CN101225516A - Ni-W-P alloy plating solution for chemical plating and chemical plating method employing the same - Google Patents
Ni-W-P alloy plating solution for chemical plating and chemical plating method employing the same Download PDFInfo
- Publication number
- CN101225516A CN101225516A CNA200810059696XA CN200810059696A CN101225516A CN 101225516 A CN101225516 A CN 101225516A CN A200810059696X A CNA200810059696X A CN A200810059696XA CN 200810059696 A CN200810059696 A CN 200810059696A CN 101225516 A CN101225516 A CN 101225516A
- Authority
- CN
- China
- Prior art keywords
- plating
- sodium
- chemical
- plating bath
- washing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention relates to a plating solution for chemical plating nickel-tungsten-phosphor alloy, comprising nickel vitriol of 24 to 28 g/l, sodium citrate of 40 to 70 g/l, gluconic acid sodium salt of 20 to 30 g/l, ammonium sulfate of 30 to 40 g/l, sodium pyroborate of 5 to 15 g/l, sodium tungstate of 30 to 50 g/l, sodium hypophosphite of 20 to 28 g/l, potash iodate of 10 to 20 mg/l, thiourea of 0.5 to 1.5 mg/l and sodium dodecyl sulfate of 5 to 15 mg/l. The plating solution is characterized in that: the chemical plating method using the plating solution comprises the following steps that: the pH value of the plating solution is adjusted to 8 to 9, and then the plating solution is heated to 80 to 90 degree centigrade, and then the processed plating articles are dipped into the plating solution; the time of dip plating is determined by the required plating layer thickness. The plating solution for chemical plating nickel-tungsten-phosphor alloy has the advantages of higher stability and higher plating speed.
Description
(1) technical field
The present invention relates to a kind of chemical nickel plating tungsten phosphorus alloy plating liquid, and relate to a kind of method of chemical nickel plating tungsten phosphorus.
(2) background technology
The electroless plating ni-w-p alloy is compared with chemical plating nickel-phosphorus alloy, can further improve wear resistance, erosion resistance and the thermostability of coating.But there are deficiencies such as plating speed is slow, bath life is low, quality of coating is undesirable in existing chemical nickel plating tungsten phosphorus technology, is difficult to satisfy the requirement of lot production.
(3) summary of the invention
In order to overcome the above-mentioned deficiency of prior art chemical nickel plating tungsten phosphorus alloy plating liquid, the invention provides that a kind of new plating speed is high, the plating bath of the electroless plating ni-w-p alloy of good stability and use the chemical plating method of this plating bath.
The technical scheme that the present invention solves its technical problem is: a kind of chemical nickel plating tungsten phosphorus alloy plating liquid, it is characterized in that: contain single nickel salt 24~28g/l in the plating bath, Trisodium Citrate 40~70g/l, Sunmorl N 60S 20~30g/l, ammonium sulfate 30~40g/l, sodium tetraborate 5~15g/l, sodium wolframate 30~50g/l, inferior sodium phosphate 20~28g/l, Potassium Iodate 10~20mg/l, thiocarbamide 0.5~1.5mg/l, sodium lauryl sulphate 5~15mg/l.
The prescription of the plating bath of recommending is: contain single nickel salt 26g/l in the plating bath, Trisodium Citrate 55g/l, Sunmorl N 60S 25g/l, ammonium sulfate 35g/l, sodium tetraborate 10g/l, sodium wolframate 40g/l, inferior sodium phosphate 24g/l, Potassium Iodate 15mg/l, thiocarbamide 1mg/l, sodium lauryl sulphate 10mg/l.
A kind of chemical plating method that uses above-mentioned plating bath comprises the following steps: the pH value of plating bath is transferred to 8~9, and plating bath is heated to 80~90 ℃, will put into plating bath immersion plating through the plating piece of pre-treatment again, keeps the temperature of plating bath in the immersion plating process.The time of immersion plating requires to decide according to thickness of coating.
Especially, can use sodium hydroxide or ammoniacal liquor that the pH value of plating bath is transferred to 8~9.
The pre-treatment of being addressed is general pre-treatment, and is identical with the pre-treatment of existing chemical nickel plating tungsten phosphorus, i.e. oil removing-washing-activation-washing-flash nickel, or oil removing-washing-alkaline etching-washing-glazing-washing-secondary soaking zinc-washing.
Beneficial effect of the present invention is: 1. plating bath adopts Trisodium Citrate and Sunmorl N 60S as compound complex agent, replaces the single Trisodium Citrate complexing agent in the conventional formulation, makes coating have higher stability, has higher plating speed again.2. plating bath adopts ammonium sulfate and sodium tetraborate as composite buffering agent, replaces the single ammonium sulfate buffer reagent in the conventional formulation, reduces bath pH value and changes.3. plating bath selects for use Potassium Iodate and thiocarbamide as one package stabilizer, replaces the single Potassium Iodate stablizer in the conventional formulation, makes the stability of plating bath and plating speed obtain better cooperation.4. plating bath adopts micro-sodium lauryl sulphate as lubricant, improves the slipperiness and the compactness of coating.
(4) embodiment
Below in conjunction with embodiment the present invention is described in further detail.
Embodiment one
The preparation of plating bath: at room temperature in deionized water, add single nickel salt, Trisodium Citrate, Sunmorl N 60S, ammonium sulfate, sodium tetraborate, sodium wolframate, inferior sodium phosphate, Potassium Iodate, thiocarbamide, sodium lauryl sulphate successively, stirring and dissolving, mixing, wherein the concentration of single nickel salt is 24g/l, Trisodium Citrate 40g/l, Sunmorl N 60S 30g/l, ammonium sulfate 40g/l, sodium tetraborate 5g/l, sodium wolframate 50g/l, inferior sodium phosphate 28g/l, Potassium Iodate 15mg/l, thiocarbamide 0.5mg/l, sodium lauryl sulphate 15mg/l.
The pH value of the plating bath that configures is transferred to 9 with sodium hydroxide, and be heated to 87 ℃ stand-by.
Plating piece is Φ 5mm * 30mm brass spare, process pre-treatment: behind oil removing-washing-activation-washing-flash nickel 0.5min, put into plating bath immersion plating 40min, keeping the temperature of plating bath in the immersion plating process is 87 ℃, obtain thickness and be 10 μ m, smooth, even, coating that bonding force is good, the hardness of coating is 520HV.
Embodiment two
The preparation of plating bath: at room temperature in deionized water, add single nickel salt, Trisodium Citrate, Sunmorl N 60S, ammonium sulfate, sodium tetraborate, sodium wolframate, inferior sodium phosphate, Potassium Iodate, thiocarbamide, sodium lauryl sulphate successively, stirring and dissolving, mixing, wherein the concentration of single nickel salt is 28g/l, Trisodium Citrate 70g/l, Sunmorl N 60S 20g/l, ammonium sulfate 30g/l, sodium tetraborate 10g/l, sodium wolframate 30g/l, inferior sodium phosphate 20g/l, Potassium Iodate 10mg/l, thiocarbamide 1.5mg/l, sodium lauryl sulphate 5mg/l.
The pH value of the plating bath that configures is transferred to 8 with sodium hydroxide, and be heated to 85 ℃ stand-by.
Plating piece is 6061 Al-alloy parts of Φ 16mm * 30mm, process pre-treatment: after oil removing-washing-alkaline etching-washing-glazing-washing-secondary soaking zinc-washing, put into plating bath immersion plating 60min, keeping the temperature of plating bath in the immersion plating process is 85 ℃, obtain thickness and be 15 μ m, smooth, even, coating that bonding force is good, the hardness of coating is 543HV.
Embodiment three
The preparation of plating bath: at room temperature in deionized water, add single nickel salt, Trisodium Citrate, Sunmorl N 60S, ammonium sulfate, sodium tetraborate, sodium wolframate, inferior sodium phosphate, Potassium Iodate, thiocarbamide, sodium lauryl sulphate successively, stirring and dissolving, mixing, wherein the concentration of single nickel salt is 26g/l, Trisodium Citrate 60g/l, Sunmorl N 60S 24g/l, ammonium sulfate 34g/l, sodium tetraborate 15g/l, sodium wolframate 38g/l, inferior sodium phosphate 23g/l, Potassium Iodate 17mg/l, thiocarbamide 0.8mg/l, sodium lauryl sulphate 7mg/l.
The pH value of the plating bath that configures is transferred to 8.5 with sodium hydroxide, and be heated to 80 ℃ stand-by.
Plating piece is Φ 5mm * 30mm brass spare, process pre-treatment: behind oil removing-washing-activation-washing-flash nickel 1min, put into plating bath immersion plating 50min, keeping the temperature of plating bath in the immersion plating process is 80 ℃, obtain thickness and be 12 μ m, smooth, even, coating that bonding force is good, the hardness of coating is 530HV.
Embodiment four
The preparation of plating bath: at room temperature in deionized water, add single nickel salt, Trisodium Citrate, Sunmorl N 60S, ammonium sulfate, sodium tetraborate, sodium wolframate, inferior sodium phosphate, Potassium Iodate, thiocarbamide, sodium lauryl sulphate successively, stirring and dissolving, mixing, wherein the concentration of single nickel salt is 27g/l, Trisodium Citrate 50g/l, Sunmorl N 60S 28g/l, ammonium sulfate 39g/l, sodium tetraborate 14g/l, sodium wolframate 46g/l, inferior sodium phosphate 27g/l, Potassium Iodate 20mg/l, thiocarbamide 1.2mg/l, sodium lauryl sulphate 13mg/l.
The pH value of the plating bath that configures is transferred to 8.7 with sodium hydroxide, and be heated to 90 ℃ stand-by.
Plating piece is 6061 Al-alloy parts of Φ 16mm * 30mm, process pre-treatment: after oil removing-washing-alkaline etching-washing-glazing-washing-secondary soaking zinc-washing, put into plating bath immersion plating 50min, keeping the temperature of plating bath in the immersion plating process is 90 ℃, obtain thickness and be 12 μ m, smooth, even, coating that bonding force is good, the hardness of coating is 540HV.
Embodiment five
The preparation of plating bath: at room temperature in deionized water, add single nickel salt, Trisodium Citrate, Sunmorl N 60S, ammonium sulfate, sodium tetraborate, sodium wolframate, inferior sodium phosphate, Potassium Iodate, thiocarbamide, sodium lauryl sulphate successively, stirring and dissolving, mixing, wherein the concentration of single nickel salt is 26g/l, Trisodium Citrate 55g/l, Sunmorl N 60S 25g/l, ammonium sulfate 35g/l, sodium tetraborate 10g/l, sodium wolframate 40g/l, inferior sodium phosphate 24g/l, Potassium Iodate 15mg/l, thiocarbamide 1mg/l, sodium lauryl sulphate 10mg/l.
The pH value of the plating bath that configures is transferred to 8.5 with sodium hydroxide, and be heated to 85 ℃ stand-by.
Plating piece is Φ 5mm * 30mm brass spare, process pre-treatment: behind oil removing-washing-activation-washing-flash nickel 0.6min, put into plating bath immersion plating 50min, keeping the temperature of plating bath in the immersion plating process is 85 ℃, obtain thickness and be 13 μ m, smooth, even, coating that bonding force is good, the hardness of coating is 540HV.
Claims (6)
1. chemical nickel plating tungsten phosphorus alloy plating liquid, it is characterized in that: contain single nickel salt 24~28g/l in the plating bath, Trisodium Citrate 40~70g/l, Sunmorl N 60S 20~30g/l, ammonium sulfate 30~40g/l, sodium tetraborate 5~15g/l, sodium wolframate 30~50g/l, inferior sodium phosphate 20~28g/l, Potassium Iodate 10~20mg/l, thiocarbamide 0.5~1.5mg/l, sodium lauryl sulphate 5~15mg/l.
2. chemical nickel plating tungsten phosphorus alloy plating liquid as claimed in claim 1, it is characterized in that: contain single nickel salt 26g/l in the plating bath, Trisodium Citrate 55g/l, Sunmorl N 60S 25g/l, ammonium sulfate 35g/l, sodium tetraborate 10g/l, sodium wolframate 40g/l, inferior sodium phosphate 24g/l, Potassium Iodate 15mg/l, thiocarbamide 1mg/l, sodium lauryl sulphate 10mg/l.
3. one kind is used the chemical plating method of plating bath according to claim 1, it is characterized in that: comprise the following steps: the pH value of plating bath is transferred to 8~9, and plating bath is heated to 80~90 ℃, and will put into plating bath immersion plating through the plating piece of pre-treatment again, keep the temperature of plating bath in the immersion plating process.
4. chemical plating method as claimed in claim 3 is characterized in that: use sodium hydroxide or ammoniacal liquor that the pH value of plating bath is transferred to 8~9.
5. chemical plating method as claimed in claim 4 is characterized in that: described pre-treatment is: oil removing-washing-activation-washing-flash nickel.
6. chemical plating method as claimed in claim 4 is characterized in that: described pre-treatment is oil removing-washing-alkaline etching-washing-glazing-washing-secondary soaking zinc-washing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA200810059696XA CN101225516A (en) | 2008-02-03 | 2008-02-03 | Ni-W-P alloy plating solution for chemical plating and chemical plating method employing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA200810059696XA CN101225516A (en) | 2008-02-03 | 2008-02-03 | Ni-W-P alloy plating solution for chemical plating and chemical plating method employing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101225516A true CN101225516A (en) | 2008-07-23 |
Family
ID=39857714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA200810059696XA Pending CN101225516A (en) | 2008-02-03 | 2008-02-03 | Ni-W-P alloy plating solution for chemical plating and chemical plating method employing the same |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101225516A (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102560449A (en) * | 2011-10-31 | 2012-07-11 | 森鹤乐器股份有限公司 | Plating solution for electroless-plating nickel, tungsten and phosphorus alloy of zinc alloy die castings and preparation method thereof |
CN102634781A (en) * | 2012-05-11 | 2012-08-15 | 森鹤乐器股份有限公司 | Plating solution for chemically plating nickel tungsten phosphorus alloy for zinc alloy die-casting piece and preparation method of plating solution |
CN102732865A (en) * | 2012-04-11 | 2012-10-17 | 中国电子科技集团公司第五十五研究所 | Chemical nickel plating solution and aluminum silicon carbide plating method |
CN105040004A (en) * | 2015-08-28 | 2015-11-11 | 安徽大地熊新材料股份有限公司 | Sintered Nd-Fe-B magnet surface coating technology |
CN105112899A (en) * | 2015-06-30 | 2015-12-02 | 中国兵器科学研究院宁波分院 | Alkaline nickel-tungsten-phosphorus-alloy chemical plating brightening agent and chemical plating method using brightening agent |
CN105887055A (en) * | 2014-12-01 | 2016-08-24 | 苏州市汉宜化学有限公司 | Chemical nickel-plating solution with high tolerance for zinc and aluminum impurities and long service life |
CN106367740A (en) * | 2016-09-18 | 2017-02-01 | 肇庆市高新区创客科技有限公司 | Novel environment-friendly alloy catalyzing liquid and preparing method thereof |
CN106480454A (en) * | 2016-10-19 | 2017-03-08 | 南昌大学 | A kind of substrate double technique for preparing coating of suppression Lead-Free Solder Joint interface compound growth |
CN106637160A (en) * | 2017-01-04 | 2017-05-10 | 上海丰豫新材料科技有限公司 | Regeneration method of chemical plating NiWP solution |
CN106835089A (en) * | 2017-01-21 | 2017-06-13 | 扬州大学 | Ni W P Nano-meter SiO_2s2The preparation method of chemical composite plating |
CN107058988A (en) * | 2017-04-20 | 2017-08-18 | 上海丰豫新材料科技有限公司 | A kind of chemical nickel plating tungsten phosphorus formula |
CN109576687A (en) * | 2019-01-21 | 2019-04-05 | 中原工学院 | A kind of formula and technique of diadust chemical nickel plating |
CN113652678A (en) * | 2021-08-12 | 2021-11-16 | 苏州市汉宜化学有限公司 | Chemical nickel-tungsten-phosphorus plating solution and chemical plating method using same |
CN113789504A (en) * | 2021-08-20 | 2021-12-14 | 清远敏惠汽车零部件有限公司 | Chemical plating method |
CN114059053A (en) * | 2021-11-09 | 2022-02-18 | 苏州汉宜纳米新材料有限公司 | Chemical plating Ni-W-P plating solution and preparation method thereof, and Ni-W-P plating layer and preparation method thereof |
-
2008
- 2008-02-03 CN CNA200810059696XA patent/CN101225516A/en active Pending
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102560449A (en) * | 2011-10-31 | 2012-07-11 | 森鹤乐器股份有限公司 | Plating solution for electroless-plating nickel, tungsten and phosphorus alloy of zinc alloy die castings and preparation method thereof |
CN102732865A (en) * | 2012-04-11 | 2012-10-17 | 中国电子科技集团公司第五十五研究所 | Chemical nickel plating solution and aluminum silicon carbide plating method |
CN102634781A (en) * | 2012-05-11 | 2012-08-15 | 森鹤乐器股份有限公司 | Plating solution for chemically plating nickel tungsten phosphorus alloy for zinc alloy die-casting piece and preparation method of plating solution |
CN105887055A (en) * | 2014-12-01 | 2016-08-24 | 苏州市汉宜化学有限公司 | Chemical nickel-plating solution with high tolerance for zinc and aluminum impurities and long service life |
CN105887055B (en) * | 2014-12-01 | 2018-05-18 | 苏州市汉宜化学有限公司 | It is a kind of to have high tolerance, the chemical nickel-plating liquid of long-life to zinc, aluminium impurity |
CN105112899A (en) * | 2015-06-30 | 2015-12-02 | 中国兵器科学研究院宁波分院 | Alkaline nickel-tungsten-phosphorus-alloy chemical plating brightening agent and chemical plating method using brightening agent |
CN105112899B (en) * | 2015-06-30 | 2018-02-27 | 中国兵器科学研究院宁波分院 | A kind of alkaline chemical nickel-plating tungsten phosphorus alloy brightener and application have the chemical plating method of the brightener |
CN105040004A (en) * | 2015-08-28 | 2015-11-11 | 安徽大地熊新材料股份有限公司 | Sintered Nd-Fe-B magnet surface coating technology |
CN106367740A (en) * | 2016-09-18 | 2017-02-01 | 肇庆市高新区创客科技有限公司 | Novel environment-friendly alloy catalyzing liquid and preparing method thereof |
CN106480454A (en) * | 2016-10-19 | 2017-03-08 | 南昌大学 | A kind of substrate double technique for preparing coating of suppression Lead-Free Solder Joint interface compound growth |
CN106480454B (en) * | 2016-10-19 | 2018-12-07 | 南昌大学 | A kind of double technique for preparing coating of the substrate inhibiting Lead-Free Solder Joint interface compound growth |
CN106637160A (en) * | 2017-01-04 | 2017-05-10 | 上海丰豫新材料科技有限公司 | Regeneration method of chemical plating NiWP solution |
CN106835089A (en) * | 2017-01-21 | 2017-06-13 | 扬州大学 | Ni W P Nano-meter SiO_2s2The preparation method of chemical composite plating |
CN107058988A (en) * | 2017-04-20 | 2017-08-18 | 上海丰豫新材料科技有限公司 | A kind of chemical nickel plating tungsten phosphorus formula |
CN109576687A (en) * | 2019-01-21 | 2019-04-05 | 中原工学院 | A kind of formula and technique of diadust chemical nickel plating |
CN113652678A (en) * | 2021-08-12 | 2021-11-16 | 苏州市汉宜化学有限公司 | Chemical nickel-tungsten-phosphorus plating solution and chemical plating method using same |
CN113789504A (en) * | 2021-08-20 | 2021-12-14 | 清远敏惠汽车零部件有限公司 | Chemical plating method |
CN114059053A (en) * | 2021-11-09 | 2022-02-18 | 苏州汉宜纳米新材料有限公司 | Chemical plating Ni-W-P plating solution and preparation method thereof, and Ni-W-P plating layer and preparation method thereof |
CN114059053B (en) * | 2021-11-09 | 2023-10-10 | 苏州汉宜纳米新材料有限公司 | Electroless Ni-W-P plating solution and preparation method thereof, ni-W-P plating layer and preparation method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101225516A (en) | Ni-W-P alloy plating solution for chemical plating and chemical plating method employing the same | |
CN100500935C (en) | Environment-protection brightening type chemical nickel-plating additive | |
CN105297085B (en) | A kind of method that nickel-plating liquid prepares nickel-base plating coat | |
EP2809825B1 (en) | Electroless nickel plating bath | |
CN101694005B (en) | Activated solution of magnesium alloy surface micro-arc oxidation ceramic coating surface and activation method | |
CN102031510B (en) | Metal zinc coating blackening agent and preparation method thereof | |
CN102286735A (en) | Chemical nickel plating solution | |
CN101665930A (en) | Magnesium alloy direct chemical plating NI-P-SiC plating solution formula and plating process | |
CN101928967B (en) | Cobalt-tungsten-nickel-phosphorus alloy electroplating liquid | |
CN100999819A (en) | Process of zine pressure casting non cyanogen alkaline immersion plating copper | |
CN104120412A (en) | Chemical nickel plating solution, chemical nickel plating method and chemical nickel plated part | |
CN109957822A (en) | Copper alloy electroplating technology | |
CN100476029C (en) | Direct chemical nickeling process for pressed-cast aluminum alloy | |
CN100476026C (en) | Copper-alloy chemical nickeling process | |
CN111235557A (en) | Chemical nickel plating solution and chemical nickel plating method | |
KR101861626B1 (en) | PC-ABS Resin parts Non-degradable Metal plating method | |
CN105039943A (en) | Plating solution for electroless plating of Ni-W-Zn-P alloy coating and coating process thereof | |
CN111074248A (en) | Chemical nickel plating solution and ceramic secondary metallization method | |
CN106048567A (en) | Method for chemically plating high-phosphorus nickel-phosphorus alloy | |
CN102181848A (en) | Electroless nickel plating compound brightener and use method thereof | |
TW202028526A (en) | Electroless Ni-Fe alloy plating solution | |
CN104746055B (en) | A kind of high stable type chemical nickel-plating solution and chemical plating method | |
CN100368595C (en) | Complex additive for chemical nickel plating | |
CN107974674A (en) | Pollution-free environmental protection nickel plating liquid, its preparation method and its application method | |
CN102925878B (en) | Normal-temperature chemical tinning solution |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080723 |