CN115486812A

CN115486812A - Cover body, electronic equipment and wearable equipment

Info

Publication number: CN115486812A
Application number: CN202110674251.8A
Authority: CN
Inventors: 周火平; 王作才
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-06-17
Filing date: 2021-06-17
Publication date: 2022-12-20
Also published as: WO2022262363A1

Abstract

The application relates to a lid, electronic equipment and wearable equipment, and the lid includes base plate and electrode layer, and the material of base plate is plastics, and the heat altered shape temperature of base plate is greater than 150 ℃. The electrode layer is attached to the surface of the substrate, and the material of the electrode layer is at least one selected from Cr, W, crW, crSiCN, crWSiC, WC and WSiC. Above lid, can be applied to wearable equipment, and the electrode layer can be used to detect the electrode as the ECG. The substrate can be formed by adopting an injection molding process, the cost is low, the forming is simple, and the color can be diversified. Because the thermal deformation temperature of the substrate is more than 150 ℃ and the specific material is selected as the electrode layer, the electrode layer can be easily formed on the surface of the substrate by adopting processes such as physical vapor deposition and the like, and is reliably connected with the substrate and meets the performance requirement of the ECG detection electrode, thereby reducing the processing difficulty of the cover body and improving the design flexibility and product expressive force of the cover body.

Description

Cover body, electronic equipment and wearable equipment

Technical Field

The application relates to the technical field of wearable equipment, in particular to a cover body, electronic equipment and wearable equipment.

Background

Wearable devices (smartwatches, smartbands, etc.) may generally be equipped with physiological sensors (heart rate sensors, electrocardiogram sensors, etc.) for detecting physiological parameters of a user and providing health guidance functionality. In the related art, a wearable device having an Electrocardiogram (ECG) detection function is generally provided with an electrode layer for detecting ECG data of a user on a cover, the cover is generally made of ceramic, glass or sapphire, and the cover has a high cost and a complex processing technology of the electrode layer.

Disclosure of Invention

The embodiment of the application discloses in a first aspect a cover body to simplify the processing of the cover body of wearable equipment and save cost.

A cover, comprising:

the substrate is made of plastics, and the thermal deformation temperature of the substrate is greater than 150 ℃; and

and the electrode layer is attached to the surface of the substrate, and the material of the electrode layer is at least one selected from Cr, W, crW, crSiCN, crWSiC, WC and WSiC.

Above lid, can be applied to wearable equipment, and the electrode layer can be used to detect the electrode as the ECG. The substrate is made of plastic, the thermal deformation temperature of the substrate is more than 150 ℃, the substrate can be formed by adopting an injection molding process, the cost is low, the forming is simple, and the color can be diversified. Because the thermal deformation temperature of the substrate is more than 150 ℃ and a specific material is selected as the electrode layer, the electrode layer can be easily formed on the surface of the substrate by adopting processes such as physical vapor deposition and the like, and is reliably connected with the substrate and meets the performance requirement of the ECG detection electrode, thereby reducing the processing difficulty of the cover body and improving the design flexibility and product expressive force of the cover body.

The second aspect of the embodiments of the present application discloses an electronic device, so as to simplify the processing of a cover body of a wearable device and save cost.

An electronic device comprises a rear shell, wherein the rear shell comprises a body and the cover body, the cover body is connected to the body, and at least part of an electrode layer is exposed to the outside of the electronic device.

In the above electronic device, the electrode layer of the cover may be used as an ECG detection electrode. The substrate is made of plastic, the thermal deformation temperature of the substrate is more than 150 ℃, the substrate can be formed by adopting an injection molding process, the cost is low, the forming is simple, and the color can be diversified. Because the thermal deformation temperature of the substrate is more than 150 ℃ and a specific material is selected as the electrode layer, the electrode layer can be easily formed on the surface of the substrate by adopting processes such as physical vapor deposition and the like, and is reliably connected with the substrate and meets the performance requirement of the ECG detection electrode, thereby reducing the processing difficulty of the cover body and improving the design flexibility and product expressive force of the cover body.

The third aspect of the embodiment of the application discloses a wearable device, so that the processing of a cover body of the wearable device is simplified, and the cost is saved.

A wearable device comprising a strap and the electronic device described above, the strap being connected to the center frame and being for wearing the electronic device to a wrist of a user.

In the above wearable device, the electrode layer of the cover may be used as an ECG detection electrode. The substrate is made of plastic, the thermal deformation temperature of the substrate is more than 150 ℃, the substrate can be formed by adopting an injection molding process, the cost is low, the forming is simple, and the color can be diversified. Because the thermal deformation temperature of the substrate is more than 150 ℃ and a specific material is selected as the electrode layer, the electrode layer can be easily formed on the surface of the substrate by adopting processes such as physical vapor deposition and the like, and is reliably connected with the substrate and meets the performance requirement of the ECG detection electrode, thereby reducing the processing difficulty of the cover body and improving the design flexibility and product expressive force of the cover body.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic view of a wearable device of an embodiment;

FIG. 2 is a schematic diagram of an electronic device of a wearable device of an embodiment;

FIG. 3 is an exploded view of a rear housing of an electronic device of an embodiment;

FIG. 4 is a schematic diagram of a cover of an electronic device according to an embodiment;

fig. 5 is an exploded view of a cover of an electronic device according to an embodiment.

Reference numerals:

10. wearable device 100, electronic device 103, card slot

110. Middle frame 120, display screen module 130, backshell

131. Body 133, cover 1331, and substrate

1331a, an inner surface 1331b, an outer surface 1333, an electrode layer

13331. First film layer 13333, second film layer 13335, third film layer

135. Detection window 200, binding band

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Referring to fig. 1, in some embodiments, wearable device 10 includes electronic device 100 and strap 200, strap 200 being mounted to electronic device 100 and electronic device 100 being wearable by strap 200 to a user's wrist. Referring to fig. 2, the electronic device 100 includes a middle frame 110, the middle frame 110 is hollow and is used for providing structural rigidity to the whole electronic device 100, and the middle frame 110 has a receiving cavity (not shown) in which electronic components such as a circuit board (not shown) and a battery (not shown) of the electronic device 100 can be disposed. The middle frame 110 may be made of non-metal materials such as plastic, rubber, silica gel, wood, ceramic, or glass, and the middle frame 110 may also be made of metal materials such as stainless steel, aluminum alloy, or magnesium alloy. The middle frame 110 may also be a metal injection-molded part, that is, the structural rigidity of the middle frame 110 is ensured by using a metal material, and the inner surface of the metal body is formed with a protrusion, a groove, a threaded hole and other structures for assembling and positioning by injection molding.

In some embodiments, the wearable device 10 is a smart watch, the electronic device 100 includes electronic components such as a battery, a circuit board, the display screen module 120, and a biosensor, the circuit board may integrate the electronic components such as a processor, a storage unit, and a communication module of the wearable device 10, and the battery may supply power to the circuit board, the display screen module 120, and other electronic components. The display module 120 covers one end of the receiving cavity and is connected to the middle frame 110, which can be used to display information and provide an interactive interface for a user. The Display screen module 120 may further include a Display screen and a cover plate covering the Display screen, the Display screen may be an LCD (Liquid Crystal Display) screen or an OLED (Organic Light-Emitting Diode) screen, and the cover plate may be a glass cover plate or a sapphire cover plate. The cover plate is transparent and has relatively high light transmittance, for example, the light transmittance of the cover plate is over 80%. The display module 120 may have a touch function, but the touch function is not required, and the display module 120 is not required.

Further, referring to fig. 3, the electronic device 100 may include a rear shell 130 connected to the middle frame 110, and at least a portion of a surface of the rear shell 130 fits against the wrist of the user after the wearable device 10 is worn on the wrist of the user. In an embodiment where the electronic device 100 includes the display module 120, the rear case 130 and the display module 120 are disposed opposite to each other at two ends of the middle frame 110 and respectively cover two ends of the accommodating cavity. The rear housing 130 may include a body 131 and a cover 133 connected to the body 131, wherein the cover 133 may be made of a material different from that of the body 131, for example, the cover 133 may be made of plastic, and the body 131 may be made of metal. The cover 133 may be provided with a detection window 135 of a biosensor, such as a heart rate sensor or a blood oxygen sensor. The electronic device 100 may include two or more biosensors that may be used to detect biometric data such as electrocardiogram, heart rate, respiratory rate, blood pressure, or body fat, etc. For example, the electronic device 100 may include an electrocardiogram sensor disposed within the housing cavity, the electrocardiogram sensor being integrated with the circuit board for measuring electrocardiogram data of the user. In some embodiments, the biosensor may also be used to detect a state of motion, for example, for step counting. In other embodiments, the wearable device 10 may be a smart band or the like.

With continued reference to fig. 2, the middle frame 110 is substantially rectangular, and four corners of the rectangle may be processed into arc transitions through a chamfering process, so as to provide the wearable device 10 with better appearance characteristics. In other embodiments, the middle frame 110 may have a circular frame shape. The side surface of the middle frame 110, i.e., the surface facing away from the receiving cavity, may be provided with a fitting structure for mounting the strap 200, and the strap 200 can form a reliable connection with the middle frame 110 through the fitting structure of the middle frame 110, so as to reliably wear the electronic device 100 to the wrist of the user. In some embodiments, strap 200 can also be relatively easily detached from middle frame 110 to allow a user to easily replace strap 200. For example, the user may purchase straps 200 of various styles and replace the straps 200 according to the use scene to improve convenience of use. For example, a user may use more formal strap 200 in formal situations and may use a casual style strap 200 in recreational situations.

With continued reference to fig. 1, in some embodiments, the strap 200 includes two sections, the two opposite ends of the electronic device 100 are respectively provided with the slots 103, one end of each of the two sections of the strap 220 is connected to the electronic device 100, and the ends of the two sections of the strap 220 facing away from the electronic device 100 may be buckled to form a receiving space, so that the electronic device 100 can be worn on the wrist of the user through the strap 200. In other embodiments, the strap 200 may be a one-piece structure, one end of the strap 200 is connected to one end of the electronic device 100, the other end of the electronic device 100 may be provided with a buckle for the strap to pass through, the free end of the strap may pass through the buckle and be fixed to another position of the strap to form an accommodating space, and the size of the accommodating space is easily adjusted to facilitate wearing by a user.

Referring to fig. 4 and 5, in some embodiments, the cover 133 includes a substrate 1331 and an electrode layer 1333 attached to the substrate 1331. The substrate 1331 is made of plastic. For example, the material of the substrate 1331 may be at least one selected from PEI (Polyetherimide), nylon, and PEEK (polyetheretherketone). Substrate 1331 may be injection molded. The substrate 1331 has a heat distortion temperature of more than 150 ℃, the electrode layer 1333 is attached to the surface of the substrate 1331, and the material of the electrode layer 1333 is at least one selected from Cr (chromium), W (tungsten), crW (chromium tungsten compound), crSiCN (chromium silicon carbon nitrogen compound), crWSiC (chromium tungsten silicon carbon compound), WC (tungsten carbon compound), and WSiC (tungsten silicon carbon compound).

The electrode layer 1333 may be used as an ECG detection electrode, with at least a portion of the electrode layer 1333 exposed to the exterior of the electronic device 100. After the wearable device 10 is well worn to the wrist of the user, the electrode layer 1333 may contact the skin of the user for detecting bioelectrical signals of the human body surface, in combination with the electrocardiogram sensor of the electronic device 100, i.e. for measuring electrocardiogram data of the user. The substrate 1331 is made of plastic, the thermal deformation temperature of the substrate 1331 is greater than 150 ℃, the substrate 1331 can be formed by an injection molding process to obtain a relatively accurate external dimension, and complicated machining processes such as turning and grinding are avoided, so that the machining cost of the cover 133 is saved, and the color of the substrate 1331 can be diversified.

In the related art, a Physical Vapor Deposition (PVD) process has the advantages of simple processing, environmental protection, no pollution, less material consumption, uniform and compact film formation, strong bonding force with a substrate, and the like, but the PVD process generally needs to be performed at a high temperature. In the solution disclosed in the present application, since the thermal deformation temperature of the substrate 1331 is greater than 150 ℃ and the material of the electrode layer 1333 is selected from at least one of Cr, W, crW, crSiCN, crWSiC, WC, and WSiC, the thermal deformation temperature of the substrate 1331 can meet the requirements of the PVD process, and the electrode layer 1333 made of the above specific material can be easily deposited on the surface of the substrate 1331 by the PVD process, and forms a reliable connection with the substrate 1331 and meets the performance requirements of the ECG detection electrode, thereby reducing the processing difficulty of the lid 133, and improving the flexibility of the design of the lid 133 and the product expressive force.

In the related art, the electrode layer 1333 of the electronic device 100 of the wearable device 10 is generally formed on ceramic, glass or sapphire, and the raw material price of the ceramic, glass and sapphire is relatively high, and the processing technology is complex, the manufacturing yield is low, and the color is single, so that the overall cost of the cover 133 is relatively high, and the product competitiveness is reduced. The electrode layer formed on the plastic surface by other processes such as electroplating, printing, etc. is difficult to meet the requirements of adhesion and/or wear resistance of the ECG detection electrode.

The cover 133 of the electronic device 100 of the wearable device 10 disclosed in the present application forms the electrode layer 1333 on the substrate 1331 made of plastic material with a thermal deformation temperature greater than 150 ℃, because plastic can be formed by injection molding, the processing technology is relatively simple, the yield of finished products is high, and the color can be diversified, so that the manufacturing cost of the cover 133 can be greatly reduced, the appearance expressive force of the electronic device 100 can be improved, and the competitiveness of the product can be improved.

Referring to fig. 5, in some embodiments, the electrode layer 1333 includes at least two film layers stacked one on another, and the material of the outermost film layer is at least one selected from W, WC, cr and WSiC. In other words, the electrode layer 1333 may include two stacked film layers, three stacked film layers, or more than four stacked film layers, and the material of the outermost film layer is selected from at least one of W, WC, cr, and WSiC, so that the outermost film layer of the electrode layer 1333 has relatively good wear resistance and corrosion resistance while ensuring the conductivity, so as to better protect the inner film layer, and improve the reliability and service life of the electrode layer 1333. The material of the outermost layer of the electrode layer 1333 is not limited to the above-mentioned material, and may be other materials, and may be provided as needed.

In some embodiments, the electrode layer 1333 includes a first film layer 13331, a second film layer 13333 and a third film layer 13335, which are sequentially stacked, the first film layer 13331, the second film layer 13333 and the third film layer 13335 are respectively formed by a PVD process, the first film layer 13331 is attached to the surface of the substrate 1331, the first film layer 13331 is made of Cr or W, the second film layer 13333 is made of at least one of CrW, crSiCN and CrWSiC, the third film layer 13335 is an outermost layer of the electrode layer 1333, and the third film layer 13335 is made of at least one of W, WC, cr and WSiC. The first film layer 13331, the second film layer 13333 and the third film layer 13335 with higher density can be obtained by adopting a PVD (physical vapor deposition) process, so that the electrode layer has better mechanical properties (structural strength, wear resistance and the like) and electrical properties (resistance and the like).

In this embodiment, the first film layer 13331 may have relatively good conductivity and ductility, and have relatively high bonding force with the substrate 1331 made of plastic material, so that the connection structure between the electrode layer 1333 and the substrate 1331 is reliable. The second film layer 13333 serving as a transition layer between the first film layer 13331 and the third film layer 13335 can be used to ensure the bonding force of the first film layer 13331 and the second film layer 13333 and ensure the conductivity of the electrode layer 1333. The materials of the first film layer 13331 and the second film layer 13333 of the electrode layer 1333 are not limited to those described above, and may be other materials, and may be provided as needed.

In some embodiments, the density of the second film layer 13333 is less than the density of the first film layer 13331. The density of the first film layer 13331 is higher, so that the first film layer 13331 has better adhesion, the density of the second film layer 13333 is lower than that of the first film layer 13331, the deposition speed of the second film layer 13333 is higher, and relatively lower stress is provided, and the internal stress of the whole electrode layer 1333 can be reduced, so that the cracking of the electrode layer 1333 can be prevented. It should be noted that the density of the second film layer 13333 is not limited to be smaller than that of the first film layer 13331, the density of the second film layer 13333 may also be equal to that of the first film layer 13331, and the density of the second film layer 13333 may also be greater than that of the first film layer 13331. Can be set according to actual needs.

The substrate 1331 has an inner surface 1331a and an outer surface 1331b, which are oppositely disposed, and the outer surface 1331b is located at a side of the cover 133 facing away from the receiving cavity, that is, the outer surface 1331b of the substrate 1331 can be simply understood as a surface of the substrate 1331 facing away from the interior of the electronic device 100, which may be partially exposed to the outside to enable a user to touch the surface. In some embodiments, the electrode layer 1333 extends from the outer surface 1331b to the inner surface 1331a and around the edge of the substrate 1331, and is electrically connected to the circuit board in the receiving cavity. For example, the first film layer 13331 of the electrode layer 1333 may wrap around the edge of the substrate 1331 and extend to the inner surface 1331a of the substrate 1331, and the circuit board may be provided with a connection structure such as an elastic contact pin or a metal spring piece, which abuts against the first film layer 13331 on the inner surface 1331a side, so that the electrode layer 1333 is electrically connected to the circuit board. For another example, the first film layer 13331 and the second film layer 13333 of the electrode layer 1333 both extend around the edge of the substrate 1331 and extend to the surface of the substrate 1331, and are electrically connected to a connection structure disposed on a circuit board. For another example, the first film layer 13331, the second film layer 13333 and the third film layer 13335 of the electrode layer 1333 all bypass the edge of the substrate 1331 and extend to the inner surface 1331a of the substrate 1331, that is, the entire electrode layer 1333 bypasses the edge of the substrate 1331 and extends to the inner surface 1331a of the substrate 1331, and is electrically connected to a connection structure disposed on the circuit board.

In other embodiments, the substrate 1331 defines a through hole extending from the outer surface 1331b to the inner surface 1331a. The electrode layer 1333, such as the first film layer 13331, may extend to the inner surface 1331a along the hole wall of the through hole, and is electrically connected to a connection structure, such as an elastic contact pin or a metal spring, disposed on the circuit board. Of course, the first film layer 13331 and the second film layer 13333, or the entire electrode layer 1333 may extend along the through hole to the inner surface 1331a of the substrate 1331 and be electrically connected to the connection structure disposed on the circuit board.

Of course, in the embodiment where the substrate 1331 is provided with a through hole, in order to simplify the processing of the through hole inner electrode layer 1333 and improve the reliability of the circuit connection, a conductive pillar may be disposed in the through hole, and the conductive pillar is used to make the conductive layer on the outer surface 1331b and the connection structure disposed on the circuit board be conductive. The conductive pillar may be a copper pillar or other alloy member, which may penetrate through the through hole and be in interference fit with the through hole, the electrode layer 1333 covers the conductive pillar and is conducted with the conductive pillar, the conductive pillar extends to the inner surface 1331a, and thus the electrical connection between the electrode layer 1333 and the circuit board may be achieved through the conductive pillar.

In some embodiments, the electrode layer 1333 has a thickness in the range of 1.5 μm to 3.6 μm, and the first film layer 13331, the second film layer 13333, and the third film layer 13335 have a thickness in the range of 0.5 μm to 1.2 μm. For example, the thickness of the entire electrode layer 1333 may be 1.8 μm, or 2.0 μm, or 2.5 μm, or 3.0 μm, or 3.5 μm, or the like. The thickness of the first film layer 13331 may be 0.6 μm, or 0.8 μm, or 1.0 μm, etc. The thickness of the second film layer 13333 may be 0.6 μm, or 0.8 μm, or 1.0 μm, etc. The thickness of the third film layer 13335 may be 0.6 μm, or 0.8 μm, or 1.0 μm, etc.

Such an arrangement can make the electrode layer 1333 have a low thickness and can secure mechanical properties (adhesion, structural strength, abrasion resistance, etc.) and electrical properties (resistance, etc.) of the electrode layer 1333. It is to be appreciated that any two of the thickness of the first film layer 13331, the thickness of the second film layer 13333, and the thickness of the third film layer 13335 can be approximately equal or can differ significantly. The thickness of the electrode layer 1333 is not limited to the above-described thickness, and may be other thicknesses, and may be set as necessary.

With continued reference to fig. 4 and 5, in the present embodiment, the substrate 1331 is substantially in a circular block shape, the electrode layers 1333 extend along the edge of the substrate 1331, the number of the electrode layers 1333 is 2, and two electrode layers 1333 may be disposed on the substrate 1331 in an axisymmetric manner with respect to the interval therebetween. The detection window 135 of the substrate 1331 is located in the region surrounded by the two electrode layers 1333.

In addition, with reference to fig. 4 and 5, the present application further provides a method for manufacturing the cover 133 according to the above embodiment, so that the cover 133 of the wearable device 10 with low cost and good mechanical and electrical properties can be manufactured. The preparation method comprises the following steps of S110-S130:

s110, providing a substrate 1331, wherein the substrate 1331 has an outer surface 1331b and an inner surface 1331a oppositely disposed.

For details of the structure and material of the substrate 1331, for example, the material of the substrate 1331 may be at least one selected from PEI, nylon, and PEEK, and the substrate 1331 is injection molded, which will not be described herein again.

S120, a roughening process is performed on a part of the outer surface 1331b of the substrate 1331.

The roughening treatment can be a chemical etching process or a laser etching process. Such an arrangement can improve the adhesion of the electrode layer 1333 to the substrate 1331. Further, the surface roughness of the part of the outer surface 1331b after the roughening treatment may be 0.2 μm to 0.3 μm. The method of the roughening treatment is not limited to the above-described process, and other roughening treatment methods may be used. The step of roughening the outer surface 1331b of the substrate 1331 may be omitted.

And S130, forming an electrode layer 1333 on the outer surface 1331b by adopting a PVD (physical vapor deposition) process, wherein the electrode layer 1333 comprises at least two film layers which are arranged in a stacked mode.

It should be noted that the specific structure and arrangement of the electrode layer 1333 are described above in detail, and are not described herein again.

The following are specific examples.

As not particularly described, in the following embodiments, the cover 133 is the cover 133 of the electronic device 100 of the wearable device 10. The substrate 1331 is made of PEI.

Example 1

The structure of the cover 133 of the present embodiment is shown in fig. 4 and 5. The process for preparing the cap 133 of this embodiment is as follows:

(1) A substrate 1331 is provided, the substrate 1331 having an outer surface 1331b and an inner surface 1331a disposed opposite.

(2) The first film layer 13331 of the electrode layer 1333 is formed on the outer surface 1331b by a PVD process, the first film layer 13331 is made of Cr, the thickness is 0.514 μm, and the deposition temperature is 150 ℃.

(3) And forming a second film layer 13333 on the side, far away from the outer surface 1331b, of the first film layer 13331 by adopting a PVD (physical vapor deposition) process, wherein the second film layer 13333 is made of CrW, the thickness of the second film layer 13333 is 0.514 mu m, and the deposition temperature is 150 ℃.

(4) And forming a third film layer 13335 on the side, away from the first film layer 13331, of the second film layer 13333 by using a PVD (physical vapor deposition) process, wherein the third film layer 13335 is made of W, the thickness of the third film layer 13335 is 0.515 mu m, and the deposition temperature is 150 ℃.

Example 2

(2) A first film layer 13331 of the electrode layer 1333 is formed on the outer surface 1331b by a PVD (physical vapor deposition) process, the first film layer 13331 is made of Cr, the thickness is 0.898 mu m, and the deposition temperature is 150 ℃.

(3) And forming a second film layer 13333 on the side, far away from the outer surface 1331b, of the first film layer 13331 by adopting a PVD (physical vapor deposition) process, wherein the second film layer 13333 is made of CrW, the thickness of the second film layer 13333 is 0.898 mu m, and the deposition temperature is 150 ℃.

(4) And forming a third film layer 13335 on the side, away from the first film layer 13331, of the second film layer 13333 by using a PVD process, wherein the third film layer 13335 is made of W and has a thickness of 0.897 μm and a deposition temperature of 150 ℃.

Example 3

(2) The first film layer 13331 of the electrode layer 1333 is formed on the outer surface 1331b by a PVD process, the first film layer 13331 is made of Cr, the thickness is 0.848 mu m, and the deposition temperature is 150 ℃.

(3) And forming a second film layer 13333 on the side, far away from the outer surface 1331b, of the first film layer 13331 by adopting a PVD (physical vapor deposition) process, wherein the second film layer 13333 is made of CrW, the thickness of the second film layer 13333 is 0.848 mu m, and the deposition temperature is 150 ℃.

(4) And forming a third film layer 13335 on the side, away from the first film layer 13331, of the second film layer 13333 by using a PVD (physical vapor deposition) process, wherein the third film layer 13335 is made of WC and has a thickness of 0.847 mu m and a deposition temperature of 150 ℃.

Example 4

(2) A first film layer 13331 of the electrode layer 1333 is formed on the outer surface 1331b through a PVD (physical vapor deposition) process, the first film layer 13331 is made of Cr, the thickness is 1.067 mu m, and the deposition temperature is 150 ℃.

(3) And forming a second film 13333 on the side, far away from the outer surface 1331b, of the first film 13331 by adopting a PVD (physical vapor deposition) process, wherein the second film 13333 is made of CrSiCN and has the thickness of 1.067 mu m and the deposition temperature of 150 ℃.

(4) And forming a third film layer 13335 on the side, away from the first film layer 13331, of the second film layer 13333 by using a PVD (physical vapor deposition) process, wherein the third film layer 13335 is made of Cr, the thickness of the third film layer 13335 is 1.067 mu m, and the deposition temperature is 150 ℃.

Example 5

(2) And forming a first film layer 13331 of the electrode layer 1333 on the outer surface 1331b by adopting a PVD (physical vapor deposition) process, wherein the first film layer 13331 is made of Cr, the thickness is 0.936 mu m, and the deposition temperature is 150 ℃.

(3) And forming a second film layer 13333 on the side, far away from the outer surface 1331b, of the first film layer 13331 by adopting a PVD (physical vapor deposition) process, wherein the second film layer 13333 is made of CrWSiC and has the thickness of 0.936 mu m, and the deposition temperature is 150 ℃.

(4) And forming a third film layer 13335 on the side, away from the first film layer 13331, of the second film layer 13333 by using a PVD (physical vapor deposition) process, wherein the third film layer 13335 is made of WSiC and has a thickness of 0.936 μm and a deposition temperature of 150 ℃.

Example 6

(2) The first film layer 13331 of the electrode layer 1333 is formed on the outer surface 1331b by a PVD (physical vapor deposition) process, the first film layer 13331 is made of W, the thickness is 0.936 mu m, and the deposition temperature is 150 ℃.

Example 7

The process for preparing the cap 133 of this embodiment is substantially the same as that of embodiment 1, except that:

in the steps (2), (3) and (4), the first layer 13331, the second layer 13333 and the third layer 13335 are made of Cr.

Comparative example 1

The cap 133 of this comparative example was prepared in substantially the same manner as in example 1, except that:

the substrate 1331 is made of PC (Polycarbonate), and has a heat distortion temperature of about 100 ℃, i.e., the heat distortion temperature of the substrate 1331 is less than 150 ℃. In the steps (2), (3) and (4), the substrate 1331 is easily deformed under the original PVD process conditions, so the first film layer 13331, the second film layer 13333 and the third film layer 13335 are formed on the surface of the substrate 1331 by the electroplating process at a temperature of 60 ℃.

Comparative example 2

in the steps (2), (3) and (4), the first film 13331, the second film 13333 and the third film 13335 are all made of titanium.

Comparative example 3

in the steps (2), (3) and (4), the first film layer 13331, the second film layer 13333 and the third film layer 13335 are all made of Cr, and are formed on the substrate 1331 by a water plating process.

And (3) testing:

the adhesion, abrasion resistance, thermal stability, corrosion resistance and resistance of the electrode layer 1333 of the cap body 133 of examples 1 to 7 and comparative examples 1 to 3 were measured. Table 1 shows the results of the adhesion, abrasion resistance, ring test (thermal stability, corrosion resistance, etc.) and resistance test of the electrode layer 1333 in the cover 133 of examples 1 to 7 and comparative examples 1 to 3. In table 1, the purpose of the loop test is to test the thermal stability, corrosion resistance and other properties of the electrode layer 1333, wherein the thermal stability test specifically includes a high-low temperature resistance test, a temperature impact resistance (i.e., a temperature sharp change) test and the like, and the corrosion resistance test specifically includes a salt spray test, an artificial sweat test and the like.

The 'water boiling 80 ℃ for 60 minutes' test is used for testing the adhesive force of the cover 133 on the electrode layer 1333, and the qualified standard is that the tested electrode layer 1333 has no crack and does not fall off;

"RCA (load 175 g)" test the wear resistance of the electrode layer 1333 of the lid 133 using a U.S. Norman Tool RCA tape abrasion tester, with the acceptance criteria being that the electrode layer 1333 after more than 200 tests is not worn through and the substrate 1331 is not exposed;

the "CS10 rubber (load 500 g)" test uses the CS10 rubber to match with the american Taber tester to test the wear resistance of the electrode layer 1333 of the cover 133, since the substrate 1331 is made of plastic and has relatively low surface hardness, the substrate 1331 made of such a material is generally not used for testing the wear resistance of the plating layer by using the test method, but the test result can be used for reference;

in the test of "red head rubber (load 500 g)", the wear resistance of the electrode layer 1333 of the cover 133 was tested by using the red head rubber in combination with a U.S. Taber tester, and the qualified standard was that the tested electrode layer 1333 was not worn through and the substrate 1331 was not exposed.

The results are shown in table 1, and table 1 shows the results of the adhesion, abrasion resistance, ring test, and resistance test of the electrode layer 1333 of the cover 133 of examples 1 to 7 and comparative examples 1 to 3.

TABLE 1

As can be seen from table 1, the adhesion of the electrode layer 1333 of the cover 133 of examples 1 to 7 was all acceptable, and it was demonstrated that the electrode layer 1333 of the cover 133 prepared in the above embodiment had excellent adhesion. The abrasion resistance (RCA test and red rubber test) of examples 1 to 7 was all acceptable, and it was demonstrated that the electrode layer 1333 of the lid body 133 of the above embodiment had excellent abrasion resistance. The results of the loop tests (thermal stability test and corrosion resistance test) of examples 1 to 7 are all acceptable, which indicates that the electrode layer 1333 has superior thermal stability and corrosion resistance in the above embodiment. The impedance of the electrode layer 1333 of the cover 133 of examples 1-7 was less than 100 Ω, which demonstrates that the electrode layer 1333 of the cover 133 prepared in the above embodiments has good conductivity and can meet the requirements of ECG detection electrodes. Further, as can be seen from table 1, the adhesion and abrasion resistance of the lid bodies 133 of examples 1 to 7 are significantly superior to those of comparative example 1, comparative example 2 and comparative example 3.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is specific and detailed, but not construed as limiting the scope of the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A cover, comprising:

2. The cover according to claim 1, wherein said electrode layer comprises at least two laminated layers, and the material of said outermost layer is at least one selected from the group consisting of W, WC, cr and WSiC.

3. The cover according to claim 2, wherein the electrode layer comprises a first film layer, a second film layer and a third film layer stacked in this order, the first film layer is attached to the surface of the substrate, the first film layer is made of a material selected from Cr or W, the second film layer is made of a material selected from at least one of CrW, crSiCN and CrWSiC, and the third film layer is an outermost layer of the electrode layer.

4. The cover of claim 3, wherein the thickness of the electrode layer is in the range of 1.5 μm to 3.6 μm;

and/or the thickness range of the first film layer is 0.5-1.2 μm;

and/or the thickness range of the second film layer is 0.5-1.2 μm;

and/or the thickness of the third film layer ranges from 0.5 mu m to 1.2 mu m.

5. The cover of claim 1 wherein said electrode layer is a PVD coating.

6. The cover of any of claims 1-5, wherein the substrate has an inner surface and an outer surface, and the electrode layer extends from the outer surface around the edge of the substrate and to the inner surface.

7. The cover according to any of claims 1-5, wherein said substrate has an inner surface and an outer surface, said substrate defines a through hole, and said electrode layer extends from said outer surface to said inner surface along a wall of said through hole; or, a conductive column is arranged in the through hole, the conductive column is conducted with the electrode layer on the outer surface, and the conductive column extends to the inner surface.

8. The cover according to any one of claims 1 to 5, wherein the material of the substrate is at least one selected from the group consisting of PEI, nylon and PEEK;

and/or, the substrate is injection molded.

9. An electronic device comprising a rear case, wherein the rear case comprises a body and a cover according to any one of claims 1 to 8, the cover is connected to the body and at least a portion of the electrode layer is exposed to the outside of the electronic device.

10. The electronic device of claim 9, further comprising a middle frame and an electrocardiogram sensor, wherein the middle frame has a receiving cavity, the body is connected to the middle frame and covers one end of the receiving cavity, and the electrocardiogram sensor is disposed in the receiving cavity and electrically connected to the electrode layer for measuring an electrocardiogram.

11. A wearable device comprising the electronic device of claim 9 or 10 and a strap connected to the electronic device and configured to wear the electronic device to a wrist of a user.