CN109943146A - A kind of Nanometer Copper ink-jet printing ink and its preparation method and application - Google Patents
A kind of Nanometer Copper ink-jet printing ink and its preparation method and application Download PDFInfo
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- CN109943146A CN109943146A CN201910191510.4A CN201910191510A CN109943146A CN 109943146 A CN109943146 A CN 109943146A CN 201910191510 A CN201910191510 A CN 201910191510A CN 109943146 A CN109943146 A CN 109943146A
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Abstract
The invention discloses the preparation methods and purposes of a kind of Nanometer Copper ink-jet printing ink, its preparation step are as follows: prepare polyvinylpyrrolidone precursor liquid, by the polyvinylpyrrolidone for replacing different average molecular weight, to obtain the copper nano particles of different-grain diameter, and prepare copper source precursor liquid, reducing agent precursor liquid, copper source precursor liquid and reducing agent precursor liquid are added dropwise to together in polyvinylpyrrolidone precursor liquid, oil bath is stirred；Resulting product is dried in vacuo after carrying out centrifuge washing, obtains copper nano particles；The copper nano particles for obtaining different-grain diameter are mixed, is subsequently solubolized in the mixed liquor of deionized water, ethylene glycol and glycerine, ultrasonic disperse, obtains the Nanometer Copper ink-jet printing ink.The conductive ink has preferable stability, can be attached to well in the flexible substrates such as PET by way of inkjet printing, and conductive pattern filling is full, shows good electric conductivity, and preparation process is simple, economic and environment-friendly, low in cost.
Description
Technical field
The invention belongs to metallic conduction field of nanoparticles, in particular to a kind of inkjet printing that is directed to is in the flexible base such as PET
On bottom, the ink-jet printing ink and preparation method thereof comprising different-grain diameter Nanometer Copper.
Background technique
With the demand of the economic route manufactured to electronic device, inkjet printing technology is more and more focused on
On.Metal nanoparticle is considered as the important component of electrically conductive ink.Currently, Nano silver grain electrically conductive ink business
Change and is applied to manufacture electronic product, such as conducting channel, electrode, radio frequency identification (RFID) label and sensor.However, silver
High cost and electromigration limit the large-scale use of silver-colored electrically conductive ink.In contrast, copper nano-particle is considered one
The material of kind of potential alternative silver, because copper is low with price, conductivity height and the high feature of electromigration resisting property, blocky copper
Resistivity is 1.72 μ Ω cm, is only slightly higher than 1.59 μ Ω cm of blocky silver.
In order to prepare the different copper nano particles of partial size, imitated using the steric hindrance of different molecular weight polyvinylpyrrolidone
The size answered controls the formation of copper nano particles, and PVP-K90 is due to the higher steric hindrance effect of its big molecular weight bring
The continued growth of copper nano particles should be inhibited to a certain extent, so when it is as covering, the copper nanometer of preparation
The partial size of particle is smaller.On the contrary, PVP-K30 is due to its comparatively lesser molecular weight, and when it is as covering, preparation
Copper nano particles partial size it is larger.After the completion of the preparation of different-grain diameter copper nano particles, by the two with certain solid content ratio
Example mixing is then added related solvents and is configured to conductive ink progress inkjet printing, which shows preferable affine with PET
Property, the electrical property of sintered conducting wire is good.
Chinese patent CN 101693297A discloses a kind of preparation method of copper nanoparticles with different particle diameters, using chemistry
The method of reduction prepares nano copper particle, but the type of required reagent is excessive, except basic mantoquita, covering and reducing agent
Outside, it is also necessary to add complexing agent and surfactant, step is complicated and the particle of preparation is micron level, while the copper prepared
Grain also take out by more difficult centrifugation.Chinese patent CN 106424751A discloses a kind of preparation method of copper nanoparticle, using machine
The method of tool mixed calcining, but reaction is related to salt sour solvent, and needs to carry out under reducing atmosphere hydrogen, brings to experiment safety
Very big hidden danger.
Summary of the invention
The purpose of the present invention is being directed to the method for above-mentioned nano copper particle conductive ink, propose that one kind is set
The different Nanometer Copper ink-jet printing ink and preparation method thereof of standby simple, easily operated partial size.
To achieve the above object, the technical solution adopted by the present invention are as follows:
A kind of preparation method of Nanometer Copper ink-jet printing ink, includes the following steps:
(1) it prepares polyvinylpyrrolidone precursor liquid: polyvinylpyrrolidone being taken to be placed in container, ethylene glycol is added, stirs
It mixes uniformly, is configured to polyvinylpyrrolidone precursor liquid；It prepares polyvinylpyrrolidone precursor liquid: polyvinylpyrrolidone being taken to set
In container, ethylene glycol is added, stirs evenly, is configured to polyvinylpyrrolidone precursor liquid；Wherein, by replacing different put down
The polyvinylpyrrolidone of average molecular weight, to obtain the copper nano particles of different-grain diameter；
(2) it prepares copper source precursor liquid: taking copper sulphate to be dissolved in the container equipped with ethylene glycol, stirred evenly under room temperature, prepare
At copper source predecessor；
(3) it prepares reducing agent precursor liquid: taking ascorbic acid to be dissolved in the beaker equipped with ethylene glycol, stirred evenly under room temperature,
It is configured to reducing agent precursor liquid；
(4) precursor liquid is added dropwise: copper source predecessor and reducing agent precursor liquid that step (2) and step (3) obtain are dripped together
It adds in the polyvinylpyrrolidone precursor liquid in step (1), stirs oil bath；
(5) centrifuge washing: step (4) are reacted after resulting product carries out centrifuge washing and are dried in vacuo, copper nanometer is obtained
Particle；
(6) prepare ink: will obtain different-grain diameter copper nano particles mix, be subsequently solubolized in deionized water, ethylene glycol and
In the mixed liquor of glycerine, ultrasonic disperse obtains the copper nanometer ink-jet printing ink.
In the step (1), the concentration of polyvinylpyrrolidone precursor liquid is 0.01M；Polyvinylpyrrolidone is averaged
Molecular weight is 40000~1300000, by selecting the polyvinylpyrrolidone of different average molecular weight, prepares different-grain diameter
Copper nano particles, wherein select average molecular weight for 40000 PVP-K30, the PVP-K30 packet that partial size is 150nm is prepared
The copper nano particles covered, selecting average molecular weight for 1300000 is PVP-K90, and the PVP-K90 packet that partial size is 50nm is prepared
The copper nano particles covered.
In the step (2), the concentration of copper source precursor liquid is 0.01~0.03M.
In the step (3), the concentration of reducing agent precursor liquid is 0.01~0.03M.
In the step (4), drop rate is 1mL/min~2mL/min, and oil bath temperature is 100~150 DEG C.
In the step (6), it is 150nm copper nano particles and partial size is that the copper nano particles of different-grain diameter, which include partial size,
The solid content ratio for the copper nano particles that the copper nano particles of 50nm, 150nm copper nano particles and partial size are 50nm is 3:7~1:
1；Copper nano particles and the mass ratio of deionized water, ethylene glycol and glycerine are 3:7:4:5:5；The copper nanometer inkjet printing of preparation
The viscosity of ink is 10~16cps.
A kind of Nanometer Copper ink-jet printing ink prepared by method described above.It is scattered in by spherical copper nano particles
It is formed in the mixed liquor of deionized water, ethylene glycol and glycerine, copper nano particles have different partial sizes, after being configured to ink
Little particle can be filled between bulky grain, therefore the ink that the nano particle is prepared has lower sintering temperature and preferably leads
Electrically.At the same time, after doing hydrophilic treated to flexible substrates, which can preferably adhere on a flexible substrate, sintering
Conducting wire afterwards is more fine.Nano copper particle conductive ink of the invention carries out printing and thermal sintering on a flexible substrate
After have preferable electric conductivity.
Nanometer Copper ink-jet printing ink of the invention can be applied in flexible electronic printing, specific steps are as follows:
Step a handles substrate: to flexible substrates plasma treatment；
Step b, printing ink: will be in Nanometer Copper ink-jet printing ink inkjet printing flexible substrates after treatment；
Sintering processes: step c the flexible substrates for adhering to conductive pattern is put into vacuum drying oven and are sintered.
In the step a, flexible substrates are polyethylene terephthalate or photo paper；The time of plasma treatment is
The contact angle of 5~20min, Nanometer Copper ink-jet printing ink and flexible substrates is 39~63 °.
In the step c, sintering temperature is 50~200 DEG C, sintering time 60min.
The utility model has the advantages that the method that the present invention uses electronation, using the PVP series of different molecular weight as covering, Vc is
Reducing agent, CuSO4For copper source, reaction temperature is 100~150 DEG C, and reaction 60min prepares copper nano particles.The spherical shape prepared
Copper nano particles partial size is respectively 50nm and 150nm, after the nano copper particle of two kinds of partial sizes is mixed, is configured to after solvent is added
Conductive ink, the ink can be preferably attached on PET.Raw material needed for the different-grain diameter copper nano particles of this method preparation is easy
, it is easy to operate, it is suitble to investment application.
Detailed description of the invention
Fig. 1 is copper nano particles scanning electron microscope (SEM) figure prepared by the present invention, wherein a is copper prepared by embodiment 1
Nano particle scanning electron microscope (SEM) figure, b are copper nano particles scanning electron microscope (SEM) figure prepared by embodiment 2；
Fig. 2 is contact angle figure of the different-grain diameter copper nano particles conductive ink on PET prepared by embodiment 3, wherein
A, b figure is respectively the contact angle figure of ink droplet and substrate after the ultraviolet processing 20min and 5min of PET；
Fig. 3 is the conducting wire optical picture after different-grain diameter copper nano particles printing of conductive inks prepared by embodiment 3,
It can be seen that the line edges after printing are flat and smooth, route is fine；
Fig. 4 is scanning electron microscope (SEM) figure after the sintering of different-grain diameter copper nano particles conductive ink prepared by embodiment 3,
Wherein, the sintering temperature that the sintering temperature of conductive ink is respectively in a, b, c, d is respectively 50 DEG C, 100 DEG C, 150 DEG C, 200 DEG C.
Specific embodiment
A kind of Nanometer Copper ink-jet printing ink of the invention is scattered in deionized water, second two by spherical copper nano particles
It is formed in the mixed liquor of pure and mild glycerine, copper nano particles have different partial sizes, comprising: the copper nanometer of PVP-K30 cladding
Grain partial size is about 150nm, and the copper nano particles partial size of PVP-K90 cladding is about 50nm.Little particle can after being configured to ink
It is filled between bulky grain, therefore the ink that the nano particle is prepared has lower sintering temperature and preferable electric conductivity.With this
Meanwhile after doing hydrophilic treated to flexible substrates, which can preferably adhere on a flexible substrate, sintered conductor wire
Road is more fine.
The preparation method of above-mentioned Nanometer Copper ink-jet printing ink, includes the following steps:
(1) it prepares polyvinylpyrrolidone PVP precursor liquid: polyvinylpyrrolidone being taken to be placed in container, ethylene glycol is added,
It stirs evenly, is configured to polyvinylpyrrolidone precursor liquid；By replacing the polyvinylpyrrolidone of different average molecular weight,
To obtain the copper nano particles of different-grain diameter；
Wherein, the concentration of polyvinylpyrrolidone precursor liquid is 0.01M；
The average molecular weight of polyvinylpyrrolidone is 40000~1300000, by selecting the poly- of different average molecular weight
Vinylpyrrolidone, prepares the copper nano particles of different-grain diameter, specifically, select average molecular weight for 40000 PVP-K30,
The copper nano particles that the PVP-K30 that partial size is 150nm is coated are prepared, selecting average molecular weight for 1300000 is PVP-
The copper nano particles that the PVP-K90 that partial size is 50nm is coated are prepared in K90；
(2) it prepares copper source precursor liquid: taking copper sulphate to be dissolved in the container equipped with ethylene glycol, stirred evenly under room temperature, prepare
At copper source predecessor；
Wherein, the concentration of copper source precursor liquid is 0.01~0.03M；
(3) it prepares reducing agent precursor liquid: taking ascorbic acid to be dissolved in the beaker equipped with ethylene glycol, stirred evenly under room temperature,
It is configured to reducing agent precursor liquid；
Wherein, the concentration of reducing agent precursor liquid is 0.01~0.03M；
(4) be added dropwise precursor liquid: the copper source predecessor and reducing agent precursor liquid that step (2) and step (3) are obtained together with
Rate is that 1mL/min~2mL/min is added dropwise in the polyvinylpyrrolidone PVP precursor liquid in step (1), stirs oil bath, oil
Bath temperature is 100~150 DEG C, and the oil bath time is 60min；
(5) centrifuge washing: step (4) are reacted after resulting product carries out centrifuge washing and are dried in vacuo, copper nanometer is obtained
Particle；
(6) prepare ink: will obtain different-grain diameter copper nano particles mix, be subsequently solubolized in deionized water, ethylene glycol and
In the mixed liquor of glycerine, ultrasonic disperse obtains the Nanometer Copper ink-jet printing ink；
Wherein, the copper nanometer that the 150nm copper nano particles of PVP-K30 cladding and the partial size of PVP-K90 cladding are 50nm
The solid content ratio of grain is 3:7~1:1；Copper nano particles and the mass ratio of deionized water, ethylene glycol and glycerine are 3:7:4:
5:5；The viscosity of the copper nanometer ink-jet printing ink of preparation is 10~16cps.
Nanometer Copper ink-jet printing ink of the invention can be applied in flexible electronic printing, specific steps are as follows:
Step a handles substrate: to flexible substrates plasma treatment；Wherein, flexible substrates are polyethylene terephthalate
Ester PET or photo paper；The time of plasma treatment is 5~20min, the contact angle of Nanometer Copper ink-jet printing ink and flexible substrates
It is 39~63 °；
Step b, printing ink: will be in Nanometer Copper ink-jet printing ink inkjet printing flexible substrates after treatment；
Step c, sintering processes: the flexible substrates for adhering to conductive pattern being put into vacuum drying oven and are sintered, sintering temperature
Degree is 50~200 DEG C, sintering time 60min.
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.
The present embodiment is implemented premised on technical solution of the present invention, gives detailed embodiment and specific behaviour
Make process, but protection scope of the present invention is not limited to following embodiments, and only protection is specifically addressed.
Embodiment 1
It is the copper nano particles that a kind of PVP-K30 makees covering preparation in the present embodiment, preparation method includes following step
It is rapid:
Step 1, it prepares polyvinylpyrrolidone precursor liquid: 3g PVP-K30 being taken to be placed in a beaker, 50mL ethylene glycol is added,
It is stirred evenly at 140 DEG C and is configured to polyvinylpyrrolidone precursor liquid；
Step 2, it prepares copper source predecessor: taking 1.6g CuSO4It is dissolved in the beaker equipped with 20mL ethylene glycol, is stirred under room temperature
It mixes and is uniformly configured to copper source predecessor；
Step 3, it prepares reducing agent precursor liquid: taking 2g ascorbic acid to be dissolved in the beaker equipped with 20mL ethylene glycol, under room temperature
It stirs evenly and is configured to reducing agent precursor liquid；
Step 4, precursor liquid is added dropwise: being with rate by copper source predecessor and reducing agent precursor liquid that step 2 and step 3 obtain
1mL/min is added dropwise to together in the beaker equipped with polyvinylpyrrolidone precursor liquid in step 1, stirs oil bath at 140 DEG C
60min；
Step 5, centrifuge washing: step 4 is reacted after resulting product carries out centrifuge washing and is dried in vacuo, with revolving speed
4000rpm is centrifuged 5min, and deionized water and ethyl alcohol are successively respectively washed twice, is subsequently placed into vacuum drying oven dry；Obtain copper
Nano particle.
The copper nano particles pattern prepared to embodiment 1 is analyzed, scanning electron microscope (SEM) figure such as Fig. 1 (a)
It is shown, it can be seen that product is spherical nanoparticle, and partial size is about 150nm, more uniform, and dispersibility is preferably.
Embodiment 2
It is the copper nano particles conductive ink that a kind of PVP-K90 makees covering preparation, preparation method packet in the present embodiment
Include following steps:
Step 1, it prepares polyvinylpyrrolidone precursor liquid: 3g PVP-K90 being taken to be placed in a beaker, 50mL ethylene glycol is added,
It is stirred evenly at 140 DEG C and is configured to polyvinylpyrrolidone precursor liquid；
Step 2, it prepares copper source precursor liquid: taking 1.6g CuSO4It is dissolved in the beaker equipped with 20mL ethylene glycol, is stirred under room temperature
It mixes and is uniformly configured to copper source predecessor；
Step 3, it prepares reducing agent precursor liquid: taking 2g ascorbic acid to be dissolved in the beaker equipped with 20mL ethylene glycol, under room temperature
It stirs evenly and is configured to reducing agent precursor liquid；
Step 4, precursor liquid is added dropwise: the copper sulphate precursor liquid and reducing agent precursor liquid that step 2 and step 3 are obtained are with rate
It is added dropwise to together for 2mL/min in the beaker equipped with polyvinylpyrrolidone precursor liquid in step 1, stirs oil bath at 140 DEG C
60min；
Step 5, centrifuge washing: step 4 is reacted after resulting product carries out centrifuge washing and is dried in vacuo, with revolving speed
4000rpm is centrifuged 5min, and deionized water and ethyl alcohol are successively respectively washed twice, is subsequently placed into vacuum drying oven dry；Obtain copper
Nano particle.
The copper nano particles pattern prepared to embodiment 2 is analyzed, scanning electron microscope (SEM) figure such as Fig. 1 (b)
It is shown, it can be seen that product is the spherical nanoparticle that partial size is about 50nm, and uniform particle diameter is well dispersed.
Embodiment 3
It is a kind of conductive ink of nano copper particle containing different-grain diameter in the present embodiment, prepares PVP-K30 packet respectively
The copper nano particles that the partial size for 150nm copper nano particles and the PVP-K90 cladding covered is 50nm, it is different to be then mixed preparation
The copper nano particles conductive ink of partial size, specific steps are as follows:
Step 1, it prepares polyvinylpyrrolidone precursor liquid: taking 3g PVP-K90 or 3g PVP-K30 to be placed in a beaker, add
Enter 50mL ethylene glycol, is stirred evenly at 140 DEG C and be configured to polyvinylpyrrolidone precursor liquid；By replacing polyvinylpyrrolidine
Ketone, the partial size of the 150nm copper nano particles that PVP-K30 is coated and PVP-K90 cladding is made as the copper nano particles of 50nm；
Step 2, it prepares copper source predecessor: taking 1.6g CuSO4It is dissolved in the beaker equipped with 20mL ethylene glycol, is stirred under room temperature
It mixes and is uniformly configured to copper source predecessor；
Step 3, it prepares reducing agent precursor liquid: taking 2g ascorbic acid to be dissolved in the beaker equipped with 20mL ethylene glycol, under room temperature
It stirs evenly and is configured to reducing agent precursor liquid；
Step 4, precursor liquid is added dropwise: being with rate by copper source predecessor and reducing agent precursor liquid that step 2 and step 3 obtain
1mL/min is added dropwise to together in the beaker equipped with polyvinylpyrrolidone precursor liquid in step 1, stirs oil bath at 140 DEG C
60min；
Step 5, centrifuge washing: step 4 being reacted after resulting product carries out centrifuge washing and is dried in vacuo, 4000rpm from
Heart 5min, deionized water and ethyl alcohol are successively respectively washed twice, are subsequently placed into vacuum drying oven dry；
Step 6, ink is prepared: the 150nm copper nano particles and PVP-K90 packet that PVP-K30 obtained in step 5 is coated
The partial size covered is that the copper nano particles of 50nm are mixed with the solid content ratio of 7:3, is subsequently solubolized in deionized water, ethylene glycol and the third three
In alcohol, ultrasonic 20min；
Step 7, substrate is handled: to flexible substrates PET plasma treatment 15min；
Step 8, inkjet printing: by the ink jet prepared in step 6 flexibilities such as PET or photo paper that are printed upon that treated
In substrate；
Step 9, sintering processes: the flexible substrates for adhering to conductive pattern are put into vacuum drying oven at 50~200 DEG C and are carried out
Sintering, sintering time 60min.
Compatibility of the different-grain diameter copper nano particles conductive ink on PET prepared by embodiment 3 is tested, as a result
As shown in Fig. 2, contact angular region of the ink with substrate is 39~63 °, show that the compatibility of ink and substrate is preferable.Ink printed
The conductive film pictorial diagram constituted afterwards is as shown in Figure 3.Then its microscopic appearance is analyzed, scanning electron microscope (SEM) figure
As shown in fig. 4, it can be seen that the fusion of nano particle is more close, and little particle is served as by a~d with the promotion of sintering temperature
The effect of welding compound, is filled between bulky grain, so that conductive path is increased, thus macroscopically improving conductive film
Electric conductivity.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (10)
1. a kind of preparation method of Nanometer Copper ink-jet printing ink, characterized by the following steps:
(1) it prepares polyvinylpyrrolidone precursor liquid: polyvinylpyrrolidone being taken to be placed in container, ethylene glycol is added, stirring is equal
It is even, it is configured to polyvinylpyrrolidone precursor liquid；Wherein, by replacing the polyvinylpyrrolidone of different average molecular weight,
To obtain the copper nano particles of different-grain diameter；
(2) it prepares copper source precursor liquid: taking copper sulphate to be dissolved in the container equipped with ethylene glycol, stirred evenly under room temperature, be configured to copper
Source precursor liquid；
(3) it prepares reducing agent precursor liquid: taking ascorbic acid to be dissolved in the beaker equipped with ethylene glycol, stirred evenly under room temperature, prepare
At reducing agent precursor liquid；
(4) precursor liquid is added dropwise: copper source precursor liquid and reducing agent precursor liquid that step (2) and step (3) obtain are added dropwise to together
In polyvinylpyrrolidone precursor liquid in step (1), oil bath is stirred；
(5) centrifuge washing: step (4) are reacted after resulting product carries out centrifuge washing and are dried in vacuo, copper nano particles are obtained；
(6) prepare ink: the copper nano particles that will obtain different-grain diameter mix, and are subsequently solubolized in deionized water, ethylene glycol and the third three
In the mixed liquor of alcohol, ultrasonic disperse obtains the Nanometer Copper ink-jet printing ink.
2. the preparation method of Nanometer Copper ink-jet printing ink according to claim 1, it is characterised in that: the step (1)
In, the concentration of polyvinylpyrrolidone precursor liquid is 0.01M；The average molecular weight of polyvinylpyrrolidone be 40000~
1300000, by selecting the polyvinylpyrrolidone of different average molecular weight, prepare the copper nano particles of different-grain diameter, wherein
It selects average molecular weight for 40000 PVP-K30, the copper nano particles that the PVP-K30 that partial size is 150nm is coated is prepared,
Selecting average molecular weight for 1300000 is PVP-K90, and the copper nano particles that the PVP-K90 that partial size is 50nm is coated are prepared.
3. the preparation method of Nanometer Copper ink-jet printing ink according to claim 1, it is characterised in that: the step (2)
In, the concentration of copper source precursor liquid is 0.01~0.03M.
4. the preparation method of Nanometer Copper ink-jet printing ink according to claim 1, it is characterised in that: the step (3)
In, the concentration of reducing agent precursor liquid is 0.01~0.03M.
5. the preparation method of Nanometer Copper ink-jet printing ink according to claim 1, it is characterised in that: the step (4)
In, drop rate is 1mL/min~2mL/min, and oil bath temperature is 100~150 DEG C, and the oil bath time is 60min.
6. the preparation method of Nanometer Copper ink-jet printing ink according to claim 1, it is characterised in that: the step (6)
In, the copper nano particles of different-grain diameter include the copper nano particles that partial size is 150nm copper nano particles and partial size is 50nm,
The mass ratio for the copper nano particles that 150nm copper nano particles and partial size are 50nm is 3:7~1:1；Copper nano particles and go from
The mass ratio of sub- water, ethylene glycol and glycerine is 3:7:4:5:5；The viscosity of the copper nanometer ink-jet printing ink of preparation be 10~
16cps。
7. a kind of Nanometer Copper ink-jet printing ink of any method preparation of claim 1-6.
8. purposes of the Nanometer Copper ink-jet printing ink as claimed in claim 7 in flexible electronic printing, specific steps are as follows:
Step a handles substrate: to flexible substrates plasma treatment；
Step b, printing ink: will be in Nanometer Copper ink-jet printing ink inkjet printing flexible substrates after treatment；
Sintering processes: step c the flexible substrates for adhering to conductive pattern is put into vacuum drying oven and are sintered.
9. purposes according to claim 8, it is characterised in that: in the step a, flexible substrates are poly terephthalic acid second
Diol ester (PET) or photo paper；The time of plasma treatment is 5~20min, Nanometer Copper ink-jet printing ink and flexible substrates
Contact angle is 39~63 °.
10. purposes according to claim 8, it is characterised in that: in the step c, sintering temperature is 50~200 DEG C, is burnt
The knot time is 60min.
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| CN111975011A (en) * | 2020-07-20 | 2020-11-24 | 华南理工大学 | Nano copper paste for chip pressureless sintering interconnection and preparation method and application thereof |
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| CN115197609A (en) * | 2022-08-22 | 2022-10-18 | 上海应用技术大学 | Preparation and printing method of conductive ink for commercial ink-jet printer |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111151767A (en) * | 2020-01-16 | 2020-05-15 | 江苏镭明新材料科技有限公司 | Preparation method of composite nano-silver ink-jet conductive ink |
| CN111975011A (en) * | 2020-07-20 | 2020-11-24 | 华南理工大学 | Nano copper paste for chip pressureless sintering interconnection and preparation method and application thereof |
| CN111975011B (en) * | 2020-07-20 | 2022-01-18 | 华南理工大学 | Nano copper paste for chip pressureless sintering interconnection and preparation method and application thereof |
| CN113579229A (en) * | 2021-06-18 | 2021-11-02 | 西湖未来智造(杭州)科技发展有限公司 | Nano metal 3D printing ink and application thereof |
| CN114210972A (en) * | 2021-11-03 | 2022-03-22 | 中科检测技术服务(重庆)有限公司 | Novel nano copper welding material |
| CN114210972B (en) * | 2021-11-03 | 2023-04-14 | 中科检测技术服务(重庆)有限公司 | Preparation method of novel nano copper welding material |
| CN115197609A (en) * | 2022-08-22 | 2022-10-18 | 上海应用技术大学 | Preparation and printing method of conductive ink for commercial ink-jet printer |
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