CN115573008A - Surface treatment method for carbon fiber packaging tube shell - Google Patents

Surface treatment method for carbon fiber packaging tube shell Download PDF

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Publication number
CN115573008A
CN115573008A CN202211141198.6A CN202211141198A CN115573008A CN 115573008 A CN115573008 A CN 115573008A CN 202211141198 A CN202211141198 A CN 202211141198A CN 115573008 A CN115573008 A CN 115573008A
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plating
carbon fiber
copper
nickel
packaging tube
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张超
李生
王永河
仇明保
李晓军
黄鑫冰
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Jiangsu Huaici Technology Co ltd
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Jiangsu Huaici Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention relates to a surface treatment method of a carbon fiber packaging tube shell, wherein a pretreatment layer is formed by sequentially plating 2-9 mu m copper and 2-9 mu m nickel on the surface of the carbon fiber packaging tube shell, and the treatment method comprises the following steps: 1) Alkaline ultrasonic oil removal; 2) Plasma cleaning; 3) Removing oil by acid ultrasonic; 4) Activating; 5) Pre-plating copper; 6) Copper plating; 7) Pre-plating nickel; 8) And (4) nickel plating. The invention has the advantages that: the carbon fiber packaging tube shell treated by the method can be subjected to a good brazing packaging process with other packaging parts through silver-copper solder and the like, so that the performances of corrosion resistance, high temperature resistance, light weight and the like of the packaging tube shell are greatly improved compared with those of a traditional metal tube shell.

Description

Surface treatment method for carbon fiber packaging tube shell
Technical Field
The invention relates to a surface treatment method for a carbon fiber packaging tube shell, and belongs to the technical field of coating of packaging components.
Background
The packaging tube shell used in the semiconductor industry has a great influence on the electrical and thermodynamic properties of the whole product, provides an electrical path and a heat dissipation path for the work of a tube core, and is an important supporting part for ensuring the normal work of a semiconductor device. With the continuous development of modern communication systems, ceramic packages also put higher demands on the performance indexes of the package packages used in semiconductors.
The current semiconductor package case is usually composed of metal material (metal is mainly 10# steel, kovar, copper, etc.) and ceramic material by brazing. Compared with ceramic materials and metal materials, the carbon fiber material has the advantages of low density, corrosion resistance and easy heat conduction. In order to meet the application requirements of the high-quality packaging tube shell, the invention adopts a carbon fiber material.
However, the untreated carbon fiber has less polar group content on the surface, low surface energy, low reactivity and poor adhesion with a matrix, and more defects exist in an interface, so that the mechanical property of the carbon fiber composite material is directly influenced, and the exertion of the high performance of the carbon fiber composite material is limited. In order to improve the interface performance, the wettability and the cohesiveness of the carbon fiber to a matrix can be improved by a method of metalizing the surface of the carbon fiber, so that a new function is generated on the surface, the intermiscibility of the carbon fiber and other substances is improved, and various novel functional materials are obtained.
Lead-tin solder itself has poor wettability with molybdenum base materials, and surface treatment is required. In order to solve the problem, the process target of replacing silver-copper solder with lead-tin solder is successfully realized. The invention solves the problem of metallization of the carbon fiber material, changes the interface performance of the surface of the carbon fiber material and realizes good brazing of the carbon fiber material and other components by adopting silver-copper solder.
Has the advantages that:
the metallized carbon fiber material prepared by the method has the advantages that the good brazing packaging process can be realized with other metal materials or metallized carbon fiber and ceramic materials, and the reliability of the tube shell is greatly improved in the aspects of corrosion resistance, light density and the like.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a surface treatment method for a carbon fiber packaging tube shell.
In order to achieve the purpose, the invention is realized by the following technical scheme:
1. a surface treatment method for a carbon fiber packaging tube shell is characterized in that a pretreatment layer is formed by sequentially plating copper and nickel coatings on the surface of the carbon fiber packaging tube shell, wherein the thicknesses of the copper and nickel coatings are respectively as follows:
copper plating layer 1-9 μm;
the nickel plating layer is 1-9 μm.
2. A surface treatment method for a carbon fiber packaging tube shell is characterized by comprising the following steps:
1) Alkaline ultrasonic oil removal: the carbon fiber packaging tube shell adopts high-temperature alkaline degreasing liquid to remove impurities such as oil stains and stains on the surface of the carbon fiber packaging tube shell, wherein the degreasing temperature is 60-80 ℃, and the time is 5-10min; ultrasonic frequency 40KHz; the power is 1-1.5kW.
The mixture ratio of the degreasing liquid is 20 +/-10 g/L of sodium hydroxide, 50 +/-10 g/L of sodium carbonate, 5 +/-3 g/L of sodium tripolyphosphate and 5 +/-3 g/L of surfactant.
2) Plasma cleaning: putting the carbon fiber packaging tube shells into a plasma cleaning machine in batches for plasma cleaning treatment, wherein the plasma cleaning process parameters are as follows: plasma frequency 13.56MHz; vacuum degree: not less than 80kPa; gas flow rate: 100-200L/min; and (3) Ar and O2 mixed gas atmosphere.
3) Acid ultrasonic oil removal: putting the carbon fiber packaging tube shells into an acidic oil removal tank in batches for treatment, wherein the oil removal temperature is room temperature, and the time is 5-10min; ultrasonic frequency 40KHz; the power is 1-1.5kW.
The mixture ratio of the degreasing liquid is 50-200g/L of sulfuric acid, 10 +/-5 g/L of acid liquor corrosion inhibitor and 5 +/-3 g/L of surfactant.
4) And (3) activation: putting the carbon fiber packaging tube shells into an activation tank in batches, and carrying out pre-plating activation treatment, wherein the activation process parameters are as follows: the activating solution is hydrochloric acid solution with mass ratio concentration of 7-18%, and the process comprises soaking the product in the activating solution at room temperature for 10-30min.
5) Pre-copper plating: pre-plating copper on the carbon fiber packaging tube shells in batches in a pre-plating copper groove; the formula of the bath solution of the pre-copper plating bath is as follows: 21g/L of copper acetate, 100 +/-30 g/L of HEDP, 18g/L of potassium carbonate and 9-10.5 of PH. The technological parameters are room temperature and the current density is 1-5A/dm 2 The electroplating time is 1-3mim.
6) Copper plating: the copper plating in the copper electroplating tank increases the thickness of a copper layer, the thickness of the copper layer is controlled to be 1-9 mu m, and the formula of a tank liquor of the copper tank is as follows: 70g/L of copper pyrophosphate, 250 +/-30 g/L of potassium pyrophosphate, 0.2-0.3ml/L of copper plating additive and 2-4g of ammonia water; PH =8.6-8.9. The technological parameters are 50-55 deg.C, current density (1.6-3) 1-6A/dm 2 The electroplating time is 15-90mim.
7) Pre-nickel plating: pre-plating nickel on the carbon fiber packaging tube shells in batch in a pre-nickel plating groove, so as to improve the binding force between the plating layer and the matrix; the formula of the bath solution of the nickel preplating bath is as follows: 150 +/-50 g/L of nickel chloride and 100 +/-30 g/L of hydrochloric acid. The technological parameters are room temperature and the current density is 4-6A/dm 2 The electroplating time is 1-3mim.
8) Nickel plating: the nickel plating in the nickel electroplating bath increases the thickness of the nickel layer, the thickness of the nickel layer is controlled to be 1-9 μm, and the bath solution formula of the nickel electroplating bath is as follows: 12 +/-5 g/L of nickel chloride, 250 +/-100 g/L of nickel sulfamate, 30 +/-10 g/L of boric acid and 1-3g/L of wetting agent; 5ml/L of nickel plating additive. The technological parameters are that the temperature is 45 +/-5 ℃, and the current density is 2-3A/dm 2 The electroplating time is 10-90mim.
3. The method for treating the surface of the carbon fiber encapsulated pipe shell according to claim 2, wherein the surfactant in the step 1) is one of ionic surfactants such as OP-10, sodium dodecyl aryl sulfonate and sodium dodecyl sulfonate.
4. The method for treating the surface of the carbon fiber encapsulated pipe shell as claimed in claim 2, wherein the corrosion inhibitor in the step 3) is one of metal corrosion inhibitors such as thiourea, benzotriazole and urotropin.
5. The method for treating the surface of the carbon fiber encapsulated pipe shell according to claim 2, wherein the prepared copper plating additive in the step 6) is one or more aqueous solutions of organic additives for improving the wettability of the plating solution and the compactness and smoothness of the plating layer, such as one or more of chemical agents including sodium 2-ethylhexyl sulfonate, thiouracil, nicotinic acid, benzalacetone, sodium sulfosuccinate, saccharin and the like, and the mass concentration of the chemical agents is 10-35%.
6. The method for treating the surface of the carbon fiber encapsulated pipe shell according to claim 2, wherein the prepared nickel plating additive in the step 8) is one or more aqueous solutions of organic additives for improving the wettability of the plating solution and the compactness and smoothness of the plating layer, such as one or more of nicotinic acid, benzalacetone, sodium sulfosuccinate, saccharin and other chemical reagents, and the mass concentration of the one or more aqueous solutions is 10-35%.
The invention has the beneficial effects that: the metallized carbon fiber material prepared by the method has the advantages that the good brazing packaging process can be realized with other metal materials or metallized carbon fiber and ceramic materials, and the reliability of the tube shell is greatly improved in the aspects of corrosion resistance, light density and the like.
Detailed Description
The present invention will be described in detail with reference to the following examples.
Example 1: a surface treatment method for a carbon fiber packaging tube shell is characterized in that a carbon fiber material is subjected to metallization treatment, copper and nickel plating layers are plated on the surface of the carbon fiber material in sequence, and the technical process comprises the following steps:
(1) Alkaline ultrasonic oil removal: the carbon fiber packaging tube shell adopts high-temperature alkaline degreasing liquid to remove impurities such as oil stains and stains on the surface of the carbon fiber packaging tube shell, wherein the degreasing temperature is 60-80 ℃, and the time is 5-10min; ultrasonic frequency 40KHz; the power is 1-1.5kW.
The mixture ratio of the degreasing liquid is 20 +/-10 g/L of sodium hydroxide, 50 +/-10 g/L of sodium carbonate, 5 +/-3 g/L of sodium tripolyphosphate and 5 +/-3 g/L of surfactant.
(2) Plasma cleaning: putting the carbon fiber packaging tube shells into a plasma cleaning machine in batches for plasma cleaning treatment, wherein the plasma cleaning process parameters are as follows: plasma frequency 13.56MHz; vacuum degree: not less than 80kPa; gas flow rate: 100-200L/min; and (3) Ar and O2 mixed gas atmosphere.
(3) Acid ultrasonic oil removal: putting the carbon fiber packaging tube shells into an acid oil removing groove in batches for treatment, wherein the oil removing temperature is room temperature, and the time is 5-10min; ultrasonic frequency 40KHz; the power is 1-1.5kW.
The degreasing liquid comprises 50-200g/L of sulfuric acid, 10 +/-5 g/L of acid liquor corrosion inhibitor and 5 +/-3 g/L of surfactant.
(4) And (3) activation: putting the carbon fiber packaging tube shells into an activation tank in batches, and carrying out pre-plating activation treatment, wherein the activation process parameters are as follows: the activating solution is hydrochloric acid solution with mass ratio concentration of 7-18%, and the process comprises soaking the product in the activating solution at room temperature for 10-30min.
(5) Pre-copper plating: pre-plating copper on the carbon fiber packaging tube shells in batches in a pre-plating copper groove; the formula of the bath solution of the pre-copper plating bath is as follows: 21g/L of copper acetate, 100 +/-30 g/L of hydroxyethylidene diphosphonic acid HEDP, 18g/L of potassium carbonate and PH =9-10.5. The technological parameters are room temperature, current density of 1-5A/dm < 2 > and electroplating time of 1-3mim.
(6) Copper plating: the copper plating in the copper electroplating tank increases the thickness of a copper layer, the thickness of the copper layer is controlled to be 1-9 mu m, and the formula of a tank liquor of the copper tank is as follows: 70g/L of copper pyrophosphate, 250 +/-30 g/L of potassium pyrophosphate, 0.2-0.3ml/L of copper plating additive and 2-4g of ammonia water; PH =8.6-8.9. The technological parameters are 50-55 ℃, the current density (1.6-3) is 1-6A/dm < 2 >, and the electroplating time is 15-90mim.
Preparing an additive for copper electroplating: 130g of 2-ethylhexyl sodium sulfonate, 2g of thiouracil and 100g of succinic acid diester sodium sulfonate are dissolved in 1 liter of pure water, and stirring is carried out continuously in the preparation process until all chemical reagents are completely dissolved.
(7) Pre-plating nickel: pre-plating nickel on the carbon fiber packaging tube shells in batch in a pre-nickel plating groove, so as to improve the binding force between the plating layer and the matrix; the formula of the bath solution of the nickel preplating bath is as follows: 150 +/-50 g/L of nickel chloride and 100 +/-30 g/L of hydrochloric acid. The technological parameters are room temperature and the current density is 4-6A/dm 2 The electroplating time is 1-3mim.
(8) Nickel plating: nickel plating in the nickel electroplating bath to increase the thickness of the nickel layer and controlThe thickness of the nickel layer is 1-9 μm, and the bath solution formula of the nickel electroplating bath is as follows: 12 +/-5 g/L of nickel chloride, 250 +/-100 g/L of nickel sulfamate, 30 +/-10 g/L of boric acid and 1-3g/L of wetting agent; 5ml/L of nickel plating additive. The technological parameters are that the temperature is 45 +/-5 ℃, and the current density is 2-3A/dm 2 The electroplating time is 10-90mim.
Preparing an additive for nickel electroplating: 120g of nicotinic acid, 100g of benzalacetone, 150g of sodium sulfosuccinate and 90g of saccharin are dissolved in 1 liter of pure water, and stirring is carried out continuously during the preparation process until all chemical reagents are completely dissolved.
Testing the thickness of a coating on a treated carbon fiber material sample, then performing a welding test on a red copper plate with the thickness of 2mm at the welding temperature of 820 ℃, and performing a salt spray test on the brazed sample, wherein the test data are as follows:
Figure BDA0003853603130000061
example 2: substantially the same as in example 1, except that the copper-nickel thickness of the plated layer metallized by the carbon fiber material sample was 1.33 μm and 8.48 μm by adjusting the time for copper electroplating and the time for nickel electroplating. The test data are as follows:
Figure BDA0003853603130000062
example 3: substantially the same as in example 1, except that the copper-nickel thickness of the plated layer metallized by the carbon fiber material sample was 8.85 μm, 1.22 μm by adjusting the time for copper electroplating and the time for nickel electroplating. The test data are as follows:
Figure BDA0003853603130000063
example 4: the same as in example 1, except that the amount of the copper plating additive in the formulation of the copper plating bath used for copper plating of the carbon fiber material sample was adjusted to 10ml/L. The test data are as follows:
Figure BDA0003853603130000064
Figure BDA0003853603130000071
example 5: basically the same as example 1, except that the copper plating additive content in the formulation of the copper plating bath used in the copper plating of the carbon fiber material sample was adjusted to 3ml/L. The test data are as follows:
Figure BDA0003853603130000072
example 6: basically the same as example 1, except that the content of the nickel plating additive in the formulation of the bath solution for nickel plating used in the nickel plating of the carbon fiber material sample was adjusted to 3ml/L. The test data are as follows:
Figure BDA0003853603130000073
example 7: basically the same as example 1, except that the content of the nickel plating additive in the formulation of the bath solution for nickel plating used in the nickel plating of the carbon fiber material sample was adjusted to 10ml/L. The test data are as follows:
Figure BDA0003853603130000074
as can be seen from the test data, the copper layer and the nickel layer which are metalized on the carbon fiber material sample can meet the brazing requirement within the ranges of 1-9 μm and 1-9 μm; the salt spray effect of the sample is influenced by the content of the additive in the nickel plating.
The above embodiments do not limit the present invention in any way, and all technical solutions obtained by means of equivalent substitution or equivalent transformation fall within the scope of the present invention.

Claims (6)

1. A surface treatment method for a carbon fiber packaging tube shell is characterized in that a pretreatment layer is formed by sequentially plating copper and nickel coatings on the surface of the carbon fiber packaging tube shell, and the thicknesses of the copper and nickel coatings are as follows:
copper plating layer 1-9 μm;
the nickel plating layer is 1-9 μm.
2. A surface treatment method for a carbon fiber packaging tube shell is characterized by comprising the following steps:
1) Alkaline ultrasonic oil removal: the carbon fiber packaging tube shell adopts high-temperature alkaline degreasing liquid to remove impurities such as oil stains and stains on the surface of the carbon fiber packaging tube shell, wherein the degreasing temperature is 60-80 ℃, and the time is 5-10min; ultrasonic frequency 40KHz; the power is 1-1.5kW.
The mixture ratio of the degreasing liquid is 20 +/-10 g/L of sodium hydroxide, 50 +/-10 g/L of sodium carbonate, 5 +/-3 g/L of sodium tripolyphosphate and 5 +/-3 g/L of surfactant.
2) Plasma cleaning: putting the carbon fiber packaging tube shells into a plasma cleaning machine in batches for plasma cleaning treatment, wherein the plasma cleaning process parameters are as follows: plasma frequency 13.56MHz; vacuum degree: not lower than 80kPa; gas flow rate: 100-200L/min; and (3) Ar and O2 mixed gas atmosphere.
3) Acid ultrasonic oil removal: putting the carbon fiber packaging tube shells into an acidic oil removal tank in batches for treatment, wherein the oil removal temperature is room temperature, and the time is 5-10min; ultrasonic frequency 40KHz; the power is 1-1.5kW.
The mixture ratio of the degreasing liquid is 50-200g/L of sulfuric acid, 10 +/-5 g/L of acid liquor corrosion inhibitor and 5 +/-3 g/L of surfactant.
4) And (3) activation: putting the carbon fiber packaging tube shells into an activation tank in batches, and carrying out pre-plating activation treatment, wherein the activation process parameters are as follows: the activating solution is hydrochloric acid solution with mass ratio concentration of 7-18%, and the process comprises soaking the product in the activating solution at room temperature for 10-30min.
5) Pre-copper plating: pre-plating copper on the carbon fiber packaging tube shells in batches in a pre-plating copper groove; the formula of the bath solution of the pre-copper plating bath is as follows: 21g/L of copper acetate, 100 +/-30 g/L of HEDP, 18g/L of potassium carbonate and 9-10.5 of PH. The technological parameters are room temperature and the current density is 1-5A/dm 2 The electroplating time is 1-3mim.
6) Copper plating: the copper plating in the copper electroplating tank increases the thickness of a copper layer, the thickness of the copper layer is controlled to be 1-9 mu m, and the formula of a tank liquor of the copper tank is as follows: 70g/L of copper pyrophosphate, 250 +/-30 g/L of potassium pyrophosphate, 0.2-0.3ml/L of copper plating additive and 2-4g of ammonia water; PH =8.6-8.9. The technological parameters are 50-55 deg.C, current density (1.6-3) 1-6A/dm 2 The electroplating time is 15-90mim.
7) Pre-nickel plating: pre-plating nickel on the carbon fiber packaging tube shells in batch in a pre-nickel plating groove, so as to improve the binding force between the plating layer and the matrix; the formula of the bath solution of the nickel preplating bath is as follows: 150 +/-50 g/L of nickel chloride and 100 +/-30 g/L of hydrochloric acid. The technological parameters are room temperature and current density of 4-6A/dm 2 And the electroplating time is 1-3mim.
8) Nickel plating: the nickel plating in the nickel electroplating bath increases the thickness of the nickel layer, the thickness of the nickel layer is controlled to be 1-9 μm, and the bath solution formula of the nickel electroplating bath is as follows: 12 +/-5 g/L of nickel chloride, 250 +/-100 g/L of nickel sulfamate, 30 +/-10 g/L of boric acid and 1-3g/L of wetting agent; 5ml/L of nickel plating additive. The technological parameters are that the temperature is 45 +/-5 ℃, and the current density is 2-3A/dm 2 The electroplating time is 10-90mim.
3. The method for treating the surface of the carbon fiber encapsulated pipe shell according to claim 2, wherein the surfactant in the step 1) is one of ionic surfactants such as OP-10, sodium dodecyl aryl sulfonate and sodium dodecyl sulfonate.
4. The method for treating the surface of the carbon fiber encapsulated pipe shell as claimed in claim 2, wherein the corrosion inhibitor in the step 3) is one of metal corrosion inhibitors such as thiourea, benzotriazole and urotropin.
5. The method for treating the surface of the carbon fiber encapsulated pipe shell according to claim 2, wherein the prepared copper plating additive in the step 6) is one or more aqueous solutions of organic additives for improving the wettability of the plating solution and the compactness and smoothness of the plating layer, such as one or more of chemical agents including sodium 2-ethylhexyl sulfonate, thiouracil, nicotinic acid, benzalacetone, sodium sulfosuccinate, saccharin and the like, and the mass concentration of the chemical agents is 10-35%.
6. The method for treating the surface of the carbon fiber encapsulated pipe shell according to claim 2, wherein the prepared nickel plating additive in the step 8) is one or more aqueous solutions of organic additives for improving the wettability of the plating solution and the compactness and smoothness of the plating layer, such as one or more of nicotinic acid, benzalacetone, sodium sulfosuccinate, saccharin and other chemical reagents, and the mass concentration of the one or more aqueous solutions is 10-35%.
CN202211141198.6A 2022-09-20 2022-09-20 Surface treatment method for carbon fiber packaging tube shell Pending CN115573008A (en)

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