CN115562392A - A Composite Temperature Control System Based on TEC and Heating Film - Google Patents
A Composite Temperature Control System Based on TEC and Heating Film Download PDFInfo
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Abstract
Description
技术领域technical field
本发明涉及重力仪精密测量设备领域,尤其涉及一种基于TEC和加热膜的复合温控系统。The invention relates to the field of gravimeter precision measuring equipment, in particular to a composite temperature control system based on TEC and heating film.
背景技术Background technique
地球重力场的测定对大地测量学、空间科学、地球物理学、地球动力学、海洋科学、资源勘探以及现代军事等学科具有重要意义,由高精度的石英挠性加速度计组成的比力测量系统是重力测量的核心传感器,而石英挠性加速度计对温度十分敏感,在重力仪测量系统中,对温度要求达到0.01℃。The determination of the earth's gravity field is of great significance to geodesy, space science, geophysics, geodynamics, marine science, resource exploration and modern military and other disciplines. The specific force measurement system composed of high-precision quartz flexible accelerometers It is the core sensor of gravity measurement, and the quartz flexible accelerometer is very sensitive to temperature. In the gravimeter measurement system, the temperature requirement reaches 0.01°C.
在一般温控系统中,主回路中加热膜串联温度敏感电阻连接到电源,在温度较低时温敏电阻阻值较小电源通过该电阻给加热膜加热,当给设备或者器件加热到一定温度后,温敏电阻阻值变大,主回路断开,加热膜停止加热,达到将设备或器件加热到某一温度区间的目的。或者利用TEC加热或者制冷来达到温度控制的目的,后者所采用的总体方案可以对温度闭环控制,达到很高的控制精度,但是面对重力仪设备快速稳定某点并精度要求很高这种温度要求中,该方案不能满足设计要求,温度稳定时间过长,控制精度长周期波动等问题,不能满足重力仪等精密测量设备对温度要求。In a general temperature control system, the heating film in the main circuit is connected to the power supply in series with a temperature-sensitive resistor. When the temperature is low, the resistance of the temperature-sensitive resistor is small. The power supply heats the heating film through this resistor. When the device or device is heated to a certain temperature Finally, the resistance value of the temperature-sensitive resistor becomes larger, the main circuit is disconnected, and the heating film stops heating, so as to achieve the purpose of heating the equipment or device to a certain temperature range. Or use TEC heating or cooling to achieve the purpose of temperature control. The overall scheme adopted by the latter can control the temperature in a closed loop to achieve high control accuracy. However, the gravimeter equipment is fast and stable at a certain point and requires high precision. Among the temperature requirements, this solution cannot meet the design requirements, the temperature stabilization time is too long, and the control accuracy fluctuates in a long period, etc., and cannot meet the temperature requirements of precision measuring equipment such as a gravity meter.
发明内容Contents of the invention
本发明针对现有技术中存在的技术问题,提供一种基于TEC和加热膜的复合温控系统,解决了以往技术方案温度采集不准确,温度响应慢,控制不精准等问题,且具有长时间的温度精度稳定性。Aiming at the technical problems existing in the prior art, the present invention provides a composite temperature control system based on TEC and heating film, which solves the problems of inaccurate temperature collection, slow temperature response, and inaccurate control in previous technical solutions, and has long-term temperature accuracy stability.
根据本发明的第一方面,提供了一种基于TEC和加热膜的复合温控系统,包括:温度信息采集与处理模块和温度控制处理模块;According to the first aspect of the present invention, a composite temperature control system based on TEC and heating film is provided, including: a temperature information collection and processing module and a temperature control processing module;
所述温度信息采集与处理模块包括:加热膜、TEC制冷制热器和铂电阻;The temperature information collection and processing module includes: heating film, TEC refrigeration heater and platinum resistance;
所述温度控制处理模块接收通过所述铂电阻采集的实时环境温度;The temperature control processing module receives the real-time ambient temperature collected by the platinum resistance thermometer;
所述实时环境温度与预设温度相差超过设定阈值时,所述温度控制处理模块控制所述加热膜运行使环境温度升高,所述实时环境温度与预设温度相差不超过所述设定阈值时,所述温度控制处理模块通过控制所述TEC制冷制热器运行使环境温度到达所述预设温度。When the difference between the real-time ambient temperature and the preset temperature exceeds a set threshold, the temperature control processing module controls the operation of the heating film to increase the ambient temperature, and the difference between the real-time ambient temperature and the preset temperature does not exceed the set threshold. When the threshold is reached, the temperature control processing module makes the ambient temperature reach the preset temperature by controlling the operation of the TEC refrigeration heater.
在上述技术方案的基础上,本发明还可以作出如下改进。On the basis of the above technical solution, the present invention can also make the following improvements.
可选的,所述温度控制处理模块包括:核心处理器、驱动电路和温度测量电路;Optionally, the temperature control processing module includes: a core processor, a drive circuit and a temperature measurement circuit;
所述核心处理器通过所述驱动电路控制所述加热膜和所述TEC制冷制热器的运行;The core processor controls the operation of the heating film and the TEC refrigeration heater through the drive circuit;
所述核心处理器通过所述温度测量电路与所述铂电阻连接,获取所述实时环境温度。The core processor is connected to the platinum resistor through the temperature measurement circuit to obtain the real-time ambient temperature.
可选的,所述核心处理器包括:DSP;Optionally, the core processor includes: DSP;
所述驱动电路包括:MOS管栅极驱动器和MOS电桥;The drive circuit includes: a MOS tube gate driver and a MOS bridge;
所述温度测量电路包括:模数转换器;The temperature measurement circuit includes: an analog-to-digital converter;
可选的,所述温度控制处理模块通过一定的占空比信号分别控制加热膜和所述TEC制冷制热器。Optionally, the temperature control processing module separately controls the heating film and the TEC refrigeration heater through a certain duty cycle signal.
可选的,所述温度控制处理模块控制所述加热膜的方法包括:所述实时环境温度与预设温度相差超过设定阈值时,控制所述加热膜以最大功率制热。Optionally, the method for the temperature control processing module to control the heating film includes: when the difference between the real-time ambient temperature and the preset temperature exceeds a set threshold, controlling the heating film to heat with maximum power.
可选的,所述温度控制处理模块控制所述TEC制冷制热器的方法包括:所述实时环境温度与预设温度相差不超过所述设定阈值时,根据所述实时环境温度与预设温度的偏差进行数字PID运算,输出控制信号,通过控制所述TEC制冷制热器的占空比使所述实时温度达到所述设定温度。Optionally, the method for controlling the TEC refrigeration heater by the temperature control processing module includes: when the difference between the real-time ambient temperature and the preset temperature does not exceed the set threshold, according to the real-time ambient temperature and the preset temperature A digital PID operation is performed on the temperature deviation, and a control signal is output, and the real-time temperature reaches the set temperature by controlling the duty cycle of the TEC refrigeration heater.
可选的,输出所述控制信号还包括:判定所述控制信号是否超过占空比限幅,若超过则限幅,并将限幅后的所述控制信号输出并更新。Optionally, outputting the control signal further includes: determining whether the control signal exceeds a duty ratio limit, and if so, limiting the limit, and outputting and updating the limited control signal.
可选的,所述复合温控系统还包括接口通讯模块和上位机;Optionally, the composite temperature control system also includes an interface communication module and a host computer;
所述温度控制处理模块通过所述接口通讯模块接收所述上位机发来的控制命令,且按照一定的顺序将温度、系统状态量、控制参数和占空比的数据通过所述接口通讯模块发送给所述上位机,完成数据交互。The temperature control processing module receives the control command sent by the upper computer through the interface communication module, and sends the data of temperature, system state quantity, control parameter and duty cycle through the interface communication module in a certain order to the host computer to complete data interaction.
可选的,所述复合温控系统采用气凝胶和磁屏蔽板构造热磁隔离腔体。Optionally, the composite temperature control system uses airgel and a magnetic shield to construct a thermal-magnetic isolation chamber.
本发明提供的一种基于TEC和加热膜的复合温控系统,采用加热膜和TEC全数字式精密温度控制系统,铂电阻为温度传感器,执行器是加热膜和TEC双向制冷器,铂电阻精密测温反馈进入温度控制系统调节输出控制量实现高精度温度闭环控制,其中,在温度偏差大时,通过加热膜以最大功率运行实现组件内部的快速升温,当温度偏差落入设定的较小区间时,通过模糊PID控制率驱动TEC制冷制实现组件内部温度的精细调节,最终使组件内部温度在最短时间内稳定在设定温度,实现在-25℃~+40℃宽温域环境条件下,加速度计组合温度波动小于0.1℃,温控起始最大瞬时功耗小于50W;主要解决重力仪等测量设备对温度的快速响应、高精度闭环控制问题。。The present invention provides a composite temperature control system based on TEC and heating film, using heating film and TEC all-digital precision temperature control system, platinum resistance as temperature sensor, actuator as heating film and TEC two-way cooler, platinum resistance precision The temperature measurement feedback enters the temperature control system to adjust the output control quantity to realize high-precision temperature closed-loop control. Among them, when the temperature deviation is large, the heating film is operated at the maximum power to achieve rapid temperature rise inside the component. When the temperature deviation falls into the set smaller During the interval, the fuzzy PID control rate drives the TEC refrigeration system to realize the fine adjustment of the internal temperature of the module, and finally makes the internal temperature of the module stable at the set temperature in the shortest time, and realizes the wide temperature range of -25°C to +40°C. , the temperature fluctuation of the accelerometer combination is less than 0.1°C, and the maximum instantaneous power consumption at the beginning of temperature control is less than 50W; it mainly solves the problems of rapid response to temperature and high-precision closed-loop control of gravimeter and other measuring equipment. .
附图说明Description of drawings
图1为本发明提供的一种基于TEC和加热膜的复合温控系统的实施例的结构框图。Fig. 1 is a structural block diagram of an embodiment of a composite temperature control system based on a TEC and a heating film provided by the present invention.
具体实施方式detailed description
以下结合附图对本发明的原理和特征进行描述,所举实例只用于解释本发明,并非用于限定本发明的范围。The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.
本发明提供的一种基于TEC和加热膜的复合温控系统,可以用于加速度计测量系统领域,具体是该系统的温度控制分系统,提升温控系统的温度响应度和精度。A composite temperature control system based on TEC and heating film provided by the present invention can be used in the field of accelerometer measurement systems, specifically the temperature control subsystem of the system, to improve the temperature response and accuracy of the temperature control system.
图1为本发明提供的一种基于TEC和加热膜的复合温控系统的实施例的结构框图,如图1所示,该复合温控系统包括:温度信息采集与处理模块和温度控制处理模块。Fig. 1 is a structural block diagram of an embodiment of a composite temperature control system based on TEC and heating film provided by the present invention. As shown in Fig. 1, the composite temperature control system includes: a temperature information collection and processing module and a temperature control processing module .
温度信息采集与处理模块包括:加热膜、TEC制冷制热器和铂电阻。The temperature information collection and processing module includes: heating film, TEC refrigeration heater and platinum resistance.
温度控制处理模块接收通过铂电阻采集的实时环境温度。The temperature control processing module receives the real-time ambient temperature collected by the platinum resistance thermometer.
实时环境温度与预设温度相差超过设定阈值时,温度控制处理模块控制加热膜运行使环境温度升高,实时环境温度与预设温度相差不超过设定阈值时,温度控制处理模块通过控制TEC制冷制热器运行使环境温度到达预设温度。When the difference between the real-time ambient temperature and the preset temperature exceeds the set threshold, the temperature control processing module controls the operation of the heating film to increase the ambient temperature. When the difference between the real-time ambient temperature and the preset temperature does not exceed the set threshold, the temperature control processing module controls the TEC The cooling and heater operation makes the ambient temperature reach the preset temperature.
针对温敏电阻作为温度采集和主回路控制通断的方案和单TEC控制方案缺点,本发明提供一种基于TEC和加热膜的复合温控系统,采用加热膜和TEC全数字式精密温度控制系统,铂电阻为温度传感器,执行器是加热膜和TEC双向制冷器,铂电阻精密测温反馈进入温度控制系统调节输出控制量实现高精度温度闭环控制,在温度偏差大时,通过加热膜以最大功率运行实现组件内部的快速升温,当温度偏差落入设定的较小区间时,通过驱动TEC制冷制热器实现组件内部温度的精细调节,最终,使组件内部温度在最短时间内稳定在设定温度,主要解决现有技术中温度采集不准确,温度响应慢,控制不精准等问题,且具有长时间的温度精度稳定性,实现重力仪等测量设备对温度的快速响应、高精度闭环控制问题。Aiming at the shortcomings of the thermosensitive resistor as a temperature acquisition and main loop control on-off scheme and the single TEC control scheme, the present invention provides a composite temperature control system based on TEC and heating film, using heating film and TEC full digital precision temperature control system , the platinum resistance is the temperature sensor, the actuator is the heating film and the TEC two-way cooler, the platinum resistance precision temperature measurement feedback enters the temperature control system to adjust the output control amount to achieve high-precision temperature closed-loop control, when the temperature deviation is large, the maximum The power operation realizes the rapid temperature rise inside the module. When the temperature deviation falls into the set small range, the fine adjustment of the internal temperature of the module is realized by driving the TEC refrigeration heater, and finally, the internal temperature of the module is stabilized at the set value in the shortest time. Fixed temperature, mainly solves the problems of inaccurate temperature collection, slow temperature response, and inaccurate control in the prior art, and has long-term temperature accuracy stability, and realizes rapid response to temperature and high-precision closed-loop control of gravimeter and other measuring equipment question.
实施例1Example 1
本发明提供的实施例1为本发明提供的一种基于TEC和加热膜的复合温控系统的实施例,结合图1可知,该复合温控系统的实施例包括:Embodiment 1 provided by the present invention is an embodiment of a composite temperature control system based on TEC and a heating film provided by the present invention. It can be seen from FIG. 1 that the embodiment of the composite temperature control system includes:
温度信息采集与处理模块和温度控制处理模块。A temperature information collection and processing module and a temperature control processing module.
温度信息采集与处理模块包括:加热膜、TEC制冷制热器和铂电阻。The temperature information collection and processing module includes: heating film, TEC refrigeration heater and platinum resistance.
具体实施中,该加热膜可以为聚酰亚胺薄膜。In a specific implementation, the heating film may be a polyimide film.
温度控制处理模块接收通过铂电阻采集的实时环境温度。The temperature control processing module receives the real-time ambient temperature collected by the platinum resistance thermometer.
实时环境温度与预设温度相差超过设定阈值时,温度控制处理模块控制加热膜运行使环境温度升高,实时环境温度与预设温度相差不超过设定阈值时,温度控制处理模块通过控制TEC制冷制热器运行使环境温度到达预设温度。When the difference between the real-time ambient temperature and the preset temperature exceeds the set threshold, the temperature control processing module controls the operation of the heating film to increase the ambient temperature. When the difference between the real-time ambient temperature and the preset temperature does not exceed the set threshold, the temperature control processing module controls the TEC The cooling and heater operation makes the ambient temperature reach the preset temperature.
在一种可能的实施例方式中,温度控制处理模块包括:核心处理器、驱动电路和温度测量电路。In a possible embodiment, the temperature control processing module includes: a core processor, a drive circuit and a temperature measurement circuit.
核心处理器通过驱动电路控制加热膜和TEC制冷制热器的运行;以DSP为核心处理器、MOS管为功率驱动。The core processor controls the operation of the heating film and the TEC refrigeration heater through the driving circuit; the DSP is used as the core processor and the MOS tube is used as the power drive.
核心处理器通过温度测量电路与铂电阻连接,获取实时环境温度。The core processor is connected with the platinum resistor through the temperature measurement circuit to obtain the real-time ambient temperature.
在一种可能的实施例方式中,核心处理器包括:DSP。In a possible embodiment manner, the core processor includes: DSP.
驱动电路包括:MOS管栅极驱动器和MOS电桥。The driving circuit includes: MOS transistor gate driver and MOS electric bridge.
温度测量电路包括:模数转换器。The temperature measurement circuit includes: an analog-to-digital converter.
具体实施中,该核心处理器的型号可以为DSP2812,该MOS管栅极驱动器的型号可以为MOS管栅极驱动器IR2136,模数转换器的型号可以为集成式24位模数转换器LTC2983。基于以上环节整个系统实现精确温度闭环控制。In a specific implementation, the model of the core processor may be DSP2812, the model of the MOS transistor gate driver may be MOS transistor gate driver IR2136, and the model of the analog-to-digital converter may be an integrated 24-bit analog-to-digital converter LTC2983. Based on the above links, the whole system realizes precise temperature closed-loop control.
在一种可能的实施例方式中,温度控制处理模块通过一定的占空比信号分别控制加热膜和TEC制冷制热器。In a possible embodiment, the temperature control processing module separately controls the heating film and the TEC refrigeration heater through a certain duty cycle signal.
在一种可能的实施例方式中,温度控制处理模块控制加热膜的方法包括:实时环境温度与预设温度相差超过设定阈值时,控制加热膜以最大功率制热。In a possible embodiment, the method for controlling the heating film by the temperature control processing module includes: when the difference between the real-time ambient temperature and the preset temperature exceeds a set threshold, controlling the heating film to heat with maximum power.
在一种可能的实施例方式中,温度控制处理模块控制TEC制冷制热器的方法包括:实时环境温度与预设温度相差不超过设定阈值时,根据实时环境温度与预设温度的偏差进行数字PID运算,输出控制信号,通过控制TEC制冷制热器的占空比使实时温度达到设定温度。In a possible embodiment, the method for controlling the TEC refrigeration heater by the temperature control processing module includes: when the difference between the real-time ambient temperature and the preset temperature does not exceed a set threshold, perform Digital PID operation, output control signal, make the real-time temperature reach the set temperature by controlling the duty cycle of the TEC refrigeration heater.
在一种可能的实施例方式中,输出控制信号还包括:判定控制信号是否超过占空比限幅,若超过则限幅,并将限幅后的控制信号输出并更新。In a possible embodiment, outputting the control signal further includes: determining whether the control signal exceeds a duty ratio limit, and if so, limiting the limit, and outputting and updating the limited control signal.
可以理解的是,温度控制处理模块完成系统状态初始化、温度通道设置、以及温度读取采集并转换功能。利用系统采集反馈的加表温度与系统设定的温度差值作为输入,根据温度偏差选择输出加热膜功率和TEC工作模式,经过一定的占空比信号分别控制加热膜和TEC执行器,闭环控制来满足系统快速响应设定温度和精度的要求。复合控制的流程和步骤如下:It can be understood that the temperature control processing module completes system state initialization, temperature channel setting, and temperature reading, acquisition and conversion functions. Use the temperature difference between the metering temperature collected and fed back by the system and the temperature set by the system as input, select the output heating film power and TEC working mode according to the temperature deviation, and control the heating film and TEC actuator respectively through a certain duty ratio signal, closed-loop control To meet the requirements of the system's rapid response to the set temperature and accuracy. The process and steps of compound control are as follows:
①根据加表温度以及外界温度以及过渡板温度来综合判定温控系统处于什么阶段,在不同的阶段执行不同的温度控制策略。当属于加热阶段系统便会通过加热膜最大功率制热;当超过系统设定温度以后系统便开启TEC制冷模式;当温度居于系统设定范围时,系统开启数字PID运算,输出控制信号,自动控制TEC占空比以一定的误差来达到系统设定温度值。①Comprehensively determine what stage the temperature control system is in based on the surface temperature, external temperature, and transition plate temperature, and implement different temperature control strategies at different stages. When it belongs to the heating stage, the system will heat with the maximum power of the heating film; when the temperature exceeds the system setting temperature, the system will start the TEC cooling mode; when the temperature is within the system setting range, the system will start the digital PID calculation, output the control signal, and automatically control The TEC duty cycle reaches the system set temperature value with a certain error.
②PID控制解算模块主要完成增量式PID运算,当积分饱和时完成积分退饱和过程,将控制量统一成占空比信息输出给功率模块。②The PID control calculation module mainly completes the incremental PID calculation, completes the integral desaturation process when the integral is saturated, and unifies the control amount into duty cycle information and outputs it to the power module.
③计算加表设置温度与采集温度偏差,将此偏差输入给PID运算器供其运算。③Calculate the deviation between the temperature set in the table and the collected temperature, and input this deviation to the PID calculator for its calculation.
④PID运算器按照设定的控制参数,将温度偏差转换成所需要的控制量。④ The PID calculator converts the temperature deviation into the required control amount according to the set control parameters.
⑤判定控制量是否超过占空比限幅,若超过则限幅,并将控制量结果输出并更新。⑤ Determine whether the control amount exceeds the duty cycle limit, if it exceeds the limit, and output and update the result of the control amount.
在一种可能的实施例方式中,复合温控系统还包括接口通讯模块和上位机。In a possible embodiment, the composite temperature control system further includes an interface communication module and a host computer.
温度控制处理模块通过接口通讯模块接收上位机发来的控制命令,且按照一定的顺序将温度、系统状态量、控制参数和占空比的等数据通过接口通讯模块发送给上位机,以此来完成数据交互。The temperature control processing module receives the control commands sent by the host computer through the interface communication module, and sends the data such as temperature, system state quantity, control parameters and duty cycle to the host computer through the interface communication module in a certain order, so as to achieve Complete data interaction.
在一种可能的实施例方式中,复合温控系统采用气凝胶和磁屏蔽板构造热磁隔离腔体。In a possible embodiment, the composite temperature control system uses airgel and a magnetic shielding plate to construct a thermal-magnetic isolation chamber.
本发明实施例采用气凝胶和磁屏蔽板构造热磁隔离腔体,在惯性组件上布置聚酰亚胺薄膜电加热器和TEC制冷制热器。The embodiment of the present invention uses airgel and a magnetic shielding plate to construct a thermal-magnetic isolation cavity, and arranges a polyimide film electric heater and a TEC refrigeration heater on the inertial assembly.
本发明实施例提供的一种基于TEC和加热膜的复合温控系统,采用加热膜和TEC全数字式精密温度控制系统,铂电阻为温度传感器,执行器是加热膜和TEC双向制冷器,铂电阻精密测温反馈进入温度控制系统调节输出控制量实现高精度温度闭环控制,其中,在温度偏差大时,通过加热膜以最大功率运行实现组件内部的快速升温,当温度偏差落入设定的较小区间时,通过模糊PID控制率驱动TEC制冷制实现组件内部温度的精细调节,最终使组件内部温度在最短时间内稳定在设定温度,实现在-25℃~+40℃宽温域环境条件下,加速度计组合温度波动小于0.1℃,温控起始最大瞬时功耗小于50W;主要解决重力仪等测量设备对温度的快速响应、高精度闭环控制问题。A composite temperature control system based on TEC and heating film provided by the embodiment of the present invention adopts heating film and TEC all-digital precision temperature control system. The precision temperature measurement feedback of resistance enters the temperature control system to adjust the output control quantity to realize high-precision temperature closed-loop control. Among them, when the temperature deviation is large, the heating film is operated at the maximum power to realize the rapid temperature rise inside the component. When the temperature deviation falls into the set When the interval is small, the fuzzy PID control rate drives the TEC refrigeration system to realize the fine adjustment of the internal temperature of the module, and finally stabilize the internal temperature of the module at the set temperature in the shortest time, and realize the wide temperature range environment of -25℃~+40℃ Under certain conditions, the temperature fluctuation of the accelerometer combination is less than 0.1°C, and the maximum instantaneous power consumption at the beginning of temperature control is less than 50W; it mainly solves the problems of rapid response to temperature and high-precision closed-loop control of gravimeter and other measuring equipment.
需要说明的是,在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详细描述的部分,可以参见其它实施例的相关描述。It should be noted that, in the foregoing embodiments, descriptions of each embodiment have their own emphases, and for parts that are not described in detail in a certain embodiment, reference may be made to relevant descriptions of other embodiments.
本领域内的技术人员应明白,本发明的实施例可提供为方法、系统、或计算机程序产品。因此,本发明可采用完全硬件实施例、完全软件实施例、或结合软件和硬件方面的实施例的形式。而且,本发明可采用在一个或多个其中包含有计算机可用程序代码的计算机可用存储介质(包括但不限于磁盘存储器、CD-ROM、光学存储器等)上实施的计算机程序产品的形式。Those skilled in the art should understand that the embodiments of the present invention may be provided as methods, systems, or computer program products. Accordingly, the present invention can take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) having computer-usable program code embodied therein.
本发明是参照根据本发明实施例的方法、设备(系统)、和计算机程序产品的流程图和/或方框图来描述。应理解可由计算机程序指令实现流程图和/或方框图中的每一流程和/或方框、以及流程图和/或方框图中的流程和/或方框的结合。可提供这些计算机程序指令到通用计算机、专用计算机、嵌入式计算机或者其他可编程数据处理设备的处理器以产生一个机器,使得通过计算机或其他可编程数据处理设备的处理器执行的指令产生用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的装置。The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It should be understood that each procedure and/or block in the flowchart and/or block diagram, and a combination of procedures and/or blocks in the flowchart and/or block diagram can be realized by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded computer, or other programmable data processing device to produce a machine such that the instructions executed by the processor of the computer or other programmable data processing device produce a machine for A device for realizing the functions specified in one or more procedures of a flowchart and/or one or more blocks of a block diagram.
这些计算机程序指令也可存储在能引导计算机或其他可编程数据处理设备以特定方式工作的计算机可读存储器中,使得存储在该计算机可读存储器中的指令产生包括指令装置的制造品,该指令装置实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能。These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing apparatus to operate in a specific manner, such that the instructions stored in the computer-readable memory produce an article of manufacture comprising instruction means, the instructions The device realizes the function specified in one or more procedures of the flowchart and/or one or more blocks of the block diagram.
这些计算机程序指令也可装载到计算机或其他可编程数据处理设备上,使得在计算机或其他可编程设备上执行一系列操作步骤以产生计算机实现的处理,从而在计算机或其他可编程设备上执行的指令提供用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的步骤。These computer program instructions can also be loaded onto a computer or other programmable data processing device, causing a series of operational steps to be performed on the computer or other programmable device to produce a computer-implemented process, thereby The instructions provide steps for implementing the functions specified in the flow diagram procedure or procedures and/or block diagram procedures or blocks.
尽管已描述了本发明的优选实施例,但本领域内的技术人员一旦得知了基本创造概念,则可对这些实施例作出另外的变更和修改。所以,所附权利要求意欲解释为包括优选实施例以及落入本发明范围的所有变更和修改。While preferred embodiments of the invention have been described, additional changes and modifications to these embodiments can be made by those skilled in the art once the basic inventive concept is understood. Therefore, it is intended that the appended claims be construed to cover the preferred embodiment as well as all changes and modifications which fall within the scope of the invention.
显然,本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样,倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内,则本发明也意图包括这些改动和变型在内。Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and equivalent technologies thereof, the present invention also intends to include these modifications and variations.
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