WO2024078221A1

WO2024078221A1 - Electronic device

Info

Publication number: WO2024078221A1
Application number: PCT/CN2023/117730
Authority: WO
Inventors: 孟凡越; 刘晓刚; 张友良; 祝培培
Original assignee: 华为技术有限公司
Priority date: 2022-10-14
Filing date: 2023-09-08
Publication date: 2024-04-18
Also published as: CN219206972U

Abstract

The present application provides an electronic device. A through hole is formed in a rear cover of the electronic device, the through hole can be electrically connected to an ECG signal processing module inside the electronic device and an ECG signal detection module outside the electronic device, an ECG signal conduction circuit of the electronic device has a stable structure, the impact of the conduction circuit on the detection result of ECG is small, the electronic device can accurately detect an ECG signal, and the ECG measurement result is reliable.

Description

Electronic equipment

This application claims priority to the Chinese patent application filed with the China Patent Office on October 14, 2022, with application number 202222722776.7 and invention name “Electronic Device”, all contents of which are incorporated by reference in this application.

Technical Field

The present application relates to the field of terminal electronic equipment, and more specifically, to an electronic equipment.

Background technique

With the development of science and technology, people's demand for intelligent detection of physiological health indicators in scenarios such as work, life, exercise and sleep is becoming more and more significant. Wearable devices have emerged with functions such as heart rate detection, blood oxygen saturation detection, electrocardiogram (ECG) detection and body temperature measurement.

An electrocardiogram (ECG) can record the electrical signals in the heart and can be used to quickly check for heart problems and monitor heart health. For example, the relevant data recorded on the ECG can be used to diagnose whether the person being diagnosed has heart problems such as arrhythmia and coronary artery disease. Accurate and reliable test data is the key to disease diagnosis. If the measurement results of the measuring instrument or equipment are inaccurate or unreliable, not only will it fail to assist in diagnosing the disease for the patient, but it may also cause psychological distress and other inconveniences to the user, and may even lead to misdiagnosis in severe cases.

Therefore, it is worth considering how to improve the accuracy and reliability of wearable devices in measuring ECG.

Summary of the invention

The present application provides an electronic device, a through hole is provided on the back cover of the electronic device, and the through hole can electrically connect an ECG signal processing module inside the electronic device and an ECG signal detection module outside the electronic device. The electronic device and the electronic device can accurately detect ECG signals, and the ECG measurement results are reliable.

In a first aspect, an electronic device is provided, comprising: a shell; a cover body, the cover body and the shell form a cavity, the cavity accommodates an electrocardiogram (ECG) signal processing module, ECG electrodes are arranged on the outer surface of the cover body, and a through hole is opened on the cover body, and the ECG electrode and the ECG signal processing module are electrically connected through the through hole.

The outer surface of the cover body is the side of the cover body away from the cavity or the ECG signal processing module, or the side close to the user's skin.

This technical solution opens a through hole on the back cover of the electronic device, and uses the through hole to electrically connect the ECG signal processing module and ECG electrodes located on the inside and outside of the device respectively. Compared with the solution of connecting from the connection position of the cover body and the shell, the implementation of this technical solution is conducive to reducing the contamination of the ECG signal transmission line during the use of the device due to the extrusion and wear between different components, as well as pollutants in the environment in which the device is used. The ECG signal transmission line is more reliable, the adverse effect of the transmission line on the ECG signal transmission is smaller, and the test results of the device for the ECG signal are more accurate and stable.

In combination with the first aspect, in certain implementations of the first aspect, a first conductive film is deposited on an inner wall of the through hole, and the first conductive film is used to electrically connect the ECG electrode and the ECG signal processing module.

In combination with the first aspect, in some implementations of the first aspect, the first conductive film contains one or more of the following elements: chromium, titanium, aluminum, iron, indium or tin.

The conductive film may be made of one or more different materials so that the conductive film can achieve a conductive function.

This technical solution uses the conductive film deposited on the inner wall of the through hole to conduct the ECG electrode and the ECG signal processing module. By adjusting the diameter of the through hole, the area of the conductive film on the inner wall of the through hole can be adjusted. In addition, the conductive film on the inner wall of the through hole is not easily worn or contaminated, the ECG signal transmission line is more reliable, and the test results of the ECG signal are more accurate and stable.

In combination with the first aspect, in certain implementations of the first aspect, the through hole is filled with a filling medium, and the filling medium is used to electrically connect the ECG electrode and the ECG signal processing module.

This technical solution uses a filling medium to fill the through hole. Compared with the solution of coating the inner wall of the through hole, the process is simpler and is conducive to simplifying the production process of electronic equipment. In addition, the solution of filling the conductive medium in the through hole is more stable, which is conducive to improving the reliability of the ECG conduction circuit. Reliability.

In combination with the first aspect, in certain implementations of the first aspect, the filling medium is also used to seal the through hole.

In the present technical solution, a filling medium is used to seal the through hole, thereby preventing pollutants in the external environment of the device from entering the device through the through hole, reducing the impact of the opening of the through hole on the normal operation of components inside the device, and improving the reliability of the device operation.

In combination with the first aspect, in certain implementations of the first aspect, the filling medium includes one or more of the following: conductive silver paste, conductive gel, or conductive ceramic.

In combination with the first aspect, in certain implementations of the first aspect, a first protective film is deposited on the surface of the first conductive film, and the first protective film contains one or more of the following elements: chromium, titanium, aluminum, silicon, carbon, nitrogen, fluorine or niobium.

The protective film can be made of one or more different materials so that the protective film has better wear resistance, corrosion resistance, hardness and other properties than the conductive film.

The protective film may have better hardness, corrosion resistance and other properties than the conductive film. In the present technical solution, the protective film is deposited on the surface of the conductive film, which is beneficial to strengthen the protection of the conductive film and further improve the reliability of the ECG conduction circuit.

In combination with the first aspect, in some implementations of the first aspect, the first protective film is conductively connected to the first conductive film.

In this technical solution, the protective film is set as a conductor and is connected to the conductive film, which is beneficial to enhancing the conductive performance of the conductive film and improving the connectivity between the through-hole electrical connection ECG signal detection module and the ECG signal processing module.

In combination with the first aspect, in certain implementations of the first aspect, a transition layer is arranged between the first conductive film and the first protective film, the transition layer is fixedly connected to the first conductive film and the first protective film respectively, and the transition layer contains one or more of the following elements: chromium, titanium or aluminum.

In the present technical solution, a transition layer is arranged between the conductive film and the protective film, and the transition layer is fixedly connected to the conductive film and the protective film respectively, which is beneficial to enhancing the bonding force between the conductive film and the protective film, preventing the conductive film and the protective film from detaching, and improving the reliability of the through hole during ECG signal transmission.

In combination with the first aspect, in some implementations of the first aspect, the transition layer is respectively conductively connected to the first conductive film and the first protective film.

In the present technical solution, the transition layer is connected to the conductive film and the protective film respectively, which is beneficial to further enhance the conductive effect of the conductive film on the ECG signal and reduce the adverse effect of the ECG conductive line on the ECG signal conduction.

In combination with the first aspect, in certain implementations of the first aspect, the ECG electrode includes a second conductive film and a second protective film, the second conductive film is deposited on the outer surface of the cover body, and the second protective film is deposited on the second conductive film; wherein the second conductive film and the first conductive film are made of the same material, and the second protective film and the first protective film are made of the same material.

In the technical solution, the ECG electrode can be composed of a second conductive film and a second protective film, and the second protective film is made of the same material as the first protective film, and the second conductive film and the second protective film are made of the same material. In the actual production process, the first conductive film and the second conductive film can be processed in the same process using the same technology, and the first protective film and the second protective film can also be processed in the same process using the same technology, which is conducive to simplifying the preparation process of the back cover and improving the production efficiency of electronic equipment.

In combination with the first aspect, in certain implementations of the first aspect, a third conductive film is deposited on the inner surface of the cover body, the third conductive film is connected to the through hole, and the electronic device also includes conductive silicone, which is used to connect the third conductive film and the ECG signal processing module.

In combination with the first aspect, in some implementations of the first aspect, the third conductive film and the second conductive film are made of the same material.

In the present technical solution, the connection point between the back side of the back cover and the ECG signal processing module is set as a conductive film. When the conductive film and the conductive film on the front side of the back cover are made of the same material, the back cover can be processed in the same process using the same process to obtain the ECG electrode and the third conductive film, which is conducive to further simplifying the back cover processing process and improving the production efficiency of electronic equipment.

In combination with the first aspect, in some implementations of the first aspect, a diameter of the through hole ranges from 0.1 mm to 1.0 mm.

The diameter range of the through hole is 0.1 mm to 1.0 mm, which means that the diameter of the through hole can be 0.1 mm or 1.0 mm, or a size between 0.1 mm and 1.0 mm.

In combination with the first aspect, in some implementations of the first aspect, the electronic device is a bracelet or a watch.

In a possible implementation, the electronic device further includes a display screen, which is used to display the processing result of the ECG signal processing module.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic functional block diagram of a wearable device provided in an embodiment of the present application.

FIG2 is a schematic diagram of a wearable device provided in an embodiment of the present application.

FIG. 3 is a schematic diagram of an AA cross-section of the wearable device in FIG. 2 .

FIG. 4 is a schematic diagram of the outer surface of the rear shell of the wearable device in FIG. 2 .

FIG5 is a schematic diagram of the inner surface of the rear shell of the wearable device in FIG2 .

FIG. 6 is a schematic cross-sectional view of a through hole of the rear housing in FIG. 3 .

FIG. 7 is another schematic cross-sectional view of a through hole of the rear housing in FIG. 3 .

FIG. 8 is a schematic cross-sectional view of another through hole of the rear housing in FIG. 3 .

FIG. 9 is a schematic cross-sectional view of another through hole of the rear housing in FIG. 3 .

FIG. 10 is a schematic cross-sectional view of another through hole of the rear housing in FIG. 3 .

FIG. 11 is a schematic diagram of a back cover processing process provided in the present application.

FIG. 12 is a schematic diagram of another back cover processing process provided in an embodiment of the present application.

FIG. 13 is a schematic diagram of another back cover processing process provided in an embodiment of the present application.

Detailed ways

The technical solution in this application will be described below in conjunction with the accompanying drawings.

The embodiments of the present application are described in detail below, and examples of the embodiments of the present application are shown in the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

The terms "first", "second", "third", "fourth", etc. (if any) in this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the application described herein can be implemented in orders other than those illustrated or described herein.

Unless otherwise defined, the technical terms or scientific data used in this application shall have the usual meanings understood by persons with ordinary skills in the technical field to which this application belongs. In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing this application and simplifying the description, and do not indicate or indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

In order to make the technical problems solved by the present application, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments.

FIG1 is a schematic functional block diagram of a wearable device 1000 provided in an embodiment of the present application. Exemplarily, the wearable device 1000 may be a smart watch or a smart bracelet, etc. Referring to FIG1 , exemplarily, the wearable device 1000 may include a processor 110, an input device 120, a sensor module 130, a memory 160, and a power supply module 170. It is to be understood that the components shown in FIG1 do not constitute a specific limitation on the wearable device 100, and the wearable device 100 may also include more or fewer components than shown in the figure, or combine certain components, or split certain components, or arrange the components differently.

The processor 110 may include one or more processing units, for example: the processor 110 may include an application processor (application processor, AP), a modem processor, a graphics processor (graphics processing unit, GPU), an image signal processor (image signal processor, ISP), a controller, a memory, a video codec, a digital signal processor (digital signal processor, DSP), a baseband processor, and/or a neural-network processing unit (neural-network processing unit, NPU), etc. Among them, different processing units can be independent devices or integrated in one or more processors. Among them, the controller can be the nerve center and command center of the wearable device 1000. The controller can generate an operation control signal according to the instruction opcode and the timing signal to complete the control of fetching and executing instructions. In other embodiments, a memory can also be set in the processor 110 for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory can save instructions or data that the processor 110 has just used or circulated. If the processor 110 needs to use the instruction or data again, it can be directly called from the memory, avoiding repeated access, reducing the waiting time of the processor 110, and thus improving the efficiency of the wearable device 100.

The input device 120 is used to provide user input and can be a mechanical device. The user touches the input device 120, causing the input device 120 to rotate, translate or tilt to implement user input, so as to realize functions or operations such as starting the wearable device 1000 (for example, turning on or off), determining or adjusting signals (for example, adjusting the volume), etc.

The sensor module 130 may include one or more sensors, for example, a PPG sensor 130A, a pressure sensor 130B, a fingerprint sensor 130C, a capacitive sensor 130D, an acceleration sensor 130E, an ambient light sensor 130F, a proximity light sensor 130G, a touch sensor 130H, etc. It should be understood that FIG. 1 only lists several examples of sensors. In actual applications, the wearable device 100 may also include more or fewer sensors, or use other sensors with the same or similar functions to replace the above-listed sensors, etc., which is not limited in the embodiments of the present application.

In some embodiments, the sensor module 130 can detect user input from the input device 120 and respond to the user input to implement functions or operations such as starting, determining, and adjusting signals.

The PPG sensor 130A can be used to detect heart rate, that is, the number of heartbeats per unit time. In some embodiments, the PPG sensor 130A may include a light transmitting unit and a light receiving unit. The light transmitting unit can irradiate a light beam into a human body (such as a blood vessel), and the light beam is reflected/refracted in the human body, and the reflected/refracted light is received by the light receiving unit to obtain a light signal. Since the light transmittance of the blood changes during the fluctuation process, the emitted/refracted light changes, and the light signal detected by the PPG sensor 130A also changes. The PPG sensor 130A can convert the light signal into an electrical signal and determine the heart rate corresponding to the electrical signal. In an embodiment of the present application, the PPG sensor 130A can be disposed in the input device 120 or in the housing 180, and the function of PPG detection can be realized by the light signal detected by the PPG sensor 130A.

The pressure sensor 130B can be used to detect the pressure value between the human body and the wearable device 1000. The pressure sensor 130B is used to sense the pressure signal and can convert the pressure signal into an electrical signal. There are many types of pressure sensors 130B, such as resistive pressure sensors, inductive pressure sensors, capacitive pressure sensors, etc., which are not limited in the embodiment of the present application. In the embodiment of the present application, a plurality of pressure sensors 130B may be provided on the input device 120, and the rotation of the input device 120 is identified by the signal difference between adjacent pressure sensors 130B among the plurality of pressure sensors 130B.

The capacitive sensor 130D can be used to detect the capacitance between two electrodes to achieve specific functions.

In some embodiments, the capacitive sensor 130D can be used to detect the capacitance between the human body and the wearable device 100. The capacitance can reflect whether the contact between the human body and the wearable device is good, and can be applied to electrocardiography (ECG) detection, in which the human body can be used as an electrode. When the capacitive sensor 130D is set on the electrode on the wearable device, the capacitive sensor 130D can detect the capacitance between the human body and the electrode. When the capacitance detected by the capacitive sensor 105D is too large or too small, it means that the contact between the human body and the electrode is poor; when the capacitance detected by the capacitive sensor 130D is moderate, it means that the contact between the human body and the electrode is good. Since whether the contact between the human body and the electrode is good will affect the electrode detection electrical signal, and then affect the generation of ECG, the wearable device 1000 can refer to the capacitance detected by the capacitive sensor 130D when generating ECG.

The memory 160 can be used to store computer executable program codes, which include instructions. The processor 110 executes various functional applications and data processing of the wearable device 1000 by running the instructions stored in the memory. The memory 160 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one disk storage device, a flash memory device, a universal flash storage (UFS), etc., which is not limited in the embodiments of the present application.

The power supply module 170 can supply power to various components in the wearable device 100, such as the processor 110, the sensor module 130, etc. In some embodiments, the power supply module 170 can be a battery or other portable power element. In other embodiments, the wearable device 1000 can also be connected to a charging device (for example, via a wireless or wired connection), and the power supply module 170 can receive the power input by the charging device to store power in the battery.

In some embodiments, with continued reference to FIG. 1 , the wearable device 100 further includes a display screen 140. The display screen 140 includes a display panel. The display panel may be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), Miniled, MicroLed, Micro-oLed, a quantum dot light-emitting diode (QLED), etc. In some embodiments, a touch sensor may be provided in the display screen to form a touch screen, which is not limited in the embodiments of the present application. It is understood that in some embodiments, the wearable device 1000 may include the display screen 140 or may not include the display screen 140. For example, when the wearable device 1000 is a bracelet, it may include a display screen or not include a display screen. When the wearable device 1000 is a watch, it may include a display screen.

In addition, the wearable device 1000 may have a wireless communication function. In some embodiments, referring to FIG. 1 , the wearable device 1000 may have a wireless communication function. The wearable device 100 may further include a wireless communication module 191, a mobile communication module 192, one or more antennas 1, and one or more antennas 2. The wearable device 100 may implement wireless communication functions through the antenna 1, the antenna 2, the wireless communication module 191, and the mobile communication module 192.

Electrocardiogram measurement is a method of recording the electrophysiological activity of the heart in units of time. This method uses electrodes (or ECG electrodes) attached to the surface of human skin to detect changes in the potential of the heart. Generally, ECG electrodes need to be close to the skin so that the ECG electrodes can detect ECG signals and draw an electrocardiogram. The amplitude of the ECG signal is generally only a few millivolts, and the frequency is generally not more than a few hundred hertz. After the ECG signal is detected by the ECG electrode, the ECG electrode will transmit the ECG signal to the test equipment for further processing. The impedance of the ECG electrode in contact with the skin is a contact noise that affects the detection of ECG signals. The line that transmits the signal from the ECG electrode to the ECG signal processing module will also affect the processing of the ECG signal.

FIG2 is a schematic diagram of the structure of a wearable device 1000 provided in an embodiment of the present application. The wearable device 1000 may be a bracelet, a watch or other types of electronic devices. For ease of description, the following embodiments are described by taking the wearable device 1000 as a watch as an example. It should be understood that the following exemplary description should not be regarded as a limitation on the present application.

The wearable device 1000 may include a watch head 200 and a watch strap 300, wherein the watch strap 300 is connected to the watch head 200 and can be used to wear the watch head 200 on the wrist of the user. In some examples, the tightness of the watch head 200 in contact with the user's skin can be adjusted by adjusting the tightness of the watch strap 300, so that the aforementioned ECG electrodes can be in contact with the user's skin.

The header 200 may include a processor 110, an input device 120, a sensor module 130, and a display screen 140, which are included in the wearable device 1000 in FIG. 1. The wearable device 1000 may use one or more of these components to detect and process the user's physiological health data. Exemplarily, the input device 120 may be used to obtain the user's indication information, and the processor 110 may process the indication information and call one or more sensors in the sensor module 130 to measure the user's electrocardiogram.

Fig. 3 is a schematic diagram of the AA cross-section of the meter head 200. The meter head 200 may include a display screen 140, a power supply module 170, a housing 210, a circuit board 220 and a back cover 230. The functions of the display screen 140 and the power supply module 170 have been introduced above, and will not be repeated here for the sake of brevity.

The housing 210 can form a cavity with the back cover 230, and the cavity can be used to accommodate the display screen 140, the circuit board 220, the power supply module 170 and other functional components. The circuit board 220 can carry one or more electronic components, and the circuit board 220 can be used to process data and information acquired by the wearable device 1000. For example, the circuit board 220 can receive and process ECG signals to generate an electrocardiogram of the user. The circuit board 220 as a whole or all or part of the electronic components on the circuit board 220 can be referred to as an ECG signal processing module. In other words, the ECG signal processing module may include one or more electronic components on the circuit board 220.

The back cover 230 may be composed of multiple components. For example, the back cover 230 may include a central portion and an edge portion. The materials of different components on the back cover 230 may be different, and the materials of different components may be determined according to the functions of different components. For example, the back cover 230 includes a central portion, which may be made of glass. A light-emitting element may be disposed in the watch head 200, and the light emitted by the light-emitting element may be transmitted to the outside of the watch head 200 through the glass material. For another example, the back cover 230 includes an edge portion, which is used to provide a protective function for the glass material located in the central portion, and the edge portion may be made of a metal material.

One or more through holes 233 may be provided on the back cover 230. For example, two through holes 233, 233A and 233B, may be provided on the back cover 230. Conductive materials may be provided in the through holes 233A and 233B. The conductive materials may be used to electrically connect the ECG detection circuit. In other words, the conductive materials provided in the through holes 233 may be used to electrically connect the ECG signal processing module in the cavity and the ECG signal detection module outside the cavity, thereby enabling the wearable device 1000 to detect the user's electrocardiogram. The following embodiments describe this part in detail in conjunction with the structure of the back cover 230.

FIG4 is a schematic diagram of the front side (or outer surface, i.e., the side in contact with the user's skin) of the back cover 230. The back cover 230 includes a substrate 231, on which a second conductive film 232 can be deposited. The second conductive film 232 can include a plurality of components, which can be distributed in different areas on the front side of the back cover 230. These areas may be interconnected or not. The interconnected areas can simplify the processing technology of the back cover 230, and by setting a plurality of areas not to be interconnected, different functions can be set for different areas, which is conducive to improving the accuracy of the ECG test results. In addition, different parts (areas) can have different shapes.

In some examples, the second conductive film 232 may include a first portion 232A and a second portion 232B, and the shapes of the first portion 232A and the second portion 232B may be half a ring, etc. The first portion 232A and the second portion 232B are not connected. The first portion 232A and the second portion 232B may be symmetrically arranged around the geometric center of the back cover 230.

The second conductive film 232 can be in contact with the user's skin, and part or all of the second conductive film 232 can be used as a test electrode of an ECG test circuit, that is, an ECG electrode. The ECG electrode can be used to detect the ECG signal of the user's body, and the ECG electrode can also be called The second conductive film 232 includes a first portion 232A and a second portion 232B, one of the first portion 232A and the second portion 232B can be regarded as a reference electrode of the ECG electrode, and the other can be regarded as a measurement electrode of the ECG electrode. The provision of the reference electrode and the measurement electrode is conducive to improving the accuracy of the ECG signal measurement result.

4 , a through hole 233 may be formed on the back cover 230 , and the through hole 233 may be connected to the second conductive film 232 and used to electrically connect the ECG signal detection module and the ECG signal processing module.

The through hole 233 can be provided in the area where the conductive film is deposited on the back cover 230, so as to shorten the length of the line connecting the through hole 233 and the conductive film. Alternatively, the through hole 233 can also be provided in the area where the conductive film is not deposited on the back cover 230. In this case, a conductive line needs to be provided between the conductive film and the through hole 233 to electrically connect the through hole 233 and the conductive film.

In some embodiments, as shown in FIG3 , a first conductive film 240 (this part of the content is further described below) may be deposited on the inner wall of the through hole 233, and the first conductive film 240 may be used to electrically connect the ECG electrode and the ECG signal processing module in the cavity. The number of the through holes 233 may be one or more, and the aperture of the through hole 233 may be determined according to the processing technology and the ECG test requirements. For example, in order to reduce the influence of the ECG signal transmission line on the ECG signal transmission, the aperture of the through hole 233 may be appropriately increased. The larger the aperture of the through hole 233, the larger the area of the inner wall of the through hole 233, the larger the area of the corresponding first conductive film 240, the smaller the resistance on the circuit caused by the through hole 233, the smaller the influence of the ECG signal transmission line on the result of ECG signal transmission, and the higher the accuracy of the ECG test.

In some examples, the number of the through holes 233 is two, namely, the first through hole 233A and the second through hole 233B, and one end port of the first through hole 233A and the second through hole 233B can be opened at the position where the second conductive film 232 is deposited on the outer surface of the back cover 230. For example, the first through hole 233A and the second through hole 233B can be opened at one end adjacent to the first part 232A and the second part 232B, respectively. Thereby, the connecting line for electrically connecting the first through hole 233A and the second through hole 233B can be shortened, which is conducive to reducing the interference of the connecting line on the ECG test signal, and is conducive to reducing the influence of the ECG signal transmission line on the ECG test result.

A first conductive film 240 may be deposited on the inner wall of the first through hole 233A and the inner wall of the second through hole 233B. The first conductive film 240 and the second conductive film 232 may be made of the same material or by the same process.

The first conductive film 240 and the second conductive film 232 can be connected to each other, so that the ECG signal detected by the ECG electrode can be conducted to the ECG signal processing module in the cavity through the first conductive film 240 and the second conductive film 232. For example, the second conductive film 232 includes a first part 232A and a second part 232B, wherein the first part 232A is the positive electrode of the ECG electrode, and the second part 232B is the negative electrode of the ECG electrode. The back cover 230 is provided with a first through hole 233A and a second through hole 233B, the first conductive film 240 on the inner wall of the first through hole 233A and the first part 232A of the second conductive film 232 are connected, and the first conductive film 240 on the inner wall of the second through hole 233B is connected to the second part 232B of the second conductive film 232.

Referring to FIG. 5 , the inner surface (the reverse side, i.e., the side not in contact with the user, or the side close to the cavity) of the back cover 230 and the area connected to the through hole 233 may be respectively deposited with a third conductive film 234. In the case where the through hole 233 includes a first through hole 233A and a second through hole 233B, the area where the third conductive film 234 is deposited on the reverse side of the back cover 230 may be divided into a third area and a fourth area. In other words, the third conductive film 234 may include a third portion 234A and a fourth portion 234B, the third portion 234A is located in the third area on the reverse side of the back cover 230, and the fourth portion 234B is located in the fourth area on the reverse side of the back cover 230.

The third portion 234A and the fourth portion 234B may have a variety of shapes, and the shapes of the third portion 234A and the fourth portion 234B may be the same or different. For example, the third portion 234A and the fourth portion 234B may be one eighth of a ring. The third portion 234A and the fourth portion 234B may not be connected to each other.

The third conductive film and the aforementioned second conductive film 232 may be made of the same material, and the third conductive film 234 may also be made of the same process as the second conductive film 232 .

In conjunction with FIG. 5 and FIG. 3 , a first conductor 221A and a second conductor 221B may also be provided in the meter head 200. The first conductor 221A and the second conductor 221B may be rod-shaped. One end of the first conductor 221A contacts and conducts with the third portion 234A, and the other end of the first conductor 221A may contact and conduct with the first contact on the circuit board 220. One end of the second conductor 221B contacts and conducts with the fourth portion 234B, and the other end of the second conductor 221B may contact and conduct with the second contact on the circuit board 220. An ECG signal processing module for processing, receiving and processing ECG signals may be connected between the first contact and the second contact on the circuit board 220, and the ECG signal processing module may include one or more chips, one or more components, etc.

Combined with the above statements about the ECG test circuit, in the process of detecting the ECG signal of the user's body, the ECG signal is detected by the ECG electrode and can be transmitted to the ECG signal processing module through the second conductive film 232, the conductive material set in the through hole 233, the third conductive film 234 and the conductor 221. By adjusting the transmission line of the ECG signal, or in other words, by adjusting the second conductive film 232, The conductive material disposed in the through hole 233 , the third conductive film 234 , the conductor 221 , and the connection parts between different parts may affect the ECG signal received by the ECG signal processing module to a certain extent.

By opening a through hole on the back cover 200 and using the through hole to connect the ECG test circuit, it is helpful to shorten the length of the ECG test circuit and reduce the impact of the connection between different parts of the circuit and adjacent parts of the circuit on the ECG test result. The circuit located at the through hole position connecting the front and back sides of the back cover is not easily interfered by external factors (such as corrosion from skin sweat). The implementation of this technical solution is conducive to improving the stability and reliability of the ECG test results.

6 to 10 are BB cross-sectional views of the rear cover 230 at the position of the through hole 233 in FIG. 5 . The structure of the through hole 233 will be further described below in conjunction with FIGS. 6 to 10 .

FIG. 6 shows a possible structure of a through hole 233, in which the through hole 233 is provided on the substrate 231 of the back cover 230, and the substrate 231 may be an insulator, such as glass, ceramic or other non-metallic materials. The through hole 233 may be obtained by processing the substrate 231 by laser processing, computer numerical control (CNC) machine tool processing or other processing methods. The aperture of the through hole 233 ranges from 0.1 mm to 1.0 mm, for example, the diameter of the through hole 233 may be 0.2 mm, 0.4 mm or 0.8 mm, etc.

A conductive film may be deposited on the inner wall of the through hole 233 and the front and back surfaces of the rear cover 230, and the conductive film may contain one or more of the following elements and compounds: chromium (Cr), titanium (Ti), aluminum (Al), iron (Fe), indium (In) or tin (Sn), etc. For example, the conductive film may include elemental iron, aluminum oxide, In2O3 and SnO2.

The thickness of the conductive film on the surface of the rear cover 230 and the inner wall of the through hole 233 may be the same or different. The thickness of the conductive film on the front and/or back of the rear cover 233 ranges from 50nm to 200nm, that is, the thickness of the second conductive film 232 and the third conductive film 234 ranges from 50nm to 200nm. For example, the thickness of the second conductive film 232 may be 100nm or 150nm. The thickness of the conductive film deposited on the inner wall of the through hole 233 may range from 300nm to 1500nm, that is, the thickness of the first conductive film 240 may range from 300nm to 1500nm. For example, the thickness of the first conductive film 240 may be 600nm or 900nm, etc.

Depositing the same conductive film on the inner surface, outer surface and inner wall of the through hole 233 of the back cover 230 is beneficial to simplifying the processing process of the back cover 230 and improving the production efficiency of the back cover 230 .

In some embodiments, as shown in FIG. 7 , a protective film may also be deposited on the conductive film, and the protective film may be deposited on the conductive film (i.e., the first conductive film 240) at the inner wall position of the through hole 233, or may be deposited on the conductive film (i.e., the second conductive film 232 and/or the third conductive film 234) deposited on the front and/or back of the back cover 230. For example, the protective film is deposited on the conductive film at the first part 233A, the second part 233B, and the inner wall position of the through hole 233. The protective film located on the front of the back cover 230 may be referred to as the second protective film 242, and the protective film located at the inner wall position of the through hole 233 may be referred to as the first protective film 241. For another example, the protective film may be deposited on the first part 233A, the second part 233B, the third part 234A, the fourth part 234B, and the inner wall of the through hole 233. The area of the protective film deposition may be the same as the area of the conductive film, or may be different from the area of the conductive film.

The protective film may contain one or more of the following elements and compounds: chromium (Cr), titanium (Ti), aluminum (Al), silicon (Si), carbon (C), nitrogen (N), fluorine (F) and niobium (Nb), etc. For example, the protective film may include aluminum oxide, SiO2 and elemental carbon, etc. The thickness of the protective film may range from 500nm to 1000nm, for example, the thickness of the protective film may be 600nm or 800nm. The protective film may be formed by a process of physical vapor deposition (PVD) magnetron sputtering coating priming combined with chemical vapor deposition (CVD) atmosphere growth crystallization.

The protective film can be a conductor or an insulator. Setting the protective film as a conductor is beneficial to improving the conductivity of the ECG electrode and is more conducive to detecting ECG signals. In the case where the protective film is a conductor, the area of the protective film can be consistent with the area of the conductive film, or in other words, the protective film can be set on the same area of the conductive film, which is beneficial to the processing of the back cover.

In some examples, as shown in FIG8 , the protective film is a conductor, and only the protective film is deposited on the front side of the back cover 230, and a conductive film is deposited on the back side of the back cover 230. No conductive film or protective film is deposited on the inner wall of the through hole 233, and the through hole 233 is filled with a conductive medium 235. The ECG signal detection module and the ECG signal processing module on both sides of the back cover 230 can be connected through the conductive medium 235 filled in the through hole 233.

Filling the through hole 233 with a conductive medium 235 is beneficial to improving the connectivity between the conductive film on the inner surface and the conductive film on the outer surface of the back cover 230, which is beneficial to reducing the interference of the ECG conduction line on ECG signal detection and improving the accuracy of ECG test results.

In other examples, as shown in FIG. 9 , the protective film is a conductor, and a conductive film is deposited on the front and back surfaces of the rear cover 230 and the inner wall of the through hole 233. A protective film is also deposited at the positions where the conductive film is deposited on the front surface of the rear cover 230 and the inner wall of the through hole 233. The protective film can be The ECG signal detection module and the ECG signal processing module on both sides of the rear cover 230 can be connected through the conductive medium filled in the through hole 233, the conductive film on the inner wall of the through hole 233 and the protective film on the conductive film.

The constituent material of the protective film may be different from that of the conductive film. The hardness, wear resistance, and corrosion resistance of the protective film may be better than those of the conductive film. The deposition of the protective film on the conductive film is beneficial to reducing the wear and corrosion of the conductive film during the use of the equipment.

In other embodiments, as shown in Figures 8 to 10, the interior of the through hole 233 can be filled with a filling medium 235, which can be one or more of conductive silver paste, conductive gel, conductive ceramic and the like. The filling medium 235 can be filled into the through hole 233 from the opening of the through hole 233 on the front side of the back cover 230, or can be filled into the through hole 233 from the opening of the through hole 233 on the reverse side of the back cover 230. In some examples, the filling medium 235 can also seal the through hole 233 to prevent pollutants such as liquids and dust in the external environment from entering the cavity. The through hole 233 can also connect the ECG electrodes and the ECG signal processing module at both ends of the through hole 233 using the conductive film deposited on the inner wall and the filling medium 235 filled in the through hole 233.

In some other embodiments, the interior of the through hole 233 may be filled with a sealant, which may be a sealant glue, which may be a hydrophobic material, and the sealant may seal the through hole 233 to achieve the purpose of waterproofing and dustproofing. In some examples, the sealant may be an insulating material, and the through hole 233 may be electrically connected to the ECG electrodes and the ECG signal processing module on both sides of the through hole through the conductive film on the inner wall of the through hole.

Filling the filling medium 235 in the through hole 233 can prevent pollutants (such as dust, sweat, etc.) in the external environment of the wearable device 1000 from entering the wearable device 1000 through the through hole 233 to adversely affect the electronic components in the meter head 200. On the other hand, the filling medium 235 can also play a certain protective role on the conductive film and protective film on the inner wall of the through hole 233. In addition, when the filling medium 235 is a conductive material, filling the filling medium 235 can also enhance the conductivity of the conductive film inside and outside the back cover 230, which is beneficial to the conduction of ECG signals.

In some other embodiments, as shown in FIG10 , a transition layer 250 may be deposited between the conductive film and the protective film, and the transition layer 250 may be used to enhance the bonding force between the conductive film and the protective film. The transition layer 250 may contain a single substance or compound of an element common to the conductive film and the protective film (e.g., a single substance or compound of chromium, titanium, or aluminum). Exemplarily, when both the conductive film and the protective film contain the element chromium (Cr), the transition layer 250 may contain a single substance of chromium (Cr) or an oxide of the chromium element or other types of compounds of the chromium element. In some examples, the transition layer 250 may also be a conductive material, and the transition layer 250 may be used to electrically connect the conductive film and the protective film to enhance the conductivity between the two layers of the conductive film and the protective film.

By setting the transition layer 250, it is helpful to improve the bonding force between the conductive film and the protective film, prevent the conductive film and the protective film from separating from each other, improve the stability of the through hole 233 structure, and improve the reliability of the results of ECG testing using the through hole 233 to form a test circuit.

The following further describes the process flow of opening the through hole and preparing the conductive film.

FIG. 11 is a flow chart of a back cover processing process provided in an embodiment of the present application.

S111, processing through holes.

One or more through holes are opened on the back cover by laser processing, and the aperture of the through hole can range from 0.1 mm to 1.0 mm. In some examples, the back cover can be subjected to surface acid polishing after the laser processing step, that is, the surface of the back cover is polished using an acidic corrosive liquid of a certain concentration. In other examples, the back cover can also be subjected to edge chamfering during the through hole processing step.

S112, ECG coating shielding.

Specifically, an acid- and alkali-resistant ink is pad-printed on the area on the back cover that does not need to be coated to protect this area. After pad printing the ink, the position on the back cover that needs to be coated can be plated. In some examples, a specific coating hanger can be designed so that the front and back of the back cover can be plated at the same time to improve the efficiency of coating.

S113, through hole plating.

Specifically, a conductive film may be plated on the inner wall of the through hole by using a PVD process, and the conductive film may include one or more of the following elements and compounds: chromium (Cr), titanium (Ti), aluminum (Al), iron (Fe), indium (In) or tin (Sn), etc. The thickness of the conductive film may range from 300 nm to 1500 nm.

S114, stripping ink.

Specifically, the masking ink on the surface of the back cover is deplated using chemical agents. In some examples, the boundary of the coating area on the back cover can also be processed and trimmed using a laser engraving process.

S115, through-hole dispensing.

Specifically, a sealant is filled in the through hole using a dispensing process to prevent pollutants in the environment from entering the wearable device through the through hole. The sealant may be a sealing glue.

In the back cover processing step shown in FIG11 , after a through hole is opened on the back cover, the inner wall of the through hole and the front and back surfaces of the back cover are directly plated, and the through hole is sealed using a glue dispensing process, which is beneficial to improving the efficiency of the back cover processing and preventing pollutants outside the wearable device from entering the wearable device through the through hole.

FIG12 is another process flow chart of a back cover processing provided by an embodiment of the present application. Compared with the processing method shown in FIG10, the process shown in FIG12 fills the through hole with a conductive medium. The following is a detailed description.

S121, machining through holes.

S122, the through hole is turned on.

Specifically, conductive materials such as conductive gel, conductive silver paste, and conductive ceramics are filled in the through hole to achieve the purpose of connecting the ECG signal detection module and the ECG signal processing module at both ends of the through hole using the conductive material filled in the through hole.

S123, polished through holes.

Specifically, the overflowing portion of the conductive material filled in S112 or the area near the through hole is polished, for example, by using physical grinding polishing or chemical etching polishing or other processes.

S124, ECG coating shielding.

S125, ECG coating.

Specifically, a conductive film may be plated on different areas of the back cover by using a PVD process, and the conductive film may include one or more of the following elements and compounds: chromium (Cr), titanium (Ti), aluminum (Al), iron (Fe), indium (In) or tin (Sn), etc. The thickness of the conductive film may range from 300nm to 1500nm.

S126 stripping ink.

Specifically, the masking ink on the back cover is deplated using chemical agents. In some examples, the boundary of the coating area on the back cover can also be processed and trimmed using a laser engraving process.

In the back cover processing process shown in Figure 12, the conduction at both ends of the through-hole is achieved by filling the through-hole with conductive material. Compared with the method of plating a conductive film on the inner wall of the through-hole, the plating process in the back cover processing process is simplified, and the space for filling the conductive material in the through-hole is relatively large, which is beneficial to reduce the adverse effects of the ECG signal conduction line on the ECG signal conduction and improve the accuracy and reliability of the ECG test results.

Fig. 13 is a flowchart of another back cover processing process provided by an embodiment of the present application. In this process, a conductive film is plated on the inner wall of the through hole and a conductive material is filled at the same time.

S131, processing through holes.

S132, ECG coating shielding.

S133, through-hole plating.

Specifically, a conductive film may be plated on the inner wall of the through hole by using a PVD process, and the conductive film may include one or more of the following elements and oxides: chromium (Cr), titanium (Ti), aluminum (Al), iron (Fe), indium (In) or tin (Sn), etc. The thickness of the conductive film may range from 100 nm to 300 nm.

S134, through hole conduction.

Specifically, the through hole is filled with conductive materials such as conductive gel, conductive silver paste, and conductive ceramics to achieve the purpose of conducting the two ends of the through hole using the conductive material in the through hole.

S135, partial polishing.

S136, fill masking ink.

Since the coating area may be damaged during the S135 treatment process, the damaged or damaged area may be further coated again.

In some examples, the front side of the through hole back cover (the side with the ECG electrode) is partially polished in S135. In S136, masking ink can be pad printed on the area of the front side of the back cover that does not need to be coated, or some masking ink can be reprinted on the area where the masking ink is damaged or destroyed during the polishing process in S135.

S137, ECG coating.

The damaged parts of the coating area during the polishing process are coated again.

S138, stripping ink.

Specifically, chemical agents are used to de-plating the masking ink on the back cover. In some examples, laser engraving technology can also be used to process and trim the border of the plated area on the back cover.

In this back cover processing process, after the through hole is filled with conductive medium, the positions near the two ends of the through hole on the back cover are polished, and the coating area on the back cover that may be damaged during the processing is further coated again, which is beneficial to improve the reliability of the coating structure on both sides of the back cover, and is beneficial to further improve the stability and accuracy of the test ECG results of the wearable device.

The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

An electronic device (1000), characterized by comprising:

Housing (210);

A cover body (230), wherein the cover body (230) and the shell (210) enclose a cavity, wherein an electrocardiogram (ECG) signal processing module is accommodated in the cavity, and ECG electrodes are arranged on the outer surface of the cover body (230), and a through hole (233) is opened on the cover body (230), and the ECG electrodes and the ECG signal processing module are electrically connected through the through hole (233).
The electronic device (1000) according to claim 1 is characterized in that a first conductive film (240) is deposited on the inner wall of the through hole (233), and the first conductive film (240) is used to electrically connect the ECG electrode and the ECG signal processing module.
The electronic device (1000) according to claim 2, characterized in that the first conductive film (240) contains one or more of the following elements: chromium, titanium, aluminum, iron, indium or tin.
The electronic device (1000) according to any one of claims 1 to 3 is characterized in that the through hole (233) is filled with a filling medium (235), and the filling medium (235) is used to electrically connect the ECG electrode and the ECG signal processing module.
The electronic device (1000) according to claim 4 is characterized in that the filling medium (235) is also used to seal the through hole (233).
The electronic device (1000) according to claim 5, characterized in that the filling medium (235) comprises one or more of the following: conductive silver paste, conductive gel or conductive ceramic.
The electronic device (1000) according to claim 2 or 3 is characterized in that a first protective film (241) is deposited on the surface of the first conductive film (240), and the first protective film (241) contains one or more of the following elements: chromium, titanium, aluminum, silicon, carbon, nitrogen, fluorine or niobium.
The electronic device (1000) according to claim 7, characterized in that the first protective film (241) is conductively connected to the first conductive film (240).
The electronic device (1000) according to claim 8 is characterized in that a transition layer (250) is arranged between the first conductive film (240) and the first protective film (241), and the transition layer (250) is fixedly connected to the first conductive film (240) and the first protective film (241), respectively, and the transition layer (250) contains one or more of the following elements: chromium, titanium or aluminum.
The electronic device (1000) according to claim 9, characterized in that the transition layer (250) is electrically connected to the first conductive film (240) and the first protective film (241) respectively.
The electronic device (1000) according to claim 10, characterized in that the ECG electrode comprises a second conductive film (232) and a second protective film (242), the second conductive film (232) being deposited on the outer surface of the cover (230), and the second protective film (242) being deposited on the second conductive film (232);

The second conductive film (232) and the first conductive film (240) are made of the same material, and the second protective film (242) and the first protective film (241) are made of the same material.
The electronic device (1000) according to claim 11 is characterized in that a third conductive film (234) is deposited on the inner surface of the cover body (230), and the third conductive film (234) is conductively connected to the through hole (233); the electronic device (1000) further includes a conductive silicone (221), and the conductive silicone (221) is used to electrically connect the third conductive film (234) and the ECG signal processing module.
The electronic device (1000) according to claim 12, characterized in that the third conductive film (234) and the second conductive film (232) are made of the same material.
The electronic device (1000) according to any one of claims 1 to 3, characterized in that the diameter of the through hole (233) ranges from 0.1 mm to 1.0 mm.
The electronic device (1000) according to any one of claims 1 to 3, characterized in that the electronic device (1000) is a bracelet or a watch.