CN115513359A - Quantum dot inorganic packaging color conversion sheet and manufacturing method thereof - Google Patents

Quantum dot inorganic packaging color conversion sheet and manufacturing method thereof Download PDF

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Publication number
CN115513359A
CN115513359A CN202211121894.0A CN202211121894A CN115513359A CN 115513359 A CN115513359 A CN 115513359A CN 202211121894 A CN202211121894 A CN 202211121894A CN 115513359 A CN115513359 A CN 115513359A
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China
Prior art keywords
quantum dot
color conversion
silicon substrate
pixel
conversion sheet
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CN202211121894.0A
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Chinese (zh)
Inventor
黄培轩
刘义刚
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Wells Advanced Materials Shanghai Co ltd
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Wells Advanced Materials Shanghai Co ltd
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Priority to CN202211121894.0A priority Critical patent/CN115513359A/en
Publication of CN115513359A publication Critical patent/CN115513359A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02Use of particular materials as binders, particle coatings or suspension media therefor
    • C09K11/025Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/005Processes relating to semiconductor body packages relating to encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0058Processes relating to semiconductor body packages relating to optical field-shaping elements

Abstract

The invention discloses a quantum dot inorganic packaging color conversion chip and a preparation method thereof, wherein the preparation method comprises the following steps: an inorganic glass substrate and a silicon substrate; the light emergent surface of the silicon substrate is in anodic bonding with the inorganic glass substrate, the light incident surface of the silicon substrate is etched with a plurality of pixel grooves, and the pixel grooves are filled with quantum dot color conversion materials. The inorganic glass substrate is adopted to package the quantum dot color conversion material, so that the quantum dot color conversion material can be effectively isolated from the outside air, the problem that the quantum dot particles in the quantum dot color conversion material are faded and even inactivated due to water vapor and oxygen in the air is solved, and the service life of the quantum dot color conversion material is greatly prolonged; the invention adopts the silicon substrate as the retaining wall, can effectively prevent the interference phenomenon that partial light emitted by one pixel enters into adjacent pixels, can increase the effective utilization rate of refraction enhanced light in the same pixel, and can also avoid the situation of re-excitation among different pixels.

Description

Quantum dot inorganic packaging color conversion sheet and manufacturing method thereof
Technical Field
The invention relates to the technical field of color conversion, in particular to a quantum dot inorganic packaging color conversion sheet and a manufacturing method thereof.
Background
The quantum dot material has the advantages of wide excitation spectrum, good monochromaticity, adjustable wavelength of a light-emitting peak and high conversion efficiency, can realize accurate regulation and control of a spectrum, and has more economic advantages and application prospects compared with the current fluorescent powder scheme.
However, the surfaces of the quantum dots are modified by special organic treatment, so that the quantum dots are easily corroded by water vapor and oxygen in an excited state and are ineffective; therefore, the encapsulation method for quantum dots is more strict than the encapsulation method for high-stability inorganic fluorescent powder at present.
Since the light reflected by the quantum dots does not have a specific direction and is emitted in all directions, if the color conversion sheet is patterned, part of the light emitted from one pixel enters an adjacent pixel, causing unnecessary interference and re-excitation. The common solution is to arrange a black matrix between adjacent pixels to solve the problems of crosstalk and failure to obtain the desired spectrum; however, most of the light is absorbed by the black matrix, resulting in low luminous efficiency.
Disclosure of Invention
In view of the above problems in the prior art, the present invention provides a quantum dot inorganic packaging color conversion plate and a manufacturing method thereof, which can prolong the service life of the quantum dot color conversion plate and effectively improve the luminous flux, luminous efficiency and color purity of the color conversion plate.
The invention discloses a quantum dot inorganic packaging color conversion sheet, which comprises: an inorganic glass substrate and a silicon substrate;
the light emergent surface of the silicon substrate is in anodic bonding with the inorganic glass substrate, the light incident surface of the silicon substrate is etched with a plurality of pixel grooves, and the pixel grooves are filled with quantum dot color conversion materials.
As a further improvement of the invention, the inorganic glass substrate is a transparent glass substrate with alkali metal, and the thickness of the inorganic glass substrate is 100-300 μm.
As a further improvement of the invention, the thickness of the silicon substrate is 100-200 μm, and the etching mode of the pixel groove comprises a dry method or a wet method.
As a further improvement of the invention, the etching depth of the pixel groove is equal to the thickness of the silicon substrate.
As a further refinement of the present invention, the quantum dot color conversion material comprises one or more of a colored quantum dot material comprising a red quantum dot material and a green quantum dot material, and a diffusing particle.
As a further improvement of the present invention, the quantum dot color conversion material filled in the plurality of pixel grooves is independently selected, and when one of the pixel grooves is simultaneously filled with the colored quantum dot material and the diffusion particles, the diffusion particles are uniformly dispersed in the colored quantum dot material.
As a further improvement of the invention, the core and shell materials of the colored quantum dot material include but are not limited to one of Zns, znSe, cdS, cdSe, gaN, gaP, gaSe and InP, and the diffusion particles are titanium dioxide.
As a further improvement of the invention, the particle size of the colored quantum dot material is 2-7 nm, and the particle size of the diffusion particles is in a nanometer level.
As a further improvement of the present invention, the pixel groove is further filled with a colorless solvent for curing the quantum dot color conversion material, wherein the colorless solvent includes but is not limited to acrylic acid.
The invention also discloses a preparation method of the quantum dot inorganic packaging color conversion sheet, which comprises the following steps:
bonding the light-emitting surface of the silicon substrate with the inorganic glass substrate anode;
etching a plurality of pixel grooves on the light incident surface of the silicon substrate;
and quantum dot color conversion materials are filled in each pixel groove.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the inorganic glass substrate is adopted to encapsulate the quantum dot color conversion material, so that the contact between the quantum dot color conversion material and the outside air can be effectively isolated, the problem that the quantum dot particles in the quantum dot color conversion material are faded and even inactivated due to water vapor and oxygen in the air is solved, and the service life of the quantum dot color conversion material is greatly prolonged; the inorganic glass has high light transmittance, so that the light flux is prevented from being weakened;
the invention adopts the silicon substrate as the retaining wall, can effectively prevent the interference phenomenon that partial light emitted by one pixel enters into adjacent pixels, can increase the effective utilization rate of refraction enhanced light in the same pixel, and can also avoid the situation of re-excitation among different pixels.
Drawings
Fig. 1 is a schematic structural diagram of a quantum dot inorganic packaging color conversion sheet according to an embodiment of the present invention.
In the figure:
1. an inorganic glass substrate; 2. a silicon substrate; 3. a light incident surface; 4. a light-emitting surface; 5. red quantum dots; 6. green quantum dots; 7. diffusing the particles; 8. a colorless solvent.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The invention is described in further detail below with reference to the attached drawing figures:
as shown in fig. 1, the present invention provides a quantum dot inorganic packaging color conversion sheet, which has a light incident surface 3 and a light emergent surface 4; the method comprises the following steps: an inorganic glass substrate 1 and a silicon substrate 2; wherein the content of the first and second substances,
the light-emitting surface of the silicon substrate 2 is in anodic bonding with the inorganic glass substrate 1, so that the inorganic glass substrate 1 and the silicon substrate 2 achieve good bonding effect; the inorganic glass substrate 1 is preferably a transparent glass substrate with alkali metal, and the thickness is 100 to 300 mu m; the inorganic glass substrate 1 is used as a light emitting surface of the color conversion sheet, and can reduce light attenuation and increase protection of the quantum dot color conversion material based on good sealing property and light transmittance of glass.
The light incident surface of the silicon substrate 2 is etched with a plurality of pixel grooves; the thickness of the silicon substrate 2 is 100-200 μm, the silicon substrate 2 is subjected to patterning etching to form a pixel groove, the etching mode is not limited to a dry method or a wet method, other modes can be selected, the depth of the pixel groove is the thickness of the silicon substrate 2, and the size specifically refers to the size of the light-emitting source chip; due to the opacity of the silicon substrate 2, color cross-over caused by part of the light emitted from one pixel entering an adjacent pixel and re-excitation between different pixels can be effectively prevented.
The required quantum dot color conversion material is correspondingly filled in each pixel groove, and other organic materials which need water resistance and have high oxygen coefficients can be filled; the quantum dot color conversion material comprises one or more of a colored quantum dot material and a diffusion particle 7, and the colored quantum dot material comprises a red quantum dot material 5 and a green quantum dot material 6; the quantum dot color conversion materials filled in the plurality of pixel grooves are independently selected, and when one pixel groove is simultaneously filled with the colored quantum dot material and the diffusion particles, the diffusion particles 7 are uniformly dispersed in the colored quantum dot material. Furthermore, the core and shell materials of the colored quantum dot material are not limited, and materials such as Zns, znSe, cdS, cdSe, gaN, gaP, gaSe, inP and the like can be freely selected; further, the diffusion particles 7 may be titanium dioxide; furthermore, the grain diameter of the quantum dot material with color is 2-7 nm, and the grain diameter of the diffusion particles is nano-scale.
The invention also fills the colorless solvent 8 for curing the quantum dot color conversion material in the pixel groove, and the colorless solvent 8 includes but is not limited to acrylic acid; further, the filling method of the quantum dot color conversion material and the colorless solvent 8 can be ink-jet, dispensing, and the like.
The color conversion sheet of the present invention has an incident surface 3 and an emergent surface 4, wherein the incident surface 3 is a surface of the color conversion sheet from which the backlight enters, and the emergent surface is a surface to be extracted when the color conversion sheet is applied, and the emergent surface and the incident surface can correspond to each other. The backlight source matched with the light incident surface of the color conversion sheet is not limited, and the backlight sources such as blue, red and the like can be freely selected; moreover, the pixels can also be colorless pixels and matched with various colors of backlight; for example: the multiple pixels are a combination of red, green and diffusing particle materials, and are matched with a blue backlight source. Therefore, the combination of the color of the pixel and the backlight source can be changed properly according to the actual requirement.
As shown in fig. 1, as an embodiment, the present invention selects a blue backlight, and fills a red quantum dot material 5, a diffusion particle 7, and a colorless solvent 8 in a first pixel groove of a silicon substrate 2, fills a green quantum dot material 6, a diffusion particle 7, and a colorless solvent 8 in a second pixel groove of the silicon substrate 2, and fills a diffusion particle 7 and a colorless solvent 8 in a third pixel groove of the silicon substrate 2. Therefore, after the blue backlight light passes through the color conversion sheet, red, green and blue light is formed on the light-emitting surface of the inorganic glass substrate 1 of the color conversion sheet.
The invention relates to a preparation method of a quantum dot inorganic packaging color conversion sheet, which comprises the following steps:
step 1, bonding a light-emitting surface of a silicon substrate with an inorganic glass substrate anode;
step 2, etching a plurality of pixel grooves on the light incident surface of the silicon substrate;
and 3, filling quantum dot color conversion materials in each pixel groove, wherein the formed color conversion sheet is provided with a light incident surface and a light emergent surface.
As an example, as shown in fig. 1, the preparation method of the present invention includes:
s1, bonding the light-emitting surface of the silicon substrate 2 with the anode of the inorganic glass substrate 1;
s2, etching a plurality of pixel grooves on the bonded silicon substrate 2;
s3, filling a red quantum dot material 5, diffusion particles 7 and a colorless solvent 8 in a first pixel groove of the silicon substrate 2, filling a green quantum dot material 6, diffusion particles 7 and a colorless solvent 8 in a second pixel groove of the silicon substrate 2, and filling diffusion particles 7 and a colorless solvent 8 in a third pixel groove of the silicon substrate 2 to form a color conversion sheet with a light-in surface and a light-out surface;
and S4, fixing the light incident surface of the color conversion sheet on the light emergent side of the blue backlight source.
Therefore, after the light emitted by the blue backlight passes through the color conversion sheet, red, green and blue light is formed on the light emitting surface of the inorganic glass substrate 1 of the color conversion sheet.
The invention has the advantages that:
according to the invention, the inorganic glass substrate is adopted to encapsulate the quantum dot color conversion material, so that the contact between the quantum dot color conversion material and the outside air can be effectively isolated, the problem that the quantum dot particles in the quantum dot color conversion material are faded and even inactivated due to water vapor and oxygen in the air is solved, and the service life of the quantum dot color conversion material is greatly prolonged; the inorganic glass has high light transmittance, so that the light flux is prevented from being weakened;
the invention adopts the silicon substrate as the retaining wall, can effectively prevent the interference phenomenon that part of light rays emitted by one pixel enter adjacent pixels, can increase the effective utilization rate of refraction and light increase in the same pixel, and can also avoid the situation of re-excitation among different pixels.
The present invention has been described in terms of the preferred embodiment, and it is not intended to be limited to the embodiment. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A quantum dot inorganic packaging color conversion sheet, comprising: an inorganic glass substrate and a silicon substrate;
the light emergent surface of the silicon substrate is in anodic bonding with the inorganic glass substrate, the light incident surface of the silicon substrate is etched with a plurality of pixel grooves, and the pixel grooves are filled with quantum dot color conversion materials.
2. The quantum dot inorganic packaging color conversion sheet according to claim 1, wherein the inorganic glass substrate is a transparent glass substrate with alkali metal, and the thickness is 100 to 300 μm.
3. The quantum dot inorganic packaging color conversion sheet according to claim 1, wherein the thickness of the silicon substrate is 100-200 μm, and the etching manner of the pixel groove includes but is not limited to a dry method or a wet method.
4. The quantum dot inorganic packaging color conversion plate of claim 1, wherein the etching depth of the pixel groove is equal to the thickness of the silicon substrate.
5. The quantum dot inorganic encapsulation color conversion sheet of claim 1, wherein the quantum dot color conversion material comprises one or more of a colored quantum dot material comprising a red quantum dot material and a green quantum dot material and a diffusing particle.
6. The quantum dot inorganic packaging color conversion sheet of claim 5, wherein the quantum dot color conversion material filled in a plurality of the pixel grooves is independently selected, and when one of the pixel grooves is simultaneously filled with the colored quantum dot material and the diffusion particles, the diffusion particles are uniformly dispersed in the colored quantum dot material.
7. The quantum dot inorganic packaging color conversion sheet according to claim 5, wherein the core and shell materials of the colored quantum dot material include but are not limited to one of Zns, znSe, cdS, cdSe, gaN, gaP, gaSe, inP, and the diffusing particles are titanium dioxide.
8. The quantum dot inorganic packaging color conversion sheet according to claim 5, wherein the particle size of the colored quantum dot material is 2 to 7nm, and the particle size of the diffusion particle is in the nanometer order.
9. The quantum dot inorganic packaging color conversion sheet according to any one of claims 1 to 8, wherein the pixel grooves are further filled with a colorless solvent for curing the quantum dot color conversion material, wherein the colorless solvent includes but is not limited to acrylic acid.
10. A method for preparing the quantum dot inorganic packaging color conversion sheet according to any one of claims 1 to 9, comprising:
bonding the light-emitting surface of the silicon substrate with the inorganic glass substrate anode;
etching a plurality of pixel grooves on the light incident surface of the silicon substrate;
and quantum dot color conversion materials are filled in each pixel groove.
CN202211121894.0A 2022-09-15 2022-09-15 Quantum dot inorganic packaging color conversion sheet and manufacturing method thereof Pending CN115513359A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211121894.0A CN115513359A (en) 2022-09-15 2022-09-15 Quantum dot inorganic packaging color conversion sheet and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211121894.0A CN115513359A (en) 2022-09-15 2022-09-15 Quantum dot inorganic packaging color conversion sheet and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN115513359A true CN115513359A (en) 2022-12-23

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Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN115513359A (en)

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