CN115491641A - Evaporation machine for prolonging service life of crystal oscillation piece - Google Patents
Evaporation machine for prolonging service life of crystal oscillation piece Download PDFInfo
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- CN115491641A CN115491641A CN202211267080.8A CN202211267080A CN115491641A CN 115491641 A CN115491641 A CN 115491641A CN 202211267080 A CN202211267080 A CN 202211267080A CN 115491641 A CN115491641 A CN 115491641A
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- crystal oscillator
- service life
- plating
- prolonging
- shielding plate
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- 239000013078 crystal Substances 0.000 title claims abstract description 97
- 230000008020 evaporation Effects 0.000 title claims abstract description 48
- 238000001704 evaporation Methods 0.000 title claims abstract description 48
- 230000010355 oscillation Effects 0.000 title abstract description 17
- 238000007747 plating Methods 0.000 claims abstract description 57
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 14
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000000903 blocking effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- 238000012937 correction Methods 0.000 description 7
- 238000009834 vaporization Methods 0.000 description 7
- 230000008016 vaporization Effects 0.000 description 7
- 238000000151 deposition Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/546—Controlling the film thickness or evaporation rate using measurement on deposited material using crystal oscillators
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to the field of semiconductors, in particular to an evaporator for prolonging the service life of a crystal oscillator piece, wherein a plurality of shielding parts of the evaporator for prolonging the service life of the crystal oscillator piece are uniformly arranged around the rotation axis of a shielding plate, and hollow parts are arranged between adjacent shielding parts; the hollow part is provided with a hollow channel; the planes swept by the rotation of the hollow channel and the shielding part are both blocked between the plating source and the crystal oscillator piece. The invention has the beneficial effects that: in the evaporation plating machine for prolonging the service life of the crystal oscillator piece, the evaporation plating material is blocked by the blocking part from the plating source to the path on the crystal oscillator piece by evaporation plating and is communicated with the hollow channel by the hollow channel. Therefore, the arrangement of the shielding plate enables the crystal oscillation piece to be coated with less film. The method not only enables the thickness precision of the detected film of the crystal oscillator wafer to be higher, but also enables the crystal oscillator wafer to be in a state of lower load for a long time, and prolongs the service life of the crystal oscillator wafer.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to an evaporator for prolonging the service life of a crystal oscillator plate.
Background
In the field of LED semiconductor chips, a vacuum evaporator is often applied to coat a film on a wafer; and a crystal oscillator plate is arranged in the evaporator and used for calculating the thickness of the coating film.
The main structure of the crystal oscillator is quartz crystal, the quartz crystal has piezoelectric effect, and if a layer of film is plated on the surface of the crystal, the natural oscillation frequency of the crystal can be changed; in other words, the larger the mass carried on the wafer, the lower the oscillation frequency.
But the bearing mass of the crystal oscillator wafer is not in a linear relation with the oscillation frequency; along with the reduction of the oscillation frequency, the detection film thickness of the crystal oscillator plate is not only inaccurate, but also the long-term load of the crystal oscillator plate is large and easy to lose efficacy. Especially, when materials with higher density such as gold, platinum and the like are evaporated, the service life of the crystal oscillator piece can be greatly reduced, and therefore, the production cost is improved. There is a strong need in the art for a structure that can extend the lifetime of a crystal plate.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the evaporator for prolonging the service life of the crystal oscillator plate is provided, so that the service life of the crystal oscillator plate is prolonged, and the detection structure of the film thickness is accurate.
In order to solve the technical problems, the invention adopts a technical scheme that: an evaporation machine for prolonging the service life of a crystal oscillator piece comprises an evaporation cavity, wherein a plating source and the crystal oscillator piece are arranged in the evaporation cavity, the crystal oscillator piece is connected with a film thickness meter, the evaporation machine for prolonging the service life of the crystal oscillator piece comprises a shielding plate, the shielding plate is arranged in a self-rotation manner, and the axis of the self-rotation of the shielding plate is perpendicular to the shielding plate;
the shielding plate comprises a plurality of shielding parts and a plurality of hollow parts; the shielding parts are uniformly arranged around the rotation axis of the shielding plate, and the hollow parts are arranged between the adjacent shielding parts; the hollow part is provided with a hollow channel;
the planes swept by the rotation of the hollow channel and the shielding part are both blocked between the plating source and the crystal oscillator piece.
The invention has the beneficial effects that: in the evaporation plating machine for prolonging the service life of the crystal oscillator piece, the plating source enables evaporation plating materials to evaporate and then to be evaporated on the wafer piece or the crystal oscillator piece through the baffle plate.
The shielding plate rotates, and a hollow channel and a shielding part are arranged on the shielding plate; therefore, the evaporation material is blocked by the shielding part when the evaporation material is evaporated from the plating source to the path on the crystal oscillator piece, and is communicated with the hollow channel when the evaporation material is evaporated. Therefore, the arrangement of the shielding plate enables the crystal oscillation piece to be coated with less film. And adjusting the correction coefficient of the film thickness meter to enable the film thickness meter to calculate the correct film thickness of the plated film on the wafer after receiving the oscillation frequency of the crystal oscillation plate.
The thickness of the crystal oscillator plate coating film in the evaporation machine for prolonging the service life of the crystal oscillator plate is smaller than that of the coating film on the crystal wafer, so that the detection film thickness precision of the crystal oscillator plate is higher, the crystal oscillator plate is in a low-load state for a long time, and the service life of the crystal oscillator plate is prolonged.
Drawings
FIG. 1 is a schematic diagram of an overall structure of an evaporation machine for prolonging the lifetime of a crystal oscillator plate according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a part of a structure of an evaporation machine for prolonging the lifetime of a crystal plate according to an embodiment of the present invention;
description of reference numerals:
1. plating source; 2. a crystal oscillation sheet; 3. a shielding plate; 31. a shielding portion; 32. hollowing out the channel; 33. clamping the protrusions; 4. plating a pot; 5. a planet rail; 6. the ring is rotated.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1-2, an evaporator for prolonging the service life of a crystal oscillator piece comprises an evaporation chamber, a plating source 1 and a crystal oscillator piece 2 are arranged in the evaporation chamber, the crystal oscillator piece 2 is connected with a film thickness meter, the evaporator for prolonging the service life of the crystal oscillator piece comprises a shielding plate 3, the shielding plate 3 is arranged in a rotation manner, and the axis of the rotation of the shielding plate 3 is perpendicular to the shielding plate 3;
the shielding plate 3 includes a plurality of shielding portions 31 and a plurality of hollowed-out portions; the shielding parts 31 are uniformly arranged around the rotation axis of the shielding plate 3, and the hollow parts are arranged between the adjacent shielding parts 31; the hollow part is provided with a hollow channel 32;
the planes swept by the rotation of the hollow channel 32 and the shielding part 31 are both blocked between the plating source 1 and the crystal oscillator piece 2.
As can be seen from the above description, the beneficial effects of the present invention are: in the evaporator for prolonging the service life of the crystal oscillation piece, the plating source 1 evaporates the evaporation material and evaporates the evaporation material on the wafer or on the crystal oscillation piece 2 through the shielding plate 3.
The shielding plate 3 rotates because the shielding plate 3 is provided with the hollow channel 32 and the shielding part 31; therefore, the deposition material is blocked by the shielding part 31 when depositing on the path of the crystal oscillator piece 2 from the deposition source 1, and is communicated by the hollow passage 32 when depositing. Therefore, the arrangement of the shielding plate 3 causes the crystal oscillation piece 2 to be less coated. And adjusting the correction coefficient of the film thickness meter to enable the film thickness meter to calculate the correct film thickness of the plated film on the wafer after receiving the oscillation frequency of the crystal oscillation plate 2.
The thickness of the film coated on the crystal oscillator plate 2 in the evaporation plating machine for prolonging the service life of the crystal oscillator plate is smaller than that of the film coated on the crystal wafer, so that the detection film thickness precision of the crystal oscillator plate 2 is higher, the crystal oscillator plate 2 is in a low-load state for a long time, and the service life of the crystal oscillator plate 2 is prolonged.
Further, the plating device also comprises a plating pot 4, wherein the plating source 1, the plating pot 4, the shielding plate 3 and the crystal oscillator piece 2 are sequentially arranged from bottom to top.
As can be seen from the above description, the plating pot 4 is used for placing the wafer, and the arrangement provides a reasonable spatial arrangement structure of the plating source 1, the plating pot 4, the shielding plate 3 and the wafer 2.
Further, an annular planet rail 5 is horizontally arranged on the inner wall of the evaporation coating cavity, and the plating pot 4 is connected with the planet rail 5 in a sliding mode.
As can be seen from the above description, the plating pot 4 is rotatably disposed, so that the wafer is plated more uniformly.
Furthermore, the section of the shielding plate 3 is circular, and the section of the hollow-hole channel is fan-shaped; the radii of the hollow channels 32 are all arranged along the radius of the shielding plate 3.
As is clear from the above description, the crystal plate 2 can be arbitrarily placed in the longitudinal direction of the radius of the shielding plate 3, and the above placement allows the ratio of the film thickness on the deposited crystal plate 2 to the film thickness on the wafer to be maintained constant regardless of where the crystal plate is placed.
Further, the total area of the cross sections of the plurality of hollowed-out channels 32 is 0.35 to 0.65 time of the area of the shielding plate 3.
As can be seen from the above description, a reasonable size of the hollowed-out channel 32 is provided.
Further, the device also comprises a rotating ring 6 and a motor, wherein the rotating ring 6 is horizontally arranged, and the whole circumference of the outer ring of the rotating ring 6 is connected with the evaporation cavity in a sliding manner; the motor is in transmission connection with a rotating ring 6, and the shielding plate 3 covers and is fixed on the inner ring of the rotating ring 6.
As is apparent from the above description, a simple and efficient structure for driving the shutter 3 to rotate is provided.
Furthermore, the inner ring of the rotating ring 6 is provided with a clamping groove, the edge of the shielding plate 3 is provided with a clamping protrusion 33 corresponding to the clamping groove, and the shielding plate 3 is fixedly connected with the rotating ring 6 through the clamping groove.
As can be seen from the above description, a removable structure of the shielding plate 3 is provided to facilitate cleaning of the shielding plate 3 or evaporation of some material having a lower density, without the need to use the shielding plate 3, and to remove the shielding plate 3.
Further, the device also comprises a plating pot 4, and the plating pot 4 is fixedly connected with the rotating ring 6.
As can be seen from the above description, the plating pot 4 is also driven to rotate by the rotating ring 6, and the same set of structure is used to simultaneously drive the shielding plate 3 and the plating pot 4 to rotate, so that the evaporation plating machine for prolonging the service life of the crystal oscillator wafer has a simple structure.
The application background of the evaporator for prolonging the service life of the crystal oscillator plate is as follows: when the coating process needs to save the use amount of the crystal oscillation piece 2.
Example one
Referring to fig. 1-2, an evaporator for prolonging the service life of a crystal oscillator piece comprises an evaporation chamber, a plating source 1 and a crystal oscillator piece 2 are arranged in the evaporation chamber, and the crystal oscillator piece 2 is connected with a film thickness meter, and is characterized in that the evaporator for prolonging the service life of the crystal oscillator piece comprises a shielding plate 3, the shielding plate 3 is arranged in a self-rotation manner, and an axis of the self-rotation of the shielding plate 3 is perpendicular to the shielding plate 3;
the shielding plate 3 comprises a plurality of shielding portions 31 and a plurality of hollowed-out portions; the shielding parts 31 are uniformly arranged around the rotation axis of the shielding plate 3, and the hollow parts are arranged between the adjacent shielding parts 31; the hollow part is provided with a hollow channel 32;
the planes swept by the rotation of the hollow channel 32 and the shielding part 31 are both blocked between the plating source 1 and the crystal oscillator piece 2.
The evaporator for prolonging the service life of the crystal oscillator piece further comprises a plating pot 4, a rotating ring 6 and a motor, wherein the plating source 1, the plating pot 4, the baffle plate 3 and the crystal oscillator piece 2 are sequentially arranged from bottom to top.
An annular planet rail 5 is horizontally arranged on the inner wall of the evaporation coating cavity, and the plating pot 4 is connected with the planet rail 5 in a sliding manner.
The section of the shielding plate 3 is circular, and the section of the hollow-hole channel is fan-shaped; the radius of the hollow-out channel 32 is arranged along the radius of the shielding plate 3.
The total area of the cross sections of the hollow channels 32 is 0.35-0.65 times of the area of the shielding plate 3.
The rotating ring 6 is horizontally arranged, and the whole circumference of the outer ring of the rotating ring 6 is connected with the evaporation cavity in a sliding manner; the motor is in transmission connection with a rotating ring 6, and the shielding plate 3 covers and is fixed on the inner ring of the rotating ring 6.
The inner circle of rotatory ring 6 is equipped with the joint groove, 3 borders of shielding plate are equipped with the joint arch 33 that corresponds the joint groove, shielding plate 3 passes through joint groove and rotatory ring 6 fixed connection.
The plating pot 4 is fixedly connected with the rotating ring 6.
The invention relates to a vapor deposition machine for prolonging the service life of a crystal oscillator plate, which has the following use and principle:
the staff sets up the wafer on plating pot 4, works as when extension wafer life-span's coating by vaporization machine starts, and the motor drives rotatory ring 6 rotation, even has shielding plate 3 and plates pot 4 on the rotatory ring 6 of level, so rotatory ring 6 drives shielding plate 3 and plates 4 rotations of pot. Meanwhile, the evaporation material evaporated by the plating source 1 is emitted into the whole evaporation chamber from bottom to top. Because the whole circumference of the outer ring of the rotating ring 6 is connected with the evaporation cavity in a sliding way, and the shielding plate 3 covers the inner ring of the rotating ring 6, the rotating ring 6 and the shielding plate 3 are completely blocked on the path of the evaporation material which volatilizes upwards. However, the shielding plate 3 is provided with a hollow passage 32, and the evaporation material can be evaporated on the crystal oscillating plate 2 through the hollow passage 32.
The projection of the crystal oscillator piece 2 from top to bottom is always on the plane swept by the rotation of the hollow channel 32, and the projection of the crystal oscillator piece 2 from top to bottom is always on the plane swept by the rotation of the shielding part 31. Therefore, the evaporation material can be evaporated on the crystal oscillator piece 2 sometimes and is blocked by the baffle plate 3 sometimes; the thickness of the plating film on the wafer 2 is made smaller than that on the wafer. The operator can obtain the thickness of the coating film on the wafer from the film thickness meter only by adjusting the correction coefficient of the film thickness meter.
Because the thickness of the coating film on the crystal oscillator plate 2 is thinner, the load of the crystal oscillator plate 2 is always lower during each evaporation, and therefore the service life of the crystal oscillator plate 2 is prolonged.
Correction coefficient acquisition and verification example of correction coefficient:
set up a control experiment, including an experiment coating by vaporization machine, except that the experiment coating by vaporization machine does not have the shielding plate, all the other structures are the same with this embodiment 1 the structure of the coating by vaporization machine of extension crystal oscillator piece life-span uses coating by vaporization machine and the experiment coating by vaporization machine of extension crystal oscillator piece life-span are with the same kind of metal of same speed coating by vaporization. The ratio of the film thickness measurement data of the experimental evaporator to the film thickness measurement data not corrected in example 1 was used as a correction coefficient.
Through verification, in the case that the same metal is evaporated by the plating source of the evaporation machine for prolonging the service life of the crystal oscillator wafer in the embodiment 1, no matter how fast the evaporation rate is, the data of the film thickness meter after being corrected by the correction coefficient basically conforms to the data of the film thickness on the wafer measured by the step profiler.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (8)
1. An evaporator for prolonging the service life of a crystal oscillator piece comprises an evaporation cavity, wherein a plating source and the crystal oscillator piece are arranged in the evaporation cavity, and the crystal oscillator piece is connected with a film thickness meter;
the shielding plate comprises a plurality of shielding parts and a plurality of hollow parts; the shielding parts are uniformly arranged around the rotation axis of the shielding plate, and the hollow parts are arranged between the adjacent shielding parts; the hollow part is provided with a hollow channel;
the planes swept by the rotation of the hollow channel and the shielding part are both blocked between the plating source and the crystal oscillator piece.
2. The evaporation plating machine for prolonging the service life of the crystal oscillator piece according to claim 1, further comprising a plating pot, wherein the plating source, the plating pot, the shielding plate and the crystal oscillator piece are sequentially arranged from bottom to top.
3. The evaporation plating machine for prolonging the service life of the crystal oscillator plate according to claim 2, wherein an annular planet rail is horizontally arranged on the inner wall of the evaporation plating chamber, and the plating pot is connected with the planet rail in a sliding manner.
4. The evaporation plating machine for prolonging the service life of the crystal oscillator piece according to claim 1, wherein the cross section of the shielding plate is circular, and the cross section of the hollow-out channel is fan-shaped; the radius of the hollowed-out channel is arranged along the radius of the shielding plate.
5. The evaporator for prolonging the service life of the crystal oscillator plate according to claim 1, wherein the total area of the cross sections of the plurality of hollowed-out channels is 0.35 to 0.65 times the area of the shielding plate.
6. The evaporation plating machine for prolonging the service life of the crystal oscillator piece according to claim 1, further comprising a rotating ring and a motor, wherein the rotating ring is horizontally arranged, and the whole circumference of the outer ring of the rotating ring is in sliding connection with the evaporation plating chamber; the motor is connected with the rotating ring in a transmission mode, and the shielding plate covers and is fixed to the inner ring of the rotating ring.
7. The evaporation plating machine for prolonging the lifetime of a crystal oscillator plate according to claim 6, wherein the inner ring of the rotating ring is provided with a locking groove, the edge of the shielding plate is provided with a locking protrusion corresponding to the locking groove, and the shielding plate is fixedly connected with the rotating ring through the locking groove.
8. The evaporator for prolonging the service life of the crystal oscillator plate as recited in claim 6, further comprising a plating pot, wherein the plating pot is fixedly connected with the rotating ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211267080.8A CN115491641A (en) | 2022-10-17 | 2022-10-17 | Evaporation machine for prolonging service life of crystal oscillation piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211267080.8A CN115491641A (en) | 2022-10-17 | 2022-10-17 | Evaporation machine for prolonging service life of crystal oscillation piece |
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| Publication Number | Publication Date |
|---|---|
| CN115491641A true CN115491641A (en) | 2022-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211267080.8A Pending CN115491641A (en) | 2022-10-17 | 2022-10-17 | Evaporation machine for prolonging service life of crystal oscillation piece |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116536640A (en) * | 2023-05-18 | 2023-08-04 | 江苏宜兴德融科技有限公司 | Crystal vibrating diaphragm thickness monitoring device and coating equipment |
-
2022
- 2022-10-17 CN CN202211267080.8A patent/CN115491641A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116536640A (en) * | 2023-05-18 | 2023-08-04 | 江苏宜兴德融科技有限公司 | Crystal vibrating diaphragm thickness monitoring device and coating equipment |
| CN116536640B (en) * | 2023-05-18 | 2024-01-23 | 江苏宜兴德融科技有限公司 | Crystal vibrating diaphragm thickness monitoring device and coating equipment |
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