CN115570259A - Laser processing equipment for chip breaker groove processing and chip breaker groove processing method - Google Patents

Abstract

The invention provides laser processing equipment for chip breaker groove processing and a chip breaker groove processing method, and belongs to the technical field of laser processing. The auxiliary workbench is positioned on one side of the main body, a liftable objective table is arranged on the auxiliary workbench, a guide rail is arranged on the objective table, a clamping block for clamping a workpiece is arranged on the objective guide rail, and the clamping block can move on the objective guide rail; the laser head is provided with a position tracker for detecting the position of the clamping block, and the laser head moves along with the movement of the clamping block. The processing equipment utilizes laser to process the chip breaker groove on the workpiece, and can meet the processing requirement of complex chip breaker grooves on brittle and hard materials such as PCD, PCBN and the like.

Description

Laser processing equipment for chip breaker groove processing and chip breaker groove processing method

Technical Field

The invention relates to the technical field of laser processing, in particular to laser processing equipment for chip breaker groove processing and a chip breaker groove processing method.

Background

In metal cutting machining, the shape of the chip has a significant influence on normal production and on the safety of the operator. The problem of chip breaking has long been a problem of confusion in machining. When plastic metal is cut, strip-shaped chips are usually formed, and when brittle materials are cut, disintegrating chips are easily formed, and when the chip breaking grooves are the same under different cutting conditions, the formed chips are different; the same cutting conditions and different chip breakers can lead to different chips, the shape of the chip is in a critical connection with the surface machining quality, and the shape and geometric parameters of the chip breaker directly determine the cutting efficiency and the surface quality condition of the cutter. The traditional chip breaker processing mode comprises processes such as grinding wheel grinding or die stamping. But the grinding wheel grinding and die stamping processes are not suitable for chip breaker processing of hard and brittle materials such as PCD, PCBN and the like, and the chip breaker is usually produced on the hard and brittle materials by adopting wire cutting or electric spark processing.

However, wire cutting and electric spark machining processes can only machine the chip breaker with a simple structure, and cannot meet the machining requirements of the chip breaker with a complex shape. Therefore, new chip breaker processing equipment is needed to meet the production requirement of processing chip breakers on hard and brittle materials such as PCD, PCBN and the like.

Disclosure of Invention

In order to overcome the problems in the related art, one of the purposes of the invention is to provide a laser processing device for chip breaker groove processing, which utilizes laser to process chip breakers on workpieces and can meet the requirement of processing complex chip breakers on brittle and hard materials such as PCD and PCBN.

A laser processing apparatus for chip breaker groove processing, comprising:

the laser device comprises a main body, wherein a movable platform is arranged on the main body, a movable laser head is arranged on the movable platform, and the laser head is electrically connected with the main body;

the auxiliary workbench is positioned on one side of the main body, a liftable objective table is arranged on the auxiliary workbench, an objective guide rail is arranged on the objective table, a clamping block for clamping a workpiece is arranged on the objective guide rail, and the clamping block can move on the objective guide rail; the laser head is provided with a position tracker for detecting the position of the clamping block, and moves along with the movement of the clamping block.

In a preferred technical scheme of the invention, an imaging device is arranged on the moving platform and is close to the laser head.

In a preferred embodiment of the present invention, the moving platform includes an X-direction guide rail fixed to the main body and a Y-direction guide rail provided on the X-direction guide rail and movable in an X-axis direction on the X-direction guide rail, and the laser head is provided on the Y-direction guide rail and movable in a Y-axis direction on the Y-direction guide rail.

In a preferred embodiment of the present invention, the Y-guide rail is provided with a mounting block, and the laser head and the imaging device are mounted on the mounting block.

In a preferred technical scheme of the invention, a lifting driver is arranged on the auxiliary workbench and comprises a hand wheel and a lifting rod, the lifting rod is vertically arranged on the auxiliary workbench, the hand wheel is meshed with the lifting rod through a gear, the lifting rod can move in the vertical direction by rotating the hand wheel, and the top of the lifting rod is fixedly connected with the objective table.

In a preferred technical scheme of the invention, the auxiliary workbench is provided with a plurality of guide sleeves, vertical guide rods are arranged in the guide sleeves, and the tops of the guide rods penetrate through the guide sleeves and are fixedly connected with the objective table.

In a preferred technical scheme of the invention, the main body is provided with a laser generator and a light path, the laser generator generates laser, the laser passes through the light path and then is emitted from the laser head to form a focusing light spot for processing, and a light beam expander is arranged in the light path.

In a preferred technical scheme of the invention, a plurality of sucker feet are arranged at the bottom of the main body and the bottom of the auxiliary workbench.

The second purpose of the invention is to provide a chip breaker groove processing method, which is implemented by adopting the laser processing equipment;

the processing method comprises the following steps:

loading the chip breaker groove model data to be processed into a control center of laser processing equipment;

clamping a workpiece in laser processing equipment, and focusing a laser head;

setting machining parameters, configuring a machining model, setting a machining position, planning a path and finishing the setting of a machining program;

starting and executing a machining program until machining is finished;

after the machining is finished, collecting the machining groove combination characteristics by using an imaging device, comparing the collected set characteristics with the chip breaker groove model data, and judging whether the machining error is larger than a threshold value;

if so, analyzing the error reason, readjusting the machining program, and if not, reserving the machining program and the chip breaker groove model to an equipment database for subsequent machining and calling.

The invention has the beneficial effects that:

the invention provides laser processing equipment for chip breaker groove processing and a chip breaker groove processing method. The auxiliary workbench is located on one side of the main body, the auxiliary workbench is provided with a liftable objective table, the objective table is provided with a guide rail, and the objective guide rail is provided with a clamping block for clamping a workpiece. When the chip breaker is used, a workpiece is fixed on the clamping block, the chip breaker is machined on the workpiece by utilizing a focusing spot emitted from the laser head, the laser head can move along with the movement of the workpiece in the machining process, no cutting force acts on the workpiece in the laser machining process, and the direction and the size of the focusing spot are easy to adjust in the machining process, so that the chip breaker can be used for machining the chip breaker with a complex shape, and the production and machining requirements of machining the chip breaker on materials such as PCD, PCBN and the like are met. The processing method of the chip breaker can analyze whether the processing parameters are set wrongly or not according to the processing result, so that workers can adjust the laser processing parameters in time, the processing path is optimized, the yield of chip breaker processing is improved, and the processing efficiency of the chip breaker is improved.

Drawings

Fig. 1 is a perspective view of a laser processing apparatus for chip breaker processing according to the present invention;

FIG. 2 is a perspective view of the lift drive provided by the present invention mounted on an auxiliary table;

FIG. 3 is a schematic diagram of a laser generator for emitting laser light to a laser head according to the present invention;

fig. 4 is a flowchart of a chip breaker processing method provided by the present invention.

Reference numerals:

100. a main body; 110. a laser generator; 120. an optical path; 130. a beam expander; 200. a mobile platform; 210. an X-direction guide rail; 220. a Y-direction guide rail; 2201. mounting blocks; 300. a laser head; 310. a position tracker; 400. an image forming device; 500. an auxiliary work table; 510. an object stage; 520. a loading guide rail; 530. installing a clamping block; 540. a guide sleeve; 550. a guide bar; 600. a lift drive; 610. a hand wheel; 620. a lifting rod; 700. a sucker foot.

Detailed Description

Preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this disclosure and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It is to be understood that, although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present invention. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

As shown in fig. 1 to 3, the laser processing apparatus for chip breaker processing claimed in the present application includes a main body 100 and an auxiliary table 500, wherein a movable platform 200 is provided on the main body 100, a movable laser head 300 is provided on the movable platform 200, and the laser head 300 is electrically connected to the main body 100. The auxiliary workbench 500 is positioned at one side of the main body 100, a liftable object stage 510 is arranged on the auxiliary workbench 500, an object guide rail 520 is arranged on the object stage 510, a clamping block 530 for clamping a workpiece is arranged on the object guide rail 520, and the clamping block 530 can move on the object guide rail 520; the laser head 300 is provided with a position tracker 310 for detecting the position of the clamping block 530, and the laser head 300 moves along with the movement of the clamping block 530. It should be noted that the stage 510 is located below the laser head 300 during the process of machining the chip breaker. The position tracker 310 employs a position sensor that senses the position of the clamping block 530 such that the laser head 300 can move according to the movement of the clamping block 530.

Specifically, the main body 100 is provided with a laser generator 110 and a light path 120, the laser generator 110 generates laser light, and the laser light is emitted from the laser head 300 after passing through the light path 120 to form a focused spot for processing, and the light path 120 is provided with a beam expander 130. The beam expander 130 is disposed near the laser generator 110. In actual use, laser light emitted from the laser generator 110 is refracted by the beam expander 130 and the optical path 120, and then is emitted from the laser head 300 and falls on the surface of a workpiece to form a focused spot. It should be noted that the laser head 300 of the present application may employ an existing laser head 300.

The laser processing equipment for chip breaker processing comprises a main body 100 and an auxiliary workbench 500, wherein a moving platform 200 is arranged on the main body 100, a movable laser head 300 is arranged on the moving platform 200, and the laser head 300 is electrically connected with the main body 100. The auxiliary workbench 500 is located on one side of the main body 100, the auxiliary workbench 500 is provided with a liftable objective table 510, the objective table 510 is provided with a guide rail, and the objective guide rail 520 is provided with a clamping block 530 for clamping a workpiece. When the chip breaker is used, a workpiece is fixed on the clamping block 530, a chip breaker groove is machined on the workpiece by using a focusing light spot emitted from the laser head 300, the laser head 300 can move along with the movement of the workpiece in the machining process, no cutting force acts on the workpiece in the laser machining process, and the direction and the size of the focusing light spot are easy to adjust in the machining process, so that the chip breaker groove can be used for machining the chip breaker groove with a complex shape, and the chip breaker groove production and machining requirements of PCD and PCBN materials are met.

In a preferred embodiment, an imaging device 400 is disposed on the movable platform 200, and the imaging device 400 is disposed near the laser head 300. The imaging device 400 is a line laser point cloud camera, and the camera is used for collecting the geometric characteristics of the chip groove in the laser processing process and feeding the geometric characteristics back to the control system of the main body 100. The control system can optimize subsequent processing parameters of the chip breaker according to the acquired data, save the processing time of subsequent workpieces and improve the processing quality.

In a specific embodiment, the moving platform 200 includes an X-direction guide rail 210 and a Y-direction guide rail 220, the X-direction guide rail 210 is fixed on the main body 100, the Y-direction guide rail 220 is disposed on the X-direction guide rail 210, the Y-direction guide rail 220 can move in the X-direction guide rail 210 along the X-axis direction, and the laser head 300 is disposed on the Y-direction guide rail 220 and can move in the Y-direction guide rail 220 along the Y-axis direction. The movement of the Y-guide rail 220 on the X-guide rail 210 is driven by an electric slider.

Further, a mounting block 2201 is provided on the Y-guide 220, and the laser head 300 and the imaging device 400 are mounted on the mounting block 2201. The mounting block 2201 and the Y-guide rail 220 are driven by an electric slider. Since the Y-guide 220 is movable in the X-axis direction and the mounting block 2201 is movable in the Y-axis direction, the laser head 300 and the imaging device 400 can be moved in the X-axis direction and the Y-axis direction, that is, the laser head 300 can process different positions of the workpiece, and the imaging device 400 can also acquire geometric features of different positions of the workpiece.

In a better embodiment, a lifting driver 600 is arranged on the auxiliary workbench 500, the lifting driver 600 includes a hand wheel 610 and a lifting rod 620, the lifting rod 620 is vertically arranged on the auxiliary workbench 500, the hand wheel 610 is engaged with the lifting rod 620 through a gear, rotation of the hand wheel 610 enables the lifting rod 620 to move in the vertical direction, and the top of the lifting rod 620 is fixedly connected with the object stage 510.

The hand wheel 610 is arranged at the front side of the auxiliary workbench 500, and the up-and-down movement of the lifting rod 620 is controlled by controlling the rotation of the hand wheel 610, so that the position of the object stage 510 is changed to meet different processing requirements.

Furthermore, a plurality of guide sleeves 540 are arranged on the auxiliary workbench 500, vertical guide rods 550 are arranged in the guide sleeves 540, and the tops of the guide rods 550 penetrate through the guide sleeves 540 and are fixedly connected with the object stage 510. Specifically, the number of the guide sleeves 540 is 4, and the 4 guide sleeves 540 are arranged on the auxiliary worktable 500 in a rectangular shape, so that the guide rods 550 form four-point support guide for the movement of the object stage 510, which can ensure the stability of the lifting movement of the object stage 510. In another embodiment, a scale may be further disposed on the auxiliary table 500, and the scale is used for reflecting the lifting height of the lifting rod 620.

Further, a plurality of sucker feet 700 are arranged at the bottom of the main body 100 and the auxiliary workbench 500. The sucker foot 700 is used for adsorbing the main body 100 and the auxiliary workbench 500 on a base surface, and ensures the working stability of the main body 100 and the auxiliary workbench 500.

As shown in fig. 4, the present invention also provides a chip breaker groove processing method, which is implemented by using the laser processing apparatus as described above;

the processing method comprises the following steps:

s100, loading chip breaker model data to be processed into a control center of laser processing equipment;

s200, clamping a workpiece in laser processing equipment, and focusing by using a laser head 300;

s300, setting processing parameters, configuring a processing model, setting a processing position, planning a path and finishing the setting of a processing program;

s400, starting and executing a machining program until machining is finished;

s500, after the machining is finished, collecting the machining groove combination characteristics by using the imaging device 400, comparing the collected set characteristics with the chip breaker groove model data, and judging whether the machining error is larger than a threshold value;

s600, if so, analyzing error reasons, readjusting the machining program, and if not, keeping the machining program and the chip breaker groove model to an equipment database for calling in subsequent machining.

The processing method of the chip breaker can analyze whether the processing parameters are set wrongly or not according to the processing result, so that workers can adjust the laser processing parameters in time, the processing path is optimized, the yield of chip breaker processing is improved, and the processing efficiency of the chip breaker is improved.

For ease of description, spatially relative terms such as "over 8230 \ 8230;,"' over 8230;, \8230; upper surface "," above ", etc. may be used herein to describe the spatial relationship of one device or feature to another device or feature as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary terms "at 8230; \8230; above" may include both orientations "at 8230; \8230; above" and "at 8230; \8230; below". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of protection of the present application is not to be construed as being limited. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. A laser processing equipment for chip breaker groove processing, characterized by includes:

the laser device comprises a main body (100), wherein a movable platform (200) is arranged on the main body (100), a movable laser head (300) is arranged on the movable platform (200), and the laser head (300) is electrically connected with the main body (100);

the auxiliary workbench (500) is positioned on one side of the main body (100), a liftable object stage (510) is arranged on the auxiliary workbench (500), an object guide rail (520) is arranged on the object stage (510), a clamping block (530) for clamping a workpiece is arranged on the object guide rail (520), and the clamping block (530) can move on the object guide rail (520); the laser head (300) is provided with a position tracker (310) for detecting the position of the clamping block (530), and the laser head (300) moves along with the movement of the clamping block (530).

2. The laser processing apparatus for chip breaker groove processing as set forth in claim 1, wherein:

the laser head (300) is characterized in that an imaging device (400) is arranged on the moving platform (200), and the imaging device (400) is close to the laser head (300).

3. The laser processing apparatus for chip breaker groove processing as set forth in claim 2, wherein:

moving platform (200) include X to guide rail (210) and Y to guide rail (220), X is fixed to guide rail (210) on main part (100), Y sets up to guide rail (220) X is to guide rail (210) on, just Y can to guide rail (220) move along X axle direction on X to guide rail (210), laser head (300) set up Y is to guide rail (220) on, and can Y moves along Y axle direction to guide rail (220).

4. The laser processing apparatus for chip breaker groove processing as set forth in claim 3, wherein:

and a mounting block (2201) is arranged on the Y-direction guide rail (220), and the laser head (300) and the imaging device (400) are mounted on the mounting block (2201).

5. The laser processing apparatus for chip breaker groove processing as set forth in any one of claims 1 to 4, wherein:

be provided with lifting drive (600) on auxiliary work platform (500), lifting drive (600) include hand wheel (610) and lifter (620), the vertical setting of lifter (620) is in on auxiliary work platform (500), hand wheel (610) with lifter (620) pass through gear engagement, rotate hand wheel (610) can make lifter (620) move in vertical direction, lifter (620) top with objective table (510) fixed connection.

6. The laser processing apparatus for chip breaker groove processing as set forth in claim 5, wherein:

be equipped with a plurality of guide sleeve (540) on auxiliary work platform (500), be equipped with vertical guide bar (550) in guide sleeve (540), guide bar (550) top is run through guide sleeve (540) with objective table (510) fixed connection.

7. The laser processing apparatus for chip breaker groove processing as set forth in any one of claims 1 to 4, wherein:

the laser processing device is characterized in that a laser generator (110) and a light path (120) are arranged on the main body (100), the laser generator (110) generates laser, the laser passes through the light path (120) and then is ejected from the laser head (300) to form a focusing light spot for processing, and a light beam expander (130) is arranged in the light path (120).

8. The laser processing apparatus for chip breaker groove processing as set forth in any one of claims 1 to 4, wherein:

the bottom of the main body (100) and the bottom of the auxiliary workbench (500) are provided with a plurality of sucker feet (700).

9. A method of chip breaker machining, characterized in that the method is carried out using a laser machining apparatus as claimed in claim 2;

the processing method comprises the following steps:

loading the chip breaker model data to be processed into a control center of laser processing equipment;

clamping a workpiece in laser processing equipment, and focusing a laser head;

setting machining parameters, configuring a machining model, setting a machining position, planning a path and finishing the setting of a machining program;

starting and executing a machining program until machining is finished;

after the machining is finished, collecting the machining groove combination characteristics by using an imaging device, comparing the collected set characteristics with the chip breaker groove model data, and judging whether the machining error is larger than a threshold value;

if so, analyzing the error reason, readjusting the machining program, and if not, reserving the machining program and the chip breaker groove model to an equipment database for subsequent machining and calling.

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