CN113529143A - Leveling agent-containing ionic liquid aluminum plating liquid and aluminum plating process using same - Google Patents
Leveling agent-containing ionic liquid aluminum plating liquid and aluminum plating process using same Download PDFInfo
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- CN113529143A CN113529143A CN202110748559.2A CN202110748559A CN113529143A CN 113529143 A CN113529143 A CN 113529143A CN 202110748559 A CN202110748559 A CN 202110748559A CN 113529143 A CN113529143 A CN 113529143A
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- 239000002608 ionic liquid Substances 0.000 title claims abstract description 46
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 27
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- 238000005406 washing Methods 0.000 claims description 8
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- 238000001035 drying Methods 0.000 claims description 7
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 5
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
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- 239000000126 substance Substances 0.000 claims description 2
- NEUSVAOJNUQRTM-UHFFFAOYSA-N cetylpyridinium Chemical group CCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 NEUSVAOJNUQRTM-UHFFFAOYSA-N 0.000 claims 1
- 229960004830 cetylpyridinium Drugs 0.000 claims 1
- 238000000576 coating method Methods 0.000 abstract description 31
- 239000011248 coating agent Substances 0.000 abstract description 27
- 239000000758 substrate Substances 0.000 abstract description 8
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- YMKDRGPMQRFJGP-UHFFFAOYSA-M cetylpyridinium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 YMKDRGPMQRFJGP-UHFFFAOYSA-M 0.000 description 11
- 229960001927 cetylpyridinium chloride Drugs 0.000 description 11
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
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- -1 amine compound Chemical class 0.000 description 4
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical compound NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 2
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- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
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- FQERWQCDIIMLHB-UHFFFAOYSA-N 1-ethyl-3-methyl-1,2-dihydroimidazol-1-ium;chloride Chemical compound [Cl-].CC[NH+]1CN(C)C=C1 FQERWQCDIIMLHB-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
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- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
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- NXSHZRHXPTWQIM-UHFFFAOYSA-N [Cl-].CCCN1C=C[NH+](C)C1C Chemical compound [Cl-].CCCN1C=C[NH+](C)C1C NXSHZRHXPTWQIM-UHFFFAOYSA-N 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
- KVLJKZLFLIJDCM-UHFFFAOYSA-N dimethyl-(2-methylphenyl)azanium;chloride Chemical compound Cl.CN(C)C1=CC=CC=C1C KVLJKZLFLIJDCM-UHFFFAOYSA-N 0.000 description 1
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- QRXWMOHMRWLFEY-UHFFFAOYSA-N isoniazide Chemical compound NNC(=O)C1=CC=NC=C1 QRXWMOHMRWLFEY-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 229960003966 nicotinamide Drugs 0.000 description 1
- 235000005152 nicotinamide Nutrition 0.000 description 1
- 239000011570 nicotinamide Substances 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/42—Electroplating: Baths therefor from solutions of light metals
- C25D3/44—Aluminium
Abstract
The invention discloses an ionic liquid aluminum plating liquid containing a leveling agent and a process for plating aluminum by using the plating liquid. The leveling agent-containing ionic liquid is adopted to prepare the Al coating, so that the smooth Al coating can be obtained on the microscopically uneven substrate surface. The leveling agent in the ionic liquid aluminum plating liquid has no corrosive toxic volatility and the like, the Al plating process is green and environment-friendly, no organic solvent or dangerous solvent is required to be applied in the whole process flow, no waste gas and waste water are discharged, and the ionic liquid aluminum plating liquid has a great application prospect.
Description
Technical Field
The invention belongs to the technical field of surface treatment, and particularly relates to leveling agent-containing ionic liquid aluminum plating liquid and an electroplating process for preparing a flat aluminum plating layer by using the same.
Background
Metal aluminum (Al) has low density, good ductility and gloss, and excellent corrosion resistance, and thus is widely used as a surface coating for various materials, and is a coating material with a good application prospect. At present, the method for preparing the aluminum plating layer includes a hot dipping method, physical vapor deposition, chemical vapor deposition, electroplating, and the like. The former three technologies have the problems of weak binding force of a plating layer, low compactness, poor applicability to parts with complex shapes and the like. In contrast, the electrodeposition method is simple and convenient to operate, can control or optimize the thickness and quality of the coating by controlling the parameters of the electroplating process, and is a preferred method for preparing the aluminum coating. The basic principle of Al plating can be divided into an inorganic molten salt system, an organic solution system, and an ionic liquid system. The ionic liquid is a novel electroplating solution, and compared with inorganic molten salt and organic solution electroplating, the ionic liquid electroplating has the following advantages: no combustion and explosion hazard, low requirement on electroplating equipment, and green and environment-friendly electroplating process. At present, the ionic liquid aluminum electroplating technology is utilized to successfully solve the problems of low-temperature preparation of a tritium-resistant coating in the international thermonuclear fusion plan, corrosion-resistant surface treatment of a rare earth permanent magnet material and the like. However, the ionic liquid aluminum plating layer is generally rougher in appearance, which is more noticeable on machined, sandblasted, or the like parts.
In industrial electroplating, various additives, such as brighteners, levelers, wetting agents, modifiers, etc., are commonly used to improve the properties of the plating. Wherein, the leveling agent is an important additive, and the leveling agent is added into the plating solution, so that a smooth plating layer can be obtained on the surface of a substrate with fine pits, scratches and other micro-rough appearances. The mechanism of action of levelers is generally believed to be due to the inhibition of the growth rate of the coating and the selective adsorption at the surface of the coating during growth: the growth is inhibited by adsorbing more at the convex part of the plating layer, so that the growth rate at the convex part is less than that at the concave part, and the leveling effect is achieved.
Leveling agents have been extensively studied in aqueous electroplating and have been patented in numerous ways. For example, CN105018977B discloses a sulfur-based composite pore-filling electroplating leveling agent for pore-filling and leveling of electroplated copper. CN110684995A discloses a composite plating leveling agent, which is produced by the reaction of at least one amine compound, at least one epoxy compound and at least one quaternizing agent, and is used for the plating of through holes and blind holes of metals to improve the deep plating capability of a plating solution. CN105026385B discloses a chlorine-containing leveling agent composition in an acidic copper plating system, which is used for metal electrodeposition in the field of microelectronics.
For the ionic liquid, a novel plating solution, additive-related research and report mainly focuses on the aspect of brightening agent. For example, it is reported that 1, 10-phenanthroline, nicotinamide and 4-pyridinecarboxylic acid hydrazide can be added to obtain a bright aluminum coating by electrodeposition. 103849911B discloses an ionic liquid electroplating solution for preparing bright aluminum plating layer at low temperature and its application method, wherein a series of pyridine derivatives are added as additives to obtain bright plating layer. 201110204292.7 discloses a method for preparing nanometer aluminum plating layer by ionic liquid/additive system, which reduces the viscosity of the plating solution by organic additives such as benzene, dimethylbenzene, cyclohexane, butadiene, styrene, ethylene diamine, etc., to obtain bright aluminum plating layer. 201410558140.0 discloses an ionic liquid electrolyte and a method for preparing a bright aluminum coating by using the electrolyte, wherein the organic solvent dichloromethane or trichloromethane is added into the ionic liquid to reduce the viscosity of the electrolyte and improve the conductivity of the electrolyte, thereby obtaining the bright aluminum coating. In addition to brighteners, U.S. Pat. No. 4, 20200123672, 1 discloses an ionic liquid aluminum plating method, in which 1, 10-phenanthroline and potassium chloride are added in a complex manner to obtain a plating layer having a good thickness uniformity. At present, no specific literature or patent report of the ionic liquid aluminum plating leveling agent is found.
In summary, although the ionic liquid aluminum plating technology has a great application prospect, due to the lack of an effective leveling agent, the technology has a high requirement on the roughness of the surface of a part when being adopted, and the wider application of the technology is limited.
Disclosure of Invention
The invention aims to provide an ionic liquid aluminum plating liquid containing a leveling agent and a method for preparing an Al plating layer by adopting the plating liquid for electrodeposition, so that a smooth Al plating layer is obtained on the surface of a microscopically uneven substrate.
In order to achieve the purpose of the invention, the invention adopts the technical scheme that:
leveling agent-containing ionic liquid aluminum plating liquid
The invention adopts leveling agent-containing ionic liquid aluminum plating liquid to prepare an aluminum plating layer, and the aluminum plating liquid mainly comprises the ionic liquid and the leveling agent.
Currently, ionic liquid systems used for electroplating are mainly alkyl pyridinium halide systems, alkyl imidazolium halide systems, and quaternary ammonium halide systems. The most studied for electrodepositing aluminum is the chloroaluminate system, such as aluminum chloride (AlCl)3) And 1-methyl-3-ethylimidazole chloride (EMIC), aluminum chloride and 1, 2-dimethyl-3-propylimidazole chloride, aluminum chloride and trimethylaniline chloride, and the like. Wherein AlCl3EMIC ionic liquids are the preferred plating solution for electroplating aluminum due to their higher conductivity and lower viscosity. The invention adopts acidic AlCl with the molar ratio of 1.5-2.03EMIC ionic liquid, which can be used to deposit Al and has a higher current density.
The leveling agent provided by the invention is an organic salt with a long alkyl chain and a nitrogen-containing aromatic ring. Wherein the long alkyl chain can be twelve to eighteen carbons, the nitrogen-containing aromatic ring can be a pyridine, pyrrole or imidazole ring, and the anion can be chloride ion or bromide ion. The leveling agent adopted by the invention is cetylpyridinium chloride with a chemical formula of C21H38The specific structure of ClN is shown as follows, and the ClN consists of a cation consisting of a hexadecyl long chain and a pyridine ring and chloride ions, and is different from the additive which is disclosed to be reported or invented and protected and is used for an ionic liquid system.
The invention adds a certain amount of cetylpyridinium chloride to AlCl3And EMIC ionic liquid is uniformly stirred to obtain the electroplating solution. Wherein the addition concentration of the additive is 5.0 g/L-20 g/L. The reason for selecting this concentration range is that when the additive concentration is too low, the content of the additive in the plating solution is too low, and effective leveling efficiency cannot be achieved; when the additive concentration is increased, the effect of the additive is enhanced, but too high additive concentration may cause the waste of the additive.
Preparation method of Al coating
The ionic liquid plating technology is adopted, and comprises the following steps:
the method comprises the following steps: pretreatment
The matrix adopts a conventional pretreatment method, namely: mechanical polishing, alkali washing for removing oil, acid washing for removing an oxidation film, water washing, alcohol washing and drying.
Step two: ionic liquid aluminium plating
The part to be plated is taken as a cathode, a high-purity Al wire (the purity is more than 99.99%) is taken as an anode, the ionic liquid containing the additive is taken as a plating solution, and Al is plated at constant current.
The parameters of the electroplating process are as follows: current density (c.d.): 10 to 30mA/cm2Temperature: 25-60 ℃. The time is determined according to the thickness of the plating layer and the current density, and the time is 16-48 min for the thickness of the plating layer of 10 mu m.
In the invention, the current density of electroplating is selected to be 10-30 mA/cm2The reason is that the current density is too small, the coating is rough, a smooth aluminum coating cannot be obtained, and the function of a leveling agent cannot be reflected; the current density is too high, dendrite is easily generated at the edge of the plating layer, and the plating solution is easily damaged.
The electroplating temperature is 25-60 ℃, because the electroplating temperature is lower than 25 ℃, and the current density of the platable aluminum is smaller; above 60 ℃, the leveling effect is poor, and meanwhile, the operation is not beneficial, so that the energy waste is caused, and the requirement on aluminum plating equipment is high.
Step three: post-treatment
And taking the workpiece plated with the aluminum layer out of the glove box, ultrasonically cleaning the workpiece by using alcohol, and drying the workpiece.
The invention has the advantages that:
the Al coating obtained by the electro-deposition method has the following beneficial effects:
(1) even under the condition that the substrate is microscopically uneven, a flat Al coating can be obtained, and the requirement of the ionic liquid Al coating on the roughness of the substrate is reduced;
(2) the Al plating layer obtained by electroplating after the leveling agent is added can completely cover the matrix under the condition of thinner plating layer thickness, thereby meeting the requirement of corrosion resistance;
(3) the ionic liquid is a green solution, the leveling agent has no corrosive toxic volatility and the like, the Al plating process is green and environment-friendly, no organic solvent or dangerous solvent is required to be applied in the whole process flow, no waste gas and waste water are discharged, and the method has a great application prospect. The invention can promote the wider application of the green ionic liquid aluminum plating technology.
Drawings
FIG. 1 is a photomicrograph of a cross-section of a coating without the addition of a leveler;
FIG. 2 is a photomicrograph of a cross-section of each of the coatings obtained in example 1;
FIG. 3 is a photomicrograph of a cross-section of each of the coatings obtained in example 2;
FIG. 4 is a graph showing that the current density was 40mA/cm2The macroscopic morphology and the dendrite condition of the surface of the lower plating layer;
FIG. 5 is a photomicrograph of a cross-section of each of the coatings obtained in example 3;
FIG. 6 is a photomicrograph of a cross-section of each of the coatings obtained in example 4.
Detailed Description
The invention is further illustrated by the following specific examples.
Example 1
Step one, pretreatment
An industrial pure Cu sheet with a thickness of 1mm is sequentially polished by 400# and 600# sandpaper, and then polished by P80 sandpaper along the same direction until the roughness Ra is 1.6 +/-0.3 um and is marked as Ra1Then ultrasonic cleaning is carried out by NaOH and dilute sulphuric acid in sequence, then deionized water and alcohol are used for cleaning in sequence, drying is carried out, then an insulating tape is used for pasting and covering a non-electroplating area, and the plating area is controlled. Thereafter, the sample was placed in a glove box under an argon atmosphere. High-purity Al wire (99.999%) is prepared from NaOH and H3PO4And the deionized water and the alcohol are sequentially subjected to ultrasonic cleaning and drying, and then are placed into a glove box in an argon atmosphere.
Step two, ion liquid aluminum plating
AlCl at a molar ratio of 2:13EMIC ionic liquid with the concentration of 5.0g/L and 10.0 g/L respectively,20.0g/L cetylpyridinium chloride, and stirred well.
Adding cetyl pyridinium chloride into AlCl3Constant current Al plating in EMIC ionic liquids. The pretreated Cu sheet is used as a cathode, the pure Al wire is used as an anode, and the current density is as follows: 10mA/cm2Temperature: the total thickness of the plating layer was 10 μm at 25 ℃.
For comparison, AlCl was added without cetylpyridinium chloride at a 2:1 molar ratio3The EMIC ionic liquid is also aluminized, and the electroplating conditions are as follows: the current density is 10mA/cm2The temperature is 25 ℃, and the total thickness of the plating layer is 10 mu m.
Step three, post-treatment
And taking the Cu sheet with the aluminum layer plated on the surface out of the glove box, ultrasonically cleaning the Cu sheet with alcohol, and drying the Cu sheet.
The characterization of the leveling efficiency of the plating layer obtained by the electroplating process comprises the following steps: horizontally placing the coating sample, measuring the roughness Ra of the coating sample vertical to the original substrate polishing direction, and recording as Ra2Calculating the leveling efficiency LP, wherein the formula is LP ═ Ra1-Ra2)/Ra1100, wherein the value of the plating layer obtained under the same conditions by the additive-free plating solution calculated by the formula is denoted as LP0. The leveling efficiency LP ranges from-infinity to 100, and the higher the leveling efficiency LP, the better the leveling effect of the plating layer. If the coating LP<LP0It is called "no leveling"; if LP0<LP<5, then called "lightly leveled"; 5<LP<15, referred to as "weak leveling"; 15<LP<25, referred to as "strong leveling"; LP>25, it is called "significant flattening".
First, LP was measured when an Al plating layer was obtained from a plating solution to which cetylpyridinium chloride was not added0The cross section of the coating and the substrate is shown in fig. 1, and it can be seen that the micro-undulation degree of the coating is obviously larger than that of the substrate without adding the leveling agent.
Next, the leveling efficiency LP of each plating sample obtained by electrodeposition in a bath to which cetylpyridinium chloride was added at different concentrations is shown in table 1. As can be seen from Table 1, at 25 ℃ 10mA/cm2At a thickness of 10um, the obtained aluminum coating isWhen the concentration of the additive is more than 5g/L, the leveling effect is different, and the effect is increased along with the increase of the concentration of the additive. The photographs of the cross sections of the respective plating layers in Table 1 are shown in FIG. 2.
Example 2
The first step and the third step are the same as those in example 1.
In the second step, cetylpyridinium chloride with the concentration of 20.0g/L is added, and the current density is 10-30 mA/cm2The other conditions are as in the first embodiment.
The plating leveling efficiency LP obtained at each current density is shown in Table 2, and the cross-sectional photograph is shown in FIG. 3.
As can be seen from the graph, the current density is 10 to 30mA/cm2Within this range, the leveling efficiency LP gradually increases as the current density increases. When the current density exceeds 30mA, dendrites appear at the edges of the plating layer, as shown in fig. 4, which is not favorable for leveling.
Example 3
The first step and the third step are the same as those in example 1.
In the second step, cetylpyridinium chloride with the concentration of 20.0g/L is added, and the current density is as follows: 20mA/cm2The time is controlled so that the total thickness of the plating layer is 10 to 20 μm, and other conditions are as in the first embodiment.
The plating leveling efficiency LP obtained at each current density is shown in Table 3, and the cross-sectional photograph is shown in FIG. 5.
As can be seen from the graph, the leveling efficiency LP increases with increasing coating thickness when the coating thickness is greater than 10 um.
Example 4
The first step and the third step are the same as those in example 1.
In the second step, cetylpyridinium chloride with the concentration of 20.0g/L is added, and the current density is as follows: 30mA/cm2Temperature: at 25-60 ℃, the other conditions refer to the first embodiment.
The plating leveling efficiency LP obtained at each current density is shown in Table 4, and the cross-sectional photograph is shown in FIG. 6.
As can be seen from the graph, the plating leveling efficiency LP decreases with increasing temperature in the temperature range of 25-60 ℃, and the leveling agent can still exhibit a weak leveling effect at 60 ℃.
Example 5
The first step and the third step are the same as those in example 1.
In the second step, cetylpyridinium chloride with the concentration of 20.0g/L is added into the ionic liquid with the molar ratio of 1.5:1,1.8:1 and 2:1, and the current density is as follows: 20mA/cm2The other conditions are as in the first embodiment.
The leveling efficiency LP of the plating layer obtained in the liquid with each molar ratio is shown in Table 5, and the additive can show the leveling effect in the ionic liquid with the molar ratio of 1.5-2.0: 1.
TABLE 1 correlation of additive concentration to leveling efficiency LP in EXAMPLE 1
| The addition concentration is g/L | Leveling efficiency LP | Leveling capability |
| 0 | -20.8 | - |
| 5 | -0.8 | Lightly level off |
| 10 | 9.5 | Weak leveling |
| 20 | 10.4 | Weak leveling |
Table 2 correspondence between current density and leveling efficiency LP in example 2
| Current density mA/cm2 | Leveling efficiency | Leveling capability | |
| 10 | 10.4 | Weak leveling | |
| 20 | 18.1 | Strong leveling | |
| 30 | 40.4 | Significant leveling |
Table 3 correspondence between plating thickness and leveling efficiency LP in example 3
| Thickness um | Leveling efficiency | Leveling capability | |
| 10 | 18.1 | Strong leveling | |
| 15 | 29.8 | Significant leveling | |
| 20 | 46.6 | Significant leveling |
Table 4 correspondence of temperature and leveling efficiency LP in example 4
| Temperature of | Leveling efficiency LP | Leveling capability |
| 25 | 40.4 | Significant leveling |
| 45 | 7.0 | Weak leveling |
| 60 | -2.7 | Lightly level off |
TABLE 5 leveling efficiency LP corresponding relation for each plating layer obtained in example 5
| Molar ratio of | Leveling efficiency LP | Leveling capability |
| 1.5:1 | 21.0 | Strong leveling |
| 1.8:1 | 19.0 | Strong leveling |
| 2:1 | 18.1 | Strong leveling |
Claims (5)
1. The ionic liquid aluminum plating liquid containing the leveling agent is characterized in that the leveling agent is an organic salt with a long alkyl chain and a nitrogen-containing aromatic ring, the long alkyl chain is twelve to eighteen carbons, the nitrogen-containing aromatic ring is a pyridine, pyrrole or imidazole ring, and an anion is a chloride ion or a bromide ion.
2. The ionic liquid aluminum-plating liquid containing the leveling agent as claimed in claim 1, wherein the leveling agent is cetylpyridinium chlorideOf the chemical formula C21H38ClN。
3. The ionic liquid aluminum-plating liquid containing the leveling agent as recited in claim 1, wherein the addition concentration of the leveling agent is 5.0g/L to 20 g/L.
4. An aluminum plating process, characterized in that the ionic liquid aluminum plating solution containing the leveling agent according to any one of claims 1 to 3 is used for aluminum plating, and the method comprises the following steps:
the method comprises the following steps: pretreatment
The matrix is treated by adopting a conventional pretreatment method, namely: mechanical polishing, alkali washing for removing oil, acid washing for removing an oxidation film, water washing, alcohol washing and drying;
step two: ionic liquid aluminium plating
Taking a piece to be plated as a cathode, taking a high-purity Al wire as an anode, taking an ionic liquid containing a leveling agent as a plating solution, and plating Al at constant current;
step three: post-treatment
And taking out the workpiece plated with the aluminum layer, ultrasonically cleaning the workpiece by using alcohol, and drying the workpiece.
5. An aluminum plating process according to claim 4, wherein in the second step, the parameters of the plating process are as follows: current density: 10 to 30mA/cm2Temperature: 25-60 ℃.
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| CN113913868A (en) * | 2021-10-29 | 2022-01-11 | 北京欧菲金太科技有限责任公司 | Ionic liquid electrolyte, 6N ultra-pure aluminum obtained by ionic liquid electrolyte and preparation method of ionic liquid electrolyte |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105518185A (en) * | 2013-03-14 | 2016-04-20 | 思力柯集团 | Electrodeposition in ionic liquid electrolytes |
| CN107148497A (en) * | 2014-09-17 | 2017-09-08 | 思力柯集团 | additive for electro-deposition |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105518185A (en) * | 2013-03-14 | 2016-04-20 | 思力柯集团 | Electrodeposition in ionic liquid electrolytes |
| CN107148497A (en) * | 2014-09-17 | 2017-09-08 | 思力柯集团 | additive for electro-deposition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113913868A (en) * | 2021-10-29 | 2022-01-11 | 北京欧菲金太科技有限责任公司 | Ionic liquid electrolyte, 6N ultra-pure aluminum obtained by ionic liquid electrolyte and preparation method of ionic liquid electrolyte |
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