CN115581016A - Packaging sealing cover with built-in metal ring and application and preparation thereof - Google Patents
Packaging sealing cover with built-in metal ring and application and preparation thereof Download PDFInfo
- Publication number
- CN115581016A CN115581016A CN202211093192.6A CN202211093192A CN115581016A CN 115581016 A CN115581016 A CN 115581016A CN 202211093192 A CN202211093192 A CN 202211093192A CN 115581016 A CN115581016 A CN 115581016A
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- China
- Prior art keywords
- metal ring
- sealing cover
- cover
- cavity structure
- glass insulator
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention relates to the field of electronic component packaging, in particular to a packaging sealing cover with a built-in metal ring and application and preparation thereof. The sealing cover is arranged on the circuit board and is used for being matched with the lead, the glass insulator and the cap to form the air-tight package of the electronic device; the size of the sealing cover is matched with an electronic device to be packaged, the inner side surface of the sealing cover is provided with a cavity structure which protrudes towards the outer side direction and is used for accommodating a glass insulator, the sealing cover further comprises a flat flash which is integrally arranged around the edge of the cavity structure, and the bottom surface of the flash is parallel to the surface of the circuit board for packaging so as to ensure the attachment; the cavity structure is internally provided with a metal ring with the same height as the cavity structure, and the sealing cover is arranged in the metal ring and provided with a through hole for inserting the lead. According to the invention, the insulating structure of the sealed glass is regular in shape by arranging the metal ring, so that the phenomenon of stress concentration of the glass is avoided, and the problems that the sealed glass is easy to crack, break edges and the like are solved.
Description
Technical Field
The invention relates to the field of electronic component packaging, in particular to a packaging sealing cover with a built-in metal ring and application and preparation thereof.
Background
In recent years, with the rapid development of intellectualization and informatization, the field of electronic components has come to burst in a blowout manner, and emerging and key electronic components represented by core and basic devices are receiving more and more attention. Electronic components generally consist of an internal chip, a circuit, a substrate and an airtight packaging shell, the rapid development of the electronic components cannot be supported by the airtight packaging shell, and the rapid development of the electronic components also drives the development of the airtight packaging shell.
The core and basic electronic components have strong universality and substitution interchangeability, are widely applied to various electronic information fields such as telecommunication transmission, intelligent control and the like, and have high requirements on quality stability and batch, so that the remarkable characteristics of strict requirement on quality consistency and large batch are realized. The airtight packaging shell serves as a key accessory, not only plays a role in interconnecting an internal circuit and an external circuit, but also plays other roles in protecting the internal circuit and the like, and is the most direct embodiment of performance indexes of electronic components, so that how to realize large-scale and stable preparation of the packaging shell is a difficult problem in the front of the industry.
For the housing, considering the problems of batch and quality consistency, the housing is generally prepared by punching a cavity body and directly filling the cavity with an integral large glass insulator for sintering. The punching process can form a transition fillet at the corner of the cavity or other abrupt structural changes, which is caused by the limitations of the punching process and cannot be thoroughly solved. Glass is a brittle material, but after sintering in the traditional package housing process, the glass forms a matched irregular structure with inflection points along a fillet structure, so that a stress concentration phenomenon easily occurs, and a large stress easily exceeds the yield limit of the glass material, so that defects such as cracks, edge breakage and the like are generated, which is fatal to the housing airtightness index. Meanwhile, a cold pressure welding process is generally adopted during cover sealing, the cover cap and the shell are forcedly sealed through combination of physical layers, the applied pressure is very large in the process, the pressure loaded on the shell is directly transmitted to the glass insulator, and the risk of cracks of the glass is further increased. The existence of the problem limits the rapid development of the packaging shell and also limits the high-speed rise of core and base electronic components.
Disclosure of Invention
In order to solve the problem that glass defects are easily generated in the sealing process of punching and integral large glass fusion sealing, the invention firstly provides a sealing cover with a built-in metal ring.
The technical scheme adopted by the invention is as follows:
a package sealing cover with a built-in metal ring is arranged on a circuit board and is used for being matched with a lead, a glass insulator and a cover cap to form air-tight package of an electronic device;
the size and the shape of the sealing cover are matched with an electronic device to be packaged, one surface, namely the inner side surface, of the sealing cover close to the circuit board is provided with a cavity structure which is convex towards the direction of one surface, namely the outer side surface, far away from the circuit board and is used for accommodating a melt-sealed glass insulator, the sealing cover further comprises a flash which is integrally arranged around the edge of the cavity structure, the flash is flat, and the bottom surface of the flash is parallel to the surface, used for packaging, of the circuit board so as to ensure the attachment; the sealing cover is arranged at a set position inside the metal ring and is provided with a through hole for inserting the lead.
Preferably, the metal ring is made of kovar alloy, and the shape of the metal ring is matched with the shape of a sealing inner cavity of the glass insulator.
Preferably, the distance between the outer edge of the metal ring and the inner wall of the cavity structure is 1-2 mm.
Preferably, the sealing cover substrate is formed by compounding oxygen-free copper arranged on the outer side face and kovar alloy arranged on the inner side face.
Preferably, the oxygen-free copper is TU1, and the kovar alloy is 4J29 or an iron-nickel alloy 4J42.
Preferably, the total thickness of the oxygen-free copper and the kovar alloy after being compounded is 0.1-1.0 mm, wherein the thickness ratio of the oxygen-free copper to the kovar alloy is 7:3.
the invention also provides an airtight packaging shell which comprises the packaging sealing cover with low glass insulator stress, the glass insulator arranged in the cavity structure of the sealing cover, and a lead inserted in the glass insulator and the sealing cover.
The preparation method of the airtight packaging shell comprises the following steps:
s1, processing a packaging sealing cover with a required size by using an oxygen-free copper and kovar alloy material and using a punching or turning or milling process, wherein the sealing cover comprises a cavity structure and a flash, and a through hole is formed in a corresponding position;
s2, processing a metal ring by using Kovar alloy according to the required size, and processing a lead hole matched with the through hole on the glass insulator, wherein the inner diameter of the metal ring is 0.2-0.4 mm larger than that of the glass insulator;
s3, assembling the metal ring into the cavity structure, assembling the glass insulator into the metal ring, setting the lead, and then sintering the sealing cover with the metal ring, the glass insulator and the lead at high temperature to form a whole through fusion sealing.
The invention also provides an airtight package, which comprises the airtight package shell and a cover cap arranged on the surface of the airtight package shell.
Preferably, the size of the cap is matched with that of the sealing cover, the edge of the cap is provided with an edge which is matched with the flash of the sealing cover in an arrangement mode, and the lower surface of the edge is attached to the upper surface of the flash of the sealing cover.
The invention has the beneficial effects that:
the invention has great advantages no matter the preparation of the packaging shell before packaging or the assembly of the packaged electronic component, can overcome the quality defects of the existing products, reduce the stress of the glass insulator, and improve the reliability of the products, and specifically comprises the following steps:
before packaging, the regular-shaped metal ring is added in the punched melt-sealed cavity structure, so that the large glass insulation structure after melt-sealing can be forcibly limited in the regular metal ring, the shape of the glass insulation structure after melt-sealing is regular, the stress concentration phenomenon of the glass caused by inflection points or sudden change is avoided, and the problems that the glass is easy to crack, break edges and the like after melt-sealing are solved. Meanwhile, the glass insulator added with the metal ring is not in direct contact with the packaging shell, so that the risk of glass cracking caused by the pressure of the sealing cover is reduced.
In order to achieve the best limiting effect, the shape of the metal ring is the same as that of the glass melt-sealed inner cavity, namely if the melt-sealed inner cavity is a circular cavity, the metal ring is designed and processed into a circular ring shape; if the fusion-sealed inner cavity is a rectangular cavity, the metal is designed and processed into a rectangular ring shape, and so on.
The invention adopts the whole large glass for insulation and sintering, the metal ring is processed by kovar alloy in consideration of the sealing reliability, and the matched whole large glass is made of materials matched with a sealing process system, such as DM305, BH-G/K, GBC and other brands of glass, which is actually equivalent to glass sealing on the surface of the kovar alloy and is similar to the conventional airtight sealing shell preparation process technology. The arrangement mode greatly saves the research and development cost and time cost of a new material or a new process, and further reduces the technical risk, so that the operability and the practicability of the invention are greatly enhanced.
For the reliability of the sealing cap after the circuit of the packaging shell is assembled: as known to those skilled in the art, in order to ensure the sealing reliability of electronic components, a cap sealing or a cover sealing process is required after the internal circuit is assembled and debugged to be qualified, so as to ensure that a complete device with the requirement of air tightness is formed. Because the invention adopts the scheme of melt sealing the whole large glass cavity and the circuit is arranged on the upper surface of the shell, the cap with a certain cavity depth can be only used for sealing the cap, but the cover plate of a flat plate type can not be used for sealing the cap.
Aiming at the traditional packaging structure, the whole large glass is in direct contact with the side edge of a packaging shell, and the pressure applied to the shell and a cover cap during cap sealing is directly transmitted to a glass insulation structure through the side edge of the shell, so that the defects of edge breakage, cracks and the like of the glass are easily caused. At this time, the electronic component product will be scrapped, and the resulting cost-economic loss and time loss will be difficult to estimate. In the invention, because a gap is reserved between the added metal ring and the side edge of the packaging shell, the force applied by the process during cap sealing can not be directly transmitted to the glass insulation structure, and the damage to glass is small, so that the defects and the defects brought by the traditional structure can be well avoided, and the quality problem caused by the defects and the damage can be solved.
In addition, in the traditional airtight packaging, when the shell and the sealing cover are subjected to parallel seam welding or energy storage welding, redundant objects are splashed to different degrees, once the splashed redundant objects pollute circuits inside the device, unforeseen malignant consequences can be caused, the generation of the splashed objects is caused by inherent limitations of the process, and the problem cannot be fundamentally solved or eradicated.
Mechanical pressure welding is a method of realizing solid state welding by plastically deforming metal to be welded under pressure, and the metal is tightly contacted through plastic deformation to achieve intercrystalline bonding. The process can not generate the splashing of the excess, thereby being an effective means for solving the stability of high-end electronic components. The mechanical pressure welding is performed on the premise that the welded piece has enough plastic cold pressing amount and plastic deformation amount, and the commonly applied material is aluminum, copper and the like. The application of the mechanical pressure welding and capping process of the conventional packaging materials such as kovar alloy (4J 29), cold rolled steel and the like is limited due to physical properties.
According to the invention, the sealing cover is prepared by selecting the oxygen-free copper (TU 1) and kovar alloy (4J 29) composite material, on one hand, the mechanical pressure sealing can be carried out by utilizing the plastic deformation capability characteristics of soft material and good fluidity of the oxygen-free copper (TU 1) arranged on the outer side surface, so that the problem of splashing of hot-pressing energy storage welding excess is fundamentally solved, and the stability of electronic components is greatly improved; on the other hand, kovar (4J 29) material arranged on the inner side surface can be subjected to high-reliability melt sealing with glass, and the reliability of shell sealing is improved.
Drawings
Fig. 1 is a schematic view of a package cover structure with low glass insulator stress according to the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is an enlarged view of portion I of FIG. 1;
FIG. 4 is a schematic view of a package cover with low glass insulator stress and a package housing formed after the glass insulator and leads are melt sealed;
FIG. 5 is a schematic structural view of the cap;
fig. 6 is a schematic view of a hermetic package formed after a low glass insulator stress package cap and cap are attached.
The notations in the figures have the following meanings:
10-sealing cover 11-outer side 12-inner side 13-cavity structure 131-metal ring 14-flash 15-through hole
30-cap 31-rim
41-lead 42-glass insulator
Detailed Description
The technical solution of the present invention is described below with reference to the drawings of the specification so as to facilitate the understanding of those skilled in the art.
As shown in fig. 1-6, a metal ring-embedded package cover is disposed on a circuit board or the like for cooperating with leads 41 and glass insulators 42 to form a hermetic package of an electronic device.
The size and the shape of the sealing cover 10 are matched with an electronic device to be packaged, one surface, namely the inner side surface 12, of the sealing cover close to the circuit board is provided with a cavity structure 13 which is convex towards the surface, namely the outer side surface 11, far away from the circuit board and is used for containing a fused glass insulator 42, the sealing cover 10 further comprises a flange 14 which is integrally arranged at the edge of the cavity structure 13, the flange 14 is flat, and the bottom surface of the flange 14 is parallel to the surface, used for packaging, of the circuit board so as to ensure the attachment.
Inside the cavity structure 13, a metal ring 131 with the same height as the cavity structure 13 is arranged, the material of the metal ring 131 is kovar alloy, and the arrangement shape of the metal ring 131 is matched with the shape of the sealing inner cavity of the glass insulator 42. The metal ring 131 is used for limiting the volume shape of the glass insulator 42 after being fused, in order to ensure the use effect, the distance between the outer edge of the metal ring 131 and the inner wall of the cavity structure 13 is 1-2 mm, and the inner diameter of the metal ring 131 is 0.2-0.4 mm larger than the size of the glass insulator 42 before being processed.
The cover 10 has a through hole 15 for inserting the lead 41 at a predetermined position inside the metal ring 131.
Further, the base material of the closure 10 of the present invention is composed of oxygen-free copper disposed on the outer surface 11 and kovar alloy disposed on the inner surface 12. In the embodiment, the oxygen-free copper is TU1, the kovar alloy is 4J29, the total thickness of the oxygen-free copper and the kovar alloy after the oxygen-free copper and the kovar alloy are compounded is 0.1-1.0 mm, and the thickness ratio of the oxygen-free copper to the kovar alloy is 7:3.
when the cover 10 of the present invention is used for circuit assembly, a cap 30 is further disposed on the outer side of the cover 10 to form an airtight package. In order to achieve a better matching effect with the cap 10, the cap 30 is made of oxygen-free copper TU1, the cap 30 is sized to match with the cap 10, a cavity 13 for accommodating the cap 10 and the electronic device is formed inside the cap 30, and the edge of the cap 30 has a rim 31 configured to be matched with the flange 14 of the cap 10, so as to better form a seal with the cap 10.
The preparation method of the low-stress package with the built-in metal ring comprises the following steps:
s1, processing a packaging sealing cover 10 with a required size by using an oxygen-free copper and kovar alloy material and using a punching or turning or milling process, wherein the sealing cover 10 comprises a cavity structure 13 and a flange 14, and a through hole 15 is formed in a corresponding position;
s2, processing a metal ring 131 by using Kovar alloy according to the required size, and processing a lead hole matched with the through hole 15 on the glass insulator 42, wherein the inner diameter of the metal ring 131 is larger than 420.2-0.4 mm of the glass insulator, and the outer diameter of the metal ring is smaller than 2-4 mm of the inner diameter of the cavity structure 13;
and S3, assembling the metal ring 131 into the cavity structure 13, assembling the glass insulator 42 into the metal ring 131, setting the lead 41, sintering the sealing cover 10 with the metal ring 131, the glass insulator 42 and the lead 41 at high temperature, and firmly connecting the sealing cover 10, the metal ring 131 and the lead 41 into a whole after cooling by utilizing glass melting deformation.
S4, processing the cap 30 by using the oxygen-free copper TU1, and electroplating the lead 41 and the seal cover 10 in the cap 30 and the cap S3, wherein the cap 30 is plated with gold or nickel, and the lead 41 and the seal cover 10 are plated with gold to meet the welding requirement and facilitate the implementation of an electroplating process;
s5, assembling the cap 30 on the outer side surface 11 of the sealing cover in the step S2, and enabling the lower surface of the edge 31 of the cap to be attached to the upper surface of the flash 14 of the sealing cover;
and S6, packaging the sealing cover 10 processed in the step S4 on a required circuit board, and sealing the electronic device in a space formed by the sealing cover 10 and the cap 30 to form the airtight packaging device with an airtight function.
The above is only a preferred embodiment of the invention, and is not intended to limit the invention; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A package sealing cover with a built-in metal ring is arranged on a circuit board and used for being matched with a lead (41), a glass insulator (42) and a cover cap (30) to form airtight package of an electronic device, and is characterized in that the size and the shape of the sealing cover (10) are matched with the electronic device to be packaged, one surface, namely an inner side surface (12), close to the circuit board of the sealing cover is provided with a cavity structure (13) which protrudes towards one surface, namely an outer side surface (11), far away from the circuit board and is used for accommodating the glass insulator (42) in a melting and sealing mode, the sealing cover (10) further comprises a flash (14) integrally arranged around the edge of the cavity structure (13), the flash (14) is flat, and the bottom surface of the flash (14) is parallel to the surface, used for packaging, of the circuit board so as to ensure the attachment; the sealing structure is characterized in that a metal ring (131) with the same height as the cavity structure (13) is further arranged inside the cavity structure (13), and a through hole (15) for inserting the lead (41) is formed in the set position of the sealing cover (10) inside the metal ring (131).
2. The packaging cover with the built-in metal ring as claimed in claim 1, wherein the metal ring (131) is made of kovar alloy, and the shape of the metal ring (131) is adapted to the shape of the sealing cavity of the glass insulator (42).
3. The packaging cover with built-in metal ring as claimed in claim 1, wherein the outer edge of the metal ring (131) is 1-2 mm away from the inner wall of the cavity structure (13).
4. The metal ring-embedded packaging cover according to claim 1, wherein the cover (10) substrate is composed of oxygen-free copper disposed on the outer side (11) and kovar alloy disposed on the inner side (12).
5. The package cover with built-in metal ring of claim 4, wherein said oxygen-free copper is TU1, and said kovar alloy is 4J29 or iron-nickel alloy 4J42.
6. The packaging cover with built-in metal ring as claimed in claim 5, wherein the total thickness of the oxygen-free copper and the kovar alloy after being compounded is 0.1-1.0 mm, and the thickness ratio of the oxygen-free copper to the kovar alloy is 7:3.
7. a hermetic package, characterized in that it comprises a cover (10) according to any one of claims 1 to 6, and a glass insulator (42) arranged in the cavity structure (13) of the cover (10), and leads (43) interposed between the glass insulator (42) and the cover (10).
8. A method of making the hermetic package in accordance with claim 7, comprising the steps of:
s1, processing a packaging sealing cover (10) with a required size by using an oxygen-free copper and kovar alloy material through a punching or turning or milling process, wherein the sealing cover (10) comprises a cavity structure (13) and a flash (14), and a through hole (15) is formed in a corresponding position;
s2, processing a metal ring (131) by using Kovar alloy according to the required size, processing a lead hole matched with the through hole (15) in position on the glass insulator (42), wherein the inner diameter of the metal ring (131) is 0.2-0.4 mm larger than that of the glass insulator (42);
s3, assembling the metal ring (131) into the cavity structure (13), assembling the glass insulator (42) into the metal ring (131), setting the lead (41), and then sintering the sealing cover (10) with the metal ring (131), the glass insulator (42) and the lead (41) at high temperature together to seal the metal ring, the glass insulator and the lead into a whole.
9. A hermetic package comprising a hermetic package casing according to claim 7, and a cap (30) disposed on a surface of the hermetic package casing, wherein a lower surface of a rim of the cap (30) is attached to an upper surface of the flash (14) of the lid (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211093192.6A CN115581016A (en) | 2022-09-08 | 2022-09-08 | Packaging sealing cover with built-in metal ring and application and preparation thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211093192.6A CN115581016A (en) | 2022-09-08 | 2022-09-08 | Packaging sealing cover with built-in metal ring and application and preparation thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115581016A true CN115581016A (en) | 2023-01-06 |
Family
ID=84580971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211093192.6A Pending CN115581016A (en) | 2022-09-08 | 2022-09-08 | Packaging sealing cover with built-in metal ring and application and preparation thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115581016A (en) |
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2022
- 2022-09-08 CN CN202211093192.6A patent/CN115581016A/en active Pending
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