CN115573006A - Copper and copper alloy environment-friendly cyanide-free silver electroplating solution - Google Patents
Copper and copper alloy environment-friendly cyanide-free silver electroplating solution Download PDFInfo
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- CN115573006A CN115573006A CN202211204967.2A CN202211204967A CN115573006A CN 115573006 A CN115573006 A CN 115573006A CN 202211204967 A CN202211204967 A CN 202211204967A CN 115573006 A CN115573006 A CN 115573006A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
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Abstract
The invention discloses an environment-friendly cyanide-free silver electroplating solution for copper and copper alloy, which comprises, by weight, 0.5 to 3.5 parts of silver chloride, 8 to 35 parts of 3-pyridine acid, 2 to 8 parts of 5, 5-Dimethylhydantoin (DMH), 2 to 8 parts of potassium carbonate, 3 to 10 parts of potassium citrate and 3 to 10 parts of ethylenediamine. The solution is environment-friendly in use, can be applied to mass production of copper parts, and simultaneously has the following advantages: 1. the stability of the electroplating solution is high; 2. the current density range is wide; 3. the silver plating layer has good appearance and is milky white; 4. the solution does not contain CN ‑ And is safe.
Description
Technical Field
The invention relates to a copper piece silver plating process, in particular to an environment-friendly cyanide-free silver electroplating solution for copper and copper alloy.
Background
In the production of electrical products or electronic products, most parts of copper and copper alloys need to be subjected to silver electroplating, and at present, most of silver electroplating processes are cyanide electroplating processes. With the increasing requirement on environmental protection, the cyanide electroplating process is eliminated, the implementation of cyanide-free electroplating is a trend of future development, and the premise of realizing the cyanide-free electroplating process is to provide cyanide-free electroplating solution. However, the existing cyanide-free silver electroplating solution has the problems of poor stability, low current density, low impurity interference resistance, difficult solution maintenance and the like.
Currently, there are some research results on cyanide-free silver electroplating solutions, such as: chinese patent CN104480500A discloses a cyanide-free electroplating solution for copper or copper alloy silver plating, which is prepared from the following raw materials: 80-00 g/L of sulfosalicylic acid, 20-50 g/L of silver nitrate, 100-200 g/L of ammonium acetate, 5-25 g/L of ethylenediamine and 2-50 mL/L of free ammonia. Although the cyanide-free silver plating electroplating solution provided by the invention improves the stability of the plating solution to a certain extent, the cyanide-free silver plating electroplating solution still cannot meet the requirement of mass electroplating production.
Disclosure of Invention
The invention aims to provide an environment-friendly cyanide-free silver electroplating solution for copper and copper alloy. The silver plating effect is good; the electroplating solution has high stability, safety and environmental protection.
The invention is realized by the following steps: an environment protection type cyanide-free silver electroplating solution for copper and copper alloy contains (by weight portions) silver chloride 0.5-3.5, pyridine acid 8-35, 5-dimethyl hydantoin 2-8, potassium carbonate 2-8, potassium citrate 3-10 and ethylenediamine 3-10.
The environment-friendly cyanide-free silver electroplating solution for copper and copper alloy comprises, by weight, 1-3 parts of silver chloride, 10-30 parts of 3-pyridine acid, 3-7 parts of 5, 5-dimethylhydantoin, 3-6 parts of potassium carbonate, 4-8 parts of potassium citrate and 4-8 parts of ethylenediamine.
The environment-friendly cyanide-free silver electroplating solution for copper and copper alloy comprises, by weight, 2-3 parts of silver chloride, 20-30 parts of 3-pyridine acid, 5-6 parts of 5, 5-dimethylhydantoin, 4-5 parts of potassium carbonate, 5-7 parts of potassium citrate and 5-7 parts of ethylenediamine.
In the invention, the main functions of each component of the silver electroplating solution are as follows:
silver chloride: main salt of providing Ag + Ions;
3-pyridine acid: a primary complexing agent;
5, 5-dimethylhydantoin hydantoin (DMH): an auxiliary complexing agent;
potassium citrate: an auxiliary complexing agent;
potassium carbonate: a conductive salt;
ethylene diamine: a buffering agent.
The effect of the above-mentioned concentration change of each component on the effect of silver electroplating is shown in Table 1.
TABLE 1
Experiments prove that the electrosilvering effect of the invention meets the production requirements, the plating solution has good stability, and the current density range is 0.2-0.7A/dm 2 The optimum value is 0.5A/dm 2 . The invention has the following advantages: 1. the stability of the electroplating solution is high; 2. the current density range is wide; 3. the silver plating layer has good appearance; 4. the solution does not contain CN - Safe and environment-friendly.
Detailed Description
Example 1: an environment protection type cyanide-free silver electroplating solution for copper and copper alloy contains (by weight portions) silver chloride 0.5-3.5, pyridine acid 8-35, 5-dimethyl hydantoin (DMH) 2-8, potassium carbonate 2-8, potassium citrate 3-10 and ethylenediamine 3-10.
The preparation method comprises the following steps:
cleaning the plating bath with purified water;
adding 40% of purified water in the plating bath;
respectively adding 3-pyridine acid and 5, 5-dimethylhydantoin in a certain amount into the plating bath, and stirring to completely dissolve the pyridine acid and the 5, 5-dimethylhydantoin;
adding metered silver chloride into the plating tank, and stirring to completely dissolve the silver chloride;
adding appropriate amount of purified water into another clean container (such as a beaker), adding potassium citrate, stirring, dissolving, and pouring into the plating tank;
adding purified water into another clean container (such as a beaker), adding potassium carbonate, stirring, dissolving, and pouring into the plating tank;
adding ethylene diamine in a certain amount into the plating tank, and uniformly stirring;
detecting whether the pH value of the plating solution is 8-9.5.
Example 2: more preferably, the silver chloride comprises 1 to 3 parts by weight of silver chloride, 10 to 30 parts by weight of 3-pyridine acid, 3 to 6 parts by weight of 5, 5-Dimethylhydantoin (DMH), 3 to 6 parts by weight of potassium carbonate, 4 to 8 parts by weight of potassium citrate and 4 to 8 parts by weight of ethylenediamine.
Example 3: more preferably, the silver chloride solution comprises, by weight, 2-3 parts of silver chloride, 20-30 parts of 3-pyridine acid, 5-7.5 parts of 5, 5-Dimethylhydantoin (DMH), 4-5 parts of potassium carbonate, 5-7 parts of potassium citrate and 5-7 parts of ethylenediamine.
Example 4: an environment-friendly cyanide-free silver electroplating solution for copper and copper alloy is prepared from 1.5 parts of silver chloride, 10 parts of 3-pyridine acid, 2.5 parts of 5, 5-Dimethylhydantoin (DMH), 2 parts of potassium carbonate, 4 parts of potassium citrate and 3 parts of ethylenediamine by weight, and 100 parts of the solution is prepared.
The preparation method comprises the following steps:
cleaning the plating bath with purified water;
adding 40% of pure water into the plating tank;
respectively adding metered 3-pyridine acid and 5, 5-dimethylhydantoin into the plating tank, and stirring to completely dissolve the pyridine acid and the 5, 5-dimethylhydantoin;
adding silver chloride in the plating tank, and stirring to completely dissolve the silver chloride;
adding appropriate amount of purified water into another clean container (such as a beaker), adding potassium citrate, stirring, dissolving, and pouring into the plating tank;
adding purified water into another clean container (such as a beaker), adding potassium carbonate, stirring, dissolving, and pouring into the plating tank;
adding ethylene diamine in a certain amount into the plating tank, and uniformly stirring;
and detecting whether the pH value of the plating solution is 8-9.5.
The copper and copper alloy environment-friendly cyanide-free silver electroplating process parameters and flow are as follows:
chemical degreasing (45-60 ℃,3 min) → hot water rinsing → tap water rinsing → activation (room temperature, 0.5-1 min) → tap water rinsing → purified water rinsing → chemical silver plating → primary purified water rinsing → secondary purified water rinsing → electrolytic silver plating (45-60 ℃, 0.5A/dm) 2 The electroplating time is set according to the requirement of the thickness of the silver plating layer) → recovery → first-grade purified water rinsing → second-grade purified water rinsing → anti-discoloration treatment → drying (85 ℃ -95 ℃,10-20 min) → inspection → storage.
Example 5: an environment-friendly cyanide-free silver electroplating solution for copper and copper alloy is prepared from (by weight parts) silver chloride 2, 3-pyridinecarboxylic acid 15, 5-Dimethylhydantoin (DMH) 5, 5.5 potassium carbonate 4, potassium citrate 4, and ethylenediamine 5 by mixing to obtain 100 parts of solution.
Example 6: an environment-friendly cyanide-free silver electroplating solution for copper and copper alloy is prepared from (by weight parts) silver chloride 3, 3-pyridine acid 28, 5-Dimethylhydantoin (DMH) 6.5, potassium carbonate 5, potassium citrate 4.5, and ethylenediamine 6.5 by mixing to obtain 100 parts of solution.
Claims (5)
1. An environment-friendly cyanide-free silver electroplating solution for copper and copper alloy is characterized in that: the paint comprises, by weight, 0.5 to 3.5 parts of silver chloride, 8 to 35 parts of 3-pyridine acid, 2 to 8 parts of 5, 5-dimethylhydantoin, 2 to 8 parts of potassium carbonate, 3 to 10 parts of potassium citrate and 3 to 10 parts of ethylenediamine.
2. The copper and copper alloy environment-friendly cyanide-free electro-silvering solution of claim 1, wherein: the material comprises, by weight, 1 to 3 parts of silver chloride, 10 to 30 parts of 3-pyridine acid, 3 to 7 parts of 5, 5-dimethylhydantoin, 3 to 6 parts of potassium carbonate, 4 to 8 parts of potassium citrate and 4 to 8 parts of ethylenediamine.
3. The copper and copper alloy environment-friendly cyanide-free electro-silvering solution of claim 2, wherein: the material comprises, by weight, 2 to 3 parts of silver chloride, 20 to 30 parts of 3-pyridine acid, 5 to 6 parts of 5, 5-dimethylhydantoin, 4 to 5 parts of potassium carbonate, 5 to 7 parts of potassium citrate and 5 to 7 parts of ethylenediamine.
4. The copper and copper alloy environment-friendly cyanide-free electro-silvering solution of claim 1, wherein: the current density ranges from 0.2 to 0.7A/dm 2 。
5. The environmentally friendly cyanide-free electrosilvering solution of copper and copper alloys according to claim 4, wherein: the current density range is 0.45 to 0.55A/dm 2 。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211204967.2A CN115573006A (en) | 2022-09-29 | 2022-09-29 | Copper and copper alloy environment-friendly cyanide-free silver electroplating solution |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211204967.2A CN115573006A (en) | 2022-09-29 | 2022-09-29 | Copper and copper alloy environment-friendly cyanide-free silver electroplating solution |
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| CN115573006A true CN115573006A (en) | 2023-01-06 |
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| CN202211204967.2A Pending CN115573006A (en) | 2022-09-29 | 2022-09-29 | Copper and copper alloy environment-friendly cyanide-free silver electroplating solution |
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| CN (1) | CN115573006A (en) |
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- 2022-09-29 CN CN202211204967.2A patent/CN115573006A/en active Pending
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