CN115562392A - Compound temperature control system based on TEC and heating film - Google Patents
Compound temperature control system based on TEC and heating film Download PDFInfo
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- CN115562392A CN115562392A CN202211244022.3A CN202211244022A CN115562392A CN 115562392 A CN115562392 A CN 115562392A CN 202211244022 A CN202211244022 A CN 202211244022A CN 115562392 A CN115562392 A CN 115562392A
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 74
- 150000001875 compounds Chemical class 0.000 title description 3
- 238000012545 processing Methods 0.000 claims abstract description 50
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000002131 composite material Substances 0.000 claims abstract description 29
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 19
- 238000005057 refrigeration Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 9
- 238000009529 body temperature measurement Methods 0.000 claims description 8
- 239000004964 aerogel Substances 0.000 claims description 4
- 238000002955 isolation Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 230000003993 interaction Effects 0.000 claims description 3
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- 230000004044 response Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 10
- 238000004590 computer program Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 230000002457 bidirectional effect Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011217 control strategy Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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Abstract
The invention relates to a composite temperature control system based on TEC and a heating film, which comprises: the temperature information acquisition and processing module and the temperature control processing module; the temperature information acquisition and processing module comprises: the device comprises a heating film, a TEC refrigerating and heating device and a platinum resistor; the temperature control processing module receives real-time environment temperature acquired through a platinum resistor; when the difference between the real-time environment temperature and the preset temperature exceeds a set threshold, the temperature control processing module controls the heating film to operate to enable the environment temperature to rise, and when the difference between the real-time environment temperature and the preset temperature does not exceed the set threshold, the temperature control processing module controls the TEC refrigeration heater to operate to enable the environment temperature to reach the preset temperature; the problems of inaccurate temperature acquisition, slow temperature response, inaccurate control and the like in the prior art are solved, and the temperature precision stability for a long time is realized.
Description
Technical Field
The invention relates to the field of precision measurement equipment of gravimeters, in particular to a composite temperature control system based on a TEC and a heating film.
Background
The measurement of the earth gravity field has important significance for the disciplines of geodetics, space science, geophysics, geodynamics, oceanographic science, resource exploration, modern military and the like, a specific force measurement system consisting of high-precision quartz flexible accelerometers is a core sensor for gravity measurement, the quartz flexible accelerometers are very sensitive to temperature, and in a gravimeter measurement system, the requirement on the temperature reaches 0.01 ℃.
In a general temperature control system, a heating film in a main loop is connected with a temperature sensitive resistor in series and is connected to a power supply, when the temperature is lower, the power supply with smaller resistance value of the temperature sensitive resistor heats the heating film through the resistor, when equipment or a device is heated to a certain temperature, the resistance value of the temperature sensitive resistor is increased, the main loop is disconnected, the heating film stops heating, and the purpose of heating the equipment or the device to a certain temperature range is achieved. Or the aim of temperature control is achieved by utilizing TEC (thermoelectric cooler) for heating or refrigerating, the general scheme adopted by the latter can realize closed-loop control on the temperature to achieve high control precision, but in the temperature requirement that the equipment of the gravimeter is quickly stabilized at a certain point and has high precision requirement, the scheme can not meet the design requirement, the temperature stabilization time is too long, the control precision is long in period fluctuation and the like, and the temperature requirement of precision measurement equipment such as the gravimeter and the like can not be met.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a composite temperature control system based on a TEC and a heating film, solves the problems of inaccurate temperature acquisition, slow temperature response, inaccurate control and the like in the prior technical scheme, and has long-time temperature precision stability.
According to a first aspect of the present invention, there is provided a composite temperature control system based on a TEC and a heating film, comprising: the temperature information acquisition and processing module and the temperature control processing module;
the temperature information acquisition and processing module comprises: the device comprises a heating film, a TEC refrigerating and heating device and a platinum resistor;
the temperature control processing module receives real-time environment temperature acquired through the platinum resistor;
when the difference between the real-time environment temperature and the preset temperature exceeds a set threshold value, the temperature control processing module controls the heating film to operate to enable the environment temperature to rise, and when the difference between the real-time environment temperature and the preset temperature does not exceed the set threshold value, the temperature control processing module controls the TEC refrigerating and heating device to operate to enable the environment temperature to reach the preset temperature.
On the basis of the technical scheme, the invention can be improved as follows.
Optionally, the temperature control processing module includes: the temperature measuring circuit comprises a core processor, a driving circuit and a temperature measuring circuit;
the core processor controls the operation of the heating film and the TEC refrigerating and heating device through the driving circuit;
and the core processor is connected with the platinum resistor through the temperature measuring circuit to obtain the real-time environment temperature.
Optionally, the core processor includes: a DSP;
the drive circuit includes: a MOS transistor grid driver and a MOS bridge;
the temperature measurement circuit includes: an analog-to-digital converter;
optionally, the temperature control processing module controls the heating film and the TEC refrigerating and heating device respectively through a certain duty ratio signal.
Optionally, the method for controlling the heating film by the temperature control processing module includes: and when the difference between the real-time environment temperature and the preset temperature exceeds a set threshold value, controlling the heating film to heat at the maximum power.
Optionally, the method for controlling the TEC refrigeration and heating device by the temperature control processing module includes: and when the difference between the real-time environment temperature and the preset temperature is not more than the set threshold value, carrying out digital PID operation according to the deviation between the real-time environment temperature and the preset temperature, outputting a control signal, and controlling the duty ratio of the TEC refrigerating and heating device to enable the real-time temperature to reach the set temperature.
Optionally, outputting the control signal further includes: and judging whether the control signal exceeds the duty ratio amplitude limit, if so, limiting, and outputting and updating the control signal after amplitude limit.
Optionally, the composite temperature control system further includes an interface communication module and an upper computer;
the temperature control processing module receives a control command sent by the upper computer through the interface communication module, and sends data of temperature, system state quantity, control parameters and duty ratio to the upper computer through the interface communication module according to a certain sequence to complete data interaction.
Optionally, the composite temperature control system adopts aerogel and a magnetic shielding plate to construct a thermomagnetic isolation cavity.
The invention provides a composite temperature control system based on a TEC (thermoelectric cooler) and a heating film, which adopts the heating film and a full-digital precise temperature control system of the TEC, a platinum resistor is a temperature sensor, an actuator is a bidirectional cooler of the heating film and the TEC, and precise temperature measurement feedback of the platinum resistor enters the temperature control system to adjust output control quantity so as to realize high-precision temperature closed-loop control, wherein when temperature deviation is large, the heating film is operated at the maximum power to realize rapid temperature rise in a component, when the temperature deviation falls into a set smaller interval, the TEC is driven by fuzzy PID (proportion integration differentiation) control rate to realize fine adjustment of the temperature in the component, so that the temperature in the component is stabilized at the set temperature in the shortest time, the combined temperature fluctuation of an accelerometer is less than 0.1 ℃ under the environment condition of-25 ℃ to 40 ℃ in a wide temperature range, and the initial maximum instantaneous power consumption of temperature control is less than 50W; the system mainly solves the problems of quick response and high-precision closed-loop control of measuring equipment such as a gravimeter to temperature. .
Drawings
Fig. 1 is a structural block diagram of an embodiment of a composite temperature control system based on a TEC and a heating film provided by the present invention.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth to illustrate, but are not to be construed to limit the scope of the invention.
The composite temperature control system based on the TEC and the heating film can be used in the field of accelerometer measurement systems, particularly a temperature control subsystem of the system, and improves the temperature responsiveness and precision of the temperature control system.
Fig. 1 is a structural block diagram of an embodiment of a composite temperature control system based on a TEC and a heating film, as shown in fig. 1, the composite temperature control system includes: the temperature information acquisition and processing module and the temperature control processing module.
The temperature information acquisition and processing module comprises: heating film, TEC refrigeration heater and platinum resistance.
The temperature control processing module receives the real-time ambient temperature collected through the platinum resistor.
When the difference between the real-time environment temperature and the preset temperature exceeds a set threshold value, the temperature control processing module controls the heating film to operate to enable the environment temperature to rise, and when the difference between the real-time environment temperature and the preset temperature does not exceed the set threshold value, the temperature control processing module controls the TEC refrigeration heater to operate to enable the environment temperature to reach the preset temperature.
The invention provides a composite temperature control system based on a TEC and a heating film, aiming at the defects of a scheme that a temperature-sensitive resistor is used for temperature acquisition and main loop control on-off and a single TEC control scheme, the composite temperature control system adopts the heating film and a full-digital precise temperature control system of the TEC, a platinum resistor is a temperature sensor, an actuator is a heating film and a TEC bidirectional refrigerator, precise temperature measurement feedback of the platinum resistor enters the temperature control system to adjust output control quantity to realize high-precision temperature closed-loop control, when temperature deviation is large, rapid temperature rise in a component is realized by the operation of the heating film at the maximum power, when the temperature deviation falls into a set smaller interval, fine adjustment of the internal temperature of the component is realized by driving a refrigeration TEC heater, and finally the internal temperature of the component is stabilized at the set temperature within the shortest time.
Example 1
Embodiment 1 provided in the present invention is an embodiment of a composite temperature control system based on a TEC and a heating film, and as can be seen from fig. 1, the embodiment of the composite temperature control system includes:
the temperature information acquisition and processing module and the temperature control processing module.
The temperature information acquisition and processing module comprises: heating film, TEC refrigeration heater and platinum resistance.
In a specific implementation, the heating film may be a polyimide film.
The temperature control processing module receives the real-time ambient temperature collected through the platinum resistor.
When the difference between the real-time environment temperature and the preset temperature exceeds a set threshold value, the temperature control processing module controls the heating film to operate to enable the environment temperature to rise, and when the difference between the real-time environment temperature and the preset temperature does not exceed the set threshold value, the temperature control processing module controls the TEC refrigeration heater to operate to enable the environment temperature to reach the preset temperature.
In one possible embodiment, the temperature control processing module includes: the temperature measurement device comprises a core processor, a driving circuit and a temperature measurement circuit.
The core processor controls the operation of the heating film and the TEC refrigerating and heating device through the driving circuit; the DSP is used as a core processor, and the MOS tube is used as power drive.
The core processor is connected with the platinum resistor through the temperature measuring circuit to obtain the real-time environment temperature.
In one possible implementation, the core processor includes: and (4) DSP.
The drive circuit includes: MOS tube gate driver and MOS bridge.
The temperature measurement circuit includes: an analog-to-digital converter.
In a specific implementation, the core processor may be in a model of DSP2812, the MOS gate driver may be in a model of MOS gate driver IR2136, and the analog-to-digital converter may be in a model of integrated 24-bit analog-to-digital converter LTC2983. Based on the links, the whole system realizes accurate temperature closed-loop control.
In a possible embodiment mode, the temperature control processing module respectively controls the heating film and the TEC refrigerating and heating device through a certain duty ratio signal.
In one possible embodiment, the method for controlling the heating film by the temperature control processing module comprises the following steps: and when the difference between the real-time environment temperature and the preset temperature exceeds a set threshold value, controlling the heating film to heat at the maximum power.
In a possible embodiment mode, the method for controlling the TEC cooling and heating device by the temperature control processing module comprises the following steps: and when the difference between the real-time environment temperature and the preset temperature is not more than a set threshold value, carrying out digital PID operation according to the deviation between the real-time environment temperature and the preset temperature, outputting a control signal, and controlling the duty ratio of the TEC refrigerating and heating device to enable the real-time temperature to reach the set temperature.
In one possible embodiment, the outputting the control signal further includes: and judging whether the control signal exceeds the duty ratio amplitude limit, if so, limiting, and outputting and updating the limited control signal.
It can be understood that the temperature control processing module performs the functions of system state initialization, temperature channel setting, and temperature reading acquisition and conversion. The difference value between the acquired and fed-back adding table temperature of the system and the temperature set by the system is used as input, the power of the heating film and the working mode of the TEC are selected and output according to the temperature deviation, the heating film and the TEC actuator are respectively controlled through a certain duty ratio signal, and the requirement of the system for quickly responding to the set temperature and precision is met through closed-loop control. The flow and the steps of the compound control are as follows:
(1) and comprehensively judging the stage of the temperature control system according to the temperature of the adding table, the external temperature and the temperature of the transition plate, and executing different temperature control strategies at different stages. When the system belongs to the heating stage, the system can be heated by the maximum power of the heating film; when the temperature exceeds the set temperature of the system, the system starts the TEC refrigeration mode; when the temperature is within the set range of the system, the system starts digital PID operation, outputs a control signal, and automatically controls the TEC duty ratio to reach the set temperature value of the system with a certain error.
(2) The PID control resolving module mainly completes incremental PID operation, completes the integral desaturation process when integral is saturated, and unifies the control quantity into duty ratio information to be output to the power module.
(3) And calculating the deviation between the set temperature and the collected temperature of the adder, and inputting the deviation to the PID arithmetic unit for operation.
(4) The PID operator converts the temperature deviation into a required control quantity according to a set control parameter.
(5) And judging whether the controlled variable exceeds the duty ratio amplitude limit, if so, limiting, and outputting and updating the controlled variable result.
In a possible embodiment, the composite temperature control system further includes an interface communication module and an upper computer.
The temperature control processing module receives a control command sent by the upper computer through the interface communication module, and sends data such as temperature, system state quantity, control parameters and duty ratio to the upper computer through the interface communication module according to a certain sequence, so that data interaction is completed.
In one possible embodiment, the composite temperature control system adopts aerogel and magnetic shielding plates to construct a thermomagnetic isolation cavity.
According to the embodiment of the invention, the thermal magnetic isolation cavity is constructed by adopting the aerogel and the magnetic shielding plate, and the polyimide film electric heater and the TEC refrigerating and heating device are arranged on the inertia assembly.
The embodiment of the invention provides a composite temperature control system based on a TEC and a heating film, which adopts the heating film and a full digital precise temperature control system of the TEC, a platinum resistor is a temperature sensor, an actuator is a heating film and a TEC bidirectional refrigerator, and the precise temperature measurement feedback of the platinum resistor enters the temperature control system to adjust output control quantity so as to realize high-precision temperature closed-loop control, wherein when the temperature deviation is large, the heating film is operated at the maximum power to realize the rapid temperature rise in the component, when the temperature deviation falls into a set smaller interval, the TEC is driven to refrigerate by fuzzy PID control rate so as to realize the fine adjustment of the temperature in the component, and finally the temperature in the component is stabilized at the set temperature in the shortest time, so that the combined temperature fluctuation of an accelerometer is less than 0.1 ℃ and the maximum instantaneous power consumption of the temperature control is less than 50W under the wide temperature range environment condition of-25 ℃ to +40 ℃; the system mainly solves the problems of quick response and high-precision closed-loop control of measuring equipment such as a gravimeter to temperature.
It should be noted that, in the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to relevant descriptions of other embodiments for parts that are not described in detail in a certain embodiment.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all changes and modifications that fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (9)
1. A composite temperature control system based on TEC and heating film, the composite temperature control system comprising: the temperature information acquisition and processing module and the temperature control processing module;
the temperature information acquisition and processing module comprises: the device comprises a heating film, a TEC refrigerating and heating device and a platinum resistor;
the temperature control processing module receives the real-time environment temperature acquired through the platinum resistor;
when the difference between the real-time environment temperature and the preset temperature exceeds a set threshold value, the temperature control processing module controls the heating film to operate to increase the environment temperature, and when the difference between the real-time environment temperature and the preset temperature does not exceed the set threshold value, the temperature control processing module controls the TEC refrigeration and heating device to operate to enable the environment temperature to reach the preset temperature.
2. The composite temperature control system of claim 1, wherein the temperature control processing module comprises: the temperature measuring circuit comprises a core processor, a driving circuit and a temperature measuring circuit;
the core processor controls the operation of the heating film and the TEC refrigerating and heating device through the driving circuit;
and the core processor is connected with the platinum resistor through the temperature measuring circuit to obtain the real-time environment temperature.
3. The composite temperature control system of claim 2,
the core processor includes: a DSP;
the drive circuit includes: a MOS transistor grid driver and a MOS bridge;
the temperature measurement circuit includes: an analog-to-digital converter.
4. The composite temperature control system of claim 1, wherein the temperature control processing module controls the heating film and the TEC cooling and heating device respectively according to a duty cycle signal.
5. The composite temperature control system of claim 4, wherein the method of the temperature control processing module controlling the heating film comprises: and when the difference between the real-time environment temperature and the preset temperature exceeds a set threshold value, controlling the heating film to heat at the maximum power.
6. The composite temperature control system of claim 4, wherein the method for the temperature control processing module to control the TEC cooling and heating device comprises: and when the difference between the real-time environment temperature and the preset temperature is not more than the set threshold value, carrying out digital PID operation according to the deviation between the real-time environment temperature and the preset temperature, outputting a control signal, and controlling the duty ratio of the TEC refrigerating and heating device to enable the real-time temperature to reach the set temperature.
7. The composite temperature control system of claim 6, wherein outputting the control signal further comprises: and judging whether the control signal exceeds the duty ratio amplitude limit, if so, limiting, and outputting and updating the control signal after amplitude limit.
8. The composite temperature control system of claim 1, further comprising an interface communication module and an upper computer;
the temperature control processing module receives a control command sent by the upper computer through the interface communication module, and sends data of temperature, system state quantity, control parameters and duty ratio to the upper computer through the interface communication module according to a certain sequence to finish data interaction.
9. The composite temperature control system of claim 1, wherein the composite temperature control system employs an aerogel and a magnetic shield to construct a thermomagnetic isolation chamber.
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| CN202211244022.3A CN115562392A (en) | 2022-10-09 | 2022-10-09 | Compound temperature control system based on TEC and heating film |
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| CN202211244022.3A CN115562392A (en) | 2022-10-09 | 2022-10-09 | Compound temperature control system based on TEC and heating film |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205450846U (en) * | 2016-03-14 | 2016-08-10 | 中国科学院测量与地球物理研究所 | Temperature -control circuit and corresponding marine gravimeter stabilized platform control system |
| US20180299581A1 (en) * | 2017-04-18 | 2018-10-18 | International Business Machines Corporation | Parallel Dipole Line Trap Gravimeter |
| CN109460089A (en) * | 2019-01-23 | 2019-03-12 | 青岛大学 | Based on it is passive can variable resistance temprature control method |
| CN109582064A (en) * | 2019-01-23 | 2019-04-05 | 青岛大学 | Passive variable resistance temperature controls dibit adjusting method |
| US20200284940A1 (en) * | 2017-06-19 | 2020-09-10 | Huazhong University Of Science And Technology | Mems gravimeter |
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2022
- 2022-10-09 CN CN202211244022.3A patent/CN115562392A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205450846U (en) * | 2016-03-14 | 2016-08-10 | 中国科学院测量与地球物理研究所 | Temperature -control circuit and corresponding marine gravimeter stabilized platform control system |
| US20180299581A1 (en) * | 2017-04-18 | 2018-10-18 | International Business Machines Corporation | Parallel Dipole Line Trap Gravimeter |
| US20200284940A1 (en) * | 2017-06-19 | 2020-09-10 | Huazhong University Of Science And Technology | Mems gravimeter |
| CN109460089A (en) * | 2019-01-23 | 2019-03-12 | 青岛大学 | Based on it is passive can variable resistance temprature control method |
| CN109582064A (en) * | 2019-01-23 | 2019-04-05 | 青岛大学 | Passive variable resistance temperature controls dibit adjusting method |
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Inventor after: Ye Chao Inventor after: Huang Guopeng Inventor after: Wu Mingqiang Inventor after: Cao Wen Inventor after: Wang Hui Inventor after: Zeng Shuru Inventor before: Ye Chao Inventor before: Huang Guopeng Inventor before: Cao Wen Inventor before: Wang Hui Inventor before: Zeng Shuru |