CN115494695A - Equipment and method for correcting position deviation of photomask pattern - Google Patents
Equipment and method for correcting position deviation of photomask pattern Download PDFInfo
- Publication number
- CN115494695A CN115494695A CN202211047725.7A CN202211047725A CN115494695A CN 115494695 A CN115494695 A CN 115494695A CN 202211047725 A CN202211047725 A CN 202211047725A CN 115494695 A CN115494695 A CN 115494695A
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- China
- Prior art keywords
- photomask
- protective film
- control
- film frame
- cover plate
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/48—Protective coatings
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/72—Repair or correction of mask defects
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
The application provides equipment and a method for correcting position deviation of a photomask graph, belongs to the technical field of photomasks, and particularly comprises an upper cover plate and a lower cover plate, wherein the upper cover plate and the lower cover plate are connected through an upper cover plate support post; the periphery of the protective film frame is provided with control rods, one ends of the control rods, far away from the protective film frame, are connected with a macro control assembly, and the macro control assembly is used for controlling the control rods to drive the protective film frame to move; the equipment also comprises a control system which is connected with each component in the equipment for control. The method and the device improve the position accuracy of the photomask pattern and the yield of the chip.
Description
Technical Field
The present disclosure relates to the field of photomask technology, and more particularly, to an apparatus and method for correcting a position deviation of a photomask pattern.
Background
The accuracy of the pattern position of the photomask is a key factor for evaluating the quality of the photomask, and if the position of the photomask pattern deviates, the registration of the upper layer and the lower layer of the chip is caused to be in a problem, which leads to electrical abnormality and even the yield is reduced. Factors affecting the accuracy of the pattern position include accuracy of a lithography machine, temperature stability during lithography, stress of a chromium film and a silicon molybdenum film, deformation of a protective film, and the like.
When a photomask is attached with a protective film (Pellicle), the protective film may be deformed due to stress generated on the photomask by the material factors of the frame and the adhesive and uneven application of force during the attachment, which is called PID (film Induced deformation), and the PID may cause deviation of the pattern position of the photomask, so that the protective film and the film attaching device are developed in a form of reducing PID at present.
Disclosure of Invention
In view of the above, embodiments of the present disclosure provide an apparatus and method for correcting a position deviation of a photomask pattern, which at least partially solve the problem of deformation of the photomask caused by a protective film in the prior art.
In a first aspect, an embodiment of the present application provides an apparatus for correcting a position deviation of a photomask pattern, including an upper cover plate and a lower cover plate, where the upper cover plate and the lower cover plate are connected by an upper cover plate pillar, a photomask is disposed on a lower side of the upper cover plate, the photomask is fixed on the lower cover plate by a photomask pillar, a protective film frame is disposed on a lower side of the photomask, a protective film is disposed in the protective film frame, the protective film frame is fixed on the lower cover plate by a protective film pillar, and the upper cover plate pillar, the photomask pillar and the protective film pillar are all configured to be a telescopic structure;
control rods are arranged on the periphery of the protective film frame, one ends, far away from the protective film frame, of the control rods are connected with a micro-distance control assembly, and the micro-distance control assembly is used for controlling the control rods to drive the protective film frame to move;
the equipment also comprises a control system which is connected with each component in the equipment for control.
According to a specific implementation manner of the embodiment of the application, the center of the control rod is provided with a vacuum structure, and the vacuum structure is used for adsorbing the protective film frame.
According to a specific implementation of the embodiment of the application, the macro control assembly includes a piezoelectric ceramic.
According to a specific implementation of the embodiment of the application, the diameter of the control rod is less than 2mm.
According to a specific implementation manner of the embodiment of the application, a plurality of control rods are uniformly arranged on each side of the protective film frame, and each control rod is controlled independently.
In a second aspect, an embodiment of the present application further provides a method for correcting a position deviation of a photomask pattern, where the apparatus for correcting a position deviation of a photomask pattern according to any embodiment of the first aspect is used, the method including:
obtaining the relation between the deformation of the protective film frame and the position change of the photomask graph;
measuring the position deviation of a photomask graph before film pasting;
calculating the deformation of the protective film frame to obtain the expansion amount of each control rod;
the control system controls the macro control assembly to drive the control rod to stretch, deformation adjustment is carried out on the protective film frame, and the position deviation of the photomask graph is corrected;
pasting a protective film of a photomask;
measuring whether the pattern position deviation after the film sticking of the photomask is within a preset value or not;
and if the position deviation of the pattern after film pasting exceeds the preset value, continuing to adjust until the preset value is reached.
According to a specific implementation of the embodiment of the application, the macro control assembly includes a piezoelectric ceramic.
Advantageous effects
According to the equipment and the method for correcting the position deviation of the photomask graph, the deformation of the frame of the protective film can be accurately controlled, the deviation of the position of the photomask graph can be corrected by PID, the graph position accuracy of the photomask can be increased, scrappage caused by the fact that the deviation of the graph position exceeds the specification is reduced, the registration of the front layer and the rear layer of a chip can be effectively improved, and the yield of the chip is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic diagram illustrating an apparatus for correcting a position deviation of a photomask pattern according to an embodiment of the present invention;
FIG. 2 is a side view of an apparatus for correcting positional deviation of a photomask pattern according to an embodiment of the present invention;
fig. 3 is a bottom view of an apparatus for correcting a positional deviation of a photomask pattern according to an embodiment of the present invention.
In the figure: 1. an upper cover plate; 2. a photomask; 3. a protective film; 4. an upper cover plate strut; 5. piezoelectric ceramics; 6. a protective film support; 7. a photomask support; 8. a control rod.
Detailed Description
The embodiments of the present application will be described in detail below with reference to the accompanying drawings.
The following description of the embodiments of the present application is provided by way of specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. The present application is capable of other and different embodiments and its several details are capable of modifications and/or changes in various respects, all without departing from the spirit of the present application. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It is noted that various aspects of the embodiments are described below within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art should appreciate that one aspect described herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. Additionally, such an apparatus may be implemented and/or such a method may be practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present application, and the drawings only show the components related to the present application rather than the number, shape and size of the components in actual implementation, and the type, amount and ratio of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details.
In a first aspect, embodiments of the present application provide an apparatus for correcting a position deviation of a photomask pattern, which is described in detail below with reference to fig. 1 to 3.
Referring to fig. 1 to 3, the apparatus for correcting a position deviation of a photomask pattern according to this embodiment includes an upper cover plate 1 and a lower cover plate, the upper cover plate 1 and the lower cover plate are connected by an upper cover plate pillar 4, a photomask 2 is disposed on a lower side of the upper cover plate 1, the photomask 2 is fixed on the lower cover plate by a photomask pillar 7, a protective film frame is disposed on a lower side of the photomask 2, a protective film 3 is disposed in the protective film frame, the protective film frame is fixed on the lower cover plate by a protective film pillar 6, and the upper cover plate pillar 4, the photomask pillar 7 and the protective film pillar 6 are all provided with a telescopic structure; a control rod 8 is arranged on the periphery of the protective film frame, one end, far away from the protective film frame, of the control rod 8 is connected with a macro control assembly, and the macro control assembly is used for controlling the control rod 8 to drive the protective film frame to move; the equipment also comprises a control system which is connected with each component in the equipment for control. In this embodiment, by providing the retractable upper cover plate support 4, the photomask support 7, and the protective film support 6, the distance between the upper cover plate 1, the photomask 2, and the protective film 3 can be adjusted to complete the adhesion of the protective film 3, and the specific amount of retraction can be controlled by the control system.
In one embodiment, the center of the control rod 8 is set to be a vacuum structure, the vacuum structure is used for adsorbing the protective film frame, and when the deformation of the protective film frame needs to be adjusted, the movement of the control rod 8 can be controlled to drive the protective film frame to move.
Furthermore, the macro control component comprises a piezoelectric ceramic 5, the piezoelectric ceramic 5 is a functional ceramic material capable of converting mechanical energy and electrical energy to each other, and the piezoelectric ceramic 5 commonly used at present comprises a barium titanate system and a lead zirconate titanate binary system, and a third ABO3 (a represents divalent metal ion, and B represents tetravalent metal ion or the sum of several ions is positive tetravalent) type compound is added into the binary system. In the present embodiment, the material of the piezoelectric ceramic 5 is not limited, and in practical application, the material can be selected according to practical situations.
Specifically, utilize piezoceramics 5's inverse piezoelectric effect, control is to piezoceramics 5's input voltage, and piezoceramics 5 can take place deformation displacement thereupon, and after the electric field was removed, deformation can disappear thereupon, consequently through control input voltage, the displacement of adjustment control rod 8 that can be accurate, and then the deformation of adjustment protection film frame.
In one embodiment, since the lowest height of the protective film frame on the market is about 2.5mm, the diameter of the control rod 8 is less than 2mm, so that the control rod 8 can be used for all kinds of protective films on the market, and therefore, the diameter of the control rod 8 is less than 2mm in the embodiment.
In order to enable the deformation adjustment of the protective film frame to be more accurate, a plurality of control rods 8 are uniformly arranged on each edge of the protective film frame, and each control rod 8 is controlled independently, namely each control rod 8 is respectively connected with piezoelectric ceramics.
In a second aspect, an embodiment of the present application further provides a method for correcting a position deviation of a photomask pattern, where the apparatus for correcting a position deviation of a photomask pattern according to any embodiment of the first aspect is used, the method including:
And 2, measuring the position deviation of the photomask pattern before film sticking, wherein the position deviation of the photomask pattern exists before film sticking, and the deviation amount before film sticking needs to be measured so as to correct the deviation amount through the deformation of the protective film frame and reduce the deviation amount.
And 3, calculating the deformation of the protective film frame according to the relational expression in the step 1 and the deviation measured in the step 2, thereby obtaining the expansion and contraction amount of each control rod 8. Because the deformation of the protective film frame may be nonlinear deformation, that is, the deformation of different positions on one side of the protective film frame may be different, the problem of different deformation of different positions of the protective film frame can be effectively solved by uniformly arranging a plurality of control rods 8 on each side and independently controlling each control rod 8.
And 4, controlling the macro control assembly to drive the control rod to stretch by the control system, carrying out deformation adjustment on the protective film frame, and correcting the position deviation of the photomask graph. In this embodiment, what the microspur control assembly adopted is piezoceramics 5, in this embodiment, utilize piezoceramics 5's inverse piezoelectric effect, through control to piezoceramics 5's input voltage, piezoceramics 5 can take place deformation displacement thereupon, and piezoceramics 5's deformation displacement drives control rod 8's displacement, and after the electric field was removed, deformation can disappear thereupon, consequently through control input voltage, can accurate adjustment control rod 8's displacement, and then the deformation of adjustment protection film frame.
And 5, pasting a protective film of the photomask, and performing a protective film pasting process after correcting the position deviation of the photomask.
And 6, measuring whether the position deviation of the pattern after the photomask is pasted with the film is within a preset value.
And 7, if the position deviation of the pattern after film pasting exceeds a preset value, continuing to adjust until the preset value is reached.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (7)
1. The equipment for correcting the position deviation of the photomask graph is characterized by comprising an upper cover plate and a lower cover plate, wherein the upper cover plate is connected with the lower cover plate through an upper cover plate support column;
control rods are arranged on the periphery of the protective film frame, one ends, far away from the protective film frame, of the control rods are connected with a macro control assembly, and the macro control assembly is used for controlling the control rods to drive the protective film frame to move;
the equipment also comprises a control system which is connected with each component in the equipment for control.
2. The apparatus of claim 1, wherein the center of the control bar is disposed in a vacuum structure for sucking the protective film frame.
3. The apparatus for correcting the positional deviation of a photomask pattern according to claim 1, wherein the macro control member comprises a piezoelectric ceramic.
4. The apparatus for correcting a positional deviation of a photomask pattern of claim 1, wherein the diameter of the control rod is less than 2mm.
5. The apparatus for correcting a pattern misalignment of a photomask according to claim 1, wherein the protective film frame is uniformly provided at each side thereof with a plurality of control rods, each of the control rods being individually controlled.
6. A method of correcting positional deviation of a photomask pattern using the apparatus for correcting positional deviation of a photomask pattern according to any one of claims 1 to 5, the method comprising:
obtaining the relation between the deformation of the protective film frame and the position change of the photomask graph;
measuring the position deviation of a photomask graph before film pasting;
calculating the deformation of the protective film frame to obtain the expansion amount of each control rod;
the control system controls the macro control assembly to drive the control rod to stretch, deformation adjustment is carried out on the protective film frame, and the position deviation of the photomask graph is corrected;
pasting a protective film of a photomask;
measuring whether the position deviation of the pattern after the film is attached to the photomask is within a preset value;
and if the position deviation of the pattern after film pasting exceeds the preset value, continuing to adjust until the preset value is reached.
7. The method of claim 6, wherein the macro control element comprises a piezoelectric ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211047725.7A CN115494695A (en) | 2022-08-30 | 2022-08-30 | Equipment and method for correcting position deviation of photomask pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211047725.7A CN115494695A (en) | 2022-08-30 | 2022-08-30 | Equipment and method for correcting position deviation of photomask pattern |
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| Publication Number | Publication Date |
|---|---|
| CN115494695A true CN115494695A (en) | 2022-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211047725.7A Pending CN115494695A (en) | 2022-08-30 | 2022-08-30 | Equipment and method for correcting position deviation of photomask pattern |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117261271A (en) * | 2023-11-20 | 2023-12-22 | 深圳市龙图光罩股份有限公司 | Mask film pasting method, device and storage medium |
-
2022
- 2022-08-30 CN CN202211047725.7A patent/CN115494695A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117261271A (en) * | 2023-11-20 | 2023-12-22 | 深圳市龙图光罩股份有限公司 | Mask film pasting method, device and storage medium |
| CN117261271B (en) * | 2023-11-20 | 2024-02-20 | 深圳市龙图光罩股份有限公司 | Mask film pasting method, device and storage medium |
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