CN115587610B - Anti-metal electronic tag and manufacturing method thereof - Google Patents
Anti-metal electronic tag and manufacturing method thereof Download PDFInfo
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- CN115587610B CN115587610B CN202211446626.6A CN202211446626A CN115587610B CN 115587610 B CN115587610 B CN 115587610B CN 202211446626 A CN202211446626 A CN 202211446626A CN 115587610 B CN115587610 B CN 115587610B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/10—Resonant antennas
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
- Waveguide Aerials (AREA)
Abstract
The embodiment of the invention provides an anti-metal electronic tag and a manufacturing method thereof, belonging to the technical field of electronic tags. The anti-metal electronic tag includes: the electronic tag comprises a tag bonding layer, an electronic tag chip and an antenna structure; the electronic tag chip is positioned between the tag bonding layer and the antenna structure; the antenna structure comprises a radiation plate, wherein one end of the radiation plate penetrates through a plate body of the radiation plate and is provided with a U-shaped groove which is opened and points to the other end of the radiation plate and is closed; and an anti-disassembly bonding hole is reserved in the area, facing the electronic tag chip, of the tag bonding layer. The scheme of the invention solves the problems of narrow antenna bandwidth, poor adaptability and poor anti-disassembly performance of the conventional anti-metal electronic tag.
Description
Technical Field
The invention relates to the technical field of electronic tags, in particular to an anti-metal electronic tag and a manufacturing method of the anti-metal electronic tag.
Background
With the development of RFID technology, the requirements on the performance of electronic tags are increasing. The anti-metal electronic tag is an electronic tag packaged by a special anti-magnetic wave-absorbing material, and the problem that the electronic tag cannot be attached to the metal surface is technically solved. The product can be used outdoors, and is waterproof, acid-proof, alkali-proof and collision-proof. The anti-metal electronic tag can be attached to metal to obtain good reading performance, and even the distance is farther than the distance read in the air. By adopting a special circuit design, the model electronic tag can effectively prevent metal from interfering radio frequency signals, and the real outstanding performance of the anti-metal electronic tag is as follows: the read distance of the metal is longer than that of the metal which is not attached, which is an excellent result of the whole design. Based on the excellent performance of the anti-metal electronic tag, the anti-metal electronic tag is very wide in application and has higher corresponding performance requirements.
In the existing method, the design of the anti-metal electronic tag generally adopts the form of a common dipole antenna heightening or a microstrip antenna, and the tag is thicker in size in the mode of the dipole antenna heightening, so that the anti-metal electronic tag is inconvenient to use; the microstrip antenna is affected by the antenna structure, the general bandwidth is narrower, the gain is lower, the center frequency point of the anti-metal electronic tag produced by the influence of the production process can generate certain deviation, and the tag identification performance difference is larger; on the other hand, the anti-metal label is difficult to realize the anti-disassembly design due to the structural characteristics of the anti-metal label. Aiming at the problems of narrow antenna bandwidth, low gain and poor anti-disassembly performance of the traditional anti-metal electronic tag, a new anti-metal electronic tag needs to be created.
Disclosure of Invention
The embodiment of the invention aims to provide an anti-metal electronic tag and a manufacturing method thereof, which at least solve the problems of narrow antenna bandwidth, low gain and poor anti-disassembly performance of the traditional anti-metal electronic tag.
In order to achieve the above object, a first aspect of the present invention provides an anti-metal electronic tag, including: the electronic tag comprises a tag bonding layer, an electronic tag chip and an antenna structure; the electronic tag chip is positioned between the tag bonding layer and the antenna structure; the antenna structure comprises a radiation plate, wherein one end of the radiation plate penetrates through a plate body of the radiation plate and is provided with a U-shaped groove which is opened and points to the other end of the radiation plate and is closed; and an anti-disassembly bonding hole is reserved in the area, facing the electronic tag chip, of the tag bonding layer.
Optionally, the antenna structure further includes: an antenna body and an antenna substrate; the antenna body comprises a radiation plate and an antenna bottom plate; the radiation plate is positioned on the surface of the antenna substrate and is used for signal radiation; the antenna base plate is positioned between the antenna base plate and the label bonding layer and is used for fixing an antenna structure; a metallized via is disposed through the antenna substrate, the metallized via being used to connect the radiating plate and the antenna base plate.
Optionally, the antenna substrate is provided with a plurality of metallized through holes, and at least one metallized through hole is arranged on both sides inside and outside the bottom of the groove along the length direction of the U-shaped groove.
Optionally, the metallized via is filled with a conductive metal.
Optionally, the radiation plate and the antenna base plate are fixed based on adhesion of filler metal.
Optionally, the metallized via filled with conductive metal is further used for transmitting a signal generated by the electronic tag chip to a radiation plate.
The second aspect of the invention provides a method for manufacturing an anti-metal electronic tag, which comprises the following steps: fixing an electronic tag chip on the tag bonding layer, and forming anti-disassembly bonding holes in the area, facing the electronic tag chip, on the tag bonding layer; laying an antenna structure above the electronic tag chip; the antenna structure comprises a radiation plate, wherein one end of the radiation plate penetrates through the plate body of the radiation plate and is provided with a U-shaped groove which is opened and points to the other end of the radiation plate and is closed.
Optionally, the label adhesive layer is double-sided adhesive tape.
Optionally, the antenna structure further includes: an antenna body and an antenna substrate; the antenna body comprises a radiation plate and an antenna bottom plate; the radiation plate is positioned on the surface of the antenna substrate and is used for signal radiation; the antenna base plate is located between the antenna base plate and the tag bonding layer and used for fixing an antenna structure.
Optionally, the method further comprises: a metallized via is arranged through the antenna substrate to connect the radiation plate and the antenna bottom plate through the metallized via; and in the laying process of the antenna structure, performing metal filling operation on the metallized via holes on the antenna substrate.
Optionally, a metallized via is disposed through the antenna substrate, including: a plurality of metallized through holes are arranged through the antenna substrate, wherein at least one metallized through hole is arranged on the inner side and the outer side of the groove bottom along the length direction of the groove body of the U-shaped groove.
Optionally, the metal filling operation comprises an electrocautery metal filling operation or a metal grouting operation.
Optionally, the metal used in the metal filling operation is a conductive metal.
Through the technical scheme, the U-shaped slot is used as a resonant radiator, so that a plurality of current paths on the radiating plate are in resonance matching, and the bandwidth is further expanded. The purpose of expanding the frequency band of the microstrip antenna is achieved by generating multi-point resonance. And a structural design of an anti-disassembly bonding hole is reserved, so that the anti-disassembly design of the anti-metal label is realized. The antenna solves the problems of narrow bandwidth, low gain and poor anti-disassembly performance of the traditional anti-metal electronic tag.
Additional features and advantages of embodiments of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings are included to provide a further understanding of embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain, without limitation, the embodiments of the invention. In the drawings:
FIG. 1 is a schematic structural diagram of an anti-metal electronic tag according to an embodiment of the present invention;
FIG. 2 is a top view of a radiation plate of a metal resistant electronic tag provided in one embodiment of the present invention;
FIG. 3 is a bottom view of an antenna chassis provided in accordance with one embodiment of the present invention;
fig. 4 is a cross-sectional view of an anti-metal electronic tag according to an embodiment of the present invention.
Description of the reference numerals
10-a label adhesive layer; 20-an electronic tag chip; 30-antenna structure;
101-an anti-disassembly bonding hole; 301-an antenna substrate; 302-an antenna body;
3021-a radiation plate; 3022 an antenna backplane; 3023-metallizing the via;
3024-U-shaped groove.
Detailed Description
The following describes specific embodiments of the present invention in detail with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the invention, are not intended to limit the invention.
The principle of Radio Frequency Identification (RFID) is that a non-contact data communication is carried out between a reader and a tag, so that the aim of identifying a target is fulfilled. The RFID is widely applied, and is typically applied to animal wafers, automobile wafer burglar alarms, access control, parking lot control, production line automation and material management. The radio frequency identification technology realizes non-contact two-way communication by combining radio wave with a rapid information exchange and storage technology and combining radio communication with a data access technology and then connecting a database system, thereby achieving the purpose of identification, being used for data exchange and being connected in series to form a very complex system. In the identification system, reading, writing and communication of the electronic tag are realized through electromagnetic waves. The communication distance can be divided into near field and far field, and for this reason, the data exchange manner between the read/write device and the electronic tag is correspondingly divided into load modulation and backscatter modulation, which are considered as one of the most promising information technologies in the 21 st century.
With the development of RFID technology, the requirements on the performance of electronic tags are increasing. The anti-metal electronic tag is an electronic tag packaged by a special anti-magnetic wave-absorbing material, and the problem that the electronic tag cannot be attached to the metal surface is technically solved. The product can be used outdoors, and is waterproof, acid-proof, alkali-proof and collision-proof. The anti-metal electronic tag can be attached to metal to obtain good reading performance, and even the distance is farther than the distance read in the air. By adopting a special circuit design, the model electronic tag can effectively prevent metal from interfering radio frequency signals, and the real outstanding performance of the anti-metal electronic tag is as follows: the read distance of the metal is longer than that of the metal which is not attached, which is an excellent result of the whole design. Based on the excellent performance of the anti-metal electronic tag, the anti-metal electronic tag is very wide in application and has higher corresponding performance requirements.
In the existing method, the design of the anti-metal electronic tag generally adopts the form of a common dipole antenna heightening or a microstrip antenna, and the tag is thicker in size in the mode of the dipole antenna heightening, so that the anti-metal electronic tag is inconvenient to use; the microstrip antenna is affected by the antenna structure 30, the bandwidth is generally narrow, the gain is low, the center frequency point of the anti-metal electronic tag produced by the influence of the production process can generate certain deviation, and the tag identification performance difference is large; on the other hand, the anti-metal label is difficult to realize the anti-disassembly design due to the structural characteristics of the anti-metal label.
Aiming at the problems of narrow antenna bandwidth, low gain and poor anti-disassembly performance of the traditional anti-metal electronic tag, the scheme of the invention provides a novel anti-metal electronic tag. For convenience of explanation of the scheme, the scheme is explained below by the U-plane antenna.
Fig. 1 is a system configuration diagram of an anti-metal electronic tag according to an embodiment of the present invention. As shown in fig. 1, an embodiment of the present invention provides an anti-metal electronic tag, where the system includes: a label adhesive layer 10, an electronic label and an antenna structure 30; the electronic tag is located between the tag adhesive layer 10 and the antenna structure 30; the antenna structure 30 includes a radiation plate, one end of which penetrates through a plate body of the radiation plate 3021 and is provided with a closed U-shaped groove 3024 which is open and points to the other end of the radiation plate 3021; the anti-disassembly adhesive hole 101 is reserved in the area in the label adhesive layer 10 facing the electronic label.
In the embodiment of the invention, in the prior art, the RFID anti-metal electronic tag is generally designed and manufactured by four methods, namely:
1) A mode of heightening a common dipole antenna tag;
2) A mode of adding a wave-absorbing material into a common label is adopted;
3) A substrate with an electromagnetic band gap UBG structure is used as a dielectric plate of the antenna;
4) Microstrip antenna design method.
Among these, the first three methods are generally costly and bulky and are not suitable for application to large-scale equipment surfaces. The microstrip antenna generally has a structure comprising a dielectric substrate, a radiator, and a ground plate. The thickness of the dielectric substrate is far smaller than the wavelength, the metal thin layer at the bottom of the substrate is connected with the grounding plate, and the metal thin layer with a specific shape is manufactured on the front side of the dielectric substrate through a photoetching process to serve as a radiator. The shape of the radiation sheet can be variously changed according to the requirements. The development of microstrip antennas is driven by the rise of microwave integration technology and new manufacturing processes. Compared with the traditional antenna, the microstrip antenna has the advantages of small volume, light weight, low profile, easy conformal, easy integration, low cost, suitability for mass production, diversified electrical properties and the like. The microstrip antenna design method is very suitable for the anti-metal electronic tag. However, microstrip antennas also have certain problems, such as a relatively narrow bandwidth and a high Q value; the loss is large, and the surface wave can be excited, so that the radiation efficiency is reduced; the performance is greatly affected by the material of the dielectric substrate, etc. These disadvantages in turn affect the identification performance of the electronic tag.
Based on this, the solution of the present invention needs to overcome the above-mentioned drawbacks while designing the anti-metal tag antenna structure 30 with a microstrip antenna. Preferably, in order to improve the adaptability of the anti-metal electronic tag, a U-shaped antenna is adopted to realize the broadband of the tag. The tag bandwidth can be greatly expanded through the U-shaped groove 3024 antenna structure 30 while the metal resistance characteristic is met, and the environmental adaptability of the tag is improved.
In the embodiment of the present invention, as shown in fig. 2, the structure 30 of combining the U-shaped slot 3024 antenna with the metallized via is selected, and the main purpose is to change the current path on the radiation plate so that the resonance point moves to a low frequency, and a relatively gentle return loss is formed. On the other hand, by forming the U-shaped groove 3024 and the edge metallization via connection, the U-shaped groove is used as a resonant radiator, so that a plurality of current paths on the radiation plate are in resonance matching, and the bandwidth is further expanded. The purpose of expanding the frequency band of the microstrip antenna is achieved by generating multi-point resonance. Further, the bandwidth of the microstrip antenna is widened, consumable use is reduced, cost is reduced, and reliability is improved.
Preferably, the antenna structure 30 includes: an antenna substrate 301 and an antenna body 302; the antenna body 302 is attached to the antenna substantially.
Preferably, as shown in fig. 3, the antenna body 302 includes: a radiation plate 3021, located on the surface of the antenna body 302, for radiating signals; an antenna base 3022 located between the antenna substrate 301 and the electronic tag chip 20, for fixing an antenna; a metallized via 3023 extending through the antenna substrate 301 is used to connect the radiation plate 3021 and the antenna chassis 3022.
In the embodiment of the present invention, the antenna substrate 301 is a filled polytetrafluoroethylene composite material or an FR-4 glass fiber board, so that it has better dielectric constant performance and heat-resistant and moisture-resistant performance, thereby ensuring the stability of the tag.
Preferably, a plurality of metallized vias 3023 are present on the antenna substrate 301.
Preferably, the metallized via 3023 is filled with a conductive metal.
Preferably, as shown in fig. 4, the radiation plate 3021 and the antenna base 3022 are fixed based on adhesion of filler metal.
In the embodiment of the present invention, the metallized via has various functional requirements, on one hand, the signal generated by the electronic tag chip 20 needs to be conducted to the radiation plate for being emitted. The radiation plate and the electronic tag chip 20 are blocked by the dielectric substrate, and a corresponding conductive path needs to be constructed to conduct the signal. Based on this, a plurality of metallized vias 3023 are preset, and the metallized vias 3023 are filled with conductive metal, so that signal conduction can be achieved. On the other hand, the two are required to be fixed based on the adhesion force between the filling metal and the radiation plate and the antenna base plate 3022, so that the multiple metallized vias 3023 can realize multi-point fixation, and the structural stability of the multi-point metallized vias is ensured.
Preferably, the metallized via 3023 is further used to transmit the signal generated by the electronic tag chip 20 to the radiation plate 3021.
Preferably, the long side dimension of the U-shaped groove is not less than 1/2 of the long side dimension of radiation plate 3021.
In the embodiment of the present invention, in order to secure the multi-point resonance effect, the size of the corresponding U-shaped groove cannot be excessively small, and the long side size of the U-shaped groove is preferably set to be not less than 1/2 of the long side size of the radiation plate 3021.
The embodiment of the invention provides a manufacturing method of an anti-metal electronic tag, which comprises the following steps: fixing an electronic tag on the tag adhesive layer 10, and forming an anti-disassembly adhesive hole 101 in the area in the tag adhesive layer 10 opposite to the electronic tag; and (3) paving the antenna structure 30 above the electronic tag, and performing metal filling operation on the metallized via 3023 in the antenna structure 30 in the paving process.
Preferably, the label adhesive layer 10 is double-sided adhesive.
In the embodiment of the present invention, the tag adhesive layer 10 is used to ensure that the electronic tag and the corresponding attachment object are adhered and fixed during the use process. On the other hand, it is also necessary to secure the fixation between the antenna base plate 3022, the electronic tag chip 20, and the corresponding tag adhesive layer 10. Based on this, the corresponding label adhesive layer 10 needs to be designed as a double-sided back adhesive to achieve double-sided fixing.
Preferably, the antenna body 302 includes: a radiation plate 3021, located on the surface of the antenna body 302, for radiating signals; an antenna base 3022 located between the antenna substrate 301 and the electronic tag chip 20, for fixing an antenna; a metallized via 3023 extending through the antenna substrate 301 is used to connect the radiation plate 3021 and the antenna chassis 3022.
Preferably, a U-shaped slot structure is present at one end of the antenna structure 30.
Preferably, a plurality of metallized vias 3023 are present on the antenna substrate 301.
Preferably, the metal filling operation comprises any one of an electrocautery metal filling operation or a metal grouting operation.
Preferably, the metal used for the metal filling operation is a conductive metal.
In the embodiment of the invention, the radiation plate and the antenna floor need to have electric conduction performance, so that the radiation plate and the antenna floor are made of conductive metal or plated with conductive metal films, and when the metal is filled, the adhesion and fixation between metals can be realized through electrocautery metal filling operation or metal grouting.
Preferably, the electronic tag is fixed in a tamper-proof manner through a preset tamper-proof adhesive hole 101, so as to ensure the use safety of the electronic tag. In the existing anti-disassembly technology of the electronic tag, the technology of cutting a hidden groove on fragile paper and a base material is mainly adopted, but the technology is generally applied to common non-anti-metal tags. In order to realize the anti-disassembly characteristic of the tag, the special structural design is adopted, the tag chip is placed on the bottom plate of the microstrip antenna, a hole right opposite to the glue filling hole is formed on the back glue right opposite to the chip position under the tag during the production of the electronic tag, the epoxy resin AB glue is dripped into the glue filling hole and then is arranged on the surface of an attachment after being solidified (the best state can be achieved within 24 hours after the catalyst is added), and the epoxy resin AB glue is firmly adhered with the chip and the attachment during the use. When the tag is moved, the bonding force between the chip and the surface of the antenna is originally smaller than the bonding force between the epoxy resin adhesive and the chip and the adhesive, so that the chip is separated from the antenna, and the anti-disassembly effect is achieved.
Those skilled in the art will appreciate that all or part of the steps in a method for implementing the above embodiments may be implemented by a program stored in a storage medium, where the program includes several instructions for causing a single-chip microcomputer, chip or processor (procUssor) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a usb disk, a removable hard disk, a read-Only memory (ROM), a random access memory (RAM, random AccUss MUmory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
The alternative embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the embodiments of the present invention are not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solutions of the embodiments of the present invention within the scope of the technical concept of the embodiments of the present invention, and all the simple modifications belong to the protection scope of the embodiments of the present invention. In addition, the specific features described in the above embodiments may be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the various possible combinations of embodiments of the invention are not described in detail.
In addition, any combination of the various embodiments of the present invention may be made, so long as it does not deviate from the idea of the embodiments of the present invention, and it should also be regarded as what is disclosed in the embodiments of the present invention.
Claims (9)
1. An anti-metal electronic tag, characterized in that the anti-metal electronic tag comprises:
the electronic tag comprises a tag bonding layer, an electronic tag chip and an antenna structure;
the electronic tag chip is positioned between the tag bonding layer and the antenna structure;
the antenna structure comprises a radiation plate, wherein one end of the radiation plate penetrates through a plate body of the radiation plate and is provided with a U-shaped groove which is opened and points to the other end of the radiation plate and is closed;
the long side dimension of the U-shaped groove is not less than 1/2 of the long side dimension of the radiation plate;
the tag bonding layer is provided with anti-disassembly bonding holes in advance in the area right opposite to the electronic tag chip;
the anti-disassembly bonding hole is a hole which is formed in the back adhesive facing to the position of the electronic tag chip and is opposite to the glue filling hole, and the chip falls off from the antenna when the tag is moved;
the antenna structure comprises: an antenna body and an antenna substrate;
the antenna body comprises a radiation plate and an antenna bottom plate;
the radiation plate is positioned on the surface of the antenna substrate and is used for signal radiation;
the antenna base plate is positioned between the antenna base plate and the label bonding layer and is used for fixing an antenna structure;
a metallized via hole is arranged through the antenna substrate, and the metallized via hole is used for connecting the radiation plate and the antenna bottom plate;
the antenna substrate is provided with a plurality of metallized through holes, and at least one metallized through hole is arranged on the inner side and the outer side of the groove bottom along the length direction of the U-shaped groove body.
2. The anti-metal electronic tag of claim 1, wherein the metallized via is filled with a conductive metal.
3. The anti-metal electronic tag according to claim 2, wherein the radiation plate and the antenna base plate are fixed based on adhesion of filler metal.
4. The anti-metal electronic tag of claim 2, wherein the metallized via filled with a conductive metal is further used to transmit signals generated by the electronic tag chip to a radiating plate.
5. A method for manufacturing an anti-metal electronic tag, which is characterized by comprising the following steps:
fixing an electronic tag chip on the tag bonding layer, and forming anti-disassembly bonding holes in the area, facing the electronic tag chip, on the tag bonding layer;
the anti-disassembly bonding hole is a hole which is formed in the back adhesive facing to the position of the electronic tag chip and is opposite to the glue filling hole, and the chip falls off from the antenna when the tag is moved;
laying an antenna structure above the electronic tag chip;
the antenna structure comprises a radiation plate, wherein one end of the radiation plate penetrates through a plate body of the radiation plate and is provided with a U-shaped groove which is opened and points to the other end of the radiation plate and is closed;
the long side dimension of the U-shaped groove is not less than 1/2 of the long side dimension of the radiation plate;
the antenna structure comprises: an antenna body and an antenna substrate;
the antenna body comprises a radiation plate and an antenna bottom plate;
the radiation plate is positioned on the surface of the antenna substrate and is used for signal radiation;
the antenna base plate is positioned between the antenna base plate and the label bonding layer and is used for fixing an antenna structure;
a metallized via hole is arranged through the antenna substrate, and the metallized via hole is used for connecting the radiation plate and the antenna bottom plate;
the antenna substrate is provided with a plurality of metallized through holes, and at least one metallized through hole is arranged on the inner side and the outer side of the groove bottom along the length direction of the U-shaped groove body.
6. The method of claim 5, wherein the label is an adhesive layer double sided backing adhesive.
7. The method of claim 5, further comprising:
a metallized via is arranged through the antenna substrate to connect the radiation plate and the antenna bottom plate through the metallized via;
and in the laying process of the antenna structure, performing metal filling operation on the metallized via holes on the antenna substrate.
8. The method of claim 7, wherein the metal filling operation comprises an electrocautery metal filling operation or a metal grouting operation.
9. The method of claim 7, wherein the metal used in the metal filling operation is a conductive metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211446626.6A CN115587610B (en) | 2022-11-18 | 2022-11-18 | Anti-metal electronic tag and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211446626.6A CN115587610B (en) | 2022-11-18 | 2022-11-18 | Anti-metal electronic tag and manufacturing method thereof |
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| CN115587610A CN115587610A (en) | 2023-01-10 |
| CN115587610B true CN115587610B (en) | 2023-06-27 |
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| CN105305040A (en) * | 2015-09-25 | 2016-02-03 | 西安电子科技大学 | Antenna used for anti-metal tag and antenna signal transmitting and receiving method |
| CN108320008A (en) * | 2017-01-17 | 2018-07-24 | 华大半导体有限公司 | Electronic tag tamper method |
| CN206684763U (en) * | 2017-03-23 | 2017-11-28 | 上海航天芯锐电子科技有限公司 | A kind of ultra-thin anti-metal electronic nameplate labels of UHF RFID |
| EP3750109A1 (en) * | 2018-02-08 | 2020-12-16 | Avery Dennison Retail Information Services, LLC | Edge attachable radio frequency identification tags |
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