CN115560623A - Substrate processing apparatus - Google Patents

Abstract

The invention relates to a substrate processing device, which is provided with an inner cavity and comprises: wallboard and planking. The wall plate is used for forming the boundary of the inner cavity; the outer plate is arranged on one side of the wall plate back to the inner cavity; a gap is arranged between the outer plate and the wall plate to form a circulating space for the first cooling fluid to pass through. Since the wall forms the boundary surface of the cavity, a portion of the heat generated in the cavity is transferred to the wall when the substrate is subjected to processing. When the first cooling fluid is introduced into the circulating space, the first cooling fluid can generate heat transfer with one side of the wall plate facing the outer plate. Because first cooling fluid flows through the clearance between wallboard and the planking to make and have great area of contact between first cooling fluid and the wallboard, effectively promoted first cooling fluid and absorbed thermal efficiency and inner chamber refrigerated efficiency, make the inner chamber be difficult to rise to higher temperature, guarantee the stable operation of technology processing of substrate, prevent that the processing of substrate from receiving the influence.

Description

Substrate processing apparatus

Technical Field

The invention relates to the technical field of substrate processing, in particular to substrate processing equipment.

Background

The substrate may need to be subjected to various treatments before it is shipped to a factory for use in applications. For example, glass is used as a substrate, and is subjected to surface roughening treatment before shipment to produce an anti-glare effect on the surface of the glass.

In some process links, the processing of the substrate generates more heat, which causes the temperature of the processing equipment to rise. For example, in a process of sputtering a glass surface with plasma, the processing equipment easily absorbs heat and the temperature rises. Conventional processing equipment has a limited cooling efficiency, is liable to rise to a high temperature, is difficult to stably operate, and causes the processing of the substrate to be affected.

Disclosure of Invention

In view of the above, it is necessary to provide a substrate processing apparatus which is capable of solving the problems that the cooling efficiency of the processing apparatus is limited and the processing apparatus is likely to rise to a high temperature.

A substrate processing apparatus having an interior chamber, comprising:

a wall panel for bounding the interior cavity; and

the outer plate is arranged on one side of the wall plate, which is back to the inner cavity; a gap is formed between the outer plate and the wall plate to form a circulation space for passing a first cooling fluid.

According to the substrate processing equipment, when the substrate needs to be subjected to process treatment, the substrate is positioned in the inner cavity of the substrate processing equipment. Because the wall forms the boundary surface of the cavity, a portion of the heat generated in the cavity is transferred to the wall when the substrate is being processed. Because the planking sets up in the one side of wallboard dorsad inner chamber to through clearance formation circulation space between planking and the wallboard, when first cooling fluid lets in the circulation space, first cooling fluid can produce the heat transfer with the wallboard towards the one side in the planking, and the heat transfer of wallboard is to first cooling fluid, makes the temperature of wallboard descend, finally lets first cooling fluid absorb the heat in the inner chamber, makes the temperature in the inner chamber descend. Because first cooling fluid flows through the clearance between wallboard and the planking to make and have great area of contact between first cooling fluid and the wallboard, effectively promoted first cooling fluid and absorbed thermal efficiency and inner chamber refrigerated efficiency, make the inner chamber be difficult to rise to higher temperature, guarantee the stable operation of technology processing of substrate, prevent that the processing of substrate from receiving the influence.

In one embodiment, the substrate processing apparatus further comprises a barrier disposed in the flow-through space, a length direction of the barrier being at least partially parallel to a flow direction of the first cooling fluid in the flow-through space; the barrier strip is used for guiding the first cooling fluid towards the wall plate.

In one embodiment, the outside of the barrier is formed with threads.

In one embodiment, the outer diameter of the barrier strip is 60% to 100% of the distance between the wall plate and the outer plate.

In one embodiment, the flow space comprises a plurality of advection sections and a plurality of deflection sections, each of which is capable of passing the first cooling fluid; a plurality of the advection sections are arranged and distributed; one end of the advection section is communicated to the other advection section through one of the deflection sections, and the other end of the advection section is communicated to the other advection section through the other deflection section.

In one embodiment, the device further comprises a division bar; two sides of the division bar respectively abut against the wall plate and the outer plate; the division bars are used for dividing the gap between the wall plate and the outer plate, and at least the advection section is formed between the two division bars.

In one embodiment, the outer plate is provided with an input port and an output port; the input port and the output port are respectively communicated with the circulation space.

In one embodiment, the substrate processing equipment is provided with an outer flow passage for introducing a second cooling fluid; the outer flow channel is positioned on one side of the outer plate, which is back to the wall plate.

In one embodiment, the shell comprises a shell connected to the outer plate; the outer flow passage is formed between the inner wall surface of the pipe shell and the outer surface of the outer plate.

In one embodiment, the device further comprises a plurality of guide tubes accommodated in the inner cavity; the guide pipe is arranged between the wall plate and the processing station.

Drawings

FIG. 1 is a schematic perspective view of a substrate processing apparatus according to one embodiment of the present invention;

FIG. 2 is a schematic perspective view of the substrate processing apparatus shown in FIG. 1 at another angle;

FIG. 3 is an exploded schematic view of the substrate processing apparatus shown in FIG. 2;

FIG. 4 is an exploded view of the substrate processing apparatus of FIG. 2 from another angle;

FIG. 5 is an exploded view of the substrate processing apparatus of FIG. 2 at another angle with the faceplate hidden;

FIG. 6 is an exploded view of the substrate processing apparatus of FIG. 2 at another angle with the faceplate hidden;

FIG. 7 is an enlarged view of the substrate processing apparatus shown in FIG. 6 at A;

fig. 8 is a partial schematic view of the cartridge in the substrate processing apparatus shown in fig. 6.

Reference numerals: 100. a substrate processing device; 20. wall plates; 30. an outer plate; 31. a flow-through space; 311. a advection section; 312. a baffling section; 313. an input port; 314. an output port; 32. a pipe shell; 321. an outer flow passage; 33. a frame body; 40. a panel; 41. a first port; 42. a second port; 50. blocking strips; 60. a parting strip; 61. a relocation section; 62. an extension section; 70. and (4) guiding the tube.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are for purposes of illustration only and do not denote a single embodiment.

The technical scheme provided by the embodiment of the invention is described below by combining the accompanying drawings.

Referring to fig. 1 to 8, the present invention provides a substrate processing apparatus 100.

In some embodiments, the substrate processing apparatus 100 is capable of performing a transfer process, a cleaning process, or an etching process on a substrate. In particular, the substrate processing apparatus 100 can have one or more internal chambers. The substrate may be subjected to a cleaning process, an etching process, or other processing after entering the cavity. When the substrate processing apparatus 100 has a chamber, the substrate processing apparatus 100 may move a substrate into the chamber or out of the chamber by a transfer process. When the substrate processing apparatus 100 has a plurality of cavities, the substrate processing apparatus 100 may also move a substrate into one cavity while leaving another cavity by a transfer process.

Further, the substrate comprises glass, or other material having a composition or property close to that of glass. The substrate may be in the form of a plate or sheet. More specifically, in the cleaning process, the substrate processing apparatus 100 can perform plasma cleaning of the surface to be processed of the substrate to be processed using an inert gas source or other cleaning gas source. More specifically, in an etching process, the substrate processing apparatus 100 may utilize an inert gas source and a fluorine-containing gas source or other etching gas source to plasma etch the surface to be processed of the substrate.

In some embodiments, the substrate processing apparatus 100 includes a moving device for performing a material moving process to move the substrate relative to the inner cavity. Specifically, the moving device comprises a plurality of guide wheels capable of rotating and a driving device for driving the guide wheels to rotate, a carrier connected with one or more substrates is borne by the guide wheels, and when the guide wheels rotate, the carrier moves in the inner cavity under the action of the guide wheels.

In some embodiments, the substrate processing apparatus 100 includes a plasma generating device for generating plasma. In one embodiment, the plasma is used to perform a cleaning process on the substrate surface. In another embodiment, the plasma is used to etch a surface of the substrate.

In some embodiments, as shown in fig. 1, 3 and 6 in combination, the substrate processing apparatus 100 includes: wall panel 20 and outer panel 30. The wall plate 20 serves to delimit the interior cavity. The outer panel 30 is disposed on a side of the wall panel 20 facing away from the cavity. A gap is provided between the outer panel 30 and the wall panel 20 to form a circulation space 31 for passing the first cooling fluid.

When a substrate is to be processed, the substrate is in the interior chamber of the substrate processing apparatus 100. Since the wall plate 20 forms the boundary surface of the cavity, a portion of the heat generated in the cavity is transferred to the wall plate 20 when the substrate is subjected to the processing. Because the outer plate 30 is disposed on a side of the wall plate 20 opposite to the inner cavity, and a flow space 31 is formed between the outer plate 30 and the wall plate 20 through a gap, when the first cooling fluid is introduced into the flow space 31, the first cooling fluid can generate heat transfer with the wall plate 20 toward the side of the outer plate 30, and the heat of the wall plate 20 is transferred to the first cooling fluid, so that the temperature of the wall plate 20 is reduced, and finally the first cooling fluid absorbs the heat in the inner cavity, so that the temperature in the inner cavity is reduced. Because first cooling fluid flows through the clearance between wallboard 20 and the planking 30 to make and have great area of contact between first cooling fluid and the wallboard 20, effectively promoted first cooling fluid and absorbed thermal efficiency and to the refrigerated efficiency of cavity, make the inner chamber be difficult to rise to higher temperature, guarantee the technology of substrate and handle steady operation, prevent that the processing of substrate from receiving the influence.

In some embodiments, as shown in conjunction with fig. 1 and 2, the wall plate 20 is used to form a portion of the boundary of the internal cavity. Specifically, substrate processing apparatus 100 further includes a faceplate 40, and faceplate 40 is used to form the other boundaries of the interior cavity.

In one embodiment, as shown in fig. 1, the panel 40 is used to form a sidewall of the inner cavity, and the panel 40 is provided with a first port 41 communicating with the inner cavity. The first ports 41 are disposed in pairs, and the first ports 41 are used for the carrier to enter and exit the inner cavity. More specifically, the substrate processing apparatus 100 further includes a cover plate for covering the first port 41 to enable the inner chamber to be in a vacuum atmosphere. In one embodiment, the faceplate 40 is provided with a second port 42 communicating with the interior cavity, the second port 42 being for mounting a plasma generating device. More specifically, the plasma generating device is embedded in the second opening 42, and the edge of the plasma generating device in the second opening 42 is sealed and attached, so that the inner cavity can be in a vacuum environment. In some embodiments, the panel 40 may also be used to form the upper or lower boundary of the internal cavity. More specifically, the inner side of the wall plate 20 is disposed opposite one of the face plates 40.

In some embodiments, as shown in fig. 6 and 7, the substrate processing apparatus 100 further comprises a barrier strip 50 disposed in the flow-through space 31, wherein a length direction of the barrier strip 50 is at least partially parallel to a flow direction of the first cooling fluid in the flow-through space 31. The bars 50 are used to direct the first cooling fluid towards the wall plate 20. Specifically, since the barrier strip 50 is provided in the circulation space 31, the first cooling fluid can contact the barrier strip 50 when the first cooling fluid flows in the circulation space 31. And because the length direction of the barrier strip 50 is at least partially parallel to the flowing direction of the first cooling fluid, the obstruction of the barrier strip 50 to the first cooling fluid can be reduced, and the situation that the first cooling fluid is unfavorable for the first cooling fluid to quickly take away heat due to the excessive reduction of the speed of the first cooling fluid is prevented. Because the barrier strip 50 guides the first cooling fluid to the side of the siding 20 facing the outer panel 30, the first cooling fluid is in more complete contact with the siding 20, thereby facilitating the first cooling fluid to fully absorb heat on the siding 20 and improving the heat dissipation efficiency of the siding 20.

In some embodiments, as shown in connection with FIG. 7, the outside of the bar 50 is threaded. Specifically, when the first cooling fluid flows in the circulation space 31, a part of the first cooling fluid flows to a position near the outside of the barrier 50. The threads on the outside of bar 50 redirect the flow of the first cooling fluid adjacent to the outside of bar 50 from parallel to the length of bar 50 to oblique to the length of bar 50. When the first cooling fluid flows in a direction parallel to the length of the barrier 50, the flow path of the first cooling fluid is short, so that the first cooling fluid stays in the circulation space 31 for a short time, and the heat absorbed by the first cooling fluid in the process of passing through the circulation space 31 is limited. Since the threads on the outside of the barrier strip 50 are spirally distributed on the outside of the barrier strip 50 along the length direction of the barrier strip 50, when the first cooling fluid flows to the vicinity of the threads, the first cooling fluid is guided by the gap between the threads to flow toward the surface of the panel 20 or the surface of the outer panel 30, thereby increasing the actual flow rate of the first cooling fluid in the vicinity of the surface of the panel 20 or the outer panel 30, and allowing the heat on the panel 20 to be more sufficiently absorbed by the first cooling fluid. In addition, since the first cooling fluid does not completely flow in the direction parallel to the surface of the wall plate 20 or the outer plate 30, the flow path length of the first cooling fluid in the flow-through space 31 is increased, the residence time of the first cooling fluid in the flow-through space 31 is increased, and the cooling effect on the inner cavity is increased.

In other embodiments, a plurality of convex protruding portions may be disposed on the outer side of the barrier 50, and the gap between adjacent protruding portions may be used to guide the first cooling fluid, so that the first cooling fluid passing through the protruding portions flows to the surface of the wall plate 20 under the guiding effect.

In some embodiments, the outer diameter of the barrier strip 50 is 60% to 100% of the distance between the wall plate 20 and the outer plate 30. Because the outer diameter of the barrier strip 50 is in a relatively proper range, the barrier strip 50 can generate a relatively obvious guiding effect on the flowing direction of the first cooling fluid, and the first cooling fluid can flow to the surface of the wall plate 20 under the guiding of the barrier strip 50. Specifically, the outer diameter of the barrier strip 50 is 60%, 65%, 70%, 75%, 80%, 85%, 90%, or 95% of the distance between the wall panel 20 and the outer panel 30. In one embodiment, the barrier strip 50 has an outer diameter of 80% of the distance between the wall plate 20 and the outer plate 30, such that a certain gap is maintained between the barrier strip 50 and the wall plate 20 or the outer plate 30, the first cooling fluid can flow around the barrier strip 50 to a certain extent, and the first cooling fluid can contact a portion of the wall plate 20 close to the barrier strip 50, such that the heat of the wall plate 20 can be uniformly absorbed by the first cooling fluid.

In some embodiments, as shown in fig. 3, the plane of the wall plate 20 and the plane of the outer plate 30 are approximately parallel, so that the gap width between the wall plate 20 and the outer plate 30 is relatively uniform, and the flow rate of the first cooling fluid in each part of the flow space 31 is approximately uniform. Further, the gap edge between the wall plate 20 and the outer plate 30 forms a boundary of the flow space 31 by providing a weather strip. Alternatively, the gap between the wall plate 20 and the outer plate 30 extends to the face plate 40, so that the face plate 40 forms the boundary of the flow space 31. In some embodiments, the surface of the wall panel 20 or the outer panel 30 is not limited to a plane. In other embodiments, the surface of the wall panel 20 or the outer panel 30 may also be curved.

In some embodiments, as shown in fig. 5 and 6, the outer plate 30 is provided with an input port 313 and an output port 314. The input port 313 and the output port 314 communicate with the flow space 31, respectively. Specifically, the first cooling fluid enters the circulation space 31 from the input port 313. The first cooling fluid flows in the flow space 31 and then exits the flow space 31 through the outlet 314. Since the first cooling fluid with the lower temperature is continuously supplied to the input port 313, a large temperature difference between the first cooling fluid in the circulation space 31 and the wall plate 20 can be ensured, and the heat on the wall plate 20 can be more quickly transferred to the first cooling fluid. Further, the input port 313 and the output port 314 of the flow space 31 are provided on the wall plate 20, and the input port 313 and the output port 314 of the outer plate 30 are provided so that the input port 313 or the output port 314 can be easily abutted against an external pipe.

In some embodiments, as shown in fig. 6 and 8 in combination, the substrate processing apparatus 100 is provided with an external flow passage 321 for passing a second cooling fluid. The outer flow passages 321 are located on the side of the outer plate 30 facing away from the wall plate 20 so that the second cooling fluid can absorb heat from the outer plate 30. Specifically, since the outer side of the outer panel 30 may be touched by an operator, the operator may be burned when the outer panel 30 is in a high temperature state. Because the outer flow channel 321 is located on the side of the outer plate 30 opposite to the circulation space 31, when the second cooling fluid flows into the outer flow channel 321, the second cooling fluid can absorb heat of the outer plate 30, reduce the temperature of the outer plate 30, and prevent operators from being damaged by high temperature.

In some embodiments, as shown in conjunction with fig. 6 and 8, the substrate processing apparatus 100 includes a housing 32 connected to an outer plate 30. An outer flow passage 321 is formed between the inner wall surface of the tube case 32 and the outer surface of the outer panel 30. Specifically, since a part of the surface of the outer plate 30 forms the boundary of the outer flow passage 321, the second cooling fluid can be brought into contact with the outer plate 30 more directly, and the transfer of heat from the outer plate 30 to the second cooling fluid is accelerated. Further, in a direction perpendicular to the length of the pipe shell 32, a part of the cross-sectional edge of the pipe shell 32 is concave, and the opening of the concave edge faces the outer surface of the outer plate 30, so that the pipe shell 32 has a certain structural strength, and when the pipe shell 32 is fixedly connected to the outer plate 30, the structural strength of the outer plate 30 can be improved, and the outer plate 30 is prevented from deforming under the pressure of the first cooling fluid. In one embodiment, the tube housing 32 is disposed in a plurality of zigzag patterns along the outer surface of the outer plate 30. Specifically, the outer surface of the outer panel 30 is on the side of the outer panel 30 facing away from the wall panel 20. The inner wall surface of the tube case 32 is a surface of the tube case 32 on the concave side.

Further, as shown in fig. 2 and 4, the substrate processing apparatus 100 further includes a frame body 33, wherein the frame body 33 is disposed on a side of the outer plate 30 opposite to the wall plate 20. The frame 33 is connected to the panel 40 and provides support to the outer plate 30 to prevent the outer plate 30 from being displaced or deformed to cause leakage of the first cooling fluid.

In some embodiments, as shown in fig. 6 and 7, the flow-through space 31 includes a plurality of advection sections 311 and a plurality of deflection sections 312, and the advection sections 311 and the deflection sections 312 can pass through the first cooling fluid, respectively. The plurality of advection sections 311 are arranged and distributed. Furthermore, one end of one advection section 311 is communicated to the second advection section 311 through one deflection section 312, and the other end is communicated to the third advection section 311 through the other deflection section 312. Specifically, in the predetermined linear direction, a plurality of advection sections 311 are arranged and distributed in sequence. The front and rear advection sections 311 are communicated with each other through the baffle section 312, so that the two adjacent advection sections 311 have overlapped parts in the length direction, the circulation space 31 is arranged in a winding shape, the length of the flow path of the first cooling fluid between the wall plate 20 and the outer plate 30 is increased, the first cooling fluid can have basically consistent flow velocity when passing through any surface of the wall plate 20, and the wall plate 20 is prevented from accumulating heat at the position where the flow velocity of the first cooling fluid is too low. In one embodiment, the advection section 311 is extended in a vertical direction, and the predetermined straight line is parallel to a horizontal direction. In another embodiment, the advection section 311 is extended and disposed along a horizontal direction, and the predetermined straight line is parallel to a vertical direction. In yet another embodiment, the advection section 311 can be disposed at any angle relative to the horizontal.

In one embodiment, the advection section 311 extends along a straight line, and the predetermined straight line is a straight line perpendicular to the length direction of the advection section 311. In another embodiment, the advection section 311 extends along a curve having an arc. In one embodiment, the first cooling fluid flows in opposite directions in the two adjacent advection sections 311, and the flow direction of the first cooling fluid is adjusted by 180 degrees after passing through the deflection section 312. In other embodiments, the flow-through space 31 may be in any shape capable of guiding the flow of the first cooling fluid.

In some embodiments, not shown, the flow-through spaces 31 are arranged in a spiral in a plane, and the first cooling fluid flows circumferentially around a center at different distances from the center at least twice through a ray from the center, so that the first cooling fluid flows in a swirling motion along the surface of the wall plate 20, allowing the first cooling fluid to have a substantially uniform flow velocity across any surface of the wall plate 20.

In some embodiments, as shown in conjunction with fig. 6 and 7, substrate processing apparatus 100 further includes a spacer bar 60. Both sides of the division bar 60 are respectively abutted against the wall plate 20 and the outer plate 30. The division bars 60 are used to divide a gap between the wall plate 20 and the outer plate 30, and at least a advection section 311 is formed between the two division bars 60. Specifically, both sides of the division bar 60 may be directly abutted against the wall plate 20 or the outer plate 30, more specifically, the division bar 60 is abutted against the wall plate 20 with an edge close to the wall plate 20, and the division bar 60 is additionally abutted against the outer plate 30 with an edge close to the outer plate 30. The two sides of the division bar 60 can also indirectly abut against the wall plate 20 or the outer plate 30, and more specifically, an easily deformable sealing gasket can be arranged between the division bar 60 and the wall plate 20 or the outer plate 30 to fully fill and block the first cooling fluid and prevent the first cooling fluid from passing through a gap between the division bar 60 and the wall plate 20 or the outer plate 30. In one embodiment, the lengthwise direction of the division bar 60 is perpendicular to a predetermined straight line, and the plurality of division bars 60 are arranged along the predetermined straight line. The division bars 60 include a repositioning section 61 and an extending section 62, and an advection section 311 of the circulation space 31 is formed between the repositioning sections 61 of the adjacent division bars 60.

Specifically, as shown in fig. 7, an end of each extension section 62 away from the weight section 61 extends to an outer boundary line, and a gap is provided between an end of the barrier strip 50 and the outer boundary line, so as to prevent the first cooling fluid from being completely blocked by the barrier strip 50. Further, when a division bar 60 is disposed in the middle between two division bars 60, a space relationship is formed between the two division bars 60. For two adjacent spacers 60, the extension section 62 is disposed on the opposite side of the repositioning section 61. Thus, the outward extending sections 62 of the bars 60 in a spaced relationship are opposed to each other and are not obstructed by the outward extending sections 62 of the intermediate bars 60. Thus forming a baffle section 312 between the two extension sections 62 in a spaced relationship. Specifically, a portion or all of barrier strip 50 is positioned between two adjacent division strips 60. More specifically, it is possible that a portion of barrier 50 is located between the heavy end sections 61 of two adjacent spacers 60, while another portion of barrier 50 extends beyond the end of spacer 60 where no extension section 62 is located, to sufficiently direct the first cooling fluid to wash against different surfaces of wall plate 20. Further, a plurality of barrier strips 50 may be arranged in parallel between the repositioning sections 61 of two adjacent division bars 60.

In some embodiments, as shown in fig. 3 and 4, the substrate processing apparatus 100 further includes a plurality of conduits 70 received in the inner chamber. The lead 70 is disposed between the wall plate 20 and the processing station. Specifically, when a substrate is processed, the carrier carrying the substrate is moved to a processing station, so that the substrate is subjected to corresponding process treatment. More specifically, the first through openings 41 correspond to the front and the rear of the processing station, respectively. The lead pipe 70 is used for introducing a cooling medium. When flowing in the lead tube 70, the cooling medium can absorb heat on the lead tube 70, so that the temperature in the inner cavity is reduced to a proper temperature range. Further, as the lead tube 70 is arranged between the wall plate 20 and the processing station, and a plasma generating device is arranged on one side of the processing station opposite to the lead tube 70, the plasma generating device can be matched with the first cooling fluid to absorb heat in the inner cavity from one side of the substrate which is not subjected to process treatment, so that the cooling effect is ensured. In one embodiment, the first cooling fluid or the second cooling fluid is a water stream.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A substrate processing apparatus having an interior chamber, comprising:

a wall panel for bounding the interior cavity; and

the outer plate is arranged on one side of the wall plate, which is back to the inner cavity; a gap is formed between the outer plate and the wall plate to form a circulation space for passing a first cooling fluid.

2. The substrate processing apparatus of claim 1, further comprising a baffle disposed in the flow-through space, a length of the baffle being at least partially parallel to a direction of flow of the first cooling fluid in the flow-through space; the barrier strip is used for guiding the first cooling fluid towards the wall plate.

3. The substrate processing apparatus of claim 2, wherein the bar is threaded on an outer side.

4. The substrate processing apparatus of claim 2, wherein the outer diameter of the bar is 60% to 100% of the distance between the wall plate and the outer plate.

5. The substrate processing apparatus of claim 1, wherein the flow space includes a plurality of advection sections and a plurality of deflection sections, each of which is capable of passing the first cooling fluid; a plurality of the advection sections are arranged and distributed; one end of the advection section is communicated to the other advection section through one of the deflection sections, and the other end of the advection section is communicated to the other advection section through the other deflection section.

6. The substrate processing apparatus of claim 5, further comprising a spacer; two sides of the division bar respectively abut against the wall plate and the outer plate; the division bars are used for dividing a gap between the wall plate and the outer plate, and at least the advection section is formed between the two division bars.

7. The substrate processing apparatus of claim 1, wherein the outer plate has an input port and an output port; the input port and the output port are respectively communicated with the circulation space.

8. The substrate processing apparatus of claim 1, wherein the substrate processing apparatus is provided with an external flow channel for the introduction of a second cooling fluid; the outer flow channel is positioned on one side of the outer plate, which is back to the wall plate.

9. The substrate processing apparatus of claim 8, comprising a cartridge connected to the outer plate; the outer flow passage is formed between the inner wall surface of the pipe shell and the outer surface of the outer plate.

10. The substrate processing apparatus of claim 1, further comprising a plurality of conduits received in the interior chamber; the guide pipe is arranged between the wall plate and the processing station.

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