CN115543881A

CN115543881A - PCIE (peripheral component interface express) equipment adaptation method, system, computer equipment and storage medium

Info

Publication number: CN115543881A
Application number: CN202211503953.0A
Authority: CN
Inventors: 李烨
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2022-11-29
Filing date: 2022-11-29
Publication date: 2022-12-30
Anticipated expiration: 2042-11-29
Also published as: CN115543881B

Abstract

The application relates to a PCIE equipment adaptation method, a system, a computer device and a storage medium, wherein the method comprises the following steps: in response to the server detecting a target PCIE device, acquiring target address information corresponding to the target PCIE device; acquiring the model of a target temperature sensor matched with the target address information from a preset association configuration table according to the target address information; acquiring temperature detection configuration information from a preset association configuration table according to the target address information and the model of the target temperature sensor, and generating a temperature detection instruction according to the temperature detection configuration information; and starting a temperature detection instruction to acquire temperature information of the target PCIE equipment through the target temperature sensor. The temperature reading adaptation of the PCIE equipment is automatically realized through the preset association configuration table, namely the association query of the address information configuration table, the temperature sensor information configuration table and the server topology configuration table, and the problem that when the PCIE equipment is newly added, the BMC modifies the codes is solved.

Description

PCIE (peripheral component interface express) equipment adaptation method, system, computer equipment and storage medium

Technical Field

The present application relates to the field of servers, and in particular, to a PCIE device adaptation method, system, computer device, and storage medium.

Background

The server includes various PCIE (Peripheral Component Interconnect Express) devices, such as various network cards, RAID (Redundant Arrays of Independent Disks) cards, NVME (non-volatile memory host controller interface specification) hard Disks, and other PCIE devices.

In normal operation of a server, the PCIE device on the server needs to be monitored for temperature. When the temperature of the PCIE device is abnormal, the PCIE device with the abnormal temperature needs to be cooled by the cooling adjustment system, so that the PCIE device with the abnormal temperature returns to normal. In the prior art, a BMC (Baseboard Management Controller) obtains a PCIE device temperature through an I2C protocol, so as to implement a PCIE device temperature monitoring and Management function.

Since the PCIE devices have the above multiple types, and each type of PCIE device corresponds to a configuration of the PCIE device, after the PCIE device is adapted on the server to complete entering a trial, if a client puts forward a new requirement, the PCIE device needs to be added, and therefore the configuration of the PCIE device needs to be added, the code needs to be modified again for the BMC, and the newly added PCIE device can be subjected to normal temperature monitoring.

Disclosure of Invention

Based on this, the application provides a PCIE device adaptation method, a PCIE device adaptation system, a computer device, and a storage medium, so that temperature information of a PCIE device can be acquired without modifying a BMC code.

In one aspect, a PCIE device adaptation method is provided, where the PCIE device adaptation method includes:

responding to a server to detect a target PCIE device, and acquiring target address information corresponding to the target PCIE device;

acquiring the model of a target temperature sensor matched with the target address information from a preset association configuration table according to the target address information;

acquiring temperature detection configuration information from the preset association configuration table according to the target address information and the model of the target temperature sensor, and generating a temperature detection instruction according to the temperature detection configuration information;

starting the temperature detection instruction to acquire the temperature information of the target PCIE equipment through the target temperature sensor;

the target address information is address information of a target PCIE slot connected with the target PCIE device.

In one embodiment, the preset association configuration table includes an address information configuration table, a temperature sensor information configuration table, and a server topology configuration table, and before the server detects the target PCIE device, the method further includes:

and establishing association query logic for the address information configuration table, the temperature sensor information configuration table and the server topology configuration table to generate a preset association configuration table carrying the association query logic.

In one embodiment, the establishing association query logic for the address information configuration table, the temperature sensor information configuration table, and the server topology configuration table includes:

establishing association query logic between an address information configuration table and a temperature sensor information configuration table in the preset association configuration table through a first same field;

and establishing association query logic between the address information configuration table in the preset association configuration table and the server topology configuration table through a second same field.

In one embodiment, the address information configuration table includes a model of the PCIE device, an address and a model of a target temperature sensor, and target address information;

the target address information corresponds to the model of one target temperature sensor, the model of one PCIE device and the address of one target temperature sensor.

In one embodiment, the temperature sensor information configuration table includes a model, a command, and a read size of the target temperature sensor.

The type of one target temperature sensor corresponds to one command and one reading size.

In one embodiment, the server topology configuration table includes the target address information, bus information and channel information;

one piece of target address information corresponds to one piece of bus information and one piece of channel information.

In one embodiment, before responding to the detection of the target PCIE device by the server, the method further includes:

storing the preset association configuration table for establishing the association query logic in a database associated with a substrate management controller;

and forming an address information list by using slot address information corresponding to the PCIE equipment slot, and storing the address information list in a basic input and output system.

receiving a starting-up instruction of a server, and executing PCIE equipment detection to detect whether a PCIE equipment slot on the server is connected with new PCIE equipment or not;

if a PCIE device is connected in a PCIE device slot on the server, determining the PCIE device as the target PCIE device, and determining a slot to which the PCIE device is connected as the target PCIE slot;

the acquiring of the target address information corresponding to the target PCIE device includes:

and positioning address information of a target PCIE slot from an address information list in the basic input and output system, and determining the address information of the target PCIE slot as the target address information.

In one embodiment, the obtaining, according to the target address information, a model of a target temperature sensor corresponding to the target address information from a preset association configuration table includes:

acquiring the address information configuration table from a database associated with a baseboard management controller to preset an associated configuration table;

and acquiring the model of the target temperature sensor corresponding to the target address information from the address information configuration table according to the target address information.

In one embodiment, the acquiring temperature detection configuration information from the preset association configuration table according to the target address information and the model of the target temperature sensor includes:

performing association query on the address information configuration table and the temperature sensor information configuration table according to the association query logic so as to acquire first temperature detection configuration information from the temperature sensor information configuration table according to the model of the target temperature sensor;

wherein the first temperature detection configuration information includes a command address and a read size corresponding to a model of the target temperature sensor.

In one embodiment, the acquiring temperature detection configuration information from the preset association configuration table according to the target address information and the model of the target temperature sensor further includes:

performing association query on the address information configuration table and a server topology configuration table according to the association query logic so as to acquire second temperature detection configuration information from the server topology configuration table according to the target address information;

wherein the second temperature detection configuration information includes bus information and channel information corresponding to the target address information.

generating the temperature detection configuration information by the first temperature detection configuration information and the second temperature detection configuration information.

In one embodiment, the step of storing the temperature detection configuration information in the temperature detection instruction, and the step of starting the temperature detection instruction to acquire the temperature information of the target PCIE device through the target temperature sensor includes:

and starting the temperature detection instruction, and sending the temperature detection instruction carrying the temperature detection configuration information to the target temperature sensor so as to acquire the temperature information of the target PCIE equipment through the target temperature sensor.

In one embodiment, after the temperature information of the target PCIE device is acquired by the target temperature sensor, the method includes:

acquiring temperature reference information corresponding to the target PCIE equipment;

and comparing the temperature information of the target PCIE equipment with the corresponding temperature reference information so as to carry out heat dissipation control on the target PCIE equipment according to the comparison result.

In one embodiment, the comparing the temperature information of the target PCIE device with the corresponding temperature reference information includes:

acquiring a temperature reference value corresponding to the target PCIE equipment;

and comparing the real-time temperature value of the target PCIE equipment with the corresponding temperature reference value thereof so as to carry out heat dissipation control on the target PCIE equipment according to the comparison result.

In one embodiment, comparing the real-time temperature value of the target PCIE device with a corresponding temperature reference value thereof to perform heat dissipation control on the target PCIE device according to a comparison result includes:

if the real-time temperature value of the target PCIE equipment is smaller than the corresponding temperature reference value, subtracting the real-time temperature value from the temperature reference value of the target PCIE equipment to obtain a first difference value;

and acquiring heat dissipation adjustment logic corresponding to the first difference value so as to adjust the rotating speed of the fan assembly of the target PCIE equipment.

In one embodiment, the comparing the real-time temperature value of the target PCIE device with the corresponding temperature reference value thereof to perform heat dissipation control on the target PCIE device according to the comparison result further includes:

if the real-time temperature value of the target PCIE equipment is larger than the corresponding temperature reference value, subtracting the temperature reference value from the real-time temperature value of the target PCIE equipment to obtain a second difference value;

and acquiring heat dissipation adjustment logic corresponding to the second difference value so as to adjust the rotating speed of the fan assembly of the target PCIE equipment.

In one embodiment, the comparing, with the temperature rise rate of the target PCIE device, the temperature information of the target PCIE device with the corresponding temperature reference information to perform heat dissipation control on the target PCIE device according to the comparison result includes:

the base plate management controller acquires a temperature rise rate reference value corresponding to the target PCIE equipment, and compares the temperature rise rate of the target PCIE equipment with the temperature rise rate reference value;

and if the temperature rise rate of the target PCIE equipment exceeds the temperature rise rate reference value, adjusting the rotating speed of the fan assembly according to corresponding heat dissipation adjustment logic.

In another aspect, a PCIE device adaptation system is provided, where the system includes:

a target address information module, configured to, in response to a server detecting a target PCIE device, acquire target address information matched with the target PCIE device;

the preset association configuration table module is used for acquiring the model of the target temperature sensor corresponding to the target address information from a preset association configuration table according to the target address information;

the temperature detection instruction module is used for acquiring temperature detection configuration information from the preset association configuration table according to the target address information and the model of the target temperature sensor and generating a temperature detection instruction according to the temperature detection configuration information;

the target temperature sensor module is used for starting the temperature detection instruction so as to acquire temperature information of the target PCIE equipment through the target temperature sensor;

In another aspect, a computer device is provided, which includes a memory, a processor, and a computer program stored on the memory and executable on the processor, and the processor implements the following steps when executing the computer program:

and starting the temperature detection instruction to acquire the temperature information of the target PCIE equipment through the target temperature sensor.

In yet another aspect, there is provided a computer-readable storage medium storing a program which, when executed by a processor, causes the processor to perform the steps of:

Compared with the prior art, the technical scheme of the application has the following advantages:

according to the PCIE equipment adapting method, the system, the computer equipment and the storage medium, the temperature reading adaptation of the PCIE equipment can be automatically realized through presetting the association configuration table, namely the association query of the address information configuration table, the temperature sensor information configuration table and the server topology configuration table, so that the problem that when the PCIE equipment is newly added, the code is modified by the BMC is solved, and the efficiency is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a flowchart of a first method of a PCIE device adaptation method provided in an embodiment of the present application;

fig. 2 is a flowchart of a second method of a PCIE device adaptation method provided in the embodiment of the present application;

fig. 3 is a system structure diagram of a PCIE device adaptation system provided in the embodiment of the present application;

fig. 4 is a device structure diagram of a computer device provided in an embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

The first embodiment is as follows:

referring to fig. 1, fig. 1 is a flowchart of a first method of a PCIE device adaptation method provided in the embodiment of the present application.

The method comprises the following steps:

s101, responding to a server detecting a target PCIE device, and acquiring target address information corresponding to the target PCIE device;

specifically, when a PCIE device is inserted into a motherboard on a server, the server can detect the PCIE device inserted into the motherboard, which is called a target PCIE device. When the server detects the target PCIE device, the server responds to the detection of the target PCIE device, and target address information corresponding to the target PCIE device is obtained, so that correlation query is performed through a preset correlation configuration table according to the target address information, and the model of the matched target temperature sensor is obtained.

S102, acquiring the model of a target temperature sensor matched with the target address information from a preset association configuration table according to the target address information;

specifically, after the target address information corresponding to the target PCIE device is acquired, the preset association configuration table may be acquired through the target address information to perform association query, so as to acquire the model of the target temperature sensor matched with the target PCIE device from the preset association configuration table.

S103, acquiring temperature detection configuration information from the preset association configuration table according to the target address information and the model of the target temperature sensor, and generating a temperature detection instruction according to the temperature detection configuration information;

specifically, after the model of the target temperature sensor matched with the target PCIE device is obtained, association query is performed again in the preset association configuration table in combination with the target address information and the information of the target temperature sensor, so that final temperature detection configuration information can be obtained, and a temperature detection instruction is generated by the temperature detection configuration information.

S104, starting the temperature detection instruction to acquire temperature information of the target PCIE equipment through the target temperature sensor;

specifically, after the temperature detection instruction is generated, the temperature detection instruction is started, so that the temperature information of the target PCIE device is obtained through the target temperature sensor, and the temperature obtaining operation of the newly added PCIE device is completed.

The method comprises the steps that the PCIE equipment is inserted into a PCIE slot, a target PCIE equipment is determined, the slot into which the target PCIE equipment is inserted is the target PCIE slot, and the address where the target PCIE slot is located is target address information corresponding to the target PCIE equipment.

Specifically, the preset association configuration table includes three association lookup tables, that is, an address information configuration table, a temperature sensor information configuration table, and a server topology configuration table, and corresponding association lookup logic is established among the three association lookup tables, so that an address of a target temperature sensor can be determined through target address information, so as to obtain temperature information of a target PCIE device connected to a target PCIE slot through the target temperature sensor.

In one embodiment, the establishing of the association query logic for the address information configuration table, the temperature sensor information configuration table and the server topology configuration table includes:

specifically, corresponding association query logics need to be established among the three association query tables, and the same fields exist between one of the three association query tables and the other two association query tables, further, the association query logics are established through the first same fields of the address information configuration table and the temperature sensor information configuration table in the preset association configuration table, for example, the three association query tables shown in tables 1 to 3, wherein the first same fields of the association query logics established by the address information configuration table and the temperature sensor information configuration table are "devicetype".

Specifically, the address information configuration table and the server topology configuration table in the preset association configuration table establish association query logic through a second same field, such as three association query tables shown in tables 1 to 3, where the second same field of the address information configuration table and the temperature sensor information configuration table establishing association query logic is "location".

Table 1 address information configuration table

Wherein "name" represents the model of the target PCIE device;

"slave" represents the address of the target temperature sensor;

"evicetype" represents the model number of the target temperature sensor;

"location" indicates destination address information.

Table 2 address information configuration table

Wherein "command" represents a command to be written to the register of the target temperature sensor;

"readlength" indicates the size of data to be read from the register of the target temperature sensor.

Table 3 address information configuration table

Wherein "bus" represents bus information for sending a temperature detection instruction to a target temperature sensor;

"channel" indicates channel information for sending a temperature detection instruction to the target temperature sensor.

specifically, as shown in table 1 above, the address information configuration table includes the model of the PCIE device, the address "slave" and the model "evicetype" of the target temperature sensor, and the target address information "location".

Specifically, as shown in the above table 2, the temperature sensor information configuration table includes the model "evicetype", the command ", and the read size" readlength "of the target temperature sensor.

The type of one target temperature sensor corresponds to one command address and one reading size.

In one embodiment, the server topology configuration table includes the target address information, bus information, and channel information;

specifically, as shown in the above table 3, the server topology configuration table includes destination address information "location", bus information "bus", and channel information "channel".

In one embodiment, before the responding to the detection of the target PCIE device by the server, the method further includes:

storing the preset association configuration table for establishing the association query logic in a database associated with a baseboard management controller;

specifically, before detecting whether a target PCIE slot is connected to a target PCIE device, a preset association configuration table is prepared in advance, where the content of the preset association configuration table includes address information of all PCIE slots that may appear on a motherboard, that is, target address information, and one target address information corresponds to a model of one target temperature sensor, a model of one PCIE device, and an address of one target temperature sensor; the type of a target temperature sensor corresponds to a command and a reading size; one destination address information corresponds to one bus information and one channel information. Therefore, all the above contents need to be stored in the preset associated configuration table, and then the preset associated configuration table is stored in the database associated with the baseboard management controller.

Specifically, the preset association configuration table is stored in a database associated with the bmc, and slot address information corresponding to the PCIE device slot is also required to form an address information list, and the address information list is stored in the bios, so that when the server is powered on, the target address information can be located from the address information list through the bios.

receiving a starting-up instruction of a server, and executing PCIE equipment detection to detect whether a PCIE equipment slot on the server is connected with a new PCIE equipment or not;

specifically, the overall PCIE device adapting method starts from the server boot, receives a boot instruction of the server after the server boots, and then starts to perform the detection operation of the PCIE device to detect whether a PCIE device slot on the server is connected to a new PCIE device, including the case of replacing the PCIE device.

specifically, after detection, if a new PCIE device is connected to a PCIE device slot on the server, it indicates that the client inserts a new PCIE device (one or more PCIE devices) on the motherboard or replaces an original PCIE device (one or more PCIE devices).

Specifically, after the target PCIE slot is determined, the stored address information list is acquired from the basic input/output system, then the address information of the target PCIE slot (the address information of one or more target PCIE slots) is located from the address information list, and the address information of the target PCIE slot is determined as the target address information.

acquiring the address information configuration table from a database associated with a baseboard management controller;

specifically, a database is connected to the baseboard management controller, and the preset associated configuration table is stored in the database connected to the baseboard management controller, so that the baseboard management controller can obtain the preset associated configuration table from the database associated therewith, and determine the address information configuration table from the preset associated configuration table.

Specifically, after the target address information and the address information configuration table are obtained, the model of the target temperature sensor corresponding to the target address information can be obtained from the address information configuration table according to the target address information.

In one embodiment, the acquiring temperature detection configuration information from the preset associated configuration table according to the target address information and the model of the target temperature sensor includes:

specifically, after the target address information and the model of the target temperature sensor are obtained, the address information configuration table and the temperature sensor information configuration table are subjected to correlation query according to correlation query logic, and first temperature detection configuration information can be obtained from the temperature sensor information configuration table according to the model of the target temperature sensor through a first same field (devicetype) in the address information configuration table and the temperature sensor information configuration table.

Wherein the first temperature detection configuration information includes a command and a read size corresponding to a model of the target temperature sensor.

Specifically, the command is a command that needs to be written into the register of the target temperature sensor, and the read size is a data size that needs to be read from the register of the target temperature sensor.

specifically, after the first temperature detection configuration information is acquired from the temperature sensor information configuration table according to the model of the target temperature sensor, association query needs to be performed again, association query is performed on the address information configuration table and the server topology configuration table according to association query logic, and second temperature detection configuration information can be acquired from the temperature sensor information configuration table according to the model of the target temperature sensor through a second identical field (location) in the address information configuration table and the server topology configuration table.

Specifically, the bus information is a bus when a temperature detection instruction is sent to the target temperature sensor, and the channel is a channel when a temperature detection instruction is sent to the target temperature sensor.

In one embodiment, the acquiring temperature detection configuration information from the preset associated configuration table according to the target address information and the model of the target temperature sensor further includes:

Specifically, after the first temperature detection configuration information and the second temperature detection configuration information are acquired, the temperature detection configuration information is generated through the first temperature detection configuration information and the second temperature detection configuration information, so that a temperature detection instruction carrying the temperature detection configuration information is generated.

In one embodiment, the storing, in the temperature detection instruction, the temperature detection configuration information, and the starting the temperature detection instruction to acquire the temperature information of the target PCIE device through the target temperature sensor includes:

Specifically, the temperature detection instruction carries temperature detection configuration information, the temperature detection instruction carrying the temperature detection configuration information is sent to the target temperature sensor, and the target temperature sensor can acquire temperature information of the target PCIE device according to the temperature detection instruction.

In one embodiment, the temperature detection instruction is:

I2C-test -b < bus number > -s < slave > -rc < read count > -m 1 -d < data >。

specifically, the above is a temperature detection instruction, and an I2C command is adopted, where b denotes a bus number; s represents the address of the target temperature sensor; rc represents a data size of a register of the reading target temperature sensor; m represents that the register of the target temperature sensor can be read and written; d denotes an instruction to be written to the register of the target temperature sensor. The address of the target temperature sensor already contains channel information, i.e. the command is sent to the target temperature sensor via the target channel.

specifically, to perform heat dissipation control, the bmc needs to acquire temperature reference information corresponding to a target PCIE device.

Specifically, after the substrate management controller acquires the temperature reference information corresponding to the target PCIE device, the substrate management controller compares the temperature information of the target PCIE device with the corresponding temperature reference information thereof, so as to perform heat dissipation control on the target PCIE device according to a comparison result. If the heat dissipation capacity far exceeds the heat dissipation requirement of the target PCIE equipment, the heat dissipation capacity needs to be reduced; if the heat dissipation capability is not sufficient to meet the heat dissipation requirement of the target PCIE device, the heat dissipation capability needs to be improved.

specifically, the temperature information of the target PCIE device may be a real-time temperature value or a temperature rise rate. When the temperature information of the target PCIE device is the real-time temperature value of the target PCIE device, the substrate management controller needs to acquire a temperature reference value corresponding to the target PCIE device.

Specifically, after the real-time temperature value and the corresponding temperature reference value of the target PCIE device are obtained, the real-time temperature value and the corresponding temperature reference value of the target PCIE device are compared, so as to perform heat dissipation control on the target PCIE device according to a comparison result.

specifically, if the real-time temperature value of the target PCIE device is smaller than the corresponding temperature reference value, it indicates that the heat dissipation capability of the target PCIE device is greater than the heat dissipation requirement thereof, and therefore, the temperature reference value of the target PCIE device needs to be obtained to subtract the real-time temperature value to obtain a first difference value, so as to obtain the heat dissipation adjustment logic corresponding to the first difference value according to the first difference value.

Specifically, after the first difference is obtained, the baseboard management controller obtains a heat dissipation adjustment logic corresponding to the first difference to adjust the rotation speed of the fan assembly of the target PCIE device, for example, if the first difference exceeds a temperature value margin threshold, it indicates that the heat dissipation capability far exceeds the heat dissipation requirement, and the heat dissipation adjustment logic may be to appropriately reduce the heat dissipation capability to reduce the heat dissipation power consumption; if the first difference is within the temperature value margin threshold, the heat dissipation capacity and the heat dissipation requirement are in a balanced state, and therefore heat dissipation adjustment is not needed.

specifically, if the real-time temperature value of the target PCIE device is greater than the corresponding temperature reference value, it indicates that the heat dissipation capability of the target PCIE device is not sufficient to meet the heat dissipation requirement, and therefore the temperature reference value of the target PCIE device needs to be obtained to subtract the real-time temperature value to obtain a second difference value, so as to obtain the heat dissipation adjustment logic corresponding to the second difference value according to the second difference value.

Specifically, after the second difference is obtained, the baseboard management controller obtains a heat dissipation adjustment logic corresponding to the second difference to adjust the rotation speed of the fan assembly of the target PCIE device, for example, if the second difference exceeds a temperature value margin threshold, the heat dissipation capability is far lower than the heat dissipation requirement, and the heat dissipation adjustment logic may greatly improve the heat dissipation capability, for example, improve 20% of the rotation speed of the fan assembly; if the second difference is within the margin threshold of the temperature value, the heat dissipation capability is lower than the heat dissipation requirement, and the heat dissipation adjustment logic may be to increase the heat dissipation capability by a small margin, for example, by 10% of the rotation speed of the fan assembly.

In one embodiment, the comparing, with the temperature rise rate of the target PCIE device, the temperature information of the target PCIE device with the corresponding temperature reference information to perform heat dissipation control on the target PCIE device according to a comparison result includes:

acquiring a temperature rise rate reference value corresponding to the target PCIE equipment, and comparing the temperature rise rate of the target PCIE equipment with the temperature rise rate reference value;

specifically, the temperature information of the target PCIE device may be a real-time temperature value or a temperature rise rate. When the temperature information of the target PCIE device is the temperature rise rate of the target PCIE device, the substrate management controller needs to acquire the temperature rise rate reference value corresponding to the target PCIE device.

Specifically, if the temperature rise rate of the target PCIE device exceeds the temperature rise rate reference value, the rotation speed of the fan assembly is adjusted according to the corresponding heat dissipation adjustment logic, for example, the rotation speed of the fan assembly is increased by 20%, which is consistent with the adjustment logic when the temperature information of the target PCIE device is the real-time temperature value of the target PCIE device, and the adjustment is performed according to the temperature rise rate margin threshold value.

The second embodiment:

referring to fig. 2, fig. 2 is a flowchart of a second method of a PCIE device adaptation method provided in the embodiment of the present application. In the method shown in fig. 2, the same or similar contents as those in the method shown in fig. 1 may refer to the description in the method shown in fig. 1, and are not repeated here.

S201, storing the preset association configuration table for establishing the association query logic in a database associated with a baseboard management controller;

before detecting whether a target PCIE slot is connected with a target PCIE device, a preset association configuration table is prepared in advance, the content of the preset association configuration table comprises address information of all PCIE slots possibly appearing on a mainboard, namely the target address information, relevant information of a target temperature sensor, bus information and the like are stored in the preset association configuration table, and then the preset association configuration table is stored in a database associated with a substrate management controller.

S202, forming an address information list by using slot address information corresponding to the PCIE equipment slot, and storing the address information list in a basic input and output system;

the method includes the steps that a preset association configuration table is stored in a database associated with a baseboard management controller, slot address information corresponding to PCIE equipment slots needs to form an address information list, and the address information list is stored in a basic input and output system, so that target address information can be located from the address information list through the basic input and output system when a server is started.

S203, receiving a starting-up instruction of the server, and executing PCIE equipment detection to detect whether a new PCIE equipment is connected in a PCIE equipment slot on the server;

the overall PCIE equipment adapting method starts from the startup of a server, receives a startup instruction of the server after the server is started, and then starts to execute the detection operation of the PCIE equipment so as to detect whether a PCIE equipment slot on the server is connected with new PCIE equipment or not, including the situation that the PCIE equipment is replaced.

S204, if a PCIE device is already connected to a PCIE device slot on the server, determining the PCIE device as the target PCIE device, and determining a slot to which the PCIE device is connected as the target PCIE slot;

after detection, if a new PCIE device is connected in a PCIE device slot on the server, it indicates that the client inserts a new PCIE device (one or more PCIE devices) on the motherboard or replaces an original PCIE device (one or more PCIE devices).

S205, positioning address information of a target PCIE slot from an address information list in the basic input output system, and determining the address information of the target PCIE slot as the target address information;

after the target PCIE slot is determined, the stored address information list is obtained from the basic input and output system, then the address information of the target PCIE slot (the address information of one or more target PCIE slots) is positioned from the address information list, and the address information of the target PCIE slot is determined as the target address information.

S206, acquiring the address information configuration table from a database associated with the baseboard management controller;

the baseboard management controller is connected with a database, and the preset association configuration table is stored in the database connected with the baseboard management controller, so that the baseboard management controller can obtain the preset association configuration table from the database associated with the baseboard management controller, and determine the address information configuration table from the preset association configuration table.

S207, acquiring the model of the target temperature sensor corresponding to the target address information from the address information configuration table according to the target address information;

after the target address information and the address information configuration table are obtained, the model of the target temperature sensor corresponding to the target address information can be obtained from the address information configuration table according to the target address information.

S208, performing correlation query on the address information configuration table and the temperature sensor information configuration table according to the correlation query logic so as to acquire first temperature detection configuration information from the temperature sensor information configuration table according to the model of the target temperature sensor;

after the target address information and the model of the target temperature sensor are obtained, the address information configuration table and the temperature sensor information configuration table are subjected to correlation query according to correlation query logic, and first temperature detection configuration information can be obtained from the temperature sensor information configuration table according to the model of the target temperature sensor through a first same field (devicetype) in the address information configuration table and the temperature sensor information configuration table.

S209, performing association query on the address information configuration table and the server topology configuration table according to the association query logic, so as to obtain second temperature detection configuration information from the server topology configuration table according to the target address information;

after the first temperature detection configuration information is obtained from the temperature sensor information configuration table according to the model of the target temperature sensor, association query needs to be carried out again, the address information configuration table and the server topology configuration table are subjected to association query according to association query logic, and second temperature detection configuration information can be obtained from the temperature sensor information configuration table according to the model of the target temperature sensor through a second same field (location) in the address information configuration table and the server topology configuration table.

S210, generating the temperature detection configuration information through the first temperature detection configuration information and the second temperature detection configuration information;

after the first temperature detection configuration information and the second temperature detection configuration information are obtained, the temperature detection configuration information is generated through the first temperature detection configuration information and the second temperature detection configuration information, so that a temperature detection instruction carrying the temperature detection configuration information can be generated conveniently.

S211, generating a temperature detection instruction according to the temperature detection configuration information, starting the temperature detection instruction, and sending the temperature detection instruction carrying the temperature detection configuration information to the target temperature sensor, so as to obtain the temperature information of the target PCIE device through the target temperature sensor;

the temperature detection instruction carries temperature detection configuration information, the temperature detection instruction carrying the temperature detection configuration information is sent to the target temperature sensor, and the target temperature sensor can acquire temperature information of the target PCIE equipment according to the temperature detection instruction.

S212, acquiring temperature reference information corresponding to the target PCIE equipment;

to perform heat dissipation control, the bmc needs to acquire temperature reference information corresponding to a target PCIE device.

S213, judging whether the temperature information of the target PCIE equipment is a real-time temperature value or a temperature rise rate;

s214, if the temperature information of the target PCIE device is a real-time temperature value, acquiring a temperature reference value corresponding to the target PCIE device;

the temperature information of the target PCIE device may be a real-time temperature value or a temperature rise rate. When the temperature information of the target PCIE device is a real-time temperature value of the target PCIE device, the baseboard management controller needs to acquire a temperature reference value corresponding to the target PCIE device.

S215, if the real-time temperature value of the target PCIE device is smaller than the corresponding temperature reference value, subtracting the real-time temperature value from the temperature reference value of the target PCIE device to obtain a first difference value;

if the real-time temperature value of the target PCIE device is smaller than the corresponding temperature reference value, it indicates that the heat dissipation capability of the target PCIE device is greater than the heat dissipation requirement thereof, and therefore, the temperature reference value of the target PCIE device needs to be obtained to subtract the real-time temperature value to obtain a first difference value, so as to obtain the heat dissipation adjustment logic corresponding to the first difference value.

S216, obtaining a heat dissipation adjustment logic corresponding to the first difference value to adjust the rotating speed of the fan assembly of the target PCIE device;

after the first difference value is obtained, the substrate management controller obtains a heat dissipation adjustment logic corresponding to the first difference value to adjust the rotating speed of the fan assembly of the target PCIE device, for example, if the first difference value exceeds a temperature value margin threshold, it indicates that the heat dissipation capability far exceeds the heat dissipation requirement, and the heat dissipation adjustment logic may be adapted to reduce the heat dissipation capability appropriately, so as to reduce the heat dissipation power consumption; if the first difference is within the temperature value margin threshold, the heat dissipation capacity and the heat dissipation requirement are in a balanced state, and therefore heat dissipation adjustment is not needed.

S217, if the real-time temperature value of the target PCIE device is greater than the corresponding temperature reference value, subtracting the temperature reference value from the real-time temperature value of the target PCIE device to obtain a second difference value;

if the real-time temperature value of the target PCIE device is greater than the corresponding temperature reference value, it indicates that the heat dissipation capability of the target PCIE device is not sufficient to meet the heat dissipation requirement, and therefore, the temperature reference value of the target PCIE device needs to be obtained to subtract the real-time temperature value to obtain a second difference value, so as to obtain the heat dissipation adjustment logic corresponding to the second difference value according to the second difference value.

S218, obtaining a heat dissipation adjustment logic corresponding to the second difference value to adjust a rotation speed of the fan assembly of the target PCIE device;

after the second difference value is obtained, the substrate management controller obtains a heat dissipation adjustment logic corresponding to the second difference value to adjust the rotation speed of the fan assembly of the target PCIE device, for example, if the second difference value exceeds a temperature value margin threshold, it indicates that the heat dissipation capability is far lower than the heat dissipation requirement, and the heat dissipation adjustment logic may greatly improve the heat dissipation capability, for example, improve 20% of the rotation speed of the fan assembly; if the second difference is within the margin threshold of the temperature value, the heat dissipation capability is lower than the heat dissipation requirement, and the heat dissipation adjustment logic may be to increase the heat dissipation capability by a small margin, for example, by 10% of the rotation speed of the fan assembly.

S219, if the temperature information of the target PCIE device is a temperature rise rate, acquiring a temperature rise rate reference value corresponding to the target PCIE device, and comparing the temperature rise rate of the target PCIE device with the temperature rise rate reference value;

the temperature information of the target PCIE device may be a real-time temperature value or a temperature rise rate. When the temperature information of the target PCIE device is the temperature rise rate of the target PCIE device, the substrate management controller needs to acquire the temperature rise rate reference value corresponding to the target PCIE device.

And S220, if the temperature rise rate of the target PCIE equipment exceeds the temperature rise rate reference value, adjusting the rotating speed of the fan assembly according to corresponding heat dissipation adjustment logic.

If the temperature rise rate of the target PCIE equipment exceeds the temperature rise rate reference value, the rotating speed of the fan assembly is adjusted according to the corresponding heat dissipation adjustment logic, if the rotating speed of the fan assembly is increased by 20%, the rotating speed is consistent with the adjustment logic when the temperature information of the target PCIE equipment is the real-time temperature value of the target PCIE equipment, and adjustment is carried out according to the temperature rise rate allowance threshold value.

It should be understood that although the various steps in the flow chart of FIG. 1~2 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a portion of the steps in 1~2 may comprise multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performing the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternating with other steps or at least a portion of the sub-steps or stages of other steps.

Example three:

referring to fig. 3, fig. 3 is a system structure diagram of a PCIE device adaptation system provided in the embodiment of the present application.

The PCIE device adaptation system of this embodiment includes:

when a PCIE device is inserted into a motherboard on a server, the server can detect the PCIE device inserted into the motherboard, which is referred to as a target PCIE device. After the server detects the target PCIE device, in response to the detection of the target PCIE device by the server, the target address information obtaining module is used for obtaining target address information corresponding to the target PCIE device, so that correlation query is carried out through a preset correlation configuration table according to the target address information to obtain the model of the matched target temperature sensor.

The preset association configuration table is used for acquiring the model of the target temperature sensor corresponding to the target address information from the preset association configuration table according to the target address information;

after the target address information corresponding to the target PCIE device is acquired, the preset association configuration table may be acquired through the target address information to perform association query, so that the preset association configuration table module is facilitated to acquire the model of the target temperature sensor matched with the target PCIE device from the preset association configuration table.

after the model of the target temperature sensor matched with the target PCIE equipment is obtained, the target address information and the information of the target temperature sensor are combined to perform correlation query in the preset correlation configuration table again, so that the temperature detection instruction module can be improved to obtain the final temperature detection configuration information, and a temperature detection instruction is generated through the temperature detection configuration information.

after the temperature detection instruction is generated, the target temperature sensor module is increased to start the temperature detection instruction, so that the temperature information of the target PCIE device can be conveniently acquired through the target temperature sensor, and the temperature acquisition operation of the newly-added PCIE device is completed.

For specific limitations of the PCIE device adaptation system, see the above limitations on the method, which are not described herein again. Each module in the PCIE device adaptation system may be wholly or partially implemented by software, hardware, or a combination thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.

Example four:

the embodiment provides a computer device, which includes a memory, a processor, and a computer program stored in the memory and capable of running on the processor, where the processor implements the steps of the PCIE device adaptation method when executing the computer program.

The computer device may be a terminal, and its internal structure diagram may be as shown in fig. 4. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a PCIE device adaptation method. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the computer equipment, an external keyboard, a touch pad or a mouse and the like.

It will be appreciated by those skilled in the art that the configuration shown in fig. 4 is a block diagram of only a portion of the configuration relevant to the present solution and does not constitute a limitation on the computing device to which the present solution applies, and that a particular computing device may include more or less components than those shown, or combine certain components, or have a different arrangement of components.

In one embodiment, a computer device is provided, which includes a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor implementing the following steps when executing the computer program:

Example five:

the present embodiments provide a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of:

It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double Data Rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous Link DRAM (SLDRAM), rambus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A PCIE equipment adapting method is characterized in that the adapting method comprises the following steps:

starting the temperature detection instruction to acquire temperature information of the target PCIE equipment through the target temperature sensor;

2. The PCIE device adaptation method of claim 1, wherein the preset association configuration table comprises an address information configuration table, a temperature sensor information configuration table, and a server topology configuration table, and the method further comprises, before responding to a server detecting a target PCIE device:

3. The PCIE device adaptation method according to claim 2, wherein the establishing association query logic for the address information configuration table, the temperature sensor information configuration table, and the server topology configuration table includes:

4. The PCIE device adaptation method according to claim 2, wherein the address information configuration table includes a model of the PCIE device, an address and a model of a target temperature sensor, and target address information;

5. The PCIE device adapting method of claim 4, wherein the temperature sensor information configuration table includes a model, a command and a read size of the target temperature sensor;

6. The PCIE device adaptation method of claim 5, wherein the server topology configuration table includes the target address information, bus information and channel information;

wherein, one target address information corresponds to one bus information and one channel information.

7. The PCIE device adaptation method of claim 2, wherein the responding to the server before detecting the target PCIE device further comprises:

8. The PCIE device adaptation method of claim 7, wherein in response to a server detecting a target PCIE device, further comprising:

receiving a starting-up instruction of a server, and executing PCIE equipment detection to detect whether a new PCIE equipment is connected in a PCIE equipment slot on the server or not;

the obtaining of the target address information corresponding to the target PCIE device includes:

9. The PCIE device adapting method according to claim 8, wherein the obtaining, according to the destination address information, a model of a destination temperature sensor corresponding to the destination address information from a preset association configuration table includes:

10. The PCIE device adaptation method according to claim 6, wherein the obtaining temperature detection configuration information from the preset association configuration table according to the destination address information and the model of the destination temperature sensor includes:

11. The PCIE device adaptation method according to claim 10, wherein the acquiring temperature detection configuration information from the preset association configuration table according to the destination address information and the model of the destination temperature sensor further comprises:

12. The PCIE device adaptation method according to claim 11, wherein the acquiring temperature detection configuration information from the preset association configuration table according to the destination address information and the model of the destination temperature sensor further comprises:

13. The PCIE device adaptation method according to claim 12, wherein the temperature detection instruction stores the temperature detection configuration information, and the starting the temperature detection instruction to obtain the temperature information of the target PCIE device through the target temperature sensor includes:

14. The PCIE device adaptation method according to any one of claims 1 to 13, wherein after the obtaining the temperature information of the target PCIE device by the target temperature sensor, the method includes:

15. The PCIE device adaptation method of claim 14, wherein the temperature information of the target PCIE device is a real-time temperature value of the target PCIE device, and comparing the temperature information of the target PCIE device with corresponding temperature reference information thereof includes:

16. The PCIE device adaptation method according to claim 15, wherein comparing the real-time temperature value of the target PCIE device with the corresponding temperature reference value thereof to perform heat dissipation control on the target PCIE device according to the comparison result comprises:

17. The PCIE device adaptation method according to claim 16, wherein the comparing the real-time temperature value of the target PCIE device and the temperature reference value corresponding thereto to perform heat dissipation control on the target PCIE device according to the comparison result, further comprising:

18. The PCIE device adaptation method according to claim 14, wherein the temperature information of the target PCIE device is a temperature rise rate of the target PCIE device, and the comparing the temperature information of the target PCIE device with the corresponding temperature reference information thereof is performed to perform heat dissipation control on the target PCIE device according to a comparison result, including:

19. A PCIE device adaptation system, the system comprising:

the preset association configuration table block is used for acquiring the model of the target temperature sensor corresponding to the target address information from a preset association configuration table according to the target address information;

20. A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the steps of the method of any one of claims 1 to 18 are implemented when the computer program is executed by the processor.

21. A computer-readable storage medium, characterized in that: the computer-readable storage medium stores a program which, when executed by a processor, causes the processor to carry out the steps of the method according to any one of claims 1 to 18.