CN115502500A - Aluminum product with multilayer structure and manufacturing method thereof - Google Patents
Aluminum product with multilayer structure and manufacturing method thereof Download PDFInfo
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- CN115502500A CN115502500A CN202211108727.2A CN202211108727A CN115502500A CN 115502500 A CN115502500 A CN 115502500A CN 202211108727 A CN202211108727 A CN 202211108727A CN 115502500 A CN115502500 A CN 115502500A
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 58
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 153
- 239000002184 metal Substances 0.000 claims abstract description 153
- 239000000463 material Substances 0.000 claims abstract description 118
- 238000003466 welding Methods 0.000 claims abstract description 116
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 107
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 107
- 239000010703 silicon Substances 0.000 claims abstract description 107
- 239000000126 substance Substances 0.000 claims abstract description 50
- 238000005219 brazing Methods 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 40
- 239000010953 base metal Substances 0.000 claims abstract description 34
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 84
- 239000002356 single layer Substances 0.000 claims description 54
- 238000012545 processing Methods 0.000 claims description 15
- 238000004544 sputter deposition Methods 0.000 claims description 9
- 238000001704 evaporation Methods 0.000 claims description 7
- 230000008020 evaporation Effects 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 43
- 230000008569 process Effects 0.000 abstract description 17
- 230000004907 flux Effects 0.000 abstract description 15
- 230000007547 defect Effects 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- 239000000945 filler Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The application relates to a manufacturing method of an aluminum product with a multilayer structure, which comprises the following steps: providing a plurality of metal base metals made of aluminum or aluminum alloy; stacking a plurality of metal base materials according to a preset sequence, wherein the surfaces to be welded of the adjacent metal base materials are relatively attached, and at least one surface of each of the two opposite surfaces to be welded is covered with a simple substance of silicon in advance; and performing vacuum brazing on the plurality of metal base materials which are stacked. The aluminum product with the multilayer structure is manufactured by the method, the covered silicon simple substance layer can replace the traditional soldering lug or soldering paste as the soldering flux for vacuum brazing, the thickness of the product can be thinner, the flatness of a welding surface can be better ensured, the welding defects can be reduced, the yield of finished products can be improved, a soldering flux groove does not need to be reserved, special customized soldering flux is not needed, the soldering flux does not need to be positioned before welding, and the process is simpler.
Description
Technical Field
The application relates to the technical field of metal welding, in particular to an aluminum product with a multilayer structure and a manufacturing method thereof.
Background
The vacuum aluminum brazing technology is a brazing method which takes aluminum or aluminum alloy as a metal base material and enables the metal base material to be connected through brazing filler metal by utilizing capillary action under certain temperature and vacuum conditions. The vacuum aluminum brazing process is completed under the conditions of vacuum and uniform heating, the adverse effect of air on metal base materials can be effectively avoided, welded parts have the advantages of compact and non-corrosive welding seams, high welding seam strength, small size deformation, no need of cleaning after welding and the like, a plurality of welding seams and a plurality of parts can be welded simultaneously by the technology, the yield is high, the technology is green and environment-friendly, and welded products obtained by welding by adopting the vacuum aluminum brazing technology are widely applied to the fields of microwave assemblies, waveguides, cases, radiators, radars and the like which have higher requirements on the complex precision of the parts.
The existing vacuum aluminum brazing technology generally needs to select brazing filler metal for auxiliary welding, because the temperature of an aluminum simple substance or aluminum alloy during vacuum brazing is higher than the liquidus temperature of the brazing filler metal but lower than the solidus temperature of a metal base metal, the brazing filler metal is melted into liquid during welding and the metal base metal still keeps solid, the liquid brazing filler metal is wetted, capillary flowing, filled and spread in the gaps or the surfaces of the metal base metal, and the brazing filler metal is solidified to form a firm welding layer after cooling, so that multiple layers of metal base metals are firmly welded together.
Further, the process flow of the conventional vacuum aluminum brazing technique is generally as follows: machining a metal base material made of aluminum or aluminum alloy, machining a cavity or a groove, and reserving a solder groove on the surface of the metal base material; performing surface deoxidation treatment on the machined metal base material; and placing a soldering lug or soldering paste in the reserved soldering flux groove for vacuum brazing to form a welded product.
Soldering lugs and soldering paste are common solders in the vacuum aluminum brazing technology, the operation of brazing by adopting the soldering paste is relatively simple, but when the soldering paste is coated on a metal base material, the consistency of the coating thickness and the shape is difficult to ensure, the welding defect is easily caused due to the uneven welding surface, and the yield of a final finished product is low; the soldering lug is adopted for soldering operation, the soldering lug needs to be specially customized according to the processing structure of each layer of the metal base material in advance, the customization cost is high, the soldering lug required by soldering is extremely thin and is generally required to be 0.01-0.1 mm, the soldering lug with the special structure is manufactured with high processing difficulty, materials are easy to deform in the process of thinning, in addition, the soldering lug needs to be preset on the surface to be soldered by using special positioning equipment during soldering, and the process is complex.
Disclosure of Invention
Accordingly, there is a need for a multi-layer aluminum product and a method for manufacturing the same, which can improve the flatness of the welding surface, reduce the welding defects, and improve the yield of the product.
An embodiment of the present application provides a method for manufacturing an aluminum product with a multilayer structure, including the following steps:
providing a plurality of metal base metals made of aluminum or aluminum alloy;
stacking a plurality of metal base materials according to a preset sequence, wherein the surfaces to be welded of the adjacent metal base materials are relatively attached, and at least one surface of each of the two opposite surfaces to be welded is covered with a silicon single layer in advance;
and performing vacuum brazing on the plurality of metal base materials which are stacked.
In one embodiment, the silicon single layer is coated on the surface to be welded by evaporation or sputtering.
In one embodiment, the thickness of the silicon single layer between two opposite surfaces to be welded in adjacent metal base materials satisfies at least one of the following conditions:
(1) The total thickness is 5-1000 μm;
(2) The thickness of each silicon single layer is 1-1.5 times of the flatness of the surface to be welded covered with the silicon single layer.
In one embodiment, the method further comprises the following steps:
and directly processing a functional structure on the surface of the metal base material which is not covered with the silicon single layer and/or processing a functional structure penetrating through the silicon single layer to the metal base material on the surface covered with the silicon single layer.
In one embodiment, the functional structures on two opposite surfaces to be welded in the adjacent metal base materials are symmetrical structures;
optionally, one of the two opposite surfaces to be welded is coated with a silicon single layer, and the other surface is not coated with the silicon single layer.
In one embodiment, the functional structures on two opposite surfaces to be welded in the adjacent metal base materials are mutually asymmetric structures;
optionally, the two opposite surfaces to be welded are covered with silicon single substance layers, and the thickness of each silicon single substance layer is reduced relative to the thickness of only one silicon single substance layer in the adjacent metal base materials.
In one embodiment, the functional structure comprises at least one of a channel, a groove, and a hole location.
In one embodiment, the conditions for vacuum brazing satisfy at least one of the following conditions:
(1) The temperature of vacuum brazing is 500-700 ℃;
(2) Vacuum degree of vacuum brazing is less than 10 ﹣3 Pa。
An embodiment of the application provides an aluminum product with a multilayer structure, which comprises a metal parent material layer and a welding layer, wherein the metal parent material layer is made of aluminum or aluminum alloy, and the welding layer is made of silicon simple substance;
the number of layers of the metal parent material layers is multiple, and the adjacent metal parent material layers are connected through the welding layer.
In one of the embodiments, the first and second electrodes are, the aluminum product with the multilayer structure is prepared by the method for preparing the aluminum product with the multilayer structure in any embodiment.
According to the method, the plurality of metal base materials are stacked according to the preset sequence, at least one surface of each of two opposite surfaces to be welded in the adjacent metal base materials is coated with the silicon simple substance layer, then the aluminum product with the multilayer structure is manufactured in a vacuum brazing mode, the coated silicon simple substance layer can replace a traditional soldering lug or soldering paste which is adopted as a welding flux for vacuum brazing, the thickness of the aluminum product can be thinner, the flatness of the welding surface can be better ensured, the welding defects can be reduced, the yield of finished products can be improved, a welding flux groove does not need to be reserved, special customized welding flux is not needed, the welding flux does not need to be positioned before welding, and the process is simpler.
Drawings
Fig. 1 is a schematic structural view of an aluminum product having a multilayer structure according to an embodiment.
Description of reference numerals:
100: an aluminum article having a multilayer structure; 110: a metal matrix layer; 120: and (6) welding the layers.
Detailed Description
To facilitate an understanding of the present application, the present application is described more fully below with reference to the examples and the accompanying drawings. This application may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the present application, the technical features described in the open manner include a closed technical solution including the listed features, and also include an open technical solution including the listed features.
One embodiment of the present application provides a method for manufacturing an aluminum product having a multilayer structure, including the following steps S110 to S130.
Step S110: providing a plurality of metal base materials made of aluminum or aluminum alloy.
It is understood that the number of the metal base materials may be provided according to the number of layers of the final aluminum product, and may be, for example, two, three, five, ten, twenty, or the like, without being limited thereto.
It is understood that the shape of the metal base material may be provided according to the design requirement of the final aluminum product, and may be, for example, a rectangle, a circle, a polygon, and the like, without being limited thereto.
It is understood that the thickness of the metal base material may be provided according to the design requirements of the final aluminum product, and the application is not particularly limited thereto. In a specific example, the thickness of the metal base material is 3mm to 20mm.
Step S120: a plurality of metal base materials are stacked according to a preset sequence, the surfaces to be welded of the adjacent metal base materials are relatively attached, and at least one surface of each of the two opposite surfaces to be welded is covered with a silicon single layer in advance.
Furthermore, the total thickness of the silicon single layer between two opposite surfaces to be welded in the adjacent metal base materials is 5-1000 μm. The total thickness of the silicon single layer between two opposite surfaces to be welded in the adjacent metal base materials can ensure that sufficient welding flux can effectively form a firm welding layer, the thickness is not too thick, the risk that the redundant welding flux overflows to a functional structure during welding can be reduced, and the yield of finished products can be improved. It is understood that the total thickness of the silicon single layer between two opposite surfaces to be welded in the adjacent metal base materials may be, for example, 5 μm, 8 μm, 10 μm, 15 μm, 25 μm, 30 μm, 50 μm, 80 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, 550 μm, 600 μm, 650 μm, 700 μm, 750 μm, 800 μm, 850 μm, 900 μm, 950 μm, 1000 μm, etc., but is not limited thereto. Preferably, the total thickness of the silicon single layer between two opposite surfaces to be welded in the adjacent metal base materials is 5 μm to 500 μm. More preferably, the total thickness of the silicon single layer between the two surfaces to be welded facing each other in the adjacent metal base materials is 5 μm to 200 μm. Still preferably, the total thickness of the silicon single layer between the two surfaces to be welded facing each other in the adjacent metal base materials is 5 μm to 50 μm.
Furthermore, in the silicon single layer between two opposite surfaces to be welded in the adjacent metal base materials, the thickness of each silicon single layer is 1 to 1.5 times of the flatness of the surface to be welded covered with the silicon single layer. In the range, the thickness of each silicon single layer between two opposite surfaces to be welded in adjacent metal base materials is more matched with the flatness of the surface to be welded covered with the silicon single layer, so that the welding surface formed after welding is more smooth, welding gaps can be reduced, welding defects can be reduced, and the yield of finished products can be improved. For example, in a specific example, when only one of the two opposite surfaces to be welded of the adjacent metal base materials is covered with the silicon simple substance layer, the flatness of the surface to be welded covered with the silicon simple substance layer is 0.02mm, the thickness of the silicon simple substance layer covered on the surface to be welded is preferably 20 μm to 30 μm, and it can be understood that the thickness of the silicon simple substance layer covered on the surface to be welded is the total thickness of the silicon simple substance layer between the two surfaces to be welded of the adjacent metal base materials. For example, in another specific example, in the case where the surfaces to be welded of the adjacent metal base materials are each covered with a silicon single layer, and the flatness of one of the surfaces to be welded is 0.01mm, when the surface to be welded is covered with the silicon single layer, the thickness of the silicon single layer is preferably 10 μm to 15 μm, and the flatness of the other surface to be welded is 0.02mm, when the surface to be welded is covered with the silicon single layer, the thickness of the silicon single layer is preferably 20 μm to 30 μm, and it is understood that the total thickness of the silicon single layers between the two surfaces to be welded of the adjacent metal base materials is the sum of the thicknesses of the silicon single layers respectively covered on the two surfaces to be welded.
Furthermore, the silicon single layer is coated on the surface to be welded by evaporation or sputtering. It is understood that the evaporation is a coating process in which a coating material is evaporated and gasified by heating and evaporating under vacuum, and the gasified coating material is dispersed to the surface of a substrate to be coated to condense and form a film. Sputtering is a coating process in which ions bombard the surface of a target, atoms of the target are knocked out, and the knocked out atoms deposit on the surface of a substrate to be coated to form a film, and can be, but is not limited to, radio frequency sputtering, magnetron sputtering, and the like. At least one surface between two opposite surfaces to be welded in adjacent metal base materials is plated with a silicon simple substance layer in advance in an evaporation or sputtering mode, so that the consistency of the thickness of the silicon simple substance layer can be favorably ensured, and then the welding surface formed by welding is favorably ensured to be smoother, the welding defects can be reduced, and the welding rate is improved.
In the conventional technology, whether solder paste is coated or soldering is carried out by using a soldering lug, the thickness of a soldering layer in the conventional technology is difficult to achieve as thin as 5-1000 μm, and particularly, the process difficulty is very high and is almost difficult to achieve if the thickness of the solder paste or the soldering lug is required to achieve as thin as 50 μm or less. When the tradition adopted the coating soldering paste or used the soldering lug to weld, because the thickness of soldering paste or soldering lug is too big, not only be difficult to guarantee the roughness of face of weld, lead to the welding seam too big easily, still can lead to final finished product's whole thickness grow, but to the product that precision required height, the size of any one spare part all has strict regulation, if finished product whole thickness too big probably can't satisfy the demand for design, also equally is the finished product bad. The silicon single layer coated in the embodiment of the application can have smaller thickness, and can ensure that the welding surface is smoother, thereby greatly improving the yield of finished products.
In a specific example, step S120 further includes the following steps:
and directly processing a functional structure on the surface of the metal base material which is not covered with the silicon single layer and/or processing a functional structure penetrating through the silicon single layer to the metal base material on the surface covered with the silicon single layer.
It can be understood that the functional structure can be designed according to the requirement, and can be arranged on any surface of each metal base material, and any metal base material can be preset with a specific functional structure. Further, the functional structure may, for example and without limitation, comprise at least one of a channel, a groove, and a hole site.
It can be understood that, if the surface of the metal base material of the functional structure to be processed is covered with the simple substance layer of silicon, the processing is started directly from the simple substance layer of silicon on the surface, and the processing depth penetrates through the simple substance layer of silicon to the inside of the metal base material.
Traditional adoption soldering lug is as the solder when welding, all process out functional structure earlier, then place the soldering lug, the soldering lug needs to be customized specially in order to avoid all functional structure, to complicated functional structure, the soldering lug processing degree of difficulty is big, very easily warp, influence the roughness of face of weld easily, especially when functional structure's size is also very small, for example when the chamber says that the size is less than 1mm, because the deformation uncontrollable of soldering lug processing, lead to blockking up the chamber way for avoiding soldering lug deformation, often can only let the soldering lug avoid this chamber way and place, thereby the welding rate has been reduced. In a specific example provided by the application, the silicon single substance layer directly and completely covers at least one surface between two opposite surfaces to be welded in adjacent metal base materials in advance, then the functional structure is processed, in the process of processing the functional structure, if the surface is covered with the silicon single substance layer, the silicon single substance layer material part corresponding to the functional structure can be processed and removed together, the processing depth of the functional structure penetrates through the silicon single substance layer until the inside of the corresponding metal base material, solder can be prevented from being arranged at the position with the functional structure during welding, blockage of the functional structure is avoided, areas without processing the functional structure are all covered with the silicon single substance layer material for welding, and the welding rate can be greatly improved. Further, since the functional structure is processed after at least one surface between the two facing surfaces to be soldered of the adjacent metal base materials is coated with the elemental silicon layer in advance, the risk of the solder overflowing into the functional structure at the time of soldering can be further reduced by controlling the total thickness of the coated elemental silicon layer.
It can be understood that, for two opposite surfaces to be welded in the adjacent metal base materials, the functional structures on the two opposite surfaces to be welded may be symmetrical structures or asymmetrical structures.
In a specific example, the functional structures on two opposite surfaces to be welded in the adjacent metal base materials are symmetrical structures; alternatively, one of the two opposite surfaces to be welded may be coated with a silicon single layer, and the other surface is not coated with the silicon single layer; optionally, the two opposite surfaces to be welded can be covered with a silicon single layer.
Preferably, the functional structures on two opposite surfaces to be welded in the adjacent metal base materials are symmetrical structures, one of the two opposite surfaces to be welded is covered with the silicon single layer, and the other surface of the two opposite surfaces to be welded is not covered with the silicon single layer. When the functional structures on the two opposite surfaces to be welded in the adjacent metal base materials are mutually symmetrical structures, only one surface is coated with the silicon single substance layer, then the silicon single substance layer material at the corresponding position of the functional structure is simultaneously processed and removed when the functional structures are processed on the surface, and when the two opposite surfaces to be welded are jointed, the other opposite surface to be welded is also prevented from being blocked by the silicon single substance layer material serving as a welding flux due to the symmetrical structure with the welding surface with the silicon single substance layer when the two opposite surfaces to be welded are jointed, the process of coating the silicon single substance layer on the other surface to be welded can be omitted, and the manufacturing method is simplified.
In a specific example, the functional structures on two opposite surfaces to be welded in the adjacent metal base materials are mutually asymmetric structures, the two opposite surfaces to be welded are both covered with silicon simple substance layers, and the thickness of each silicon simple substance layer is reduced relative to the thickness of only one silicon simple substance layer on the two opposite surfaces to be welded in the adjacent metal base materials. When the functional structures on the two opposite surfaces to be welded in the adjacent metal base materials are mutually asymmetric structures, the thickness of the silicon single substance layer coated on the two opposite surfaces to be welded is reduced as much as possible relative to the condition that only one silicon single substance layer exists in the adjacent metal base materials under the precondition that the flatness requirement of each silicon single substance layer and the surface to be welded is met, and the risk that the solder of the silicon single substance layer overflows to the functional structure on the other surface can be reduced.
Step S130: and performing vacuum brazing on the plurality of metal base materials which are stacked.
In the conventional process of performing vacuum brazing by using a soldering paste or a soldering lug as a solder, a step of removing an oxide film on the surface of a metal base material is required before vacuum brazing, and in an embodiment provided by the application, after step S120, the metal base material with a silicon single-substance layer coated on the surface to be welded can block the contact between the metal base material and air due to the existence of the silicon single-substance layer, so that the surface of the metal base material is prevented from being continuously oxidized to form a compact oxide film, therefore, the corresponding metal base material can be directly subjected to vacuum brazing, the operation of removing the surface oxide film from the metal base material before brazing is not required, and the process procedure can be saved.
In one specific example, the temperature of the vacuum brazing is 500 ℃ to 700 ℃. In this temperature range, silicon in the simple substance layer of silicon and aluminum in the metal base material in contact therewith react and interact with each other to cause the material as the solder layer to be alloyed and changed into an aluminum-silicon alloy, and melting is achieved, so that the simple substance layer of silicon solder layer can be brought into sufficient contact with both surfaces of the respective metal base materials and welding can be smoothly completed. If the temperature is too low, the solder does not melt when it does not reach the melting point, and the soldering effect cannot be achieved. It is understood that the temperature of the vacuum brazing may be, for example, 500 deg.C, 510 deg.C, 520 deg.C, 530 deg.C, 540 deg.C, 550 deg.C, 560 deg.C, 570 deg.C, 580 deg.C, 590 deg.C, 600 deg.C, 610 deg.C, 620 deg.C, 630 deg.C, 640 deg.C, 650 deg.C, 660 deg.C, 670 deg.C, 680 deg.C, 690 deg.C, 700 deg.C, etc., without being limited thereto.
In one specific example, vacuum brazing is performed with a vacuum of < 10 ﹣3 Pa。
According to the method, at least one surface of two opposite surfaces to be welded in adjacent metal base materials is covered with the silicon single substance layer, the silicon single substance layer is used as a connecting surface to enable the two surfaces to be welded to be correspondingly attached, a plurality of metal base materials are stacked according to a preset sequence, then the aluminum product with the multilayer structure is manufactured in a vacuum brazing mode, the covered silicon single substance layer can replace a traditional welding piece or welding paste which is used as a welding flux for vacuum brazing, the thickness of the covered silicon single substance layer can be thinner, the flatness of the welding surface can be guaranteed better, welding defects can be reduced, the yield of finished products can be improved, special customization of the welding flux is not needed, the welding flux does not need to be positioned before welding, and the process is simpler.
As shown in fig. 1, an embodiment of the present application further provides an aluminum product 100 having a multilayer structure, which includes a metal matrix layer 110 and a welding layer 120, wherein a material of the metal matrix layer 110 includes aluminum or an aluminum alloy, and a material of the welding layer 120 includes elemental silicon.
The number of layers of the metal matrix layers 110 is a plurality of layers, and the adjacent metal matrix layers 110 are connected by the welding layer 120.
Further, the aluminum product 100 having a multilayer structure is manufactured by the above-described manufacturing method of an aluminum product having a multilayer structure.
An embodiment of the present application also provides an industrial part, including the aluminum product 100 having a multi-layer structure described above. It is to be understood that the industrial component may be, for example, but not limited to, a pipe, a rack, a housing, and the like.
An embodiment of the present application also provides an industrial product, including the industrial parts described above. It is understood that the industrial product may be, for example, but not limited to, a microwave component, a waveguide, a cabinet, a radiator, a radar, and the like.
The following are specific examples.
Example 1
A method for manufacturing an aluminum product with a multilayer structure comprises the following steps:
step 1: two metal base metals made of aluminum alloy are provided and are sequentially called as a first metal base metal and a second metal base metal, and two opposite surfaces to be welded of the first metal base metal and the second metal base metal are a first welding surface and a second welding surface respectively.
Step 2: a silicon single layer with the thickness of 20 μm is plated on the first welding surface by an evaporation process, and the flatness of the first welding surface is 0.02mm.
And step 3: the functional structures processed on the surfaces of the two metal base materials are symmetrical structures.
And 4, step 4: the first welding surface and the second welding surface are oppositely attached, the two metal base materials are stacked, and the silicon simple substance layer is arranged between the first welding surface and the second welding surface.
And 5: vacuum brazing two metal base metals in a laminated manner at 700 ℃ and a vacuum degree of less than 10 ﹣3 Pa。
Example 2
A method for manufacturing an aluminum product with a multilayer structure comprises the following steps:
step 1: two metal base metals made of aluminum alloy are provided and are sequentially called as a first metal base metal and a second metal base metal, and two opposite surfaces to be welded of the first metal base metal and the second metal base metal are a first welding surface and a second welding surface respectively.
Step 2: a silicon single layer with a total thickness of 80 μm was plated on the first bonding surface by a sputtering process, and the flatness of the first bonding surface was 0.08mm.
And step 3: the functional structures processed on the surfaces of the two metal base materials are symmetrical structures.
And 4, step 4: the first welding surface and the second welding surface are oppositely attached, the two metal base materials are stacked, and the silicon simple substance layer is arranged between the first welding surface and the second welding surface.
And 5: carrying out vacuum brazing on two metal base metals which are stacked up, wherein the temperature of the vacuum brazing is 500 ℃, and the vacuum degree is less than 10 ﹣3 Pa。
Example 3
A method for manufacturing an aluminum product with a multilayer structure comprises the following steps:
step 1: providing three metal base materials made of aluminum alloy, which are sequentially called as a first metal base material, a second metal base material and a third metal base material, wherein two opposite surfaces to be welded of the first metal base material and the second metal base material are respectively a first welding surface and a second welding surface, and two opposite surfaces to be welded of the second metal base material and the third metal base material are respectively a third welding surface and a fourth welding surface.
Step 2: a silicon single layer with the total thickness of 20 mu m is plated on the first welding surface through a sputtering process, and the flatness of the first welding surface is 0.02mm. A silicon single layer with a total thickness of 30 μm was plated on the fourth bonding surface by a sputtering process, and the flatness of the fourth bonding surface was 0.02mm.
And 3, step 3: the functional structures processed on the first welding surface and the second welding surface are symmetrical structures, and the functional structures processed on the third welding surface and the fourth welding surface are symmetrical structures.
And 4, step 4: the first welding surface and the second welding surface are oppositely jointed, the third welding surface and the fourth welding surface are oppositely jointed, three metal base materials are stacked according to the sequence of the first metal base material, the second metal base material and the third metal base material, and a silicon single layer is respectively arranged between the first welding surface and the second welding surface and between the third welding surface and the fourth welding surface.
And 5: three metal base metals which are stacked are subjected to vacuum brazing, wherein the temperature of the vacuum brazing is 600 ℃, and the vacuum degree is less than 10 ﹣3 Pa。
Comparative example 1
A manufacturing method of an aluminum product with a multilayer structure comprises the following steps:
step 1: providing two metal base metals made of aluminum alloy, which are sequentially called as a first metal base metal and a second metal base metal, wherein two opposite surfaces to be welded of the first metal base metal and the second metal base metal are a first welding surface and a second welding surface respectively.
Step 2: functional structures are respectively processed on the surfaces of the two metal base materials, a solder groove is reserved, and the functional structures processed on the first welding surface and the second welding surface are mutually symmetrical structures.
And step 3: and carrying out surface deoxidation treatment on the two metal base metals.
And 4, step 4: solder paste with a total thickness of 80 μm is coated in the reserved solder pot.
And 5: and oppositely attaching the first welding surface and the second welding surface and stacking the two metal base materials.
Step 6: carrying out vacuum brazing on two metal base metals which are stacked up, wherein the temperature of the vacuum brazing is 500 ℃, and the vacuum degree is less than 10 ﹣3 Pa。
Comparative example 2
A method for manufacturing an aluminum product with a multilayer structure comprises the following steps:
step 1: providing two metal base metals made of aluminum alloy, which are sequentially called as a first metal base metal and a second metal base metal, wherein two opposite surfaces to be welded of the first metal base metal and the second metal base metal are a first welding surface and a second welding surface respectively.
Step 2: functional structures are respectively processed on the surfaces of the two metal base materials, a solder groove is reserved, and the functional structures processed on the first welding surface and the second welding surface are mutually symmetrical structures.
And step 3: and carrying out surface deoxidation treatment on the two metal base metals.
And 4, step 4: and placing and positioning a customized soldering lug with the thickness of 80 mu m in the reserved solder groove.
And 5: and oppositely attaching the first welding surface and the second welding surface and stacking the two metal base materials.
And 6: carrying out vacuum brazing on two metal base metals which are stacked up, wherein the temperature of the vacuum brazing is 500 ℃, and the vacuum degree is less than 10 ﹣3 Pa。
The aluminum products having a multi-layer structure manufactured in examples 1 to 3 and comparative examples 1 to 2 were subjected to the weld ratio, deformation ratio and tensile strength property tests, and the test results are shown in table 1 below.
The method for testing the welding rate comprises the following steps: a weld joint metallographic specimen was prepared using the aluminum products having a multilayer structure prepared in examples 1 to 3 and comparative examples 1 to 2, and the microstructure was observed under a metallographic microscope. And measuring the total length of the welding line and the length of the part which is not welded by using metallographic analysis software matched with the device, and calculating the welding rate according to the following formula:
w＝(L 0 -L 1 )/L0×100％
wherein w is the weld rate, L 0 Total length of weld joint, L 1 Is the length of the unwelded portion.
The method for testing the deformation rate comprises the following steps: the welded part may change in size after welding, and the amount of deformation in the thickness direction is generally one of the indicators for measuring the welding quality. The adopted measuring tool is a vernier caliper, the metal base material to be welded is made into a sample before welding, the thickness of the sample is measured at a plurality of different positions, and the average value is taken as the initial thickness; similarly, the aluminum products having a multilayer structure obtained by welding by the methods of examples 1 to 3 and comparative examples 1 to 2 were prepared as weld joint samples, the thickness of the welded samples at a plurality of positions was measured by a vernier caliper as the post-weld thickness, and the difference between the initial and post-weld thicknesses of the samples was the deformation of the weld joint. And calculating the deformation rate of the welded part joint according to the following formula:
δ＝(δ 0 -δ 1 )/δ 0 ×100％
where δ is a thickness-direction deformation ratio, δ 0 Is the average value of the thickness before welding, delta 1 Is the average post-weld thickness.
The test method of tensile strength (welding strength) is as follows: the test was performed using a universal tester.
TABLE 1 Performance test results for aluminum articles having a multilayer structure
| Percentage of weld (%) | Percent deformation (%) | Tensile strength (MPa) | |
| Example 1 | 92 | 0.2％ | 112.4 |
| Example 2 | 94 | 0.5％ | 137.3 |
| Example 3 | 91 | 0.1％ | 107.6 |
| Comparative example 1 | 75 | 5.3％ | 92.1 |
| Comparative example 2 | 80 | 3.7％ | 87.5 |
As can be seen from table 1 above, compared with comparative examples 1 to 2, the aluminum products with multilayer structures manufactured in examples 1 to 3 have high weld ratio rigidity, lower deformation rate, higher tensile strength, i.e., welding strength, and higher yield of finished products.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention claims. It should be noted that, for those skilled in the art, without departing from the inventive concept of the present application, several changes and modifications can be made, which are within the protection scope of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A manufacturing method of an aluminum product with a multilayer structure is characterized by comprising the following steps:
providing a plurality of metal base metals made of aluminum or aluminum alloy;
stacking a plurality of metal base materials according to a preset sequence, wherein the surfaces to be welded of the adjacent metal base materials are relatively attached, and at least one surface of each of the two opposite surfaces to be welded is covered with a silicon single layer in advance;
and performing vacuum brazing on the plurality of metal base materials which are stacked.
2. The method for manufacturing an aluminum product with a multilayer structure as recited in claim 1, wherein the silicon single layer is coated on the surface to be welded by evaporation or sputtering.
3. The method of manufacturing an aluminum product having a multilayer structure according to claim 1, wherein the thickness of the silicon single layer between two surfaces to be welded opposed in adjacent metal base materials satisfies at least one of the following conditions:
(1) The total thickness is 5-1000 μm;
(2) The thickness of each silicon single layer is 1-1.5 times of the flatness of the surface to be welded covered with the silicon single layer.
4. The method for manufacturing an aluminum product having a multilayer structure according to any one of claims 1 to 3, further comprising the steps of:
and directly processing a functional structure on the surface of the metal base material which is not covered with the silicon single layer and/or processing a functional structure penetrating through the silicon single layer to the metal base material on the surface covered with the silicon single layer.
5. The method according to claim 4, wherein the functional structures on the two opposite surfaces to be welded of the adjacent metal base materials are symmetrical structures;
optionally, one of the two opposite surfaces to be welded is coated with a silicon single layer, and the other surface is not coated with the silicon single layer.
6. The method according to claim 4, wherein the functional structures on the two opposite surfaces to be welded of the adjacent metal base materials are mutually asymmetric structures;
optionally, the two opposite surfaces to be welded are covered with silicon single substance layers, and the thickness of each silicon single substance layer is reduced relative to the thickness of only one silicon single substance layer in the adjacent metal base materials.
7. The method of claim 4, wherein the functional structure comprises at least one of a channel, a groove, and a hole site.
8. The method for producing an aluminum product having a multilayer structure according to any one of claims 1 to 3 and 5 to 7, wherein the condition of vacuum brazing satisfies at least one of the following conditions:
(1) The temperature of vacuum brazing is 500-700 ℃;
(2) Vacuum degree of vacuum brazing is less than 10 ﹣3 Pa。
9. The aluminum product with the multilayer structure is characterized by comprising a metal mother material layer and a welding layer, wherein the metal mother material layer comprises aluminum or aluminum alloy, and the welding layer comprises a silicon simple substance;
the number of layers of the metal parent material layers is multiple, and the adjacent metal parent material layers are connected through the welding layer.
10. The aluminum product having a multilayer structure according to claim 9, which is produced by the method for producing an aluminum product having a multilayer structure according to any one of claims 1 to 8.
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