CN115558460B - Pouring sealant for photovoltaic module and preparation method thereof - Google Patents
Pouring sealant for photovoltaic module and preparation method thereof Download PDFInfo
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- CN115558460B CN115558460B CN202111653989.2A CN202111653989A CN115558460B CN 115558460 B CN115558460 B CN 115558460B CN 202111653989 A CN202111653989 A CN 202111653989A CN 115558460 B CN115558460 B CN 115558460B
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- 239000000565 sealant Substances 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- -1 polysiloxanes Polymers 0.000 claims abstract description 28
- 229920002545 silicone oil Polymers 0.000 claims abstract description 24
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 8
- 239000000945 filler Substances 0.000 claims abstract description 8
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims abstract description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 38
- 239000011787 zinc oxide Substances 0.000 claims description 19
- 238000003756 stirring Methods 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 13
- 239000007822 coupling agent Substances 0.000 claims description 11
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 11
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 7
- 239000003063 flame retardant Substances 0.000 claims description 7
- 239000002994 raw material Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- 238000004382 potting Methods 0.000 claims description 6
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 3
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 239000000243 solution Substances 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 230000002745 absorbent Effects 0.000 claims description 2
- 239000002250 absorbent Substances 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- 239000002216 antistatic agent Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 2
- 238000011161 development Methods 0.000 abstract description 4
- 238000004383 yellowing Methods 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical group CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical class [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 3
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical group CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910001593 boehmite Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical group [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Sealing Material Composition (AREA)
Abstract
The application relates to the field of IPC classified C09J183/07, in particular to pouring sealant for a photovoltaic module and a preparation method thereof. The pouring sealant for the photovoltaic module comprises a component A and a component B; the A component at least comprises: polysiloxanes, silicone oils; the component B at least comprises the following components: silicone oil, organic tin salt, auxiliary agent, silicate and nano filler. The pouring sealant prepared by the application has good cohesiveness and thermal conductivity, effectively reduces the semi-gel phenomenon of the pouring sealant, has excellent yellowing resistance and water vapor resistance, is suitable for popularization in the field of electronic element processing, and has wide development prospect.
Description
Technical Field
The application relates to the field of IPC classified C09J183/07, in particular to pouring sealant for a photovoltaic module and a preparation method thereof.
Background
Along with the development of society and economy, the development of electronic technology has been rapidly advanced in recent years, and in order to realize high power, high performance and miniaturization of high-technology products such as electronic components, integrated circuit boards, circuit modules and the like, the preparation conditions and the use conditions of the high-technology products are becoming stricter. In addition, since the electronic devices are subjected to external forces and complex external environments during the production, transportation and storage processes, the requirements for electronic components have been gradually developed in recent years to have good heat resistance, mechanical properties and heat and electrical conductivity. This places higher demands on the potting material and the adhesive material used in the electronic components, regardless of the requirements of the electronic components themselves.
The prior art (CN 106147698A) provides a silicone potting adhesive which is mainly used for a junction box of a photovoltaic module, is prepared by adopting two components, and is claimed to have durable stability and bonding performance. However, the adopted boehmite of the flame-retardant material has obvious flame-retardant performance, but a large amount of surface hydroxyl groups are introduced by adding a large amount of boehmite, so that the hydrophobic performance of the pouring sealant is easily reduced, and the moisture absorption phenomenon is generated in the long-term use process, so that the use of electronic components is not only harmful, but also the long-term bonding and pouring effect of the pouring sealant are further reduced.
Therefore, a pouring sealant which has excellent flame-retardant, heat-conducting and high-temperature-resistant properties and also has good waterproof and deep curing effects is needed.
Disclosure of Invention
In order to solve the above problems, a first aspect of the present application provides a pouring sealant for a photovoltaic module, which is characterized in that: comprises a component A and a component B; the A component at least comprises: polysiloxanes, silicone oils and nanofillers; the component B at least comprises the following components: silicone oil, organic tin salt, auxiliary agent and silicate ester.
As a preferred scheme, the component a comprises, in parts by mass: 70-90 parts of polysiloxane, 20-30 parts of silicone oil and 30-60 parts of nano filler.
As a preferred scheme, the component B comprises, in parts by mass: 60-80 parts of silicone oil, 0.1-3 parts of organic tin salt, 10-20 parts of auxiliary agent and 30-60 parts of silicate ester.
As a preferable embodiment, the polysiloxane is at least one of hydroxy polydimethylsiloxane, vinyl methyl polysiloxane, vinyl polyborosiloxane, hydroxy-terminated phenyl polysiloxane, and mono-terminated polysiloxane.
As a preferred embodiment, the polysiloxanes are hydroxy-terminated phenyl polysiloxanes.
As a preferred embodiment, the polysiloxane has a viscosity of 1000 to 22000cps at 25 ℃.
As a preferred embodiment, the polysiloxane has a viscosity of 3000 to 10000cps at 25 ℃.
As a preferable scheme, the silicone oil is at least one of methyl silicone oil, hydroxyl silicone oil, hydrogen-containing silicone oil, benzyl silicone oil and vinyl silicone oil.
As a preferred embodiment, the silicone oil is methyl silicone oil.
As a preferred embodiment, the silicone oil has a viscosity of 100 to 1500cps at 25 ℃.
As a preferred embodiment, the silicone oil has a viscosity of 200 to 800cps at 25 ℃.
According to the application, the deep curing effect of the pouring sealant is effectively improved by selecting the methyl silicone oil with specific viscosity, and the semi-gel phenomenon of the pouring sealant can be avoided. The inventors speculate that: the methyl silicone oil with specific viscosity is beneficial to the cross-linking of the methyl silicone oil to the system with the help of organic tin, so that the requirement of the potting adhesive system to the moisture in the system is reduced.
As a preferred embodiment, the organotin salt is dibutyltin dilaurate.
As a preferable scheme, the auxiliary agent is at least one of a coupling agent, an anti-dripping agent, an ultraviolet-resistant absorbent, an antistatic agent, a flame retardant and an antioxidant.
As a preferred embodiment, the coupling agent is a mixture of an amino coupling agent and an epoxy coupling agent.
As a preferred embodiment, the amino coupling agent is aminopropyl triethoxysilane.
As a preferred embodiment, the epoxy coupling agent is 2- (3, 4-epoxycyclohexane) ethyltrimethoxysilane.
As a preferable scheme, the mass ratio of the amino coupling agent to the epoxy coupling agent is 3-5:1-2.
As a preferable embodiment, the silicate is at least one of methyl orthosilicate, ethyl orthosilicate, and propyl orthosilicate.
As a preferred embodiment, the silicate is ethyl orthosilicate.
As a preferred embodiment, the nanofiller is coated zinc oxide.
As a preferred scheme, the average fineness of the nano-filler is 200-400 nm.
The preparation method of the coated zinc oxide comprises the following steps: (1) Mixing zinc oxide with a silane coupling agent, stirring and heating for 1-2 hours at 70-80 ℃; (2) And then mixing the treated zinc oxide with 2-methylimidazole and zinc nitrate, adding water or methanol solution, reacting for 3-4 hours at 60-80 ℃, and washing and drying the obtained product to obtain the zinc oxide.
According to the application, through coating modification of zinc oxide particles, the waterproof and hydrophobic properties of the pouring sealant are effectively improved, the phenomenon of moisture absorption and viscosity breaking in the long-term use process is effectively avoided, and the heat conduction, electric conduction and light resistance of the pouring sealant are further improved. The inventors speculate that: the modified zinc oxide material is coated by the formed framework material, the outer coating shell is formed to have a more hydrophobic surface while the performance of the zinc oxide material is not changed, the direct contact of hydroxyl groups on the zinc oxide surface with water vapor and water molecules is avoided, and the better dispersion compatibility of an organosilicon system is realized; on the other hand, the modified zinc oxide can form a good electron flow path with the surface framework material, and the flow effect of electrons is accelerated, so that the modified zinc oxide has a better electron transmission effect, and further, when the surface of the modified particle is influenced by illumination, electrons and electron holes can be excited to be gathered on the surface, so that the light absorption effect of the modified particle is improved, the light absorption energy spectrum range is improved, and the yellowing and oxidation influence of the illumination on the pouring sealant is reduced.
As a preferable scheme, the mass ratio of the component A to the component B is 4-7:1.
As a preferable scheme, the mass ratio of the component A to the component B is 5:1.
The second aspect of the application provides a preparation method of the pouring sealant for the photovoltaic module, which comprises the following steps: (1) Mixing and stirring the raw materials required by the component A, and uniformly stirring and mixing for later use; (2) Adding the component B raw material, stirring for 30-60 minutes at a stirring speed of 200-400 rpm; and (3) vacuumizing the mixed solution.
The beneficial effects are that:
1. according to the organic silicon pouring sealant prepared by the application, a stable pouring sealant system is effectively formed through reasonable mixing proportion and viscosity selection of polysiloxane and silicone oil, and the flowing property and leveling property of the pouring sealant are further improved.
2. According to the organic silicon pouring sealant prepared by the application, through specific and specific selection of silicone oil, the deep curing effect of the organic silicon pouring sealant in the use process is further improved, the internal problem of the pouring sealant is reduced, the semi-gel phenomenon is avoided, and the usability of the pouring sealant is improved.
3. According to the organic silicon pouring sealant prepared by the application, the heat resistance and the heat conduction performance of a pouring sealant system are effectively improved through the addition of the modified filler, and the waterproof property in the pouring sealant system is effectively prevented from being reduced, so that the poor moisture permeability resistance of the pouring sealant system caused by the introduction of a large amount of hydrophilic groups is avoided.
Detailed Description
Example 1
Embodiment 1 provides a pouring sealant for a photovoltaic module, which comprises a component A and a component B; wherein, the A component comprises the following components in parts by mass: 80 parts of polysiloxanes and 25 parts of silicone oil; the component B comprises the following components in parts by mass: 65 parts of silicone oil, 5 parts of organic tin salt, 20 parts of auxiliary agent, 40 parts of silicate and 40 parts of nano filler; the mass ratio of the whole component A to the whole component B is 5:1.
the polysiloxane is hydroxyl end-capped phenyl polysiloxane; the viscosity was 5000cps at 25 ℃.
The silicone oil is methyl silicone oil; the viscosity was 500cps at 25 ℃.
The organotin salt is dibutyl tin dilaurate.
The auxiliary agent is a coupling agent and a flame retardant, and the mass ratio is 1:3; the coupling agent is a mixture of aminopropyl triethoxysilane and 2- (3, 4-epoxycyclohexane) ethyl trimethoxysilane, and the mass ratio of the aminopropyl triethoxysilane to the 2- (3, 4-epoxycyclohexane) ethyl trimethoxysilane is 4:1.5; the flame retardant is aluminum hydroxide.
The silicate is ethyl orthosilicate.
The nano filler is coated zinc oxide, and the average fineness is 320nm; the preparation method of the coated zinc oxide comprises the following steps of: (1) Mixing 2 parts of zinc oxide with 2 parts of a silane coupling agent kh550, and stirring and heating at 75 ℃ for 1.5 hours; (2) And then mixing the treated 2 parts of zinc oxide with 10 parts of 2-methylimidazole and 5 parts of zinc nitrate, adding 100 parts of methanol solution, reacting for 3.5 hours at 65 ℃, and washing and drying the obtained product to obtain the zinc oxide.
In this example, the hydroxy-terminated phenyl polysiloxane was a hydroxy-terminated phenyl polysiloxane product sold by Anhui Ai Yaoda Silicone oil Co., ltd. Having an average viscosity of 5000cps at 25 ℃.
In this example, the methyl silicone oil is a methyl silicone oil product sold by Hubei New Sihai chemical Co., ltd.
The second aspect of the present embodiment further provides a preparation method of the pouring sealant for a photovoltaic module, including the following steps: (1) Mixing and stirring the raw materials required by the component A, and uniformly stirring and mixing for later use; (2) Adding the raw material of the component B, stirring for 40 minutes at a stirring speed of 300rpm; and (3) vacuumizing the mixed solution.
Example 2
The specific implementation of this example is the same as example 1, except that: the mass ratio of the component A to the component B is 7:1.
Comparative example 1
The specific embodiment of this comparative example is the same as example 1, except that: the mass ratio of the component A to the component B is 13:1.
Comparative example 2
The specific embodiment of this comparative example is the same as example 1, except that: the average particle diameter is 50nm by adding common zinc oxide particles.
Evaluation of Performance
1. Water contact angle test: for each of the pouring sealants prepared in examples and comparative examples, water contact angle test was performed on a sample wafer of 2cmx 2cm x 2cm, the amount of water drop was 2. Mu.l by using a drop-in-place instrument, 5 points were uniformly selected for each sample, the result was averaged, the retention time of the water drop was 15 minutes, the water contact angle value after 15 minutes was recorded, 5 samples were tested for each comparative example, and the average of the measured values was recorded in Table 1.
2. Tack-free time and light fastness test: testing the surface drying time of the pouring sealant by referring to GB/T13477.5; and placing the pouring sealant sample after being cured for 5 hours at the temperature of 80 ℃ into a water-ultraviolet irradiation test box for observation, checking whether the surface of the glue sample is yellow or not after 30 days, marking the cracking phenomenon as unqualified, testing 100 samples according to each comparative example, wherein less than or equal to 10 samples are A, less than or equal to 25 samples are unqualified and B, and more than 25 samples are unqualified and C, and marking the measured results in Table 1.
TABLE 1
Examples | Water contact angle (°) | Light resistance | Time of surface drying (min, 21 ℃ C.) |
Example 1 | 121 | A | 40 |
Example 2 | 119 | A | 40 |
Comparative example 1 | 98 | B | 80 |
Comparative example 2 | 88 | C | 70 |
As can be seen from examples 1-2, comparative examples 1-3 and table 1, the pouring sealant for the photovoltaic module and the preparation method thereof provided by the application have good cohesiveness and thermal conductivity, effectively reduce the semi-gel phenomenon of the pouring sealant, have excellent yellowing resistance and water vapor resistance, are suitable for popularization in the field of electronic element processing, and have wide development prospects. Wherein example 1 obtained the best performance index under the factors of the best preparation raw material proportion and preparation process.
Claims (5)
1. The utility model provides a pouring sealant for photovoltaic module which characterized in that: comprises a component A and a component B;
the component A comprises the following components in parts by mass: 70-90 parts of polysiloxanes, 20-30 parts of silicone oil and 30-60 parts of nanofillers;
the component B comprises the following components in parts by mass: 60-80 parts of silicone oil, 0.1-3 parts of organic tin salt, 10-20 parts of auxiliary agent and 30-60 parts of silicate;
the nano filler is coated zinc oxide;
the average fineness of the nano filler is 200-400 nm;
the silicone oil is methyl silicone oil; the viscosity of the silicone oil is 200-800 cps and 25 ℃;
the mass ratio of the component A to the component B is 4-7: 1, a step of;
the preparation method of the coated zinc oxide comprises the following steps: (1) Mixing zinc oxide with a silane coupling agent, and stirring and heating for 1-2 hours at 70-80 ℃; (2) And mixing the treated zinc oxide with 2-methylimidazole and zinc nitrate, adding water or methanol solution, reacting for 3-4 hours at 60-80 ℃, and washing and drying the obtained product to obtain the zinc oxide.
2. The potting adhesive for a photovoltaic module according to claim 1, wherein: the polysiloxane is at least one of hydroxy polydimethylsiloxane, vinyl methyl polysiloxane, vinyl polyborosiloxane and hydroxy-terminated phenyl polysiloxane.
3. The potting adhesive for a photovoltaic module according to claim 2, wherein: the viscosity of the polysiloxane is 1000-22000 cps and 25 ℃.
4. The potting adhesive for a photovoltaic module according to claim 3, wherein: the auxiliary agent is at least one of a coupling agent, an anti-dripping agent, an ultraviolet-resistant absorbent, an antistatic agent, a flame retardant and an antioxidant.
5. A method for preparing the pouring sealant for a photovoltaic module according to any one of claims 1 to 4, which is characterized in that: the method comprises the following steps: (1) Mixing and stirring the raw materials required by the component A, and uniformly stirring and mixing for later use; (2) Adding the component B raw material, stirring for 30-60 minutes at a stirring speed of 200-400 rpm; and (3) vacuumizing the mixed solution.
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CN115558460B true CN115558460B (en) | 2023-11-28 |
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CN109908959A (en) * | 2019-04-03 | 2019-06-21 | 中山大学 | A kind of hud typed ZnO/ noble metal@ZIF-8 catalysis material and its preparation method and application |
JP2020100520A (en) * | 2018-12-20 | 2020-07-02 | 東ソー株式会社 | Zinc oxide-modified mfi type zeolite and method for producing aromatic compound using the same |
CN112250917A (en) * | 2020-10-24 | 2021-01-22 | 董浩 | Preparation method of high-thermal-conductivity natural rubber composite material |
CN113604851A (en) * | 2021-07-15 | 2021-11-05 | 桂林理工大学 | Super-hydrophobic coating without low surface energy substance modification on magnesium alloy surface and preparation method thereof |
CN113684000A (en) * | 2021-07-23 | 2021-11-23 | 广东长鹿精细化工有限公司 | Double-component condensed type transparent pouring sealant and preparation method thereof |
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JP2020100520A (en) * | 2018-12-20 | 2020-07-02 | 東ソー株式会社 | Zinc oxide-modified mfi type zeolite and method for producing aromatic compound using the same |
CN109908959A (en) * | 2019-04-03 | 2019-06-21 | 中山大学 | A kind of hud typed ZnO/ noble metal@ZIF-8 catalysis material and its preparation method and application |
CN112250917A (en) * | 2020-10-24 | 2021-01-22 | 董浩 | Preparation method of high-thermal-conductivity natural rubber composite material |
CN113604851A (en) * | 2021-07-15 | 2021-11-05 | 桂林理工大学 | Super-hydrophobic coating without low surface energy substance modification on magnesium alloy surface and preparation method thereof |
CN113684000A (en) * | 2021-07-23 | 2021-11-23 | 广东长鹿精细化工有限公司 | Double-component condensed type transparent pouring sealant and preparation method thereof |
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