CN115477847B - Composition, and preparation method and application thereof - Google Patents
Composition, and preparation method and application thereof Download PDFInfo
- Publication number
- CN115477847B CN115477847B CN202210827748.3A CN202210827748A CN115477847B CN 115477847 B CN115477847 B CN 115477847B CN 202210827748 A CN202210827748 A CN 202210827748A CN 115477847 B CN115477847 B CN 115477847B
- Authority
- CN
- China
- Prior art keywords
- composition
- adopting
- deionized water
- volume fraction
- aqueous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to a composition comprising: tetramethyl ammonium hydroxide, aqueous polyimide, aqueous epoxy resin, aqueous glycoluril resin, aqueous functional additive and nano directional super dispersant; the application of the composition in the preparation of circuit boards comprises the step of carrying out surface treatment on a substrate by adopting the composition; when the composition is used for preparing the superfine precise circuit board, the yield can be improved, and the scrappage can be reduced.
Description
Technical Field
The invention relates to the technical field of circuit board surface treatment, in particular to a composition, a preparation method and application thereof.
Background
The addition of chemical nickel on nonmetallic materials, especially circuit board base materials such as polyimide or/and FR4 (epoxy resin+glass fiber) has no corresponding application, mainly because the chemical nickel cannot meet the performance requirements of 288 ℃ for 10 seconds, 3 times of thermal shock, surface tension after aging and the like; at present, a Japanese chemical copper layering method used in the circuit board IC carrier industry is mainly applied to the inner layer and the secondary inner layer of the circuit board, namely various epoxy resin surfaces such as ABF, BT and the like, but cannot be applied to the outer layer of FR 4; and chemical copper is a strongly alkaline system, which has serious damage to mechanical properties of the polyimide.
Therefore, there is a need for a composition that meets all the performance requirements while simultaneously achieving both the principal materials of polyammonium imide and FR 4.
Disclosure of Invention
The invention aims at overcoming the defects in the prior art and provides a composition, a preparation method and application thereof.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
in a first aspect, the present invention provides a composition comprising: tetramethyl ammonium hydroxide, aqueous polyimide, aqueous epoxy resin, aqueous glycoluril resin, aqueous functional additive and nano directional super dispersant;
wherein the aqueous functional additive comprises a compound of formula (I):
R 1 selected from-H or-CH 3 ；R 2 Selected from-C n H 2n+1 ，n∈[0,50]；R 3 Selected from-C n'+3y H 2n'+4y ，n'∈[3,500]，y∈[1,20]，z∈[1,20]，Y＝Z；R 4 Selected from-C n” H 2n” (EO) n”' (PO) n”” H，n”∈[0,50]EO represents ethylene oxide, n' [1,50 ]]PO represents propylene oxide, n "" ∈1,50]；m∈[0,10000]；m 1 ∈[0,10000]；m 2 ∈[1,1000]；m 3 ∈[0,10000]；
Wherein the nano-directional dispersant comprises a compound as shown in formula (II):
r is selected from-C n””' H 2n””' ，n””'∈[1,50]；R 1 Selected from-H or-CH 3 ；M 1 M is as follows 2 Independently selected from H + 、[NH 4 ] + Or metal ions (e.g. Na + )；x∈[1,100]；x 1 ∈[1,100]；x 2 ∈[0,50]；x 3 ∈[1,100]。
Preferably, n'. Epsilon.5,100.
More preferably, n'. Epsilon. [6,20].
Preferably, m 1 ∈[0,8000]。
More preferably, m 1 ∈[1,2000]。
Preferably, m 2 ∈[3,800]。
More preferably, m 2 ∈[4,600]。
Most preferably, m 2 ∈[5,500]。
In a second aspect, the present invention provides a process for the preparation of a composition as described above, comprising the steps of:
adding pure water to a reaction kettle until the pure water accounts for 30% of the volume fraction of the reaction kettle, sequentially adding tetramethyl ammonium hydroxide with the final volume fraction of 10% -40%, aqueous polyimide with the final volume fraction of 2% -5%, aqueous epoxy resin with the final volume fraction of 2% -5%, aqueous glycoluril resin with the final volume fraction of 0.5% -2%, aqueous functional additive with the final volume fraction of 0.5% -2% and nano directional super dispersant with the final volume fraction of 0.1% -1.0%, and adding pure water to the liquid level of the reaction kettle; stirring for 4 hours, standing for 1 hour, and filtering to obtain the composition.
In a third aspect, the present invention provides a use of a composition as described above in the preparation of a circuit board, the process of the preparation comprising selecting a substrate and sequentially subjecting the substrate to:
cleaning ring opening, overflow water washing, coarsening, overflow water washing, neutralizing, overflow water washing, performing surface treatment by adopting the composition, overflow water washing, catalysis, overflow water washing, accelerating treatment, overflow water washing, adding chemical nickel, water washing and baking crosslinking.
Wherein the base material is selected from one or more of PI (polyimide), epoxy resin, BT, ABF or a soft and hard combination board.
Wherein the cleaning ring-opening is to adopt a surface treating agent for cleaning dirt or attachments on the surface of the substrate to carry out surface basic treatment.
Wherein, overflow water washing is carried out by adopting deionized water for two times.
Wherein, the coarsening is coarsening by adopting potassium permanganate and sodium hydroxide.
Wherein the neutralization is performed by sulfuric acid and hydrogen peroxide.
Wherein the surface treatment is to soak the circuit board in the aqueous solution of the composition for 4min-7min at 45-55 ℃; the volume fraction of the aqueous solution of the composition is 65% -85%.
Wherein the catalysis is carried out by adopting a catalyst.
Wherein, the chemical nickel added in the chemical nickel is chemical nickel boron alloy (and the content of nickel in the crystal is more than 99 percent and the content of boron is less than 1 percent).
Wherein the water washing is sequentially deionized water washing, hot deionized water washing and deionized water washing.
Compared with the prior art, the invention has the following technical effects:
the tetramethylammonium hydroxide in the composition of the present invention is an organic base and is essentially non-aggressive to the substrate, especially for polyimide substrates; the water-based polyimide, the water-based glycoluril resin and the water-based epoxy resin are used as a temperature unloading layer and are the same as the nano directional super-dispersing agent, so that organic matter lamination can be effectively prevented; the aqueous functional additive contains functional group monomers containing double bonds such as acrylic ester, methacrylic ester, styrene and the like, and also contains functional group monomers containing nitrogen or/and oxygen atoms such as acrylic acid, methacrylic acid, allyl and the like, so that better adhesiveness is provided for the composition, and the substrate and the catalyst can be effectively adsorbed; therefore, when the superfine precise circuit board is prepared, the yield can be improved, and the scrappage is reduced.
Drawings
FIG. 1 is an SEM image of a precision circuit obtained by the circuit board manufacturing process of the present invention;
FIG. 2 is a graph showing the results of thermal shock testing of the circuit board prepared in example 3;
wherein, the graph (a) is a soft circuit board, and the graph (b) is a hard circuit board;
FIG. 3 is a view showing a duct section of a circuit board obtained by adopting the circuit board preparation process of the present invention;
wherein, the graph (a) is a blind hole slice, and the graph (b) is a through hole slice.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other.
The invention is further described below with reference to the drawings and specific examples, which are not intended to be limiting.
Example 1
The preparation method of the composition for the surface treatment of the circuit board comprises the following steps in sequence: adding pure water to a reaction kettle until the pure water accounts for 30% of the volume fraction of the reaction kettle, sequentially adding tetramethyl ammonium hydroxide (such as tetramethyl ammonium hydroxide from Toyo Yi chemical Co., ltd.), water-based polyimide (WLUP from Shanghai Chemicals Co., ltd.), water-based epoxy resin (Jitian chemical, F0707 or Vilina chemical Co., ltd., CYDEW-2008) from 2% to 5% of the final volume fraction, water-based glycoluril resin (Shanghai Chemies Co., Q-172) from 0.5% to 2% of the final volume fraction, water-based functional additive from 0.5% to 2% of the final volume fraction, nano-oriented super dispersant from 0.1% to 1.0% of the final volume fraction, and adding pure water to the liquid level of the reaction kettle; stirring for 4 hours, standing for 1 hour, and filtering to obtain the composition.
Example 2
TABLE 1
Wherein YCE AD-250 is a mixture of alkali and surfactant, YCE AD-3316 is palladium, YCE-AD-3800 is a mixture of sulfuric acid and surfactant, YCE EN-1820M is malic acid or/and succinic acid, YCE EN-1820A is nickel sulfate, YCE EN-1820B is sodium borohydride, and YCE EN-1820C is amino acid; SEEDING Cocktail is the composition prepared in example 1, and is named because it appears as a seed after the surface treatment of the substrate;
as shown in the above table, the preparation process of the circuit board sequentially includes: cleaning ring opening by adopting a surface treating agent, overflow washing twice by adopting deionized water, coarsening by adopting potassium permanganate and sodium hydroxide, overflow washing twice by adopting deionized water, neutralizing by adopting sulfuric acid and hydrogen peroxide, overflow washing twice by adopting deionized water, surface treatment by adopting a composition prepared in the embodiment, overflow washing twice by adopting deionized water, catalytic treatment by adopting a catalyst, overflow washing twice by adopting deionized water, acceleration treatment, overflow washing twice by adopting deionized water, chemical nickel addition, deionized water washing, hot deionized water washing, deionized water washing and baking crosslinking.
Example 3
The manufacturing process of the flexible circuit board sequentially comprises the following steps: PI film selection, drilling (mechanical drilling or laser), plasma treatment, flow as described in example 2, [ electroplating 2 microns copper ], dry film application, exposure development, pattern plating, etching, subsequent treatment.
The manufacturing process of the hard circuit board sequentially comprises the following steps: FR4 (copper-free) BT ABF was selected, drilled (machine or laser), the procedure described in example 2, [ plating 2 microns copper ], dry film lamination, exposure development, pattern plating, etching, subsequent processing.
Note that: the contents of the above [ are optional.
Example 4: performance testing
(1) Aging Properties
Temperature 22-28 ℃, relative humidity: the copper foil is tested by a universal tensile tester at 90 DEG, the pulling speed is 50mm/min, the pulling distance is more than 70mm, the testing is carried out in sequence, and the numerical value is recorded.
The test results show that: as shown in tables 2-3, the test result of the normal PI sample peel force is about 0.5kgf/cm, and the requirements can be met; the test results of the peel force of the PI samples after aging at 150℃for 7 days showed that the bonding force was substantially lost (tensile units in tables 2 to 4 are: lb/in,1 Lb/in= 0.1786 kgf/cm).
Table 2 normal PI sample peel force test results
Table 3 7 results of the PI sample Peel force test after 150℃aging
The test results of example 3 are shown in Table 4, and the peel force of the flexible wiring board was 0.7kgf/cm in normal state; 0.89kgf/cm after aging; the peel force of the hard circuit board is 0.35kgf/cm in normal state; 0.5kgf/cm after aging;
TABLE 4 Table 4
The composition ensures that the stripping force of the circuit board is not reduced after aging at 150 ℃ in 7 days, and the bonding force with materials is increased due to the crosslinking effect, so that the requirements of IPC are completely met and even exceeded.
(2) Thermal shock resistance
As shown in fig. 2, after the circuit board of example 3 is subjected to thermal shock at 288 ℃ for 10 seconds×3 times, the material has no fracture, no crack, no flaking and other phenomena on the surface, and the compositions on the soft circuit board and the hard circuit board can pass the thermal shock test at 288 ℃ for 10 seconds×3 times; thus, the wiring board of example 3 was considered to exhibit excellent thermal shock resistance.
(3) Blind hole and through hole dicing obtained by the procedure described in example 2
The procedure described in example 2 also shows good applicability in blind and through hole dicing, as shown in fig. 3.
In summary, the composition for surface treatment of the circuit board can increase the product qualification rate of a precise circuit, and can effectively solve the problem of qualification rate of line width line distance below 25 microns, line width line distance below 25 microns and other conventional comprehensive wiring; the composition can ensure that the treated circuit board can resist heat shock of more than 10 seconds multiplied by 3 times at 288 ℃ and can be peeled off and pulled off to reach the material specification of IPC.
The foregoing description is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, and it will be appreciated by those skilled in the art that equivalent substitutions and obvious variations may be made using the description and illustrations of the present invention, and are intended to be included within the scope of the present invention.
Claims (9)
1. A composition for use in the preparation of a circuit board, the preparation step of the composition comprising: adding pure water to a reaction kettle until the pure water accounts for 30% of the volume fraction of the reaction kettle, sequentially adding tetramethyl ammonium hydroxide with the final volume fraction of 10% -40%, aqueous polyimide with the final volume fraction of 2% -5%, aqueous epoxy resin with the final volume fraction of 2% -5%, aqueous glycoluril resin with the final volume fraction of 0.5% -2%, aqueous functional additive with the final volume fraction of 0.5% -2% and nano directional dispersant with the final volume fraction of 0.1% -1.0%, and adding pure water to the liquid level of the reaction kettle; stirring for 4 hours, standing for 1 hour, and filtering to obtain the composition;
wherein the aqueous functional additive comprises a compound of formula (I):
；
（I）
R 1 selected from-H or-CH 3 ；R 2 Selected from-C n H 2n+1 ，n∈[0,50]；R 3 Selected from-C n'+3Y H 2n'+4Y ，n'∈[3,500]，Y∈[1,20]，Z∈[1,20]，Y=Z；R 4 Selected from-C n'' H 2n'' (EO) n''' (PO) n'''' H，n''∈[0,50]EO represents ethylene oxide, n '' '' E [1,50 ]]PO represents propylene oxide, n '' '' E [1,50 ]]；m∈[0,10000]；m 1 ∈[0,10000]；m 2 ∈[1,1000]；m 3 ∈[0,10000]；
Wherein m, m 1 ，m 3 Are not 0;
wherein the nano-directional dispersant comprises a compound as shown in formula (II):
；
（II）
r is selected from-C n''''' H 2n''''' ，n'''''∈[1,50]；R 1 Selected from-H or-CH 3 ；M 1 M is as follows 2 Independently selected from H + 、[NH 4 ] + Or a metal ion; x is E [1,100 ]]；x 1 ∈[1,100]；x 2 ∈[0,50]；x 3 ∈[1,100]；
The flow of the composition in the preparation of the circuit board sequentially comprises the following steps: cleaning and ring-opening by adopting a surface treating agent, overflow washing twice by adopting deionized water, roughening by adopting potassium permanganate and sodium hydroxide, overflow washing twice by adopting deionized water, neutralizing by adopting sulfuric acid and hydrogen peroxide, overflow washing twice by adopting deionized water, surface treatment by adopting the composition, overflow washing twice by adopting deionized water, catalytic treatment by adopting a catalyst, overflow washing twice by adopting deionized water, acceleration treatment, overflow washing twice by adopting deionized water, chemical nickel addition, deionized water washing, hot deionized water washing, deionized water washing and baking crosslinking.
2. The composition of claim 1, wherein n' e [5,100].
3. The composition of claim 2, wherein n' e [6,20].
4. The composition of claim 1, wherein m 1 ∈[0,8000]，m 1 And is not 0.
5. The composition of claim 4, wherein m 1 ∈[1,2000]。
6. The composition of claim 1, wherein m 2 ∈[3,800]。
7. The composition of claim 6, wherein m 2 ∈[4,600]。
8. The composition of claim 7, wherein m 2 ∈[5,500]。
9. Use of a composition according to any one of claims 1 to 8 in the preparation of circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210827748.3A CN115477847B (en) | 2022-07-14 | 2022-07-14 | Composition, and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210827748.3A CN115477847B (en) | 2022-07-14 | 2022-07-14 | Composition, and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115477847A CN115477847A (en) | 2022-12-16 |
| CN115477847B true CN115477847B (en) | 2023-08-11 |
Family
ID=84422760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210827748.3A Active CN115477847B (en) | 2022-07-14 | 2022-07-14 | Composition, and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115477847B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003327825A (en) * | 2002-05-08 | 2003-11-19 | Toyobo Co Ltd | Composition containing acidic group-containing polybenzimidazole-based compound and acidic group- containing polymer, ion-conductive film, adhesive, composite material and fuel cell |
| CN1590438A (en) * | 2003-09-05 | 2005-03-09 | 三星电机株式会社 | Brown oxide pretreatment composition, and method for improving adhesion of polyimide surface |
| CN1914561A (en) * | 2004-01-05 | 2007-02-14 | 微量化学公司 | Photoresist compositions and processess of use |
| JP2013036021A (en) * | 2011-07-08 | 2013-02-21 | Ube Industries Ltd | Carbon nanotube dispersant including polyamic acid |
| CN103377830A (en) * | 2012-04-11 | 2013-10-30 | Avx公司 | Solid electrolytic capacitor with enhanced mechanical stability under extreme conditions |
| CN111073461A (en) * | 2020-01-02 | 2020-04-28 | 万华化学集团股份有限公司 | Aqueous bi-component epoxy composition and preparation method and application thereof |
-
2022
- 2022-07-14 CN CN202210827748.3A patent/CN115477847B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003327825A (en) * | 2002-05-08 | 2003-11-19 | Toyobo Co Ltd | Composition containing acidic group-containing polybenzimidazole-based compound and acidic group- containing polymer, ion-conductive film, adhesive, composite material and fuel cell |
| CN1590438A (en) * | 2003-09-05 | 2005-03-09 | 三星电机株式会社 | Brown oxide pretreatment composition, and method for improving adhesion of polyimide surface |
| CN1914561A (en) * | 2004-01-05 | 2007-02-14 | 微量化学公司 | Photoresist compositions and processess of use |
| JP2013036021A (en) * | 2011-07-08 | 2013-02-21 | Ube Industries Ltd | Carbon nanotube dispersant including polyamic acid |
| CN103377830A (en) * | 2012-04-11 | 2013-10-30 | Avx公司 | Solid electrolytic capacitor with enhanced mechanical stability under extreme conditions |
| CN111073461A (en) * | 2020-01-02 | 2020-04-28 | 万华化学集团股份有限公司 | Aqueous bi-component epoxy composition and preparation method and application thereof |
Non-Patent Citations (1)
| Title |
|---|
| 孙兆洋 ; 熊育资 ; 罗江满 ; 温振超 ; 张杰元 ; 范鉴全 ; .柔性环氧胶的合成及其在印刷线路板油墨中的应用研究.绝缘材料.2018,(第07期),全文. * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115477847A (en) | 2022-12-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5800859A (en) | Copper coating of printed circuit boards | |
| US7682432B2 (en) | Adhesion promotion in printed circuit boards | |
| WO2011149019A1 (en) | Method for manufacturing base material having gold-plated metal fine pattern, base material having gold-plated metal fine pattern, printed wiring board, interposer, and semiconductor device | |
| TW201212755A (en) | Method and agent for surface processing of printed circuit board substrate | |
| TWI732045B (en) | Manufacturing method of printed wiring board | |
| KR102502531B1 (en) | Pretreatment liquid for electroless plating used simultaneously with reduction treatment, and manufacturing method of printed wiring board | |
| KR101327618B1 (en) | Metal-coated polyimide resin substrate with excellent thermal aging resistance properties | |
| JP2023162285A (en) | Cleaning solution containing mixture of polyoxyalkylene nonionic surfactants for cleaning metal surfaces | |
| CN115477847B (en) | Composition, and preparation method and application thereof | |
| JP7228468B2 (en) | Method for manufacturing printed wiring board | |
| JP5522617B2 (en) | Adhesive layer forming liquid and adhesive layer forming method | |
| JPH0319301B2 (en) | ||
| JP2005082807A (en) | Brown oxide pretreatment agent composition, and method for improving polyimide surface adhesivity by using brown oxide process | |
| KR20180073473A (en) | Electroless plating method | |
| JP3342852B2 (en) | Pretreatment method for catalyzing treatment and throwing improver used therefor | |
| JPH06316768A (en) | Electroless plating method for fluorine containing polyimide resin | |
| JPH05145221A (en) | Manufacture of printed circuit board | |
| US20180179634A1 (en) | Method for electroless plating | |
| JP3465016B2 (en) | Method for improving adhesion of resin to copper surface and high adhesion electroless copper plating bath used for the method | |
| KR100567093B1 (en) | Coating composition for treating inner layer of printed circuit board and method for treating inner layer of printed circuit board using the same | |
| JPH0222477A (en) | Pretreatment for electroless plating | |
| CN116426022A (en) | Polyimide film surface modifier and preparation method and application thereof | |
| JPH04198486A (en) | Pretreating solution for electroless plating | |
| JP2000073181A (en) | Improvement of adhesiveness of resin to copper surface and adhesiveness improver | |
| JP2002030452A (en) | Method for producing printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |