CN115543881B

CN115543881B - PCIE (peripheral component interconnect express) equipment adaptation method, PCIE equipment adaptation system, computer equipment and storage medium

Info

Publication number: CN115543881B
Application number: CN202211503953.0A
Authority: CN
Inventors: 李烨
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2022-11-29
Filing date: 2022-11-29
Publication date: 2023-05-02
Anticipated expiration: 2042-11-29
Also published as: CN115543881A

Abstract

The application relates to a PCIE device adaptation method, a system, a computer device and a storage medium, wherein the method comprises the following steps: in response to the server detecting the target PCIE equipment, acquiring target address information corresponding to the target PCIE equipment; obtaining the model of a target temperature sensor matched with target address information from a preset association configuration table according to the target address information; acquiring temperature detection configuration information from a preset association configuration table according to the target address information and the model of the target temperature sensor, and generating a temperature detection instruction according to the temperature detection configuration information; and starting a temperature detection instruction to acquire temperature information of the target PCIE equipment through the target temperature sensor. And automatically realizing the temperature reading adaptation of the PCIE equipment by presetting an associated configuration table, namely, the address information configuration table, the temperature sensor information configuration table and the server topology configuration table, and solving the problem of modifying codes by the BMC when the PCIE equipment is newly added.

Description

PCIE (peripheral component interconnect express) equipment adaptation method, PCIE equipment adaptation system, computer equipment and storage medium

Technical Field

The present invention relates to the field of servers, and in particular, to a PCIE device adaptation method, a PCIE device adaptation system, a PCIE device adaptation computer device, and a PCIE storage medium.

Background

The server includes various PCIE (Peripheral Component Interconnect Express, high-speed serial computer expansion bus standard) devices, such as PCIE devices of various network cards, RAID (Redundant Arrays of Independent Disks, disk array) cards, NVME (NVM Express, nonvolatile memory host controller interface specification) hard disks, and the like.

In normal operation of the server, temperature monitoring needs to be performed on PCIE devices on the server. When the temperature of the PCIE equipment is abnormal, the PCIE equipment with abnormal temperature needs to be radiated through the radiation adjusting system, so that the PCIE equipment with abnormal temperature is recovered to be normal. In the prior art, a BMC (Baseboard Management Controller ) obtains PCIE device temperature through an I2C protocol, so as to implement PCIE device temperature monitoring management function.

Because the PCIE devices have the above multiple types, each type of PCIE device corresponds to one type of PCIE device configuration, when the PCIE device is adapted on the server and completes entering the test, if a client proposes a new requirement, the PCIE device needs to be added, and therefore, the PCIE device needs to be added, and the BMC needs to be modified with a code again, so that normal temperature monitoring can be performed on the newly added PCIE device.

Disclosure of Invention

Based on the above, the application provides a PCIE device adapting method, a PCIE device adapting system, a PCIE device adapting computer, and a PCIE storage medium, so that temperature information of the PCIE device may be obtained without modifying a BMC code.

In one aspect, a PCIE device adaptation method is provided, where the PCIE device adaptation method includes:

responding to the detection of a target PCIE device by a server, and acquiring target address information corresponding to the target PCIE device;

obtaining the model of a target temperature sensor matched with the target address information from a preset association configuration table according to the target address information;

acquiring temperature detection configuration information from the preset association configuration table according to the target address information and the model of the target temperature sensor, and generating a temperature detection instruction according to the temperature detection configuration information;

starting the temperature detection instruction to acquire temperature information of the target PCIE equipment through the target temperature sensor;

the target address information is address information of a target PCIE slot connected to the target PCIE device.

In one embodiment, the preset association configuration table includes an address information configuration table, a temperature sensor information configuration table, and a server topology configuration table, and before the server detects the target PCIE device, the method further includes:

And establishing association inquiry logic for the address information configuration table, the temperature sensor information configuration table and the server topology configuration table to generate a preset association configuration table carrying the association inquiry logic.

In one embodiment, establishing the association query logic for the address information configuration table, the temperature sensor information configuration table and the server topology configuration table includes:

establishing an association inquiry logic through a first same field by using an address information configuration table and a temperature sensor information configuration table in the preset association configuration table;

and establishing association query logic through a second same field by the address information configuration table and the server topology configuration table in the preset association configuration table.

In one embodiment, the address information configuration table includes a model number of the PCIE device, an address and model number of the target temperature sensor, and target address information;

one of the target address information corresponds to a model of one of the target temperature sensors, a model of one of the PCIE devices, and an address of one of the target temperature sensors.

In one embodiment, the temperature sensor information configuration table includes a model number, a command, and a read size of the target temperature sensor.

Wherein, the model of a target temperature sensor corresponds to a command and to a read size.

In one embodiment, the server topology configuration table includes the destination address information, bus information, and channel information;

wherein one target address information corresponds to one bus information and one channel information.

In one embodiment, before the response to the detection of the target PCIE device by the server, the method further includes:

storing the preset association configuration table for establishing association query logic in a database associated with a baseboard management controller;

and forming an address information list by the slot address information corresponding to the PCIE equipment slot, and storing the address information list in a basic input and output system.

receiving a starting-up instruction of a server, and executing PCIE equipment detection to detect whether new PCIE equipment is connected in a PCIE equipment slot on the server;

if PCIE equipment is connected in the PCIE equipment slots on the server, determining the PCIE equipment as the target PCIE equipment, and determining the slots connected with the PCIE equipment as the target PCIE slots;

The obtaining the target address information corresponding to the target PCIE device includes:

and positioning the address information of the target PCIE slot from an address information list in the basic input and output system, and determining the address information of the target PCIE slot as the target address information.

In one embodiment, the obtaining, according to the target address information, the model of the target temperature sensor corresponding to the target address information from a preset association configuration table includes:

acquiring the address information configuration table preset association configuration table from a database associated with a baseboard management controller;

and acquiring the model of the target temperature sensor corresponding to the target address information from the address information configuration table according to the target address information.

In one embodiment, the obtaining the temperature detection configuration information from the preset association configuration table according to the target address information and the model of the target temperature sensor includes:

performing association inquiry on the address information configuration table and the temperature sensor information configuration table according to the association inquiry logic so as to acquire first temperature detection configuration information from the temperature sensor information configuration table according to the model of the target temperature sensor;

Wherein the first temperature detection configuration information includes a command address and a read size corresponding to a model of the target temperature sensor.

In one embodiment, the obtaining the temperature detection configuration information from the preset association configuration table according to the target address information and the model of the target temperature sensor further includes:

performing association inquiry on the address information configuration table and the server topology configuration table according to the association inquiry logic so as to acquire second temperature detection configuration information from the server topology configuration table according to the target address information;

wherein the second temperature detection configuration information includes bus information and channel information corresponding to the target address information.

and generating the temperature detection configuration information through the first temperature detection configuration information and the second temperature detection configuration information.

In one embodiment, the temperature detection instruction stores the temperature detection configuration information, and the starting the temperature detection instruction to obtain, by the target temperature sensor, the temperature information of the target PCIE device includes:

And starting the temperature detection instruction, and sending the temperature detection instruction carrying the temperature detection configuration information to the target temperature sensor so as to acquire the temperature information of the target PCIE equipment through the target temperature sensor.

In one embodiment, after obtaining the temperature information of the target PCIE device through the target temperature sensor, the method includes:

acquiring temperature reference information corresponding to the target PCIE equipment;

and comparing the temperature information of the target PCIE equipment with corresponding temperature reference information thereof, so as to control heat dissipation of the target PCIE equipment according to a comparison result.

In one embodiment, the temperature information of the target PCIE device is a real-time temperature value of the target PCIE device, and comparing the temperature information of the target PCIE device with corresponding temperature reference information includes:

acquiring a temperature reference value corresponding to the target PCIE equipment;

and comparing the real-time temperature value of the target PCIE equipment with a corresponding temperature reference value thereof, so as to control heat dissipation of the target PCIE equipment according to a comparison result.

In one embodiment, comparing the real-time temperature value of the target PCIE device with the temperature reference value corresponding to the real-time temperature value of the target PCIE device, so as to perform heat dissipation control on the target PCIE device according to a comparison result, the method includes:

If the real-time temperature value of the target PCIE equipment is smaller than the corresponding temperature reference value, subtracting the real-time temperature value from the temperature reference value of the target PCIE equipment to obtain a first difference value;

and acquiring heat dissipation adjustment logic corresponding to the first difference value so as to adjust the rotating speed of the fan assembly of the target PCIE equipment.

In one embodiment, comparing the real-time temperature value of the target PCIE device with the temperature reference value corresponding to the real-time temperature value of the target PCIE device, so as to perform heat dissipation control on the target PCIE device according to the comparison result, further includes:

if the real-time temperature value of the target PCIE equipment is larger than the corresponding temperature reference value, subtracting the temperature reference value from the real-time temperature value of the target PCIE equipment to obtain a second difference value;

and acquiring heat dissipation adjustment logic corresponding to the second difference value so as to adjust the rotating speed of the fan assembly of the target PCIE equipment.

In one embodiment, the temperature information of the target PCIE device is a temperature rise rate of the target PCIE device, and comparing the temperature information of the target PCIE device with corresponding temperature reference information of the target PCIE device, so as to perform heat dissipation control on the target PCIE device according to a comparison result, including:

The baseboard management controller obtains a temperature rise rate reference value corresponding to the target PCIE equipment, and compares the temperature rise rate of the target PCIE equipment with the temperature rise rate reference value;

and if the temperature rise rate of the target PCIE equipment exceeds the temperature rise rate reference value, adjusting the rotating speed of the fan assembly according to the corresponding heat dissipation adjustment logic.

In another aspect, a PCIE device adaptation system is provided, the system comprising:

the target address information module is used for responding to the detection of the target PCIE equipment by the server and obtaining target address information matched with the target PCIE equipment;

the preset association configuration table module is used for acquiring the model of the target temperature sensor corresponding to the target address information from the preset association configuration table according to the target address information;

the temperature detection instruction module is used for acquiring temperature detection configuration information from the preset association configuration table according to the target address information and the model of the target temperature sensor, and generating a temperature detection instruction according to the temperature detection configuration information;

the target temperature sensor module is used for starting the temperature detection instruction so as to acquire the temperature information of the target PCIE equipment through the target temperature sensor;

In yet another aspect, a computer device is provided comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor implementing the steps of:

and starting the temperature detection instruction to acquire the temperature information of the target PCIE equipment through the target temperature sensor.

In yet another aspect, there is provided a computer-readable storage medium storing a program which, when executed by a processor, causes the processor to perform the steps of:

Compared with the prior art, the technical scheme of the application has the following advantages:

according to the PCIE equipment adaptation method, the system, the computer equipment and the storage medium, the temperature reading adaptation of the PCIE equipment can be automatically realized through the preset association configuration table, namely the association inquiry of the address information configuration table, the temperature sensor information configuration table and the server topology configuration table, so that the problem that the BMC modifies codes when the PCIE equipment is newly added is solved, and the efficiency is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a flowchart of a first method of PCIE device adaptation method provided in an embodiment of the present application;

fig. 2 is a second method flowchart of a PCIE device adaptation method provided in an embodiment of the present application;

fig. 3 is a system structural diagram of a PCIE device adaptation system provided in an embodiment of the present application;

fig. 4 is a device configuration diagram of a computer device provided in an embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

Embodiment one:

referring to fig. 1, fig. 1 is a flowchart of a first method of PCIE device adaptation method provided in an embodiment of the present application.

The method comprises the following steps:

s101, responding to a server to detect a target PCIE device, and acquiring target address information corresponding to the target PCIE device;

specifically, when the PCIE device is inserted into the motherboard on the server, the server can detect the PCIE device inserted into the motherboard, which is called a target PCIE device. After the server detects the target PCIE equipment, the server responds to the detection of the target PCIE equipment to acquire target address information corresponding to the target PCIE equipment, so that the model of the matched target temperature sensor is acquired by carrying out association query through a preset association configuration table according to the target address information.

S102, acquiring the model of a target temperature sensor matched with target address information from a preset association configuration table according to the target address information;

specifically, after the target address information corresponding to the target PCIE device is obtained, the preset association configuration table may be obtained through the target address information to perform association query, so that a model of the target temperature sensor matched with the target PCIE device is obtained from the preset association configuration table.

S103, acquiring temperature detection configuration information from the preset association configuration table according to the target address information and the model of the target temperature sensor, and generating a temperature detection instruction according to the temperature detection configuration information;

specifically, after the model of the target temperature sensor matched with the target PCIE device is obtained, association query is performed again in a preset association configuration table in combination with the target address information and the information of the target temperature sensor, so that final temperature detection configuration information can be obtained, and a temperature detection instruction is generated through the temperature detection configuration information.

S104, starting the temperature detection instruction to acquire temperature information of the target PCIE equipment through the target temperature sensor;

Specifically, after the temperature detection instruction is generated, the temperature detection instruction is started so as to acquire the temperature information of the target PCIE device through the target temperature sensor, and the temperature acquisition operation of the newly added PCIE device is completed.

The PCIE device is inserted into the PCIE slot, the target PCIE device is determined, the slot into which the target PCIE device is inserted is the target PCIE slot, and the address where the target PCIE slot is located is the target address information corresponding to the target PCIE device.

Specifically, the preset association configuration table includes three association lookup tables, namely an address information configuration table, a temperature sensor information configuration table and a server topology configuration table, and corresponding association lookup logic is established between the three association lookup tables, so that the address of the target temperature sensor can be determined through the target address information, and the temperature information of the target PCIE device connected with the target PCIE slot can be acquired through the target temperature sensor.

specifically, corresponding association query logic needs to be established between the three association query tables, the same fields exist between one association query table and the other two association query tables in the three association query tables, further, the association query logic is established through the first same fields by presetting the address information configuration table and the temperature sensor information configuration table in the association configuration table, and the three association query tables shown in tables 1-3, wherein the first same field for establishing the association query logic by the address information configuration table and the temperature sensor information configuration table is "devicetype".

Specifically, an address information configuration table and a server topology configuration table in the preset association configuration table establish association query logic through a second same field, such as three association query tables shown in tables 1-3, wherein the second same field of the association query logic established by the address information configuration table and the temperature sensor information configuration table is "location".

Table 1 address information configuration table

Wherein, "name" represents the model of the target PCIE device;

"slave" represents the address of the target temperature sensor;

"evicetype" indicates the model number of the target temperature sensor;

"location" indicates destination address information.

Table 2 address information configuration table

Wherein "command" represents a command to be written to a register of the target temperature sensor;

"readlength" means the data size to be read from the register of the target temperature sensor.

Table 3 address information configuration table

Wherein, "bus" represents bus information for sending a temperature detection instruction to a target temperature sensor;

"channel" indicates channel information for transmitting a temperature detection instruction to the target temperature sensor.

specifically, as shown in table 1 above, the address information configuration table includes the model of the PCIE device, the address "slave" and the model "evicetype" of the target temperature sensor, and the target address information "location".

Specifically, as shown in the above table 2, the temperature sensor information configuration table includes the model "evicetype", command "and read size" readlength "of the target temperature sensor.

Wherein, the model of a target temperature sensor corresponds to a command address and a read size.

specifically, as shown in the above table 3, the server topology configuration table includes the target address information "location", the bus information "bus", and the channel information "channel".

specifically, before detecting whether the target PCIE slot is connected to the target PCIE device, a preset association configuration table is prepared in advance, where contents of the preset association configuration table include address information of all PCIE slots that may occur on the motherboard, that is, target address information, and one target address information corresponds to a model of one target temperature sensor, a model of one PCIE device, and an address of one target temperature sensor; the model of a target temperature sensor corresponds to a command and to a read size; one target address information corresponds to one bus information and one channel information. It is therefore necessary to store all of the above into a preset association configuration table, which is then stored into a database associated with the baseboard management controller.

Specifically, the preset association configuration table is stored in a database associated with the baseboard management controller, and address information of a slot corresponding to the PCIE device slot is required to form an address information list, and the address information list is stored in the basic input/output system, so that when the server is started, the target address information can be located from the address information list through the basic input/output system.

receiving a starting-up instruction of a server, and executing PCIE equipment detection to detect whether new PCIE equipment is connected in PCIE equipment slots on the server;

specifically, the overall PCIE device adapting method starts from the start of the server, after the start of the server, the start instruction of the server is received, and then the detection operation of the PCIE device is started to be executed, so as to detect whether a new PCIE device is connected in a PCIE device slot on the server, including the situation that the PCIE device is replaced.

specifically, after detection, if a new PCIE device is connected to a PCIE device slot on the server, it is indicated that the client inserts a new PCIE device (one or more PCIE devices) on the motherboard, or replaces an original PCIE device (one or more PCIE devices), in this case, the PCIE device needs to be determined as a target PCIE device, and a slot connected to the PCIE device needs to be determined as a target PCIE slot.

Specifically, after determining the target PCIE slot, the stored address information list is obtained from the basic input/output system, and then address information of the target PCIE slot (address information of one or more target PCIE slots) is located from the address information list, and the address information of the target PCIE slot is determined as target address information.

acquiring the address information configuration table from a database associated with a baseboard management controller;

specifically, the baseboard management controller is connected with a database, and the preset association configuration table is stored in the database connected with the baseboard management controller, so that the baseboard management controller can acquire the preset association configuration table from the database associated with the baseboard management controller, and determine the address information configuration table from the preset association configuration table.

Specifically, after the target address information and the address information configuration table are acquired, the model of the target temperature sensor corresponding to the target address information can be acquired from the address information configuration table according to the target address information.

specifically, after the target address information and the model of the target temperature sensor are obtained, the address information configuration table and the temperature sensor information configuration table are subjected to association query according to association query logic, and first temperature detection configuration information can be obtained from the temperature sensor information configuration table according to the model of the target temperature sensor through a first same field (devicetype) in the address information configuration table and the temperature sensor information configuration table.

Wherein the first temperature detection configuration information includes a command and a read size corresponding to a model of the target temperature sensor.

Specifically, the command is a command that needs to be written into a register of the target temperature sensor, and the read size is a data size that needs to be read from the register of the target temperature sensor.

specifically, after the first temperature detection configuration information is obtained from the temperature sensor information configuration table according to the model of the target temperature sensor, the association query is needed again, the address information configuration table and the server topology configuration table are subjected to the association query according to the association query logic, and the second temperature detection configuration information can be obtained from the temperature sensor information configuration table according to the model of the target temperature sensor through the second same field (location) in the association query logic.

Specifically, the bus information is a bus when a temperature detection instruction is sent to the target temperature sensor, and the channel is a channel when a temperature detection instruction is sent to the target temperature sensor.

Specifically, after the first temperature detection configuration information and the second temperature detection configuration information are obtained, the temperature detection configuration information is generated through the first temperature detection configuration information and the second temperature detection configuration information, so that a temperature detection instruction carrying the temperature detection configuration information is generated.

Specifically, the temperature detection instruction carries temperature detection configuration information, the temperature detection instruction carrying the temperature detection configuration information is sent to the target temperature sensor, and the target temperature sensor can acquire the temperature information of the target PCIE device according to the temperature detection instruction.

In one embodiment, the temperature detection instruction is:

I2C-test -b < bus number > -s < slave > -rc < read count > -m 1 -d < data >。

specifically, the temperature detection instruction adopts an I2C command, wherein b represents a bus number; s represents the address of the target temperature sensor; rc represents the data size of the register of the read target temperature sensor; m represents that the register of the target temperature sensor can be read and written; d represents an instruction to be written into a register of the target temperature sensor. The address of the target temperature sensor already contains channel information, i.e. the command is sent to the target temperature sensor via the target channel.

In one embodiment, after obtaining the temperature information of the target PCIE device by the target temperature sensor, the method includes:

specifically, to perform heat dissipation control, the baseboard management controller needs to acquire temperature reference information corresponding to the target PCIE device.

Specifically, after the baseboard management controller obtains the temperature reference information corresponding to the target PCIE device, the temperature information of the target PCIE device is compared with the temperature reference information corresponding to the temperature reference information, so as to perform heat dissipation control on the target PCIE device according to a comparison result. If the heat dissipation capability far exceeds the heat dissipation requirement of the target PCIE device, the heat dissipation capability needs to be reduced; if the heat dissipation capability is insufficient to meet the heat dissipation requirement of the target PCIE device, the heat dissipation capability needs to be improved.

specifically, the temperature information of the target PCIE device may be a real-time temperature value or a temperature rise rate. When the temperature information of the target PCIE device is a real-time temperature value of the target PCIE device, the baseboard management controller needs to obtain a temperature reference value corresponding to the target PCIE device.

Specifically, after the real-time temperature value and the corresponding temperature reference value of the target PCIE device are obtained, the real-time temperature value of the target PCIE device and the corresponding temperature reference value thereof are compared, so that heat dissipation control is performed on the target PCIE device according to the comparison result.

specifically, if the real-time temperature value of the target PCIE device is smaller than the temperature reference value corresponding to the real-time temperature value, it indicates that the heat dissipation capability of the target PCIE device is greater than the heat dissipation requirement of the target PCIE device, so that the temperature reference value of the target PCIE device needs to be obtained and the real-time temperature value is subtracted to obtain a first difference value, so that heat dissipation adjustment logic corresponding to the first difference value is obtained according to the first difference value.

Specifically, after the first difference value is obtained, the baseboard management controller obtains a heat dissipation adjustment logic corresponding to the first difference value to adjust the rotation speed of the fan assembly of the target PCIE device, for example, if the first difference value exceeds a temperature value margin threshold, the heat dissipation capability is indicated to be far exceeding the heat dissipation requirement, and the heat dissipation adjustment logic may be to appropriately reduce the heat dissipation capability to reduce the heat dissipation power consumption; if the first difference is within the temperature margin threshold, it indicates that the heat dissipation capacity and the heat dissipation requirement are in balance, so no heat dissipation adjustment is needed.

In one embodiment, comparing the real-time temperature value of the target PCIE device with the temperature reference value corresponding to the real-time temperature value of the target PCIE device, so as to perform heat dissipation control on the target PCIE device according to a comparison result, the method further includes:

specifically, if the real-time temperature value of the target PCIE device is greater than the corresponding temperature reference value, it indicates that the heat dissipation capability of the target PCIE device is insufficient to meet the heat dissipation requirement of the target PCIE device, so that the temperature reference value of the target PCIE device needs to be obtained, and the real-time temperature value is subtracted to obtain a second difference value, so that heat dissipation adjustment logic corresponding to the second difference value is obtained according to the second difference value.

Specifically, after the second difference value is obtained, the baseboard management controller obtains a heat dissipation adjustment logic corresponding to the second difference value to adjust the rotation speed of the fan assembly of the target PCIE device, for example, if the second difference value exceeds the temperature margin threshold value, the heat dissipation capacity is indicated to be far lower than the heat dissipation requirement, and the heat dissipation adjustment logic may greatly improve the heat dissipation capacity, for example, improve the rotation speed of the fan assembly by 20%; if the second difference is within the margin threshold of the temperature value, indicating that the heat dissipation capacity is below the heat dissipation demand, the heat dissipation adjustment logic may increase the heat dissipation capacity by a small amount, such as by 10% of the fan assembly speed.

acquiring a temperature rise rate reference value corresponding to the target PCIE equipment, and comparing the temperature rise rate of the target PCIE equipment with the temperature rise rate reference value;

specifically, the temperature information of the target PCIE device may be a real-time temperature value or a temperature rise rate. When the temperature information of the target PCIE device is the temperature rise rate of the target PCIE device, the baseboard management controller needs to obtain a temperature rise rate reference value corresponding to the target PCIE device.

Specifically, if the temperature rise rate of the target PCIE device exceeds the temperature rise rate reference value, the rotation speed of the fan assembly is adjusted according to the corresponding heat dissipation adjustment logic, if the rotation speed of the fan assembly is increased by 20%, the temperature information of the target PCIE device is consistent with the adjustment logic when the temperature information of the target PCIE device is the real-time temperature value of the target PCIE device, and the adjustment is performed according to the temperature rise rate margin threshold value.

Embodiment two:

referring to fig. 2, fig. 2 is a flowchart of a second method of PCIE device adaptation method provided in the embodiment of the present application. In the method shown in fig. 2, the same or similar content as in the method shown in fig. 1 may refer to the description in the method of fig. 1, and will not be described herein.

S201, storing the preset association configuration table for establishing association inquiry logic in a database associated with a baseboard management controller;

before detecting whether the target PCIE slot is connected to the target PCIE device, a preset association configuration table is prepared in advance, where contents of the preset association configuration table include address information of all PCIE slots that may occur on the motherboard, that is, target address information, related information of the target temperature sensor, bus information, and the like are stored in the preset association configuration table, and then the preset association configuration table is stored in a database associated with the baseboard management controller.

S202, forming an address information list by the slot address information corresponding to the PCIE equipment slot, and storing the address information list in a basic input/output system;

and storing the preset association configuration table into a database associated with the baseboard management controller, forming an address information list by the slot address information corresponding to the PCIE equipment slot, and storing the address information list into the basic input/output system so as to be convenient for positioning target address information from the address information list through the basic input/output system when the server is started.

S203, receiving a starting instruction of the server, and executing PCIE equipment detection to detect whether new PCIE equipment is connected in a PCIE equipment slot on the server;

the whole PCIE equipment adapting method is characterized in that firstly, starting from the starting of a server, after the starting of the server, a starting instruction of the server is received, and then detection operation of PCIE equipment is started to be executed so as to detect whether new PCIE equipment is connected in PCIE equipment slots on the server or not, wherein the situation of replacing the PCIE equipment is included.

S204, if PCIE equipment is connected in the PCIE equipment slots on the server, determining the PCIE equipment as the target PCIE equipment, and determining the slots connected with the PCIE equipment as the target PCIE slots;

through detection, if a new PCIE device is already connected to the PCIE device slot on the server, it is indicated that the client inserts a new PCIE device (one or more PCIE devices) or replaces an original PCIE device (one or more PCIE devices), in this case, the PCIE device needs to be determined as a target PCIE device, and a slot connected to the PCIE device needs to be determined as a target PCIE slot.

S205, positioning the address information of the target PCIE slot from an address information list in the basic input and output system, and determining the address information of the target PCIE slot as the target address information;

after determining the target PCIE slot, acquiring a stored address information list from the basic input and output system, and then locating address information of the target PCIE slot (address information of one or more target PCIE slots) from the address information list, and determining the address information of the target PCIE slot as target address information.

S206, acquiring the address information configuration table from a database associated with the baseboard management controller;

the baseboard management controller is connected with a database, and the preset association configuration table is stored in the database connected with the baseboard management controller, so that the baseboard management controller can acquire the preset association configuration table from the database associated with the baseboard management controller, and determine the address information configuration table from the preset association configuration table.

S207, obtaining the model of the target temperature sensor corresponding to the target address information from the address information configuration table according to the target address information;

after the target address information and the address information configuration table are acquired, the model of the target temperature sensor corresponding to the target address information can be acquired from the address information configuration table according to the target address information.

S208, performing association query on the address information configuration table and the temperature sensor information configuration table according to the association query logic so as to acquire first temperature detection configuration information from the temperature sensor information configuration table according to the model of the target temperature sensor;

after the target address information and the model of the target temperature sensor are obtained, carrying out association inquiry on the address information configuration table and the temperature sensor information configuration table according to association inquiry logic, and obtaining first temperature detection configuration information from the temperature sensor information configuration table according to the model of the target temperature sensor through a first same field (devicetype) in the address information configuration table and the temperature sensor information configuration table.

S209, performing association query on the address information configuration table and the server topology configuration table according to the association query logic so as to acquire second temperature detection configuration information from the server topology configuration table according to the target address information;

after the first temperature detection configuration information is obtained from the temperature sensor information configuration table according to the model of the target temperature sensor, the association inquiry is needed again, the address information configuration table and the server topology configuration table are subjected to the association inquiry according to the association inquiry logic, and the second temperature detection configuration information can be obtained from the temperature sensor information configuration table according to the model of the target temperature sensor through the second same field (location) in the address information configuration table and the server topology configuration table.

S210, generating the temperature detection configuration information through the first temperature detection configuration information and the second temperature detection configuration information;

after the first temperature detection configuration information and the second temperature detection configuration information are obtained, the temperature detection configuration information is generated through the first temperature detection configuration information and the second temperature detection configuration information so as to generate a temperature detection instruction carrying the temperature detection configuration information.

S211, generating a temperature detection instruction according to the temperature detection configuration information, starting the temperature detection instruction, and sending the temperature detection instruction carrying the temperature detection configuration information to the target temperature sensor so as to acquire the temperature information of the target PCIE equipment through the target temperature sensor;

the temperature detection instruction carries temperature detection configuration information, the temperature detection instruction carrying the temperature detection configuration information is sent to the target temperature sensor, and the target temperature sensor can acquire the temperature information of the target PCIE equipment according to the temperature detection instruction.

S212, acquiring temperature reference information corresponding to the target PCIE equipment;

to perform heat dissipation control, the baseboard management controller needs to obtain temperature reference information corresponding to the target PCIE device.

S213, judging that the temperature information of the target PCIE equipment is a real-time temperature value or a temperature rise rate;

s214, if the temperature information of the target PCIE equipment is a real-time temperature value, acquiring a temperature reference value corresponding to the target PCIE equipment;

the temperature information of the target PCIE device may be a real-time temperature value, or may be a temperature rise rate. When the temperature information of the target PCIE device is a real-time temperature value of the target PCIE device, the baseboard management controller needs to obtain a temperature reference value corresponding to the target PCIE device.

S215, if the real-time temperature value of the target PCIE equipment is smaller than the corresponding temperature reference value, subtracting the real-time temperature value from the temperature reference value of the target PCIE equipment to obtain a first difference value;

if the real-time temperature value of the target PCIE device is smaller than the corresponding temperature reference value, the heat dissipation capability of the target PCIE device is indicated to be greater than the heat dissipation requirement of the target PCIE device, and therefore the temperature reference value of the target PCIE device needs to be obtained and subtracted by the real-time temperature value to obtain a first difference value, so that heat dissipation adjustment logic corresponding to the first difference value is obtained according to the first difference value.

S216, acquiring heat dissipation adjustment logic corresponding to the first difference value to adjust the rotating speed of a fan assembly of the target PCIE equipment;

After the first difference value is obtained, the baseboard management controller obtains heat dissipation adjustment logic corresponding to the first difference value to adjust the rotation speed of the fan assembly of the target PCIE device, for example, if the first difference value exceeds a temperature value margin threshold value, the heat dissipation capacity is indicated to be far exceeding the heat dissipation requirement, and the heat dissipation adjustment logic may be to properly reduce the heat dissipation capacity to reduce the heat dissipation power consumption; if the first difference is within the temperature margin threshold, it indicates that the heat dissipation capacity and the heat dissipation requirement are in balance, so no heat dissipation adjustment is needed.

S217, if the real-time temperature value of the target PCIE equipment is larger than the corresponding temperature reference value, subtracting the temperature reference value from the real-time temperature value of the target PCIE equipment to obtain a second difference value;

if the real-time temperature value of the target PCIE device is greater than the corresponding temperature reference value, the heat dissipation capability of the target PCIE device is not enough to meet the heat dissipation requirement of the target PCIE device, so that the temperature reference value of the target PCIE device needs to be obtained and the real-time temperature value is subtracted to obtain a second difference value, so that heat dissipation adjustment logic corresponding to the second difference value is obtained according to the second difference value.

S218, acquiring heat dissipation adjustment logic corresponding to the second difference value to adjust the rotating speed of a fan assembly of the target PCIE equipment;

After the second difference value is obtained, the baseboard management controller obtains a heat dissipation adjustment logic corresponding to the second difference value to adjust the rotation speed of the fan assembly of the target PCIE device, for example, if the second difference value exceeds a temperature value margin threshold value, the heat dissipation capacity is indicated to be far lower than the heat dissipation requirement, and the heat dissipation adjustment logic may greatly improve the heat dissipation capacity, for example, improve the rotation speed of the fan assembly by 20%; if the second difference is within the margin threshold of the temperature value, indicating that the heat dissipation capacity is below the heat dissipation demand, the heat dissipation adjustment logic may increase the heat dissipation capacity by a small amount, such as by 10% of the fan assembly speed.

S219, if the temperature information of the target PCIE equipment is the temperature rise rate, acquiring a temperature rise rate reference value corresponding to the target PCIE equipment, and comparing the temperature rise rate of the target PCIE equipment with the temperature rise rate reference value;

the temperature information of the target PCIE device may be a real-time temperature value, or may be a temperature rise rate. When the temperature information of the target PCIE device is the temperature rise rate of the target PCIE device, the baseboard management controller needs to obtain a temperature rise rate reference value corresponding to the target PCIE device.

S220, if the temperature rise rate of the target PCIE equipment exceeds the temperature rise rate reference value, the rotating speed of the fan assembly is adjusted according to the corresponding heat dissipation adjustment logic.

If the temperature rise rate of the target PCIE device exceeds the temperature rise rate reference value, the rotation speed of the fan assembly is adjusted according to the corresponding heat dissipation adjustment logic, if the rotation speed of the fan assembly is increased by 20%, the temperature information of the target PCIE device is consistent with the adjustment logic when the temperature information of the target PCIE device is the real-time temperature value of the target PCIE device, and the adjustment is performed according to the temperature rise rate margin threshold value.

It should be understood that, although the steps in the flowcharts of fig. 1-2 are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least some of the steps in fig. 1-2 may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of execution of the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternately with at least some of the other steps or sub-steps of other steps.

Embodiment III:

Referring to fig. 3, fig. 3 is a system structure diagram of a PCIE device adapting system provided in an embodiment of the present application.

The PCIE device adaptation system of this embodiment includes:

when the PCIE device is inserted into the motherboard on the server, the server can detect the PCIE device inserted into the motherboard, which is called a target PCIE device. After the server detects the target PCIE equipment, the target address information module is increased to acquire target address information corresponding to the target PCIE equipment in response to the detection of the target PCIE equipment by the server, so that the model of the matched target temperature sensor is acquired by carrying out association inquiry through a preset association configuration table according to the target address information.

The preset association configuration table is used for acquiring the model of the target temperature sensor corresponding to the target address information from the preset association configuration table according to the target address information;

after the target address information corresponding to the target PCIE device is obtained, the preset association configuration table may be obtained through the target address information to perform association query, so as to improve the model of the target temperature sensor that is matched with the target PCIE device and obtained from the preset association configuration table by the preset association configuration table module.

after the model of the target temperature sensor matched with the target PCIE equipment is obtained, the correlation inquiry is carried out again in a preset correlation configuration table by combining the target address information and the information of the target temperature sensor, so that the temperature detection instruction module can be improved to obtain final temperature detection configuration information, and a temperature detection instruction is generated through the temperature detection configuration information.

after the temperature detection instruction is generated, the temperature detection instruction is started by the target temperature sensor module, so that the temperature information of the target PCIE equipment is acquired through the target temperature sensor, and the temperature acquisition operation of the newly-added PCIE equipment is completed.

For specific limitations of the PCIE device adaptation system, reference may be made to the above limitations of the method, which are not repeated here. All or part of the modules in the PCIE device adaptation system may be implemented by software, hardware, and a combination thereof. The above modules may be embedded in hardware or may be independent of a processor in the computer device, or may be stored in software in a memory in the computer device, so that the processor may call and execute operations corresponding to the above modules.

Embodiment four:

the embodiment provides a computer device, which comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, wherein the processor realizes the steps of a PCIE device adaptation method when executing the computer program.

The computer device may be a terminal, and its internal structure may be as shown in fig. 4. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program, when executed by the processor, implements a PCIE device adaptation method. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, can also be keys, a track ball or a touch pad arranged on the shell of the computer equipment, and can also be an external keyboard, a touch pad or a mouse and the like.

It will be appreciated by those skilled in the art that the structure shown in fig. 4 is merely a block diagram of some of the structures associated with the present application and does not constitute a limitation of the computer device to which the present application may be applied, and that a particular computer device may include more or fewer components than shown, or may combine certain components, or have a different arrangement of components.

In one embodiment, a computer device is provided that includes a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor implementing the following steps when executing the computer program:

Fifth embodiment:

the present embodiment provides a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of:

Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the various embodiments provided herein may include non-volatile and/or volatile memory. The nonvolatile memory can include Read Only Memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double Data Rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous Link DRAM (SLDRAM), memory bus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), among others.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims

1. A PCIE device adaptation method, wherein the adaptation method includes:

establishing an association inquiry logic through a first same field by an address information configuration table and a temperature sensor information configuration table in a preset association configuration table;

establishing an association inquiry logic through a second same field by an address information configuration table in a preset association configuration table and a server topology configuration table so as to generate a preset association configuration table carrying the association inquiry logic;

obtaining the model of a target temperature sensor matched with the target address information from the preset association configuration table according to the target address information;

the target address information is address information of a target PCIE slot connected to the target PCIE device;

the preset association configuration table comprises the address information configuration table, a temperature sensor information configuration table and a server topology configuration table;

the temperature detection configuration information includes a command and a read size corresponding to a model of the target temperature sensor, bus information and channel information corresponding to the target address information.

2. The PCIE device adaptation method according to claim 1, wherein the address information configuration table includes a model number of the PCIE device, an address and model number of a target temperature sensor, and target address information;

3. The PCIE device adaptation method of claim 2, wherein the temperature sensor information configuration table comprises a model number, a command, and a read size of the target temperature sensor;

4. The PCIE device adaptation method of claim 3, wherein the server topology configuration table comprises the destination address information, bus information, and channel information;

5. The PCIE device adaptation method of claim 1, wherein before the response to the server detecting the target PCIE device, further comprises:

6. The PCIE device adaptation method of claim 5, wherein before the response to the server detecting the target PCIE device, further comprises:

7. The PCIE device adaptation method according to claim 6, wherein the obtaining, according to the target address information, a model number of a target temperature sensor corresponding to the target address information from a preset association configuration table includes:

8. The PCIE device adaptation method of claim 4, wherein the obtaining temperature detection configuration information from the preset association configuration table according to the target address information and a model of a target temperature sensor includes:

9. The PCIE device adaptation method of claim 8, wherein the obtaining temperature detection configuration information from the preset association configuration table according to the target address information and a model of a target temperature sensor further comprises:

10. The PCIE device adaptation method of claim 9, wherein the obtaining temperature detection configuration information from the preset association configuration table according to the target address information and a model of a target temperature sensor further comprises:

11. The PCIE device adaptation method of claim 10, wherein the temperature detection instruction stores the temperature detection configuration information, and the starting the temperature detection instruction to obtain the temperature information of the target PCIE device through the target temperature sensor includes:

12. The PCIE device adaptation method according to any one of claims 1-11, wherein after obtaining temperature information of the target PCIE device through the target temperature sensor, the PCIE device adaptation method includes:

13. The PCIE device adaptation method of claim 12, wherein the temperature information of the target PCIE device is a real-time temperature value of the target PCIE device, and comparing the temperature information of the target PCIE device with corresponding temperature reference information includes:

14. The PCIE device adaptation method of claim 13, wherein comparing the real-time temperature value of the target PCIE device with the temperature reference value corresponding to the real-time temperature value of the target PCIE device, so as to perform heat dissipation control on the target PCIE device according to a comparison result, includes:

15. The PCIE device adaptation method of claim 14, wherein comparing the real-time temperature value of the target PCIE device with the temperature reference value corresponding to the real-time temperature value of the target PCIE device, so as to perform heat dissipation control on the target PCIE device according to a comparison result, further comprises:

16. The PCIE device adaptation method of claim 12, wherein the temperature information of the target PCIE device is a temperature rise rate of the target PCIE device, and comparing the temperature information of the target PCIE device with corresponding temperature reference information of the target PCIE device, so as to perform heat dissipation control on the target PCIE device according to a comparison result, including:

17. A PCIE device adaptation system, the system comprising:

the preset association configuration table module is used for establishing association inquiry logic between the address information configuration table and the temperature sensor information configuration table in the preset association configuration table through the first same field; establishing an association inquiry logic through a second same field by an address information configuration table in a preset association configuration table and a server topology configuration table so as to generate a preset association configuration table carrying the association inquiry logic; obtaining the model of the target temperature sensor corresponding to the target address information from a preset association configuration table according to the target address information;

18. A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements the steps of the method according to any one of claims 1-16 when the computer program is executed by the processor.

19. A computer-readable storage medium, characterized by: the computer readable storage medium stores a program which, when executed by a processor, causes the processor to perform the steps of the method according to any one of claims 1 to 16.