CN115548201A - Infrared light-emitting diode packaging structure and packaging method - Google Patents
Infrared light-emitting diode packaging structure and packaging method Download PDFInfo
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- CN115548201A CN115548201A CN202210436089.0A CN202210436089A CN115548201A CN 115548201 A CN115548201 A CN 115548201A CN 202210436089 A CN202210436089 A CN 202210436089A CN 115548201 A CN115548201 A CN 115548201A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 22
- 230000000149 penetrating effect Effects 0.000 claims abstract description 7
- 238000012360 testing method Methods 0.000 claims abstract description 3
- 230000003044 adaptive effect Effects 0.000 claims description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
The invention discloses an infrared light emitting diode packaging structure, comprising: the chip is arranged on the light reflecting inclined plane, and the packaging shell is arranged on the light reflecting inclined plane and outside the chip. The packaging method of the packaging structure comprises the following steps: penetrating the insulating layer so that the lead is fixed at the penetrated position of the insulating layer; fixing the reflecting inclined plane above the insulating layer; the light reflecting slope is penetrated, and the penetrated position of the light reflecting slope corresponds to the penetrated position of the insulating layer; fixing the chip on the reflecting inclined plane, wherein a pin arranged below the chip is positioned in a penetrated position of the reflecting inclined plane and is electrically connected with the lead; encapsulating the light reflecting inclined plane and the chip to form an encapsulating shell; cutting a plurality of package bodies existing on the insulating layer; and testing the packaging body. The problem of current diode adopt transparent to glue when integrative pouring, be difficult for fixing a position the core part that chip, pin in the diode are constituteed for the diode yields is not high is solved.
Description
Technical Field
The invention relates to the technical field of diodes, in particular to an infrared light-emitting diode packaging structure and a packaging method.
Background
A diode, also called a crystal diode, is called a diode for short, and is an electronic device with unidirectional conduction current. The electronic device has a PN junction and two lead terminals in the semiconductor diode, and has a unidirectional current transfer property according to the direction of an applied voltage. Generally, a crystal diode is a p-n junction interface formed by sintering a p-type semiconductor and an n-type semiconductor. Space charge layers are formed on two sides of the interface to form a self-established electric field. When the applied voltage is equal to zero, the diffusion current and the drift current caused by the self-established electric field are equal and in an electric balance state due to the concentration difference of carriers on both sides of the p-n junction, which is also the characteristic of the diode in a normal state. Semiconductor diodes are used in almost all electronic circuits, and play an important role in many circuits and are also very widely used.
The conventional diode is generally formed by integrally pouring transparent sealing glue, and when the diode is poured, a core component consisting of a chip, pins and radiating fins in the diode is difficult to position, so that the yield of the diode is low.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides an infrared light-emitting diode packaging structure and a packaging method, which solve the problem that when the prior diode in the background art is integrally cast by adopting transparent sealing glue, the core part consisting of a chip and a pin in the diode is not easy to position, so that the yield of the diode is low.
In order to achieve the purpose, the invention is realized by the following technical scheme: an infrared light emitting diode packaging structure, includes the encapsulation body, the encapsulation body includes: the chip is arranged on the light reflecting inclined plane, and packaging shells are arranged on the light reflecting inclined plane and outside the chip.
Preferably, a pin is arranged below the chip and electrically connected with the chip.
Preferably, an insulating layer is arranged below the reflecting inclined plane, and the packaging shell is filled between the insulating layer and the lower surface of the reflecting inclined plane.
Preferably, the pin penetrates through the light reflecting slope, a lead is arranged on the insulating layer, and the lead penetrates through the insulating layer and is electrically connected with the pin.
Preferably, the insulating layer is an epoxy glass fiber cloth laminated board.
Preferably, the light reflecting inclined plane is coated with titanium dioxide paint.
A packaging method of an infrared light emitting diode packaging structure comprises the following steps:
the method comprises the following steps: penetrating the insulating layer so that the lead is fixed at the penetrated position of the insulating layer;
step two: fixing the reflecting inclined plane above the insulating layer;
step three: the light reflecting inclined plane is penetrated, and the penetrated position of the light reflecting inclined plane corresponds to the penetrated position of the insulating layer;
step four: fixing the chip on the reflecting inclined plane, wherein a pin arranged below the chip is positioned in a penetrated position of the reflecting inclined plane and is electrically connected with the lead;
step five: encapsulating the light reflecting inclined plane and the chip to form an encapsulating shell;
step six: cutting a plurality of package bodies existing on the insulating layer;
step seven: and testing the packaging body.
Preferably, the sixth step uses an adaptive cutting device to cut the package bodies on the insulating layer.
Preferably, the adaptive cutting device comprises:
the cutting machine comprises a rack, a linear motor output end, a support rod, a first sliding groove, a first rotating shaft, a telescopic sleeve, a linkage rod, a sliding block, a second sliding groove and a cutting piece;
the rack is driven to move by a driving device;
the linear motor is fixedly connected to the rack;
the upper end of the rack is provided with the first sliding groove, and the first rotating shaft slides left and right along the first sliding groove;
the plurality of support rods are rotationally connected through the first rotating shaft;
the first rotating shaft positioned at the left end of the rack is fixedly connected with the rack, and the first rotating shaft positioned at the left end of the rack is fixedly connected with the left end of the output end of the linear motor;
the right end of the output end of the linear motor is connected with the linear motor;
the first rotating shafts are rotatably connected with the telescopic sleeves, and the telescopic sleeves are sleeved on the periphery of the upper end of the linkage rod;
the second sliding chute is arranged at the lower end of the rack;
the middle section of the linkage rod is fixedly connected with the sliding block, and the sliding block is connected in the second sliding groove in a left-right sliding mode;
the lower end of the linkage rod is fixedly connected with the cutting piece.
Preferably, the cutting member includes:
the cutting machine comprises a first fixing rod, a second fixing rod, a cavity, a first fixing plate, a second fixing plate, a first articulated element, a spring, a telescopic rod, a second articulated element, a third fixing rod, an articulated shaft, a second rotating shaft and a cutting tool bit;
the upper end of the first fixed rod is fixedly connected with the lower end of the linkage rod, and the lower end of the first fixed rod is fixedly connected with the upper end of the second fixed rod;
the first fixing rod is provided with the cavity, and the second fixing rod penetrates through the cavity;
the second fixing rod is fixedly connected with the upper end of the third fixing rod, and the third fixing rod is arc-shaped;
the second fixing plate is fixedly connected to the lower side of the first fixing plate;
the middle section of the third fixing rod is rotatably connected with the second fixing plate through the hinge shaft;
the upper surface of the lower end of the third fixed rod is fixedly connected with the second hinge;
the lower surface of the first fixing plate is fixedly connected with the first hinge;
the telescopic rod is rotatably connected between the first hinge part and the second hinge part, the spring is sleeved outside the telescopic rod, and the spring is respectively fixed at the lower end of the first hinge part and the upper end of the second hinge part;
the lower end of the second fixing plate is rotatably connected with the cutting tool bit through the second rotating shaft.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of an arrangement of package bodies according to the present invention;
FIG. 3 is a bottom view of the main body structure of the present invention;
FIG. 4 is a schematic structural diagram of an adaptive cutting device according to the present invention;
FIG. 5 is a schematic view of the structure of the cutting member of the present invention.
In the figure: 1. a package body; 2. packaging the shell; 3. a light reflecting slope; 4. a chip; 5. a pin; 6. a lead wire; 7. an insulating layer; 8. a self-adaptive cutting device; 9. an insulating coating device; 801. a frame; 802. a linear motor; 803. an output end of the linear motor; 804. a stay bar; 805. a first chute; 806. a first rotating shaft; 807. a telescopic sleeve; 808. a linkage rod; 809. a slider; 810. a second chute; 811. cutting the piece; 81101. a first fixing lever; 81102. a second fixing bar; 81103. a void; 81104. a first fixing plate; 81105. a second fixing plate; 81106. a first hinge member; 81107. a spring; 81108. a telescopic rod; 81109. a second hinge member; 81110. a third fixing bar; 81111. hinging a shaft; 81112. a second rotating shaft; 81113. a cutting head.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example 1
Referring to fig. 1-3, the present invention provides a technical solution: an infrared light emitting diode packaging structure comprises a packaging body 1, wherein the packaging body 1 comprises: the LED chip comprises an encapsulation shell 2, a light reflecting inclined plane 3 and a chip 4, wherein the chip 4 is arranged on the light reflecting inclined plane 3, and the encapsulation shell 2 is arranged on the light reflecting inclined plane 3 and outside the chip 4.
Preferably, a pin 5 is disposed below the chip 4, and the pin 5 is electrically connected to the chip 4.
Preferably, an insulating layer 7 is arranged below the reflecting inclined plane 3, and the packaging shell 2 is filled between the insulating layer 7 and the lower surface of the reflecting inclined plane 3.
Preferably, the pin 5 penetrates through the light reflecting slope 3, a lead 6 is arranged on the insulating layer 7, and the lead 6 penetrates through the insulating layer 7 and is electrically connected with the pin 5.
Preferably, the insulating layer 7 is an epoxy glass fiber cloth laminate.
Preferably, the reflective inclined plane 3 is coated with titanium dioxide paint.
A packaging method of an infrared light emitting diode packaging structure comprises the following steps:
the method comprises the following steps: penetrating the insulating layer 7 so that the lead 6 is fixed to the penetrated portion of the insulating layer 7;
step two: fixing the reflecting inclined plane 3 above the insulating layer 7;
step three: the light reflecting inclined plane 3 is penetrated, and the penetrated position of the light reflecting inclined plane 3 corresponds to the penetrated position of the insulating layer 7;
step four: fixing a chip 4 on the reflecting inclined surface 3, wherein a pin 5 arranged below the chip 4 is positioned in a penetrated position of the reflecting inclined surface 3, and the pin 5 is electrically connected with a lead 6;
step five: encapsulating the reflecting inclined plane 3 and the chip 4 to form an encapsulating shell 2;
step six: cutting a plurality of package bodies 1 existing on the insulating layer 7;
step seven: the package body 1 is tested.
The working principle and the beneficial effects of the scheme are as follows: punching insulating layer 7 and running through, make lead wire 6 be fixed in on insulating layer 7, be fixed in on insulating layer 7 with reflection of light inclined plane 3 again, punch and run through reflection of light inclined plane 3, and reflection of light inclined plane 3 is run through the position and is corresponded by the department position of running through with insulating layer 7, be fixed in on the reflection of light inclined plane 3 with chip 4, pour the embedment to it at last, when having solved current emitting diode and adopting transparent to seal a glue an organic whole to pour, be difficult for fixing a position the core part of chip 4 in the diode, pin 5 constitution, make the problem that the diode yields is not high.
And the light reflecting inclined plane 3 is arranged to gather the light emitted by the chip 4, so that the optical performance of the diode is ensured to be more excellent.
Example 2
Referring to fig. 4, based on embodiment 1, the sixth step uses an adaptive cutting device 8 to cut the package bodies 1 on the insulating layer 7.
The adaptive cutting device 8 comprises:
the device comprises a rack 801, a linear motor 802, a linear motor output end 803, a support rod 804, a first sliding groove 805, a first rotating shaft 806, a telescopic sleeve 807, a linkage rod 808, a sliding block 809, a second sliding groove 810 and a cutting piece 811;
the machine frame 801 is driven to move by a driving device;
the linear motor 802 is fixedly connected to the rack 801;
the upper end of the rack 801 is provided with the first sliding chute 805, and the first rotating shaft 806 slides left and right along the first sliding chute 805;
a plurality of the supporting rods 804 are rotatably connected through the first rotating shaft 806;
the first rotating shaft 806 positioned at the left end of the rack 801 is fixedly connected with the rack 801, and the first rotating shaft 806 positioned at the left end of the rack 801 is fixedly connected with the left end of the output end 803 of the linear motor;
the right end of the output end 803 of the linear motor is connected with the linear motor 802;
the first rotating shafts 806 are rotatably connected with the telescopic sleeves 807, and the telescopic sleeves 807 are sleeved on the periphery of the upper ends of the linkage rods 808;
the second chute 810 is arranged at the lower end of the rack 801;
the slider 809 is fixedly connected to the middle section of the linkage rod 808, and the slider 809 is connected to the second sliding groove 810 in a left-right sliding manner;
the lower end of the linkage rod 808 is fixedly connected with the cutting part 811.
The working principle and the beneficial effects of the scheme are as follows: the packaging bodies 1 on the insulating layer 7 are cut, so that the diodes are divided into single parts, and when the packaging bodies 1 are cut, the sizes of the packaging bodies 1 can change along with different models and batches, and the cutting devices for the insulating layer 7 and the packaging bodies 1 also change along with the cutting devices, so that the operation is increased, and the efficiency is reduced;
by using the adaptive cutting device 8, the linear motor 802 and the output end 803 of the linear motor act on the first rotating shaft 806 at the right end of the rack 801, so that the first rotating shaft 806 slides in the first sliding chute 805, and because the first rotating shaft 806 at the left end of the rack 801 is fixed with the rack 801, in the process that the first rotating shaft 806 at the right end of the rack 801 is moved by the action of the linear motor 802, the first rotating shaft 806 at the left end of the rack 801 and the first rotating shaft 806 at the right end of the rack 801 move along with the first rotating shaft 806, and the distance between two adjacent first rotating shafts 806 is always equal, under the action of the linear motor 802, the distance between the cutting pieces 811 connected by the telescopic sleeve 807 and the link lever 808 on two adjacent first rotating shafts 806 is also equal, and when the distance between the cutting pieces 811 is adjusted, the insulating layer 7 and the packaging body 1 are cut, so that the operation time is reduced and the efficiency is improved;
connect through telescopic sleeve 807, trace 808, conveniently dismantle the maintenance to trace 808, cutting member 811 whole.
Example 3
Referring to fig. 5, in the embodiment 1-2, the cutting member 811 includes:
a first fixing rod 81101, a second fixing rod 81102, a hollow 81103, a first fixing plate 81104, a second fixing plate 81105, a first hinge 81106, a spring 81107, a telescopic rod 81108, a second hinge 81109, a third fixing rod 81110, a hinge shaft 81111, a second rotating shaft 81112 and a cutting head 81113;
the upper end of the first fixed rod 81101 is fixedly connected with the lower end of the linkage 808, and the lower end of the first fixed rod 81101 is fixedly connected with the upper end of the second fixed rod 81102;
the first fixing plate 81104 is provided with the hollow 81103, and the second fixing rod 81102 penetrates through the hollow 81103;
the second fixing rod 81102 is fixedly connected with the upper end of the third fixing rod 81110, and the third fixing rod 81110 is arc-shaped;
the second fixing plate 81105 is fixedly connected to the lower side of the first fixing plate 81104;
the middle section of the third fixing rod 81110 is rotatably connected with the second fixing plate 81105 through the hinge shaft 81111;
the upper surface of the lower end of the third fixing rod 81110 is fixedly connected with the second hinge 81109;
the lower surface of the first fixing plate 81104 is fixedly connected with the first hinge 81106;
the telescopic rod 81108 is rotatably connected between the first hinge part 81106 and the second hinge part 81109, the spring 81107 is sleeved outside the telescopic rod 81108, and the spring 81107 is respectively fixed at the lower end of the first hinge part 81106 and the upper end of the second hinge part 81109;
the lower end of the second fixing plate 81105 is rotatably connected with the cutting head 81113 through the second rotating shaft 81112.
The working principle and the beneficial effects of the scheme are as follows: when the cutting part 811 cuts the insulating layer 7 and the package body 1, the cutting tool bit 81113 contacts the insulating layer 7, the cutting tool bit 81113 is stressed, the first fixing plate 81104 is driven, the second fixing plate 81105 deflects around the hinge shaft 81111, in the process, the telescopic rod 81108 is shortened, the spring 81107 is compressed, the second fixing rod 81102 moves in the cavity 81103, the stress is compressed through the spring 81107, the cutting tool bit 81113 is guaranteed to be always stressed in the cutting engineering of the insulating layer 7, idling of equipment in the cutting engineering is effectively avoided, and the cutting effect of the cutting tool bit 81113 on the insulating layer 7 is guaranteed.
Example 4
On the basis of the embodiments 1 to 3, the present invention further includes a diode state detection device, the diode state detection device including:
a current sensor for detecting a current through the diode;
a voltage sensor for detecting a voltage applied to the diode;
the first timer is used for recording the electrifying duration of the diode;
the second timer is used for recording the existence duration of the diode;
the alarm is used for alarming;
the controller, the controller respectively with current sensor, voltage sensor, first time-recorder, second time-recorder, alarm electric connection, the controller is based on current sensor, voltage sensor, first time-recorder, the work of second time-recorder control alarm include:
step 1: the controller obtains a state effect index of the diode based on the first timer, the second timer and formula (1):
wherein A is the state effect index of the diode, t 1 The duration of the diode current, t, recorded for the first timer 2 The duration of the diode's presence, t, recorded for the second timer 0 Is unit time length, e is a natural constant, and the value is 2.72;
step 2: the controller calculates a diode state index based on the current sensor, voltage sensor, counter, and equation (2):
where B is the diode state index, I is the current through the diode as detected by the current sensor, U is the voltage applied to the diode as detected by the voltage sensor, and W is the voltage applied to the diode as detected by the voltage sensor 1 The rated power of the diode, W the maximum power of the diode and delta the electro-optic conversion efficiency of the diode;
and when the diode state index is smaller than the corresponding preset reference value, the controller controls an alarm to give an alarm.
In the formula (I), the compound is shown in the specification,
the state effect index of the diode is derived based on the time the diode is in different states,
when the power of the diode is higher than the maximum power of the diode, the diode is burnt out, and the state index of the diode is 0.
Suppose that the first timer records the power-on time period t of the diode 1 =3000min, the duration t of the diode's presence recorded by the second timer 2 =50000min, unit time length t 0 If the natural constant e =2.72 is =1min, the state effect index a =1 of the diode can be calculated as described above.
The current I =0.1A passing through the diode detected by the current sensor, the voltage U =5V acting on the diode detected by the voltage sensor, and the rated power W of the diode 1 The diode state index B =2.134 (three digits after the decimal point is taken) is obtained through calculation according to a formula (2), the calculated diode state index B =2.134 does not exceed a preset reference value 1, and at the moment, the controller does not control the alarm to give an alarm prompt.
The beneficial effects of the above technical scheme are: the method comprises the steps that a first timer is arranged for recording the electrifying time of a diode, a second timer is arranged for recording the existence time of the diode, the electrifying time of the diode recorded by the first timer, the existence time of the diode recorded by the second timer and a formula (1) are used for calculating to obtain the state effect index of the diode, meanwhile, a current sensor is arranged for detecting the current passing through the diode, a voltage sensor is arranged for detecting the voltage acting on the diode, then the diode state index can be calculated according to the calculation result of the formula (1), the current passing through the diode detected by the current sensor, the voltage acting on the diode detected by the voltage sensor and the formula (2), and when the diode state index is smaller than a preset reference value, the controller controls an alarm to give an alarm to inform a user, the alarm is controlled by the controller, and intelligence is increased.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. An infrared light emitting diode packaging structure is characterized in that:
comprising a package body (1), said package body (1) comprising: the LED packaging structure comprises a packaging shell (2), a light-reflecting inclined plane (3) and a chip (4), wherein the chip (4) is arranged on the light-reflecting inclined plane (3), and the packaging shell (2) is arranged on the light-reflecting inclined plane (3) and outside the chip (4).
2. The infrared light emitting diode package structure of claim 1, wherein:
and a pin (5) is arranged below the chip (4), and the pin (5) is electrically connected with the chip (4).
3. The infrared light emitting diode package structure of claim 2, wherein:
an insulating layer (7) is arranged below the reflecting inclined plane (3), and the packaging shell (2) is filled between the insulating layer (7) and the lower surface of the reflecting inclined plane (3).
4. The infrared light emitting diode package structure of claim 3, wherein:
the pin (5) penetrates through the light reflecting inclined plane (3), a lead (6) is arranged on the insulating layer (7), and the lead (6) penetrates through the insulating layer (7) and is electrically connected with the pin (5).
5. The infrared light emitting diode package structure of claim 3, wherein:
the insulating layer (7) is an epoxy glass fiber cloth laminated board.
6. The infrared light emitting diode package structure of claim 3, wherein:
the reflecting inclined plane (3) is coated with titanium dioxide paint.
7. A method for encapsulating an infrared light emitting diode encapsulation structure according to any one of claims 1 to 6, wherein: the packaging method comprises the following steps:
the method comprises the following steps: penetrating the insulating layer (7) so that the lead (6) is fixed at the part where the insulating layer (7) is penetrated;
step two: fixing the reflecting inclined plane (3) above the insulating layer (7);
step three: the light reflecting slope (3) penetrates through the light reflecting slope, and the penetrating position of the light reflecting slope (3) corresponds to the penetrating position of the insulating layer (7);
step four: the chip (4) is fixed on the reflecting inclined plane (3), the pin (5) arranged below the chip (4) is positioned in the penetrating position of the reflecting inclined plane (3), and the pin (5) is electrically connected with the lead (6);
step five: encapsulating the light reflecting inclined plane (3) and the chip (4) to form an encapsulating shell (2);
step six: cutting a plurality of packaging bodies (1) existing on the insulating layer (7);
step seven: and testing the package body (1).
8. The method of claim 7, wherein:
and step six, cutting the plurality of packaging bodies (1) on the insulating layer (7) by using a self-adaptive cutting device (8).
9. The method of claim 8, wherein:
the adaptive cutting device (8) comprises:
the cutting machine comprises a rack (801), a linear motor (802), a linear motor output end (803), a support rod (804), a first sliding groove (805), a first rotating shaft (806), a telescopic sleeve (807), a linkage rod (808), a sliding block (809), a second sliding groove (810) and a cutting piece (811);
the machine frame (801) is driven to move by a driving device;
the linear motor (802) is fixedly connected to the rack (801);
the upper end of the rack (801) is provided with the first sliding chute (805), and the first rotating shaft (806) slides left and right along the first sliding chute (805);
a plurality of the support rods (804) are rotatably connected through the first rotating shaft (806);
the first rotating shaft (806) positioned at the left end of the rack (801) is fixedly connected with the rack (801), and the first rotating shaft (806) positioned at the left end of the rack (801) is fixedly connected with the left end of the output end (803) of the linear motor;
the right end of the output end (803) of the linear motor is connected with the linear motor (802);
the first rotating shafts (806) are rotatably connected with the telescopic sleeves (807), and the telescopic sleeves (807) are sleeved on the periphery of the upper end of the linkage rod (808);
the second sliding groove (810) is formed in the lower end of the rack (801);
the sliding block (809) is fixedly connected to the middle section of the linkage rod (808), and the sliding block (809) is connected to the second sliding groove (810) in a left-right sliding manner;
the lower end of the linkage rod (808) is fixedly connected with the cutting piece (811).
10. The method of claim 9, wherein:
the cutting member (811) includes:
the device comprises a first fixing rod (81101), a second fixing rod (81102), a hollow hole (81103), a first fixing plate (81104), a second fixing plate (81105), a first hinge (81106), a spring (81107), a telescopic rod (81108), a second hinge (81109), a third fixing rod (81110), a hinge shaft (81111), a second rotating shaft (81112) and a cutting head (81113);
the upper end of the first fixing rod (81101) is fixedly connected with the lower end of the linkage rod (808), and the lower end of the first fixing rod (81101) is fixedly connected with the upper end of the second fixing rod (81102);
the first fixing rod (81104) is provided with the hollow hole (81103), and the second fixing rod (81102) penetrates through the hollow hole (81103);
the second fixing rod (81102) is fixedly connected with the upper end of the third fixing rod (81110), and the third fixing rod (81110) is arc-shaped;
the second fixing plate (81105) is fixedly connected to the lower side of the first fixing plate (81104);
the middle section of the third fixing rod (81110) is rotatably connected with the second fixing plate (81105) through the hinge shaft (81111);
the upper surface of the lower end of the third fixing rod (81110) is fixedly connected with the second hinge part (81109);
the lower surface of the first fixing plate (81104) is fixedly connected with the first hinge part (81106);
the telescopic rod (81108) is rotatably connected between the first hinge part (81106) and the second hinge part (81109), the spring (81107) is sleeved outside the telescopic rod (81108), and the spring (81107) is respectively fixed at the lower end of the first hinge part (81106) and the upper end of the second hinge part (81109);
the lower end of the second fixing plate (81105) is rotatably connected with the cutting head (81113) through the second rotating shaft (81112).
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6625036B1 (en) * | 1999-08-31 | 2003-09-23 | Rohm Co., Ltd. | Infrared data communication module and method of making the same |
| CN102315359A (en) * | 2010-06-29 | 2012-01-11 | 昆山旭扬电子材料有限公司 | LED (light emitting diode) packaging structure for improving optical efficiency |
| CN102646774A (en) * | 2011-02-18 | 2012-08-22 | 奇力光电科技股份有限公司 | Light emitting diode element and manufacturing method thereof |
| KR20130117107A (en) * | 2012-04-17 | 2013-10-25 | 서울반도체 주식회사 | Light emitting diode package |
| KR101632144B1 (en) * | 2015-03-19 | 2016-06-21 | 서승환 | Apparatus and method for led package test |
| KR20180048350A (en) * | 2016-11-02 | 2018-05-10 | 에임큐주식회사 | Aluminum infrared LED having a concave len |
-
2022
- 2022-04-25 CN CN202210436089.0A patent/CN115548201B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6625036B1 (en) * | 1999-08-31 | 2003-09-23 | Rohm Co., Ltd. | Infrared data communication module and method of making the same |
| CN102315359A (en) * | 2010-06-29 | 2012-01-11 | 昆山旭扬电子材料有限公司 | LED (light emitting diode) packaging structure for improving optical efficiency |
| CN102646774A (en) * | 2011-02-18 | 2012-08-22 | 奇力光电科技股份有限公司 | Light emitting diode element and manufacturing method thereof |
| KR20130117107A (en) * | 2012-04-17 | 2013-10-25 | 서울반도체 주식회사 | Light emitting diode package |
| KR101632144B1 (en) * | 2015-03-19 | 2016-06-21 | 서승환 | Apparatus and method for led package test |
| KR20180048350A (en) * | 2016-11-02 | 2018-05-10 | 에임큐주식회사 | Aluminum infrared LED having a concave len |
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Denomination of invention: A packaging structure and packaging method for infrared light-emitting diodes Granted publication date: 20240105 Pledgee: Bank of China Limited by Share Ltd. Heyuan branch Pledgor: Guangdong Xusheng Semiconductor Co.,Ltd. Registration number: Y2024980007312 |
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