CN115551209A

CN115551209A - V-CUT test method for avoiding lead wire residue on PCB

Info

Publication number: CN115551209A
Application number: CN202211222347.1A
Authority: CN
Inventors: 刘建军; 伍进喜
Original assignee: Quanchengxin Electronics Shenzhen Co ltd
Current assignee: Quanchengxin Electronics Shenzhen Co ltd
Priority date: 2022-10-08
Filing date: 2022-10-08
Publication date: 2022-12-30

Abstract

The invention discloses a V-CUT leakage test method for avoiding a lead remaining on a PCB, which comprises the following steps: s1, arranging a V-CUT groove on a broken edge of a PCB; s2, arranging a plurality of test end points in the V-CUT groove, wherein the middle parts of the test end points are positioned at the broken edges of the PCB; s3, arranging a V-CUT test line between the two test endpoints, wherein the endpoint of the V-CUT test line is a test endpoint; and S4, conducting conductivity test after the PCB is subjected to V-CUT, cutting off the connecting wire when the PCB is in an open circuit state, and not cutting off the connecting wire when the PCB is in a conductive state.

Description

V-CUT test method for avoiding lead wire residue on PCB

Technical Field

The invention relates to the technical field of printed circuit boards, in particular to a V-CUT test method for avoiding lead wire residue on a PCB.

Background

In the PCB manufacturing process, the PCB units are spliced into a connected piece and designed on a large board, and after corresponding functional patterns, solder resist ink covering and corresponding surface treatment are completed, the large board is cut into required small units in a forming mode. In order to facilitate the carrying and assembling operation of the PCB in the subsequent assembly process of the components, a process edge (also called a breaking edge) is generally added at the edge of the shipment unit of the PCB; and after the PCB is assembled, the broken edge is manually separated and broken from the PCB, and in order to enable the technical edge to be easily separated, a V-CUT knife is adopted to CUT into a groove with a certain depth between the minimum units of the delivered PCB in the PCB forming process through special equipment, so that the technical edge can be conveniently separated after the assembly of a customer.

However, in the actual production process, the V-CUT phenomenon is easy to occur, including the V leakage (on two sides) of the whole plate or the V leakage on one side; when V leaks, need rely on the manual work to inspect, the hourglass V board that inspects carries out rework processing again, but adopts the manual work to inspect and has following problem: 1. The labor intensity of workers is high, and the workers are easy to fatigue; 2. The cost is high, and the labor cost is increased for inspection; 3. the efficiency is low, and artifical inspection inefficiency is influenced by personnel's factor great.

Disclosure of Invention

Aiming at the defects in the technology, the invention provides the V-CUT leakage test method for avoiding the conducting wire remaining on the PCB, through transversely arranging the test end point and the test wire, the copper wire remaining on the board surface is avoided, and the V-CUT can be timely found when the V-CUT deviates.

In order to achieve the above object, the present invention provides a method for testing a leaky V-CUT that prevents a wire from remaining on a PCB, comprising the steps of:

s1, arranging a V-CUT groove on a broken edge of a PCB;

s2, arranging a plurality of test end points in the V-CUT groove, wherein the middle parts of the test end points are positioned at the broken edges of the PCB;

s3, arranging a V-CUT test line between the two test endpoints, wherein the endpoint of the V-CUT test line is a test endpoint;

and S4, after the PCB is subjected to V-CUT, conducting a conductivity test, wherein when the PCB is in an open circuit state, the connecting wire is CUT off, and when the PCB is in a conductive state, the connecting wire is not CUT off.

Preferably, in step S1, the distance between the upper edge and the lower edge of the V-CUT groove is 30-50mil.

Preferably, in step S2, the test end points are circular or rectangular, and a plurality of test end points are provided, and paired to form a group for use; the size of the test end point is the same as that of the V-CUT test line.

Preferably, a solder mask is placed on the test terminals, and solder mask windows 1-2mil larger than the test terminals are added so that the test terminals are not covered by ink.

Preferably, in step S3, the width of the leakage V-CUT test line is 1/3-1/2 of the width of the V-CUT groove, and the length of the leakage V-CUT test line is 3-5mm.

Preferably, in step S4, when the test fixture is connected to the PCB, two pairs of test terminals use different test probes;

the invention has the beneficial effects that: compared with the prior art, the invention has the advantages that two groups of leakage-proof V-CUT test end points are arranged on the broken edge, a leakage-proof V-CUT test line is arranged between each group of leakage-proof V-CUT test end points, then the leakage-proof V-CUT test line is communicated with a test fixture through the test end points for testing, if no leakage exists or no groove quality problem exists, the two matched test end points are not communicated, and the V-CUT groove is obtained without leakage or no quality problem; need not to carry out artifical the measuring, improved production efficiency, guaranteed the quality of product.

Drawings

FIG. 1 is a flow chart of the steps of the present invention;

FIG. 2 is a schematic structural diagram of the leak-proof molding detection of the PCB by the present application.

The main component symbols are as follows:

1. first plate 2, second plate 3, V-CUT line 4, leakage V-CUT test line 5, V-CUT groove upper edge

6. V-CUT slot lower edge 7, first test endpoint 8, second test endpoint.

Detailed Description

In order to make the present invention more clear, the present invention is further described with reference to the accompanying drawings and the specific embodiments, however, the technical solution of the present invention is not limited thereto, and the modifications made to the present application without making creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 and 2, the present invention discloses a method for preventing a wire from remaining on a PCB board by a leaky V-CUT test, which is characterized by comprising the following steps: s1, arranging a V-CUT groove on a broken edge of a PCB; s2, arranging a plurality of test end points in the V-CUT groove, wherein the middle parts of the test end points are positioned at the broken edges of the PCB; s3, arranging a V-CUT test line between the two test endpoints, wherein the endpoint of the V-CUT test line is a test endpoint; and S4, after the PCB is subjected to V-CUT, conducting a conductivity test, wherein when the PCB is in an open circuit state, the connecting wire is CUT off, and when the PCB is in a conductive state, the connecting wire is not CUT off. In the prior art, the V-CUT test line for preventing leakage is usually in a V shape or a U shape and is added at two ends of the V-CUT line of the PCB; the adding mode can only CUT off the V-CUT test line after the V-CUT is over, but cannot remove the V-CUT test line; the test lines remained on the board can affect the surface beauty of the board; and if the V-CUT line is connected with the copper sheet in the board, the V-CUT test line leaks electricity to influence the hidden danger of the electrical function, in order to solve the problem, a new scheme is set, the V-CUT test line is transversely arranged on the broken edge (V-CUT line) of the PCB, and the two ends of the V-CUT test line are respectively connected with the test end points, so that after the V-CUT is carried out, the test line and the V-CUT line are parallel and level with each other, and the whole V-CUT test line is completely stripped after the V-CUT treatment, thereby not generating any residue.

In order to achieve the above object, in step S1, the distance from the upper edge to the lower edge of the V-CUT slot is 30-50mil. In the specific implementation process, the design of the V-CUT groove is to meet the requirement of V-CUT cutting, and if the whole groove is too wide, the available area of the whole PCB board is affected, so that the width of the whole PCB board needs to be selected according to the processed PCB board, and the width of the whole PCB board is generally 40 mils.

In the step S2, the test end points are circular or rectangular, a plurality of test end points are arranged, and the test end points are paired with each other to form a group for use; the size of the test end point is the same as that of the leakage V-CUT test line; arranging a solder mask layer on the testing end point, and adding a solder mask window which is 1-2mil larger than the size of the testing end point so that the testing end point is not covered by ink; when the test fixture is connected with the PCB, the pairwise paired test endpoints adopt different test probes. In the embodiment, the anti-welding windowing is arranged, so that the test endpoints are conveniently connected with the test fixture and the test is more convenient to carry out, the test endpoints are connected by the leakage V-CUT test lines, and every two pairs of test endpoints adopt different test probes, so that after the V-CUT production is carried out, if the leakage V-CUT or the V-CUT deviation does not occur, the added leakage V-CUT test lines are completely removed, meanwhile, the whole test endpoint is CUT off together, so that when the electrical test is carried out, the probes on the test fixture only contact with the PCB, and the open-circuit state is displayed; if a leakage V-CUT exists or the V-CUT deviates, the added leakage V-CUT test line is remained on the board, and meanwhile, a test endpoint also exists, so that the probe on the test fixture is contacted with the test endpoint, and a short circuit is displayed in the test process.

More specifically, the width of the leakage V-CUT test line is 1/3-1/2 of the width of the V-CUT groove, and the length of the leakage V-CUT test line is 3-5mm. In the embodiment, the width of the leaky V-CUT test line is only about half of the width of the V-CUT groove, and the leaky V-CUT test line is positioned in the middle position, so that complete coverage can be conveniently carried out after V-CUT, the whole leaky V-CUT test line is CUT off, the length of the leaky V-CUT test line is not easy to overlong, and therefore the fact that multiple sections of leaky V-CUT test lines can be arranged on one V-CUT line is guaranteed, and the detection structure is more accurate in the subsequent detection process.

The invention is illustrated below by means of specific examples:

splitting a complete PCB into a first board 1 and a second board 2, firstly drawing an upper edge 5 of a V-CUT groove, a lower edge 6 of the V-CUT groove and a V-CUT line 3 according to operation requirements, then selecting test endpoints on the V-CUT line, wherein the test endpoints comprise a first test endpoint 7 and a second test endpoint 8, then arranging a leakage V-CUT test line 4 between the two test endpoints, enabling the width of the leakage V-CUT test line to be consistent with that of the test endpoints, and carrying out the same operation on the other side of the PCB for convenience of operation; then V-CUT cutting is carried out, testing is carried out by using a testing jig after cutting is finished, if a testing end point still exists, the probe of the testing jig is respectively contacted with the first plate, the second plate and the testing end point, and the whole display result is in a short circuit state at the moment, which indicates that V-CUT leakage or V-CUT cutting deviation exists; if the test end point does not exist, the cutting is indicated to be correct, and at the moment, the leakage V-CUT test line is also completely CUT off without residue.

The above disclosure is only for a few specific embodiments of the present invention, but the present invention is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.

Claims

1. A V-CUT test method for avoiding the residual leakage of a lead on a PCB is characterized by comprising the following steps:

s1, arranging a V-CUT groove on a broken edge of a PCB;

2. The method for avoiding the leakage of the conductive wire on the PCB as recited in claim 1, wherein in step S1, the distance between the upper edge and the lower edge of the V-CUT slot is 30-50mil.

3. The method for testing the leakage V-CUT of the PCB board for avoiding the lead wire from remaining on the PCB board as claimed in claim 1, wherein in the step S2, the testing end points are circular or rectangular, a plurality of testing end points are arranged, and the testing end points are paired with each other to form a group for use; the size of the test end point is the same as the V-CUT test line.

4. The method for avoiding the leakage of the V-CUT on the PCB board of the claim 3, wherein the solder mask is arranged on the testing end point, and the solder mask window which is 1-2mil larger than the size of the testing end point is added, so that the testing end point is not covered by the ink.

5. The method for avoiding the leakage V-CUT of the PCB board remained by the wire in claim 1, wherein in the step S3, the width of the leakage V-CUT test line is 1/3-1/2 of the width of the V-CUT groove, and the length of the leakage V-CUT test line is 3-5mm.

6. The method for testing V-CUT capable of avoiding the wire residue on the PCB as claimed in claim 1, wherein in step S4, when the test fixture is connected to the PCB, two pairs of test terminals employ different test probes.