CN115519129A - Preparation method of silver powder for conductive paste - Google Patents
Preparation method of silver powder for conductive paste Download PDFInfo
- Publication number
- CN115519129A CN115519129A CN202210936670.9A CN202210936670A CN115519129A CN 115519129 A CN115519129 A CN 115519129A CN 202210936670 A CN202210936670 A CN 202210936670A CN 115519129 A CN115519129 A CN 115519129A
- Authority
- CN
- China
- Prior art keywords
- silver powder
- wet
- silver
- surface treatment
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
Abstract
本发明公开了一种导电浆料用银粉的制备方法,以含银溶液和还原剂溶液制得湿态银粉,以疏水性表面活性剂与溶剂混合成的有机溶剂加水乳化制得表面处理剂,将表面处理剂与湿态银粉包覆处理制得银粉。表面处理剂采用疏水性表面活性剂且乳化形成油包水型乳液,表面处理剂在制备湿态银粉后加入,能将银粉包覆完全,使制得的银粉粒子分散性好、无团聚,可重新在非极性溶剂中分散,银粉粒子粒径均匀、粒径分布窄、平均粒径小,银粉产率高,生产周期短。
The invention discloses a method for preparing silver powder for conductive paste. The wet silver powder is prepared from a silver-containing solution and a reducing agent solution, and a surface treatment agent is prepared by emulsifying an organic solvent obtained by mixing a hydrophobic surfactant and a solvent with water. Silver powder is obtained by coating the surface treatment agent with wet silver powder. The surface treatment agent uses a hydrophobic surfactant and is emulsified to form a water-in-oil emulsion. The surface treatment agent is added after the preparation of the wet silver powder, which can completely cover the silver powder, so that the prepared silver powder particles have good dispersion and no agglomeration. Re-dispersed in a non-polar solvent, the particle size of the silver powder is uniform, the particle size distribution is narrow, the average particle size is small, the yield of the silver powder is high, and the production cycle is short.
Description
技术领域technical field
本发明涉及一种银粉的制备方法,特别是一种导电浆料用银粉的制备方法。The invention relates to a method for preparing silver powder, in particular to a method for preparing silver powder for conductive paste.
背景技术Background technique
一种纳米银及其合成方法(国别:中国,公开号:109079154B,公开日期:2022-03-01),公开了用加入亲水性表面处理剂的湿态银粉放入油浴锅中加热搅拌,形成纳米银溶胶,再加入沉降剂使银粉表面呈疏水结构。A nano-silver and its synthesis method (country: China, publication number: 109079154B, publication date: 2022-03-01), which discloses that wet silver powder added with a hydrophilic surface treatment agent is heated in an oil bath Stir to form a nano-silver sol, and then add a sedimentation agent to make the surface of the silver powder a hydrophobic structure.
一种银粉制备过程中表面处理液及添加方式(国别:中国,公开号:112024906A,公开日期:2020-12-04),公开了将亲油性表面活性剂、疏水消泡剂及有机溶剂进行混合,获得表面处理液,然后将表面处理液添加至银粉合成体系中,进行搅拌混合,然后进行洗涤和干燥。该表面处理液克服了现有技术中银粉分散性较差,易结团的问题,同时省去了表面处理剂多次加热的繁琐,提高了操作效率,降低了操作误差,省时省力。在银的合成体系中,疏水消泡剂会吸引表面活性剂的疏水端,使得疏水消泡剂变为亲水性的,进而降低了银的合成体系中泡膜中表面活性剂的浓度和张力,进而起到消泡作用;有机溶剂能够溶解亲油性表面活性剂和疏水消泡剂,进而降低了两个亲油性表面活性剂和疏水消泡剂的熔点。A surface treatment liquid and its addition method in the preparation process of silver powder (country: China, publication number: 112024906A, publication date: 2020-12-04), which discloses that a lipophilic surfactant, a hydrophobic defoamer and an organic solvent are processed mixing to obtain a surface treatment solution, and then adding the surface treatment solution to the silver powder synthesis system, stirring and mixing, and then washing and drying. The surface treatment liquid overcomes the problem of poor dispersion and easy agglomeration of silver powder in the prior art, and at the same time saves the cumbersome heating of the surface treatment agent multiple times, improves operation efficiency, reduces operation errors, and saves time and effort. In the silver synthesis system, the hydrophobic defoamer will attract the hydrophobic end of the surfactant, making the hydrophobic defoamer hydrophilic, thereby reducing the concentration and tension of the surfactant in the foam film in the silver synthesis system , and then play a defoaming effect; the organic solvent can dissolve the lipophilic surfactant and the hydrophobic defoamer, thereby reducing the melting point of the two lipophilic surfactants and the hydrophobic defoamer.
但以上方法中的银粉表面处理剂容易析出,漂浮在表层,包覆不完全,成品银粉的粒径分布宽,平均粒径大。But the silver powder surface treatment agent in the above method is easy to separate out, floats on the surface layer, and the coating is incomplete, and the particle size distribution of the finished silver powder is wide, and the average particle size is large.
发明内容Contents of the invention
发明目的:本发明的目的是提供一种导电浆料用银粉的制备方法,得到粒径分布窄、粒径均匀的成品银粉。Purpose of the invention: the purpose of this invention is to provide a kind of preparation method of silver powder for conductive paste, obtain the finished silver powder with narrow particle size distribution and uniform particle size.
技术方案:一种导电浆料用银粉的制备方法,包括以下步骤:Technical solution: a method for preparing silver powder for conductive paste, comprising the following steps:
步骤S10,制备湿态银粉:以含银溶液和还原剂溶液反应,生成银沉淀,形成湿态银粉;Step S10, preparing wet silver powder: reacting the silver-containing solution with the reducing agent solution to form silver precipitates to form wet silver powder;
步骤S20,制备表面处理剂:以疏水性表面活性剂与溶剂混合成有机溶剂,在加热条件下生成溶液,再加入热水,搅拌形成乳液的表面处理剂;Step S20, preparing a surface treatment agent: mixing a hydrophobic surfactant and a solvent to form an organic solvent, generating a solution under heating conditions, adding hot water, and stirring to form an emulsion surface treatment agent;
步骤S30,包覆:将表面处理剂加入湿态银粉中,进行包覆处理,干燥后制得银粉。Step S30, coating: adding a surface treatment agent into the wet silver powder, performing coating treatment, and drying to obtain silver powder.
进一步的,步骤S10中,含银溶液为银氨溶液、Ag2O悬浮液或Ag2CO3悬浮液的其中一种,还原剂溶液为葡萄糖、甲醛、水合肼、抗坏血酸、异抗坏血酸钠、对二苯酚的其中一种。Further, in step S10, the silver-containing solution is one of silver ammonia solution, Ag 2 O suspension or Ag 2 CO 3 suspension, and the reducing agent solution is glucose, formaldehyde, hydrazine hydrate, ascorbic acid, sodium erythorbate, para One of the diphenols.
进一步的,步骤S10中,生成银沉淀后,再加入分散剂,混合均匀,形成湿态银粉。Further, in step S10, after the silver precipitate is formed, a dispersant is added and mixed evenly to form wet silver powder.
进一步的,分散剂为聚乙烯吡咯烷酮、柠檬酸盐、油胺、具有甲基硅氧基官能团有机化合物的其中一种或者两种以上混合。Further, the dispersant is one or a mixture of two or more of polyvinylpyrrolidone, citrate, oleylamine, and organic compounds with methylsiloxy functional groups.
进一步的,分散剂的用量为湿态银粉含银量的0.01~5%,摩尔百分含量。Further, the amount of the dispersant is 0.01-5% of the silver content of the wet silver powder, the mole percentage.
进一步的,步骤S20中:疏水性表面活性剂的用量为湿态银粉含银量的0.0001~20%,质量百分含量;疏水性表面活性剂与溶剂按质量比1∶80~10∶80混合成有机溶剂;热水与疏水性表面活性剂按质量比1∶1~10∶1用量。Further, in step S20: the amount of the hydrophobic surfactant is 0.0001 to 20% of the silver content of the wet silver powder, in mass percent; the hydrophobic surfactant and the solvent are mixed in a mass ratio of 1:80 to 10:80 into an organic solvent; hot water and hydrophobic surfactants are used in a mass ratio of 1:1 to 10:1.
进一步的,步骤S20中,疏水性表面活性剂为C6~C22饱和脂肪酸、C6~C22非饱和脂肪酸、C6~C22酯类、C6~C22胺类、C6~C22脂肪胺类、C6~C22脂肪酰胺类的其中一种或者至少两种混合,溶剂为乙醇、丙酮、乙二醇、甲苯的其中一种或者至少两种混合。Further, in step S20, the hydrophobic surfactant is C 6 -C 22 saturated fatty acids, C 6 -C 22 unsaturated fatty acids, C 6 -C 22 esters, C 6 -C 22 amines, C 6 -C 22 22 One or a mixture of fatty amines and C 6 -C 22 fatty amides, and the solvent is one or a mixture of at least two of ethanol, acetone, ethylene glycol, and toluene.
进一步的,步骤S20中,加热条件为30℃~100℃,热水温度为30℃~100℃。Further, in step S20, the heating condition is 30°C-100°C, and the temperature of the hot water is 30°C-100°C.
进一步的,步骤S20中,搅拌采用均化器以1000~30000r/min的速度处理1~3分钟形成乳液,搅拌速度以可形成乳液并且液体不飞溅为宜。Further, in step S20, stirring is performed with a homogenizer at a speed of 1000-30000 r/min for 1-3 minutes to form an emulsion, and the stirring speed is preferably such that the emulsion can be formed and the liquid does not splash.
进一步的,步骤S30中,表面处理剂先冷却至湿态银粉温度,再加入湿态银粉中。Further, in step S30, the surface treatment agent is first cooled to the temperature of the wet silver powder, and then added to the wet silver powder.
有益效果:本发明的优点是:银粉制备中使用的表面处理剂,采用疏水性表面活性剂且乳化形成油包水型乳液,表面处理剂在制备湿态银粉后加入,能将银粉包覆完全,使制得的银粉粒子分散性好、无团聚,可重新在非极性溶剂中分散,银粉粒子粒径均匀、粒径分布窄、平均粒径小,银粉产率高,生产周期短。Beneficial effects: the advantages of the present invention are: the surface treatment agent used in the preparation of silver powder adopts hydrophobic surfactant and emulsifies to form a water-in-oil emulsion, and the surface treatment agent is added after the preparation of wet silver powder, which can completely coat the silver powder , so that the prepared silver powder particles have good dispersibility and no agglomeration, and can be redispersed in non-polar solvents. The particle size of the silver powder particles is uniform, the particle size distribution is narrow, the average particle size is small, the yield of the silver powder is high, and the production cycle is short.
附图说明Description of drawings
图1为实施例1制得的银粉的显微镜图;Fig. 1 is the micrograph of the silver powder that embodiment 1 makes;
图2为对比例1制得的银粉的显微镜图。Fig. 2 is the microscope picture of the silver powder that comparative example 1 makes.
具体实施方式detailed description
下面结合附图和具体实施例,进一步阐明本发明。The present invention will be further explained below in conjunction with the accompanying drawings and specific embodiments.
一种导电浆料用银粉的制备方法,以含银溶液和还原剂溶液制得湿态银粉,制备湿态银粉时还可以加入分散剂,以疏水性表面活性剂与溶剂混合成的有机溶剂加水乳化制得表面处理剂,将表面处理剂与湿态银粉包覆处理制得银粉。A method for preparing silver powder for conductive paste. The wet silver powder is prepared from a silver-containing solution and a reducing agent solution. When preparing the wet silver powder, a dispersant can also be added, and water is added to an organic solvent formed by mixing a hydrophobic surfactant and a solvent. The surface treatment agent is obtained by emulsification, and the surface treatment agent is coated with wet silver powder to obtain silver powder.
含银溶液为银氨溶液、Ag2O悬浮液或Ag2CO3悬浮液的其中一种,还原剂溶液为葡萄糖、甲醛、水合肼、抗坏血酸、异抗坏血酸钠、对二苯酚等的其中一种。分散剂为聚乙烯吡咯烷酮、柠檬酸盐、油胺、具有甲基硅氧基官能团有机化合物的其中一种或者两种以上混合,具有甲基硅氧基官能团有机化合物可以是BYK-167、BYK-191、BYK-230等。疏水性表面活性剂为C6~C22饱和脂肪酸、C6~C22非饱和脂肪酸、C6~C22酯类、C6~C22胺类、C6~C22脂肪胺类、C6~C22脂肪酰胺类的其中一种或者至少两种混合,具体可以是油胺、油酸酰胺、芥酸酰胺、十二胺、十八胺、三乙醇胺、硬脂酸、单硬脂酸甘油酯、失水山梨醇月桂酸酯、聚氧乙烯失水山梨醇单硬脂酸酯等,溶剂为乙醇、丙酮、乙二醇、甲苯的其中一种或者至少两种混合。The silver-containing solution is one of silver ammonia solution, Ag 2 O suspension or Ag 2 CO 3 suspension, and the reducing agent solution is one of glucose, formaldehyde, hydrazine hydrate, ascorbic acid, sodium erythorbate, hydroquinone, etc. . The dispersant is one of polyvinylpyrrolidone, citrate, oleylamine, and organic compounds with methylsiloxy functional groups or a mixture of two or more. The organic compounds with methylsiloxy functional groups can be BYK-167, BYK- 191, BYK-230, etc. Hydrophobic surfactants are C 6 ~C 22 saturated fatty acids, C 6 ~C 22 unsaturated fatty acids, C 6 ~C 22 esters, C 6 ~C 22 amines, C 6 ~C 22 fatty amines, C 6 ~ One or at least two mixtures of C22 fatty amides, specifically oleylamine, oleic acid amide, erucamide, dodecylamine, octadecylamine, triethanolamine, stearic acid, glycerol monostearate ester, sorbitan laurate, polyoxyethylene sorbitan monostearate, etc., the solvent is one of ethanol, acetone, ethylene glycol, toluene or a mixture of at least two.
分散剂的用量为湿态银粉含银量的0.01~5%,摩尔百分含量。疏水性表面活性剂的用量为湿态银粉含银量的0.0001~20%,质量百分含量。疏水性表面活性剂与溶剂按质量比1∶80~10∶80混合成有机溶剂。热水与疏水性表面活性剂按质量比1∶1~10∶1用量。The dosage of the dispersant is 0.01-5% of the silver content of the wet silver powder, which is the mole percentage. The dosage of the hydrophobic surfactant is 0.0001-20% of the silver content of the wet silver powder, which is the percentage by mass. The hydrophobic surfactant and the solvent are mixed in a mass ratio of 1:80 to 10:80 to form an organic solvent. Hot water and hydrophobic surfactant are used in a mass ratio of 1:1 to 10:1.
以下各实施例,基于以上原料选择。Following each embodiment, based on above-mentioned raw material selection.
实施例1Example 1
一种导电浆料用银粉的制备方法,具体包括以下步骤:A preparation method of silver powder for conductive paste, specifically comprising the following steps:
步骤S10,制备湿态银粉:将一定量的Ag2O悬浮液与足量的葡萄糖溶液混合,发生氧化还原反应,生成银沉淀,形成湿态银粉。Step S10, preparing wet silver powder: mixing a certain amount of Ag 2 O suspension with a sufficient amount of glucose solution, redox reaction occurs, silver precipitates are formed, and wet silver powder is formed.
步骤S20,制备表面处理剂:将乙醇加入油酸酰胺中,在80℃下混合搅拌至全部溶解,得到有机溶剂,再将80℃热水加入有机溶剂中,采用均化器以10000r/min的速度搅拌处理3分钟,形成乳液的表面处理剂。Step S20, preparing a surface treatment agent: adding ethanol to oleic acid amide, mixing and stirring at 80°C until completely dissolved to obtain an organic solvent, then adding hot water at 80°C to the organic solvent, using a homogenizer at 10,000r/min Speed stirring treatment for 3 minutes to form an emulsion of the surface treatment agent.
油酸酰胺的用量为湿态银粉含银量的0.01%,油酸酰胺与乙醇按质量比10∶80混合成有机溶剂,热水与油酸酰胺按质量比1∶1用量。The consumption of oleic acid amide is 0.01% of the silver content of the wet silver powder, the oleic acid amide and ethanol are mixed into an organic solvent in a mass ratio of 10:80, and the consumption of hot water and oleic acid amide is in a mass ratio of 1:1.
步骤S30,包覆:待表面处理剂冷却至湿态银粉体系温度,再将其加入湿态银粉中,进行包覆处理,干燥后得到银粉。Step S30, coating: after the surface treatment agent is cooled to the temperature of the wet silver powder system, it is added to the wet silver powder for coating treatment, and the silver powder is obtained after drying.
实施例2Example 2
一种导电浆料用银粉的制备方法,具体包括以下步骤:A preparation method of silver powder for conductive paste, specifically comprising the following steps:
步骤S10,制备湿态银粉:将一定量的银氨溶液与足量的葡萄糖溶液混合,发生氧化还原反应,生成银沉淀,再加入聚乙烯吡咯烷酮,混合均匀,形成湿态银粉。Step S10, preparing wet silver powder: mixing a certain amount of silver ammonia solution with a sufficient amount of glucose solution to cause a redox reaction to form silver precipitates, then add polyvinylpyrrolidone, and mix evenly to form wet silver powder.
步骤S20,制备表面处理剂:将乙醇加入油酸酰胺中,在80℃下混合搅拌至全部溶解,得到有机溶剂,再将80℃热水加入有机溶剂中,采用均化器以10000r/min的速度搅拌处理1分钟,形成乳液的表面处理剂。Step S20, preparing a surface treatment agent: adding ethanol to oleic acid amide, mixing and stirring at 80°C until completely dissolved to obtain an organic solvent, then adding hot water at 80°C to the organic solvent, using a homogenizer at 10,000r/min Speed agitation for 1 minute to form an emulsion of the surface treatment agent.
聚乙烯吡咯烷酮的用量为湿态银粉含银量的0.01%,油酸酰胺的用量为湿态银粉含银量的0.01%,油酸酰胺与乙醇按质量比10∶80混合成有机溶剂,热水与油酸酰胺按质量比4∶1用量。The consumption of polyvinylpyrrolidone is 0.01% of the silver content of wet silver powder, the consumption of oleic acid amide is 0.01% of the silver content of wet silver powder, oleic acid amide and ethanol are mixed into organic solvent by mass ratio 10:80, hot water It is used with oleic acid amide in a mass ratio of 4:1.
步骤S30,包覆:待表面处理剂冷却至湿态银粉体系温度,再将其加入湿态银粉中,进行包覆处理,干燥后得到银粉。Step S30, coating: after the surface treatment agent is cooled to the temperature of the wet silver powder system, it is added to the wet silver powder for coating treatment, and the silver powder is obtained after drying.
实施例3Example 3
一种导电浆料用银粉的制备方法,具体包括以下步骤:A preparation method of silver powder for conductive paste, specifically comprising the following steps:
步骤S10,制备湿态银粉:将一定量的Ag2CO3悬浮液与足量的葡萄糖溶液混合,发生氧化还原反应,生成银沉淀,再加入柠檬酸钠,混合均匀,形成湿态银粉。Step S10, preparing wet silver powder: mixing a certain amount of Ag 2 CO 3 suspension with a sufficient amount of glucose solution to cause oxidation-reduction reaction to form silver precipitates, then adding sodium citrate, and mixing evenly to form wet silver powder.
步骤S20,制备表面处理剂:将乙醇加入油酸酰胺中,在100℃下混合搅拌至全部溶解,得到有机溶剂,再将100℃热水加入有机溶剂中,采用均化器以10000r/min的速度搅拌处理3分钟,形成乳液的表面处理剂。Step S20, preparing a surface treatment agent: adding ethanol to oleic acid amide, mixing and stirring at 100°C until completely dissolved to obtain an organic solvent, then adding hot water at 100°C to the organic solvent, using a homogenizer at 10,000r/min Speed stirring treatment for 3 minutes to form an emulsion of the surface treatment agent.
柠檬酸钠的用量为湿态银粉含银量的0.01%,油酸酰胺的用量为湿态银粉含银量的0.01%,油酸酰胺与乙醇按质量比10∶80混合成有机溶剂,热水与油酸酰胺按质量比6∶1用量。The consumption of sodium citrate is 0.01% of the silver content of wet silver powder, the consumption of oleic acid amide is 0.01% of the silver content of wet silver powder, oleic acid amide and ethanol are mixed into organic solvent by mass ratio 10:80, hot water The dosage with oleic acid amide is 6:1 in mass ratio.
步骤S30,包覆:待表面处理剂冷却至湿态银粉体系温度,再将其加入湿态银粉中,进行包覆处理,干燥后得到银粉。Step S30, coating: after the surface treatment agent is cooled to the temperature of the wet silver powder system, it is added to the wet silver powder for coating treatment, and the silver powder is obtained after drying.
实施例4Example 4
一种导电浆料用银粉的制备方法,具体包括以下步骤:A preparation method of silver powder for conductive paste, specifically comprising the following steps:
步骤S10,制备湿态银粉:将一定量的Ag2CO3悬浮液与足量的葡萄糖溶液混合,发生氧化还原反应,生成银沉淀,再加入柠檬酸钠,混合均匀,形成湿态银粉。Step S10, preparing wet silver powder: mixing a certain amount of Ag 2 CO 3 suspension with a sufficient amount of glucose solution to cause oxidation-reduction reaction to form silver precipitates, then adding sodium citrate, and mixing evenly to form wet silver powder.
步骤S20,制备表面处理剂:将丙酮加入十二胺中,在90℃下混合搅拌至全部溶解,得到有机溶剂,再将90℃热水加入有机溶剂中,采用均化器以10000r/min的速度搅拌处理3分钟,形成乳液的表面处理剂。Step S20, preparing a surface treatment agent: adding acetone to dodecylamine, mixing and stirring at 90°C until completely dissolved to obtain an organic solvent, then adding hot water at 90°C to the organic solvent, using a homogenizer at 10,000r/min Speed stirring treatment for 3 minutes to form an emulsion of the surface treatment agent.
柠檬酸钠的用量为湿态银粉含银量的0.01%,十二胺的用量为湿态银粉含银量的0.01%,十二胺与丙酮按质量比10∶80混合成有机溶剂,热水与十二胺按质量比8∶1用量。The consumption of sodium citrate is 0.01% of the silver content of wet silver powder, the consumption of dodecylamine is 0.01% of the silver content of wet silver powder, dodecylamine and acetone are mixed into organic solvent by mass ratio 10:80, hot water The dosage is 8:1 with dodecylamine in mass ratio.
步骤S30,包覆:待表面处理剂冷却至湿态银粉体系温度,再将其加入湿态银粉中,进行包覆处理,干燥后得到银粉。Step S30, coating: after the surface treatment agent is cooled to the temperature of the wet silver powder system, it is added to the wet silver powder for coating treatment, and the silver powder is obtained after drying.
实施例5Example 5
一种导电浆料用银粉的制备方法,具体包括以下步骤:A preparation method of silver powder for conductive paste, specifically comprising the following steps:
步骤S10,制备湿态银粉:将一定量的Ag2O悬浮液与足量的葡萄糖溶液混合,发生氧化还原反应,生成银沉淀,再加入BYK-167,混合均匀,形成湿态银粉。Step S10, preparing wet silver powder: mixing a certain amount of Ag 2 O suspension with a sufficient amount of glucose solution to cause oxidation-reduction reaction to form silver precipitates, then add BYK-167, mix evenly, and form wet silver powder.
步骤S20,制备表面处理剂:将乙醇加入硬脂酸中,在80℃下混合搅拌至全部溶解,得到有机溶剂,再将80℃热水加入有机溶剂中,采用均化器以30000r/min的速度搅拌处理3分钟,形成乳液的表面处理剂。Step S20, preparing a surface treatment agent: adding ethanol to stearic acid, mixing and stirring at 80°C until completely dissolved to obtain an organic solvent, then adding hot water at 80°C to the organic solvent, using a homogenizer at 30,000r/min Speed stirring treatment for 3 minutes to form an emulsion of the surface treatment agent.
BYK-167的用量为湿态银粉含银量的0.01%,硬脂酸的用量为湿态银粉含银量的0.01%,硬脂酸与乙醇按质量比10∶80混合成有机溶剂,热水与硬脂酸按质量比10∶1用量。The amount of BYK-167 is 0.01% of the silver content of the wet silver powder, and the amount of stearic acid is 0.01% of the silver content of the wet silver powder. Stearic acid and ethanol are mixed into an organic solvent at a mass ratio of 10:80, and hot water The dosage is 10:1 with stearic acid in mass ratio.
步骤S30,包覆:待表面处理剂冷却至湿态银粉体系温度,再将其加入湿态银粉中,进行包覆处理,干燥后得到银粉。Step S30, coating: after the surface treatment agent is cooled to the temperature of the wet silver powder system, it is added to the wet silver powder for coating treatment, and the silver powder is obtained after drying.
实施例6Example 6
一种导电浆料用银粉的制备方法,具体包括以下步骤:A preparation method of silver powder for conductive paste, specifically comprising the following steps:
步骤S10,制备湿态银粉:将一定量的Ag2CO3悬浮液与足量的葡萄糖溶液混合,发生氧化还原反应,生成银沉淀,再加入BYK-191,混合均匀,形成湿态银粉。Step S10, preparing wet silver powder: mixing a certain amount of Ag 2 CO 3 suspension with a sufficient amount of glucose solution to cause redox reaction to form silver precipitates, then add BYK-191, mix evenly, and form wet silver powder.
步骤S20,制备表面处理剂:将丙酮加入三乙醇胺中,在90℃下混合搅拌至全部溶解,得到有机溶剂,再将90℃热水加入有机溶剂中,采用均化器以10000r/min的速度搅拌处理3分钟,形成乳液的表面处理剂。Step S20, preparing the surface treatment agent: adding acetone to triethanolamine, mixing and stirring at 90°C until completely dissolved to obtain an organic solvent, then adding hot water at 90°C to the organic solvent, using a homogenizer at a speed of 10,000r/min Stir treatment for 3 minutes to form an emulsion of the surface treatment agent.
BYK-191的用量为湿态银粉含银量的0.01%,三乙醇胺的用量为湿态银粉含银量的0.0001%,三乙醇胺与丙酮按质量比10∶80混合成有机溶剂,热水与三乙醇胺按质量比8∶1用量。The dosage of BYK-191 is 0.01% of the silver content of the wet silver powder, the consumption of triethanolamine is 0.0001% of the silver content of the wet silver powder, the triethanolamine and acetone are mixed into an organic solvent according to the mass ratio of 10:80, hot water and three Ethanolamine is used in a mass ratio of 8:1.
步骤S30,包覆:待表面处理剂冷却至湿态银粉体系温度,再将其加入湿态银粉中,进行包覆处理,干燥后得到银粉。Step S30, coating: after the surface treatment agent is cooled to the temperature of the wet silver powder system, it is added to the wet silver powder for coating treatment, and the silver powder is obtained after drying.
实施例7一种导电浆料用银粉的制备方法,具体包括以下步骤:Embodiment 7 A kind of preparation method of silver powder for conductive paste, specifically comprises the following steps:
步骤S10,制备湿态银粉:将一定量的银氨溶液与足量的葡萄糖溶液混合,发生氧化还原反应,生成银沉淀,再加入BYK-230,混合均匀,形成湿态银粉。Step S10, preparing wet silver powder: mixing a certain amount of silver ammonia solution with a sufficient amount of glucose solution to cause a redox reaction to form silver precipitates, then add BYK-230, mix evenly, and form wet silver powder.
步骤S20,制备表面处理剂:将乙醇加入油酸酰胺中,在80℃下混合搅拌至全部溶解,得到有机溶剂,再将80℃热水加入有机溶剂中,采用均化器以10000r/min的速度搅拌处理1分钟,形成乳液的表面处理剂。Step S20, preparing a surface treatment agent: adding ethanol to oleic acid amide, mixing and stirring at 80°C until completely dissolved to obtain an organic solvent, then adding hot water at 80°C to the organic solvent, using a homogenizer at 10,000r/min Speed agitation for 1 minute to form an emulsion of the surface treatment agent.
BYK-230的用量为湿态银粉含银量的5%,油酸酰胺的用量为湿态银粉含银量的0.01%,油酸酰胺与乙醇按质量比10∶80混合成有机溶剂,热水与油酸酰胺按质量比4∶1用量。The amount of BYK-230 is 5% of the silver content of the wet silver powder, the amount of oleic acid amide is 0.01% of the silver content of the wet silver powder, the oleic acid amide and ethanol are mixed into an organic solvent at a mass ratio of 10:80, and hot water It is used with oleic acid amide in a mass ratio of 4:1.
步骤S30,包覆:待表面处理剂冷却至湿态银粉体系温度,再将其加入湿态银粉中,进行包覆处理,干燥后得到银粉。Step S30, coating: after the surface treatment agent is cooled to the temperature of the wet silver powder system, it is added to the wet silver powder for coating treatment, and the silver powder is obtained after drying.
实施例8Example 8
一种导电浆料用银粉的制备方法,具体包括以下步骤:A preparation method of silver powder for conductive paste, specifically comprising the following steps:
步骤S10,制备湿态银粉:将一定量的Ag2CO3悬浮液与足量的葡萄糖溶液混合,发生氧化还原反应,生成银沉淀,再加入柠檬酸钠,混合均匀,形成湿态银粉。Step S10, preparing wet silver powder: mixing a certain amount of Ag 2 CO 3 suspension with a sufficient amount of glucose solution to cause oxidation-reduction reaction to form silver precipitates, then adding sodium citrate, and mixing evenly to form wet silver powder.
步骤S20,制备表面处理剂:将乙醇加入油酸酰胺中,在100℃下混合搅拌至全部溶解,得到有机溶剂,再将100℃热水加入有机溶剂中,采用均化器以10000r/min的速度搅拌处理3分钟,形成乳液的表面处理剂。Step S20, preparing a surface treatment agent: adding ethanol to oleic acid amide, mixing and stirring at 100°C until completely dissolved to obtain an organic solvent, then adding hot water at 100°C to the organic solvent, using a homogenizer at 10,000r/min Speed stirring treatment for 3 minutes to form an emulsion of the surface treatment agent.
柠檬酸钠的用量为湿态银粉含银量的0.01%,油酸酰胺的用量为湿态银粉含银量的20%,油酸酰胺与乙醇按质量比10∶80混合成有机溶剂,热水与油酸酰胺按质量比6∶1用量。The consumption of sodium citrate is 0.01% of the silver content of wet silver powder, the consumption of oleic acid amide is 20% of the silver content of wet silver powder, oleic acid amide and ethanol are mixed into organic solvent by mass ratio 10:80, hot water The dosage with oleic acid amide is 6:1 in mass ratio.
步骤S30,包覆:待表面处理剂冷却至湿态银粉体系温度,再将其加入湿态银粉中,进行包覆处理,干燥后得到银粉。Step S30, coating: after the surface treatment agent is cooled to the temperature of the wet silver powder system, it is added to the wet silver powder for coating treatment, and the silver powder is obtained after drying.
实施例9Example 9
一种导电浆料用银粉的制备方法,具体包括以下步骤:A preparation method of silver powder for conductive paste, specifically comprising the following steps:
步骤S10,制备湿态银粉:将一定量的Ag2O悬浮液与足量的葡萄糖溶液混合,发生氧化还原反应,生成银沉淀,再加入BYK-167,混合均匀,形成湿态银粉。Step S10, preparing wet silver powder: mixing a certain amount of Ag 2 O suspension with a sufficient amount of glucose solution to cause oxidation-reduction reaction to form silver precipitates, then add BYK-167, mix evenly, and form wet silver powder.
步骤S20,制备表面处理剂:将乙醇加入硬脂酸中,在80℃下混合搅拌至全部溶解,得到有机溶剂,再将80℃热水加入有机溶剂中,采用均化器以30000r/min的速度搅拌处理3分钟,形成乳液的表面处理剂。Step S20, preparing a surface treatment agent: adding ethanol to stearic acid, mixing and stirring at 80°C until completely dissolved to obtain an organic solvent, then adding hot water at 80°C to the organic solvent, using a homogenizer at 30,000r/min Speed stirring treatment for 3 minutes to form an emulsion of the surface treatment agent.
BYK-167的用量为湿态银粉含银量的0.01%,硬脂酸的用量为湿态银粉含银量的0.01%,硬脂酸与乙醇按质量比1∶80混合成有机溶剂,热水与硬脂酸按质量比10∶1用量。The amount of BYK-167 is 0.01% of the silver content of the wet silver powder, and the amount of stearic acid is 0.01% of the silver content of the wet silver powder. Stearic acid and ethanol are mixed into an organic solvent at a mass ratio of 1:80, and hot water The dosage is 10:1 with stearic acid in mass ratio.
步骤S30,包覆:待表面处理剂冷却至湿态银粉体系温度,再将其加入湿态银粉中,进行包覆处理,干燥后得到银粉。Step S30, coating: after the surface treatment agent is cooled to the temperature of the wet silver powder system, it is added to the wet silver powder for coating treatment, and the silver powder is obtained after drying.
实施例10Example 10
一种导电浆料用银粉的制备方法,具体包括以下步骤:A preparation method of silver powder for conductive paste, specifically comprising the following steps:
步骤S10,制备湿态银粉:将一定量的Ag2CO3悬浮液与足量的葡萄糖溶液混合,发生氧化还原反应,生成银沉淀,再加入柠檬酸钠,混合均匀,形成湿态银粉。Step S10, preparing wet silver powder: mixing a certain amount of Ag 2 CO 3 suspension with a sufficient amount of glucose solution to cause oxidation-reduction reaction to form silver precipitates, then adding sodium citrate, and mixing evenly to form wet silver powder.
步骤S20,制备表面处理剂:将丙酮加入十八胺中,在90℃下混合搅拌至全部溶解,得到有机溶剂,再将90℃热水加入有机溶剂中,采用均化器以10000r/min的速度搅拌处理3分钟,形成乳液的表面处理剂。Step S20, preparing a surface treatment agent: adding acetone to octadecylamine, mixing and stirring at 90°C until completely dissolved to obtain an organic solvent, then adding hot water at 90°C to the organic solvent, using a homogenizer at 10,000r/min Speed stirring treatment for 3 minutes to form an emulsion of the surface treatment agent.
柠檬酸钠的用量为湿态银粉含银量的0.01%,十八胺的用量为湿态银粉含银量的20%,十八胺与丙酮按质量比10∶80混合成有机溶剂,热水与十八胺按质量比8∶1用量。The consumption of sodium citrate is 0.01% of the silver content of the wet silver powder, the consumption of octadecylamine is 20% of the silver content of the wet silver powder, and octadecylamine and acetone are mixed into an organic solvent by mass ratio of 10:80, hot water With octadecylamine in a mass ratio of 8:1.
步骤S30,包覆:待表面处理剂冷却至湿态银粉体系温度,再将其加入湿态银粉中,进行包覆处理,干燥后得到银粉。Step S30, coating: after the surface treatment agent is cooled to the temperature of the wet silver powder system, it is added to the wet silver powder for coating treatment, and the silver powder is obtained after drying.
实施例11Example 11
一种导电浆料用银粉的制备方法,具体包括以下步骤:A preparation method of silver powder for conductive paste, specifically comprising the following steps:
步骤S10,制备湿态银粉:将一定量的Ag2O悬浮液与足量的葡萄糖溶液混合,发生氧化还原反应,生成银沉淀,形成湿态银粉。Step S10, preparing wet silver powder: mixing a certain amount of Ag 2 O suspension with a sufficient amount of glucose solution, redox reaction occurs, silver precipitates are formed, and wet silver powder is formed.
步骤S20,制备表面处理剂:将乙醇加入失水山梨醇月桂酸酯中,在30℃下混合搅拌至全部溶解,得到有机溶剂,再将30℃热水加入有机溶剂中,采用均化器以10000r/min的速度搅拌处理3分钟,形成乳液的表面处理剂。Step S20, preparing a surface treatment agent: adding ethanol to sorbitan laurate, mixing and stirring at 30°C until completely dissolved to obtain an organic solvent, then adding hot water at 30°C to the organic solvent, using a homogenizer to Stirring at a speed of 10000r/min for 3 minutes to form an emulsion surface treatment agent.
失水山梨醇月桂酸酯的用量为湿态银粉含银量的0.01%,失水山梨醇月桂酸酯与乙醇按质量比10∶80混合成有机溶剂,热水与失水山梨醇月桂酸酯按质量比1∶1用量。The amount of sorbitan laurate is 0.01% of the silver content of the wet silver powder, sorbitan laurate and ethanol are mixed into an organic solvent in a mass ratio of 10:80, hot water and sorbitan laurate According to the mass ratio of 1:1 dosage.
步骤S30,包覆:待表面处理剂冷却至湿态银粉体系温度,再将其加入湿态银粉中,进行包覆处理,干燥后得到银粉。Step S30, coating: after the surface treatment agent is cooled to the temperature of the wet silver powder system, it is added to the wet silver powder for coating treatment, and the silver powder is obtained after drying.
实施例12Example 12
一种导电浆料用银粉的制备方法,具体包括以下步骤:A preparation method of silver powder for conductive paste, specifically comprising the following steps:
步骤S10,制备湿态银粉:将一定量的Ag2O悬浮液与足量的葡萄糖溶液混合,发生氧化还原反应,生成银沉淀,形成湿态银粉。Step S10, preparing wet silver powder: mixing a certain amount of Ag 2 O suspension with a sufficient amount of glucose solution, redox reaction occurs, silver precipitates are formed, and wet silver powder is formed.
步骤S20,制备表面处理剂:将乙醇加入聚氧乙烯失水山梨醇单硬脂酸酯中,在70℃下混合搅拌至全部溶解,得到有机溶剂,再将70℃热水加入有机溶剂中,采用均化器以10000r/min的速度搅拌处理3分钟,形成乳液的表面处理剂。Step S20, preparing a surface treatment agent: adding ethanol to polyoxyethylene sorbitan monostearate, mixing and stirring at 70°C until completely dissolved to obtain an organic solvent, and then adding hot water at 70°C to the organic solvent, Use a homogenizer to stir at a speed of 10000r/min for 3 minutes to form an emulsion surface treatment agent.
聚氧乙烯失水山梨醇单硬脂酸酯的用量为湿态银粉含银量的0.01%,聚氧乙烯失水山梨醇单硬脂酸酯与乙醇按质量比10∶80混合成有机溶剂,热水与聚氧乙烯失水山梨醇单硬脂酸酯按质量比1∶1用量。The consumption of polyoxyethylene sorbitan monostearate is 0.01% of the silver content of wet state silver powder, polyoxyethylene sorbitan monostearate and ethanol are mixed into organic solvent by mass ratio 10: 80, Hot water and polyoxyethylene sorbitan monostearate are used in a mass ratio of 1:1.
步骤S30,包覆:待表面处理剂冷却至湿态银粉体系温度,再将其加入湿态银粉中,进行包覆处理,干燥后得到银粉。Step S30, coating: after the surface treatment agent is cooled to the temperature of the wet silver powder system, it is added into the wet silver powder for coating treatment, and the silver powder is obtained after drying.
对比例1Comparative example 1
与实施例1的区别在于:均化器以400r/min的速度搅拌处理3分钟。The difference from Example 1 is that the homogenizer was stirred at a speed of 400r/min for 3 minutes.
对比例2Comparative example 2
与实施例1的区别在于:以亲水性表面活性剂-聚乙烯醇替代疏水性表面活性剂-油酸酰胺。The difference from Example 1 is that the hydrophobic surfactant-oleic acid amide is replaced by the hydrophilic surfactant-polyvinyl alcohol.
对比例3Comparative example 3
与实施例1的区别在于:热水与油酸酰胺按质量比0.5∶1用量。The difference from Example 1 is that the amount of hot water and oleic acid amide is 0.5:1 by mass.
对比例4Comparative example 4
与实施例5的区别在于:热水与硬脂酸按质量比11∶1用量。The difference from Example 5 is that the amount of hot water and stearic acid is 11:1 by mass.
对比例5Comparative example 5
与实施例5的区别在于:均化器以40000r/min的速度搅拌处理3分钟。The difference from Example 5 is that the homogenizer was stirred at a speed of 40000r/min for 3 minutes.
对比例6Comparative example 6
与实施例5的区别在于:均化器以30000r/min的速度搅拌处理0.5分钟。The difference from Example 5 is that the homogenizer was stirred at a speed of 30000r/min for 0.5 minutes.
对比例7Comparative example 7
与实施例4的区别在于:均化器以10000r/min的速度搅拌处理5分钟。The difference from Example 4 is that the homogenizer was stirred at a speed of 10000r/min for 5 minutes.
对比例8Comparative example 8
与实施例1的区别在于:步骤S20,是将乙醇加入油酸酰胺中,在80℃下混合搅拌至全部溶解得到的有机溶剂,作为表面处理剂,该步骤中不加热水乳化。The difference from Example 1 is that in step S20, ethanol is added to oleic acid amide, and the organic solvent obtained by mixing and stirring at 80° C. until completely dissolved is used as a surface treatment agent, and water is not heated for emulsification in this step.
对比例9Comparative example 9
与实施例3的区别在于:加热条件为25℃,热水温度为25℃。The difference from Example 3 is that the heating condition is 25°C, and the hot water temperature is 25°C.
将各实施例、各对比例制得的银粉,检测质量,列为下表比较:The silver powder that each embodiment, each comparative example make, detect quality, list as following table comparison:
本申请制得的银粉,可用于制备低温固化型导电浆料,该导电浆料应用于HJT电池、薄膜开关、医疗PVC管、触摸屏、手机天线,还可用于制备高温烧结型导电浆料,该导电浆料应用于TOPcon电池、PERC电池、压电陶瓷、片式电阻、片式电容、片式电感、汽车玻璃、5G天线。The silver powder prepared by the present application can be used to prepare low-temperature curable conductive paste, which is applied to HJT batteries, membrane switches, medical PVC pipes, touch screens, mobile phone antennas, and can also be used to prepare high-temperature sintered conductive paste. Conductive pastes are used in TOPcon batteries, PERC batteries, piezoelectric ceramics, chip resistors, chip capacitors, chip inductors, automotive glass, and 5G antennas.
本申请的银粉制备方法的作用原理:表面处理剂的制备,采用疏水性表面活性剂,并在制备过程中加入少量水,形成油包水型乳液,制得的表面处理剂在制备湿态银粉后加入,能将银粉包覆完全,使制得的银粉粒子分散性好、无团聚,可重新在非极性溶剂中分散,银粉粒子粒径分布窄、平均粒径小。The action principle of the silver powder preparation method of the present application: the preparation of surface treatment agent adopts hydrophobic surfactant, and adds a small amount of water in the preparation process, forms water-in-oil type emulsion, and the prepared surface treatment agent is in the preparation wet state silver powder After the addition, the silver powder can be completely coated, so that the prepared silver powder particles have good dispersibility and no agglomeration, and can be re-dispersed in non-polar solvents. The particle size distribution of the silver powder particles is narrow and the average particle size is small.
本申请的实施例检测数据分析具体如下:The embodiment detection data analysis of the present application is specifically as follows:
1、由各实施例比较可知,制备表面处理剂时,乳化的热水用量与疏水性表面活性剂用量质量比增加,制得的银粉粒径增加,与疏水性表面活性剂混合形成有机溶剂的溶剂用量增加,制得的银粉粒径减小。本申请制备方法制得的银粉,粒径范围可控制在0.5~2μm,银粉粒子粒径分布窄、平均粒径小,而粒径越小,则比表面积越大、振实密度越大,比表面积范围可达0.3~1.5m2/g,振实密度可达5.5~6.5g/cm3,体现了粒子分散性好。1. By comparison of each embodiment, it can be seen that when preparing surface treatment agent, the mass ratio of emulsified hot water consumption and hydrophobic surfactant consumption increases, and the particle size of the silver powder obtained increases, and is mixed with hydrophobic surfactant to form organic solvent As the amount of solvent increases, the particle size of the prepared silver powder decreases. The silver powder prepared by the preparation method of the present application can be controlled in the particle size range of 0.5~2 μm, the particle size distribution of the silver powder particles is narrow, and the average particle size is small, and the smaller the particle size, the larger the specific surface area, the larger the tap density, and The surface area can reach 0.3-1.5m 2 /g, and the tap density can reach 5.5-6.5g/cm 3 , reflecting the good particle dispersion.
2、由实施例1和对比例1比较、实施例5和对比例5比较可知,制备表面处理剂时,乳化搅拌转速低于1000r/min或高于30000r/min,制得的银粉质量明显降低。附图1、2分别为实施例1、对比例1制得的银粉的显微镜图,放大倍率均为10000倍,两者相比可见,实施例1制得的银粉粒子粒径均匀、粒径分布窄、平均粒径小、分散性好。2. From the comparison of Example 1 and Comparative Example 1, and the comparison of Example 5 and Comparative Example 5, it can be seen that when preparing the surface treatment agent, the emulsification stirring speed is lower than 1000r/min or higher than 30000r/min, and the quality of the silver powder obtained is obviously reduced . Accompanying drawing 1,2 are the micrographs of the silver powder that embodiment 1, comparative example 1 make respectively, and magnification is 10000 times, and the two compare visible, and the silver powder particle diameter that embodiment 1 makes is uniform, particle size distribution Narrow, small average particle size, good dispersion.
3、由实施例1和对比例2比较可知,制备表面处理剂时,所用的活性剂采用亲水性表面活性剂,制得的银粉质量明显降低。3. By comparison of Example 1 and Comparative Example 2, it can be seen that when the surface treatment agent is prepared, the activator used is a hydrophilic surfactant, and the quality of the obtained silver powder is obviously reduced.
4、由实施例1和对比例3比较、实施例5和对比例4比较可知,制备表面处理剂时,乳化的热水用量与疏水性表面活性剂用量,质量比低于1∶1或高于10∶1,制得的银粉质量明显降低。4. From the comparison of Example 1 and Comparative Example 3, and the comparison of Example 5 and Comparative Example 4, it can be seen that when preparing the surface treatment agent, the amount of emulsified hot water and the amount of hydrophobic surfactant, the mass ratio is lower than 1: 1 or higher At a ratio of 10:1, the quality of the obtained silver powder is obviously reduced.
5、由实施例5和对比例6比较可知,制备表面处理剂时,乳化搅拌时间低于1min,制得的银粉质量明显降低;由实施例4和对比例7比较可知,制备表面处理剂时,乳化搅拌时间高于3min,制得的银粉质量相当,没有提高,但增加电费、时间成本。5. By comparison of Example 5 and Comparative Example 6, it can be seen that when the surface treatment agent is prepared, the emulsification and stirring time is lower than 1min, and the quality of the silver powder obtained is obviously reduced; , the emulsification and stirring time is higher than 3min, the quality of the prepared silver powder is equivalent, there is no improvement, but the cost of electricity and time is increased.
6、由实施例1和对比例8比较可知,制备表面处理剂时,未加热水乳化,制得的银粉质量明显降低。6. From the comparison of Example 1 and Comparative Example 8, it can be seen that when the surface treatment agent is prepared, the quality of the silver powder obtained is obviously reduced due to emulsification with unheated water.
7、由实施例3和对比例9比较可知,制得的银粉分散性好坏与制备表面处理剂过程中的加热条件和热水温度密切相关。其中,当加热条件和热水温度在80℃~100℃的范围内时,表面处理剂的乳化效果好,银粉分散性高;当加热条件和热水温度在30℃~80℃的范围内时,温度对表面处理剂的乳化效果贡献较大,一般而言,当温度升高,表面处理剂物料体系里面包裹的液珠越小,之后与银粉包覆充分,制得的银粉分散性更好。也就是说当温度低于30℃时,乳化过程中形成的液珠粒径较大,可能无法实现乳化。7. From the comparison of Example 3 and Comparative Example 9, it can be seen that the dispersibility of the prepared silver powder is closely related to the heating conditions and hot water temperature in the process of preparing the surface treatment agent. Among them, when the heating conditions and hot water temperature are in the range of 80°C to 100°C, the emulsification effect of the surface treatment agent is good, and the dispersion of silver powder is high; when the heating conditions and hot water temperature are in the range of 30°C to 80°C , the temperature contributes a lot to the emulsification effect of the surface treatment agent. Generally speaking, when the temperature rises, the liquid droplets wrapped in the material system of the surface treatment agent are smaller, and then fully coated with silver powder, the prepared silver powder has better dispersibility . That is to say, when the temperature is lower than 30°C, the size of the droplets formed during the emulsification process is relatively large, and emulsification may not be achieved.
8、对于本申请技术方案制备表面处理剂步骤中的加热条件30℃~100℃、热水温度30℃~100℃,优选在加热条件80℃~100℃、热水温度80℃~100℃下,并选用亲水亲油平衡值(HLB)为0~10的疏水性表面活性剂,均可制备出分散性好、粒径分布窄的银粉;而在加热条件30℃~80℃、热水温度30℃~80℃下,并选用亲水亲油平衡值(HLB)为8~10的疏水性表面活性剂(例如实施例11、实施例12),均可制备出分散性好、粒径分布窄的银粉。8. For the step of preparing the surface treatment agent in the technical scheme of this application, the heating conditions are 30°C to 100°C and the hot water temperature is 30°C to 100°C, preferably under the heating conditions of 80°C to 100°C and the hot water temperature of 80°C to 100°C , and choose a hydrophobic surfactant with a hydrophilic-lipophilic balance (HLB) of 0-10, silver powder with good dispersibility and narrow particle size distribution can be prepared; At a temperature of 30°C to 80°C, and a hydrophobic surfactant (such as Example 11 and Example 12) with a hydrophilic-lipophilic balance (HLB) of 8 to 10 can be prepared to produce Narrowly distributed silver powder.
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210936670.9A CN115519129B (en) | 2022-08-05 | 2022-08-05 | Preparation method of silver powder for conductive paste |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210936670.9A CN115519129B (en) | 2022-08-05 | 2022-08-05 | Preparation method of silver powder for conductive paste |
Publications (2)
Publication Number | Publication Date |
---|---|
CN115519129A true CN115519129A (en) | 2022-12-27 |
CN115519129B CN115519129B (en) | 2023-04-18 |
Family
ID=84695494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210936670.9A Active CN115519129B (en) | 2022-08-05 | 2022-08-05 | Preparation method of silver powder for conductive paste |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115519129B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116765415A (en) * | 2023-06-26 | 2023-09-19 | 浙江光达电子科技有限公司 | Silver powder preparation method and silver powder |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008088453A (en) * | 2006-09-29 | 2008-04-17 | Dowa Holdings Co Ltd | Silver powder and method for producing the same |
CN102407341A (en) * | 2011-10-27 | 2012-04-11 | 浙江光达电子科技有限公司 | surface modified particle diameter mixed silver powder and preparation method thereof |
CN103079730A (en) * | 2011-06-16 | 2013-05-01 | 住友金属矿山株式会社 | Silver powder and method for producing same |
CN104858415A (en) * | 2015-04-23 | 2015-08-26 | 金川集团股份有限公司 | Superfine silver powder washing method |
CN106862588A (en) * | 2017-01-23 | 2017-06-20 | 湖南省国银新材料有限公司 | A kind of preparation method of laser engraving touch-screen silver paste super fine silver powder |
WO2018080090A1 (en) * | 2016-10-31 | 2018-05-03 | 엘에스니꼬동제련 주식회사 | Surface-treated silver powder and method for producing same |
CN108907226A (en) * | 2018-07-13 | 2018-11-30 | 金川集团股份有限公司 | A kind of preparation method for laser ablation electrode circuit super fine silver powder |
CN109732102A (en) * | 2019-03-18 | 2019-05-10 | 湘潭市泽宇新材料科技有限公司 | A kind of monodisperse high conductivity silver powder and preparation method thereof suitable for high and low temperature silver paste |
CN110947980A (en) * | 2019-12-24 | 2020-04-03 | 长沙新材料产业研究院有限公司 | Preparation method of micron/submicron silver powder |
CN111618316A (en) * | 2020-06-29 | 2020-09-04 | 河南金渠银通金属材料有限公司 | Surface-modified silver powder and coating preparation method thereof |
CN111889695A (en) * | 2020-07-15 | 2020-11-06 | 善日(嘉善)能源科技有限公司 | Preparation method of micro-nano silver powder with controllable particle size |
CN113649557A (en) * | 2021-07-08 | 2021-11-16 | 山东建邦胶体材料有限公司 | Large-particle silver powder and preparation method and application thereof |
-
2022
- 2022-08-05 CN CN202210936670.9A patent/CN115519129B/en active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008088453A (en) * | 2006-09-29 | 2008-04-17 | Dowa Holdings Co Ltd | Silver powder and method for producing the same |
CN103079730A (en) * | 2011-06-16 | 2013-05-01 | 住友金属矿山株式会社 | Silver powder and method for producing same |
CN102407341A (en) * | 2011-10-27 | 2012-04-11 | 浙江光达电子科技有限公司 | surface modified particle diameter mixed silver powder and preparation method thereof |
CN104858415A (en) * | 2015-04-23 | 2015-08-26 | 金川集团股份有限公司 | Superfine silver powder washing method |
WO2018080090A1 (en) * | 2016-10-31 | 2018-05-03 | 엘에스니꼬동제련 주식회사 | Surface-treated silver powder and method for producing same |
CN106862588A (en) * | 2017-01-23 | 2017-06-20 | 湖南省国银新材料有限公司 | A kind of preparation method of laser engraving touch-screen silver paste super fine silver powder |
CN108907226A (en) * | 2018-07-13 | 2018-11-30 | 金川集团股份有限公司 | A kind of preparation method for laser ablation electrode circuit super fine silver powder |
CN109732102A (en) * | 2019-03-18 | 2019-05-10 | 湘潭市泽宇新材料科技有限公司 | A kind of monodisperse high conductivity silver powder and preparation method thereof suitable for high and low temperature silver paste |
CN110947980A (en) * | 2019-12-24 | 2020-04-03 | 长沙新材料产业研究院有限公司 | Preparation method of micron/submicron silver powder |
CN111618316A (en) * | 2020-06-29 | 2020-09-04 | 河南金渠银通金属材料有限公司 | Surface-modified silver powder and coating preparation method thereof |
CN111889695A (en) * | 2020-07-15 | 2020-11-06 | 善日(嘉善)能源科技有限公司 | Preparation method of micro-nano silver powder with controllable particle size |
CN113649557A (en) * | 2021-07-08 | 2021-11-16 | 山东建邦胶体材料有限公司 | Large-particle silver powder and preparation method and application thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116765415A (en) * | 2023-06-26 | 2023-09-19 | 浙江光达电子科技有限公司 | Silver powder preparation method and silver powder |
Also Published As
Publication number | Publication date |
---|---|
CN115519129B (en) | 2023-04-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101805538B (en) | Lower-temperature sintered conductive ink | |
CN104710878A (en) | Metal Nanoparticle Synthesis and Conductive Ink Formulation | |
KR101885391B1 (en) | Silver powder and method for producing same | |
JPWO2012026033A1 (en) | Low temperature sinterable silver nanoparticle composition and electronic article formed using the composition | |
CN115519129B (en) | Preparation method of silver powder for conductive paste | |
JP2006169613A (en) | Method for forming metal thin film and metal thin film | |
CN110004713B (en) | Silver-containing graphene slurry, preparation method thereof and prepared product | |
TWI661012B (en) | Method for manufacturing core-shell type metal fine particle, core-shell type metal fine particle, conductive ink, and method for manufacturing substrate | |
CN113000855B (en) | Preparation method of micro-nano copper powder | |
CN110355381A (en) | A kind of nano-silver powder and the preparation method and application thereof | |
CN106623973A (en) | Controllable synthesis method for nickel platinum alloy nano-particles | |
CN111804905A (en) | Micron-sized spherical hollow gold powder and preparation method thereof | |
KR20140125366A (en) | Silver microparticles, method for producing same, and electronic device, conductive film, and conductive paste containing said silver microparticles | |
CN102286226B (en) | A kind of colorless transparent conductive ink and its preparation method and application | |
CN109943146A (en) | A kind of nano copper ink jet printing ink and preparation method and use thereof | |
JP2013036116A (en) | Flaky silver particle of microscale and method for producing the same | |
CN105008071A (en) | Silver powder | |
CN115028473B (en) | Method for preparing porous ceramic coated with metal coating and aerosol generating device | |
CN115519131B (en) | Preparation method of silver powder for conductive paste | |
CN109651892B (en) | A kind of preparation method of nano copper conductive ink | |
JP7031038B2 (en) | Manufacturing method of silver powder | |
CN113772661A (en) | A kind of preparation method of reduced graphene oxide/nano-silver composite film | |
JP2005019028A (en) | Metal colloid liquid, and conductive ink using it | |
CN115197609B (en) | A preparation and printing method of conductive ink for commercial inkjet printers | |
JP7490629B2 (en) | Metallic particle-containing ink |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 226300 Jiangsu Province Nantong City Nantong High-tech Development Zone Jinqiao West Road No.1 Juheng Industrial Park 5# Factory Building Patentee after: Nantong leader new material technology Co.,Ltd. Country or region after: China Patentee after: Junfeng Future Technology (Beijing) Co.,Ltd. Address before: 226000 Jiangsu Province Nantong City High-tech Development Zone Juheng Industrial Park No. 2 Standard Factory Building 4th Floor Patentee before: Nantong leader new material technology Co.,Ltd. Country or region before: China Patentee before: Nantong Junfeng New Material Technology Co.,Ltd. |
|
CP03 | Change of name, title or address |