CN115533739A - Combined tool for uniformly grinding and polishing ultrathin coating on surface of heat sink carrier plate - Google Patents
Combined tool for uniformly grinding and polishing ultrathin coating on surface of heat sink carrier plate Download PDFInfo
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- CN115533739A CN115533739A CN202211148685.5A CN202211148685A CN115533739A CN 115533739 A CN115533739 A CN 115533739A CN 202211148685 A CN202211148685 A CN 202211148685A CN 115533739 A CN115533739 A CN 115533739A
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- carrier plate
- heat sink
- limiting disc
- polishing
- grinding
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- 238000000576 coating method Methods 0.000 title claims abstract description 32
- 239000011248 coating agent Substances 0.000 title claims abstract description 30
- 238000005498 polishing Methods 0.000 title claims abstract description 26
- 238000009966 trimming Methods 0.000 claims abstract description 25
- 238000007747 plating Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 13
- 230000005540 biological transmission Effects 0.000 claims 1
- 238000005253 cladding Methods 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 abstract description 17
- 239000010432 diamond Substances 0.000 abstract description 17
- 239000011156 metal matrix composite Substances 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 5
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 abstract description 3
- 239000002131 composite material Substances 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 244000137852 Petrea volubilis Species 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910000851 Alloy steel Inorganic materials 0.000 description 2
- 239000004484 Briquette Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Abstract
The invention provides a combined tool for uniformly grinding and polishing an ultrathin coating on the surface of a heat sink carrier plate, which comprises a limiting disc, wherein a plurality of through cavities for placing the heat sink carrier plate are arranged on the limiting disc, a pressure uniform pad for uniformly transmitting pressure is arranged above the limiting disc, a pressing block is arranged above the pressure uniform pad, trimming sleeves are sleeved outside the limiting disc, the pressure uniform pad and the pressing block, and the limiting disc, the pressure uniform pad and the pressing block are relatively fixed on the same axis by the trimming sleeves. The roughness of the surface coating of the diamond metal matrix composite material is reduced from the original Ra of more than 3.2 to Ra of less than or equal to 0.2, the requirement of gold-tin welding of a large-size high-power chip is met, and the voidage is less than or equal to 1 percent; the thickness of the plating layer can be uniformly reduced to 5um, so that the influence of the plating layer on the heat conductivity of the diamond metal matrix composite material is reduced; in addition, the method can be implemented on a common metallographic grinder, and has strong applicability and low cost.
Description
Technical Field
The invention relates to the technical field of grinding, in particular to a combined tool for uniformly grinding and polishing an ultrathin coating on the surface of a heat sink carrier plate.
Background
The high-power chip of the third generation of SiC/GaN semiconductor has extremely high requirement on heat dissipation, the high-power chip needs to be welded on a heat sink carrier plate, the heat sink carrier plate generally adopts metal-based diamond composite materials such as diamond aluminum (AlC) or diamond copper, and in order to meet the welding requirement, a metal coating must be plated on the surface of the metal-based diamond composite material heat sink carrier plate. During welding, in order to ensure that the heat dissipation effect is not affected, the voidage of the gold-tin welding of the high-power chip on the heat sink carrier plate is as close as possible to 0 (generally less than or equal to 5%), and the plating layer of the heat sink carrier plate is required to be as thin as possible and the surface roughness Ra is less than or equal to 0.2. Because the diamond is very hard, the metal-based diamond composite material is difficult to grind and polish, and the Ra of the base material is only about 1.2-1.6 at the lowest; meanwhile, the diamond is very stable in chemical property, the metal base can be corroded to a certain degree in the surface plating process, and the surface roughness after final plating can be further increased to Ra & gt 3.2. In order to ensure that the roughness Ra of the surface coating is less than or equal to 0.2, the coating is completely covered and the coating thickness is as thin as possible, the coating with the thickness of 15-30 micrometers on the surface of the coating needs to be uniformly ground and thinned and polished to reduce the roughness.
At present, the grinding and polishing mode for the ultra-thin plating layer on the surface of the heat sink carrier plate is generally manual grinding or grinding and polishing machine grinding.
The manual grinding is that a hand-held workpiece is pressed on the sand paper, the motion grinding is carried out according to the linear reciprocating motion or the 8-shaped track, and the grinding condition of the surface coating is continuously observed. The method can only grind the workpiece singly, and has low speed and low efficiency; the stress is easy to be uneven, the grinding and thinning of the plating layer are uneven, the edge collapse is easy to occur, and the completeness of the plating layer is damaged; furthermore, the fingers are subject to wear
The grinding machine adopts a grinding machine, a grinding pad (sand paper, canvas/flannelette pad) is attached to a grinding disc, then a workpiece is adhered to a sample carrying disc by using double-sided adhesive, paraffin or adhesive, and then a certain pressure is applied to press the workpiece on the grinding disc for grinding.
Disclosure of Invention
The invention aims to provide a combined tool for uniformly grinding and polishing an ultrathin coating on the surface of a heat sink carrier plate, which solves the technical problems that the grinding plane is easily stressed unevenly, the coating is ground and thinned unevenly, the edge collapse is easy to occur, and the integrity of the coating is damaged in the prior art.
The invention discloses a combined tool for uniformly grinding and polishing an ultrathin coating on the surface of a heat sink carrier plate, which comprises a limiting disc, wherein a plurality of through cavities for placing the heat sink carrier plate are arranged on the limiting disc, a pressure uniform pad for uniformly transmitting pressure is arranged above the limiting disc, a pressing block is arranged above the pressure uniform pad, trimming sleeves are sleeved outside the limiting disc, the pressure uniform pad and the pressing block, and the limiting disc, the pressure uniform pad and the pressing block are relatively fixed on the same axis by the trimming sleeves.
The working principle is as follows: when the heat sink support plate is used, a grinding pad (sand paper or canvas/flannelette pad) is fixed on a grinding disc, then the heat sink support plate is placed in a through cavity of the limiting disc, the pressure uniform pad is placed on the limiting disc, then the pressing block is placed on the pressure uniform pad, finally the grinding parameters are set after the finishing sleeve is sleeved on the pressing block, the grinding disc is made to rotate, the rotating speed is 20-40r/min, and meanwhile, the finishing sleeve rotates. Through setting up a plurality of logical chambeies, can put into a plurality of heat sink carrier plates to mutual isolation promotes grinding efficiency. Through the arrangement of the pressure uniform pad, the pressure of the pressing block can be uniformly applied to the heat sink carrier plate, and the uniform grinding and no edge collapse of the plating layer are ensured. Through setting up the trimming sleeve, the cover keeps spacing dish, the even pad of pressure, weight briquetting stable and on same axis outside spacing dish, the even pad of pressure, weight briquetting.
Furthermore, the limiting disc is circular.
Furthermore, the diameter of the limiting disc is 50-150 mm.
Furthermore, the thickness of the limiting disc is 0.05-0.3 mm smaller than that of the heat sinking carrier plate.
Through setting up the thickness of spacing plate, can guarantee that the briquetting is exerted on the heat sink carrier plate pressure ratio spacing dish slightly bigger, avoid spacing dish wearing and tearing too fast, can avoid the heat sink carrier plate too much to sink into the grinding pad again, and arouse the edge collapsing.
Furthermore, the gap between the through cavity and the heat sink carrier plate is 0.05-0.2 mm.
Further, the interval between the adjacent through cavities is 3-20mm.
Furthermore, the flatness and the parallelism of the limiting disc are both less than or equal to 0.03mm.
Through the flatness and the parallelism of the limiting disc, the grinding pad is guaranteed to be pressed flat, and the uneven surface state is avoided, so that the coating on the heat sink carrier plate is not ground uniformly.
Furthermore, the shape of the pressure uniform pad is adapted to the limiting disc.
The shape of the pressure equalizing pad is arranged, so that the pressure equalizing pad is matched with the limiting disc more.
Further, the thickness of the pressure-equalizing pad is 3-10mm.
Further, the pressure uniformity backing cloth hardness is less than 30.
Further, the pressure-equalizing pad is a liquid silica gel pad, a porous/microporous rubber pad or a latex pad with good flexibility and elasticity.
Furthermore, the double surfaces of the pressure uniform pad are pasted with double-sided self-adhesive glue films.
Through setting up the even two-sided glued membrane that pastes of pad double-sided self-adhesion of pressure, upper and lower self-adhesion fixed pressing block, spacing dish and heat sink carrier plate, guarantee the stable clear of grinding.
Furthermore, the shape of the pressing block is adapted to the limiting disc.
Furthermore, the thickness of the pressing block is 25-50mm.
Further, the press block maintains the pressure experienced by the heatsink carrier plate at 2 to 4Kpa.
Furthermore, flow grooves are uniformly distributed at the lower end of the trimming sleeve.
The flow grooves are arranged so that the inner and outer grinding materials and water can be dispersed in a flowing manner.
Furthermore, the width of the flowing groove is 0.5-2mm, and the depth is 1-10 mm.
The second purpose of the invention is to protect the use method of the combined tool for uniformly grinding and polishing the ultrathin coating on the surface of the heat sink carrier plate.
Further, when the grinding pad is new abrasive paper, the heat sink carrier plate is not placed at first, and the steps are carried out to level and pre-grind the new abrasive paper.
Through carry out flattening and pre-grinding to new abrasive paper, prevent that new abrasive paper unevenness and surperficial grit from being more sharp-pointed, cause to grind too fast and form darker mar.
Compared with the prior art, the invention has the following beneficial effects:
1. the problems of rough and large surface coating of the composite material heat sink carrier plate, low grinding and thinning efficiency of the coating, non-uniformity and easy edge collapse are solved. After the method is implemented, the roughness of the surface coating of the diamond metal matrix composite is reduced from the original Ra of more than 3.2 to Ra of less than or equal to 0.2, the requirement of gold-tin welding of a large-size high-power chip is met, and the voidage of the diamond metal matrix composite is less than or equal to 1 percent; the thickness of the plating layer can be uniformly reduced to 5um, so that the influence of the plating layer on the heat conductivity of the diamond metal matrix composite material is reduced; in addition, the method can be implemented on a common metallographic grinder, so that the applicability is strong and the cost is low;
2. by arranging the through cavities, a plurality of heat sink carrier plates can be placed in the through cavities and are isolated from one another, so that the grinding efficiency is improved;
3. by setting the thickness of the limiting plate, the pressing block applied on the heat sink carrier plate can be ensured to be slightly larger than the limiting disc, the limiting disc is prevented from being worn too fast, and the heat sink carrier plate can be prevented from being excessively sunk into the grinding pad to cause edge collapse;
4. by arranging the pressure uniform pad, the pressure of the pressing block can be uniformly applied to the heat sink carrier plate, and the uniform grinding and no edge collapse of the coating are ensured;
5. the trimming sleeve is sleeved outside the limiting disc, the pressure uniform pad and the pressing block, so that the limiting disc, the pressure uniform pad and the weight pressing block are kept stable and on the same axis;
6. by setting the flatness and the parallelism of the limiting disc, the grinding pad is ensured to be pressed flatly, and the uneven surface state of the grinding pad is avoided, so that the coating on the heat sink carrier plate is not ground uniformly;
7. the shape of the pressure uniform pad is set, so that the pressure uniform pad is more matched with the limiting disc;
8. the flow grooves are arranged so that the inner and outer grinding materials and water can be dispersed in a flowing manner.
Drawings
FIG. 1 is a schematic diagram of an experimental method according to the present invention;
FIG. 2 is a schematic diagram of an experimental method according to the present invention;
fig. 3 is a diagram of the polishing result of the diamond-aluminum composite heat sink carrier plate in example 1 of the present invention;
fig. 4 is a diagram of the polishing result of the diamond aluminum composite heatsink carrier plate according to embodiment 2 of the present invention.
In the figure: 1-a limiting disc, 2-a heat sink carrier plate, 3-a through cavity, 4-a pressure uniform pad, 5-a pressing block, 6-a trimming sleeve, 7-a flow groove, 8-a grinding pad and 9-a grinding disc.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.
Example 1
A combined tool for uniformly grinding and polishing ultrathin coatings on the surfaces of heat sink carrier plates and a using method thereof are disclosed, wherein the specific structure of the combined tool is shown in figures 1-2, and the using method comprises the following steps:
the diamond aluminum composite material heat sink carrier plate is 10 x 2mm in size, a limiting disc is designed according to the size of the heat sink carrier plate, the diameter of the limiting disc is 100mm, through cavities are arrayed inside, the interval between every two adjacent through cavities is 7.5mm, the outline size of each through cavity is 0.1mm larger than that of the heat sink carrier plate, the thickness of the limiting disc is 0.2mm smaller than that of the composite material heat sink carrier plate, the flatness and parallelism of the limiting disc are 0.03mm, the limiting disc is made of alloy steel, and the hardness RHC is not less than 55 after heat treatment.
The uniform pressure pad has the diameter of 100mm and the thickness of 8mm, the material adopts a soft and elastic liquid silica gel pad, the Brinell hardness is about 15, and the double-sided tape is self-adhesive and can be well fixed.
The diameter of the briquette is 100, the thickness is 40mm, and the material is 1Cr18Ni9Ti stainless steel.
Trimming a sleeve, wherein the inner diameter of the trimming sleeve is 100.3mm, the outer diameter of the trimming sleeve is 110.3mm, the lower end of the trimming sleeve is provided with uniformly stepped grooves, the width of each groove is 1mm, the depth of each groove is 5mm, and the trimming sleeve is made of 1Cr18Ni9Ti stainless steel;
grinding: a) Placing a limiting disc on a grinding pad (sand paper), and selecting 3000-mesh new sand paper; b) Placing a pressure uniform pad on the upper surface of the limiting disc; c) The pressing block is placed on the upper surface of the pressure equalizing pad; d) Sleeving a trimming sleeve outside the limiting disc, the pressure uniform pad and the pressing block to form a combination; e) Setting grinding parameters, wherein the rotating speed of a grinding disc is 40r/min, the autorotation of a trimming sleeve is realized, the rotating speed is 30r/min, and the grinding time is 30s; f) Taking down the trimming sleeve, the pressing block and the pressure equalizing pad; g) Placing the heat sink carrier plate in the through cavity of the limiting disc; h) Placing a pressure uniform pad on the upper surfaces of the limiting disc and the heat sink carrier plate; i) The pressing block is placed on the upper surface of the pressure equalizing pad; j) Sleeving a part trimming sleeve outside the limiting disc, the pressure equalizing pad and the pressing block to form a combination; k) Setting grinding parameters, wherein the rotating speed of a grinding disc is 30r/min, the autorotation of a trimming sleeve is carried out simultaneously, the rotating speed is 20r/min, the grinding time is 30-60s, and water is added in the process; l) then turning over to repeat steps f) -K).
As shown in figure 3, the surface of the diamond aluminum heat sink is plated with nickel by about 25um in a metallization mode, the obtained surface roughness Ra is less than or equal to 0.15, no edge collapse is generated at the periphery, and the thickness of a plating layer is reduced to 5-10um.
Example 2
A combined tool for uniformly grinding and polishing ultrathin coatings on the surface of a heat sink carrier plate and a use method thereof are disclosed, the specific structure of the combined tool is shown in figures 1-2, and the use method comprises the following steps:
the diamond aluminum composite material heat sink carrier plate is 10 × 1mm in size, a limiting disc is designed according to the size of the heat sink carrier plate, the diameter of the limiting disc is 100mm, the through cavities are arrayed inside, the interval between every two adjacent through cavities is 7.5mm, the outline size of each through cavity is 0.05mm larger than that of the heat sink carrier plate, the thickness of the limiting disc is 0.1mm smaller than that of the composite material heat sink carrier plate, the flatness and the parallelism of the limiting disc are 0.03mm, alloy steel is adopted as a material of the limiting disc, and the hardness RHC is not less than 55 after heat treatment.
The diameter of the pressure uniform pad is 100mm, the thickness is 5mm, the material adopts a soft rubber pad with good elasticity and uniformly distributed micropores inside, the Brinell hardness is about 20, and the double-sided tape is self-adhesive.
The diameter of the briquette is 100, the thickness is 40mm, and the material is 1Cr18Ni9Ti stainless steel.
Trimming a sleeve, wherein the inner diameter of the trimming sleeve is 100.3mm, the outer diameter of the trimming sleeve is 110.3mm, the lower end of the trimming sleeve is provided with grooves which are uniformly stepped, the width of each groove is 1mm, the depth of each groove is 5mm, and the material of the stainless steel is 1Cr18Ni9 Ti.
And (3) polishing: as shown in fig. 1-2 below, a) a limiting plate is placed on a piece of lapping pad (canvas pad); b) Placing the heatsink carrier plate in the through-cavity; c) Placing a pressure uniform pad on the upper surfaces of the limiting disc and the heat sink carrier plate; e) The pressing block is placed on the upper surface of the pressure equalizing pad; f) Sleeving a trimming sleeve outside the limiting disc, the pressure equalizing pad and the pressing block to form a combination; g) Setting polishing parameters, wherein the rotating speed of a grinding disc is 40r/min, the autorotation of a trimming sleeve is carried out simultaneously, the rotating speed is 35r/min, the grinding time is 60-120s, and water and a polishing agent are added in the process; then the turns are repeated a) -g).
As shown in figure 4, the surface of the diamond aluminum heat sink is plated with nickel of about 25um after metallization, after treatment, the surface roughness Ra is less than or equal to 0.1, no edge collapse is generated around the surface, and the thickness of a plating layer is 5-10um.
The above embodiments are just exemplified in the present embodiment, but the present embodiment is not limited to the above alternative embodiments, and those skilled in the art can obtain other various embodiments by arbitrarily combining with each other according to the above embodiments, and any other various embodiments can be obtained by anyone in light of the present embodiment. The above detailed description should not be construed as limiting the scope of the present embodiments, which should be defined in the appended claims, and the description should be used for interpreting the claims.
Claims (10)
1. The utility model provides a heat sink support plate surface ultra-thin cladding material is even grinds polishing and uses combination frock which characterized in that: including spacing dish (1), be provided with a plurality of logical chambeies (3) that are used for placing heat sink carrier plate (2) on spacing dish (1), spacing dish (1) top is provided with the even pad of pressure (4) that are used for even transmission pressure, the even pad of pressure (4) top is provided with briquetting (5), spacing dish (1), the even pad of pressure (4) and briquetting (5) overcoat are equipped with and maintain sleeve (6), it will to maintain sleeve (6) spacing dish (1), the even pad of pressure (4) and briquetting (5) relatively fixed are to same axis.
2. The combined tool for uniformly grinding and polishing the ultrathin coating on the surface of the heat sink carrier plate according to claim 1, characterized in that: the diameter of the limiting disc (1) is 50-150 mm.
3. The combined tool for uniformly grinding and polishing the ultrathin coating on the surface of the heat sink carrier plate according to claim 1, characterized in that: the thickness of the limiting disc (1) is 0.05-0.3 mm smaller than that of the heat sink carrier plate (2).
4. The combined tool for uniformly grinding and polishing the ultra-thin plating on the surface of the heatsink carrier plate according to claim 1, wherein a gap between the through cavity (3) and the heatsink carrier plate (2) is 0.05-0.2 mm.
5. The combined tool for uniformly grinding and polishing the ultrathin coating on the surface of the heat sink carrier plate according to claim 1, characterized in that: the interval between the adjacent through cavities (3) is 3-20mm.
6. The combined tool for uniformly grinding and polishing the ultrathin coating on the surface of the heat sink carrier plate according to claim 1, characterized in that: the planeness and the parallelism of the limiting disc (1) are both less than or equal to 0.03mm.
7. The combined tool for uniformly grinding and polishing the ultrathin coating on the surface of the heat sink carrier plate according to claim 1, characterized in that: the shape of the pressure uniform pad (4) is adapted to the limiting disc (1).
8. The combined tool for uniformly grinding and polishing the ultrathin coating on the surface of the heat sink carrier plate according to claim 1, characterized in that: the shape of the pressing block (5) is adapted to the limiting disc (1).
9. The combined tool for uniformly grinding and polishing the ultrathin coating on the surface of the heat sink carrier plate according to claim 1, characterized in that: and flow grooves (7) are uniformly distributed at the lower end of the trimming sleeve (6).
10. The use method of the combined tool for uniformly grinding and polishing the ultra-thin plating on the surface of the heatsink carrier plate according to any one of claims 1 to 9, characterized in that: the heat sink carrier plate (2) is placed in the through cavity (3) of the limiting disc (1), the pressure uniform pad (4) is placed on the limiting disc (1), the pressing block (5) is placed on the pressure uniform pad (4), and finally the grinding parameters are set after the finishing sleeve (6) is sleeved on the pressing block, so that the grinding disc (9) rotates.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211148685.5A CN115533739A (en) | 2022-09-21 | 2022-09-21 | Combined tool for uniformly grinding and polishing ultrathin coating on surface of heat sink carrier plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211148685.5A CN115533739A (en) | 2022-09-21 | 2022-09-21 | Combined tool for uniformly grinding and polishing ultrathin coating on surface of heat sink carrier plate |
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| US7648409B1 (en) * | 1999-05-17 | 2010-01-19 | Sumitomo Mitsubishi Silicon Corporation | Double side polishing method and apparatus |
| CN101484979A (en) * | 2006-05-03 | 2009-07-15 | 圣劳伦斯纳米科技有限公司 | Method and apparatus for chemical mechanical polishing of large size wafer with capability of polishing individual die |
| CN202491164U (en) * | 2011-09-07 | 2012-10-17 | 宜硕科技(上海)有限公司 | Grinding tool for semiconductor elements |
| CN105269452A (en) * | 2015-11-17 | 2016-01-27 | 四川制动科技股份有限公司 | Slide valve grinding clamp used for disc grinder and clamping method for slide valves |
| CN206925702U (en) * | 2017-07-08 | 2018-01-26 | 上海致领半导体科技发展有限公司 | It is a kind of for semiconductor wafer polishing without wax polishing template |
| CN209565971U (en) * | 2019-01-24 | 2019-11-01 | 深圳市正和兴电子有限公司 | A kind of grinding wafer device |
| CN211992397U (en) * | 2020-05-02 | 2020-11-24 | 青岛海泰光电技术有限公司 | Plane polishing device for optical crystal component |
| CN215433135U (en) * | 2020-12-28 | 2022-01-07 | 国泰达鸣精密机件（深圳）有限公司 | Abrasive flow deburring device |
| CN112318362A (en) * | 2021-01-06 | 2021-02-05 | 强信机械科技(莱州)有限公司 | Follow-up rotary grinding device |
| CN115008318A (en) * | 2022-06-16 | 2022-09-06 | 南京工业职业技术大学 | Pneumatic loading type double-sided ring polishing machine |
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