CN115561256A - Semiconductor chip qualification inspection device and method - Google Patents
Semiconductor chip qualification inspection device and method Download PDFInfo
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- CN115561256A CN115561256A CN202210851845.6A CN202210851845A CN115561256A CN 115561256 A CN115561256 A CN 115561256A CN 202210851845 A CN202210851845 A CN 202210851845A CN 115561256 A CN115561256 A CN 115561256A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
Abstract
The invention belongs to the technical field of semiconductor chips, and particularly discloses a semiconductor chip qualification inspection device which comprises a detection bin and a material receiving box, wherein a photographing device is fixedly arranged at the top of the inner side of the detection bin, a feeding mechanism is arranged at the bottom of the inner side of the detection bin, close to the rear side of the feeding mechanism, and comprises a sliding groove fixedly arranged at the bottom of the inner side of the detection bin, and a sliding block is arranged at the inner side of the sliding groove in a sliding manner. The invention can automatically carry out feeding inspection on the semiconductor chips through the matching of the feeding mechanism and the feeding mechanism, and can automatically collect the inspected semiconductor chips, thereby improving the working efficiency of workers for inspecting the semiconductor chips, and the whole device has simpler operation.
Description
Technical Field
The invention belongs to the technical field of semiconductor chips, and particularly discloses a semiconductor chip qualification inspection device and a semiconductor chip qualification inspection method.
Background
In the field of semiconductor chip manufacturing, since a semiconductor chip is defective due to problems such as a manufacturing process during the manufacturing of the semiconductor chip, it is necessary to check the qualification of the semiconductor chip after the semiconductor chip is manufactured, and the inspection method is generally performed by using a semiconductor chip picture comparison method. For example, a set of standard reference pictures is determined according to semiconductor chip qualification criteria, such as taking a picture of a die of a semiconductor chip. Then, a semiconductor chip picture of the manufactured semiconductor chip is acquired under the same picture acquisition condition (e.g., light source condition) as the set of standard reference pictures, and then the semiconductor chip qualification inspection is performed by comparing the obtained semiconductor chip picture with the acquisition condition;
in the past, the semiconductor chip qualification inspection device needs to manually complete feeding and discharging when inspecting the qualification of the semiconductor chip, and needs to manually complete the work of collecting the semiconductor chip, so that the efficiency is low, the cost is increased, and the problem of how to perfect the feeding and discharging device of the inspection device is to be improved.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a semiconductor chip qualification inspection device and a semiconductor chip qualification inspection method.
In order to achieve the above purpose, the invention provides a semiconductor chip qualification inspection device, which comprises a detection bin and a material receiving box, wherein a photographing device is fixedly arranged at the top of the inner side of the detection bin, a feeding mechanism is arranged at the bottom of the inner side of the detection bin close to the rear side of the feeding mechanism, the feeding mechanism comprises a chute fixedly arranged at the bottom of the inner side of the detection bin, a sliding block is arranged at the inner side of the chute in a sliding manner, a control frame is fixedly arranged at the upper end of the sliding block, a control groove is formed at the bottom of the inner side of the control frame, a connecting frame is fixedly arranged at one end of the sliding block, a threaded shaft is arranged on the inner side of the connecting frame in a threaded manner, a material pushing plate is arranged at the inner side of the control frame in a sliding manner, a spring is fixedly arranged at the bottom of the inner side of the control groove, a control rod is movably arranged at the inner side of the spring, a material pushing groove is formed at the upper end of the control frame, and a driving wheel is movably arranged at the inner side of the material pushing groove.
In the technical scheme, it is preferred, the fixed support frame that is provided with in one side that the upper end of control frame is close to the silo that pushes away, the inboard activity of support frame is provided with the axis of rotation, the control lever runs through the inside of control frame, sliding connection between control lever and the control frame, the fixed limiting plate that is provided with of lower extreme of control lever, the inboard bottom that detects the storehouse is close to the fixed big motor that is provided with in one side of spout, the fixed little motor that is provided with in one side that the upper end of control frame is close to the support frame, the fixed mount that is provided with in front side that is close to big motor in the inboard bottom that detects the storehouse.
In the above technical solution, preferably, the inner side of the fixing frame is movably connected with the outer side of the threaded shaft, the rear end of the threaded shaft is installed at the front end of the large motor, and the upper end of the spring is fixedly connected with the lower end of the material pushing plate.
In the above technical solution, preferably, the upper end of the control rod is fixedly connected with the inner side of the lower end of the material pushing plate close to the spring, one end of the rotating shaft is installed at one end of the small motor, and one side of the outer side of the rotating shaft close to the support frame is fixedly connected with the inner side of the driving wheel.
In above-mentioned technical scheme, it is preferred, feeding mechanism is including fixed setting being close to the base of spout rear side in the inboard bottom in detection storehouse, the inboard activity of base is provided with the threaded rod, the fixed slide bar that is provided with in upper end of base, the fixed master gear that is provided with of upside that is close to the base in the outside of threaded rod, the upside screw thread that is close to the master gear in the outside of threaded rod is provided with the alignment jig, the outside slip of slide bar is provided with the balladeur train, the inside activity of balladeur train is provided with the loose axle, the fixed interlock frame that is provided with in the outside of loose axle, the fixed pay-off draw-in groove that is provided with in upper end of interlock frame.
In the above technical solution, preferably, a limiting rod is movably disposed at one side of the lower end of the feeding clamping groove close to the linkage frame, a connecting plate is fixedly disposed at the lower end of the carriage, a regulating motor is fixedly disposed at the front side of the upper end of the connecting plate close to the carriage, a limiting frame is fixedly disposed at the upper end of the sliding rod, a pinion is engaged with the upper end of the main gear, and a transmission shaft is fixedly disposed at the inner side of the pinion.
In the above technical scheme, preferably, the rear side that the inboard bottom in storehouse is close to the base is fixed and is provided with the interlock motor, the front end department at the interlock motor is installed to the rear end of transmission shaft, the one end of alignment jig and the one end fixed connection of balladeur train.
In above-mentioned technical scheme, preferably, the rear end department at the regulation and control motor is installed to the front end of loose axle, the front end of gag lever post and the rear end fixed connection of control frame, the inboard of gag lever post and the outside of threaded rod are close to the upside swing joint of alignment jig.
In the above technical scheme, preferably, a storage box is fixedly arranged at the lower end of the detection bin, support legs are fixedly arranged at the lower end of the storage box, a movable door is movably arranged on the inner side of the storage box through a rotating shaft, a door handle is fixedly arranged at the front end of the movable door, and the lower end of the material receiving box is fixedly connected with one side, close to the base, of the bottom of the inner side of the detection bin.
There is also provided a semiconductor chip qualification inspection method for operating a semiconductor chip qualification inspection apparatus, comprising the steps of:
s1: the pushing plate is pulled to slide downwards in the inner side of the control frame, meanwhile, the pushing plate drives the control rod to slide downwards, the pushing plate is enabled to compress the spring downwards, then, the semiconductor chips are sequentially stacked on the upper end of the pushing plate, then, under the elastic action of the spring, the pushing plate is enabled to push the semiconductor chips to move upwards, meanwhile, the upper ends of the semiconductor chips are in contact with the lower end of the driving wheel, then, the small motor is started, so that the driving wheel sequentially pushes the semiconductor chips to move, and multiple groups of semiconductor chips can be sequentially and automatically fed;
s2: the adjusting frame moves upwards by rotating the threaded rod, the sliding frame slides upwards along the sliding rod, meanwhile, the feeding clamping groove moves upwards along with the sliding frame, and the feeding clamping groove drives the semiconductor chip to move upwards, so that the photographing device photographs and inspects the semiconductor chip;
s3: through starting the regulation and control motor, the movable shaft drives the linkage frame to rotate, and the linkage frame drives the feeding clamping groove to rotate, so that the semiconductor chip in the inner side of the feeding clamping groove slides to the inner side of the material receiving box.
Compared with the prior art, the invention has the following beneficial effects:
1. when the automatic feeding device is used, the pushing plate is pulled to slide downwards in the inner side of the control frame, meanwhile, the pushing plate drives the control rod to slide downwards, the pushing plate is enabled to compress the spring downwards, then the semiconductor chips are sequentially stacked on the upper end of the pushing plate, then the pushing plate is enabled to push the semiconductor chips to move upwards under the elastic action of the spring, meanwhile, the upper end of each semiconductor chip is contacted with the lower end of the driving wheel, then the small motor is started, and therefore the driving wheels are enabled to sequentially push the semiconductor chips to move, the purpose of automatically feeding multiple groups of semiconductor chips can be achieved, and the feeding operation time of workers is shortened.
2. Secondly make the alignment jig rebound and the balladeur train along the slide bar rebound simultaneously the pay-off draw-in groove along the balladeur train rebound and the pay-off draw-in groove drives semiconductor chip rebound thereby make the ware of shooing to shoot the inspection to semiconductor chip through rotating the threaded rod, can reach the purpose of being convenient for carry out automatic feeding inspection.
3. Finally, the regulating motor is started, so that the movable shaft drives the linkage frame to rotate, the linkage frame drives the feeding clamping groove to rotate, the semiconductor chip in the inner side of the feeding clamping groove slides to the inner side of the collecting box, the purpose of automatically recycling the semiconductor chip conveniently can be achieved, and the operation time of workers is reduced.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a semiconductor chip qualification inspection apparatus according to the present invention;
FIG. 2 is a schematic diagram of an internal structure of a semiconductor chip qualification inspection apparatus according to the present invention;
FIG. 3 is a schematic diagram of a loading mechanism of a semiconductor chip qualification inspection apparatus according to the present invention;
FIG. 4 is a schematic view of a partially cut-away structure of a feeding mechanism of a semiconductor chip qualification inspection apparatus according to the present invention;
fig. 5 is a schematic view of a partially cut structure of a feeding mechanism of a semiconductor chip qualification inspection apparatus according to the present invention;
FIG. 6 is a schematic view of a feeding mechanism of a semiconductor chip qualification inspection apparatus according to the present invention;
FIG. 7 is a schematic view of a partially cut-away structure of a feeding mechanism of a semiconductor chip qualification inspection apparatus according to the present invention;
fig. 8 is a schematic view of a partially cut structure of a feeding mechanism of a semiconductor chip qualification inspection apparatus according to the present invention.
In the figure: 1. a detection bin; 2. a storage box; 3. supporting legs; 4. a movable door; 5. a door handle; 6. a camera; 7. a feeding mechanism; 71. a chute; 72. a slider; 73. a control frame; 74. a control slot; 75. a connecting frame; 76. a threaded shaft; 77. a material pushing plate; 78. a spring; 79. a control lever; 710. a material pushing groove; 711. a driving wheel; 712. a support frame; 713. a rotating shaft; 714. a limiting plate; 715. a large motor; 716. a small motor; 717. a fixed mount; 8. a feeding mechanism; 81. a base; 82. a threaded rod; 83. a slide bar; 84. an adjusting bracket; 85. a carriage; 86. a movable shaft; 87. a linkage frame; 88. a feeding clamping groove; 89. a limiting rod; 810. a connecting plate; 811. regulating and controlling a motor; 812. a limiting frame; 813. a main gear; 814. a pinion gear; 815. a drive shaft; 816. a linkage motor; 9. and a material receiving box.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and thus the present invention is not limited to the specific embodiments disclosed below.
As shown in fig. 1-8, the semiconductor chip qualification inspection apparatus includes a detection chamber 1, a material receiving box 9, a camera 6 is fixedly disposed at the top of the inner side of the detection chamber 1, a feeding mechanism 7 is disposed at the bottom of the inner side of the detection chamber 1, a feeding mechanism 8 is disposed at the bottom of the inner side of the detection chamber 1 near the rear side of the feeding mechanism 7, the feeding mechanism 7 includes a chute 71 fixedly disposed at the bottom of the inner side of the detection chamber 1, a slider 72 is slidably disposed at the inner side of the chute 71, a control frame 73 is fixedly disposed at the upper end of the slider 72, a control slot 74 is disposed at the bottom of the inner side of the control frame 73, a connecting frame 75 is fixedly disposed at one end of the slider 72, a threaded shaft 76 is disposed at the inner side of the connecting frame 75, a material pushing plate 77 is slidably disposed at the inner side of the control frame 73, a spring 78 is fixedly disposed at the bottom of the inner side of the control slot 74, a control rod 79 is movably disposed at the inner side of the spring 78, a material pushing groove 710 is movably disposed at the upper end of the control frame 73, and a driving wheel 711 is movably disposed at the inner side of the material pushing groove 710.
A supporting frame 712 is fixedly arranged on one side of the upper end of the control frame 73 close to the material pushing groove 710, a rotating shaft 713 is movably arranged on the inner side of the supporting frame 712, the control rod 79 penetrates through the control frame 73, the control rod 79 is in sliding connection with the control frame 73, a limiting plate 714 is fixedly arranged at the lower end of the control rod 79, a large motor 715 is fixedly arranged on one side of the inner bottom of the detection bin 1 close to the sliding groove 71, a small motor 716 is fixedly arranged on one side of the upper end of the control frame 73 close to the supporting frame 712, a fixing frame 717 is fixedly arranged on the front side of the inner bottom of the detection bin 1 close to the large motor 715, the inner side of the fixing frame 717 is movably connected with the outer side of the threaded shaft 76, the rear end of the threaded shaft 76 is arranged at the front end of the large motor 715, the upper end of the spring 78 is fixedly connected with the lower end of the material pushing plate 77, the upper end of the control rod 79 is fixedly connected with the inner side of the lower end of the material pushing plate 77 close to the spring 78, one end of the rotating shaft 713 is arranged at one end of the small motor 716, and one side of the outer side of the supporting frame 713 close to the inner side of the driving wheel 711 is fixedly connected with the inner side of the driving wheel 711.
In use, a worker first starts the large motor 715, so that the large motor 715 drives the threaded shaft 76 to rotate, and the link frame 75 is made to follow one end of the threaded shaft 76, so that the link frame 75 drives the slider 72 to slide in the inner side of the chute 71, and the slider 72 drives the control frame 73 to move, at this time, the worker pulls the material pushing plate 77 to slide downward in the inner side of the control frame 73, so that the material pushing plate 77 drives the control rod 79 to move downward, and the material pushing plate 77 compresses the spring 78 downward, then semiconductor chips to be inspected are sequentially stacked at the upper end of the material pushing plate 77, and then releases the material pushing plate 77, so that the spring 78 rebounds upward under the elastic action, and the material pushing plate 78 pushes the material pushing plate 77 to move upward, and at the same time, the material pushing plate 77 drives the control rod 79 to move upward, and at the same time, the upper end of the semiconductor chips contact the lower end of the driving wheel 711, and then starts the reverse rotation of the large motor 715, thereby moving the control frame 73 to the home position, then starting the small motor 716, so that the small motor 716 drives the driving wheel 711 to rotate through the rotating shaft 713, so that the driving wheel 711 pushes the semiconductor chips to move, so that the semiconductor chips are moved to the inner side of the designated card slot by the driving wheel 711, then closing the small motor 716, and simultaneously under the elastic action of the spring 78, so that the pushing plate 77 pushes the next group of semiconductor chips to move, so that the upper ends of the next group of semiconductor chips contact the lower end of the driving wheel 711, and by pulling the pushing plate 77 to slide downward in the inner side of the control frame 73 while the pushing plate 77 drives the control rod 79 to slide downward and so that the pushing plate 77 compresses the spring 78 downward and then sequentially stacks the semiconductor chips on the upper end of the pushing plate 77 and then causes the pushing plate 77 to push the semiconductor chips to move upward while the upper ends of the semiconductor chips contact the driving wheel 711 under the elastic action of the spring 78 Then the small motor 716 is started again, so that the driving wheel 711 sequentially pushes the semiconductor chips to move, the purpose of automatically feeding a plurality of groups of semiconductor chips can be achieved, and the operation time of feeding workers is reduced.
The feeding mechanism 8 comprises a base 81 fixedly arranged at the bottom of the inner side of the detection bin 1 close to the rear side of the sliding chute 71, a threaded rod 82 is movably arranged at the inner side of the base 81, a sliding rod 83 is fixedly arranged at the upper end of the base 81, a main gear 813 is fixedly arranged at the outer side of the threaded rod 82 close to the upper side of the base 81, an adjusting frame 84 is arranged at the outer side of the threaded rod 82 close to the upper side of the main gear 813 in a threaded manner, a carriage 85 is slidably arranged at the outer side of the sliding rod 83, a movable shaft 86 is movably arranged inside the carriage 85, a linkage frame 87 is fixedly arranged at the outer side of the movable shaft 86, a feeding clamping groove 88 is fixedly arranged at the upper end of the linkage frame 87, a limiting rod 89 is movably arranged at one side of the lower end of the feeding clamping groove 88 close to the linkage frame 87, a connecting plate 810 is fixedly arranged at the lower end of the carriage 85, a regulating motor 811 is fixedly arranged at the front side of the upper end of the connecting plate 810 close to the carriage 85, a limiting frame 812 is fixedly arranged at the upper end of the sliding rod, a sub-gear 814 is meshed with the upper end of the main gear 813, a transmission shaft 815 is fixedly arranged at the inner side of the movable shaft 811 close to the rear side of the sliding frame, a regulating motor 816, a front end of the movable shaft 73 of the movable frame 84 is fixedly arranged at the front end of the movable frame 73, a front end of the movable frame 84, a regulating frame 73, a regulating frame 84, a front end of the movable frame 73 of the movable frame 84, a regulating frame 73, a regulating frame 84 is fixedly arranged at the front end of the movable frame 73, and a front end of the movable frame 84, and a front end of the movable frame 73, which is connected with the movable frame 85, the movable frame 84, the movable frame 73, which is connected with the movable frame 85, the movable frame 84, the movable frame 73, the movable frame 85, the movable frame 84, the movable frame 85, the movable frame 73.
Then, the interlocking motor 816 is started, so that the interlocking motor 816 drives the secondary gear 814 to rotate through the transmission shaft 815, the secondary gear 814 drives the threaded rod 82 to rotate through the primary gear 813, because the threaded rod 82 is in threaded connection with the adjusting frame 84, the adjusting frame 84 moves upwards along the threaded rod 82, the adjusting frame 84 drives the carriage 85 to slide upwards along the sliding rod 83, so that the carriage 85 drives the connecting plate 810 to move upwards, the feeder-card slot 88 drives the semiconductor chip to move to the lower end of the camera 6, then the camera 6 is started, so that the camera 6 takes a picture of the semiconductor chip, and the picture taken by the camera 6 is compared with a standard reference picture, so as to complete the work of checking the bare chip of the semiconductor chip, and then the interlocking motor 816 is started to rotate reversely, thereby make the feeding card slot 88 drive semiconductor chip and move down, start regulation and control motor 811 simultaneously, and make regulation and control motor 811 drive interlock frame 87 through loose axle 86 and rotate, thereby make interlock frame 87 drive feeding card slot 88 rotatory, and the semiconductor chip changes the inboard of roll-off feeding card slot 88 along with the angle of feeding card slot 88, thereby drop in the inboard of collecting box 9, and can concentrate the collection to the semiconductor chip that the inspection is accomplished, the reversal of restarting regulation and control motor 811 simultaneously, and make feeding card slot 88 rotate to the normal position, at this moment feeding card slot 88 falls in the upper end department of gag lever post 89 after the downward movement, make the alignment jig 84 upwards move and carriage 85 upwards slides along slide bar 83 while feeding card slot 88 drives semiconductor chip and upwards moves along carriage 85 and feeding card slot 88 drives semiconductor chip thereby make the ware 6 of shooing carry out the semiconductor chip to the camera through rotating threaded rod 82 The inspection of shooing can reach the purpose of being convenient for carry out the automatic feeding inspection, thereby make loose axle 86 drive interlock frame 87 rotatory and make interlock frame 87 drive the feed slot 88 rotatory thereby make the semiconductor chip landing in the feed slot 88 inboard to receive the inboard of workbin 9 through starting regulation and control motor 811, can reach the purpose of being convenient for carry out automatic recovery semiconductor chip to reduce workman operating time.
The fixed storage tank 2 that is provided with of lower extreme that detects storehouse 1, the fixed supporting leg 3 that is provided with of lower extreme of storage tank 2, the inboard of storage tank 2 is provided with dodge gate 4 through the pivot activity, and the front end of dodge gate 4 is fixed and is provided with door handle 5, receives one side fixed connection that the lower extreme of material box 9 and the inboard bottom that detects storehouse 1 are close to base 81.
Through the effect of storage tank 2, can reach the purpose of being convenient for deposit article, secondly through the effect of supporting leg 3, can reach the purpose of being convenient for support storage tank 2.
There is also provided a semiconductor chip qualification inspection method for operating a semiconductor chip qualification inspection apparatus, comprising the steps of:
s1: multiple groups of semiconductor chips can be automatically loaded in sequence by pulling the material pushing plate 77 to slide downwards in the inner side of the control frame 73, simultaneously driving the control rod 79 to slide downwards by the material pushing plate 77, enabling the material pushing plate 77 to compress the spring 78 downwards, then sequentially stacking the semiconductor chips on the upper end of the material pushing plate 77, then enabling the material pushing plate 77 to push the semiconductor chips to move upwards under the elastic action of the spring 78, simultaneously enabling the upper end of the semiconductor chips to contact with the lower end of the driving wheel 711, and then starting the small motor 716, so that the driving wheel 711 sequentially pushes the semiconductor chips to move;
s2: by rotating the threaded rod 82, the adjusting frame 84 moves upwards, the sliding frame 85 slides upwards along the sliding rod 83, meanwhile, the feeding clamping groove 88 moves upwards along with the sliding frame 85, and the feeding clamping groove 88 drives the semiconductor chip to move upwards, so that the camera 6 performs shooting inspection on the semiconductor chip;
s3: by starting the regulating motor 811, the movable shaft 86 drives the linking frame 87 to rotate, and the linking frame 87 drives the feeding slot 88 to rotate, so that the semiconductor chip in the inner side of the feeding slot 88 slides down to the inner side of the feeding box 9.
The working principle is as follows: in use, a worker first activates a large motor (model: Y2-90L-2) 715, so that the large motor 715 rotates the screw 76, and causes the link frame 75 to follow one end of the screw 76, so that the link frame 75 drives the slider 72 to slide in the inner side of the sliding slot 71, and the slider 72 drives the control frame 73 to move, at which time the worker pulls the pusher plate 77 to slide downward in the inner side of the control frame 73, so that the pusher plate 77 drives the control rod 79 to move downward, while the pusher plate 77 compresses the spring 78 downward, then sequentially stacks the semiconductor chips to be inspected at the upper end of the pusher plate 77, and then releases the pusher plate 77, so that the spring 78 rebounds upward under the elastic action, and the spring 78 pushes the pusher plate 77 to move upward, while the pusher plate 77 drives the control rod 79 to move upward, while the upper ends of the semiconductor chips contact the lower end of the driving wheel 711, then activates the large motor 715 to reverse, so that the control frame 73 moves to the original position, and activates a small motor (model: Y2-90L-2) 716, so that the driving shaft 716 drives the small motor 816 to move to rotate the lower end of the driving wheel 711, so that the driving wheel 816 drives the lower end of the driving wheel 711 of the semiconductor chips to move, so that the driving wheel 816 moves to drive the lower end of the driving wheel 77 to move, so that the driving wheel 816 to drive the lower end of the driving wheel 711 of the semiconductor chips to move, so that the driving wheel 711 of the driving wheel 78 to move, so that the driving wheel 711 moves to drive the driving wheel 711, so that the driving wheel 711 of the driving wheel 711 moves to drive the semiconductor chips to drive the driving wheel 711, meanwhile, the pinion 814 drives the threaded rod 82 to rotate through the main gear 813, and due to the fact that the threaded rod 82 is in threaded connection with the adjusting frame 84, the adjusting frame 84 moves upwards along the threaded rod 82, meanwhile, the adjusting frame 84 drives the sliding frame 85 to slide upwards along the sliding rod 83, so that the sliding frame 85 drives the connecting plate 810 to move upwards, the feeding clamping groove 88 drives the semiconductor chip to move to the lower end of the photographing device 6, and then the photographing device is started (the model is: EP16 WTLMIR) 6, so that the camera 6 takes a picture of the semiconductor chip, and the picture taken by the camera 6 is compared with a standard reference picture, so that the work of inspecting the bare chip of the semiconductor chip is completed, then the reverse rotation of the link motor 816 is started, so that the feed slot 88 drives the semiconductor chip to move downward, and at the same time, the regulating motor (model: Y2-90L-2) 811 is started, and the regulating motor 811 drives the link frame 87 to rotate through the movable shaft 86, so that the link frame 87 drives the feed slot 88 to rotate, and the semiconductor chip slides out of the inner side of the feed slot 88 along with the change of the angle of the feed slot 88, so as to fall into the inner side of the collection box 9, and the inspected semiconductor chip can be collected in a concentrated manner, and at the same time, the reverse rotation of the regulating motor 811 is started, and the feed slot 88 is rotated to the original position, and at this time, the feed slot 88 falls on the upper end of the limit rod 89 after moving downward, while the next group of semiconductor chips can be inspected, and the push plate 77 is driven to slide downward while the push rod 77 and the control rod 79 is compressed in turn to compress the stack 78 by pulling the push plate 77 in turn the push plate 77 The upper end of the plate 77 makes the material pushing plate 77 push the semiconductor chips to move upwards under the elastic action of the spring 78, and the upper end of the semiconductor chips contacts the lower end of the driving wheel 711, and then the small motor 716 is started, so that the driving wheel 711 sequentially pushes the semiconductor chips to move, the purpose of automatically feeding a plurality of groups of semiconductor chips can be achieved, thereby reducing the feeding operation time of workers, secondly, the adjusting frame 84 is enabled to move upwards by rotating the threaded rod 82, the sliding frame 85 slides upwards along the sliding rod 83, the feeding clamping groove 88 moves upwards along with the sliding frame 85, and the feeding clamping groove 88 drives the semiconductor chips to move upwards, so that the camera 6 performs shooting inspection on the semiconductor chips, the purpose of facilitating automatic feeding inspection can be achieved, finally, the adjusting motor 811 is started, so that the movable shaft 86 drives the linkage frame 87 to rotate, and the linkage frame 87 drives the feeding clamping groove 88 to rotate, thereby enabling the semiconductor chips in the feeding clamping groove 88 to slide into the inner side of the material collecting box 9, the purpose of facilitating automatic recovery of the semiconductor chips can be achieved, thereby reducing the operation time of the workers.
In the present invention, the terms "mounting," "connecting," "fixing," and the like are used in a broad sense, for example, "connecting" may be a fixed connection, a detachable connection, or an integral connection; may be connected with each other or indirectly connected with each other through an intermediate medium. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
In the description herein, the appearances of the phrases "one embodiment," "some embodiments," "a specific embodiment," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment or example, but rather to the same embodiment or example. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, principal features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The utility model provides a semiconductor chip qualification inspection device, is including detecting storehouse (1), receipts workbin (9), its characterized in that, the fixed ware (6) of shooing that is provided with in inboard top of detecting storehouse (1), the inboard bottom of detecting storehouse (1) is provided with feed mechanism (7), the rear side that the inboard bottom of detecting storehouse (1) is close to feed mechanism (7) is provided with feed mechanism (8), feed mechanism (7) are including fixed spout (71) that sets up in the inboard bottom of detecting storehouse (1), the inboard slip of spout (71) is provided with slider (72), the fixed control frame (73) that is provided with in upper end of slider (72), control groove (74) have been seted up to the inboard bottom of control frame (73), the fixed link (75) that is provided with in one end of slider (72), the inboard screw thread of link (75) is provided with screw shaft (76), the inboard slip of control frame (73) is provided with scraping wings (77), the fixed spring (78) that is provided with in inboard bottom of control groove (74), the inboard activity of spring (78) is provided with control lever (79), push away the silo (710) inboard activity is provided with push away the silo (710).
2. The semiconductor chip qualification inspection device as claimed in claim 1, wherein a support frame (712) is fixedly disposed on one side of the upper end of the control frame (73) close to the material pushing groove (710), a rotating shaft (713) is movably disposed on the inner side of the support frame (712), the control rod (79) penetrates through the control frame (73), the control rod (79) is slidably connected with the control frame (73), a limiting plate (714) is fixedly disposed on the lower end of the control rod (79), a large motor (715) is fixedly disposed on one side of the inner bottom of the inspection bin (1) close to the sliding groove (71), a small motor (716) is fixedly disposed on one side of the upper end of the control frame (73) close to the support frame (712), and a fixing frame (717) is fixedly disposed on the front side of the inner bottom of the inspection bin (1) close to the large motor (715).
3. The semiconductor chip qualification inspection apparatus according to claim 2, wherein the holder (717) has an inner side movably connected to an outer side of a screw shaft (76), a rear end of the screw shaft (76) is mounted at a front end of a large motor (715), and an upper end of the spring (78) is fixedly connected to a lower end of the pusher plate (77).
4. The semiconductor chip qualification testing apparatus of claim 2, wherein the upper end of the control rod (79) is fixedly connected to the inner side of the lower end of the pusher plate (77) near the spring (78), one end of the rotation shaft (713) is mounted at one end of the small motor (716), and the outer side of the rotation shaft (713) near the support frame (712) is fixedly connected to the inner side of the driving wheel (711).
5. The semiconductor chip qualification inspection device as claimed in claim 1, wherein the feeding mechanism (8) comprises a base (81) fixedly disposed at the bottom of the inner side of the inspection bin (1) and close to the rear side of the sliding groove (71), a threaded rod (82) is movably disposed at the inner side of the base (81), a sliding rod (83) is fixedly disposed at the upper end of the base (81), a main gear (813) is fixedly disposed at the outer side of the threaded rod (82) and close to the upper side of the base (81), an adjusting bracket (84) is disposed at the outer side of the threaded rod (82) and close to the upper side of the main gear (813), a sliding frame (85) is slidably disposed at the outer side of the sliding rod (83), a movable shaft (86) is movably disposed inside the sliding frame (85), a linkage bracket (87) is fixedly disposed at the outer side of the movable shaft (86), and a feeding clamping groove (88) is fixedly disposed at the upper end of the linkage bracket (87).
6. The semiconductor chip qualification testing device according to claim 5, wherein a limiting rod (89) is movably disposed at one side of the lower end of the feeding slot (88) close to the linkage frame (87), a connecting plate (810) is fixedly disposed at the lower end of the carriage (85), a regulating motor (811) is fixedly disposed at the front side of the upper end of the connecting plate (810) close to the carriage (85), a limiting frame (812) is fixedly disposed at the upper end of the sliding rod (83), a pinion (814) is engaged with the upper end of the main gear (813), and a transmission shaft (815) is fixedly disposed at the inner side of the pinion (814).
7. The semiconductor chip qualification testing device according to claim 6, wherein a linking motor (816) is fixedly arranged at the bottom of the inner side of the testing bin (1) close to the rear side of the base (81), the rear end of the transmission shaft (815) is installed at the front end of the linking motor (816), and one end of the adjusting frame (84) is fixedly connected with one end of the sliding frame (85).
8. The semiconductor chip qualification testing apparatus according to claim 7, wherein the movable shaft (86) has a front end mounted to a rear end of the adjustment motor (811), the limiting rod (89) has a front end fixedly connected to a rear end of the control frame (73), and the limiting frame (812) has an inner side movably connected to an outer side of the threaded rod (82) adjacent to an upper side of the adjustment frame (84).
9. The semiconductor chip qualification testing device as claimed in claim 1, wherein a storage box (2) is fixedly arranged at the lower end of the testing bin (1), support legs (3) are fixedly arranged at the lower end of the storage box (2), a movable door (4) is movably arranged at the inner side of the storage box (2) through a rotating shaft, a door handle (5) is fixedly arranged at the front end of the movable door (4), and the lower end of the material receiving box (9) is fixedly connected with one side of the bottom of the inner side of the testing bin (1) close to the base (81).
10. A semiconductor chip qualification inspection method for operating a semiconductor chip qualification inspection apparatus according to any one of claims 1 to 9, comprising the steps of:
s1: the pushing plate (77) is pulled to slide downwards in the inner side of the control frame (73), the pushing plate (77) drives the control rod (79) to slide downwards, the pushing plate (77) is enabled to compress the spring (78) downwards, then the semiconductor chips are stacked on the upper end of the pushing plate (77) in sequence, then the pushing plate (77) pushes the semiconductor chips to move upwards under the elastic action of the spring (78), meanwhile, the upper ends of the semiconductor chips are in contact with the lower end of the driving wheel (711), and then the small motor (716) is started, so that the driving wheel (711) pushes the semiconductor chips to move in sequence, and multiple groups of semiconductor chips can be automatically loaded in sequence;
s2: the adjusting frame (84) moves upwards by rotating the threaded rod (82), the sliding frame (85) slides upwards along the sliding rod (83), meanwhile, the feeding clamping groove (88) moves upwards along with the sliding frame (85), and the feeding clamping groove (88) drives the semiconductor chip to move upwards, so that the photographing device (6) photographs and inspects the semiconductor chip;
s3: through starting the regulating motor (811), the movable shaft (86) drives the linkage frame (87) to rotate, the linkage frame (87) drives the feeding clamping groove (88) to rotate, and therefore the semiconductor chip in the inner side of the feeding clamping groove (88) slides to the inner side of the material receiving box (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210851845.6A CN115561256A (en) | 2022-07-20 | 2022-07-20 | Semiconductor chip qualification inspection device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210851845.6A CN115561256A (en) | 2022-07-20 | 2022-07-20 | Semiconductor chip qualification inspection device and method |
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| Publication Number | Publication Date |
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| CN115561256A true CN115561256A (en) | 2023-01-03 |
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| CN202210851845.6A Pending CN115561256A (en) | 2022-07-20 | 2022-07-20 | Semiconductor chip qualification inspection device and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117420133A (en) * | 2023-12-18 | 2024-01-19 | 南通悦驰电子科技开发有限公司 | Automatic detection device for PCB (printed circuit board) of electric vehicle |
-
2022
- 2022-07-20 CN CN202210851845.6A patent/CN115561256A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117420133A (en) * | 2023-12-18 | 2024-01-19 | 南通悦驰电子科技开发有限公司 | Automatic detection device for PCB (printed circuit board) of electric vehicle |
| CN117420133B (en) * | 2023-12-18 | 2024-02-23 | 南通悦驰电子科技开发有限公司 | Automatic detection device for PCB (printed circuit board) of electric vehicle |
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