but the magnetic medium layer is generally difficult to meet the requirements, so that a lubricating layer is needed to realize a magnetic disk surface with the standard flatness, and particularly, the lubricating layer can be made of a diamond-like carbon (DLC) material. The disk 7 may specifically include a lubricant layer 71, a magnetic media layer 72, and a disk substrate 73.

In some specific examples, the hard disk head of the hard disk may include a plurality of magnetic sensing elements respectively disposed in the inner grooves, and each inner groove may be processed from the same ultra-smooth substrate, so as to implement parallel operation of the plurality of magnetic sensing elements under the same head arm, thereby improving the read-write speed. Further, the magnetic disk includes a target magnetic medium layer whose coercivity is adjusted to the target coercivity by a laser heating technique, such as a Heat Assisted Magnetic Recording (HAMR) technique; the magnetic disk has the advantages that the coercive force of the magnetic medium of the magnetic disk can be reduced by laser heating, the magnetic domain of the magnetic disk is reduced, the storage density is improved, data can be written into a smaller magnetic domain, and the overall performance of the hard disk is expanded.

The hard disk magnetic head described in the third aspect of the present application is similar to the structure content of the hard disk magnetic head described in the first aspect or the second aspect, and is not described herein again.

It should be understood that, in the various embodiments of the present application, the sequence number of each step does not mean the execution sequence, and the execution sequence of each step should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

The above examples are only for illustrating the technical solutions of the present application, and are not limited thereto.

Claims

1. A hard disk magnetic head, comprising: a super-slip substrate and a magnetic sensor element;

an inner groove is formed in the ultra-smooth base material;

2. The hard disk magnetic head as claimed in claim 1, wherein the ultra-smooth substrate comprises highly oriented pyrolytic graphite;

the thickness of the ultra-smooth base station which is made of the highly oriented pyrolytic graphite and obtained by cutting is 0.3nm to 3nm, and the ultra-smooth base station is used for bearing the magnetic sensing element through the inner groove.

3. The hard disk magnetic head as claimed in claim 1, wherein said magnetic sensing element comprises a magnetoresistive element and a first electrode layer stacked one on another;

the magnetic resistance element is used for sensing the magnetic field of the magnetic disk;

the ultra-smooth substrate is used as a second electrode layer, and forms a conducting loop of the hard disk magnetic head under an external electric signal together with the magnetic resistance element and the first electrode layer.

4. The hard disk magnetic head as claimed in claim 3, wherein said magnetic sensing element further comprises an insulating layer;

the insulating layer is paved around the magnetoresistive element and used for blocking the circulation of electric signals between the magnetoresistive element and the peripheral ultra-smooth substrate.

5. A hard disk magnetic head as claimed in any one of claims 1 to 4, wherein a plurality of said magnetic sensing elements are provided, each of said magnetic sensing elements being disposed in a respective one of said inner recesses;

and the distance between two adjacent magnetic sensing elements is a preset multiple of the magnetic track interval of the magnetic disk.

6. A method for manufacturing a hard disk magnetic head, comprising:

-placing said magnetic sensor element in said inner recess to obtain a hard disk magnetic head according to any one of claims 1 to 5.

7. The production method according to claim 6, wherein the magnetic sensor element includes a magnetoresistive element and a first electrode layer; the process of placing the magnetic sensor element in the inner recess includes:

manufacturing the magnetoresistive element inside or outside the inner groove through a micromachining process; if the magnetic resistance element is manufactured outside the inner groove, the process of placing the magnetic sensing element in the inner groove comprises the steps of cutting and assembling the manufactured magnetic resistance element into the inner groove according to the size of the inner groove;

manufacturing the first electrode layer;

and integrally processing and molding the magnetic resistance element and the first electrode layer so that the magnetic resistance element generates a magnetic resistance effect under the action of an external electric signal of the ultra-smooth substrate and the first electrode layer.

8. The method of claim 7, wherein when the magnetic sensing element further comprises an insulating layer, placing the magnetic sensing element in the inner recess further comprises:

manufacturing the insulating layer according to the sizes of the magnetoresistive element and the inner groove;

the insulating layer is formed around the magnetoresistive element.

9. The method according to claim 6, wherein the ultra-smooth substrate is a van der Waals substrate, and the step of processing the ultra-smooth substrate comprises:

and processing a plurality of inner grooves in the Van der Waals material base material, wherein the distance between every two adjacent inner grooves is a preset multiple of the magnetic track interval of the magnetic disk.

10. The method of claim 6, wherein the step of processing the ultra-smooth substrate comprises:

coating photoresist on the upper surface of the ultra-smooth base material and performing spin coating treatment;

photoetching and developing the spin-coated ultra-smooth base material to determine a target view field region of the ultra-smooth base material;

etching a super-slip base station with a preset specification in a super-slip base material in the target view field area, and engraving an inner groove in the super-slip base station according to a preset size, wherein the depression depth of the inner groove is smaller than the protrusion height of the super-slip base station;

or,

and engraving the inner groove in the ultra-smooth base material in the target view field according to a preset size, and etching an ultra-smooth base station with a preset specification around the engraved inner groove.

11. The method of manufacturing according to claim 6, further comprising:

defining an intercepting line lower than the bottom groove surface of the inner groove at the bottom of the ultra-smooth base material;

and intercepting a lower super-smooth base station from the super-smooth base material along the intercepting line, wherein the super-smooth base station is used for accommodating the magnetic sensing element through the inner groove.

12. The method of manufacturing according to claim 11, wherein after the cutting of the ultra-smooth submount from the ultra-smooth substrate along the cut-off line, the method further comprises:

and reducing the bottom thickness of the ultra-smooth base station to a preset base station thickness, wherein the preset base station thickness can be regarded as the distance between the bottom surface of the magnetic sensing element, which is preset above the magnetic disk, and the surface of the magnetic medium layer of the magnetic disk.

13. The method of claim 12, wherein the step of reducing the bottom thickness of the inner groove to a predetermined thickness of the abutment comprises:

and thinning the bottom thickness of the ultra-smooth base station to the preset thickness of the base station by adopting a mechanical stripping process, wherein the preset thickness of the base station is determined according to the thickness of the material layer of the ultra-smooth base material.

14. A hard disk comprising a magnetic disk, a head arm, and the hard disk head as recited in any one of claims 1 to 13, wherein an upper surface of the magnetic disk is coated with a lubricating layer;

the head arm is connected to one end of the magnetic disk head.

15. The hard disk of claim 14 wherein the hard disk head comprises a plurality of magnetic sensing elements disposed in respective inner cavities machined from the same ultra-smooth substrate.