CN115537787B

CN115537787B - Electroplating and chemical plating compatible equipment and workpiece surface treatment method

Info

Publication number: CN115537787B
Application number: CN202211264455.5A
Authority: CN
Inventors: 马庆超; 王燕; 姜丽燕
Original assignee: Hehong New Material Science & Technology Co ltd
Current assignee: Hehong New Material Science & Technology Co ltd
Priority date: 2022-10-17
Filing date: 2022-10-17
Publication date: 2023-07-25
Anticipated expiration: 2042-10-17
Also published as: CN115537787A

Abstract

The invention relates to equipment compatible with electroplating and chemical plating and a workpiece surface treatment method, which solve the technical problems of how to effectively improve the service cycle of chemical plating solution, how to avoid the invalidation of the chemical plating solution, how to discard the chemical plating solution and how to improve the production efficiency after adding hard particles in the existing chemical composite plating process. The invention is suitable for the process of forming a plating layer on the surface of a workpiece.

Description

Electroplating and chemical plating compatible equipment and workpiece surface treatment method

Technical Field

The invention relates to the technical field of electroplating and electroless plating, in particular to equipment compatible with electroplating and electroless plating and a workpiece surface treatment method.

Background

Electroless plating and electroplating are the most common surface treatment methods in industrial production, wherein electroless plating can form a plating layer with uniform thickness on the surface of a workpiece, is not limited by the shape of the workpiece, and is mainly applied to products with complex shapes, poor conductivity or nonuniform current distribution. The electroplating is mainly applied to products which are regular in shape, have no blind holes, sharp corners and the like, have concentrated current distribution and can be provided with anodes because the electroplating needs more uniform current distribution and the positions to be plated also need corresponding anodes.

In the surface treatment process of actual industrial products, electroless plating and electroplating are widely applied. Taking a petroleum pipeline as an example, the pipe is a slender hollow pipeline, and two ends of the pipe are provided with internal threads or external threads, so that the actual condition of current concentration exists because the threads are of a zigzag structure; if the threads on the pipe need to be plated, the threads are produced by an electroless plating process, so that the position plating of the threads is ensured to be uniform; if the tubing is only coated on the inner and outer surfaces (except for the threads), a more efficient electroplating process is preferred. If both the inner surface and the outer surface of the pipe are required to be plated and the thread part is required to be plated, the inner surface and the outer surface of the pipe are firstly subjected to electroplating process production in an electroplating production line, then the pipe product is subjected to chemical plating process production in a chemical plating production line, and the whole production process is completed in two independent production lines; obviously, this has the technical problem of low production efficiency.

In addition, in the chemical plating process of the current industrial production, the addition of hard particles (such as diamond, titanium dioxide, silicon carbide and the like) can effectively improve the hardness, the wear resistance and the corrosion resistance of the plating layer, namely the chemical composite plating process can effectively improve the hardness, the wear resistance and the corrosion resistance of the plating layer. However, after the hard particles are added for a period of time, a severe spontaneous reaction occurs, the plating solution fails and cannot be used normally (the plating solution can only be discarded to cause waste), and a plating layer cannot be formed on the surface of the workpiece; particularly, when micron-sized hard particles are added, the characteristic that the hard particles have large specific surface area in the electroless plating solution can cause the plating solution to have deposition reaction on the surfaces of the particles easily, the deposition reaction is difficult to control, the effective components in the plating solution can be rapidly consumed once self-reaction is induced, and the plating solution can completely lose activity in a period of generally tens of minutes to hours according to the characteristics of different plating solutions. Therefore, how to effectively improve the service cycle of the electroless plating solution after adding the hard particles, how to avoid the failure of the electroless plating solution, and how to avoid discarding the electroless plating solution are technical problems to be solved by those skilled in the art.

Disclosure of Invention

The invention provides a general compatible electroplating and chemical plating device and a workpiece surface treatment method for improving the production efficiency, which aim to solve the technical problems of how to effectively improve the service cycle of chemical plating solution, how to avoid the failure of the chemical plating solution, how to prevent the chemical plating solution from being abandoned and how to improve the production efficiency after adding hard particles in the existing chemical composite plating process.

The invention provides equipment compatible with electroplating and chemical plating, which comprises a pretreatment device, a chemical plating device, an electroplating device, a chemical plating water washing device and an electroplating water washing device, wherein the chemical plating device comprises a chemical plating working tank, a first chemical plating liquid storage tank, a second chemical plating liquid storage tank, a first conveying pipeline, a second conveying pipeline, a first conveying pump, a second conveying pump, a first stirrer, a second stirrer, a first heating device, a second heating device, a first valve, a main recovery pipeline, a first path recovery pipeline, a second valve, a third valve, a first groove type filter screen, a second groove type filter screen, a first filter material and a second filter material; the outlet of the first path of recovery pipeline is positioned above the first groove type filter screen, and the outlet of the second path of recovery pipeline is positioned above the second groove type filter screen.

Preferably, the pretreatment device comprises an oil removal device, a water washing device, an acid washing device and a water washing device.

Preferably, the first filter material is filter paper, filter cloth or filter cotton, and the second filter material is filter paper, filter cloth or filter cotton.

Preferably, a stainless steel filter screen is arranged on the first filter material, and a stainless steel filter screen is arranged on the second filter material.

The invention also provides a workpiece surface treatment method applying the equipment compatible with electroplating and electroless plating, which comprises the following steps:

the first step, the workpiece is pretreated in a pretreatment device;

secondly, preparing chemical composite plating solution;

step 1, preparing a basic electroless plating solution;

step 2, adding the hard particles into a basic chemical plating solution to form a chemical composite plating solution;

thirdly, carrying out chemical plating on the workpiece in a chemical plating device to form a plating layer;

pouring a certain amount of the chemical composite plating solution prepared in the second step into a first chemical plating solution storage tank, pouring a certain amount of the chemical composite plating solution prepared in the second step into a second chemical plating solution storage tank, starting a first conveying pump to add the chemical composite plating solution in the first chemical plating solution storage tank into a chemical plating working tank, placing a workpiece into the chemical plating working tank for chemical plating operation, opening a first valve, opening a second valve and closing a third valve before the plating solution is subjected to self-reaction, so that the plating solution in the chemical plating working tank flows onto a first filter material through a main recovery pipeline and a first path recovery pipeline, the first filter material completely filters out hard particles and attached reaction particles in the plating solution, the filtered plating solution enters the first chemical plating solution storage tank through a first groove type filter screen, and after the plating solution in the chemical plating working tank is completely discharged, closing the first valve;

Then, a second conveying pump is started to add the chemical composite plating solution in the second chemical plating solution storage tank into the chemical plating working tank through a second conveying pipeline, and chemical plating operation is continuously carried out on the workpiece;

adding a certain amount of hard particles into the basic electroless plating solution in the first electroless plating solution liquid storage tank, so as to form a new electroless composite plating solution;

then, after forming a plating layer with a required thickness on the surface of the workpiece in the chemical plating working tank, taking the workpiece out of the chemical plating working tank; before the plating solution is subjected to self-reaction, the first valve is opened, the second valve is closed, the third valve is opened, the plating solution in the chemical plating working tank flows to the second filter material through the main recovery pipeline and the second path recovery pipeline, silicon carbide particles and attached reaction particles in the plating solution are completely filtered by the second filter material, and the filtered plating solution enters the second chemical plating solution storage tank through the second groove type filter screen; after all plating solution in the chemical plating working tank is discharged, closing the first valve;

next, adding a new chemical composite plating solution in a first chemical plating solution storage tank into the chemical plating working tank through a first conveying pump, and preparing for chemical plating operation on a next workpiece to be processed;

Adding a certain amount of hard particles into the basic electroless plating solution in the second electroless plating solution liquid storage tank, so as to form a new electroless composite plating solution;

and fourthly, washing the workpiece taken out of the electroless plating working tank in an electroless plating water washing device.

the first step, the workpiece is pretreated in a pretreatment device;

secondly, preparing electroplating liquid, and adding the electroplating liquid into an electroplating working tank of an electroplating device;

thirdly, transferring the workpiece treated in the first step into an electroplating working groove of an electroplating device, and electroplating the workpiece through the electroplating device to form a coating;

and step four, taking out the workpiece in the electroplating device, and then performing water washing treatment in the electroplating water washing device.

The invention also provides a workpiece surface treatment method compatible with electroplating and electroless plating equipment, which comprises the following steps:

the first step, the workpiece is pretreated in a pretreatment device;

secondly, preparing chemical composite plating solution;

step 1, preparing a basic electroless plating solution;

Fourthly, washing the workpiece taken out of the electroless plating working tank in an electroless plating water washing device;

fifthly, preparing electroplating liquid, and adding the electroplating liquid into an electroplating working tank of an electroplating device;

a sixth step of transferring the workpiece processed in the fourth step to an electroplating working groove of an electroplating device, and electroplating the part to be electroplated on the workpiece by the electroplating device to form a plating layer;

and seventh, taking out the workpiece in the electroplating device, and then performing water washing treatment in the electroplating water washing device.

The invention also provides a workpiece surface treatment method applying the electroplating and electroless plating compatible device of claim 1, comprising the following steps:

the first step, the workpiece is pretreated in a pretreatment device;

step four, taking out the workpiece in the electroplating device, and then performing water washing treatment in an electroplating water washing device;

fifthly, preparing chemical composite plating solution;

Step 1, preparing a basic electroless plating solution;

sixthly, carrying out chemical plating on the workpiece in a chemical plating device to form a plating layer;

Seventh, the workpiece taken out of the electroless plating working tank is subjected to water washing treatment in an electroless plating water washing device.

The invention also provides a workpiece surface treatment method, which comprises equipment compatible with electroplating and chemical plating, wherein the equipment compatible with electroplating and chemical plating comprises a pretreatment device, a chemical plating device, an electroplating device, a chemical plating water washing device and an electroplating water washing device, the chemical plating device comprises a chemical plating working tank, a first chemical plating liquid storage tank, a second chemical plating liquid storage tank, a first conveying pipeline, a second conveying pipeline, a first conveying pump, a second conveying pump, a first stirrer, a second stirrer, a first heating device, a second heating device, a first valve, a main recovery pipeline, a first path recovery pipeline, a second valve, a third valve, a first groove type filter screen, a second groove type filter screen, a first filter material and a second filter material, wherein the upper part of the chemical plating working tank is connected with the first chemical plating liquid storage tank through the first conveying pipeline, the upper part of the chemical plating working tank is connected with the second chemical plating working tank through the second conveying pipeline, the second conveying pump is connected with the second chemical plating liquid storage tank through the second conveying pipeline, the second conveying pipeline is connected with the second conveying pipeline, the first recovery pipeline is connected with the first chemical plating working tank through the first valve, the first chemical plating working tank is fixedly connected with the first recovery pipeline, the first recovery filter screen is connected with the first chemical plating tank, the first recovery filter screen is fixedly connected with the first recovery filter screen, the first recovery filter screen is connected with the top of the first chemical plating working tank, the first recovery filter screen is fixedly connected with the first filter screen, the first filter screen is connected with the first top recovery filter screen, and the first filter screen is fixedly connected with the top recovery filter screen, the second filter material is placed on the second groove type filter screen; the outlet of the first path of recovery pipeline is positioned above the first groove type filter screen, and the outlet of the second path of recovery pipeline is positioned above the second groove type filter screen;

The workpiece surface treatment method comprises the following steps:

the first step, the workpiece is pretreated in a pretreatment device;

secondly, preparing chemical composite plating solution;

step 1, preparing a basic electroless plating solution;

Next, a certain amount of hard particles are added into the basic electroless plating solution in the second electroless plating solution reservoir, thereby forming a new electroless composite plating solution.

The beneficial effects of the invention are as follows: the invention provides a general device for chemical plating and electroplating, and simultaneously provides a method capable of prolonging the production period of a chemical compound plating solution, wherein the device is provided with independent tanks required by various working procedures such as electrolytic degreasing, pure water washing, acid washing, pure water washing, electroplating, pure water washing, chemical plating and pure water washing, and the device can realize the production of different plating requirements on the same production line, thereby effectively saving the device space. The treatment and use method of the chemical composite plating solution can effectively prolong the service cycle of the chemical composite plating solution and avoid the waste of the plating solution.

Drawings

FIG. 1 is a schematic diagram of an apparatus compatible with electroplating and electroless plating;

FIG. 2 is a schematic illustration of one specific configuration of a pretreatment device;

FIG. 3 is a schematic structural view of an electroless plating water washing apparatus;

FIG. 4 is a schematic view of the structure of the plating water washing apparatus;

FIG. 5 is a schematic view of an electroplating apparatus;

FIG. 6 is a schematic view of the structure of the electroless plating apparatus;

Fig. 7 is an enlarged view of the first recess filter and the first filter attachment position in the structure shown in fig. 6.

The symbols in the drawings illustrate:

100. pretreatment unit 110, degreasing unit 111, degreasing working tank 112, first reservoir 113, pump one, 114, pipeline 115, recovery pipeline 116, valve 117, heating unit 120, water washing unit 121, water washing working tank 122, second reservoir 123, pump two, 124, pipeline 125, recovery pipeline 126, valve 130, acid washing unit 131, acid washing working tank 132, third reservoir 133, pump three, 134, pipeline 135, recovery pipeline 136, valve 140, water washing unit 141, water washing working tank 142, fourth reservoir 143, pump four, 144, pipeline 145, recovery pipeline 146, valve. 200. Electroless plating apparatus, 201, electroless plating working cell, 202, first electroless plating liquid reservoir, 203, second electroless plating liquid reservoir, 204, first delivery conduit, 205, second delivery conduit, 206, first delivery pump, 207, second delivery pump, 208, first mixer, 209, second mixer, 210, first heating device, 211, second heating device, 212, first valve, 213, main recovery conduit, 214, first recovery conduit, 215, second recovery conduit, 216, second valve, 217, third valve, 218, first fluted filter screen, 219, second fluted filter screen, 220, first filter medium, 221, second filter medium. 300. Electroplating device 301, electroplating working tank 302, electroplating liquid storage tank 303, conveying pipeline 304, pump seven, 305 and return pipeline; 400. electroless plating water washing device 401, water washing working tank 402, fifth liquid storage tank 403, pump five, 404, pipeline 405, recovery pipeline 406, valve 500, electroplating water washing device 501, water washing working tank 502, sixth liquid storage tank 503, pump six, 504, pipeline 505, recovery pipeline 506, valve.

Detailed Description

As shown in fig. 1, the plating and electroless plating compatible apparatus includes a pretreatment device 100, an electroless plating device 200, a plating device 300, an electroless plating water washing device 400, and an electroplating water washing device 500. The pretreatment device 100, the plating device 300, the electroless plating water washing device 400, and the electroplating water washing device 500 are all conventional structures in the prior art. The pretreatment device 100 is located at a first station, the electroless plating device 200 is located at a second station, the electroplating device 300 is located at a third station, the electroless plating water washing device 400 is located at a fourth station, and the electroplating water washing device 500 is located at a fifth station. The electroless water plating apparatus 400 performs a post-treatment process, and the electroplating water washing apparatus 500 performs a post-treatment process.

As shown in fig. 2, a specific structure of the pretreatment apparatus 100 includes a degreasing apparatus 110, a water washing apparatus 120, a pickling apparatus 130, and a water washing apparatus 140, wherein the degreasing apparatus 110 includes a degreasing working tank 111, a first liquid storage tank 112, a pump 113, a pipeline 114, a recovery pipeline 115, a valve 116, and a heating apparatus 117, the degreasing working tank 111 is connected to the first liquid storage tank 112 through the pipeline 114, the pump 113 is connected to the pipeline 114, the valve 116 is connected to the bottom of the degreasing working tank 111, the upper end of the recovery pipeline 115 is connected to the valve 116, the lower end of the recovery pipeline 115 is connected to the first liquid storage tank 112, the heating apparatus 117 is used for heating the liquid in the first liquid storage tank 112 to a desired temperature, the pump 113 is used for conveying the liquid in the first liquid storage tank 112 into the degreasing working tank 111 through the recovery pipeline 115, and the valve 116 can drain the liquid in the degreasing working tank 111 into the first liquid storage tank 112 through the recovery pipeline 115 after opening. The water washing device 120 comprises a water washing working tank 121, a second liquid storage tank 122, a second pump 123, a pipeline 124, a recovery pipeline 125 and a valve 126, wherein the water washing working tank 121 is connected with the second liquid storage tank 122 through the pipeline 124, the second pump 123 is connected with the pipeline 124, the valve 126 is connected with the bottom of the water washing working tank 121, the upper end of the recovery pipeline 125 is connected with the valve 126, the lower end of the recovery pipeline 125 is connected with the second liquid storage tank 122, the second pump 123 is used for conveying water in the second liquid storage tank 122 into the water washing working tank 121 through the pipeline 124, the valve 126 can be opened to discharge the water in the water washing working tank 121 into the second liquid storage tank 122 through the recovery pipeline 125, and a workpiece to be processed is washed in the water washing working tank 121. The pickling device 130 comprises a pickling working tank 131, a third liquid storage tank 132, a pump III 133, a pipeline 134, a recovery pipeline 135 and a valve 136, wherein the pickling working tank 131 is connected with the third liquid storage tank 132 through the pipeline 134, the pump III 133 is connected with the pipeline 134, the valve 136 is connected with the bottom of the pickling working tank 131, the upper end of the recovery pipeline 135 is connected with the valve 136, the lower end of the recovery pipeline 135 is connected with the third liquid storage tank 132, the pump III 133 is used for conveying an acid solution in the third liquid storage tank 132 into the pickling working tank 131, the valve 136 can enable the acid solution in the pickling working tank 131 to be discharged into the third liquid storage tank 132 after being opened, and a workpiece to be processed is pickled in the pickling working tank 131. The water washing device 140 comprises a water washing working tank 141, a fourth liquid storage tank 142, a fourth pump 143, a pipeline 144, a recovery pipeline 145 and a valve 146, wherein the water washing working tank 141 is connected with the fourth liquid storage tank 142 through the pipeline 144, the fourth pump 143 is connected with the pipeline 144, the valve 146 is connected with the bottom of the water washing working tank 141, the upper end of the recovery pipeline 145 is connected with the valve 146, the lower end of the recovery pipeline 145 is connected with the fourth liquid storage tank 142, the fourth pump 143 can convey water in the fourth liquid storage tank 142 into the water washing working tank 141 through the pipeline 144, the valve 146 can enable the water in the water washing working tank 141 to be discharged into the fourth liquid storage tank 142 through the recovery pipeline 145 after being opened, and a workpiece to be processed is washed in the water washing working tank 141.

As shown in fig. 3, the electroless plating water washing device 400 includes a water washing tank 401, a fifth liquid storage tank 402, a pump five 403, a pipeline 404, a recovery pipeline 405, and a valve 406, wherein the water washing tank 401 is connected to the fifth liquid storage tank 402 through the pipeline 404, the pump five 403 is connected to the pipeline 404, the valve 406 is connected to the bottom of the water washing tank 401, the upper end of the recovery pipeline 405 is connected to the valve 406, the lower end of the recovery pipeline 405 is connected to the fifth liquid storage tank 402, the pump five 403 is used for conveying water in the fifth liquid storage tank 402 into the water washing tank 401, the valve 406 is opened to drain water in the water washing tank 401 into the fifth liquid storage tank 402, and the workpiece is subjected to water washing treatment in the water washing tank 401 after being subjected to electroless plating to form a plating layer.

As shown in fig. 4, the plating water washing apparatus 500 includes a water washing tank 501, a sixth reservoir 502, a pump six 503, a pipe 504, a recovery pipe 505, and a valve 506, wherein the water washing tank 501 is connected to the sixth reservoir 502 through the pipe 504, the pump six 503 is connected to the pipe 504, the valve 506 is connected to the bottom of the water washing tank 501, the upper end of the recovery pipe 505 is connected to the valve 506, the lower end of the recovery pipe 505 is connected to the sixth reservoir 502, the pump six 503 is used for transporting water in the sixth reservoir 502 to the water washing tank 501, the valve 506 is opened to drain water in the water washing tank 501 to the sixth reservoir 502, and the work piece is subjected to water washing treatment in the water washing tank 501 after plating.

As shown in fig. 5, the plating apparatus 300 may include a plating tank 301, a plating solution reservoir 302, a delivery pipe 303, a pump seven 304, and a return pipe 305, wherein an upper end of the delivery pipe 303 is connected to a lower portion of the plating tank 301, a lower end of the delivery pipe 303 is connected to the plating solution reservoir 302, the pump seven 304 is connected to the delivery pipe 303, an upper end of the return pipe 305 is connected to an upper portion of the plating tank 301, a lower end of the return pipe 305 is connected to the plating solution reservoir 302, and a workpiece is plated in the plating tank 301.

The chemical plating device 200 is improved on the basis of a conventional chemical plating device, two liquid storage tanks, corresponding stirring devices and heating devices are arranged, two paths of return pipelines and three valves are arranged, the specific structure is shown in fig. 6 and 7, the upper part of the chemical plating working tank 201 is connected with the first chemical plating liquid storage tank 202 through a first conveying pipeline 204, a first conveying pump 206 is connected with the first conveying pipeline 204, the upper part of the chemical plating working tank 201 is connected with the second chemical plating liquid storage tank 203 through a second conveying pipeline 205, the second conveying pump 207 is connected with the second conveying pipeline 205, a first stirrer 208 is a motor, a stirring shaft and a stirring blade structure, the stirring blade extends into the bottom of the first chemical plating liquid storage tank 202, the first heating device 210 is connected with the first chemical plating liquid storage tank 202, the second heating device 211 is connected with the second chemical plating working tank 203, the first valve 212 is connected with the bottom of the chemical plating working tank 201, the first pipeline 212 is connected with the first pipeline 213, the first pipeline 213 is connected with the first pipeline 213 and the second pipeline 219, the first pipeline 213 is fixedly arranged on the top of the first chemical plating tank 218, and the first filter screen 219 is fixedly arranged on the top of the first filter screen 218, and the first filter screen is fixedly arranged on the top of the first filter screen 218. The outlet of the first recovery conduit 214 is above the first fluted filter 218 and the outlet of the second recovery conduit 215 is above the second fluted filter 219. The first stirrer 208 is used to stir the electroless plating solution in the first electroless plating solution reservoir 202 and maintain the hard particles in a suspended state, and the stirrer is shown as a stirring blade structure by way of example only, and may be other known structures such as a magnetic stirring structure. The second stirrer 209 is used for stirring the electroless plating solution in the second electroless plating solution reservoir 203, and maintains the hard particles in a suspended state, and the stirring blade structure of the stirrer is shown as an example, and the stirrer may be other known structures such as a magnetic stirring structure. The first heating device 210 is used to heat the electroless plating solution in the first electroless plating solution reservoir 202 to a temperature required by the process, and is shown as a heating pipe structure, but other known structures are also possible. The second heating device 211 is used to heat the electroless plating solution in the second electroless plating solution tank 203 to a temperature required by the process, and is shown as a heating pipe structure, and may have other known structures. The first transfer pump 206 is capable of transferring the electroless plating solution in the first electroless plating solution reservoir 202 to the electroless plating working tank 201 via the first transfer pipe 204, and the second transfer pump 207 is capable of transferring the electroless plating solution in the second electroless plating solution reservoir 203 to the electroless plating working tank 201 via the second transfer pipe 205. The chemical plating working tank 201 is of a conventional structure in the prior art, a heating device and a stirring device are arranged in the chemical plating working tank 201, and after the chemical plating solution is pumped from the liquid storage tank to reach the working liquid level, the pumping of the plating solution is stopped. The first valve 212, the second valve 216, and the third valve 217 may be manual valves or electric valves. When the first valve 212 is opened, the second valve 216 is opened, the third valve 217 is closed, and the plating solution in the electroless plating tank 201 flows onto the first filter material 220 through the main recovery pipeline 213 and the first path recovery pipeline 214 in sequence, is filtered, and then passes through the first groove type filter screen 218 to enter the first electroless plating solution reservoir 202. When the first valve 212 is opened, the second valve 216 is closed, the third valve 217 is opened, and the plating solution in the electroless plating tank 201 flows onto the second filter material 221 through the main recovery pipeline 213 and the second recovery pipeline 215 in sequence, is filtered, and then passes through the second groove-type filter screen 219 to enter the second electroless plating solution reservoir 203.

The first filter 220 may be filter paper, filter cloth or filter cotton.

The second filter 221 may be filter paper, filter cloth, or filter cotton.

For the filtering structure, further optimization, a stainless steel filter screen can be placed on the first filtering material 220, the stainless steel filter screen is used for filtering substances with larger particles, the filtering structure with the upper thickness and the lower thickness is formed, and meanwhile, the filtering material (especially filter paper) can be prevented from being broken through by the impact of the backflow solution. Similarly, a stainless steel filter screen may be placed on the second filter material 221, where the stainless steel filter screen is used to filter substances with larger particles, so as to form a filtering structure with thick upper part and thin lower part.

The following describes a process for applying the above-described plating and electroless plating compatible apparatus:

example 1

In the first step, the workpiece is subjected to pretreatment in the pretreatment apparatus 100, the workpiece is subjected to degreasing treatment in the degreasing bath 111 of the degreasing apparatus 110, then subjected to washing treatment in the washing bath 121 of the washing apparatus 120, then subjected to pickling treatment in the pickling bath 131 of the pickling apparatus 130, and finally subjected to washing treatment in the washing bath 141 of the washing apparatus 140.

And secondly, preparing chemical composite plating solution.

Step 1, preparing a basic electroless plating solution.

200 ml of pure water is added into a first container, 25 g of nickel sulfate hexahydrate is added and stirred until the pure water is dissolved; adding 100 ml of pure water into a second container, adding 30 g of sodium hypophosphite and stirring until the sodium hypophosphite is dissolved; adding 100 ml of pure water into a third container, adding 30 g of citric acid, and stirring until the solution is dissolved; 100 ml of pure water was added to the fourth vessel, 10 g of sodium acetate was put into the vessel and stirred until it was dissolved, then the solution in the second vessel was added to the first vessel, the solution in the third vessel was added to the first vessel, the solution in the fourth vessel was added to the first vessel, 0.2 g of sodium hexadecyl sulfate and 0.1 mg of thiourea were added to the first vessel and stirred and mixed together.

And 2, preparing a composite plating solution.

Soaking 5 g of 4000-mesh silicon carbide in dilute sulfuric acid, fully diluting with pure water, standing and precipitating for 1 hour, pumping out supernatant, washing the residual precipitated silicon carbide with pure water for 3 times according to the mode, adding the residual silicon carbide precipitate particles into the chemical plating solution formed in the step 1, and finally supplementing to 1 liter with pure water to form the chemical composite plating solution.

The dosage of the composite plating solution is prepared according to the production requirement and the equal proportion of the steps.

The PH value of the basic proportioning solution formed in the step 1 is 3-3.5, and the chemical plating solution can be kept stable for a long time under the condition of stirring at the temperature of 90-92 ℃, and the plating speed is 5-7.5 mu m/h.

Third, the workpiece is electroless plated in the electroless plating apparatus 200 to form a plated layer.

Pouring a certain amount of the chemical composite plating solution prepared in the second step into a first chemical plating solution storage tank 202, pouring a certain amount of the chemical composite plating solution prepared in the second step into a second chemical plating solution storage tank 203, starting a first conveying pump 206 to add the chemical composite plating solution in the first chemical plating solution storage tank 202 into a chemical plating working tank 201, wherein the PH value of the chemical composite plating solution in the chemical plating working tank 201 is 3-3.5, under the condition that the temperature is 90-92 ℃, a stirring device is used for stirring, the plating solution undergoes severe spontaneous reaction within 2-3 hours, silicon carbide particles are rapidly wrapped by nickel-phosphorus particles generated by the reaction, the plating solution becomes black, a large amount of bubbles are produced, the PH value of the plating solution is raised to be more than 4.5, at this time, workpieces in the plating solution are wrapped by the black particles, the plating solution cannot form a plating layer on the surfaces of the workpieces, and the plating solution cannot be normally used (at this time, the plating solution can only be abandoned). Therefore, the effective period of the electroless composite plating solution is 2 hours, that is, a plating layer can be formed on the surface of the workpiece within 2 hours.

Therefore, before the plating solution is self-reacted, for example, the plating solution in the electroless plating working tank 201 is completely discharged to the first electroless plating solution reservoir 202 within 1.5 to 2 hours, the specific operation is that the first valve 212 is opened, the second valve 216 is opened, the third valve 217 is closed, the plating solution in the electroless plating working tank 201 flows onto the first filter material 220 through the main recovery pipe 213 and the first path recovery pipe 214, the silicon carbide particles and the attached reactive particles in the plating solution are completely filtered by the first filter material 220, the filtered plating solution is recovered to the basic electroless plating solution formed in the step 1 in the second step (it can be seen that the plating solution is not dead and is discarded, and the recycling is realized), and the filtered plating solution enters the first electroless plating solution reservoir 202 through the first groove type filter screen 218. After the plating solution in the electroless plating tank 201 is completely discharged, the first valve 212 is closed.

Next, the second transfer pump 207 is started to feed the electroless composite plating solution in the second electroless plating solution reservoir 203 into the electroless plating tank 201 through the second transfer pipe 205, and the electroless plating operation is continued on the workpiece, so that the electroless plating operation on the workpiece is substantially continuous and uninterrupted.

Next, a certain amount of silicon carbide precipitate particles formed according to the process of step 2 in the second step are added to the basic electroless plating solution in the first electroless plating solution reservoir 202, thereby forming a new electroless composite plating solution.

Next, after a plating layer of a desired thickness is formed on the surface of the workpiece in the electroless plating tank 201, the workpiece is taken out of the electroless plating tank 201. At this time, before the plating solution in the electroless plating tank 201 is self-reacted, for example, the plating solution in the electroless plating tank 201 is completely discharged to the second electroless plating solution reservoir 203 within a period of 1.5 to 2 hours, specifically, the first valve 212 is opened, the second valve 216 is closed, and the third valve 217 is opened, the plating solution in the electroless plating tank 201 flows to the second filter material 221 through the main recovery pipe 213 and the second recovery pipe 215, the second filter material 221 completely filters out silicon carbide particles and incidental reaction particles in the plating solution, the filtered plating solution is recovered as the basic electroless plating solution, and the filtered plating solution enters the second electroless plating solution reservoir 203 through the second groove type filter screen 219. After the plating solution in the electroless plating tank 201 is completely discharged, the first valve 212 is closed.

Next, a new electroless composite plating solution in the first electroless plating solution reservoir 202 is fed into the electroless plating tank 201 by the first transfer pump 206, ready for electroless plating of the next workpiece to be processed.

Next, a certain amount of silicon carbide precipitate particles formed according to the process of step 2 in the second step are added into the basic electroless plating solution in the second electroless plating solution reservoir 203, thereby forming a new electroless composite plating solution.

It can be seen that the plating solutions in the first electroless plating solution reservoir 202 and the second electroless plating solution reservoir 203 are recycled, and when one of the electroless plating solution reservoirs is used, the plating solution in the other electroless plating solution reservoir is used as a standby.

Fourth, the workpiece taken out of the electroless plating tank 201 is subjected to a water washing treatment in the electroless plating water washing apparatus 400.

Example 2

In the second step, a plating solution is prepared, and the plating solution is fed into the plating tank 301 of the plating apparatus 300.

Third, the workpiece processed in the first step is transferred to the plating tank 301 of the plating apparatus 300 by using an appliance such as a crane, and the plating apparatus 300 performs plating treatment on the workpiece to form a plating layer.

Fourth, the work piece in the plating apparatus 300 is taken out, and then water washing treatment is performed in the plating water washing apparatus 500.

Example 3

This example illustrates electroless plating followed by electroplating.

And secondly, preparing chemical composite plating solution.

Step 1, preparing a basic electroless plating solution.

And 2, preparing a composite plating solution.

Next, after a plating layer of a desired thickness is formed on the surface of the workpiece (the threaded portion of the pipe) in the electroless plating tank 201, the workpiece is taken out of the electroless plating tank 201. At this time, before the plating solution in the electroless plating tank 201 is self-reacted, for example, the plating solution in the electroless plating tank 201 is completely discharged to the second electroless plating solution reservoir 203 within a period of 1.5 to 2 hours, specifically, the first valve 212 is opened, the second valve 216 is closed, and the third valve 217 is opened, the plating solution in the electroless plating tank 201 flows to the second filter material 221 through the main recovery pipe 213 and the second recovery pipe 215, the second filter material 221 completely filters out silicon carbide particles and incidental reaction particles in the plating solution, the filtered plating solution is recovered as the basic electroless plating solution, and the filtered plating solution enters the second electroless plating solution reservoir 203 through the second groove type filter screen 219. After the plating solution in the electroless plating tank 201 is completely discharged, the first valve 212 is closed.

Fifth, a plating solution is prepared and added to the plating tank 301 of the plating apparatus 300.

And sixthly, transferring the workpiece (such as a pipe) processed in the fourth step into a plating working tank 301 of the plating device 300 by using an aerial crane or other devices, and performing plating treatment on a part (such as the inner surface and the outer surface of a thread removing part on the pipe) to be plated on the workpiece by the plating device 300 to form a plating layer.

Seventh, the work (e.g., pipe) in the plating apparatus 300 is taken out, and then water washing is performed in the plating water washing apparatus 500.

Example 4

This example illustrates the electroplating followed by electroless plating.

Third, the workpiece (e.g., a pipe) is transferred to the plating tank 301 of the plating apparatus 300, and the plating apparatus 300 performs plating treatment on the portion of the workpiece to be plated (e.g., the inner and outer surfaces of the pipe except the threaded portion) to form a plated layer.

Fourth, the work (e.g., tube) in the plating apparatus 300 is taken out, and then water washing is performed in the plating water washing apparatus 500.

And fifthly, preparing the chemical composite plating solution.

Step 1, preparing a basic electroless plating solution.

And 2, preparing a composite plating solution.

Sixth, the workpiece is electroless plated in the electroless plating apparatus 200 to form a plated layer.

Seventh, the workpiece taken out of the electroless plating tank 201 is subjected to water washing treatment in the electroless plating water washing apparatus 400.

The equipment compatible with electroplating and chemical plating effectively combines the chemical composite plating process and the electroplating process together, can perform chemical plating and electroplating on one production line, and can reduce the occupied area by more than 70 percent and reduce the equipment investment by more than 70 percent compared with two different production lines of the chemical composite plating production line and the electroplating production line.

According to the invention, two liquid storage tanks are arranged at the chemical composite plating station, meanwhile, a filter tank is arranged at the upper part of the liquid storage tank, after plating solution (the temperature is higher working temperature) in the chemical plating working tank 201 works for a certain time, a valve at the bottom of the chemical plating working tank 201 is opened, and the plating solution flows into the liquid storage tank (the temperature is lower stable temperature) after being refluxed and filtered. Because the failure induction factor of the chemical composite plating solution is mainly that the surface reaction of internal hard particles cannot be effectively controlled, the self-reaction is accelerated, and the whole plating solution is failed. The plating solution flows back to one liquid storage tank through the filter tank, new plating solution in the other liquid storage tank is pumped into the chemical plating working tank 201, heating is carried out for continuous production, and the filtered plating solution in the liquid storage tank is added with new hard particles for stirring and then is used as standby, so that the plating solution is recycled in sequence, the continuous production is ensured, the production efficiency is improved, and the waste of the plating solution is avoided. After the plating solution in the electroless plating working tank 201 reaches the process temperature, counting and timing are started, and the plating solution in the electroless plating working tank 201 is completely discharged within 2 hours.

The chemical plating water washing tank and the electroplating water washing tank are independent, so that the plating solution is prevented from crossing.

The specific substances added into the basic electroless plating solution are diamond, titanium dioxide and Al besides silicon carbide ₂ O ₃ MoS2, graphite, polytetrafluoroethylene (PTFE), and the like.

The above description is only for the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art.

Claims

1. The workpiece surface treatment method is characterized in that the compatible electroplating and electroless plating equipment comprises a pretreatment device, an electroless plating device, an electroplating device, an electroless plating water washing device and an electroplating water washing device, wherein the electroless plating device comprises an electroless plating working tank, a first electroless plating liquid storage tank, a second electroless plating liquid storage tank, a first conveying pipeline, a second conveying pipeline, a first conveying pump, a second conveying pump, a first stirrer, a second stirrer, a first heating device, a second heating device, a first valve, a main recovery pipeline, a first path recovery pipeline, a second valve, a third valve, a first groove type filter screen, a second groove type filter screen, a first filter material and a second filter material, the upper part of the electroless plating working tank is connected with the first electroless plating liquid tank through a first conveying pipeline, the upper part of the electroless plating working tank is connected with the second electroless plating liquid storage tank through a second conveying pipeline, the second conveying pipeline is connected with the second chemical plating liquid storage tank through a second conveying pipeline, the first path recovery pipeline is connected with the first recovery pipeline, the first path recovery pipeline is fixedly connected with the first recovery pipeline, the first path recovery pipeline is connected with the first recovery pipeline, the first recovery pipeline is fixedly connected with the first recovery pipeline, the first recovery pipeline is connected with the top of the first recovery pipeline, the second groove type filter screen is fixedly connected with the top of the second chemical plating solution storage tank, the first filter material is placed on the first groove type filter screen, and the second filter material is placed on the second groove type filter screen; the outlet of the first path of recovery pipeline is positioned above the first groove type filter screen, and the outlet of the second path of recovery pipeline is positioned above the second groove type filter screen; the workpiece surface treatment method comprises the following steps:

The first step, the workpiece is pretreated in a pretreatment device;

secondly, preparing chemical composite plating solution;

step 1, preparing a basic electroless plating solution;

2. The method for treating a surface of a workpiece using an apparatus compatible with electroplating and electroless plating according to claim 1, wherein the pretreatment means comprises an oil removing means, a water washing means, an acid washing means, and a water washing means.

3. The method for treating a surface of a workpiece using an apparatus compatible with electroplating and electroless plating according to claim 1, wherein the first filter material is filter paper, filter cloth or filter cotton, and the second filter material is filter paper, filter cloth or filter cotton.

4. The method for treating a surface of a workpiece using an apparatus compatible with electroplating and electroless plating according to claim 3, wherein a stainless steel screen is provided on the first filter member, and a stainless steel screen is provided on the second filter member.

5. The workpiece surface treatment method is characterized in that the compatible electroplating and electroless plating equipment comprises a pretreatment device, an electroless plating device, an electroplating device, an electroless plating water washing device and an electroplating water washing device, wherein the electroless plating device comprises an electroless plating working tank, a first electroless plating liquid storage tank, a second electroless plating liquid storage tank, a first conveying pipeline, a second conveying pipeline, a first conveying pump, a second conveying pump, a first stirrer, a second stirrer, a first heating device, a second heating device, a first valve, a main recovery pipeline, a first path recovery pipeline, a second valve, a third valve, a first groove type filter screen, a second groove type filter screen, a first filter material and a second filter material, the upper part of the electroless plating working tank is connected with the first electroless plating liquid tank through a first conveying pipeline, the upper part of the electroless plating working tank is connected with the second electroless plating liquid storage tank through a second conveying pipeline, the second conveying pipeline is connected with the second chemical plating liquid storage tank through a second conveying pipeline, the first path recovery pipeline is connected with the first recovery pipeline, the first path recovery pipeline is fixedly connected with the first recovery pipeline, the first path recovery pipeline is connected with the first recovery pipeline, the first recovery pipeline is fixedly connected with the first recovery pipeline, the first recovery pipeline is connected with the top of the first recovery pipeline, the second groove type filter screen is fixedly connected with the top of the second chemical plating solution storage tank, the first filter material is placed on the first groove type filter screen, and the second filter material is placed on the second groove type filter screen; the outlet of the first path of recovery pipeline is positioned above the first groove type filter screen, and the outlet of the second path of recovery pipeline is positioned above the second groove type filter screen; the workpiece surface treatment method comprises the following steps:

The first step, the workpiece is pretreated in a pretreatment device;

secondly, preparing chemical composite plating solution;

step 1, preparing a basic electroless plating solution;

6. The workpiece surface treatment method is characterized in that the compatible electroplating and electroless plating equipment comprises a pretreatment device, an electroless plating device, an electroplating device, an electroless plating water washing device and an electroplating water washing device, wherein the electroless plating device comprises an electroless plating working tank, a first electroless plating liquid storage tank, a second electroless plating liquid storage tank, a first conveying pipeline, a second conveying pipeline, a first conveying pump, a second conveying pump, a first stirrer, a second stirrer, a first heating device, a second heating device, a first valve, a main recovery pipeline, a first path recovery pipeline, a second valve, a third valve, a first groove type filter screen, a second groove type filter screen, a first filter material and a second filter material, the upper part of the electroless plating working tank is connected with the first electroless plating liquid tank through a first conveying pipeline, the upper part of the electroless plating working tank is connected with the second electroless plating liquid storage tank through a second conveying pipeline, the second conveying pipeline is connected with the second chemical plating liquid storage tank through a second conveying pipeline, the first path recovery pipeline is connected with the first recovery pipeline, the first path recovery pipeline is fixedly connected with the first recovery pipeline, the first path recovery pipeline is connected with the first recovery pipeline, the first recovery pipeline is fixedly connected with the first recovery pipeline, the first recovery pipeline is connected with the top of the first recovery pipeline, the second groove type filter screen is fixedly connected with the top of the second chemical plating solution storage tank, the first filter material is placed on the first groove type filter screen, and the second filter material is placed on the second groove type filter screen; the outlet of the first path of recovery pipeline is positioned above the first groove type filter screen, and the outlet of the second path of recovery pipeline is positioned above the second groove type filter screen; the workpiece surface treatment method comprises the following steps:

The first step, the workpiece is pretreated in a pretreatment device;

fifthly, preparing chemical composite plating solution;

step 1, preparing a basic electroless plating solution;

7. The method for treating the surface of the workpiece is characterized by comprising equipment compatible with electroplating and chemical plating, wherein the equipment compatible with electroplating and chemical plating comprises a pretreatment device, an electroless plating device, an electroplating device, an electroless plating washing device and an electroplating water washing device, the electroless plating device comprises an electroless plating working tank, a first chemical plating liquid storage tank, a second chemical plating liquid storage tank, a first conveying pipeline, a second conveying pipeline, a first conveying pump, a second conveying pump, a first stirrer, a second stirrer, a first heating device, a second heating device, a first valve, a main recovery pipeline, a first path recovery pipeline, a second valve, a third valve, a first groove type filter screen, a second groove type filter screen, a first filter material and a second filter material, wherein the upper part of the chemical plating working tank is connected with the first chemical plating liquid tank through a first conveying pipeline, the upper part of the chemical plating working tank is connected with the first conveying pipeline through a second conveying pipeline, the second liquid storage tank is connected with the second chemical plating liquid tank through a second conveying pipeline, the first path recovery pipeline is connected with the first valve, the first path recovery pipeline is connected with the first recovery pipeline, the top of the first path recovery pipeline is connected with the first recovery pipeline, the first recovery pipeline is connected with the first recovery pipeline, the top of the first recovery pipeline is connected with the first recovery pipeline, the second groove type filter screen is fixedly connected with the top of the second chemical plating solution storage tank, the first filter material is placed on the first groove type filter screen, and the second filter material is placed on the second groove type filter screen; the outlet of the first path of recovery pipeline is positioned above the first groove type filter screen, and the outlet of the second path of recovery pipeline is positioned above the second groove type filter screen;

The workpiece surface treatment method comprises the following steps:

the first step, the workpiece is pretreated in a pretreatment device;

secondly, preparing chemical composite plating solution;

step 1, preparing a basic electroless plating solution;