CN115533249B - Adjustable chip inductor welding mechanism - Google Patents
Adjustable chip inductor welding mechanism Download PDFInfo
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- CN115533249B CN115533249B CN202211235424.7A CN202211235424A CN115533249B CN 115533249 B CN115533249 B CN 115533249B CN 202211235424 A CN202211235424 A CN 202211235424A CN 115533249 B CN115533249 B CN 115533249B
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- smearing
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- 238000003466 welding Methods 0.000 title claims abstract description 54
- 230000007246 mechanism Effects 0.000 title claims abstract description 41
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000005476 soldering Methods 0.000 claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 238000009434 installation Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention provides an adjustable patch inductance welding mechanism, and relates to the technical field of patch inductors. The adjustable patch inductance welding mechanism comprises a mounting cylinder, a pushing assembly, a guiding and positioning assembly, a smearing assembly and a heating assembly, wherein a containing cavity for containing soldering paste is formed in a first end part of the mounting cylinder, and a feeding port is formed in the side wall of the mounting cylinder; the pushing component is arranged in the first end part of the mounting cylinder, can axially move along the mounting cylinder, and is provided with a magnetic attraction piece for adsorbing the back surface of the patch inductor; the guiding and positioning assembly is arranged in the second end part of the mounting cylinder, and the pushing assembly can push the patch inductor adsorbed on the magnetic attraction piece to move along the guiding and positioning assembly; the smearing component is arranged on the guiding and positioning component and is communicated with the accommodating cavity through a tin outlet pipeline; the heating component is arranged on the mounting cylinder. Based on the technical scheme of the invention, the mounting of the patch inductor is convenient.
Description
Technical Field
The invention relates to the technical field of chip inductors, in particular to an adjustable chip inductor welding mechanism.
Background
At present, a chip inductor is often required to be installed on a circuit board, and the common installation mode of the chip inductor is generally to smear soldering paste on a welding base firstly, then heat the soldering paste by using a hot air gun, then clamp the chip inductor by using tweezers and place the soldering paste at a welding position, and the soldering is completed after the soldering paste is cooled. The solder paste has certain viscosity at normal temperature, can be used for initially adhering the electronic components at a given position, and is used for welding the components to be welded with the printed circuit pads together to form permanent connection along with the volatilization of the solvent and part of the additives at the welding temperature. Because of the small size of the inductor, the tweezers are easy to shift the welding position when clamping, and the installation is failed.
Disclosure of Invention
To the problem among the above-mentioned prior art, this application provides a paster inductance welding mechanism with adjustable, can be convenient for the installation of paster inductor.
The invention provides an adjustable patch inductance welding mechanism, which comprises:
the solder paste filling device comprises a mounting cylinder, a first end part and a second end part, wherein a containing cavity for containing solder paste is formed in the first end part of the mounting cylinder, and a feeding port is formed in the side wall of the mounting cylinder;
the pushing component is arranged in the first end part of the mounting cylinder, can axially move along the mounting cylinder, and is provided with a magnetic attraction piece for adsorbing the back surface of the patch inductor;
the guiding and positioning assembly is arranged in the second end part of the mounting cylinder, and the pushing assembly can push the patch inductor adsorbed on the magnetic attraction piece to move along the guiding and positioning assembly;
the smearing component is arranged on the guiding and positioning component and communicated with the accommodating cavity through a tin outlet pipeline, and is used for smearing soldering paste on the welding surface of the patch inductor; and
and the heating component is arranged on the mounting cylinder and is used for heating the soldering paste on the patch inductor.
As a further improvement of the above technical scheme:
the adjustable patch inductance welding mechanism further comprises an annular accommodating cavity, the pushing assembly comprises a pushing rod which is slidably arranged at the inner side of the accommodating cavity in a guiding manner, the first end of the pushing rod penetrates through the accommodating cavity and is provided with the magnetic attraction piece, the upper side of the accommodating cavity is provided with a pushing plate which can move in the accommodating cavity along the axial direction of the mounting cylinder, and a first elastic piece is arranged between the pushing plate and the second end of the pushing rod.
The adjustable patch inductance welding mechanism further comprises a plurality of limiting plates which are arranged along the circumferential direction of the mounting cylinder, wherein the limiting plates extend along the axial direction of the mounting cylinder, the limiting plates move along the radial direction of the mounting cylinder through guide pieces, and second elastic pieces which are used for driving the limiting plates to be close to each other are arranged between the limiting plates and the mounting cylinder.
The adjustable patch inductance welding mechanism further comprises a guide plate arranged at one end, close to the accommodating cavity, of the limiting plate, the first end of the guide plate is rotatably installed on the limiting plate, and the second end of the guide plate is attached to the inner side wall of the installation cylinder through the action of a third elastic piece.
The adjustable patch inductance welding mechanism further comprises a lifting groove extending along the axial direction of the mounting cylinder, the smearing component comprises a mounting block capable of sliding along the lifting groove, a movable block capable of moving along the radial direction of the mounting cylinder relative to the mounting block, and a smearing block mounted on the movable block, a plurality of tin outlet holes are formed in the smearing block along the radial direction of the mounting cylinder at intervals, a tin outlet pipeline is communicated with the smearing block, a fourth elastic piece for driving the movable block to move is arranged between the movable block and the mounting block, the first ends of the smearing blocks are mutually abutted, and the second ends of the smearing blocks are abutted to the movable block.
The adjustable patch inductance welding mechanism further comprises a second end of the smearing block capable of rotating relative to the movable block, the mounting block at the lower side of the smearing block is provided with a bottom plate capable of moving relative to the mounting block along the radial direction of the mounting cylinder, a fifth elastic piece is arranged between the bottom plate and the mounting block, sliding blocks are arranged on two sides of the bottom plate, the guiding piece comprises a first guiding block close to the second end of the mounting cylinder, the first guiding block is provided with a guiding chute, the pushing assembly can push the patch inductor to move along the axial direction of the mounting cylinder and drive the sliding block to move along the guiding chute, and the bottom plate moves relative to the mounting block along the radial direction of the mounting cylinder outwards until the smearing block rotates, so that the patch inductor is attached to a circuit board.
The adjustable patch inductance welding mechanism further comprises a second guide block far away from the second end of the mounting cylinder.
The adjustable patch inductance welding mechanism further comprises a sixth elastic piece which is used for driving the installation block to reset to the upper end of the lifting groove.
The adjustable patch inductance welding mechanism further comprises a hot air blower arranged on the outer side wall of the installation cylinder in a surrounding mode and a plurality of hot air pipes arranged at intervals along the circumferential direction of the outer side wall of the installation cylinder, and the hot air pipes can drain hot air generated by the hot air blower to the second end of the installation cylinder.
The adjustable patch inductance welding mechanism further comprises a controller for controlling the air heater, and the controller is mounted at the first end of the mounting cylinder.
The above-described features may be combined in various suitable ways or replaced by equivalent features as long as the object of the present invention can be achieved.
Compared with the prior art, the adjustable patch inductance welding mechanism provided by the invention has at least the following beneficial effects: when the chip inductor needs to be welded, the chip inductor is placed into the mounting cylinder from the feed inlet and adsorbed on the magnetic attraction piece on the pushing component, then the pushing component is driven to axially move along the mounting cylinder, the pushing component pushes the chip inductor adsorbed on the magnetic attraction piece to move along the guiding and positioning component, meanwhile, the soldering paste is coated on the soldering surface of the chip inductor by the coating component, the chip inductor is attached on the circuit board by the pushing component, the heating component is started, and the soldering paste on the chip inductor is heated, so that the chip inductor is welded on the circuit board. The patch inductor is welded by using the adjustable patch inductor welding mechanism, and the magnetic attraction piece and the guiding positioning assembly are used for jointly positioning the patch inductor, so that the welding positioning accuracy of the patch inductor is improved, and the installation of the patch inductor is facilitated.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
The invention will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:
fig. 1 shows an external structural schematic diagram of an adjustable chip inductance welding mechanism according to an embodiment of the present invention;
fig. 2 shows a schematic diagram of an internal structure of an adjustable chip inductance welding mechanism according to an embodiment of the invention;
fig. 3 shows a second schematic diagram of an internal structure of the adjustable chip inductor welding mechanism according to the embodiment of the invention;
fig. 4 is a schematic structural diagram of a guiding positioning assembly of an adjustable chip inductance welding mechanism according to an embodiment of the present invention;
fig. 5 shows a schematic structural diagram of a smearing component of an adjustable chip inductance welding mechanism according to an embodiment of the present invention;
fig. 6 shows a second schematic structural diagram of a smearing component of the adjustable patch inductance welding mechanism according to the embodiment of the present invention;
fig. 7 is a schematic structural diagram of a first guide block of an adjustable chip inductance welding mechanism according to an embodiment of the present invention.
In the drawings, like parts are designated with like reference numerals. The figures are not to scale.
Reference numerals:
100-adjustable chip inductor welding mechanism, 110-mounting cylinder, 111-accommodating cavity, 112-tin outlet pipeline, 113-feeding port, 114-chute, 120-pushing component, 121-magnetic attraction component, 122-pushing rod, 123-pushing plate, 124-first elastic component, 130-guiding positioning component, 131-limiting plate, 132-second elastic component, 133-guiding piece, 134-third elastic component, 135-lifting groove, 136-first guiding block, 137-guiding chute, 138-second guiding block, 139-sixth elastic component, 140-smearing component, 141-mounting block, 142-smearing block, 143-tin outlet hole, 144-fourth elastic component, 145-bottom plate, 146-fifth elastic component, 147-sliding block, 148-movable block, 150-heating component, 151-hot air blower, 152-hot air pipe and 153-controller.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
The invention will be further described with reference to the accompanying drawings.
The embodiment of the invention provides an adjustable patch inductance welding mechanism 100, which can facilitate the installation of a patch inductor.
Referring to fig. 1 to 7, an adjustable chip inductor welding mechanism 100 according to an embodiment of the invention includes a mounting cylinder 110, a pushing component 120, a guiding and positioning component 130, a coating component 140 and a heating component 150.
Referring to fig. 1 and 2, a first end of the mounting barrel 110 is formed with a receiving cavity 111 for receiving solder paste, and a side wall of the mounting barrel 110 is provided with a feed inlet 113; the pushing component 120 is installed in the first end part of the installation cylinder 110, the pushing component 120 can axially move along the installation cylinder 110, and a magnetic attraction piece 121 for attracting the back surface of the patch inductor is arranged on the pushing component 120; referring to fig. 2 and 3, the guiding and positioning assembly 130 is installed in the second end of the mounting cylinder 110, and the pushing assembly 120 can push the chip inductor adsorbed on the magnetic attraction member 121 to move along the guiding and positioning assembly 130; the coating assembly 140 is mounted on the guiding and positioning assembly 130 and is communicated with the accommodating cavity 111 through the tin outlet pipeline 112, and the coating assembly 140 is used for coating soldering paste on the welding surface of the chip inductor; the heating assembly 150 is mounted to the mounting cylinder 110 for heating solder paste on the chip inductor.
When the chip inductor needs to be welded, the chip inductor is firstly placed into the mounting cylinder 110 from the feed inlet 113 and is adsorbed on the magnetic attraction piece 121 on the pushing component 120, then the pushing component 120 is driven to axially move along the mounting cylinder 110, the pushing component 120 pushes the chip inductor adsorbed on the magnetic attraction piece 121 to move along the guiding and positioning component 130, meanwhile, the smearing component 140 smears solder paste on the welding surface of the chip inductor, and finally the pushing component 120 attaches the chip inductor on a circuit board, the heating component 150 is started, and the solder paste on the chip inductor is heated, so that the chip inductor is welded on the circuit board. The patch inductor is welded by using the adjustable patch inductor welding mechanism 100, and the magnetic attraction piece 121 and the guide positioning assembly 130 are used for positioning the patch inductor together, so that the welding positioning accuracy of the patch inductor is improved, and the installation of the patch inductor is facilitated.
Referring to fig. 2 and 3 specifically, the accommodating cavity 111 is annular, the pushing assembly 120 includes a pushing rod 122 slidably disposed inside the accommodating cavity 111, a first end of the pushing rod 122 passes through the accommodating cavity 111 and is provided with a magnetic attraction member 121, a pushing plate 123 capable of moving along an axial direction of the mounting cylinder 110 in the accommodating cavity 111 is disposed on an upper side of the accommodating cavity 111, and a first elastic member 124 is disposed between the pushing plate 123 and a second end of the pushing rod 122. The pushing rod 122 is driven to axially move along the mounting cylinder 110 to push the chip inductor adsorbed on the magnetic attraction piece 121 to move along the guiding and positioning assembly 130, and meanwhile, the first elastic piece 124 is compressed to drive the pushing plate 123 to squeeze and hold the solder paste in the cavity 111, and the solder paste enters the smearing assembly 140 along the solder outlet pipeline 112 to smear the solder paste on the welding surface of the chip inductor.
Referring to fig. 3 and fig. 4 specifically, referring to an adjustable chip inductor welding mechanism 100 provided by an embodiment of the present invention, a guiding positioning assembly 130 includes a plurality of limiting plates 131 arranged along a circumferential direction of a mounting cylinder 110, the limiting plates 131 extend along an axial direction of the mounting cylinder 110, the limiting plates 131 move along a radial direction of the mounting cylinder 110 through guiding members, and a second elastic member 132 for driving the limiting plates 131 to approach each other is disposed between the limiting plates 131 and the mounting cylinder 110. The limiting plate 131 is provided with a guide plate 133 near one end of the accommodating cavity 111, a first end of the guide plate 133 is rotatably mounted on the limiting plate 131, and a second end of the guide plate 133 is attached to the inner side wall of the mounting barrel 110 through the action of a third elastic piece 134.
The driving pushing rod 122 moves axially along the mounting cylinder 110 to push the patch inductor adsorbed on the magnetic attraction piece 121 to move towards the second end of the mounting cylinder 110, the patch inductor is guided between the limiting plates 131 by the guide piece 133, and along with the difference of the size of the patch inductor, the limiting plates 131 move radially along the mounting cylinder 110 through the guide piece to adapt to the size of the patch inductor, and the limiting plates 131 clamp the patch inductor through the second elastic piece 132, so that the positioning of the patch inductor is completed.
In this embodiment, referring to fig. 3 and fig. 4 specifically, the guiding and positioning assembly 130 includes four limiting plates 131 arranged along the circumferential direction of the mounting cylinder 110, where the four limiting plates 131 form 90 angles in sequence, and clamp the chip inductor in four directions of front, rear, left and right of the chip inductor respectively; the guide includes a first guide block 136 proximate the second end of the mounting cylinder 110 and a second guide block 138 distal the second end of the mounting cylinder 110. Of course, it is understood that the guide positioning assembly 130 may also include other numbers of limiting plates 131 arranged along the circumference of the mounting cylinder 110; the guide may also include other numbers of guide blocks, not limited herein.
Referring to fig. 3 and 4, the limiting plate 131 is provided with a lifting groove 135 extending along the axial direction of the mounting cylinder 110,
the smearing assembly 140 comprises a mounting block 141 capable of sliding along the lifting groove 135, a movable block 148 capable of moving along the radial direction of the mounting cylinder 110 relative to the mounting block 141 and a smearing block 142 mounted on the movable block 148, a plurality of tin outlet holes 143 are formed in the smearing block 142 along the radial direction of the mounting cylinder 110 at intervals, a tin outlet pipeline 112 is communicated with the smearing block 142, a fourth elastic piece 144 for driving the movable block 148 to move is arranged between the movable block 148 and the mounting block 141, the first ends of the smearing blocks 142 are mutually abutted, and the second ends of the smearing blocks 142 are abutted against the movable block 148.
The welding surface of the patch inductor moves downwards to be abutted against the smearing block 142, the smearing block 142 is pushed to move downwards, the mounting block 141 can move downwards to slide along the axial direction of the mounting cylinder 110 in the lifting groove 135 positioned on the limiting plate 131, the first ends of the smearing block 142 are always abutted against each other under the action of the fourth elastic piece 144, according to the difference of the size of the patch inductor, the limiting plate 131 moves along the radial direction of the mounting cylinder 110 through the guide piece to adapt to the size of the patch inductor, so that the opening quantity of the tin outlet holes 143 is controlled, the larger the size of the patch inductor is, the larger the pushing distance between the limiting plate 131 and the first guide block 136 is, the larger the extending distance of the smearing block 142 is, the quantity of the tin outlet holes 143 contacted with the bottom surface of the inductor is, and the downward pushing force of the first elastic piece 124 drives the pushing plate 123 to move downwards to squeeze the solder paste in the accommodating cavity 111 into the tin outlet pipe to be discharged to the tin outlet holes 143, so that automatic tin coating is realized. The side wall of the mounting cylinder 110 is further provided with a sliding groove 114 corresponding to the lifting groove 135, and when the size of the chip inductor is large, the outer side of the mounting block 141 can penetrate through the sliding groove 114, so that the side wall of the mounting cylinder 110 is prevented from affecting the radial movement of the mounting block 141.
Referring to fig. 5 and 6, a second end of a smearing block 142 can rotate relative to a movable block 148, a bottom plate 145 capable of moving along a radial direction of a mounting cylinder 110 relative to the mounting block 141 is arranged on a mounting block 141 at the lower side of the movable block 148, a fifth elastic piece 146 is arranged between the bottom plate 145 and the mounting block 141, sliding blocks 147 are arranged at two sides of the bottom plate 145, referring to fig. 7, a guiding chute 137 is arranged on a first guiding block 136, a pushing component 120 can push a paster inductor to move along the axial direction of the mounting cylinder 110 and drive the sliding block 147 to move along the guiding chute 137, and the bottom plate 145 moves outwards along the radial direction of the mounting cylinder 110 relative to the mounting block 141 until the smearing block 142 rotates, so that the paster inductor is attached to a circuit board.
The second end of the smearing block 142 can rotate relative to the movable block 148, when the mounting block 141 moves downwards, the smearing block 142 is limited by the action of the fifth elastic piece 146, the smearing block 142 is prevented from rotating by the bottom plate 145, until the sliding block 147 of the bottom plate 145 slides into the guiding chute 137 of the first guiding block 136, the mounting block 141 continues to move downwards, the sliding block 147 slides in the guiding chute 137 to drive the bottom plate 145 to slide relative to the mounting block 141, the fifth elastic piece 146 is compressed, the limitation on the rotation of the smearing block 142 is gradually relieved, the smearing block 142 at the position gradually rotates downwards, the plurality of smearing blocks 142 simultaneously support against the side face of the chip inductor and are clamped, and the chip inductor gradually moves downwards to the mounting position along with the pushing of the magnetic attraction block, at the moment, the heating assembly 150 is started, solder paste on the chip inductor is heated, and the chip inductor is welded on the circuit board.
Referring to fig. 5 and 6, a sixth elastic member 139 for driving the mounting block 141 to return to the upper end of the lifting slot 135 is disposed between the mounting block 141 and the limiting plate 131. After the chip inductor is welded on the circuit board, the pushing rod 122 is loosened, the pushing rod 122 is reset under the action of the first elastic piece 124, the sixth elastic piece 139 is contracted, and the mounting block 141 is reset to the upper end of the lifting groove 135, specifically: the sixth elastic member 139 is extended, so that the sliding block 147 slides in the guiding chute 137 to drive the bottom plate 145 to slide relative to the mounting block 141, the bottom plate 145 pushes the smearing block 142 to rotate along the radial direction of the mounting cylinder 110, and then the mounting block 141 is reset to the upper end of the lifting groove 135.
Referring to fig. 1 and 2 specifically, a heating assembly 150 includes an air heater 151 disposed around an outer sidewall of a mounting cylinder 110 and a plurality of hot air pipes 152 circumferentially spaced along the outer sidewall of the mounting cylinder 110, where the hot air pipes 152 can guide hot air generated by the air heater 151 to a second end of the mounting cylinder 110. The heating assembly 150 further includes a controller 153 for controlling the air heater 151, and the controller 153 is mounted at the first end of the mounting cylinder 110 to facilitate control of the controller 153.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the different dependent claims and the features described herein may be combined in ways other than as described in the original claims. It is also to be understood that features described in connection with separate embodiments may be used in other described embodiments.
Claims (10)
1. Adjustable paster inductance welding mechanism, its characterized in that, adjustable paster inductance welding mechanism includes:
the solder paste filling device comprises a mounting cylinder, a first end part and a second end part, wherein a containing cavity for containing solder paste is formed in the first end part of the mounting cylinder, and a feeding port is formed in the side wall of the mounting cylinder;
the pushing component is arranged in the first end part of the mounting cylinder, can axially move along the mounting cylinder, and is provided with a magnetic attraction piece for adsorbing the back surface of the patch inductor;
the guiding and positioning assembly is arranged in the second end part of the mounting cylinder, and the pushing assembly can push the patch inductor adsorbed on the magnetic attraction piece to move along the guiding and positioning assembly;
the smearing component is arranged on the guiding and positioning component and communicated with the accommodating cavity through a tin outlet pipeline, and is used for smearing soldering paste on the welding surface of the patch inductor; and
and the heating component is arranged on the mounting cylinder and is used for heating the soldering paste on the patch inductor.
2. The adjustable chip inductor welding mechanism according to claim 1, wherein the accommodating cavity is annular, the pushing assembly comprises a pushing rod slidably arranged in the accommodating cavity in a guiding manner, a first end of the pushing rod penetrates through the accommodating cavity and is provided with the magnetic attraction piece, a pushing plate capable of moving in the accommodating cavity along the axial direction of the mounting cylinder is arranged on the upper side of the accommodating cavity, and a first elastic piece is arranged between the pushing plate and the second end of the pushing rod.
3. The adjustable chip inductor welding mechanism according to claim 1, wherein the guiding and positioning assembly comprises a plurality of limiting plates arranged along the circumferential direction of the mounting cylinder, the limiting plates extend along the axial direction of the mounting cylinder, the limiting plates move along the radial direction of the mounting cylinder through guiding elements, and a second elastic element for driving the limiting plates to approach each other is arranged between the limiting plates and the mounting cylinder.
4. The adjustable chip inductor welding mechanism according to claim 3, wherein a guide plate is arranged at one end of the limiting plate, which is close to the accommodating cavity, and a first end of the guide plate is rotatably mounted on the limiting plate, and a second end of the guide plate is attached to the inner side wall of the mounting cylinder through a third elastic member.
5. The adjustable chip inductor welding mechanism according to claim 3, wherein the limiting plate is provided with a lifting groove extending along the axial direction of the mounting cylinder, the smearing component comprises a mounting block capable of sliding along the lifting groove, a movable block capable of moving along the radial direction of the mounting cylinder relative to the mounting block, and a smearing block mounted on the movable block, a plurality of tin outlet holes are formed in the smearing block at intervals along the radial direction of the mounting cylinder, the tin outlet pipeline is communicated with the smearing block, a fourth elastic piece for driving the movable block to move is arranged between the movable block and the mounting block, the first ends of the smearing blocks are mutually abutted, and the second ends of the smearing blocks are abutted to the movable block.
6. The adjustable chip inductor welding mechanism according to claim 5, wherein the second end of the smearing block can rotate relative to the movable block, a bottom plate capable of moving radially relative to the mounting block along the mounting cylinder is arranged on the mounting block at the lower side of the smearing block, a fifth elastic piece is arranged between the bottom plate and the mounting block, sliding blocks are arranged on two sides of the bottom plate, the guiding pieces comprise first guiding blocks close to the second end of the mounting cylinder, the first guiding blocks are provided with guiding grooves, the pushing assembly can push the chip inductor to move axially along the mounting cylinder and drive the sliding blocks to move along the guiding grooves, and the bottom plate moves radially outwards relative to the mounting block along the mounting cylinder until the smearing block rotates, so that the chip inductor is attached to a circuit board.
7. The adjustable patch inductance welding mechanism of claim 6, wherein the guide further includes a second guide block distal from the second end of the mounting barrel.
8. The adjustable chip inductor welding mechanism according to claim 5, wherein a sixth elastic member for driving the mounting block to reset to the upper end of the lifting groove is arranged between the mounting block and the limiting plate.
9. The adjustable patch inductance welding mechanism according to claim 1, wherein the heating assembly comprises a hot air blower arranged around the outer side wall of the mounting cylinder and a plurality of hot air pipes arranged at intervals along the circumferential direction of the outer side wall of the mounting cylinder, and the hot air pipes can guide hot air generated by the hot air blower to the second end of the mounting cylinder.
10. The adjustable patch inductance welding mechanism of claim 9, wherein the heating assembly further includes a controller for controlling the air heater, the controller being mounted to the first end of the mounting barrel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211235424.7A CN115533249B (en) | 2022-10-10 | 2022-10-10 | Adjustable chip inductor welding mechanism |
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| CN202211235424.7A CN115533249B (en) | 2022-10-10 | 2022-10-10 | Adjustable chip inductor welding mechanism |
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| CN115533249B true CN115533249B (en) | 2023-04-28 |
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| CN116779322B (en) * | 2023-07-03 | 2024-02-13 | 湖南锦络电子股份有限公司 | Automatic change paster inductance coiling machine |
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| CN112423490A (en) * | 2020-11-23 | 2021-02-26 | 广州艺鸣电容器有限公司 | Automatic welding device for chip inductor |
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| CN114289816A (en) * | 2021-12-10 | 2022-04-08 | 王晓娜 | Assembling system for welding patch element |
| CN114918506A (en) * | 2022-05-30 | 2022-08-19 | 南通中铁华宇电气有限公司 | LED core plate tin brushing device based on visual detection |
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| JP2010162577A (en) * | 2009-01-16 | 2010-07-29 | Kuroda Techno Co Ltd | Heating iron and apparatus for soldering lead wire for solar cell |
| CN112423490A (en) * | 2020-11-23 | 2021-02-26 | 广州艺鸣电容器有限公司 | Automatic welding device for chip inductor |
| CN215997346U (en) * | 2021-09-23 | 2022-03-11 | 深圳市腾盛精密装备股份有限公司 | Hot melt adhesive heating device and dispensing equipment |
| CN114289816A (en) * | 2021-12-10 | 2022-04-08 | 王晓娜 | Assembling system for welding patch element |
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Effective date of registration: 20240613 Address after: 425000 Factory Building 1, Hengtai Industrial Park, West Side of Yuanjia Road, Changfeng Avenue, Yongzhou Economic and Technological Development Zone, Yongzhou City, Hunan Province Patentee after: Hunan Youluo Electronic Technology Co.,Ltd. Country or region after: China Address before: Southwest corner of the intersection of Changfeng Avenue and Qinshui Road, Lengshuitan District, Yongzhou City, Hunan Province 425001 Patentee before: Hunan Jinluo Electronics Co.,Ltd. Country or region before: China |