CN115584505A - Stainless steel chemical polishing agent, preparation method and application - Google Patents
Stainless steel chemical polishing agent, preparation method and application Download PDFInfo
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- CN115584505A CN115584505A CN202211187149.6A CN202211187149A CN115584505A CN 115584505 A CN115584505 A CN 115584505A CN 202211187149 A CN202211187149 A CN 202211187149A CN 115584505 A CN115584505 A CN 115584505A
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- stainless steel
- polishing agent
- chemical polishing
- steel chemical
- polyethylene glycol
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- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 60
- 239000010935 stainless steel Substances 0.000 title claims abstract description 60
- 238000005498 polishing Methods 0.000 title claims abstract description 59
- 239000000126 substance Substances 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 30
- PBAYDYUZOSNJGU-UHFFFAOYSA-N Chelidonic acid Chemical compound OC(=O)C1=CC(=O)C=C(C(O)=O)O1 PBAYDYUZOSNJGU-UHFFFAOYSA-N 0.000 claims abstract description 28
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000010936 titanium Substances 0.000 claims abstract description 20
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 20
- RGZGHMSJVAQDQO-UHFFFAOYSA-L copper;selenate Chemical compound [Cu+2].[O-][Se]([O-])(=O)=O RGZGHMSJVAQDQO-UHFFFAOYSA-L 0.000 claims abstract description 15
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 13
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 13
- -1 ethoxy propargyl Chemical group 0.000 claims abstract description 12
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims abstract description 11
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 11
- 239000011734 sodium Substances 0.000 claims abstract description 11
- XFQSNGANBJABAH-UHFFFAOYSA-N 2,3,4,5-tetrafluoro-6-(1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,9-nonadecafluorononoxy)benzenesulfonic acid Chemical compound OS(=O)(=O)C1=C(F)C(F)=C(F)C(F)=C1OC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F XFQSNGANBJABAH-UHFFFAOYSA-N 0.000 claims abstract description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 12
- MOVNRDORQHRBDI-UHFFFAOYSA-N C1(=CC=CC=C1)S(=O)(=O)OOC(C(C(C(C(C(C(C(C(F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F Chemical compound C1(=CC=CC=C1)S(=O)(=O)OOC(C(C(C(C(C(C(C(C(F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F MOVNRDORQHRBDI-UHFFFAOYSA-N 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 4
- 229940057838 polyethylene glycol 4000 Drugs 0.000 claims description 4
- TVDSBUOJIPERQY-UHFFFAOYSA-N prop-2-yn-1-ol Chemical compound OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 238000000746 purification Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 2
- 238000000227 grinding Methods 0.000 abstract description 17
- 238000005260 corrosion Methods 0.000 abstract description 9
- 230000007797 corrosion Effects 0.000 abstract description 9
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000002253 acid Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 229910052580 B4C Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 2
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Abstract
The invention discloses a stainless steel chemical polishing agent, a preparation method and application thereof, wherein the stainless steel chemical polishing agent is characterized by comprising the following components in percentage by weight: 35-42% of titanium sol, 10-12% of copper selenate, 6-8% of trichloroacetic acid, 3-5% of polyethylene glycol, 3-5% of chelidonic acid, 4-6% of ethoxy propargyl alcohol, 1-3% of sodium perfluorononanyloxybenzene sulfonate and the balance of water. The stainless steel chemical polishing agent provided by the invention does not need external grinding power, provides grinding power by self chemical reaction, levels and grinds through chemical corrosion, and provides physical grinding power under the action of chemical corrosion and chemical replacement, so that the surface of stainless steel has good finish.
Description
Technical Field
The invention belongs to the technical field of metal surface treatment, and particularly relates to a stainless steel chemical polishing agent and a preparation method thereof.
Background
The stainless steel is polished to make the appearance more beautiful, and the glossiness of the surface of the stainless steel can be improved to a greater extent, so that the metal texture of the stainless steel is stronger, and the favorite appearance enjoyment can be provided for people, and compared with a plurality of metal products, the metal luster of the stainless steel is easier to be loved by consumers.
After the stainless steel is polished by using the stainless steel polishing agent, a special protective film can be formed on the surface of the stainless steel, the special protective film can better isolate chemical reactions of active molecules such as water, air and the like, the molecular structure of the stainless steel can be firmer, the chemical reactions cannot be easily generated, the stainless characteristics of the stainless steel can be better maintained, and the stainless steel needs to be polished, so that the service life of the stainless steel can be prolonged. According to the complexity of stainless steel products and different user requirements, the mirror surface gloss can be achieved by adopting methods such as mechanical polishing, chemical polishing, electrochemical polishing and the like. The mechanical polishing has high labor intensity, serious pollution and difficult processing of complex parts. The electrochemical polishing has large investment at one time, complex parts need to be assembled with tools and auxiliary electrodes, and the temperature is reduced in mass production. The chemical polishing can polish complex workpieces, has good polishing effect and improves the corrosion resistance.
Chinese patent CN201610039894.4 discloses a composite polishing solution for metal polishing and a preparation method thereof, wherein the composite polishing solution comprises the following components in percentage by mass: 0.1-2% of polycrystalline diamond micro powder, 0.1-2% of boron carbide micro powder, 5-60% of silica sol, 0.02-5% of dispersant, 0.001-0.5% of pH value regulator, 0-1% of corrosion inhibitor and the balance of water. The composite polishing solution for metal polishing is prepared by compounding polycrystalline diamond micro powder and boron carbide micro powder into a mixed abrasive, adding polishing assistant silicon dioxide sol, and adding a dispersing agent, a pH value regulator and a corrosion inhibitor; the composite polishing solution can obviously improve the polishing efficiency in metal polishing, prevents the abrasive from being embedded on the surface of a metal workpiece, improves the brightness of the workpiece, reduces the processing difficulty of the next procedure, and is suitable for popularization and use. This patent shows that it is only an abrasive, and requires an external grinding power (grinder, polisher, etc.) to achieve the polishing purpose.
Chinese patent CN202110820315.0 discloses a surface polishing agent material, which is composed of the following raw materials in parts by weight: 250-300 parts of tetrabutyl titanate, 3-5 parts of 2,6-di-tert-butyl-p-cresol, 10-20 parts of dodecatetradecyl dimethyl tertiary amine, 60-70 parts of methyl methacrylate, 2-4 parts of dibenzoyl peroxide, 5-7 parts of ceramic powder and 10-17 parts of epoxy chloropropane. According to the invention, tetrabutyl titanate is used as a precursor, a titanium dioxide sol raw material is finally obtained through hydrolysis, and the titanium dioxide sol raw material has higher toughness and polishing performance compared with kaolin. The patent mainly aims at cleaning, scratching removal, paint surface protection, glazing, polishing and the like of the automobile paint surface, and can not act on hard metal materials such as stainless steel and the like; the polishing work needs to be carried out by external force equipment such as a rotary polishing machine and the like.
Disclosure of Invention
One of the objectives of the present invention is to overcome the disadvantages of the prior art, and to provide a chemical polishing agent for stainless steel, which does not require additional polishing power, provides polishing power by its own chemical reaction, levels polishing through chemical etching, and provides physical polishing power under the action of chemical etching and chemical displacement, so as to achieve a good surface finish of stainless steel.
The second purpose of the invention is to provide a preparation method of the stainless steel chemical polishing agent.
The invention also aims to provide application of the stainless steel chemical polishing agent in stainless steel workpieces.
The stainless steel chemical polishing agent disclosed by the invention is prepared from the following components in percentage by weight:
preferably, the stainless steel chemical polishing agent is prepared from the following components in percentage by weight:
40% of titanium sol, 10% of copper selenate, 8% of trichloroacetic acid, 3% of polyethylene glycol, 4% of chelidonic acid, 6% of ethoxy propargyl alcohol, 2% of sodium perfluorononanyloxy benzene sulfonate and the balance of water.
The titanium sol contains 15-25% of titanium dioxide, has an average particle size of 10-20nm, preferably VK-TA32 of Hangzhou Zhi titanium purification technology Co., ltd, and has an average particle size: 15nm, titanium dioxide content: 20 percent.
The polymerization degree of the polyethylene glycol is 3500-4500, and polyethylene glycol 4000 is preferred.
Trichloroacetic acid is used for corroding a stainless steel substrate to carry out polishing and roughening treatment, strong acid such as hydrochloric acid, sulfuric acid and the like is too strong in corrosivity to carry out polishing and only roughening treatment, and the strong acid is added into the system, so that the method cannot be completed.
Chelidonic acid belongs to weak acid, can slowly corrode a stainless steel substrate to further achieve a polishing effect, strong acid such as hydrochloric acid, sulfuric acid and the like is too strong in corrosivity to polish and only can be subjected to roughening treatment, and strong acid is added into the system of the invention, so that the invention cannot be completed.
The preparation method of the stainless steel chemical polishing agent comprises the following steps:
(1) Putting water into a container, starting stirring, and keeping the rotating speed at 500-1000r/min;
(2) Sequentially adding titanium sol, copper selenate, trichloroacetic acid, polyethylene glycol 4000, chelidonic acid, ethyoxyl propargyl alcohol and sodium perfluorononanyloxy benzene sulfonate, uniformly stirring, and cooling to room temperature to obtain a sample.
The reaction mechanism of the chemical polishing agent for the stainless steel is as follows:
titanium sol is used as a grinding main agent; polyethylene glycol, chelidonic acid and ethyoxyl propargyl alcohol jointly form a physical grinding brightener; sodium perfluorononanyloxybenzene sulfonate is a physical grinding brightener; firstly, selenic acid ions in copper selenate remove natural oxide films on the surface of stainless steel, then trichloroacetic acid corrodes a stainless steel substrate, copper selenate and iron atoms perform a displacement reaction to generate copper films with different thicknesses on the surface of the stainless steel, the copper film at the microscopic surface peak top part of the stainless steel is thin, the copper film at the microscopic surface peak valley part of the stainless steel is thick, when trichloroacetic acid corrodes the copper films and the stainless steel substrate again, the purpose of microscopic surface leveling can be achieved, and the process also provides grinding internal power for titanium sol physical grinding. The working mechanism of the invention comprises chemical corrosion leveling grinding and physical grinding which provides physical grinding power under the action of chemical corrosion and chemical displacement.
The invention has the following beneficial effects:
the stainless steel surface finish is good by providing grinding power by self chemical reaction without external grinding power, leveling grinding by chemical corrosion and physical grinding by providing physical grinding power under the action of chemical corrosion and chemical replacement.
In order to illustrate the invention more clearly, the following examples are given without any limitation to the scope of the invention.
Detailed Description
In the examples, the titanium sol is VK-TA32 from Hangzhou Zhi titanium purification science and technology Limited, and the average particle size: 15nm, titanium dioxide content: 20 percent.
Example 1
The stainless steel chemical polishing agent is prepared from the following components in percentage by weight:
35% of titanium sol, 10% of copper selenate, 7% of trichloroacetic acid, 4000% of polyethylene glycol, 4% of chelidonic acid, 6% of ethoxy propargyl alcohol, 2% of sodium perfluorononanyloxy benzene sulfonate and the balance of water.
Example 2
The stainless steel chemical polishing agent is prepared from the following components in percentage by weight:
40% of titanium sol, 10% of copper selenate, 7% of trichloroacetic acid, 4000% of polyethylene glycol, 4% of chelidonic acid, 6% of ethoxy propargyl alcohol, 2% of perfluoro-nonyloxy benzene sulfonate, and the balance of water.
Example 3
The stainless steel chemical polishing agent is prepared from the following components in percentage by weight:
35% of titanium sol, 12% of copper selenate, 7% of trichloroacetic acid, 4000% of polyethylene glycol, 4% of chelidonic acid, 6% of ethoxy propargyl alcohol, 2% of sodium perfluorononanyloxy benzene sulfonate and the balance of water.
Example 4
The stainless steel chemical polishing agent is prepared from the following components in percentage by weight:
40% of titanium sol, 10% of copper selenate, 8% of trichloroacetic acid, 4000% of polyethylene glycol, 4% of chelidonic acid, 6% of ethoxy propargyl alcohol, 2% of perfluoro-nonyloxy benzene sulfonate, and the balance of water.
The preparation method of the stainless steel chemical polishing agent provided by the embodiment of the invention comprises the following steps:
(1) Putting water into a container, starting stirring, and keeping the rotating speed at 900r/min;
(2) Sequentially adding titanium sol, copper selenate, trichloroacetic acid, polyethylene glycol 4000, chelidonic acid, ethyoxyl propargyl alcohol and sodium perfluorononanyloxy benzene sulfonate, uniformly stirring, and cooling to room temperature to obtain a sample.
The above examples were used as follows:
the product is used as a stock solution without being diluted by water; and (3) soaking the stainless steel workpiece in the polishing solution at normal temperature and normal pressure to completely polish the workpiece.
Comparative example 1
The stainless steel chemical polishing agent is prepared from the following components in percentage by weight:
40% of titanium sol, 10% of copper sulfate, 8% of trichloroacetic acid, 4000% of polyethylene glycol, 4% of chelidonic acid, 6% of ethoxy propargyl alcohol, 2% of sodium perfluorononanyloxy benzene sulfonate and the balance of water.
Table 1 shows the test data of examples and comparative examples.
TABLE 1
| Item | Example 1 | Example 2 | Example 3 | Example 4 | Comparative example 1 |
| Smooth finish | 13 stage | 13 stage | 13 stage | 13 stage | Grade 10 |
| Roughness of | Ra 0.025 | Ra 0.025 | Ra 0.025 | Ra 0.025 | Ra 0.2 |
| Passivation Properties | 89 | 86 | 78 | 91 | 46 |
The invention can be carried out only by removing the natural oxide film on the surface of the stainless steel by selenate ions in the copper selenate, so that the removal of the stainless steel oxide film is the very critical first step, and the copper selenate is adopted in the formulas of the embodiments 1 to 4, the natural oxide film on the surface of the stainless steel is removed, and other components are matched, so that the surface smoothness of the stainless steel is 13 grades, the surface roughness Ra0.025 and the performance index of a passive film is more than 68.
The comparative example uses copper sulfate and cannot remove the stainless steel oxide film.
The technical indexes of the stainless steel chemical polishing agent are shown in the table 2.
TABLE 2
Claims (8)
1. The stainless steel chemical polishing agent is characterized by being prepared from the following components in percentage by weight: 35-42% of titanium sol, 10-12% of copper selenate, 6-8% of trichloroacetic acid, 3-5% of polyethylene glycol, 3-5% of chelidonic acid, 4-6% of ethoxy propargyl alcohol, 1-3% of sodium perfluorononanyloxybenzene sulfonate and the balance of water.
2. The stainless steel chemical polishing agent according to claim 1, characterized by being made of, in weight percent:
40% of titanium sol, 10% of copper selenate, 8% of trichloroacetic acid, 3% of polyethylene glycol, 4% of chelidonic acid, 6% of ethoxy propargyl alcohol, 2% of sodium perfluorononanyloxy benzene sulfonate and the balance of water.
3. The stainless steel chemical polishing agent according to claim 1, wherein the titanium sol has a titanium dioxide content of 15-25% and an average particle size of 10-20nm.
4. The stainless steel chemical polishing agent according to claim 1, wherein the titanium sol is VK-TA32 from hangzhou zhizhizhizi purification technologies ltd.
5. The stainless steel chemical polishing agent according to claim 1, wherein the degree of polymerization of the polyethylene glycol is 3500 to 4500.
6. The stainless steel chemical polishing agent according to claim 1, wherein the degree of polymerization of the polyethylene glycol is 4000.
7. The method of preparing a stainless steel chemical polishing agent according to claim 1, comprising the following steps in sequence:
(1) Putting water into a container, starting stirring, and keeping the rotating speed at 500-1000r/min;
(2) Sequentially adding titanium sol, copper selenate, trichloroacetic acid, polyethylene glycol 4000, chelidonic acid, ethyoxyl propargyl alcohol and sodium perfluorononanyloxy benzene sulfonate, uniformly stirring, and cooling to room temperature to obtain a sample.
8. Use of the stainless steel chemical polishing agent of claim 1 in a stainless steel workpiece.
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