CN115513669A - 2-bit Ka-band electric control programmable super surface - Google Patents
2-bit Ka-band electric control programmable super surface Download PDFInfo
- Publication number
- CN115513669A CN115513669A CN202211354139.7A CN202211354139A CN115513669A CN 115513669 A CN115513669 A CN 115513669A CN 202211354139 A CN202211354139 A CN 202211354139A CN 115513669 A CN115513669 A CN 115513669A
- Authority
- CN
- China
- Prior art keywords
- metal
- layer
- metal layer
- patch
- rectangular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 281
- 239000002184 metal Substances 0.000 claims abstract description 281
- 230000010287 polarization Effects 0.000 claims description 19
- 238000001914 filtration Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 238000004891 communication Methods 0.000 abstract description 14
- 239000010410 layer Substances 0.000 description 126
- 230000004044 response Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000005388 cross polarization Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000013139 quantization Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910021542 Vanadium(IV) oxide Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- GRUMUEUJTSXQOI-UHFFFAOYSA-N vanadium dioxide Chemical compound O=[V]=O GRUMUEUJTSXQOI-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0086—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
- H01Q15/002—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective said selective devices being reconfigurable or tunable, e.g. using switches or diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
- H01Q15/0026—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective said selective devices having a stacked geometry or having multiple layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0053—Selective devices used as spatial filter or angular sidelobe filter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
- H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Landscapes
- Semiconductor Integrated Circuits (AREA)
Abstract
The invention discloses a 2-bit Ka-band electric control programmable super surface, which comprises M multiplied by N (M and N are positive integers) super surface units which are periodically arranged in two dimensions; the super surface unit comprises the following components in sequence from top to bottom: the prepreg comprises a first metal layer, a first dielectric layer, a second metal layer, a prepreg bonding layer, a third metal layer, a second dielectric layer and a fourth metal layer; the super-surface unit realizes four digital coding units of '00', '01', '10' and '11' by loading two diodes between three sections of step width rectangular metal patches and adjusting the switch state combination of the diodes. The super surface can dynamically regulate and control the reflected wave of the high-frequency electromagnetic wave and provide certain gain, so that the coverage enhancement of the high-frequency signal is realized. The super surface has good application prospect in the fields of 5G millimeter wave communication and Ka waveband satellite communication.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a 2-bit Ka-band electric control programmable super surface.
Background
The super surface (artificial electromagnetic surface) is a two-dimensional novel electromagnetic material formed by periodic or aperiodic arrangement of sub-wavelength artificial units. By designing the unit structure, the size and the array topological mode of the super-surface, the super-surface can show some singular electromagnetic characteristics which natural materials do not have, and meanwhile, the super-surface has the characteristics of thin thickness, light weight, simple preparation process, easiness in integration and the like, so that the super-surface is widely researched and applied in the fields of electromagnetism and communication.
The super surface can be divided into static and dynamic states according to whether the super surface is adjustable, wherein the super surface is usually designed purely passively, the electromagnetic property of the super surface is completely dependent on a passive structure, and the super surface cannot be adjusted dynamically; in the latter, a source device or a special material, such as a switching diode (PIN), a Varactor (Varactor), an MEMS (micro-mechanical switch), a liquid crystal, graphene, vanadium dioxide, etc., is usually loaded in the design, and the operating state of the active device or the characteristics of the special material are changed by applying a specific condition, so that the dynamic control of the electromagnetic wave is realized, and thus, the application in a complex communication environment is facilitated. Meanwhile, in recent years, the digital coding super surface and programmable super surface concepts make digital coding type quantification on the electromagnetic characteristics of super surface units, and perfectly combine super surface array control and programming optimization processing, thereby further simplifying the design and control of the super surface.
With the continuous evolution of wireless communication technology to high frequency, millimeter wave communication technology becomes a research hotspot in the industry, wherein a 5G FR2 and a satellite communication part of frequency bands are deployed in a Ka band.
At present, the programmable super-surface for the Ka band has less work, and the work for realizing 2-bit phase quantization of the Ka band is less. However, ka band is an important frequency band for 5G FR2 communication and Ka band satellite communication, and its line-of-sight transmission characteristic is more significant than that of a low frequency band, and thus a corresponding technique is more required to enhance coverage.
In addition, aiming at the design of a 2-bit programmable super surface unit, on one hand, the existing work is mainly focused on the frequency band of 10GHz or below; on the other hand, most of the existing 2-bit programmable super-surface technologies adopt a three-section structure, but the existing design is that symmetrical narrow metal strips are basically placed on two sides, and a large metal patch is placed in the middle and designed into an asymmetrical form. However, in the high-frequency band, the size of the corresponding unit is smaller, and the prior art has the problems of large preparation error and unstable phase linearity and dispersion; meanwhile, the influence of the distribution parameters of the millimeter wave frequency band direct current circuit on alternating current is more obvious, and the direct current bias circuit and the alternating current and direct current isolation design in the prior art are more difficult.
Therefore, the prior art is in need of improvement.
Disclosure of Invention
The invention aims to solve the technical problem that the invention provides a 2-bit Ka-band electric control programmable super surface aiming at the defects of the prior art.
The technical scheme adopted by the invention for solving the technical problem is as follows:
the invention provides a 2-bit Ka-waveband electric control programmable super surface, which comprises M multiplied by N super surface units which are periodically arranged in two dimensions; the super surface unit comprises the following components in sequence from top to bottom:
the prepreg comprises a first metal layer, a first dielectric layer, a second metal layer, a prepreg bonding layer, a third metal layer, a second dielectric layer and a fourth metal layer;
the super-surface unit loads two diodes between three sections of step width rectangular metal patches on the first metal layer and adjusts the on-off state combination of the two diodes to realize four digital coding units of 00, 01, 10 and 11.
In one implementation, the super-surface unit is a square structure, and the unit period of the super-surface unit is p.
In one implementation, the first metal layer, the second metal layer, the third metal layer, and the fourth metal layer are all copper metal layers, and the thicknesses of the first metal layer, the second metal layer, the third metal layer, and the fourth metal layer are the same.
In one implementation manner, the thicknesses of the first dielectric layer and the second dielectric layer are both h1, the dielectric constants of the first dielectric layer and the second dielectric layer are both 3.55, and the loss tangents of the first dielectric layer and the second dielectric layer are both 0.0027.
In one implementation, the thickness of the prepreg bonding layer is h2, the dielectric constant of the prepreg bonding layer is 3.52, and the loss tangent of the prepreg bonding layer is 0.0041.
In one implementation, the first metal layer includes: the metal patch comprises a first rectangular metal patch, a second rectangular metal patch and a third rectangular metal patch;
the first rectangular metal patch, the second rectangular metal patch and the third rectangular metal patch are placed on the surface of the first dielectric layer in parallel.
In one implementation manner, the lengths of the first rectangular metal patch, the second rectangular metal patch and the third rectangular metal patch are all L, and the widths of the first rectangular metal patch, the second rectangular metal patch and the third rectangular metal patch are set in an increasing or decreasing manner.
In one implementation mode, a first metal blind hole is formed in the middle of the second rectangular metal patch, and the first metal blind hole penetrates through the first dielectric layer to be connected with the second metal layer.
In one implementation mode, the first rectangular metal patch leads out a first metal strip from the edge of the structure along the axis, and a first metal through hole is formed at the tail end of the first metal strip;
and a second metal strip is led out of the third rectangular metal patch along the axis from the edge of the structure, and a second metal through hole is formed in the tail end of the second metal strip.
In one implementation, the first metal via penetrates through a first window formed in the second metal layer and is connected to the third metal layer and the fourth metal layer;
and the second metal through hole penetrates through a second window arranged on the second metal layer to be connected with the third metal layer and the fourth metal layer.
In one implementation, the first rectangular metal patch and the second rectangular metal patch are connected across a first diode; the second rectangular metal patch and the third rectangular metal patch are connected across a second diode;
the cathodes of the first diode and the second diode are connected to the second rectangular metal patch, the anode of the first diode is connected to the first rectangular metal patch, and the anode of the second diode is connected to the third rectangular metal patch.
In one implementation, the third metal layer is a filter layer;
the third metal layer comprises a first metal fan-shaped filtering structure and a second metal fan-shaped filtering structure; the tail end of the first metal fan-shaped filtering structure is connected with the first metal through hole, and a direct current control line in the X polarization direction extends;
the tail end of the second metal fan-shaped filtering structure is connected with the second metal through hole and is connected to a direct current control line extending out of the fourth metal layer in the Y polarization direction;
and the direct current control lines in the X polarization direction and the direct current control lines in the Y polarization direction are layered and vertically crossed for wiring.
The invention adopts the technical scheme and has the following effects:
the invention utilizes three-section step width rectangular metal patch structure, combines the specific direct current bias control of two diodes, and realizes 2-bit phase quantization modulation on Ka-band incident waves; based on a three-section structure, the direct current control circuit is arranged along the cross polarization (Y-polarization) direction of the axis of the rectangular metal patches on the two sides, so that the influence of the distribution parameters of the direct current control circuit on the main polarization alternating current signal is effectively reduced; the isolation between the direct current control circuit and the resonance unit is further improved by utilizing a multi-layer framework of a modulation layer-ground-filter layer + control line layer 1-control line layer 2 and combining a layout wiring mode of layering and vertically crossing two direct current control lines of the super-surface unit.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of the overall structure of a super-surface unit according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a first metal layer of a super-surface unit according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a third metal layer of the super-surface unit according to the embodiment of the invention.
FIG. 4 is a graphical representation of the reflection amplitudes of the four states of a super-surface element in accordance with an embodiment of the present invention.
FIG. 5 is a diagram illustrating reflection phases of four states of a super-surface unit according to an embodiment of the present invention.
Fig. 6 is a schematic diagram of a super-surface array structure of 16 × 16 cells according to an embodiment of the present invention.
In the figure:
1. a first metal layer; 2. a first dielectric layer; 3. a second metal layer; 4. a prepreg adhesive layer; 5. a third metal layer; 6. a second dielectric layer; 7. a fourth metal layer; 8. a first metal blind hole; 11. a first rectangular metal patch; 12. a second rectangular metal patch; 13. a third rectangular metal patch; 51. a first metal sector filter structure; 52. a second metal sector filter structure; 91. a first metal via; 92. a second metal via; 101. a first diode; 102. a second diode.
The implementation, functional features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Examples
As shown in fig. 6, the present embodiment provides a 2-bit Ka-band electrically-controlled programmable super surface, including: and the super-surface units are arranged in an equal period mode.
In an implementation manner of this embodiment, the 2-bit Ka-band electrically-controlled programmable super surface is formed by periodically arranging M × N (M and N are positive integers, for example, M =16, N = 16) super surface units; the specific structure of each super-surface unit is as follows.
As shown in fig. 1-3, the present embodiment provides a super-surface unit, which is a 2-bit Ka-band electrically-controlled programmable super-surface unit.
As shown in fig. 1, the super-surface unit comprises, from top to bottom:
the structure comprises a first metal layer 1, a first dielectric layer 2, a second metal layer 3, a prepreg bonding layer 4, a third metal layer 5, a second dielectric layer 6 and a fourth metal layer 7. The super-surface unit loads two diodes between three sections of ladder-width rectangular metal patches on the first metal layer and adjusts the on-off state combination of the two diodes to realize four digital coding units of 00, 01, 10 and 11.
In one implementation of this embodiment, the super-surface unit has a square structure, and the unit period of the super-surface unit is p.
In an implementation manner of this embodiment, the super-surface unit is a multi-layer structure of a modulation layer-ground-filter layer + control line layer 1-control line layer 2, and the isolation between the dc control lines and the resonant unit is further improved by combining a layout and wiring manner that two dc control lines of the super-surface unit are layered and vertically crossed.
In an implementation manner of this embodiment, the first metal layer 1, the second metal layer 3, the third metal layer 5, and the fourth metal layer 7 in the super-surface unit are all copper metal layers, and the thicknesses of the first metal layer 1, the second metal layer 3, the third metal layer 5, and the fourth metal layer 7 are the same; in the present embodiment, the thickness of the first metal layer 1, the second metal layer 3, the third metal layer 5, and the fourth metal layer 7 may be 0.018mm.
In an implementation manner of this embodiment, the thicknesses of the first dielectric layer 2 and the second dielectric layer 6 in the super-surface unit are both h1, the dielectric constants of the first dielectric layer 2 and the second dielectric layer 6 are both 3.55, and the loss tangents of the first dielectric layer 2 and the second dielectric layer 6 are both 0.0027.
In one implementation of the present embodiment, the thickness of the prepreg bonding layer 4 in the super-surface unit is h2, the dielectric constant of the prepreg bonding layer 4 is 3.52, and the loss tangent of the prepreg bonding layer 4 is 0.0041.
As shown in fig. 2, in one implementation of the present embodiment, the first metal layer 1 is a modulation layer of the entire super-surface unit; the first metal layer 1 includes: a first rectangular metal patch 11, a second rectangular metal patch 12 and a third rectangular metal patch 13; the first rectangular metal patch 11, the second rectangular metal patch 12 and the third rectangular metal patch 13 are disposed on the surface of the first dielectric layer 2 in parallel.
In an implementation manner of this embodiment, the lengths of the first rectangular metal patch 11, the second rectangular metal patch 12, and the third rectangular metal patch 13 are all L, and the widths of the first rectangular metal patch 11, the second rectangular metal patch 12, and the third rectangular metal patch 13 are set incrementally, that is, W1 < W2 < W3 (W1, W2, and W3 are widths of the first rectangular metal patch 11, the second rectangular metal patch 12, and the third rectangular metal patch 13 in sequence), or the widths of the first rectangular metal patch 11, the second rectangular metal patch 12, and the third rectangular metal patch 13 are set incrementally.
In an implementation manner of this embodiment, a first metal blind hole 8 is disposed in the middle of a second rectangular metal patch 12, where the first metal blind hole 8 is a metalized blind hole, the first metal blind hole 8 is connected to the second rectangular metal patch 12, and the first metal blind hole 8 penetrates through the first dielectric layer 2 and is connected to the second metal layer 3, so as to form a conduction state between the second rectangular metal patch 12 and the second metal layer 3.
It can be understood that the second metal layer 3 is a super-surface unit ground layer, and the first rectangular metal patch 11 or the third rectangular metal patch 13 can be connected with the second metal layer 3 by controlling the connection state of the first rectangular metal patch 11 and the second rectangular metal patch 12, or controlling the connection state of the third rectangular metal patch 13 and the second rectangular metal patch 12.
In one implementation manner of this embodiment, the first rectangular metal patch 11 leads out a first metal strip from the edge of the structure along the axis, and a first metal through hole 91 is provided at the end of the first metal strip; the first metal via 91 is a metalized via, and the first metal via 91 is disposed in the middle of the ring at the end of the first metal strip and connected to the first metal strip.
Correspondingly, as a structure symmetrical to the first rectangular metal patch 11, the third rectangular metal patch 13 leads out a second metal strip from the edge of the structure along the axis, and a second metal through hole 92 is arranged at the tail end of the second metal strip; the second metal via 92 is a metalized via, and the second metal via 92 is disposed in the middle of the ring at the end of the second metal strip and connected to the second metal strip.
In one implementation manner of the present embodiment, a first window is disposed on the second metal layer 3 at a position corresponding to the first metal via 91; the first window is a circular window, and the diameter or width of the first window is larger than the diameter of the first metal through hole 91, so as to prevent the first metal through hole 91 from contacting the second metal layer 3 to form a short circuit state; when the first metal via 91 is provided, the first metal via 91 may pass through a first window (non-short-circuited state) provided in the second metal layer 3 and be connected to the third metal layer 5 and the fourth metal layer 7.
In one implementation manner of the present embodiment, a second window is disposed on the second metal layer 3 at a position corresponding to the second metal via 92; the second window is a circular window, and the diameter or width of the second window is larger than the diameter of the second metal through hole 92, so as to prevent the second metal through hole 92 from contacting the second metal layer 3 to form a short circuit state; when the second metal via 92 is provided, the second metal via 92 may pass through a second opening (non-short-circuited state) provided in the second metal layer 3, and be connected to the third metal layer 5 and the fourth metal layer 7.
In one implementation manner of this embodiment, when the positions of the first rectangular metal patch 11, the second rectangular metal patch 12, and the third rectangular metal patch 13 are set, the gap widths of the adjacent two rectangular metal patches are both g.
In one implementation manner of this embodiment, the first rectangular metal patch 11 and the second rectangular metal patch 12 are connected across the first diode 101; the second rectangular metal patch 12 and the third rectangular metal patch 13 are connected across the second diode 102; the cathodes of the first diode 101 and the second diode 102 are connected to the second rectangular metal patch 12, the anode of the first diode 101 is connected to the first rectangular metal patch 11, and the anode of the second diode 102 is connected to the third rectangular metal patch 13.
In one implementation manner of this embodiment, the ON/OFF state combination of the first diode 101 and the second diode 102 corresponds to a state relationship:
the reflective phase response state corresponding to the first diode 101OFF and the second diode 102OFF is "00"; the reflective phase response state corresponding to the first diode 101OFF and the second diode 102ON is "01"; the reflective phase response state corresponding to the first diode 101ON and the second diode 102OFF is "10"; the reflective phase response state corresponding to the first diode 101ON and the second diode 102ON is "11".
In this embodiment, by controlling the on-off states of the first diode 101 and the second diode 102, the first rectangular metal patch 11 and the second rectangular metal patch 12 can be disconnected/connected, and the third rectangular metal patch 13 and the second rectangular metal patch 12 can be disconnected/connected, so that the whole super-surface unit can form four reflection phase responses of 0 degree, 90 degrees, 180 degrees and 270 degrees, namely four digital coding states of "00", "01", "10" and "11". The whole super-surface unit in the embodiment has the characteristics of simple structure, flexibility in regulation and control, easiness in preparation, stable performance and the like.
In one implementation manner of this embodiment, the third metal layer 5 is a filter layer of the entire super-surface unit; as shown in fig. 3, the third metal layer 5 includes a first metal fan filter structure 51 and a second metal fan filter structure 52; the tail end of the first metal fan-shaped filter structure 51 is connected with the first metal through hole 91, and extends a direct current control line in the X polarization direction; the end of the second metal sector filter structure 52 is connected to the second metal via 92 and to the dc control line extending in the Y polarization direction from the fourth metal layer 7.
It can be understood that the dc control line in the X polarization direction is a first control line layer, and the dc control line in the Y polarization direction is a second control line layer; and the direct current control lines in the X polarization direction and the direct current control lines in the Y polarization direction are layered and vertically crossed for wiring.
In this embodiment, in the structure of the first metal layer, three stepped width rectangular metal patches are adopted, which have the same or similar length and uniform width and are in a line increasing or decreasing rule. On one hand, 2-bit reflection phase response of linear polarization incident waves is realized by combining the on-off states of the two diodes, on the other hand, the size of the linear polarization incident waves is uniform, the high-precision preparation requirement of high frequency can be better met, the processing relative error is small, and the effect that the phase linearity and the dispersion are more uniform and stable is further brought; in this embodiment, the dc control line is arranged in a three-stage structure, and is led out from the axes of the rectangular metal patches on both sides along the cross polarization (Y-polarization) direction. This way, the influence of the distribution parameters of the DC control circuit at high frequency on the main polarization AC signal can be reduced.
Compared with the existing super-surface unit, the super-surface unit in the embodiment is based on a layered and vertically crossed layout mode of a direct current control circuit under a multilayer framework of 'modulation layer-ground-filter + control line layer 1-control line layer 2', so that the isolation of direct current and alternating current signals is further increased, and the flexibility of more compact array layout and wiring is realized.
As shown in fig. 4, the simulation results show that: in the embodiment, under the infinite period boundary condition, the reflection amplitudes of the 2-bit super-surface basic unit in the 4 switch combination states of the two diodes are all larger than-4 dB, and the working center frequency of the 2-bit super-surface basic unit is 28GHz.
As shown in fig. 5, the simulation results show that: in the 2-bit super-surface basic unit in the embodiment, under the condition of an infinite period boundary, the reflection phase difference of two diodes under 4 switch combination states is close to 90 degrees.
It should be noted that, as another implementation manner in this embodiment, the patch satisfying the feature is deformed in a manner of forming a slit or an aperture, which all belong to the protection scope of this embodiment; accordingly, in the present embodiment, a PIN switch diode is used to implement state switching, and an alternative or alternative scheme is to use other active devices or materials to implement state switching, such as a Varactor (Varactor), a MEMS switch, and the like, and the effects in the present embodiment can also be achieved.
The embodiment adopting the technical scheme has the following effects:
in the embodiment, a three-section step width rectangular metal patch structure is utilized, and specific direct current bias control of two diodes is combined, so that 2-bit phase quantization modulation on Ka-band incident waves is realized; based on a three-section structure, the direct current control circuit is arranged along the cross polarization (Y-polarization) direction of the axis of the rectangular metal patches on the two sides, so that the influence of the distribution parameters of the direct current control circuit on the main polarization alternating current signal is effectively reduced; in the embodiment, by using a multi-layer architecture of a modulation layer-ground-filter layer + control line layer 1-control line layer 2, and combining a layout and wiring manner that two direct current control lines of a super-surface unit are layered and vertically crossed, the isolation between a direct current control line and a resonance unit is further improved.
The embodiment adopting the technical scheme has the following effects:
the embodiment provides a 2-bit Ka-band electrically-controlled programmable super surface aiming at the problems of high-frequency electromagnetic wave line-of-sight transmission characteristics and high transmission loss, can dynamically adjust a high-frequency electromagnetic wave transmission path and provide certain gain, and further realizes coverage enhancement of high-frequency signals; by loading two diodes between three sections of step width rectangular metal patches of each unit of the super surface and adjusting the on-off state combination of the diodes, four digital coding units of 00, 01, 10 and 11 are realized, so that the super surface has good application prospects in the fields of 5G millimeter wave communication and Ka waveband satellite communication.
In summary, the invention provides a 2-bit Ka-band electrically-controlled programmable super surface, which comprises M × N (M and N are positive integers) super surface units arranged periodically in two dimensions; the super surface unit comprises the following components in sequence from top to bottom: the prepreg comprises a first metal layer, a first dielectric layer, a second metal layer, a prepreg bonding layer, a third metal layer, a second dielectric layer and a fourth metal layer; the super-surface unit realizes four digital coding units of '00', '01', '10' and '11' by loading two diodes between three sections of step width rectangular metal patches and adjusting the switch state combination of the diodes. The super surface can dynamically regulate and control the reflected wave of the high-frequency electromagnetic wave and provide certain gain, so that the coverage enhancement of the high-frequency signal is realized. The super surface has a good application prospect in the fields of 5G millimeter wave communication and Ka waveband satellite communication.
It will be understood that the invention is not limited to the examples described above, but that modifications and variations will occur to those skilled in the art in light of the above teachings, and that all such modifications and variations are considered to be within the scope of the invention as defined by the appended claims.
Claims (12)
1. A2-bit Ka-band electric control programmable super surface comprises M x N super surface units which are periodically arranged in a two-dimensional mode; the super-surface unit is characterized by sequentially comprising from top to bottom:
the prepreg comprises a first metal layer, a first dielectric layer, a second metal layer, a prepreg bonding layer, a third metal layer, a second dielectric layer and a fourth metal layer;
the super-surface unit loads two diodes between three sections of step width rectangular metal patches on the first metal layer and adjusts the on-off state combination of the two diodes to realize four digital coding units of 00, 01, 10 and 11.
2. The 2-bit Ka-band electrically-controlled programmable super-surface according to claim 1, wherein the super-surface cells are in a square structure, and the cell period of the super-surface cells is p.
3. The 2-bit Ka-band electrically-controlled programmable meta-surface of claim 1, wherein the first metal layer, the second metal layer, the third metal layer and the fourth metal layer are all copper metal layers, and the first metal layer, the second metal layer, the third metal layer and the fourth metal layer have the same thickness.
4. The 2-bit Ka-band electrically-controlled programmable super surface according to claim 1, wherein the first dielectric layer and the second dielectric layer are both h1 thick, the first dielectric layer and the second dielectric layer are both 3.55 dielectric constants, and the first dielectric layer and the second dielectric layer are both 0.0027 loss tangent.
5. The 2-bit Ka-band electrically-controlled programmable super surface according to claim 1, wherein the thickness of the prepreg bonding layer is h2, the dielectric constant of the prepreg bonding layer is 3.52, and the loss tangent of the prepreg bonding layer is 0.0041.
6. The 2-bit Ka-band electrically controlled programmable super surface according to claim 1, wherein the first metal layer comprises: the metal patch comprises a first rectangular metal patch, a second rectangular metal patch and a third rectangular metal patch;
the first rectangular metal patch, the second rectangular metal patch and the third rectangular metal patch are placed on the surface of the first dielectric layer in parallel.
7. The 2-bit Ka-band electrically-controlled programmable super surface according to claim 6, wherein the lengths of the first rectangular metal patch, the second rectangular metal patch and the third rectangular metal patch are all L, and the widths of the first rectangular metal patch, the second rectangular metal patch and the third rectangular metal patch are set in an increasing or decreasing manner.
8. The 2-bit Ka-band electrically-controlled programmable super surface according to claim 6, wherein a first metal blind via is disposed in the middle of the second rectangular metal patch, and the first metal blind via penetrates through the first dielectric layer to be connected with the second metal layer.
9. The 2-bit Ka-band electrically-controlled programmable super surface according to claim 6, wherein the first rectangular metal patch is provided with a first metal strip led out from the edge of the structure along the axis, and a first metal through hole is formed at the end of the first metal strip;
and a second metal strip is led out of the third rectangular metal patch along the axis from the edge of the structure, and a second metal through hole is formed in the tail end of the second metal strip.
10. The 2-bit Ka-band electrically controlled programmable super surface according to claim 9, wherein the first metal via is connected to the third metal layer and the fourth metal layer through a first window disposed on the second metal layer;
and the second metal through hole penetrates through a second window arranged on the second metal layer to be connected with the third metal layer and the fourth metal layer.
11. The 2-bit Ka-band electrically controlled programmable super surface according to claim 6, wherein the first rectangular metal patch and the second rectangular metal patch are connected across a first diode; the second rectangular metal patch and the third rectangular metal patch are connected across a second diode;
the cathodes of the first diode and the second diode are connected to the second rectangular metal patch, the anode of the first diode is connected to the first rectangular metal patch, and the anode of the second diode is connected to the third rectangular metal patch.
12. The 2-bit Ka-band electrically controlled programmable super surface according to claim 9, wherein the third metal layer is a filter layer;
the third metal layer comprises a first metal fan-shaped filtering structure and a second metal fan-shaped filtering structure; the tail end of the first metal fan-shaped filtering structure is connected with the first metal through hole, and a direct current control line in the X polarization direction extends;
the tail end of the second metal fan-shaped filtering structure is connected with the second metal through hole and is connected to a direct current control line extending out of the fourth metal layer in the Y polarization direction;
and the direct current control lines in the X polarization direction and the direct current control lines in the Y polarization direction are layered and vertically crossed for wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211354139.7A CN115513669B (en) | 2022-10-28 | 2022-10-28 | 2-Bit Ka-band electric control programmable super-surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211354139.7A CN115513669B (en) | 2022-10-28 | 2022-10-28 | 2-Bit Ka-band electric control programmable super-surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115513669A true CN115513669A (en) | 2022-12-23 |
| CN115513669B CN115513669B (en) | 2024-05-14 |
Family
ID=84512330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211354139.7A Active CN115513669B (en) | 2022-10-28 | 2022-10-28 | 2-Bit Ka-band electric control programmable super-surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115513669B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115799838A (en) * | 2023-02-07 | 2023-03-14 | 西南科技大学 | Diode-vanadium dioxide-based composite energy selection surface |
| CN116231325A (en) * | 2023-02-28 | 2023-06-06 | 深圳大学 | Electrically adjustable two-phase electromagnetic super-surface unit and array |
| CN117559144A (en) * | 2023-12-27 | 2024-02-13 | 江苏赛博空间科学技术有限公司 | 2-bit large-angle incidence reconfigurable passive super-surface structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206401526U (en) * | 2016-10-24 | 2017-08-11 | 东南大学 | A kind of programmable 1 super surface of bit anisotropy of microwave section |
| CN109462036A (en) * | 2018-10-12 | 2019-03-12 | 东南大学 | A kind of electromagnetism coding basic unit and Meta Materials with adaptation function |
| CN110401038A (en) * | 2019-07-23 | 2019-11-01 | 东南大学 | Ka wave band realizes that the reflective of beam scanning may be programmed super surface |
| CN112290222A (en) * | 2020-09-27 | 2021-01-29 | 南京大学 | Programmable anisotropic coded super surface |
| CN113067163A (en) * | 2021-03-31 | 2021-07-02 | 东南大学 | Full-space programmable digital coding metamaterial and control method thereof |
| WO2021238609A1 (en) * | 2020-05-29 | 2021-12-02 | 华为技术有限公司 | Method, apparatus and system for sending data using electromagnetic metasurface array |
-
2022
- 2022-10-28 CN CN202211354139.7A patent/CN115513669B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206401526U (en) * | 2016-10-24 | 2017-08-11 | 东南大学 | A kind of programmable 1 super surface of bit anisotropy of microwave section |
| CN109462036A (en) * | 2018-10-12 | 2019-03-12 | 东南大学 | A kind of electromagnetism coding basic unit and Meta Materials with adaptation function |
| CN110401038A (en) * | 2019-07-23 | 2019-11-01 | 东南大学 | Ka wave band realizes that the reflective of beam scanning may be programmed super surface |
| WO2021238609A1 (en) * | 2020-05-29 | 2021-12-02 | 华为技术有限公司 | Method, apparatus and system for sending data using electromagnetic metasurface array |
| CN112290222A (en) * | 2020-09-27 | 2021-01-29 | 南京大学 | Programmable anisotropic coded super surface |
| CN113067163A (en) * | 2021-03-31 | 2021-07-02 | 东南大学 | Full-space programmable digital coding metamaterial and control method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115799838A (en) * | 2023-02-07 | 2023-03-14 | 西南科技大学 | Diode-vanadium dioxide-based composite energy selection surface |
| CN115799838B (en) * | 2023-02-07 | 2023-04-14 | 西南科技大学 | Diode-vanadium dioxide-based composite energy selection surface |
| CN116231325A (en) * | 2023-02-28 | 2023-06-06 | 深圳大学 | Electrically adjustable two-phase electromagnetic super-surface unit and array |
| CN116231325B (en) * | 2023-02-28 | 2024-03-15 | 深圳大学 | Electrically adjustable two-phase electromagnetic super-surface unit and array |
| CN117559144A (en) * | 2023-12-27 | 2024-02-13 | 江苏赛博空间科学技术有限公司 | 2-bit large-angle incidence reconfigurable passive super-surface structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115513669B (en) | 2024-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115513669A (en) | 2-bit Ka-band electric control programmable super surface | |
| CN107634345B (en) | A kind of high-gain gradual change slot array antenna suitable for 5G millimetre-wave attenuator | |
| CN108767456B (en) | Block-controllable directional diagram reconfigurable liquid crystal antenna and reconfiguration method | |
| EP3982479A1 (en) | Metamaterial adjustable capacitor structure | |
| CN105337033A (en) | Terahertz waveband reflecting antenna based on combination of artificial microstructure and transistor | |
| CN110444889B (en) | Terahertz electric control resonance switching type super-surface phase shift device | |
| CN112838373B (en) | Switchable broadband multifunctional metamaterial absorber/polarization converter | |
| CN111710985B (en) | Controllable polarization conversion surface based on liquid metal | |
| CN111987452A (en) | Transmission/reflection switchable and amplitude-adjustable metamaterial | |
| CN111665588A (en) | Bifunctional polarizer based on vanadium dioxide and Dirac semi-metal composite super-surface | |
| CN111740200A (en) | Power divider capable of continuously phase modulating based on liquid crystal substrate | |
| CN116960585B (en) | Liquid crystal phase shifter based on slow wave | |
| Li et al. | A reflective multilayer polarization converter with switchable frequency band | |
| CN113067148B (en) | Wave beam scanning antenna based on ferroelectric film | |
| CN114069249A (en) | Ultra-wideband transmission type terahertz polarization converter | |
| CN113540811A (en) | Electromagnetic protection active frequency selection surface and control method thereof | |
| CN113517563A (en) | Active super surface wave beam scanning structure | |
| CN114914700A (en) | Vanadium dioxide-based dynamic multifunctional terahertz reflective array and preparation method thereof | |
| CN114142223A (en) | Reconfigurable antenna based on graphene structure | |
| CN113394532A (en) | Arrangement comprising a waveguide for radio frequency signals | |
| CN111564704B (en) | Tunable wave-absorbing metamaterial based on ferromagnetic resonance | |
| CN117458159A (en) | High-on-off ratio controllable polarization screening frequency selection surface based on PIN tube | |
| CN217427105U (en) | Electromagnetic window regulation and control device | |
| CN113708080B (en) | Efficient phase dynamically adjustable reflection super-structure surface | |
| CN113206386B (en) | Millimeter wave intelligent super-surface unit and millimeter wave intelligent super-surface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |