CN115512646A - Driving backboard, light-emitting device and electronic equipment - Google Patents
Driving backboard, light-emitting device and electronic equipment Download PDFInfo
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- CN115512646A CN115512646A CN202211117044.3A CN202211117044A CN115512646A CN 115512646 A CN115512646 A CN 115512646A CN 202211117044 A CN202211117044 A CN 202211117044A CN 115512646 A CN115512646 A CN 115512646A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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Abstract
The invention discloses a driving backboard, a light-emitting device and electronic equipment. The driving backboard comprises a substrate and a driving circuit structure. The driving circuit structure is arranged on one side of the substrate and comprises an insulating layer, a circuit body and a plurality of circuit electrodes, wherein the circuit body is arranged in the insulating layer, the circuit body forms a driving circuit for driving the back plate to comprise, the insulating layer is provided with a first surface, the insulating layer is arranged at intervals of the circuit electrodes in an array manner, the first ends of the circuit electrodes are electrically connected to the corresponding circuit body, the second ends of the circuit electrodes extend to be positioned on the first surface, the second ends are used for being connected to the micro light-emitting diode in a bonding manner, the first surface is also provided with a reserved groove, and the reserved groove is positioned between the two adjacent circuit electrodes. Thereby the insulating layer increases the overflow path of eutectic metal to reduce the risk that the eutectic metal on two adjacent circuit electrodes overflows to contact, thereby promote light emitting device's yields.
Description
Technical Field
The invention relates to the technical field of display, in particular to a driving back plate, a light-emitting device and electronic equipment.
Background
When the micro light emitting diode is bonded and connected to the driving back plate in a thermocompression bonding manner, eutectic metal is often used as a connection medium, and the eutectic metal is melted in the thermocompression process to be bonded and connected to the circuit electrode of the micro light emitting diode and the circuit electrode of the driving back plate respectively, so that the circuit electrode of the micro light emitting diode is bonded and connected to the circuit electrode of the driving back plate.
However, as the manufacturing technology develops, the size of the micro light emitting diode which can be manufactured is smaller, which leads to a closer distance between two electrodes of the micro light emitting diode, and thus, a closer distance between adjacent circuit electrodes on the driving back plate, which leads to a problem that eutectic metals respectively disposed on two adjacent circuit electrodes easily overflow to be in contact during the hot pressing process, thereby easily causing a short circuit.
Disclosure of Invention
The embodiment of the invention discloses a driving back plate, a light-emitting device and electronic equipment.
In order to achieve the above object, in a first aspect, the present invention discloses a driving backplane for carrying micro light emitting diodes, the driving backplane comprising:
a substrate; and
the driving circuit structure is arranged on one side of the substrate and comprises an insulating layer, a circuit body and a plurality of circuit electrodes, wherein the circuit body and the circuit electrodes are arranged in the insulating layer, the insulating layer is provided with a first surface, the circuit electrodes are arranged on the insulating layer in a spaced array mode, the first ends of the circuit electrodes are electrically connected to the corresponding circuit body, the second ends of the circuit electrodes extend to be located on the first surface, the second ends are used for being connected to the micro light-emitting diodes in a bonding mode, a reserved groove is further formed in the first surface, and the reserved groove is located between every two adjacent circuit electrodes.
As an optional implementation manner, in an embodiment of the first aspect of the present invention, the plurality of circuit electrodes include a plurality of first electrodes and a plurality of second electrodes, the plurality of first electrodes are respectively disposed opposite to the plurality of second electrodes at intervals, and the preformed groove is correspondingly disposed at an interval between at least one pair of the first electrodes and the second electrodes.
As an optional implementation manner, in an embodiment of the first aspect of the present invention, at least one retaining wall is convexly disposed on a bottom of the preformed groove, the retaining wall divides the preformed groove into a plurality of sub-grooves, and the plurality of sub-grooves are arranged at intervals along a direction from the corresponding first electrode to the corresponding second electrode.
As an alternative, in the first aspect of the present invention, the retaining wall has a top surface far from the bottom of the groove, and the top surface protrudes from the first surface.
As an optional implementation manner, in an embodiment of the first aspect of the present invention, a height difference h is provided between the top surface and the first surface along a direction from the insulating layer to the substrate, where h is greater than or equal to 0.5um and less than or equal to 5um.
As an optional implementation manner, in an embodiment of the first aspect of the present invention, a plurality of the reserved slots are correspondingly disposed at a gap between at least one pair of the first electrode and the second electrode, and the reserved slots are arranged at intervals along a direction from the corresponding first electrode to the corresponding second electrode.
As an optional implementation manner, in an embodiment of the first aspect of the present invention, a eutectic metal layer is disposed on each of the circuit electrodes, and the eutectic metal layer is used for being respectively bonded to the circuit electrodes and the micro light emitting diodes.
In a second aspect, the present invention discloses a light emitting device, which includes a plurality of micro light emitting diodes and the driving backplane according to the first aspect, wherein the micro light emitting diodes are arranged in an array, and the micro light emitting diodes are connected to the second end of the circuit electrode by eutectic metal bonding.
As an optional implementation manner, in an embodiment of the second aspect of the present invention, a portion of the eutectic metal overflows from the corresponding circuit electrode to be located in the reserve tank.
In a third aspect, the invention discloses an electronic device comprising the light-emitting device according to the second aspect.
Compared with the prior art, the invention has the beneficial effects that:
according to the driving back plate, the light-emitting device and the electronic device provided by the embodiment of the invention, the reserved grooves are formed in the first surface of the insulating layer corresponding to the peripheries of the circuit electrodes, so that the eutectic metal overflowing from the corresponding circuit electrodes can be accommodated through the reserved grooves, the overflow path of the eutectic metal is increased, and the risk that the eutectic metals on two adjacent circuit electrodes overflow to be in contact is reduced.
In addition, the reserved groove is located outside the circuit structure, so that the phenomenon that eutectic metal overflowing into the reserved groove contacts the circuit structure to affect the circuit function of the circuit structure can be avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic top view of a driving backplate according to a first aspect of an embodiment of the present application;
FIG. 2 isbase:Sub>A schematic cross-sectional view taken along A-A of FIG. 1;
FIG. 3 is a schematic cross-sectional view of another driving back plate disclosed in the first aspect of the embodiment of the present application;
FIG. 4 is a schematic cross-sectional view of still another driving back plate disclosed in the first aspect of the embodiment of the present application;
fig. 5 is a schematic top view of a light-emitting device disclosed in a second aspect of an embodiment of the present application;
FIG. 6 is a schematic cross-sectional view taken along line B-B of FIG. 5;
fig. 7 is a schematic perspective view of an electronic device disclosed in the third aspect of the embodiment of the present application.
Description of the main reference numerals
Driving the back plate 1; a substrate 10; a drive circuit structure 11; an insulating layer 110; the first surface 110a; a circuit body 111; a circuit electrode 112; a first end 1121; a second end 1122; a first electrode 112a; a second electrode 112b; a preformed groove 12; a tank bottom 120; a sub-groove 121; a retaining wall 13; a top surface 130; a eutectic metal layer 14; a eutectic metal block 140; a light-emitting device 2; a micro light emitting diode 20; a eutectic metal 21; an electronic device 3.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used in other meanings besides orientation or positional relationship, for example, the term "upper" may also be used in some cases to indicate a certain attaching or connecting relationship. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
Moreover, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific type and configuration may or may not be the same), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
The technical solution of the present invention will be further described with reference to the following embodiments and the accompanying drawings.
Referring to fig. 1 and fig. 2 together, fig. 1 isbase:Sub>A schematic top view ofbase:Sub>A driving backplate according tobase:Sub>A first aspect of the present disclosure, and fig. 2 isbase:Sub>A schematic cross-sectional view taken alongbase:Sub>A directionbase:Sub>A-base:Sub>A in fig. 1. The first aspect of the embodiment of the present invention discloses a driving back plate 1, configured to carry a micro light emitting diode, and configured to drive the micro light emitting diode to emit light, so as to form a light emitting device, which is used as a light source and applied to electronic devices capable of implementing a light emitting display function or a light emitting function, such as a display screen, a projector, VR (Virtual Reality) glasses, AR (Augmented Reality) glasses, and a lamp.
Specifically, the driving backplate 1 includes a substrate 10 and a driving circuit structure 11. The driving circuit structure 11 is disposed on one side of the substrate 10, the driving circuit structure 11 includes an insulating layer 110, a circuit body 111 disposed in the insulating layer 110, and a plurality of circuit electrodes 112, the circuit body 111 is formed to drive a driving circuit included in the backplane 1, the insulating layer 110 has a first surface 110a, the plurality of circuit electrodes 112 are disposed on the insulating layer 110 in a spaced array, first ends 1121 of the circuit electrodes 112 are electrically connected to the corresponding circuit body 111, second ends 1122 of the circuit electrodes 112 extend to be located on the first surface 110a, the second ends 1122 are used for being bonded to the micro light emitting diodes, the first surface 110a is further provided with a reserved slot 12, and the reserved slot 12 is located between two adjacent circuit electrodes 112, where, for convenience of viewing, only two circuit electrodes 112 included in the driving circuit structure 11 are shown in fig. 1 and fig. 2, a specific number of the circuit electrodes 112 included in the driving circuit structure 11 can be selected according to actual needs, and a specific number of the circuit electrodes 112 included in the driving circuit structure 11 is not limited in the drawings of this application.
By providing the reserve groove 12 on the first surface 110a of the insulating layer 110 corresponding to the outer periphery of the circuit electrode 112, the eutectic metal overflowing from the corresponding circuit electrode 112 can be accommodated by the reserve groove 12 to increase the overflow path of the eutectic metal, thereby reducing the risk that the eutectic metal on the adjacent two circuit electrodes 112 overflows to contact.
Alternatively, the reserve tank 12 may be spaced apart from the circuit body 111, in other words, the reserve tank 12 may be located outside the circuit body 111, so that the eutectic metal overflowing into the reserve tank 12 can be prevented from contacting the circuit body 111 and affecting the circuit function of the circuit body 111.
Alternatively, the insulating layer 110 may include, but is not limited to, siOx (x silicon oxide), siNy (y silicon nitride), alOx (x aluminum oxide), siOxNy (y nitrogen x silicon oxide), and the like, wherein x represents the number of oxygen atoms in a molecule of the material, and y represents the number of nitrogen atoms in a molecule of the material, so that the insulating layer 110 can have an insulating property and be applied to a yellow light process or a semiconductor process, thereby facilitating the arrangement of the circuit body 111 and the circuit electrode 112 in the insulating layer 110.
Alternatively, the circuit electrode 112 may include, but is not limited to, ITO (Indium Tin Oxide), IZO (Indium zinc Oxide), cu (copper), ti (titanium), al (aluminum), mo (molybdenum), moTi (titanium molybdenum), etc., or an alloy including ITO (Indium Tin Oxide ), IZO (Indium zinc Oxide), cu (copper), ti (titanium), al (aluminum), mo (molybdenum), moTi (titanium molybdenum), etc.
In the related art, in order to enable the inside of the micro light emitting diode to form an electrical circuit, the micro light emitting diode generally includes two electrodes, and thus, one micro light emitting diode may be correspondingly connected to two circuit electrodes 112, in other words, two adjacent circuit electrodes 112 may be correspondingly connected to the same micro light emitting diode.
Specifically, the plurality of circuit electrodes 112 may include a plurality of first electrodes 112a and a plurality of second electrodes 112b, the plurality of first electrodes 112a are respectively disposed opposite to the plurality of second electrodes 112b at intervals, and a pair of the first electrodes 112a and the second electrodes 112b may be respectively and correspondingly connected to the same micro light emitting diode.
Because the micro light emitting diode has a small size, a distance between the pair of first electrodes 112a and the second electrode 112b corresponding to the same micro light emitting diode is also small, so that eutectic metals respectively arranged on the pair of first electrodes 112a and the second electrode 112b are easier to overflow to be in contact in a hot pressing process, and a short circuit problem is easy to occur. Based on this, optionally, at least one pair of the first electrode 112a and the second electrode 112b is provided with the reserve groove 12, so as to effectively reduce the risk of short circuit between the corresponding first electrode 112a and the second electrode 112 b.
In order to further shorten the distance between two adjacent micro light emitting diodes, so as to improve the arrangement density of the micro light emitting diodes on the driving back plate 1, and simultaneously, the distance between two adjacent circuit electrodes 112 does not need to be further reduced, so as to reduce the risk that eutectic metals respectively arranged on the two adjacent circuit electrodes 112 overflow to be in contact in the hot pressing process to generate short circuit, optionally, the same pair of first electrodes 112a and the second electrodes 112b can be used for correspondingly connecting a plurality of micro light emitting diodes.
As shown in fig. 5, specifically, the first electrode 112a and the second electrode 112b are both long strips, the first electrode 112a and the second electrode 112b are disposed substantially in parallel, the micro light emitting diodes 20 are arranged at intervals along the length direction S of the first electrode 112a and the second electrode 112b, one electrode (not shown) of the micro light emitting diodes 20 is electrically connected to the first electrode 112a, and the other electrode (not shown) of the micro light emitting diodes 20 is electrically connected to the second electrode 112b, so that along the length direction S of the first electrode 112a and the second electrode 112b, the interval distance between the micro light emitting diodes 20 may be relatively short, and the interval between the circuit electrodes 112 along the length direction S of the first electrode 112a and the second electrode 112b does not need to be further reduced, as shown in fig. 1, and the arrow in fig. 1 shows the length direction S.
It is understood that the deeper the pregroove 12 is in the direction from the first surface 110a toward the substrate 10, the more the pregroove 12 can increase the overflow path of the eutectic metal. Based on this, optionally, the reserve tank 12 may penetrate the insulating layer 110 in a direction from the first surface 110a toward the substrate 10, so that the reserve tank 12 can further increase the overflow path of the eutectic metal.
In order to further increase the overflow path of the eutectic metal between two adjacent circuit electrodes 112 (e.g. a pair of first electrodes 112a and a pair of second electrodes 112 b), as shown in fig. 3, in an alternative embodiment, at least one retaining wall 13 may be protruded from the bottom 120 of the pre-groove 12, the retaining wall 13 divides the pre-groove 12 into a plurality of sub-grooves 121, and the sub-grooves 121 are spaced in a direction from the corresponding first electrode 112a to the corresponding second electrode 112b, so as to further increase the overflow path of the eutectic metal, and further reduce the risk of short circuit between the adjacent circuit electrodes 112 through the overflow eutectic metal.
Alternatively, the retaining wall 13 may be formed by disposing and curing an organic material such as PSPI (photosensitive polyimide), PFA (polytetrafluoroethylene) and the like on the groove bottom 120, so that the retaining wall 13 has an insulating property, and can prevent short circuit between adjacent circuit electrodes 112 due to the eutectic metal being electrically connected through the retaining wall 13, and the process for preparing and disposing the retaining wall 13 is mature, and the process difficulty is low.
Alternatively, the retaining wall 13 may have a top surface 130 remote from the trough bottom 120, protruding from the first surface 110a, so that the retaining wall 13 can achieve a greater effect of increasing the overflow path of the eutectic metal.
In the direction from the insulating layer 110 to the substrate 10, a height difference h is formed between the top surface 130 and the first surface 110a, and the height difference h may be larger in order to increase the overflow path of the eutectic metal more, but the height difference h should not be too large in order to avoid the top surface 130 of the retaining wall 13 colliding with the micro light emitting diode when the micro light emitting diode is disposed on the first electrode 112a and the second electrode 112 b. Based on this, alternatively, the height difference h may satisfy: 0.5um ≦ h ≦ 5um, for example, the height difference h may be 0.5um, 1um, 1.5um, 2um, 2.5um, 3um, 3.5um, 4um, 4.5um, or 5um, and so forth.
It is understood that in other embodiments, the top surface 130 may also be lower or flush with the first surface 110a.
As shown in fig. 4, in another alternative embodiment, a plurality of trenches 12 may be correspondingly disposed at the intervals between at least one pair of the first electrodes 112a and the second electrodes 112b, the plurality of trenches 12 are arranged at intervals along the direction from the corresponding first electrode 112a to the corresponding second electrode 112b, so that the insulating layer 110 between two adjacent trenches 12 is formed as a retaining wall 13 by disposing the plurality of trenches 12 at intervals, so as to further increase the overflow path of the eutectic metal, and at the same time, the step of disposing the retaining wall 13 is not required, so as to simplify the manufacturing process of the driving backplate 1, thereby reducing the manufacturing cost of the driving backplate 1.
Referring to fig. 1 and fig. 2 again, in order to simplify the subsequent transfer process of the micro light emitting diode, in some embodiments, the eutectic metal layer 14 may be disposed on each of the circuit electrodes 112, the eutectic metal layer 14 may include but is not limited to a low melting point alloy of Sn (tin), bi (bismuth), in (indium), sb (antimony), ga (gallium), and the eutectic metal layer 14 is used to be respectively bonded to the circuit electrodes 112 and the micro light emitting diode.
As described above, the same pair of first electrodes 112a and second electrodes 112b are used to connect a plurality of micro light emitting diodes, and the micro light emitting diodes are arranged at intervals along the length direction S of the first electrodes 112a and the second electrodes 112b, in this case, optionally, the eutectic metal layer 14 on each circuit electrode 112 may include a plurality of eutectic metal blocks 140, and the eutectic metal blocks 140 are arranged at intervals along the length direction S of each circuit electrode 112.
It is understood that, in other embodiments, the eutectic metal layer 14 may not be disposed on each circuit electrode 112, so that the eutectic metal may be disposed on each circuit electrode 112 or each electrode of the micro light emitting diode according to actual requirements, for example, according to the size of the micro light emitting diode to be transferred, the disposition density of the micro light emitting diode, and the like, before the subsequent step of transferring the micro light emitting diode to the driving back plate 1.
In the driving backplate 1 disclosed in the first aspect of the embodiment of the present invention, the pre-grooves 12 are disposed on the first surface 110a of the insulating layer 110 corresponding to the peripheries of the circuit electrodes 112, so that the eutectic metal overflowing from the corresponding circuit electrodes 112 can be accommodated by the pre-grooves 12, and the overflow path of the eutectic metal is increased, thereby reducing the risk that the eutectic metal on two adjacent circuit electrodes 112 overflows to contact each other.
In addition, by locating the reserve tank 12 outside the circuit body 111, it is possible to prevent the eutectic metal overflowing into the reserve tank 12 from contacting the circuit body 111 and affecting the circuit function of the circuit body 111.
More specifically, by providing at least one retaining wall 13 in each reserve tank 12, or by providing a plurality of reserve tanks 12 at intervals between two adjacent circuit electrodes 112, the overflow path of the eutectic metal is further increased, thereby further reducing the risk that the eutectic metal on two adjacent circuit electrodes 112 overflows to contact.
Referring to fig. 5 and fig. 6 together, fig. 5 is a schematic top view of a light emitting device according to a second aspect of the present disclosure, and fig. 6 is a schematic cross-sectional view taken along a direction B-B in fig. 5. In a second aspect of the embodiments of the present invention, a Light Emitting device 2 is disclosed, where the Light Emitting device 2 may include, but is not limited to, a Light Emitting panel, an LED (Light-Emitting Diode) Display screen, an LCOS (Liquid Crystal on silicon) Display screen, an LCD (Liquid Crystal Display) Display screen, and the like, and the Light Emitting device 2 may be applied to an electronic device, and the electronic device may include, but is not limited to, a mobile phone, a tablet, a teaching machine, a game machine, an electronic watch, a portable computer, a vehicle-mounted Display screen, a projector, a VR (Virtual Reality) glasses, AR (Augmented Reality) glasses, a lamp, and other devices having a Light Emitting Display function or a Light Emitting function, and when the Light Emitting device 2 is applied to the electronic device, the Light Emitting device 2 may be used as at least one screen or a Light Emitting source included in the electronic device.
Specifically, the light emitting device 2 includes a plurality of micro light emitting diodes 20 and the driving back plate 1 as described in the first aspect, the plurality of micro light emitting diodes 20 are arranged in an array, and the micro light emitting diodes 20 are bonded to the second end 1122 of the circuit electrode 112 through the eutectic metal 21. Because this drive backplate 1 can reduce miniature emitting diode 20 thermal compression bonding in drive backplate 1 back, the eutectic metal 21 overflow to the risk of looks short circuit that two electrodes (not reference numeral in the figure) bonding connection respectively of miniature emitting diode 20 to can promote light-emitting device 2's yields, with the manufacturing cost who reduces light-emitting device 2.
Optionally, a part of the eutectic metal 21 may overflow from the corresponding circuit electrode 112 to be located in the pre-groove 12, so that the pre-groove 12 can effectively increase the distance that the part of the eutectic metal 21 overflows to the adjacent circuit electrode 112, so as to effectively reduce the risk of short circuit between two electrodes of the micro light emitting diode 20 through the overflowing eutectic metal 21, thereby effectively improving the yield of the light emitting device 2.
It is understood that the eutectic metal 21 may be formed by thermocompression bonding from the eutectic metal layer 14 (see fig. 1 and fig. 2) as described above, or may be disposed on each circuit electrode 112 or each electrode of the micro light emitting diodes 20 before the step of transferring the micro light emitting diodes 20 to the driving backplane 1 according to actual requirements, for example, according to the size of the micro light emitting diodes 20 to be transferred, the disposing density of the micro light emitting diodes 20, and the like.
Referring to fig. 7, fig. 7 is a schematic perspective view of an electronic device disclosed in the third aspect of the embodiment of the present application. In a third aspect of the embodiments of the present invention, an electronic device 3 is disclosed, where the electronic device 3 may include, but is not limited to, devices with a light-emitting display function or a light-emitting function, such as VR (Virtual Reality) glasses, AR (Augmented Reality) glasses, a projector, a mobile phone, a tablet, a teaching machine, a game machine, an electronic watch, a laptop computer, and a light-fixture vehicle-mounted light-emitting device 2.
Specifically, the electronic device 3 may include the light-emitting device 2 according to the second aspect, the light-emitting device 2 may be used as at least one screen or light-emitting source included in the electronic device 3, and the light-emitting device 2 has high yield and low manufacturing cost, so that the electronic device 3 has high yield and low manufacturing cost, wherein a three-dimensional structure of the electronic device 3 is exemplarily shown in fig. 7 by taking the electronic device 3 as a mobile phone and the light-emitting device 2 as a display screen included in the electronic device 3 as an example.
The driving backplane, the light-emitting device and the electronic device disclosed in the embodiments of the present invention are described in detail above, and specific examples are applied herein to explain the principles and embodiments of the present invention, and the description of the embodiments above is only used to help understanding the driving backplane, the light-emitting device and the electronic device and their core ideas of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A driving backplane for carrying micro light emitting diodes, the driving backplane comprising:
a substrate; and
the driving circuit structure is arranged on one side of the substrate and comprises an insulating layer, a circuit body and a plurality of circuit electrodes, wherein the circuit body is arranged in the insulating layer, the insulating layer is provided with a first surface, the circuit electrodes are arranged on the insulating layer in a spaced array mode, the first ends of the circuit electrodes are electrically connected to the corresponding circuit body, the second ends of the circuit electrodes extend to be located on the first surface, the second ends are used for being connected to the micro light-emitting diodes in a bonding mode, a reserved groove is further formed in the first surface, and the reserved groove is located between every two adjacent circuit electrodes.
2. The driving backplate of claim 1, wherein the plurality of circuit electrodes comprises a plurality of first electrodes and a plurality of second electrodes, the plurality of first electrodes are respectively disposed opposite to the plurality of second electrodes at intervals, and the preformed groove is correspondingly disposed at the interval between at least one pair of first electrodes and the second electrodes.
3. The back driving plate as claimed in claim 2, wherein at least one retaining wall is protruded from a bottom of the pre-groove, the retaining wall separates the pre-groove into a plurality of sub-grooves, and the sub-grooves are spaced from the corresponding first electrodes to the corresponding second electrodes.
4. The back drive plate of claim 3, wherein the retaining wall has a top surface remote from the bottom surface, the top surface protruding from the first surface.
5. The driving back plate of claim 4, wherein a height difference h is between the top surface and the first surface in a direction from the insulating layer to the substrate, wherein h is greater than or equal to 0.5um and less than or equal to 5um.
6. The driving backplate of claim 2, wherein a plurality of the slots are correspondingly formed at the interval between at least one pair of the first electrodes and the second electrodes, and the slots are arranged at intervals along the direction from the corresponding first electrode to the corresponding second electrode.
7. The driving backplate of claim 1, wherein a eutectic metal layer is disposed on each of the circuit electrodes, and the eutectic metal layers are used for bonding connection with the circuit electrodes and the micro light emitting diodes, respectively.
8. A light emitting device comprising a plurality of micro light emitting diodes and the driving backplane of any of claims 1-6, wherein the plurality of micro light emitting diodes are arranged in an array, and the micro light emitting diodes are connected to the second ends of the circuit electrodes by eutectic metal bonding.
9. The light-emitting device according to claim 8, wherein a portion of the eutectic metal overflows from the corresponding circuit electrode to be located in the pre-groove.
10. An electronic device characterized by comprising the light-emitting device according to claim 8 or 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211117044.3A CN115512646A (en) | 2022-09-14 | 2022-09-14 | Driving backboard, light-emitting device and electronic equipment |
| PCT/CN2022/140927 WO2024055465A1 (en) | 2022-09-14 | 2022-12-22 | Driving backplate, light-emitting apparatus, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211117044.3A CN115512646A (en) | 2022-09-14 | 2022-09-14 | Driving backboard, light-emitting device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115512646A true CN115512646A (en) | 2022-12-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211117044.3A Pending CN115512646A (en) | 2022-09-14 | 2022-09-14 | Driving backboard, light-emitting device and electronic equipment |
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| Country | Link |
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| CN (1) | CN115512646A (en) |
| WO (1) | WO2024055465A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110416246B (en) * | 2019-07-31 | 2021-05-04 | 成都辰显光电有限公司 | Light emitting diode chip array and display panel |
| CN110998881A (en) * | 2019-11-21 | 2020-04-10 | 重庆康佳光电技术研究院有限公司 | Micro-LED circuit board |
| CN111599834B (en) * | 2020-05-29 | 2022-07-12 | 京东方科技集团股份有限公司 | Display substrate and preparation method thereof |
| CN212136469U (en) * | 2020-06-30 | 2020-12-11 | 重庆康佳光电技术研究院有限公司 | Light emitting diode chip, display panel and electronic equipment |
| CN212725367U (en) * | 2020-09-24 | 2021-03-16 | 重庆康佳光电技术研究院有限公司 | Display backboard |
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2022
- 2022-09-14 CN CN202211117044.3A patent/CN115512646A/en active Pending
- 2022-12-22 WO PCT/CN2022/140927 patent/WO2024055465A1/en unknown
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| WO2024055465A1 (en) | 2024-03-21 |
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