CN115587610A - Anti-metal electronic tag and manufacturing method - Google Patents

Anti-metal electronic tag and manufacturing method Download PDF

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Publication number
CN115587610A
CN115587610A CN202211446626.6A CN202211446626A CN115587610A CN 115587610 A CN115587610 A CN 115587610A CN 202211446626 A CN202211446626 A CN 202211446626A CN 115587610 A CN115587610 A CN 115587610A
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CN
China
Prior art keywords
antenna
electronic tag
metal
radiation plate
plate
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Granted
Application number
CN202211446626.6A
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Chinese (zh)
Other versions
CN115587610B (en
Inventor
赵军伟
帅伟
刘俊杰
杜鹃
王文赫
刘国营
时汉
侯秀峰
王璐
巴珊
张志兴
易玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
State Grid Corp of China SGCC
Beijing Smartchip Microelectronics Technology Co Ltd
Beijing Smartchip Semiconductor Technology Co Ltd
Original Assignee
State Grid Corp of China SGCC
Beijing Smartchip Microelectronics Technology Co Ltd
Beijing Smartchip Semiconductor Technology Co Ltd
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Application filed by State Grid Corp of China SGCC, Beijing Smartchip Microelectronics Technology Co Ltd, Beijing Smartchip Semiconductor Technology Co Ltd filed Critical State Grid Corp of China SGCC
Priority to CN202211446626.6A priority Critical patent/CN115587610B/en
Publication of CN115587610A publication Critical patent/CN115587610A/en
Application granted granted Critical
Publication of CN115587610B publication Critical patent/CN115587610B/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/10Resonant antennas

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)

Abstract

The embodiment of the invention provides an anti-metal electronic tag and a manufacturing method thereof, and belongs to the technical field of electronic tags. The anti-metal electronic tag comprises: the electronic tag comprises a tag bonding layer, an electronic tag chip and an antenna structure; the electronic tag chip is positioned between the tag bonding layer and the antenna structure; the antenna structure comprises a radiation plate, wherein one end of the radiation plate penetrates through a plate body of the radiation plate and is provided with a closed U-shaped groove with an opening pointing to the other end of the radiation plate; and an anti-disassembly bonding hole is reserved in the area, which is opposite to the electronic tag chip, on the tag bonding layer. The scheme of the invention solves the problems of narrow bandwidth, poor adaptability and poor anti-dismantling performance of the existing anti-metal electronic tag antenna.

Description

Anti-metal electronic tag and manufacturing method thereof
Technical Field
The invention relates to the technical field of electronic tags, in particular to a metal-resistant electronic tag and a manufacturing method thereof.
Background
With the development of RFID technology, the requirements for the performance of electronic tags are higher and higher. The anti-metal electronic tag is an electronic tag packaged by a special anti-magnetic wave-absorbing material, and technically solves the problem that the electronic tag cannot be attached to a metal surface for use. The product can prevent water, acid, alkali and collision and can be used outdoors. The metal-resistant electronic tag can obtain good reading performance even farther than the reading distance in the air when being attached to the metal. By adopting special circuit design, the electronic tag can effectively prevent metal from interfering radio frequency signals, and the real anti-metal electronic tag has the following outstanding performances: the reading distance of the metal paste is farther than that of the metal paste, which is an excellent result of the overall design. The metal-resistant electronic tag is based on the excellent performance of the metal-resistant electronic tag, the application of the metal-resistant electronic tag is very wide, and the corresponding performance requirement is higher.
In the existing method, the anti-metal electronic tag is generally designed in the form of a common dipole antenna pad height or a microstrip antenna, and the tag is thick in size and inconvenient to use in the mode of the dipole antenna pad height; the microstrip antenna is influenced by the antenna structure, generally has narrower bandwidth and lower gain, the center frequency point of the produced anti-metal electronic tag influenced by the production process can generate certain deviation, and the tag identification performance difference is larger; on the other hand, the anti-metal label is difficult to realize the anti-disassembly design due to the structural characteristics of the anti-metal label. Aiming at the problems of narrow bandwidth, low gain and poor anti-disassembly performance of the existing anti-metal electronic tag antenna, a new anti-metal electronic tag needs to be created.
Disclosure of Invention
The invention aims to provide a metal-resistant electronic tag and a manufacturing method thereof, and at least solves the problems of narrow bandwidth, low gain and poor anti-dismounting performance of the existing metal-resistant electronic tag antenna.
In order to achieve the above object, a first aspect of the present invention provides a metal-resistant electronic tag, including: the electronic tag comprises a tag bonding layer, an electronic tag chip and an antenna structure; the electronic tag chip is positioned between the tag bonding layer and the antenna structure; the antenna structure comprises a radiation plate, wherein one end of the radiation plate penetrates through a radiation plate body and is provided with a closed U-shaped groove with an opening pointing to the other end of the radiation plate; and an anti-disassembly bonding hole is reserved in the area, which is opposite to the electronic tag chip, on the tag bonding layer.
Optionally, the antenna structure further includes: an antenna body and an antenna substrate; the antenna body comprises a radiation plate and an antenna bottom plate; the radiating plate is positioned on the surface of the antenna substrate and used for signal radiation; the antenna base plate is positioned between the antenna substrate and the label bonding layer and used for fixing the antenna structure; a metalized through hole is formed through the antenna substrate and is used for connecting the radiation plate and the antenna bottom plate.
Optionally, a plurality of metalized through holes are formed in the antenna substrate, and at least one metalized through hole is formed in each of the inner side and the outer side of the groove bottom along the length direction of the groove body of the U-shaped groove.
Optionally, the metalized via hole is filled with a conductive metal.
Optionally, the radiation plate and the antenna base plate are fixed based on adhesion of a filler metal.
Optionally, the metalized via filled with the conductive metal is further used for transmitting a signal generated by the electronic tag chip to the radiation plate.
The invention provides a method for manufacturing a metal-resistant electronic tag, which comprises the following steps: fixing the electronic tag chip on the tag bonding layer, and forming an anti-disassembly bonding hole in the region, which is opposite to the electronic tag chip, on the tag bonding layer; laying an antenna structure above the electronic tag chip; the antenna structure comprises a radiation plate, wherein one end of the radiation plate penetrates through a radiation plate body and is provided with a closed U-shaped groove with an opening pointing to the other end of the radiation plate.
Optionally, the label adhesive layer is double-sided adhesive.
Optionally, the antenna structure further includes: an antenna body and an antenna substrate; the antenna body comprises a radiation plate and an antenna bottom plate; the radiating plate is positioned on the surface of the antenna substrate and used for signal radiation; the antenna bottom plate is located between the antenna substrate and the label bonding layer and used for fixing the antenna structure.
Optionally, the method further includes: a metallized via hole is arranged through the antenna substrate so as to connect the radiation plate and the antenna bottom plate through the metallized via hole; and in the process of laying the antenna structure, carrying out metal filling operation on the metallized through holes on the antenna substrate.
Optionally, a metalized via is disposed through the antenna substrate, including: a plurality of metalized through holes are formed in the antenna substrate in a penetrating mode, wherein at least one metalized through hole is formed in the inner side and the outer side of the groove bottom along the length direction of the groove body of the U-shaped groove.
Optionally, the metal filling operation comprises an electrocautery metal filling operation or a metal grouting operation.
Optionally, the metal used in the metal filling operation is a conductive metal.
According to the technical scheme, the U-shaped slot serves as a resonant radiator, so that a plurality of current paths on the radiating plate are in resonant matching, and the bandwidth is further expanded. The aim of widening the frequency band of the microstrip antenna is achieved by generating multi-point resonance. And a structural design of a disassembly-preventing bonding hole is reserved, so that the disassembly-preventing design of the anti-metal label is realized. The problems of narrow bandwidth, low gain and poor anti-dismantling performance of the conventional anti-metal electronic tag antenna are solved.
Additional features and advantages of embodiments of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the embodiments of the invention without limiting the embodiments of the invention. In the drawings:
fig. 1 is a schematic structural diagram of a metal-resistant electronic tag according to an embodiment of the present invention;
FIG. 2 is a top view of a radiation plate of a metal-resistant electronic tag according to an embodiment of the present invention;
FIG. 3 is a bottom view of an antenna backing plate according to one embodiment of the present invention;
fig. 4 is a cross-sectional view of a metal-resistant electronic tag according to an embodiment of the present invention.
Description of the reference numerals
10-a label adhesive layer; 20-an electronic tag chip; 30-an antenna structure;
101-anti-disassembly bonding hole; 301-an antenna substrate; 302-an antenna body;
3021-a radiation plate; 3022-antenna backplane; 3023-metallized vias;
3024-U-shaped groove.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
The principle of Radio Frequency Identification (RFID) is that a reader and a tag perform non-contact data communication to achieve the purpose of identifying a target. The application of RFID is very wide, and typical applications include animal chip, automobile chip burglar alarm, entrance guard control, parking lot control, production line automation and material management. The radio frequency identification technology realizes non-contact two-way communication by combining radio wave non-contact quick information exchange and storage technology and wireless communication with data access technology and then connecting a database system, thereby achieving the aim of identification. In the identification system, reading and writing and communication of the electronic tag are realized through electromagnetic waves. According to the communication distance, the data exchange mode between the read/write device and the electronic tag can be divided into near field and far field, and accordingly, the data exchange mode is divided into load modulation and backscatter modulation, which is considered to be one of the most promising information technologies in the 21 st century.
With the development of RFID technology, the requirements for the performance of electronic tags are higher and higher. The anti-metal electronic tag is an electronic tag packaged by a special anti-magnetic wave-absorbing material, and technically solves the problem that the electronic tag cannot be attached to a metal surface for use. The product can be waterproof, acid-proof, alkali-proof and anti-collision, and can be used outdoors. The metal-resistant electronic tag can obtain good reading performance even farther than the reading distance in the air when being attached to the metal. By adopting special circuit design, the electronic tag can effectively prevent metal from interfering radio frequency signals, and the real anti-metal electronic tag has the following outstanding performances: the reading distance of the metal paste is farther than that of the metal paste, which is an excellent result of the overall design. The metal-resistant electronic tag is very wide in application and higher in corresponding performance requirement just based on the excellent performance of the metal-resistant electronic tag.
In the existing method, the anti-metal electronic tag is generally designed in the form of a common dipole antenna pad height or a microstrip antenna, and the tag is thick in size and inconvenient to use in the mode of the dipole antenna pad height; the microstrip antenna is influenced by the antenna structure 30, generally has narrower bandwidth and lower gain, the center frequency point of the anti-metal electronic tag produced under the influence of the production process can generate certain deviation, and the tag identification performance difference is larger; on the other hand, the anti-metal label is difficult to achieve the anti-disassembly design due to the structural characteristics of the anti-metal label.
Aiming at the problems of narrow bandwidth, low gain and poor anti-disassembly performance of the existing anti-metal electronic tag antenna, the invention provides a novel anti-metal electronic tag, and the invention increases the bandwidth of the electronic tag by arranging a plurality of parallel slotted holes at one end of a radiation plate, for example, a U-shaped groove 3024 antenna consisting of two slotted holes, and reserves the structural design of an anti-disassembly adhesion hole 101 to realize the anti-disassembly of the anti-metal tag. For convenience of explanation, the following explanation is made of the scheme of the U-plane antenna.
Fig. 1 is a system configuration diagram of a metal-resistant electronic tag according to an embodiment of the present invention. As shown in fig. 1, an embodiment of the present invention provides a metal-resistant electronic tag, including: a label adhesive layer 10, an electronic label and antenna structure 30; the electronic tag is positioned between the tag adhesive layer 10 and the antenna structure 30; the antenna structure 30 includes a radiation plate, one end of the radiation plate penetrates through the body of the radiation plate 3021 and is provided with a closed U-shaped slot 3024 with an opening pointing to the other end of the radiation plate 3021; a tamper-proof adhesive hole 101 is reserved in an area of the label adhesive layer 10 facing the electronic label.
In the embodiment of the present invention, in the prior art, the RFID metal-resistant electronic tag is generally designed and manufactured by four methods, that is:
1) Raising a common dipole antenna tag;
2) Adopting a mode of adding wave-absorbing materials into common labels;
3) A substrate with an electromagnetic band gap UBG structure is used as a dielectric plate of the antenna;
4) A design method of a microstrip antenna.
Among them, the first three methods generally have high cost and large volume, and are not suitable for being applied to surfaces of large-scale equipment. The microstrip antenna generally includes a dielectric substrate, a radiator, and a ground plate. The thickness of the dielectric substrate is far smaller than the wavelength, the metal thin layer at the bottom of the substrate is connected with the grounding plate, and the metal thin layer with a specific shape is manufactured on the front surface of the substrate through a photoetching process to be used as a radiator. The shape of the radiating fins can be varied in many ways according to requirements. The rise of microwave integration technology and new manufacturing processes has pushed the development of microstrip antennas. Compared with the traditional antenna, the microstrip antenna has the advantages of small volume, light weight, low profile, easy conformality, easy integration, low cost, suitability for batch production, electrical property diversification and the like. Therefore, the design method of the microstrip antenna is very suitable for the anti-metal electronic tag. However, microstrip antennas also have certain problems, such as relatively narrow bandwidth and high Q value; the loss is large and surface waves are excited, resulting in a reduction in radiation efficiency; the performance is greatly influenced by the material of the dielectric substrate, and the like. These disadvantages in turn affect the identification performance of the electronic tag.
In view of the above, the solution of the present invention needs to overcome the above disadvantages while using microstrip antenna to design the anti-metal tag antenna structure 30. Preferably, in order to improve the adaptability of the anti-metal electronic tag, a U-shaped antenna is adopted to realize the broadband of the tag. The anti-metal characteristic can be met, meanwhile, the tag bandwidth can be greatly expanded through the U-shaped groove 3024 antenna structure 30, and the environmental adaptability of the tag is improved.
In the embodiment of the present invention, as shown in fig. 2, the structure 30 of the antenna of the U-shaped groove 3024 in combination with the metalized via is selected, and the main purpose is to change the current path on the radiating plate, so that the resonance point moves to a low frequency, and a relatively flat return loss is formed. On the other hand, the U-shaped groove 3024 and the metalized via hole at the edge are connected to serve as a resonant radiator, so that a plurality of current paths on the radiating plate are in resonant matching, and the bandwidth is further expanded. The purpose of widening the frequency band of the microstrip antenna is achieved by generating multi-point resonance. Furthermore, the bandwidth of the microstrip antenna is widened, the consumption of materials is reduced, the cost is reduced, and the reliability is improved.
Preferably, the antenna structure 30 includes: an antenna substrate 301 and an antenna body 302; the antenna body 302 is attached to the antenna body.
Preferably, as shown in fig. 3, the antenna body 302 includes: a radiation plate 3021 located on the surface of the antenna body 302 for signal radiation; an antenna base plate 3022 located between the antenna substrate 301 and the electronic tag chip 20 for fixing an antenna; a metalized via 3023 extending through the antenna substrate 301 for connecting the radiating plate 3021 to the antenna base plate 3022.
In the embodiment of the present invention, the antenna substrate 301 is filled with a teflon composite material or an FR-4 glass fiber board, so that the antenna substrate has good dielectric constant performance and heat-resistant and moisture-proof performance, thereby ensuring the stability of the tag.
Preferably, a plurality of the metalized vias 3023 are present on the antenna substrate 301.
Preferably, the metalized via 3023 is filled with a conductive metal.
Preferably, as shown in fig. 4, the radiation plate 3021 and the antenna base 3022 are fixed based on a filler metal adhesion.
In the embodiment of the present invention, the metallized holes have various functional requirements, such as conducting the signal generated by the electronic tag chip 20 to the radiation plate for emitting the signal. The radiation plate and the electronic tag chip 20 are isolated by the dielectric substrate, and a corresponding conductive path needs to be constructed to conduct the signal. Based on this, a plurality of metalized vias 3023 are preset, and conductive metal is filled in the metalized vias 3023, so that signal conduction can be realized. On the other hand, the filling metal and the radiation plate need to be fixed by adhesion between the filling metal and the antenna base plate 3022, so that the plurality of metalized vias 3023 can achieve multipoint fixation, and ensure structural stability.
Preferably, the metalized via 3023 is also used for transmitting a signal generated by the electronic tag chip 20 to the radiation plate 3021.
Preferably, the size of the long side of the U-shaped groove is not less than 1/2 of the size of the long side of the radiation plate 3021.
In the embodiment of the present invention, in order to ensure the multi-point resonance effect, the size of the long side of the U-shaped groove should not be too small, and is preferably set to be not less than 1/2 of the size of the long side of the radiation plate 3021.
The embodiment of the invention provides a method for manufacturing an anti-metal electronic tag, which comprises the following steps: fixing the electronic tag on the tag bonding layer 10, and forming an anti-disassembly bonding hole 101 in the area of the tag bonding layer 10 opposite to the electronic tag; the antenna structure 30 is laid above the electronic tag, and during the laying process, a metal filling operation is performed on the metalized via hole 3023 in the antenna structure 30.
Preferably, the label attachment layer 10 is double-sided adhesive backed.
In the embodiment of the present invention, the function of the label bonding layer 10 is to ensure that the electronic label is bonded and fixed with a corresponding attachment object during use. On the other hand, it is also necessary to ensure fixation between the antenna base 3022, the electronic tag chip 20, and the corresponding tag adhesive layer 10. Based on this, it is necessary to design the corresponding label adhesive layer 10 as a double-sided adhesive to realize double-sided fixation.
Preferably, the antenna body 302 includes: a radiation plate 3021 located on the surface of the antenna body 302 for signal radiation; an antenna base plate 3022 located between the antenna substrate 301 and the electronic tag chip 20 for fixing an antenna; a metalized via 3023 extending through the antenna substrate 301 for connecting the radiating plate 3021 to the antenna base plate 3022.
Preferably, a U-shaped slot structure is formed at one end of the antenna structure 30.
Preferably, a plurality of the metalized vias 3023 are present on the antenna substrate 301.
Preferably, the metal filling operation includes any one of an electrocautery metal filling operation or a metal grouting operation.
Preferably, the metal used in the metal filling operation is a conductive metal.
In the embodiment of the invention, the radiation plate and the antenna floor need electric conductivity, so that the radiation plate and the antenna floor are made of conductive metal materials or plated with conductive metal films, and the adhesion and fixation between metals can be realized through electrocautery metal filling operation or metal grouting when the metals are filled.
Preferably, the electronic tag is fixed in a tamper-proof manner through a preset tamper-proof adhesive hole 101, so as to ensure the use safety of the electronic tag. In the existing anti-dismantling technology of the electronic tag, the technology of fragile paper and a hidden groove on a base material is mainly adopted, but the technology is generally applied to common non-anti-metal tags. In order to realize the anti-disassembly characteristic of the tag, the invention adopts a special structural design, the tag chip is placed on a bottom plate of the microstrip antenna, when the electronic tag is produced, a hole which is right opposite to a glue filling hole is formed on back glue which is right under the tag and is right opposite to the chip, when the electronic tag is used, epoxy resin AB glue is dripped into the glue filling hole and then is installed on the surface of an attachment, and after the epoxy resin AB glue is cured (catalyst is added, the best state can be achieved within 24 hours), the epoxy resin AB glue is firmly bonded with the chip and the attachment. When the tag is moved, the bonding force between the chip and the surface of the antenna is originally smaller than the bonding force between the epoxy resin adhesive and the chip and the adhesive, so that the chip falls off from the antenna, and the anti-dismounting effect is achieved.
Those skilled in the art will appreciate that all or part of the steps in the method for implementing the above embodiments may be implemented by a program, which is stored in a storage medium and includes instructions for causing a single chip, a chip, or a processor (procUssor) to perform all or part of the steps in the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U disk, a portable hard disk, a read-Only memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and various media capable of storing program codes.
While the embodiments of the present invention have been described in detail with reference to the accompanying drawings, the embodiments of the present invention are not limited to the details of the above embodiments, and various simple modifications can be made to the technical solution of the embodiments of the present invention within the technical idea of the embodiments of the present invention, and the simple modifications are within the scope of the embodiments of the present invention. It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, the embodiments of the present invention will not be described separately for the various possible combinations.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as disclosed in the embodiments of the present invention as long as it does not depart from the spirit of the embodiments of the present invention.

Claims (13)

1. A metal-resistant electronic tag, comprising:
the electronic tag comprises a tag bonding layer, an electronic tag chip and an antenna structure;
the electronic tag chip is positioned between the tag bonding layer and the antenna structure;
the antenna structure comprises a radiation plate, wherein one end of the radiation plate penetrates through a radiation plate body and is provided with a closed U-shaped groove with an opening pointing to the other end of the radiation plate;
and an anti-disassembly bonding hole is reserved in the area, which is opposite to the electronic tag chip, on the tag bonding layer.
2. The metal-resistant electronic tag of claim 1, wherein the antenna structure comprises: an antenna body and an antenna substrate;
the antenna body comprises a radiation plate and an antenna bottom plate;
the radiating plate is positioned on the surface of the antenna substrate and used for signal radiation;
the antenna base plate is positioned between the antenna substrate and the label bonding layer and used for fixing the antenna structure;
a metalized through hole is formed through the antenna substrate and is used for connecting the radiation plate and the antenna bottom plate.
3. The metal-resistant electronic tag according to claim 2, wherein a plurality of metalized through holes are formed in the antenna substrate, and at least one metalized through hole is formed in each of the inner side and the outer side of the bottom of the U-shaped groove along the length direction of the groove body of the U-shaped groove.
4. The metal-resistant electronic tag of claim 2, wherein the metalized via is filled with a conductive metal.
5. The metal-resistant electronic tag of claim 4, wherein the radiating plate and the antenna substrate are secured based on adhesion of a filler metal.
6. The metal-resistant electronic tag according to claim 4, wherein the metallized via filled with conductive metal is also used to transmit signals generated by the electronic tag chip to a radiating plate.
7. A method for manufacturing a metal-resistant electronic tag is characterized by comprising the following steps:
fixing the electronic tag chip on the tag bonding layer, and forming an anti-disassembly bonding hole in the region, which is opposite to the electronic tag chip, on the tag bonding layer;
laying an antenna structure above the electronic tag chip;
the antenna structure comprises a radiation plate, wherein one end of the radiation plate penetrates through a radiation plate body and is provided with a closed U-shaped groove with an opening pointing to the other end of the radiation plate.
8. The method of claim 7 wherein the label-adhesive layer is double-sided adhesive backed.
9. The method of claim 7, wherein the antenna structure comprises:
an antenna body and an antenna substrate;
the antenna body comprises a radiation plate and an antenna bottom plate;
the radiating plate is positioned on the surface of the antenna substrate and used for signal radiation;
the antenna bottom plate is located between the antenna substrate and the label bonding layer and used for fixing the antenna structure.
10. The method of claim 9, further comprising:
a metallized via hole is arranged through the antenna substrate so as to connect the radiation plate and the antenna bottom plate through the metallized via hole;
and in the process of laying the antenna structure, carrying out metal filling operation on the metallized through holes on the antenna substrate.
11. The method of claim 10, wherein disposing a metalized via through the antenna substrate comprises:
a plurality of metalized through holes are formed in the antenna substrate in a penetrating mode, wherein at least one metalized through hole is formed in the inner side and the outer side of the groove bottom along the length direction of the groove body of the U-shaped groove.
12. The method of claim 10, wherein the metal filling operation comprises an electrocautery metal filling operation or a metal grouting operation.
13. The method of claim 10, wherein the metal used for the metal filling operation is a conductive metal.
CN202211446626.6A 2022-11-18 2022-11-18 Anti-metal electronic tag and manufacturing method thereof Active CN115587610B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105305040A (en) * 2015-09-25 2016-02-03 西安电子科技大学 Antenna used for anti-metal tag and antenna signal transmitting and receiving method
CN206684763U (en) * 2017-03-23 2017-11-28 上海航天芯锐电子科技有限公司 A kind of ultra-thin anti-metal electronic nameplate labels of UHF RFID
CN108320008A (en) * 2017-01-17 2018-07-24 华大半导体有限公司 Electronic tag tamper method
US20190244072A1 (en) * 2018-02-08 2019-08-08 Avery Dennison Retail Information Services, Llc Edge attachable radio frequency identification tags

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CN105305040A (en) * 2015-09-25 2016-02-03 西安电子科技大学 Antenna used for anti-metal tag and antenna signal transmitting and receiving method
CN108320008A (en) * 2017-01-17 2018-07-24 华大半导体有限公司 Electronic tag tamper method
CN206684763U (en) * 2017-03-23 2017-11-28 上海航天芯锐电子科技有限公司 A kind of ultra-thin anti-metal electronic nameplate labels of UHF RFID
US20190244072A1 (en) * 2018-02-08 2019-08-08 Avery Dennison Retail Information Services, Llc Edge attachable radio frequency identification tags

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