CN115588653A - Rectifier bridge - Google Patents

Rectifier bridge Download PDF

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Publication number
CN115588653A
CN115588653A CN202211365352.8A CN202211365352A CN115588653A CN 115588653 A CN115588653 A CN 115588653A CN 202211365352 A CN202211365352 A CN 202211365352A CN 115588653 A CN115588653 A CN 115588653A
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CN
China
Prior art keywords
shell body
stitch
main
chip
kept away
Prior art date
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Pending
Application number
CN202211365352.8A
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Chinese (zh)
Inventor
周威
马青
吉雪芹
陈雪飞
赵宏建
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Yangzhou Kenda Electronic Co ltd
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Yangzhou Kenda Electronic Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yangzhou Kenda Electronic Co ltd filed Critical Yangzhou Kenda Electronic Co ltd
Priority to CN202211365352.8A priority Critical patent/CN115588653A/en
Publication of CN115588653A publication Critical patent/CN115588653A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/562Protection against mechanical damage

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a rectifier bridge, which relates to the technical field of rectifier bridges and comprises a first outer shell, wherein the surface of one side of the first outer shell is fixedly connected with a second outer shell, the middle part of the inner wall of the first outer shell is provided with a main body chip, the two sides of the main body chip are both fixedly connected with first adhesive layers, the surfaces of the first adhesive layers, which are far away from the main body chip, are both fixedly connected with silica gel sheets, the surfaces of the silica gel sheets, which are far away from the first adhesive layers, are both fixedly connected with second adhesive layers, the surfaces of the second adhesive layers, which are far away from the silica gel sheets, are both fixedly connected with heat conducting sheets, and main pins are arranged in the middle part of the lower surface of the main body chip at equal intervals.

Description

Rectifier bridge
Technical Field
The invention relates to the technical field of rectifier bridges, in particular to a rectifier bridge.
Background
The rectifier bridge is to seal the rectifier tube in a shell, and is divided into a full bridge and a half bridge, wherein the full bridge seals the four diodes of the connected bridge rectifier circuit together, the half bridge seals the half of the bridge rectifier of the four diodes together, the two half bridges can form a bridge rectifier circuit, one half bridge can also form a full-wave rectifier circuit with a center tap of a transformer, the rectifier circuit and working voltage are considered when the rectifier bridge is selected, and the rectifier bridge generally has a large enough inductive load, so that the rectifier bridge does not have the condition of current interruption.
The defects of the prior art are as follows:
one is as follows: current rectifier bridge, in the use, because of self heat dispersion is relatively poor, need strengthen rectifier bridge's heat-sinking capability through adding heat radiation structure, but many complicated heat radiation structure have increased rectifier bridge's volume when increasing heat-sinking capability by a wide margin, and then influence rectifier bridge self and other electronic component's installation.
The second step is as follows: the existing rectifier bridges are usually placed in a box in the process of storage or transportation, so that the rectifier bridges collide in the moving process, the main pins are bent or damaged, and if the rectifier bridges are stored separately, the storage space is wasted.
Disclosure of Invention
In order to overcome the above-mentioned drawbacks of the prior art, the present invention provides a rectifier bridge to solve the above-mentioned problems in the prior art.
In order to solve the technical problem, the invention provides a rectifier bridge which comprises a first outer shell, wherein a second outer shell is fixedly connected to the surface of one side of the first outer shell, a main body chip is arranged in the middle of the inner wall of the first outer shell, first adhesive layers are fixedly connected to the two sides of the main body chip, silica gel sheets are fixedly connected to the surfaces of the first adhesive layers, which are far away from the main body chip, respectively, second adhesive layers are fixedly connected to the surfaces of the silica gel sheets, which are far away from the first adhesive layers, respectively, heat-conducting sheets are fixedly connected to the surfaces of the second adhesive layers, which are far away from the second adhesive layers, respectively, main pins are arranged in the middle of the lower surface of the main body chip at equal intervals, the number of the main pins is three, the surfaces of the heat-conducting sheets, which are far away from the second outer shell, of the main body chip are fixedly connected to the surface of the inner wall of the first outer shell, and the surfaces of the heat-conducting sheets, which are far away from the first outer shell, which are far away from the second adhesive layers, are fixedly connected to the surfaces of the inner wall of the main body chip, are fixed to the surfaces of the inner wall of the second outer shell.
Preferably, the one end that second shell body one side top was kept away from to first shell body has seted up the bar groove, the first fixed block of bar inslot fixedly connected with of second shell body one side top one end is kept away from to first shell body, the middle part equidistance of first fixed block upper surface is arranged and is had first spacing groove, the quantity of first spacing groove is three.
Preferably, the one end that first shell body one side top was kept away from to the second shell body has seted up the bar groove, the bar inslot fixedly connected with second fixed block of first shell body one side top one end is kept away from to the second shell body, the middle part equidistance of second fixed block upper surface is arranged and is had the second limiting plate, the quantity of second limiting plate is three.
Preferably, the silica gel piece is formed by mixing and casting heat conduction and insulating materials, the thickness of the silica gel piece is two thirds of the thickness of the heat conduction piece, and the width of the silica gel piece is greater than that of the heat conduction piece.
Preferably, the conducting strip is formed by casting the copper material, the radiating strips are arranged at equal intervals in the middle of two sides of the conducting strip, the number of the radiating strips is five, the radiating strips are formed by casting the copper material, and the thickness of the radiating strips is the same as that of the conducting strip.
Preferably, the circular recess has been seted up to the outer wall that the main part chip was passed to the one end that main stitch was kept away from main body chip, the circular recess internal swing joint that main stitch was kept away from main body chip one end has first spacing to tie, the one end that main stitch is close to first spacing to tie is equipped with first auxiliary stitch, the circular recess has all been seted up at the middle part of first auxiliary stitch both ends both sides, first auxiliary stitch is close to the inner wall of the circular recess in main stitch one end both sides middle part all with two swing joints of first spacing bolt side, the circular recess internal swing joint that main stitch one end both sides middle part was kept away from to first auxiliary stitch has the spacing bolt of second, the middle part swing joint that the spacing bolt side of second has the vice stitch of second.
Compared with the prior art, the invention provides a rectifier bridge, which has the following beneficial effects:
1. according to the invention, the heat dissipation strips are arranged, and the number of the heat dissipation strips is five, so that heat can be dissipated through the heat dissipation strips when the device is used, and the shape of the heat dissipation strips can be changed by snapping the heat dissipation strips during installation, thereby being beneficial to increasing heat dissipation and avoiding influence on installation of the device or other electronic elements.
2. According to the rectifier bridge storage device, the first limiting groove and the second limiting plate are arranged, the rectifier bridges are arranged in a staggered mode in the storage or transportation process of the rectifier bridge storage device, the main pins are inserted into the first limiting groove and the second limiting plate, the storage of the rectifier bridges can be achieved, and the bending damage caused by extrusion in the storage or transportation process of the main pins can be avoided.
3. According to the invention, the first limit bolt and the second limit bolt are arranged, when the device is used, the positions among the main pin, the first auxiliary pin and the second auxiliary pin can be fixed by adjusting the first limit bolt and the second limit bolt, so that the adjustment of the distance between the second auxiliary pin is realized, the distance between welding holes on a circuit board is adapted, meanwhile, the second auxiliary pin can be ensured to be vertically inserted into the welding hole on the circuit board, and the stability of the device is favorably improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an exploded view of the overall structure of the present invention;
FIG. 3 is a schematic cross-sectional view of the overall structure of the present invention;
FIG. 4 is a schematic view of the structure of the heat conductive sheet of the present invention;
FIG. 5 is a cross-sectional view of a pin structure of the present invention;
fig. 6 is an enlarged schematic view at a in fig. 3 of the present invention.
In the figure: 1. a first outer case; 101. a first fixed block; 102. a first limit groove; 2. a second outer housing; 201. a second fixed block; 202. a second limiting plate; 3. a main body chip; 4. a first adhesive layer; 5. a silica gel sheet; 6. a second adhesive layer; 7. a heat conductive sheet; 701. a heat dissipation strip; 8. a main pin; 801. a first limit bolt; 802. a first secondary stitch; 803. a second limit bolt; 804. and a second pair of stitches.
Detailed Description
The embodiments of the present invention will be described in detail below with reference to the drawings of the present invention, and the configurations described in the following embodiments are merely examples, and the rectifier bridge according to the present invention is not limited to the configurations described in the following embodiments, and all other embodiments obtained by a person skilled in the art without creative efforts fall within the scope of the present invention.
Referring to fig. 1-6, the invention provides a rectifier bridge, which comprises a first shell 1, wherein a second shell 2 is fixedly connected to the surface of one side of the first shell 1, a main body chip 3 is arranged in the middle of the inner wall of the first shell 1, first adhesive layers 4 are fixedly connected to both sides of the main body chip 3, silica gel sheets 5 are fixedly connected to the surfaces of the first adhesive layers 4 far away from the main body chip 3, second adhesive layers 6 are fixedly connected to the surfaces of the silica gel sheets 5 far away from the first adhesive layers 4, heat conducting sheets 7 are fixedly connected to the surfaces of the second adhesive layers 6 far away from the side of the silica gel sheets 5, main pins 8 are arranged in the middle of the lower surface of the main body chip 3 at equal intervals, the number of the main pins 8 is three, the surfaces of the heat conducting sheets 7 far away from the second shell 2 of the main body chip 3 far away from the side of the second adhesive layers 6 are fixedly connected to the surface of the inner wall of the first shell 1, and the surfaces of the heat conducting sheets 7 far away from the side of the first shell 1 far away from the second adhesive layers 6 of the main body chip 3 are fixedly connected to the surface of the inner wall of the second shell 2.
What need specifically explain in this embodiment is, through first viscose layer 4 and second viscose layer 6 at 5 both sides of silica gel piece, during the use, through first viscose layer 4 and second viscose layer 6 to conveniently fix main part chip 3 and the heat conducting strip 7 among the device, be favorable to improving the device's stability.
Further, a strip-shaped groove is formed in one end, away from the top of one side of the second outer shell 2, of the first outer shell 1, a first fixing block 101 is fixedly connected in the strip-shaped groove, away from one end, away from the top of one side of the second outer shell 2, of the first outer shell 1, first limiting grooves 102 are arranged in the middle of the upper surface of the first fixing block 101 at equal intervals, and the number of the first limiting grooves 102 is three.
What need specifically say in this embodiment, arrange through the middle part equidistance at first fixed block 101 upper surface has first spacing groove 102 to first spacing groove 102's quantity is three, during the use, with the straggly placement between a plurality of rectifier bridges, and insert first spacing groove 102 with this with main stitch 8 in, can realize accomodating of a plurality of rectifier bridges, be favorable to avoiding main stitch 8 to accomodate or lead to buckling the damage because of the extrusion in the transportation.
Further, the one end that first shell body 1 one side top was kept away from to second shell body 2 has seted up the bar groove, and second shell body 2 keeps away from the bar inslot fixedly connected with second fixed block 201 of 1 one side top one end of first shell body, and the middle part equidistance of second fixed block 201 upper surface is arranged and is had second limiting plate 202, and the quantity of second limiting plate 202 is three.
What need specifically explain in this embodiment is, arrange through the middle part equidistance at second fixed block 201 upper surface has second limiting plate 202 to the quantity of second limiting plate 202 is three, during the use, with the straggly placement between a plurality of rectifier bridges, and with main stitch 8 so insert in the second limiting plate 202, can realize accomodating of a plurality of rectifier bridges, be favorable to avoiding main stitch 8 to lead to buckling damage because of the extrusion in accomodating or the transportation.
Further, silica gel piece 5 is that heat conduction and insulating material mix the casting and form, and silica gel piece 5's thickness is two-thirds of the thickness of conducting strip 7, and the width of silica gel piece 5 is greater than the width of conducting strip 7.
It should be specifically described in this embodiment that, by setting the thickness of the silicone sheet 5 to be two thirds of the thickness of the heat conducting sheet 7, and the width of the silicone sheet 5 is greater than the width of the heat conducting sheet 7, the main body chip 3 can be prevented from contacting the heat dissipation strip 701 during use, so as to increase the stability of the device.
Further, the heat conducting sheet 7 is formed by casting a copper material, the heat dissipation strips 701 are arranged in the middle of two sides of the heat conducting sheet 7 at equal intervals, the number of the heat dissipation strips 701 is five, the heat dissipation strips 701 are formed by casting the copper material, and the thickness of the heat dissipation strips 701 is the same as that of the heat conducting sheet 7.
In this embodiment, it should be specifically described that, the heat dissipation strips 701 are equally spaced from each other in the middle of the two sides of the heat conducting strip 7, and the number of the heat dissipation strips 701 is five, so that heat can be dissipated through the heat dissipation strips 701 when the heat conducting strip is used, and when the heat conducting strip is installed, the shape of the heat dissipation strips 701 can be changed by snapping the heat dissipation strips 701, so that the heat dissipation can be increased while the installation of the heat conducting strip or other electronic components can be prevented from being affected.
Further, the circular groove has been seted up to the outer wall that main stitch 8 kept away from main part chip 3's one end and passed first shell body 1, the circular inslot swing joint that main stitch 8 kept away from main part chip 3 one end has first spacing bolt 801, the one end that main stitch 8 is close to first spacing bolt 801 is equipped with first sub stitch 802, the circular groove has all been seted up at the middle part of first sub stitch 802 both ends both sides, the inner wall that first sub stitch 802 is close to the circular groove at 8 one end both sides middle parts of main stitch all with two swing joint of first spacing bolt 801 side, swing joint has the spacing bolt 803 of second in the circular groove that main stitch 8 one end both sides middle parts were kept away from to first sub stitch 802, the middle part swing joint that the spacing bolt 803 side of second has the vice stitch 804 of second.
What need specifically say in this embodiment is, through being equipped with first secondary stitch 802 at the one end that main stitch 8 is close to first spacing bolt 801, during the use, can fix main stitch 8, the position between first secondary stitch 802 and the vice stitch 804 of second through adjusting first spacing bolt 801 and the spacing bolt 803 of second, thereby realize the regulation to the vice stitch 804 interval of second, with this welding hole interval that adapts to on the circuit board, can guarantee the vertical welding hole that inserts on the circuit board of the vice stitch 804 of second simultaneously, compare prior art and can increase welded stability.
The working principle and the using process of the invention are as follows:
during the use, first through the first viscose layer 4 and the second viscose layer 6 of silicon chip 5 both sides, fix main part chip 3 and heat-conducting strip 7 among the device, the width of silicon chip 5 is greater than the width of heat-conducting strip 7, can avoid main part chip 3 and heat dissipation strip 701 to contact, silicon chip 5 is kept away from heat-conducting strip 7 one side and is bonded with main part chip 3, main part chip 3's structure is the same with rectifier bridge internal component structure similar effect among the prior art, then be connected to the circuit in, under the condition of putting through the circuit, main part chip 3 can be along with the time of using, continuous production of heat, main part chip 3 after generating heat can conduct the heat to the silicon chip 5 of main part chip 3 both sides, silicon chip 5 can conduct the heat for the heat dissipation strip 701 that is located first shell 1 and second shell 2 outside, thereby make the device dispel the heat through heat dissipation strip 701, when the installation, can change the shape of heat dissipation strip 701 through heat dissipation bolt, and then avoid influencing the installation of self or other electronic component, in the use, through adjusting the first vice stitch 803 of second spacing bolt 801 and the second pair, thereby the spacing stitch 801 can be realized through the adjustment to the second pair spacing interval when the welding technique, the spacing interval 804 that the second pair spacing bolt 804 and the second pair of the welding line 804, the spacing adjustment, thereby the spacing interval can be convenient maintenance, the soldering hole 804, the adjustment, thereby the adjustment of the second pair of the soldering connection between the soldering connection of the second pair of the soldering connection, the second pair of the soldering connection between the soldering connection of the second pair of the soldering line 804, thereby the second pair of the soldering line 804, can be realized.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiment of the invention, only the structures related to the disclosed embodiment are related, other structures can refer to common design, and the same embodiment and different embodiments of the invention can be combined mutually under the condition of no conflict;
and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (6)

1. A rectifier bridge, comprising a first outer casing (1), characterized in that: the surface fixing of first shell body (1) one side is connected with second shell body (2), the middle part of first shell body (1) inner wall is equipped with main part chip (3), the equal fixedly connected with first viscose layer (4) in both sides of main part chip (3), the equal fixedly connected with silica gel piece (5) in surface that main part chip (3) one side was kept away from in first viscose layer (4), the equal fixedly connected with second viscose layer (6) in surface that first viscose layer (4) one side was kept away from in silica gel piece (5) is kept away from in second viscose layer (6), the equal fixedly connected with heat conduction piece (7) in surface that silica gel piece (5) one side was kept away from in middle part equidistance range of main part chip (3) lower surface has main stitch (8), the quantity of main stitch (8) is three, main part chip (3) keep away from surface fixing of heat conduction piece (7) one side of second shell body chip (2) and connect on the surface of first heat conduction piece (1) inner wall, the inner wall of second shell body chip (3) keep away from first shell body chip (7) one side and connect on the surface of second shell body chip (6) one side (2).
2. A rectifier bridge according to claim 1, wherein: the one end that second shell (2) one side top was kept away from in first shell body (1) has seted up the bar groove, the first fixed block (101) of bar inslot fixedly connected with of second shell body (2) one side top one end is kept away from in first shell body (1), the middle part equidistance of first fixed block (101) upper surface is arranged and is had first spacing groove (102), the quantity of first spacing groove (102) is three.
3. A rectifier bridge according to claim 1, wherein: the one end at first shell body (1) one side top is kept away from in second shell body (2) has seted up the bar groove, the bar inslot fixedly connected with second fixed block (201) of first shell body (1) one side top one end are kept away from in second shell body (2), second limiting plate (202) have been arranged to the middle part equidistance of second fixed block (201) upper surface, the quantity of second limiting plate (202) is three.
4. A rectifier bridge according to claim 1, wherein: the silica gel piece (5) is formed by mixing and casting heat conduction and insulating materials, the thickness of the silica gel piece (5) is two thirds of the thickness of the heat conduction piece (7), and the width of the silica gel piece (5) is greater than that of the heat conduction piece (7).
5. A rectifier bridge according to claim 1, wherein: the utility model discloses a heat sink, including conducting strip (7), radiating strip (701), the equal equidistance in middle part of conducting strip (7) both sides is arranged and is formed for the casting of copper product, conducting strip (7) are cast, the quantity of radiating strip (701) is five, radiating strip (701) are cast for the copper product and are formed, the thickness of radiating strip (701) is the same with the thickness of conducting strip (7).
6. A rectifier bridge according to claim 1, wherein: the one end that main body chip (3) was kept away from in main stitch (8) passes the outer wall of first shell body (1) and has seted up circular recess, the circular recess internal swing joint that main body chip (3) one end was kept away from in main stitch (8) has first spacing bolt (801), the one end that main stitch (8) are close to first spacing bolt (801) is equipped with first pair stitch (802), circular recess has all been seted up at the middle part of first pair stitch (802) both ends both sides, the inner wall that first pair stitch (802) are close to the circular recess at main stitch (8) one end both sides middle part all with two swing joint of first spacing bolt (801) side, the circular recess internal swing joint that main stitch (8) one end both sides middle part was kept away from in first pair stitch (802) has second spacing bolt (803), the middle part swing joint that second spacing bolt (803) side has second pair stitch (804).
CN202211365352.8A 2022-11-02 2022-11-02 Rectifier bridge Pending CN115588653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211365352.8A CN115588653A (en) 2022-11-02 2022-11-02 Rectifier bridge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211365352.8A CN115588653A (en) 2022-11-02 2022-11-02 Rectifier bridge

Publications (1)

Publication Number Publication Date
CN115588653A true CN115588653A (en) 2023-01-10

Family

ID=84781338

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211365352.8A Pending CN115588653A (en) 2022-11-02 2022-11-02 Rectifier bridge

Country Status (1)

Country Link
CN (1) CN115588653A (en)

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