CN115534152B - Wafer slicing equipment and processing technology thereof - Google Patents
Wafer slicing equipment and processing technology thereof Download PDFInfo
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- CN115534152B CN115534152B CN202211488648.9A CN202211488648A CN115534152B CN 115534152 B CN115534152 B CN 115534152B CN 202211488648 A CN202211488648 A CN 202211488648A CN 115534152 B CN115534152 B CN 115534152B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Abstract
The invention discloses wafer slicing equipment and a processing technology thereof, and relates to the technical field of wafer slicing, and the wafer slicing equipment comprises a cutting table and a cutting mechanism, wherein a substrate is vertically fixed on the left side of the upper end of the cutting table, two inverted T-shaped rods are fixedly arranged at the bottom end of a backup plate, an inverted T-shaped groove in sliding splicing with the inverted T-shaped rods is formed in the upper end of the substrate, one end of a tool apron is rotatably spliced on the right end surface of the backup plate, a plurality of cutting blades are arranged on the outer wall of the tool apron in a spiral structure, an arc-shaped guide rod is fixedly arranged in an arc-shaped guide hole, the outer wall of the arc-shaped guide rod is in sliding splicing with the inverted L-shaped rods, two compression rollers are respectively rotatably arranged at the end parts of the two inverted L-shaped rods, two support rollers extending to the lower parts of the two compression rollers are rotatably arranged in a placement notch of the substrate, and a bevel gear is meshed with a tooth groove. The invention changes the mode that a plurality of groups of cutting blades are adopted to simultaneously cut the wafer in the prior art, ensures that the end part of the wafer slice does not have a gradient section, improves the cutting precision and meets the requirements of the wafer slice.
Description
Technical Field
The invention relates to the technical field of wafer slicing, in particular to wafer slicing equipment and a processing technology thereof.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, the wafer is sliced on a slicing machine to form a thin wafer, the wafer is in a cylindrical structure before slicing, the clamping device only clamps the outer side surface of one end of the wafer, the rotating cutter is used for cutting the wafer, when the rotating cutter slices the wafer, vibration is easy to generate, the end part of the sliced wafer is in a gradient section, so that the size of the wafer is in error, and the sliced wafer cannot meet the use requirement.
Disclosure of Invention
The present invention is directed to a wafer slicing apparatus and a processing method thereof, so as to solve the problems of the background art.
In order to achieve the purpose, the invention provides the following technical scheme: wafer slicing equipment, including cutting bed and cutting mechanism, cutting mechanism includes the backup plate, the base plate, the blade holder and the cutting blade of cylindricality structure, the upper end left side at the cutting bed is fixed perpendicularly to the base plate, the bottom mounting of backup plate is equipped with two handstand T type poles, the handstand T type groove of pegging graft with handstand T type pole slip is seted up to the base plate upper end, the backup plate has all been seted up with the base plate relative lateral wall and has been placed the breach, backup plate and base plate distribute from top to bottom, the holder that can the centre gripping waited to cut the wafer is constituteed, will wait to cut wafer one end and arrange in backup plate and base plate place in the breach, the handstand T type pole with the backup plate slides along the handstand T type inslot portion of base plate inside afterwards, place the breach and grasp the wafer until two.
Two arc guiding holes have been seted up on the backup plate, and the internal fixed arc guide bar that is equipped with of arc guide hole, the outer wall of arc guide bar slides and has cup jointed handstand L type pole, and the outer wall of arc guide bar cup joints the first spring that can push down handstand L type pole in real time, the tip of two handstand L type poles all rotates and is equipped with two compression rollers, the breach internal rotation of placing of base plate is equipped with two backing rolls that extend to two compression rollers below, with the one end of wafer as for between two backing rolls and two compression rollers, the roll-in position of adjusting the compression roller according to the diameter size of wafer, be about to handstand L type pole and slide along arc guide bar outer wall, until the compression roller can the roll-in on the outer wall of wafer, the elasticity that utilizes first spring ensures that the compression roller can roll in real time on the outer wall of wafer.
The left end of backup plate is fixed with T type pole, the outer wall of T type pole slides and has cup jointed the pull sleeve, and the outer wall of T type pole cup joints the second spring that is located the pull sleeve inside, the fixed motor that is equipped with in pull sleeve's tip below, the power shaft of motor is connected with the bevel gear, the tooth's socket has been seted up to the tip of one of them compression roller, bevel gear and tooth's socket meshing, utilize second spring pad elasticity can slide the pull sleeve to the one end that is close to the backup plate in real time along the outer wall of T type pole, be about to the motor to the one end adjustment that is close to the backup plate, ensure that the bevel gear is close to the tooth's socket of compression roller, make bevel gear and tooth's socket meshing, the motor provides power and drives the bevel gear and rotates, pivoted bevel gear can drive the compression roller and rotate, the pivoted compression roller can drive by the rotation of the wafer of centre gripping.
Blade holder one end is rotated and is pegged graft at backup plate right-hand member face, and grafting department is equipped with the torsional spring, a plurality of cutting blade is the outer wall that the screw-tupe structure set up at the blade holder, rotate blade holder one end and peg graft at the backup plate right-hand member face, and be the screw-tupe structure setting with a plurality of cutting blade at the outer wall of blade holder, will be outside a cutting blade cutting edge with by the contact of the wafer outer wall of centre gripping, the wafer rotation can be realized to the starter motor, the torsional potential energy that utilizes the torsional spring can drive cutting blade with the blade holder and take the same place to rotate, can cut into the wafer gradually.
In further embodiment, a plurality of groups of mounting holes have been seted up to the blade holder outer wall of cylindricality structure, and every group mounting hole all is equipped with a plurality of, the inside of blade holder is equipped with axial distribution's regulation cavity, cutting blade's the fixed grafting piece that is equipped with in handle of a knife department, the grafting piece runs through installation Kong Houyan and extends to in the regulation cavity, according to the sliced thickness of wafer, set up the clearance between two adjacent cutting blade, can sliced thickness of wafer, the grafting piece with cutting blade runs through the installation Kong Houyan that corresponds the position and extends to in the regulation cavity, a plurality of cutting blade that will ensure the installation simultaneously is the distribution of screw-tupe structure along the outer wall of blade holder, so that satisfy the order section operation to the wafer.
In further embodiment, adjust the inside fixed cavity post that is equipped with of one end that is close to the backup plate of cavity, the outer wall of cavity post is fixed and is equipped with a plurality of and every mounting hole just right rectangular block, the rectangular channel of pegging graft with the rectangular block is seted up to the tip of grafting block, cutting blade's grafting block runs through after installation Kong Houyan that corresponds the position extends to in the regulation cavity, the rectangular channel of grafting block tip can insert the rectangular block outer wall, can ensure like this that cutting blade cutting in-process, can not take place to rotate in the mounting hole, avoid cutting blade's cutting edge and wafer outer wall dislocation, influence the effective section operation of wafer.
In further embodiment, the spacing groove has been seted up to the lateral wall of grafting piece, the cavity post tip slides and pegs graft there is the pull pole, a plurality of regulation hole has been seted up to the outer wall of cavity post, the fixed L type stopper that can slide and run through the regulation hole that is equipped with of outer wall of pull pole, the pull pole is along the inside axial direction pull of cavity post, can drive L type stopper and slide along adjusting the downthehole, insert the spacing inslot portion of grafting piece until L type stopper tip, avoid the rectangular channel and the rectangular block separation of grafting piece, thereby avoid cutting blade to break away from the mounting hole, ensure cutting blade's effective installation.
The end of the pull rod slides and runs through the hollow column, then the fixedly connected with can slide and run through the T-shaped pull rod of the side wall of the end part of the tool apron, the outer wall of the pull rod is sleeved with the third spring positioned between the hollow column and the T-shaped pull rod, the elasticity of the third spring is utilized, the T-shaped pull rod slides along the axial direction jacking of the tool apron, the L-shaped limiting block of the pull rod can slide along the adjusting hole, and the end part of the L-shaped limiting block is inserted into the limiting groove of the splicing block.
In a further embodiment, two support rods are fixedly arranged at the right end of the substrate, and the two support rods are matched with the two support rollers to stably support the wafer in the cutting process, so that the cutting stability is improved.
The outer wall of one of them bracing piece slides and has cup jointed a plurality of lantern ring, and the outer wall of the lantern ring is fixed and is equipped with arc support frame, and arc support frame's end fixing is equipped with C type cassette, C type cassette and another bracing piece outer wall joint, and arc support frame kickup utilizes kickup's cutting blade to help upwards holding up the wafer, makes like this that cutting blade cutting in-process can not contact the bracing piece, helps cutting blade to cut the wafer completely.
In a further embodiment, a magnet block is embedded in the supporting rod sleeved with the lantern ring, and the lantern ring is an iron ring.
In a further embodiment, the collecting groove has been seted up to the upper end of cutting bed, and the preceding terminal surface of cutting bed sets up the pull mouth with the collecting groove intercommunication, and the opening part of collecting groove is equipped with the filter screen of downwarping.
In a further embodiment, a scraper is slidably arranged in the collecting tank, connecting rods are fixedly arranged on two sides of the front end surface of the scraper, and a sealing cover for sealing the drawing opening is fixedly arranged between the end parts of the connecting rods on the two sides.
In further embodiment, the rear end face bottom mounting of backup plate is equipped with the mounting panel, and the mounting panel rotates through the screw hole and pegs graft there is the screw thread regulation pole, the fixed butt joint board that is equipped with in rear end face upper end of base plate, and set up on the butt joint board and rotate the screw thread matching hole of pegging graft with the screw thread regulation pole, after wafer one end is by the centre gripping in two centre gripping breachs, bare-handed screw thread regulation pole that rotates, make the tip of screw thread regulation pole rotate the screw thread matching hole of precession butt joint board, continue to rotate the screw thread regulation pole, until the unable rotation of screw thread regulation pole is given, ensure that the clearance between backup plate and the base plate does not change, realize that the wafer is stabilized the centre gripping, avoid taking place vibrations in the cutting process.
Preferably, the slicing process based on the wafer slicing device includes the following steps:
a1, placing one end of a wafer between two supporting rollers and two pressing rollers, adjusting the rolling position of the pressing rollers according to the diameter of the wafer, namely sliding an inverted L-shaped rod along the outer wall of an arc-shaped guide rod until the pressing rollers can roll on the outer wall of the wafer, and ensuring that the pressing rollers can roll on the outer wall of the wafer in real time by using the elasticity of a first spring;
a2, rotate blade holder one end and peg graft at backup plate right-hand member face to being the setting of screw-tupe structure with a plurality of cutting blade at the outer wall of blade holder, with a cutting blade cutting edge in the outside and the contact of the wafer outer wall by the centre gripping, the wafer rotation can be realized to the starter motor, utilizes the torsional potential energy of torsional spring to drive the cutting blade with the blade holder and take the same place to rotate, can cut into the wafer gradually.
Compared with the prior art, the invention has the beneficial effects that:
the invention relates to a wafer slicing device and a processing technology thereof, which change the traditional slicing mode of cutting a wafer by adopting a rotating cutter, a cutting blade is not rotated, the wafer with different diameters is clamped by matching two press rollers and two supporting rollers, simultaneously, a motor drives a bevel gear to rotate, the bevel gear is meshed with tooth grooves of the press rollers, the rotating press rollers can drive the clamped wafer to rotate, one end of a cutter holder is rotatably inserted into the right end surface of a backup plate, a plurality of cutting blades are arranged on the outer wall of the cutter holder in a spiral structure, the cutting edge of the outermost cutting blade is contacted with the outer wall of the clamped wafer, the wafer can be rotated by starting the motor, the cutter holder can drive the cutting blade to rotate in a clockwise manner by utilizing the torsional potential energy of the torsional spring, the wafer can be gradually cut into the wafer, when the cutting blade on the outer side is not cut, the adjacent cutting blade can be contacted with the wafer to carry out cutting operation, the wafer can be sequentially sliced by virtue of the torsional potential energy of the torsional spring until the torsional potential energy of the torsional spring is exhausted, the torsional potential energy of the torsional spring, the torsional spring can not be generated, the mode of cutting blade for simultaneously cutting the wafer in the prior art is changed, the mode of cutting operation on the wafer, the end of the wafer without gradient section of the wafer, the wafer is ensured, the wafer is improved in size cutting precision of the wafer slicing is improved, and the slicing requirement of the slicing is met.
Drawings
FIG. 1 is a schematic view of the main structure of the present invention;
FIG. 2 is a schematic structural view of a sleeve ring, an arc-shaped support frame and a C-shaped clamping seat of the present invention;
FIG. 3 is an enlarged view of the structure of FIG. 1 at A in accordance with the present invention;
FIG. 4 is a partial cross-sectional view of a cutting blade configuration of the present invention;
FIG. 5 is a sectional view of a cylindrical tool holder according to the present invention;
FIG. 6 is an enlarged view of the structure of FIG. 5 at B in accordance with the present invention;
FIG. 7 is a cross-sectional view of a backup plate structure of the present invention;
fig. 8 is a schematic view of the scraper and the cover structure of the present invention.
In the figure: 1. cutting table; 2. sealing the cover; 21. a connecting rod; 22. a squeegee; 3. a cutting mechanism; 31. a substrate; 32. a backup plate; 33. an inverted T-bar; 34. a T-shaped rod; 35. drawing the sleeve; 36. a motor; 37. a bevel gear; 38. pressing rollers; 39. a tooth socket; 310. an arc-shaped guide hole; 311. an inverted L-shaped bar; 312. a support roll; 313. a tool apron; 314. a cutting blade; 315. a T-shaped pull rod; 316. a support bar; 317. a collar; 318. an arc-shaped support frame; 319. a C-shaped card holder; 320. mounting holes; 321. an insertion block; 322. a rectangular groove; 323. a limiting groove; 324. a pull rod; 325. a hollow column; 326. a third spring; 327. a rectangular block; 328. an L-shaped limiting block; 329. an arc-shaped guide rod; 330. mounting a plate; 331. a screw thread adjusting rod.
Detailed Description
The following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1, 7 and 8, the present embodiment provides a wafer slicing apparatus and a processing process thereof, including a cutting table 1 and a cutting mechanism 3, the cutting mechanism 3 includes a backup plate 32, a substrate 31, a tool post 313 with a cylindrical structure and a plurality of cutting blades 314, the substrate 31 is vertically fixed on the left side of the upper end of the cutting table 1, two inverted T-shaped rods 33 are fixed at the bottom end of the backup plate 32, an inverted T-shaped groove slidably inserted into the inverted T-shaped rod 33 is formed at the upper end of the substrate 31, placing notches are formed in opposite side walls of the backup plate 32 and the substrate 31, the backup plate 32 and the substrate 31 are distributed vertically to form a clamping member capable of clamping a wafer to be cut, one end of the wafer to be cut is placed in the placing notches of the backup plate 32 and the substrate 31, and then the inverted T-shaped rods 33 of the backup plate 32 slide down along the inside of the inverted T-shaped groove of the substrate 31 until the two placing notches clamp the wafer.
In addition, a spring positioned inside the inverted T-shaped groove can be fitted to the outer wall of the inverted T-shaped rod 33, and the inverted T-shaped rod 33 can slide down along the inside of the inverted T-shaped groove in real time by the elasticity of the spring, which contributes to enhancing the stability of wafer clamping and preventing the backup plate 32 and the substrate 31 from being adjusted in position relative to each other at will.
After one end of a wafer is clamped between the substrate 31 and the backup plate 32, the wafer is in an eccentric state, and therefore the backup plate 32 can be jacked upwards under the influence of gravity of the other end, the wafer is separated from two clamping gaps, effective slicing operation of the wafer is affected, in order to ensure that the wafer can be effectively cut, the mounting plate 330 is fixedly arranged at the bottom end of the rear end face of the backup plate 32, the mounting plate 330 is rotatably inserted into the threaded adjusting rod 331 through the threaded hole, the butt plate is fixedly arranged at the upper end of the rear end face of the substrate 31, and the butt plate is provided with the threaded matching hole rotatably inserted into the threaded adjusting rod 331.
Two arc guide holes 310 are formed in the backup plate 32, an arc guide rod 329 is fixedly arranged inside the arc guide hole 310, an inverted L-shaped rod 311 is sleeved on the outer wall of the arc guide rod 329 in a sliding mode, a first spring capable of pressing the inverted L-shaped rod 311 in real time is sleeved on the outer wall of the arc guide rod 329, two pressing rollers 38 are arranged at the end portions of the two inverted L-shaped rods 311 in a rotating mode, two supporting rollers 312 extending to the lower portion of the two pressing rollers 38 are arranged in a placing notch of the substrate 31 in a rotating mode, one end of a wafer is placed between the two supporting rollers 312 and the two pressing rollers 38, the rolling position of the pressing roller 38 is adjusted according to the diameter of the wafer, the inverted L-shaped rod 311 slides along the outer wall of the arc guide rod 329 until the pressing roller 38 can roll on the outer wall of the wafer, and the pressing roller 38 can roll on the outer wall of the wafer in real time by means of elasticity of the first spring.
A T-shaped rod 34 is fixedly arranged at the left end of the backup plate 32, a drawing sleeve 35 is sleeved on the outer wall of the T-shaped rod 34 in a sliding mode, a second spring located inside the drawing sleeve 35 is sleeved on the outer wall of the T-shaped rod 34 in a sleeved mode, a motor 36 is fixedly arranged below the end portion of the drawing sleeve 35, a bevel gear 37 is connected to a power shaft of the motor 36, a tooth groove 39 is formed in the end portion of one pressing roller 38, the bevel gear 37 is meshed with the tooth groove 39, the drawing sleeve 35 can slide towards one end, close to the backup plate 32, of the outer wall of the T-shaped rod 34 in real time through the aid of elastic force of a second spring cushion, the motor 36 is adjusted towards one end, close to the backup plate 32, the bevel gear 37 is enabled to be close to the tooth groove 39 of the pressing roller 38, the bevel gear 37 is meshed with the tooth groove 39, the motor 36 provides power to drive the bevel gear 37 to rotate, the rotating bevel gear 37 can drive the pressing roller 38 to rotate, and the rotating pressing roller 38 can drive a clamped wafer to rotate.
When cutting blade 314 in the outside has not cut the completion, adjacent cutting blade 314 can contact the wafer and carry out cutting operation, can be sliced the wafer in proper order with the help of torsional spring torsional potential energy, until the torsional potential energy of torsional spring exhausts, change the tradition and adopt the pivoted cutter to carry out the slicing mode of cutting operation to the wafer, adopt cutting blade 314 now not to rotate, can not produce vibrations, adopt multiunit cutting blade 314 to carry out cutting operation's mode to the wafer simultaneously among the change prior art, ensure that the sliced tip of wafer appears not to be the tangent plane of gradient, improve wafer cutting size precision, satisfy the wafer slicing demand.
The collecting vat has been seted up to the upper end of cutting bed 1, and the preceding terminal surface of cutting bed 1 set up the pull mouth with the collecting vat intercommunication, and the opening part of collecting vat is equipped with the filter screen of downwarping, and the piece that produces among the cutting process sees through in the filter screen falls into the collecting vat of cutting bed 1, and the wafer section that downcuts drops on the filter screen.
The inside slip of collecting vat is equipped with scraper blade 22, and scraper blade 22's preceding terminal surface both sides are all fixed and are equipped with connecting rod 21, and the fixed closing cap 2 that is used for the shutoff pull mouth that is equipped with between the tip of both sides connecting rod 21, outside pull closing cap 2, closing cap 2 through connecting rod 21 pulling scraper blade 22 along the inside bottom face of collecting vat outwards slide, can promote the piece to one side that is close to the pull mouth, finally derive the piece of collecting in the collecting vat through the pull mouth.
The slicing processing technology based on the wafer slicing equipment comprises the following steps:
a1, placing one end of a wafer between two supporting rollers 312 and two pressing rollers 38, and adjusting the rolling position of the pressing roller 38 according to the diameter of the wafer, namely sliding an inverted L-shaped rod 311 along the outer wall of an arc-shaped guide rod 329 until the pressing roller 38 can roll on the outer wall of the wafer, and ensuring that the pressing roller 38 can roll on the outer wall of the wafer in real time by using the elasticity of a first spring;
a2, rotating blade holder 313 one end and pegging graft at backup plate 32 right-hand member face to being the setting of helical structure at the outer wall of blade holder 313 with a plurality of cutting blade 314, with the contact of the wafer outer wall by the centre gripping of the cutting blade 314 cutting edge in the outermost side, the wafer rotation can be realized to starter motor 36, utilizes the torsional potential energy of torsional spring to drive cutting blade 314 with the blade holder 313 and rotates along the same trend, can cut into the wafer gradually.
Example two
Please refer to fig. 1, fig. 3, fig. 4, fig. 5 and fig. 6, which are further improved based on the first embodiment:
a plurality of groups mounting hole 320 have been seted up at blade holder 313 outer wall of cylindricality structure, and every group mounting hole 320 all is equipped with a plurality of, the inside of blade holder 313 is equipped with the regulation cavity of axial distribution, the fixed grafting piece 321 that is equipped with in cutting blade 314's handle of a knife department, the grafting piece 321 runs through and extends to in the regulation cavity behind the mounting hole 320, according to the sliced thickness of wafer, set up the clearance between two adjacent cutting blade 314, can the sliced thickness of wafer, the grafting piece 321 with cutting blade 314 extends to in the regulation cavity behind the mounting hole 320 that runs through corresponding position, a plurality of cutting blade 314 that will ensure the installation simultaneously is the distribution of screw-tupe structure along the outer wall of blade holder 313, so that satisfy the order section operation to the wafer.
In the cutting process of the cutting blade 314, effective cutting can be realized only if the cutting edge of the cutting blade 314 can just face the wafer, therefore, the hollow column 325 is fixedly arranged at one end close to the backup plate 32 in the adjusting cavity, the rectangular block 327 just facing each mounting hole 320 is fixedly arranged on the outer wall of the hollow column 325, the rectangular groove 322 spliced with the rectangular block 327 is formed in the end of the splicing block 321, the splicing block 321 of the cutting blade 314 penetrates through the mounting hole 320 in the corresponding position and then extends into the adjusting cavity, the rectangular groove 322 at the end of the splicing block 321 can be inserted into the outer wall of the rectangular block 327, so that the cutting process of the cutting blade 314 can be ensured, the rotation in the mounting hole 320 can not occur, the dislocation of the cutting edge of the cutting blade 314 and the outer wall of the wafer is avoided, and the effective slicing operation of the wafer is influenced.
Spacing groove 323 has been seted up to the lateral wall of grafting piece 321, cavity post 325 tip slides and pegs graft there is pull pole 324, a plurality of regulation hole has been seted up to the outer wall of cavity post 325, the fixed L type stopper 328 that can slide through the regulation hole that is equipped with of outer wall of pull pole 324, pull pole 324 is along the inside axial direction pull of cavity post 325, can drive L type stopper 328 and slide along adjusting downthehole, insert inside the spacing groove 323 of grafting piece 321 until L type stopper 328 tip, avoid the rectangular channel 322 and the rectangular block 327 separation of grafting piece 321, thereby avoid cutting blade 314 to break away from mounting hole 320, ensure cutting blade 314's effective installation.
The end of the pulling rod 324 penetrates through the hollow column 325 in a sliding manner and then is fixedly connected with a T-shaped pull rod 315 which can penetrate through the side wall of the end of the tool apron 313 in a sliding manner, the outer wall of the pulling rod 324 is sleeved with a third spring 326 which is positioned between the hollow column 325 and the T-shaped pull rod 315, the T-shaped pull rod 315 is jacked and slid along the axial direction of the tool apron 313 by utilizing the elasticity of the third spring 326, and then the L-shaped limit block 328 of the pulling rod 324 can slide along the adjusting hole, so that the end of the L-shaped limit block 328 is inserted into the limit groove 323 of the insertion block 321.
EXAMPLE III
Please refer to fig. 1-2, which are further improved based on the second embodiment:
through the fixed two bracing pieces 316 that are equipped with in the right-hand member of base plate 31, utilize two bracing pieces 316 cooperation two backing rolls 312 to stabilize the wafer in the support cutting process, improve cutting stability.
Although the two support rods 316 can support one end of the wafer far from the clamping, the wafer can be completely cut off by the cutting blade 314, in order to prevent the support rods 316 from influencing the effective cutting operation of the cutting blade 314, a plurality of lantern rings 317 are slidably sleeved on the outer wall of one of the support rods 316, an arc-shaped support frame 318 is fixedly arranged on the outer wall of the lantern rings 317, a C-shaped clamping seat 319 is fixedly arranged at the end part of the arc-shaped support frame 318, the C-shaped clamping seat 319 is clamped with the outer wall of the other support rod 316, one end of the arc-shaped support frame 318 is sleeved on the outer wall of one of the support rods 316 through the lantern ring 317, the other end of the arc-shaped support frame 318 is clamped on the outer wall of the other support rod 316 through the C-shaped clamping seat 319, the arc-shaped support frame 318 is bent upwards, the wafer is helped to be lifted upwards by the upwardly bent cutting blade 314, and thus the wafer can not be contacted with the support rods 316 during the cutting process, and the wafer can be helped by the cutting blade 314 to completely cut the wafer.
In addition, during the cutting process, the sleeve ring 317 and the C-shaped clamping seat 319 respectively slide along the two support rods 316, so as to ensure that the arc-shaped support frame 318 and the cutting blade 314 are distributed in a staggered manner, and the effective cutting operation of the cutting blade 314 is not affected.
The magnet piece has been inlayed to the inside of a bracing piece 316 that has cup jointed the lantern ring 317, and the lantern ring 317 is the iron ring, utilizes the real-time absorption iron ring of magnet piece, avoids the lantern ring 317 to slide along bracing piece 316 outer wall at will, avoids cutting blade 314 and arc support frame 318 just to distributing, influences cutting blade 314's effective cutting operation.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. Wafer section equipment, including cutting bed (1) and cutting mechanism (3), its characterized in that: the cutting mechanism (3) comprises a backup plate (32), a base plate (31), a tool apron (313) with a cylindrical structure and a plurality of cutting blades (314), the base plate (31) is vertically fixed on the left side of the upper end of the cutting table (1), two inverted T-shaped rods (33) are fixedly arranged at the bottom end of the backup plate (32), inverted T-shaped grooves in sliding insertion connection with the inverted T-shaped rods (33) are formed in the upper end of the base plate (31), and placing notches are formed in opposite side walls of the backup plate (32) and the base plate (31);
one end of the cutter holder (313) is rotatably inserted into the right end face of the backup plate (32), a torsion spring is arranged at the inserting position, and the plurality of cutting blades (314) are arranged on the outer wall of the cutter holder (313) in a spiral structure;
two arc-shaped guide holes (310) are formed in the backup plate (32), an arc-shaped guide rod (329) is fixedly arranged in each arc-shaped guide hole (310), an inverted L-shaped rod (311) is slidably sleeved on the outer wall of each arc-shaped guide rod (329), a first spring capable of pressing down the inverted L-shaped rod (311) in real time is sleeved on the outer wall of each arc-shaped guide rod (329), two compression rollers (38) are rotatably arranged at the end parts of the two inverted L-shaped rods (311), and two supporting rollers (312) extending below the two compression rollers (38) are rotatably arranged in a placing notch of the base plate (31);
a T-shaped rod (34) is fixedly arranged at the left end of the backup plate (32), a drawing sleeve (35) is sleeved on the outer wall of the T-shaped rod (34) in a sliding mode, a second spring located inside the drawing sleeve (35) is sleeved on the outer wall of the T-shaped rod (34), a motor (36) is fixedly arranged below the end portion of the drawing sleeve (35), a power shaft of the motor (36) is connected with a bevel gear (37), a tooth groove (39) is formed in the end portion of one of the press rollers (38), and the bevel gear (37) is meshed with the tooth groove (39);
the outer wall of the cutter holder (313) with the cylindrical structure is provided with a plurality of groups of mounting holes (320), each group of mounting holes (320) is provided with a plurality of mounting holes, an adjusting cavity which is axially distributed is formed in the cutter holder (313), an inserting block (321) is fixedly arranged at the handle of the cutting blade (314), and the inserting block (321) penetrates through the mounting holes (320) and then extends into the adjusting cavity;
the inside one end that is close to backup plate (32) of regulation cavity is fixed and is equipped with well hollow column (325), the outer wall of well hollow column (325) is fixed and is equipped with a plurality of and every mounting hole (320) just right rectangular block (327), rectangular channel (322) of pegging graft with rectangular block (327) are seted up to the tip of grafting block (321).
2. The wafer dicing apparatus of claim 1, wherein: the side wall of the inserting block (321) is provided with a limiting groove (323), the end part of the hollow column (325) is inserted with a drawing rod (324) in a sliding manner, the outer wall of the hollow column (325) is provided with a plurality of adjusting holes, the outer wall of the drawing rod (324) is fixedly provided with an L-shaped limiting block (328) which can penetrate through the adjusting holes in a sliding manner, the drawing rod (324) is drawn and pulled along the axial direction in the hollow column (325), the L-shaped limiting block (328) can be driven to slide in the adjusting holes until the end part of the L-shaped limiting block (328) is inserted into the limiting groove (323) of the inserting block (321);
the end of the pull rod (324) penetrates through the hollow column (325) in a sliding mode, then the T-shaped pull rod (315) which can penetrate through the side wall of the end of the tool apron (313) in a sliding mode is fixedly connected with the end of the pull rod (324), and a third spring (326) located between the hollow column (325) and the T-shaped pull rod (315) is sleeved on the outer wall of the pull rod (324).
3. The wafer dicing apparatus of claim 1, wherein: two support rods (316) are fixedly arranged at the right end of the substrate (31);
the outer wall of one of the support rods (316) is sleeved with a plurality of lantern rings (317) in a sliding mode, the outer wall of each lantern ring (317) is fixedly provided with an arc-shaped support frame (318), the end portion of each arc-shaped support frame (318) is fixedly provided with a C-shaped clamping seat (319), and the C-shaped clamping seat (319) is clamped with the outer wall of the other support rod (316).
4. The wafer dicing apparatus of claim 3, wherein: a magnet block is embedded in the supporting rod (316) sleeved with the lantern ring (317), and the lantern ring (317) is an iron ring.
5. The wafer dicing apparatus of claim 1, wherein: the collecting groove is formed in the upper end of the cutting table (1), the front end face of the cutting table (1) is provided with a drawing opening communicated with the collecting groove, and a filter screen which bends downwards is arranged at the opening of the collecting groove.
6. The wafer dicing apparatus of claim 5, wherein: the inside slip of collecting vat is equipped with scraper blade (22), the preceding terminal surface both sides of scraper blade (22) all are fixed and are equipped with connecting rod (21), and fixed be equipped with between the tip of both sides connecting rod (21) and be used for shutoff pull-out mouthful closing cap (2).
7. The wafer dicing apparatus of claim 1, wherein: the mounting plate (330) is fixedly arranged at the bottom end of the rear end face of the backup plate (32), the mounting plate (330) is rotatably inserted with the thread adjusting rod (331) through a thread hole, the butt joint plate is fixedly arranged at the upper end of the rear end face of the base plate (31), and the butt joint plate is provided with a thread matching hole rotatably inserted with the thread adjusting rod (331).
8. The slicing method of the wafer slicing apparatus, which adopts the wafer slicing apparatus of claim 1, is characterized by comprising the following steps:
a1, placing one end of a wafer between two supporting rollers (312) and two pressing rollers (38), and adjusting the pressing position of the pressing roller (38) according to the diameter of the wafer, namely, sliding an inverted L-shaped rod (311) along the outer wall of an arc-shaped guide rod (329) until the pressing roller (38) can be pressed on the outer wall of the wafer, and ensuring that the pressing roller (38) can be pressed on the outer wall of the wafer in real time by using the elasticity of a first spring;
a2, with blade holder (313) one end rotation grafting in backup plate (32) right-hand member face, and be the outer wall that the screw-tupe structure set up at blade holder (313) with a plurality of cutting blade (314), with the contact of a cutting blade (314) cutting edge in the outside with the wafer outer wall by the centre gripping, starting motor (36) can realize that the wafer rotates, utilize the torsional potential energy of torsional spring can drive cutting blade (314) with blade holder (313) and take the lead to the situation and rotate, can cut into the wafer gradually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211488648.9A CN115534152B (en) | 2022-11-25 | 2022-11-25 | Wafer slicing equipment and processing technology thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211488648.9A CN115534152B (en) | 2022-11-25 | 2022-11-25 | Wafer slicing equipment and processing technology thereof |
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| Publication Number | Publication Date |
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| CN115534152A CN115534152A (en) | 2022-12-30 |
| CN115534152B true CN115534152B (en) | 2023-04-07 |
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| CN202211488648.9A Active CN115534152B (en) | 2022-11-25 | 2022-11-25 | Wafer slicing equipment and processing technology thereof |
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Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6418921B1 (en) * | 2001-01-24 | 2002-07-16 | Crystal Systems, Inc. | Method and apparatus for cutting workpieces |
| CN105128060A (en) * | 2015-09-23 | 2015-12-09 | 成都多力多新材料有限公司 | Rotary-cutting type sponge cutting device |
| CN205497823U (en) * | 2016-03-18 | 2016-08-24 | 浙江晶盛机电股份有限公司 | Buddha's warrior attendant line single crystal silicon rod butt equipment |
| CN108099034A (en) * | 2017-12-15 | 2018-06-01 | 德淮半导体有限公司 | For the cutter and wafer cutting process of wafer cutting |
| CN109227644A (en) * | 2018-09-19 | 2019-01-18 | 黄晓雯 | A kind of novel household corn ear stripping and slicing device |
| CN112123395A (en) * | 2020-08-25 | 2020-12-25 | 刘喜 | Heat dissipation type traditional chinese medicine section equipment |
| CN214109051U (en) * | 2020-10-31 | 2021-09-03 | 安徽铭发科技有限公司 | Cutting device for aluminum bar |
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