CN111235557A - Chemical nickel plating solution and chemical nickel plating method - Google Patents
Chemical nickel plating solution and chemical nickel plating method Download PDFInfo
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- CN111235557A CN111235557A CN202010161113.5A CN202010161113A CN111235557A CN 111235557 A CN111235557 A CN 111235557A CN 202010161113 A CN202010161113 A CN 202010161113A CN 111235557 A CN111235557 A CN 111235557A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/168—Control of temperature, e.g. temperature of bath, substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
The invention provides a chemical nickel plating solution and a chemical nickel plating method, wherein the chemical nickel plating solution comprises, by weight, 10-40 parts of nickel salt, 10-40 parts of a reducing agent, 5-40 parts of a complexing agent, 0.01-1 part of tin methanesulfonate and 5-30 parts of a pH buffering agent, wherein the complexing agent consists of aminoacetic acid, lactic acid and sodium citrate, and the dosage ratio of the aminoacetic acid to the sodium citrate is (3-7): (13-17): (10-14). The chemical nickel plating solution provided by the invention is more environment-friendly and the phosphorus content of the plating layer is higher.
Description
Technical Field
The invention belongs to the technical field of electroplating chemistry, and particularly relates to a chemical nickel plating solution and a chemical nickel plating method.
Background
Electroless nickel plating, also known as electroless nickel plating, is a novel film forming technique for depositing a metal coating on a metal surface by an autocatalytic chemical reaction in a solution in which a metal salt and a reducing agent coexist, and the coating deposited by the electroless nickel plating is a Ni-P alloy. The plating layer with uniform thickness, compact plating layer and low porosity can be obtained by a chemical nickel plating method, is suitable for plating complex parts, does not need a power supply, can be plated on metal and nonmetal substrates, has excellent chemical, mechanical and electromagnetic properties, is one of ideal surface modification technologies of zinc alloy and aluminum alloy, and has the excellent characteristics of good corrosion resistance, high surface hardness, wear resistance, decoration and the like and process feasibility.
In order to prevent the natural decomposition of the plating solution, it is necessary to add a suitable stabilizer to the plating solution so that the reduction reaction is only carried out on the surface of the plated material, and at present, the stabilizers for electroless nickel plating mainly include ⑴ heavy metal ions, such as metal cations of lead, tin, zinc, chromium, thallium, etc., ⑵ oxyacid salts, such as molybdate, iodate, tungstate, etc., ⑶ sulfur-containing compounds, such as thiourea and its derivatives, mercaptobenzothiazole, xanthate, thiosulfate, thiocyanate, etc., and ⑷ organic acid derivatives, such as methyltetrahydroxyphthalic anhydride, hexachloroendomethylenetetrahydroxyphthalic anhydride, etc.
However, the existing chemical nickel plating stabilizer such as heavy metals such as lead and cadmium causes poor environmental protection of electroplating, and the environmental-friendly stabilizer cannot keep high phosphorus content of a plating layer after electroplating.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the chemical nickel plating solution and the chemical nickel plating method which are more environment-friendly and have higher phosphorus content in a plating layer.
The invention provides a chemical nickel plating solution, which comprises, by weight, 10-40 parts of nickel salt, 10-40 parts of a reducing agent, 5-40 parts of a complexing agent, 0.01-5 parts of tin methane sulfonate and 5-30 parts of a pH buffering agent.
Preferably, the nickel salt comprises one or more of nickel sulfate, nickel chloride, nickel acetate, nickel carbonate, and nickel sulfamate.
Preferably, the reducing agent comprises one of sodium hypophosphite, potassium hypophosphite, formaldehyde sodium bisulfite, sodium borohydride, thiourea, hydroquinone, ascorbic acid, and dimethylamine borane.
Preferably, the complexing agent comprises one or more of succinic acid, sodium succinate, citric acid, sodium citrate, lactic acid, malic acid, glycine, mercaptochitosan, ethylenediaminetetraacetic acid tetrasodium salt, ethylenediaminetetraacetic acid, N-hydroxyethylethylenediaminetriacetic acid, tetrahydroxypropylethylenediamine, glycine, and triethanolamine.
Preferably, the pH buffer is sodium acetate, the nickel salt is nickel sulfate, the reducing agent is sodium hypophosphite, the accelerator is propionic acid, and the complexing agent is composed of glycine, lactic acid, and sodium citrate.
Preferably, the dosage ratio of the glycine to the sodium citrate is (3-7): (13-17): (10-14).
The invention also provides a chemical nickel plating solution which comprises, by weight, 10-40 parts of nickel sulfate, 10-40 parts of sodium hypophosphite, 10-30 parts of sodium acetate, 5-30 parts of lactic acid, 1-10 parts of glycine, 0.01-5 parts of tin methanesulfonate, 5-30 parts of sodium citrate and the balance of water.
Preferably, the water-soluble nickel-sodium hypophosphite consists of 15-30 parts of nickel sulfate, 20-30 parts of sodium hypophosphite, 10-20 parts of sodium acetate, 10-20 parts of lactic acid, 1-10 parts of glycine, 0.01-1 part of tin methanesulfonate, 5-20 parts of sodium citrate and the balance of water in parts by weight.
The invention also provides an electroless nickel plating method, wherein a plated part is placed in the electroless nickel plating solution according to any one of claims 1 to 7 and is electroplated for 5 to 20 minutes, and the temperature of the plating solution of the electroless nickel plating solution is 70 to 110 ℃, and the pH value is 3 to 5.
Preferably, electroplating is carried out for 5-15 minutes, and the temperature of the plating solution of the chemical nickel plating solution is 80-100 ℃, and the pH value is 4-5.
The chemical nickel plating solution and the chemical nickel plating method provided by the invention use the tin methane sulfonate to replace heavy metals such as lead, cadmium and the like as a stabilizer, and are more environment-friendly. Meanwhile, the phosphorus content of the plating layer can be kept in a higher range.
Detailed Description
The technical solutions of the present invention are further described in detail with reference to specific examples so that those skilled in the art can better understand the present invention and can implement the present invention, but the examples are not intended to limit the present invention.
The embodiment of the invention provides a chemical nickel plating solution which comprises, by weight, 10-40 parts of nickel salt, 10-40 parts of a reducing agent, 5-40 parts of a complexing agent, 0.01-5 parts of tin methane sulfonate and 5-30 parts of a pH buffering agent.
In the embodiment, tin methane sulfonate is selected as the stabilizer, so that the method is more environment-friendly compared with a heavy metal stabilizer, and can ensure higher phosphorus content of a plating layer compared with the existing chemical nickel plating solution using oxysalt, a sulfur-containing compound and an organic acid derivative as the stabilizer. Higher phosphorus content can make the subsequent salt spray effect better. For example, high phosphorus with a 10% phosphorus content of the coating is much more effective than salt mist of neutral phosphorus with a 7% phosphorus content of the coating. Therefore, the proper stabilizer is selected to have a good environment-friendly effect, and the plating layer of the plated part after electroplating has high phosphorus content by matching with other elements.
In a preferred embodiment, the nickel salt is 10-30 parts, and in a more preferred embodiment, the nickel salt is 15-27 parts.
In a preferred embodiment, the reducing agent is 10-30 parts, and in a more preferred embodiment, the reducing agent is 20-30 parts.
In a preferred embodiment, the complexing agent is 5-35 parts, and in a more preferred embodiment, the complexing agent is 10-30 parts.
In a preferred embodiment, the pH buffer is 5-20 parts, and in a more preferred embodiment, the pH buffer is 8-20 parts.
In a preferred embodiment, 0.01 to 1 part of tin methanesulfonate, in a further preferred embodiment, 0.05 to 1 part of tin methanesulfonate, and in a further preferred embodiment, 0.05 to 0.7 part of tin methanesulfonate.
The chemical nickel plating solution of the embodiment can keep the phosphorus content of the plating layer above 10% after being used for plating a plated part. Such high levels of plating phosphorus are not very easy for electroless nickel plating.
In a preferred embodiment, the nickel salt comprises one or more of nickel sulfate, nickel chloride, nickel acetate, nickel carbonate, nickel sulfamate. More preferably, the nickel salt is nickel sulfate.
In a preferred embodiment, the reducing agent comprises one of sodium hypophosphite, potassium hypophosphite, formaldehyde sodium bisulfite, sodium borohydride, thiourea, hydroquinone, ascorbic acid, and dimethylamine borane. More preferably, the reducing agent is sodium hypophosphite.
In a preferred embodiment, the complexing agent comprises one or more of succinic acid, sodium succinate, citric acid, sodium citrate, lactic acid, malic acid, glycine, mercaptochitosan, ethylenediaminetetraacetic acid tetrasodium salt, ethylenediaminetetraacetic acid, N-hydroxyethylethylenediaminetriacetic acid, tetrahydroxypropylethylenediamine, glycine, and triethanolamine. In a further preferred embodiment, the complexing agent consists of glycine, lactic acid and sodium citrate.
In a preferred embodiment, the pH buffer is sodium acetate (sodium citrate) and the accelerator is propionic acid.
In a preferred embodiment, the ratio of the amount of glycine, lactic acid and sodium citrate is (3-7): (13-17): (10-14).
The invention also provides a chemical nickel plating solution which comprises, by weight, 10-40 parts of nickel sulfate, 10-40 parts of sodium hypophosphite, 10-30 parts of sodium acetate, 5-30 parts of lactic acid, 1-10 parts of glycine, 0.01-5 parts of tin methanesulfonate, 5-30 parts of sodium citrate and the balance of water.
In a preferred embodiment, the nickel sulfate is 10-30 parts, and in a more preferred embodiment, the nickel sulfate is 15-27 parts.
In a preferred embodiment, the sodium hypophosphite 10-30 parts, and in a more preferred embodiment, the sodium hypophosphite 20-30 parts.
In a preferred embodiment, the sodium citrate is 5-20 parts, and in a more preferred embodiment, the sodium citrate is 8-20 parts.
In a preferred embodiment, 0.01 to 1 part of tin methanesulfonate, in a further preferred embodiment, 0.05 to 1 part of tin methanesulfonate, and in a further preferred embodiment, 0.05 to 0.7 part of tin methanesulfonate.
In the preferred embodiment, the nickel-zinc phosphate coating comprises, by weight, 15-30 parts of nickel sulfate, 20-30 parts of sodium hypophosphite, 10-20 parts of sodium acetate, 10-20 parts of lactic acid, 1-10 parts of glycine, 0.01-1 part of tin methanesulfonate, 5-20 parts of sodium citrate and the balance of water.
The invention also discloses a chemical nickel plating method, wherein a plated part is placed in the chemical nickel plating solution for electroplating for 5-20 minutes, the temperature of the plating solution of the chemical nickel plating solution is 70-110 ℃, and the pH value is 3-5.
In the preferred embodiment, the electroplating is carried out for 5-15 minutes, and the temperature of the plating solution of the chemical nickel plating solution is 80-100 ℃, and the pH value is 4-5.
In order that the technical solutions of the present invention may be further understood and appreciated, several preferred embodiments are now described in detail.
Example 1
The formula is as follows: 22.5g/L of nickel sulfate, 24g/L of sodium hypophosphite, 15g/L of sodium acetate, 15ml/L of lactic acid, 5g/L of glycine, 0.2ml/L of tin methylsulfate, 12g/L of sodium citrate and the balance of water.
The chemical nickel plating method comprises the following steps: the chemical nickel plating solution is prepared by mixing the above components for standby.
Ultrasonic deoiling of iron piece for 10 min, 3 times of water washing, derusting and activating with 20-30% hydrochloric acid, 3 times of water washing, and chemical nickel plating for 10 min at 90 deg.c and pH 4.3.
Example 2
The formula is as follows: 22.4g/L of nickel sulfate, 23g/L of sodium hypophosphite, 16g/L of sodium acetate, 15ml/L of lactic acid, 5g/L of glycine, 0.3ml/L of tin methylsulfate, 12g/L of sodium citrate and the balance of water.
The chemical nickel plating method comprises the following steps: the chemical nickel plating solution is prepared by mixing the above components for standby.
Ultrasonic deoiling of iron piece for 10 min, 3 times of water washing, derusting and activating with 20-30% hydrochloric acid, 3 times of water washing, and chemical nickel plating for 10 min at 90 deg.c and pH 4.3.
Comparative example 1
Compared with example 1, in comparative example 1, tin methyl sulfate is replaced by lead chromium as a stabilizer, and the rest of the formula, the preparation method and the chemical nickel plating method are the same as those of example 1.
Comparative example 2
In comparison with example 1, in comparative example 2, tin methylsulfate was replaced with sodium thiosulfate as a stabilizer, and the remaining formulation and preparation method and electroless nickel plating method were the same as in example 1.
Examples of effects
The electroless nickel plating solutions of examples 1, 2, 1 and 2 were subjected to nickel plating while measuring the plating rate, the appearance of the nickel-plated workpiece was observed, the brightness thereof was measured by a photometer, and the phosphorus content and heavy metal content of the plating were measured on the plating after nickel plating. Specific test results are shown in table 1.
TABLE 1
| Example 1 | Example 2 | Comparative example 1 | Comparative example 2 | |
| Content of phosphorus in the coating/%) | 10.5 | 10.3 | 9.5 | 7.9 |
| Plating speed (mu m/h) | 7.1 | 7.1 | 6.9 | 9.0 |
| Appearance after plating | Uniform brightness | Uniform brightness | Uniform brightness | Uniform brightness |
| Luminance HV | 145 | 145 | 145 | 170 |
| Total content of heavy metal in the coating/%) | 0 | 0 | 200 | 0 |
As can be seen from the data in Table 1, the electroless nickel plating solutions prepared in examples 1-2 contained no heavy metals in the plated layer of the plated article after plating, and the plated layers had high phosphorus contents. In comparative example 1, heavy metal was used as a stabilizer, and the content of the obtained plating layer was high, but the content of heavy metal in the plating layer was as high as 200%. In comparative example 2, sodium thiosulfate was used as a stabilizer, and the obtained coating did not contain heavy metals, but the phosphorus content in the coating was low.
In summary, the plating layer of the plated part after the electroless nickel plating solution prepared in the embodiments 1-2 does not contain heavy metals, is more environment-friendly, and can ensure better phosphorus content of the plating layer. The phosphorus content of the plating layer of the plated part of the electroless nickel plating solution prepared in the embodiment-2 after electroplating is more than 10%.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The chemical nickel plating solution is characterized by comprising, by weight, 10-40 parts of nickel salt, 10-40 parts of a reducing agent, 5-40 parts of a complexing agent, 0.01-5 parts of tin methane sulfonate and 5-30 parts of a pH buffering agent.
2. The electroless nickel plating solution of claim 1, wherein the nickel salt comprises one or more of nickel sulfate, nickel chloride, nickel acetate, nickel carbonate, and nickel sulfamate.
3. The electroless nickel plating solution of claim 1, wherein the reducing agent comprises one of sodium hypophosphite, potassium hypophosphite, formaldehyde sodium bisulfite, sodium borohydride, thiourea, hydroquinone, ascorbic acid, and dimethylamine borane.
4. The electroless nickel plating solution of claim 1, wherein the complexing agent comprises one or more of succinic acid, sodium succinate, citric acid, sodium citrate, lactic acid, malic acid, glycine, mercaptochitosan, ethylenediaminetetraacetic acid tetrasodium salt, ethylenediaminetetraacetic acid, N-hydroxyethylethylenediaminetriacetic acid, tetrahydroxypropylethylenediamine, aminoacetic acid, and triethanolamine.
5. The electroless nickel plating solution according to claim 1, wherein the pH buffer is sodium acetate, the nickel salt is nickel sulfate, the reducing agent is sodium hypophosphite, the accelerator is propionic acid, and the complexing agent is composed of glycine, lactic acid, and sodium citrate.
6. The electroless nickel plating solution according to claim 5, wherein the ratio of the glycine to the sodium citrate is (3-7): (13-17): (10-14).
7. The chemical nickel plating solution is characterized by comprising, by weight, 10-40 parts of nickel sulfate, 10-40 parts of sodium hypophosphite, 10-30 parts of sodium acetate, 5-30 parts of lactic acid, 1-10 parts of glycine, 0.01-5 parts of tin methanesulfonate, 5-30 parts of sodium citrate and the balance of water.
8. The electroless nickel plating solution according to claim 7, which comprises, by weight, 15 to 30 parts of nickel sulfate, 20 to 30 parts of sodium hypophosphite, 10 to 20 parts of sodium acetate, 10 to 20 parts of lactic acid, 1 to 10 parts of glycine, 0.01 to 1 part of tin methanesulfonate, 5 to 20 parts of sodium citrate, and the balance of water.
9. An electroless nickel plating method, characterized in that a plating piece is placed in the electroless nickel plating solution according to any one of claims 1 to 7 and electroplated for 5 to 20 minutes, and the temperature of the plating solution of the electroless nickel plating solution is 70 ℃ to 110 ℃, and the p H value is 3 to 5.
10. An electroless nickel plating process according to claim 9, wherein said electroless nickel plating solution has a plating solution temperature of 80 ℃ to 100 ℃ and a p H value of 4 to 5, for 5 to 15 minutes.
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| CN114635125A (en) * | 2021-03-23 | 2022-06-17 | 南通麦特隆新材料科技有限公司 | Chemical nickel plating solution for nickel plating of electronic element pin and use method thereof |
| CN116791071A (en) * | 2023-07-05 | 2023-09-22 | 诺博环保科技(中山)有限公司 | Corrosion-resistant chemical nickel plating solution and preparation method thereof |
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Cited By (6)
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| CN114635125A (en) * | 2021-03-23 | 2022-06-17 | 南通麦特隆新材料科技有限公司 | Chemical nickel plating solution for nickel plating of electronic element pin and use method thereof |
| CN114635125B (en) * | 2021-03-23 | 2024-02-27 | 南通麦特隆新材料科技有限公司 | Chemical nickel plating solution for nickel plating of electronic element pins and application method thereof |
| CN116791071A (en) * | 2023-07-05 | 2023-09-22 | 诺博环保科技(中山)有限公司 | Corrosion-resistant chemical nickel plating solution and preparation method thereof |
| CN116791071B (en) * | 2023-07-05 | 2024-01-23 | 诺博环保科技(中山)有限公司 | Corrosion-resistant chemical nickel plating solution and preparation method thereof |
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