CN115469475A - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN115469475A CN115469475A CN202210996264.1A CN202210996264A CN115469475A CN 115469475 A CN115469475 A CN 115469475A CN 202210996264 A CN202210996264 A CN 202210996264A CN 115469475 A CN115469475 A CN 115469475A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 328
- 238000005520 cutting process Methods 0.000 claims abstract description 186
- 238000000034 method Methods 0.000 claims description 23
- 238000009826 distribution Methods 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 description 24
- 239000010410 layer Substances 0.000 description 17
- 239000004973 liquid crystal related substance Substances 0.000 description 17
- 238000005452 bending Methods 0.000 description 13
- 230000009471 action Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 239000008393 encapsulating agent Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention discloses a display panel, a manufacturing method thereof and a display device. Which comprises the following steps: cutting the first sub-board along a first direction to form a first substrate to be cut, wherein the first direction is a direction in which the first sub-board points to the second sub-board, the second sub-board is cut to form a second substrate, and the distance between the edge of the first substrate to be cut and the first cutting area is smaller than the distance between the edge of the second substrate to be cut and the first cutting area; and cutting the first substrate to be cut along a second direction to form the first substrate, wherein the second direction is opposite to the first direction, and the distance between the edge of the first substrate and the second cutting area is smaller than the distance between the edge of the second substrate and the second cutting area. The invention can reduce the probability of the first substrate breaking, improve the yield of the display panel and realize the display panel with higher curvature.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a manufacturing method of the display panel and a display device.
Background
A Liquid Crystal Display (LCD) panel is composed of a Color Filter (CF) substrate, a Thin Film Transistor (TFT) array substrate, and a Liquid Crystal Layer (Liquid Crystal Layer) disposed between the two substrates. In the manufacturing process of the liquid crystal display panel, in order to improve the production efficiency, a plurality of thin film transistor array layers are formed on a larger glass substrate, and a plurality of color filter layers are formed on another larger glass substrate; then, bonding the two larger glass substrates together by frame sealing glue (Seal); then, cutting (Cut) is performed, so that a plurality of liquid crystal display panels can be manufactured simultaneously, and the productivity is improved.
In the field of display technology, the development of flat display panel technology is the most mature, but with the rapid development of display technology, display panels of other forms (such as curved displays, foldable displays, etc.) are coming out in succession to meet the diversified demands of users. Compared with a flat display panel, the curved display panel has the advantages of wider visual angle range, wider visual field, strong stereoscopic impression, vivid picture and smooth and attractive arc appearance, thereby endowing a user with better visual experience effect.
At present, in a curved liquid crystal display panel, a glass substrate in the liquid crystal display panel is often required to be bent, but in a cutting process of the liquid crystal display panel, cracks are easily formed at the cut part of the glass substrate, so that the strength and the bending capability of the glass substrate are reduced; especially, at the side of the liquid crystal display panel which needs to be bent, the glass substrate is easily broken by the cracks under the action of tensile stress, so that the improvement of the curvature of the curved liquid crystal display panel is limited, and the yield of the curved liquid crystal display panel is reduced.
Disclosure of Invention
The embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, which can improve the strength of a first substrate in the display panel, reduce the probability of damage of the first substrate due to bending and improve the yield of the display panel.
The embodiment of the invention provides a manufacturing method of a display panel, which comprises the following steps:
providing a mother board to be cut, wherein the mother board to be cut comprises a first daughter board and a second daughter board which are arranged oppositely, and the mother board to be cut comprises a finished product area, a first cutting area and a second cutting area which is positioned between the finished product area and the first cutting area;
cutting the first sub-board along a first direction to form a first substrate to be cut, wherein the first substrate to be cut is located in the second cutting area and the finished product area, the first direction is the direction in which the first sub-board points to the second sub-board, the second sub-board is cut along a second direction to form a second substrate located in the finished product area, the second direction is the direction in which the second sub-board points to the first sub-board, and the distance between the edge of the first substrate to be cut and the first cutting area is smaller than the distance between the edge of the second substrate to be cut and the first cutting area;
and cutting the first substrate to be cut along the second direction to form a first substrate positioned in the finished product area, wherein the distance between the edge of the first substrate and the second cutting area is smaller than the distance between the edge of the second substrate and the second cutting area.
In an embodiment of the invention, in the step of providing a mother board to be cut, the second cutting area includes a first sub-area located on one side of the finished area and between the finished area and the first cutting area;
and cutting the first sub-board along a first direction to form a first substrate to be cut which is positioned in the second cutting area and the finished product area, wherein the first direction is a direction in which the first sub-board points to the second sub-board, and cutting the second sub-board to form a second substrate which is positioned in the finished product area, and the edge of one side, close to the first sub-area, of the first substrate to be cut exceeds the edge of one side, close to the first sub-area, of the second substrate.
In an embodiment of the present invention, the step of cutting the first substrate to be cut along the second direction to form the first substrate located in the finished product area includes:
and cutting the first substrate to be cut along the second direction to form a first section on one side of the first substrate close to the first sub-area, wherein a cutting crack is formed at the first section, and the cutting crack is formed on one side of the first section close to the second substrate.
In an embodiment of the present invention, the first fracture surface includes a natural fracture area and a crack distribution area which are adjacent to each other, and the natural fracture area is located on a side of the crack distribution area away from the second substrate;
the step of cutting the first substrate to be cut along the second direction to form the first substrate located in the finished product area includes:
cutting the first substrate to be cut along the second direction by using a cutting piece to obtain the first substrate;
wherein a cutting depth of the cutting member is less than a length of the crack distribution zone in the second direction.
In one embodiment of the present invention, the depth of the cutting member is less than or equal to 5% of the thickness of the first substrate, and the length of the natural fracture zone in the first direction is less than or equal to 20% of the thickness of the first substrate.
In an embodiment of the present invention, the step of cutting the first substrate to be cut along the second direction to form the first substrate located in the finished product area includes:
and forming a packaging adhesive layer on one side of the first substrate and one side of the second substrate close to the first sub-area, forming a second section on one side of the second substrate close to the first sub-area, and continuously covering the first section and the second section by the packaging adhesive layer.
In an embodiment of the present invention, in the step of providing a mother board to be cut, the second cutting area further includes a second sub-area located on one side of the finished area and between the finished area and the first cutting area;
the step of cutting the first substrate to be cut along the second direction to form the first substrate located in the finished product area includes:
cutting and removing the first substrate to be cut in the second sub-area, wherein the edge of one side, close to the second sub-area, of the first substrate exceeds the edge of one side, close to the second sub-area, of the second substrate;
and forming a driving assembly on one side of the first substrate close to the second sub-area.
In an embodiment of the invention, the step of cutting to remove the first substrate to be cut in the second sub-area includes:
cutting and removing the first substrate to be cut in the second sub-area along the first direction;
or cutting and removing the first substrate to be cut in the second sub-area along the second direction.
In an embodiment of the present invention, a distance between an edge of the first substrate close to the first sub-area and an edge of the second substrate close to the first sub-area exceeds a distance between the edge of the first substrate close to the first sub-area by less than or equal to 1 mm.
According to the above object of the present invention, an embodiment of the present invention further provides a display panel, where the display panel includes a first substrate and a second substrate that are disposed opposite to each other, the display panel further includes a first side and a second side that are disposed opposite to each other, and an edge of the first substrate exceeds an edge of the second substrate at the first side and the second side.
In one embodiment of the present invention, the first substrate includes a first cross section at the first side edge, the first cross section includes a cutting crack, and the cutting crack is located on a side of the first cross section close to the second substrate.
In an embodiment of the invention, the display panel further includes an encapsulation adhesive layer, the encapsulation adhesive layer is disposed at a position where the first substrate and the second substrate are close to the first side edge, the second substrate includes a second cross section located at the first side edge, and the encapsulation adhesive layer continuously covers the first cross section and the second cross section.
In one embodiment of the present invention, at the first side edge, a distance by which an edge of the first substrate exceeds an edge of the second substrate is less than or equal to 1 mm.
In an embodiment of the invention, the display panel further includes a driving device, and the driving device is disposed on the first substrate near the second side.
According to the above object, a display device including the display panel is provided, wherein the first substrate is curved at the first side and the second side.
The invention has the beneficial effects that: when a board to be cut is cut, because the cutting starting position is the side of the first sub-board far away from the second sub-board and the side of the second sub-board far away from the first sub-board, cracks generated by cutting can be formed on the side of the cutting section close to the cutting starting position, namely, cracks can be formed on the side of the first substrate to be cut far away from the second substrate during cutting, and the cracks can easily cause the substrate to be broken under the action of bending tensile stress; according to the invention, the first substrate to be cut is cut at the side of the first substrate to be cut close to the second substrate so as to remove the cracks at the side of the first substrate to be cut away from the second substrate, and the first substrate is obtained.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1 to 3 are schematic structural diagrams illustrating a manufacturing process of a curved display panel in the related art;
FIG. 4 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 5 to 7 are schematic structural diagrams illustrating a manufacturing process of a display panel according to an embodiment of the invention;
FIG. 8 is a schematic diagram of a planar distribution structure of a display panel according to an embodiment of the present invention;
fig. 9 is a schematic diagram of a first daughter board cutting process according to an embodiment of the present invention;
FIG. 10 is a schematic view of a plane distribution structure of a first cross section provided in the embodiments of the present invention;
fig. 11 is a graph of a verification structure of the natural fracture length of the first substrate to be cut according to the embodiment of the present invention;
fig. 12 is a schematic view illustrating a bending structure of a first side of a display panel according to an embodiment of the present invention;
fig. 13 is a schematic view of another plane distribution structure of the display panel according to the embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Referring to fig. 1, 2 and 3, in the panel cutting process of the related art, the panel cutting device includes a first glass substrate 1 and a second glass substrate 2 which are oppositely disposed, and a cutter wheel 3 is used to cut the first glass substrate 1 at a side of the first glass substrate 1 away from the second glass substrate 2, and to cut the second glass substrate 2 at a side of the second glass substrate 2 away from the first glass substrate 1; however, since cracks are generated near the cross section of the glass substrate after the cutter wheel 3 is cut, if the array substrate 4 and the color filter substrate 5 are bent, the cracks reduce the strength of the array substrate 4 and the color filter substrate 5, and thus, defects such as chipping are likely to occur. Therefore, in the related art, the grinding stone 6 is often used to grind the cross section of the array substrate 4 to remove cracks on the cross section of the array substrate 4, but the grinding process for the edge of the glass substrate needs to be refined, the grinding time is long, the equipment investment is high, the material consumption is high, and the manufacturing cost of the curved display panel is greatly increased.
An embodiment of the present invention provides a method for manufacturing a display panel, referring to fig. 4, fig. 5, fig. 6, and fig. 7, the method for manufacturing a display panel includes the following steps:
providing a mother board 10 to be cut, wherein the mother board 10 to be cut comprises a first daughter board 11 and a second daughter board 12 which are oppositely arranged, and the mother board 10 to be cut comprises a finished product area 101, a first cutting area 102 and a second cutting area 103 which is positioned between the finished product area 101 and the first cutting area 102.
The first sub-board 11 is cut along a first direction X to form a first substrate 13 to be cut in the second cutting area 103 and the finished product area 101, the first direction X is a direction in which the first sub-board 11 points to the second sub-board 12, the second sub-board 12 is cut along a second direction Y to form a second substrate 22 in the finished product area 101, the second direction Y is a direction in which the second sub-board 12 points to the first sub-board 11, and a distance between an edge of the first substrate 13 to be cut and the first cutting area 102 is smaller than a distance between an edge of the second substrate 22 and the first cutting area 102.
The first substrate to be cut 13 is cut along the second direction Y to form the first substrate 21 located in the finished product area 101, and a distance between an edge of the first substrate 21 and the second cutting area 103 is smaller than a distance between an edge of the second substrate 22 and the second cutting area 103.
Referring to fig. 1, 2 and 3, in the panel cutting process of the related art, when a panel to be cut is cut, since the cutting start position is a side of the first sub-board 11 away from the second sub-board 12 and a side of the second sub-board 12 away from the first sub-board 11, a crack generated by cutting is formed on a side of a cutting cross section close to the cutting start position, that is, a crack is formed on a side of the cutting cross section of the first substrate 13 to be cut away from the second substrate 22 during cutting, and the crack is prone to cause the substrate to be broken under the action of a bending tensile stress; in the invention, the first substrate to be cut 13 is cut at the side of the first substrate to be cut 13 close to the second substrate 22 to remove the cracks at the side of the first substrate to be cut 13 far away from the second substrate 22, so as to obtain the first substrate 21, and because the side of the first substrate 21 far away from the second substrate 22 has no cracks, when the first substrate 21 is bent along the first direction X, the side of the first substrate 21 close to the second cutting area 103 can not be broken due to the cracks and the tensile stress, so that the yield of the first substrate 21 is improved, the yield of the display panel is improved, and the display panel with higher curvature can be realized. In addition, in the embodiment of the present invention, when the mother board 10 to be cut is subjected to the first cutting, a certain distance is reserved at the side edge of the first substrate 13 to be cut, that is, a portion of the first substrate 13 to be cut, which is located in the second cutting region 103, is reserved for performing the second cutting.
Specifically, with reference to fig. 4 to 12, a method for manufacturing a display panel according to an embodiment of the present invention is described in detail below, where the method includes the following steps:
s10, providing a mother board 10 to be cut, wherein the mother board 10 to be cut comprises a first daughter board 11 and a second daughter board 12 which are oppositely arranged, and the mother board 10 to be cut comprises a finished product area 101, a first cutting area 102 and a second cutting area 103 which is arranged between the finished product area 101 and the first cutting area 102.
The mother board 10 to be cut is provided, and the mother board 10 to be cut includes a first daughter board 11 and a second daughter board 12 which are oppositely disposed, wherein the mother board 10 to be cut further includes a finished product area 101, a first cutting area 102, and a second cutting area 103 located between the finished product area 101 and the first cutting area 102, as shown in fig. 5.
It should be noted that a thin film transistor array layer may also be formed on a side of the first sub-board 11 close to the second sub-board 12, a color film layer may also be formed on a side of the second sub-board 12 close to the first sub-board 11, a liquid crystal layer may also be formed between the first sub-board 11 and the second sub-board 12, and a sealant may be formed between the first sub-board 11 and the second sub-board 12 to surround the liquid crystal layer, and the liquid crystal layer is limited between the first sub-board 11 and the second sub-board 12 and is located in the finished product area 101.
Optionally, the first sub-board 11 and the second sub-board 12 are both glass substrates.
It should be understood that the mother board 10 to be cut may include a plurality of finished product regions 101, and a plurality of corresponding first cutting regions 102 and a plurality of corresponding second cutting regions 103, that is, after the mother board 10 to be cut is cut, a plurality of display panels may be formed, and in the embodiment of the present invention, one finished product region 101 in the mother board 10 to be cut, and the corresponding first cutting region 102 and second cutting region 103 are taken as an example for description, and the cutting methods of the other finished product regions 101, the first cutting regions 102 and the second cutting regions 103 on the mother board 10 to be cut may all be performed with reference to the embodiment of the present invention.
In an embodiment of the invention, referring to fig. 8, the first cutting region 102 is disposed around the corresponding finished product region 101, and the second cutting region 103 includes a first sub-region 1031 on one side of the finished product region 101 and a second sub-region 1032 on the other side of the finished product region 101, and the first sub-region 1031 and the second sub-region 1032 can be located on two opposite sides of the finished product region 101 and located between the finished product region 101 and the first cutting region 102.
S20, cutting the first sub-board 11 along a first direction X to form a first substrate to be cut 13 located in the second cutting area 103 and the finished product area 101, where the first direction X is a direction in which the first sub-board 11 points to the second sub-board 12, and cutting the second sub-board 12 along a second direction Y to form a second substrate 22 located in the finished product area 101, the second direction Y is a direction in which the second sub-board 12 points to the first sub-board 11, and a distance between an edge of the first substrate to be cut 13 and the first cutting area 102 is smaller than a distance between an edge of the second substrate 22 and the first cutting area 102.
In the embodiment of the present invention, the direction in which the first sub-board 11 points to the second sub-board 12 is set to be the first direction X, and the direction in which the second sub-board 12 points to the first sub-board 11 is set to be the second direction Y, that is, the first direction X is opposite to the second direction Y.
Cutting the first sub-board 11 along the first direction X by using the cutting member 40 to remove the first sub-board 11 in the first cutting area 102, so as to form a first substrate to be cut 13 in the finished product area 101 and the second cutting area 103; cutting the second sub-board 12 by using the cutting member 40 along the second direction Y to remove the second sub-board 12 located in the first cutting area 102, remove the second sub-board 12 located in the second cutting area 103, and remove a portion of the second sub-board 12 located in the finished product area 101, so as to form a second substrate 22 located in the finished product area 101; and the distance between the edge of the first substrate to be cut 13 and the first cutting region 102 is smaller than the distance between the edge of the second substrate 22 and the first cutting region 102, as shown in fig. 6. It should be understood that, in the embodiment of the present invention, the first sub-board 11 may be cut first, and then the second sub-board 12 is cut, or the second sub-board 12 is cut first, and then the first sub-board 11 is cut, or the first sub-board 11 and the second sub-board 12 are cut simultaneously, which is not limited herein and can be selected according to actual requirements.
Wherein, the edge of the first substrate to be cut 13 close to the first sub-area 1031 exceeds the edge of the second substrate 22 close to the first sub-area 1031; the edge of the first substrate to be cut 13 on the side closer to the second sub-region 1032 exceeds the edge of the second substrate 22 on the side closer to the second sub-region 1032.
Referring to fig. 9, when the cutting member 40 cuts the first sub-board 11, the cutting member 40 forms a transverse crack 51 and a longitudinal crack 52 on one side of the cut surface, wherein the longitudinal crack 52 may extend in the longitudinal direction until the first sub-board 11 is broken at the cut position to form a cross section, and the transverse crack 51 will remain on one side of the cut surface of the first sub-board 11, and in the embodiment of the present invention, the transverse crack 51 is a cut crack 50, and the cut crack 50 will be described later.
Because the embodiment of the invention cuts the first sub-board 11 along the first direction X, the cut crack 50 will be formed on the side of the first sub-board 11 away from the second sub-board 12; in the subsequent process, for example, when the display panel is directly bent, the cutting crack 50 will extend and expand under the action of the bending tensile stress, so that the glass substrate may be broken.
And S30, cutting the first substrate to be cut 13 along the second direction Y to form the first substrate 21 in the finished product area 101, wherein the distance between the edge of the first substrate 21 and the second cutting area 103 is smaller than the distance between the edge of the second substrate 22 and the second cutting area 103.
The first substrate to be cut 13 is cut by the cutting member 40 along the second direction Y, that is, the first substrate to be cut 13 is cut from a side of the first substrate to be cut 13 close to the second substrate 22, so as to remove the first substrate to be cut 13 in the second cutting area 103, and form the first substrate 21 in the finished product area 101. And the distance between the edge of the first substrate 21 and the second cutting region 103 is smaller than the distance between the edge of the second substrate 22 and the second cutting region 103, as shown in fig. 7.
Wherein, the edge of the first substrate 21 close to the first sub-area 1031 exceeds the edge of the second substrate 22 close to the first sub-area 1031; the edge of the first substrate 21 on the side closer to the second sub-area 1032 exceeds the edge of the second substrate 22 on the side closer to the second sub-area 1032.
In the embodiment of the present invention, by performing the second cutting on the first substrate to be cut 13 along the second direction Y, the cutting crack 50 generated by the second cutting will be formed on the side of the first substrate 21 close to the second substrate 22, and the cutting crack 50 formed on the side of the first substrate to be cut 13 away from the second substrate 22 in the first cutting is removed, so as to eliminate the cutting crack 50 on the side of the first substrate 21 away from the second substrate 22.
Specifically, referring to fig. 6, fig. 7, fig. 9 and fig. 10, after the first substrate 13 to be cut is subjected to the second cutting, a first cross section 211 is formed on a side of the first substrate 21 close to the second cutting region 103, and fig. 10 is a schematic plane distribution structure diagram of the first cross section 211. The first fracture surface 211 includes a natural fracture region 2111 and a crack distribution region 212 which are adjacent to each other, and the natural fracture region 2111 is located on a side of the crack distribution region 212 away from the second substrate 22. The crack distribution region 212 includes a crack initiation region 2113 and a crack extension region 2112 between the crack initiation region 2113 and the natural fracture region 2111.
In the second cutting process, the cutting depth of the cutting piece 40 in the first substrate to be cut 13 is smaller than the length of the crack distribution region 212 in the first direction X, and further, the cutting depth of the cutting piece 40 is also smaller than the length of the crack generation region 2113 in the first direction X. Optionally, the cutting depth of the cutting member 40 is less than or equal to 5% of the thickness of the first substrate 21.
In the embodiment of the invention, the shear mark surface tensile stress formula is as follows:
wherein σ represents tensile stress, K IC Represents glass fracture toughness, c represents vertical crack length, and γ represents fracture form factor; as can be seen from the above formula, the larger the length of the longitudinal crack 52 is, the smaller the tensile stress generated during the cutting of the glass substrate is, and the longitudinal crack 52 is generated on the glass substrate under the cutting of the cutting member 40, while the larger the depth of the generated longitudinal crack 52 is, the glass substrate will be rapidly broken under the extension of the longitudinal crack 52.
Alternatively, the cutting element 40 includes a high-permeability cutter wheel, such as a full-edge cutter wheel, which has higher permeability for vertical cutting, and the longitudinal crack 52 generated by the cutter wheel is more easily extended and propagated, so that the first substrate to be cut 13 is naturally broken.
As the glass substrate is a brittle material, the theory of microcracks in the fracture of the brittle material shows that the brittle material generates a stress concentration phenomenon under the action of an external force, and when the stress reaches a certain degree, the generated cracks begin to expand, so that the brittle material fractures. In the embodiment of the present invention, only a part of the crack generation region 2113 is cut by the cutting element 40 to generate the longitudinal crack 52, and the longitudinal crack 52 extends through the crack extension region 2112, and will naturally fracture when the end of the first cross section 211 on the side away from the second substrate 22 is not reached, and the region where the natural fracture occurs is the natural fracture region 2111, that is, the first substrate to be cut 13 is cut for the second time in the second direction Y to eliminate the cutting crack 50 generated when the first cutting is performed on the side of the first substrate to be cut 13 away from the second substrate 22, so that no cutting crack 50 is generated when the second cutting is performed on the side of the first substrate 21 away from the second substrate 22.
The second substrate 22 includes a second section 221 near the first sub-section 1031, and the encapsulant layer 30 can be formed on both the first substrate 21 and the second substrate 22 near the first sub-section 1031, that is, the encapsulant layer 30 continuously covers the first section 211 and the second section 221, the second section 221 is recessed with respect to the first section 211, and the encapsulant layer 30 is filled in the recessed portion of the second section 221.
In the embodiment of the present invention, the cutting depth of the cutting member 40 is adjusted so that the length of the first substrate to be cut 13 that is naturally fractured is changed, even if the length of the natural fracture region 2111 along the first direction X is changed, so as to verify that the first fracture surface 211 is flat when the length of the natural fracture region 2111 along the first direction X is different, and as shown in fig. 11, when the length of the natural fracture region 2111 along the first direction X is greater than 20% of the thickness of the first substrate 21, the first fracture surface 211 is prone to generate more stringiness, i.e., generate burrs, etc., in the natural fracture region 2111, which affects the ease of the first substrate to be cut 13 that is naturally fractured and the strength of the generated first substrate 21, and is not beneficial for the encapsulation adhesive layer 30 to cover the first fracture surface 211.
Optionally, the length of the natural fracture region 2111 in the first direction X is less than or equal to 20% of the thickness of the first substrate 21. The distance that the edge of the first substrate 21 close to the first sub-area 1031 exceeds the edge of the second substrate 22 close to the first sub-area 1031 is less than or equal to 1 mm, so that a display panel with a narrow bezel is realized.
In addition, in the embodiment of the present invention, a driving component (not shown in the figure) may be further formed on a side of the first substrate 21 close to the second sub-area 1032, that is, at a position where the first substrate 21 is close to the second sub-area 1032 and protrudes relative to the second substrate 22, the driving component is bound to form the display panel 20.
It should be noted that, the display panel 20 may be bent subsequently, that is, the first substrate 21 and the second substrate 22 are bent along the first direction X, and a side of the first substrate 21 close to the second cutting area 103 is bent.
Specifically, referring to fig. 7 and fig. 8, the display panel 20 includes a first side 201 close to the first sub-area 1031, a second side 202 close to the second sub-area 1032, and a third side 203 and a fourth side 204 connected between the first side 201 and the second side 202 and opposite to each other. The display panel 20 is bent along the first direction X, that is, one end of the display panel 20 close to the third side 203 and/or one end close to the fourth side 204 are bent along the first direction X, while the middle portion of the display panel 20 can be kept unchanged, so that the display panel 20 forms a curved surface, the first substrate 21 is located at the outer side of the bend, and the first side 201 and the second side 202 are both bent after the first substrate 21 and the second substrate 22 are bent, as shown in fig. 12.
Fig. 12 illustrates the first side 201 of the display panel 20, which includes the first cross section 211 and the second cross section 221, because the first substrate 13 to be cut is cut for the second time in the embodiment of the present invention, the cut crack 50 formed on the side of the first substrate 13 to be cut away from the second substrate 22 during the first cutting can be removed, and the first substrate 13 to be cut is cut for the second time along the second direction Y, that is, the first substrate 13 to be cut is cut from the side of the first substrate 13 to be cut close to the second substrate 22, so that the cut crack 50 generated by the second cutting is formed on the side of the first substrate 21 close to the second substrate 22, and no cut crack 50 is generated on the side of the first substrate 21 away from the second substrate 22. As shown in fig. 12, the side of the first substrate 21 away from the second substrate 22 is located outside the bending area and is under the action of bending stress, but the side of the first substrate 21 away from the second substrate 22 has no cutting crack 50 in the embodiment of the present invention, so as to improve the strength of the first substrate 21, reduce the probability of the first substrate 21 breaking during the bending process, and improve the yield of the display panel 20.
In the above embodiment, the first direction X is a direction in which the first sub-board 11 points to the second sub-board 12, a direction in which the first substrate to be cut 13 points to the second substrate 22, and a direction in which the first substrate 21 points to the second substrate 22, and the second direction Y is opposite to the first direction X.
In another embodiment of the present invention, please refer to fig. 5, fig. 6, fig. 7 and fig. 13, the difference between the embodiment and the above embodiment is: the second dicing area 103 includes a first sub-area 1031, a second sub-area 1032 and a third sub-area 1033 located at the other side of the finished product area 101, and during the bending process of the display panel 20, the side of the first substrate 21 close to the first sub-area 1031 and the side of the first substrate 21 close to the second sub-area 1032 are both curved, and the side of the first substrate 21 close to the third sub-area 1033 can be used for bonding the driving components.
During the process of cutting the first substrate to be cut 13, the first substrate to be cut 13 in the first sub-area 1031, the second sub-area 1032 and the third sub-area 1033 may be cut and removed along the second direction Y to form the first substrate 21; or the first substrate 13 to be cut in the third sub-region 1033 is cut and removed along the first direction X, and then the first substrate 13 to be cut in the first sub-region 1031 and the second sub-region 1032 is cut and removed along the second direction Y to form the first substrate 21; or the first substrate 13 to be cut in the first sub-region 1031 and the second sub-region 1032 is cut and removed along the second direction Y, and then the first substrate 13 to be cut in the third sub-region 1033 is cut and removed along the first direction X to form the first substrate 21.
In summary, when a board to be cut is cut, because the cutting start position is a side of the first sub-board 11 away from the second sub-board 12 and a side of the second sub-board 12 away from the first sub-board 11, a crack generated by cutting may be formed on a side of the cutting cross section close to the cutting start position, that is, a crack may be formed on a side of the cutting cross section of the first board to be cut 13 away from the second board 22 during cutting, and the crack may easily cause the board to be broken under the action of bending tensile stress; in the invention, the first substrate to be cut 13 is cut at the side of the first substrate to be cut 13 close to the second substrate 22 to remove the cracks at the side of the first substrate to be cut 13 far away from the second substrate 22, so as to obtain the first substrate 21, and because the side of the first substrate 21 far away from the second substrate 22 has no cracks, when the first substrate 21 is bent along the first direction X, the side of the first substrate 21 close to the second cutting area 103 can not be broken due to the cracks and the tensile stress, so that the yield of the first substrate 21 is improved, the yield of the display panel is improved, and the display panel with higher curvature can be realized.
In addition, an embodiment of the present invention further provides a display panel, and the display panel can be manufactured by the method for manufacturing the display panel described in the above embodiment, please refer to fig. 7, 8, 10, and 12.
The display panel 20 includes a first substrate 21 and a second substrate 22 disposed opposite to each other, and the display panel 20 includes a first side 201 and a second side 202 disposed opposite to each other, and at the first side 201 and the second side 202, an edge of the first substrate 21 exceeds an edge of the second substrate 22.
It should be noted that, in order to obtain a curved display device, the display panel 20 provided in the embodiment of the present invention may also be curved, and both the first substrate 21 and the second substrate 22 are curved along a side of the second substrate 22 away from the first substrate 21, that is, curved along a first direction X, where the first direction X is a direction in which the first substrate 21 approaches the second substrate 22, and the first substrate 21 is curved at the first side 201 and the second side 202.
Specifically, referring to fig. 7 and fig. 8, in an embodiment of the present invention, the display panel 20 includes a first side 201 close to the first sub-area 1031, a second side 202 close to the second sub-area 1032, and a third side 203 and a fourth side 204 connected between the first side 201 and the second side 202 and opposite to each other. The display panel 20 is bent along the first direction X, that is, one end of the display panel 20 close to the third side 203 and/or one end close to the fourth side 204 are bent along the first direction X, while the middle portion of the display panel 20 can be kept unchanged, so that the display panel 20 forms a curved surface, the first substrate 21 is located at the outer side of the bend, and the first side 201 and the second side 202 are both bent after the first substrate 21 and the second substrate 22 are bent, as shown in fig. 12.
Further, in the embodiment of the present invention, the display panel 20 further includes a thin film transistor layer disposed on one side of the first substrate 21 close to the second substrate 22, a color film layer disposed on one side of the second substrate 22 close to the first substrate 21, a liquid crystal layer disposed between the first substrate 21 and the second substrate 22, and a sealant disposed between the first substrate 21 and the second substrate 22 and surrounding the liquid crystal layer, and the thin film transistor layer, the color film layer, the liquid crystal layer, and the sealant can be implemented by referring to a conventional process, which is not described herein again.
The display panel 20 further includes a driving element, and at the second side 202, a protruding position of the first substrate 21 relative to the second substrate 22 may be used for binding the driving element.
In addition, the display panel 20 further includes a packaging adhesive layer 30 disposed at the first side 201, and the packaging adhesive layer 30 covers the first side 201 of the display panel 20. Specifically, the first substrate 21 includes a first section 211 at the first side 201, the second substrate 22 includes a second section 221 at the first side 201, and the second section 221 is recessed with respect to the first section 211, and the encapsulant 30 continuously covers the first section 211 and the second section 221 and fills a position where the second section 221 is recessed with respect to the first section 211.
Optionally, at the first side 201, the distance that the edge of the first substrate 21 exceeds the edge of the second substrate 22 is less than or equal to 1 mm.
Since the display panel 20 provided by the embodiment of the invention can be manufactured by the manufacturing method of the display panel described in the above embodiment, the cutting crack 50 formed at the first cross section 211 is located at a side of the first cross section 211 close to the second substrate 22. In the embodiment of the present invention, the display panel 20 is a curved display panel, that is, the first substrate 21 and the first substrate 21 are curved at the first side 201, the first substrate 21 is located at the outer side of the curve, and the side of the first substrate 21 away from the second substrate 22 is under the action of the bending tensile stress, but in the display panel 20 provided in the embodiment of the present invention, the side of the first cross section 211 away from the second cross section 221 does not have the cutting crack 50, so that the cutting crack 50 can be prevented from extending and expanding due to the action of the bending tensile stress, and the first substrate 21 is broken.
In addition, an embodiment of the present invention further provides a display device, which includes a device body and the display panel described in the above embodiment, wherein the first substrate 21 is curved at the first side 201 and the second side 202.
The device body may be a frame or a power supply, and the display device may be various curved display devices, such as a curved television, an external curved display screen, and the like, without limitation.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display panel, the manufacturing method thereof, and the display device provided in the embodiments of the present invention are described in detail above, and a specific example is applied in the description to explain the principle and the implementation of the present invention, and the description of the embodiments above is only used to help understanding the technical solution and the core idea of the present invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present invention in its embodiments.
Claims (15)
1. A manufacturing method of a display panel is characterized by comprising the following steps:
providing a mother board to be cut, wherein the mother board to be cut comprises a first daughter board and a second daughter board which are arranged oppositely, and the mother board to be cut comprises a finished product area, a first cutting area and a second cutting area which is positioned between the finished product area and the first cutting area;
cutting the first sub-board along a first direction to form a first substrate to be cut, wherein the first substrate to be cut is located in the second cutting area and the finished product area, the first direction is the direction in which the first sub-board points to the second sub-board, the second sub-board is cut along a second direction to form a second substrate located in the finished product area, the second direction is the direction in which the second sub-board points to the first sub-board, and the distance between the edge of the first substrate to be cut and the first cutting area is smaller than the distance between the edge of the second substrate to be cut and the first cutting area;
and cutting the first substrate to be cut along the second direction to form a first substrate positioned in the finished product area, wherein the distance between the edge of the first substrate and the second cutting area is smaller than the distance between the edge of the second substrate and the second cutting area.
2. The method for manufacturing a display panel according to claim 1, wherein in the step of providing the mother board to be cut, the second cutting area includes a first sub-area located on one side of the finished area and located between the finished area and the first cutting area;
and cutting the first sub-board along a first direction to form a first substrate to be cut which is positioned in the second cutting area and the finished product area, wherein the first direction is a direction in which the first sub-board points to the second sub-board, and cutting the second sub-board to form a second substrate which is positioned in the finished product area, and the edge of one side, close to the first sub-area, of the first substrate to be cut exceeds the edge of one side, close to the first sub-area, of the second substrate.
3. The method according to claim 2, wherein the step of cutting the first substrate to be cut along the second direction to form the first substrate in the finished product region comprises:
and cutting the first substrate to be cut along the second direction to form a first section on one side of the first substrate close to the first sub-area, wherein a cutting crack is formed at the first section, and the cutting crack is formed on one side of the first section close to the second substrate.
4. The method according to claim 3, wherein the first fracture surface comprises a natural fracture area and a crack distribution area which are adjacent to each other, and the natural fracture area is located on a side of the crack distribution area away from the second substrate;
the step of cutting the first substrate to be cut along the second direction to form the first substrate located in the finished product area includes:
cutting the first substrate to be cut along the second direction by using a cutting piece to obtain the first substrate;
wherein a cutting depth of the cutting member is less than a length of the crack distribution zone in the second direction.
5. The method of claim 4, wherein the depth of the cutting member is less than or equal to 5% of the thickness of the first substrate, and the length of the natural fracture region along the first direction is less than or equal to 20% of the thickness of the first substrate.
6. The method according to claim 3, wherein the step of cutting the first substrate to be cut along the second direction to form the first substrate in the finished product region comprises:
and forming a packaging adhesive layer on one side of the first substrate and one side of the second substrate close to the first sub-area, forming a second section on one side of the second substrate close to the first sub-area, and continuously covering the first section and the second section by the packaging adhesive layer.
7. The method for manufacturing a display panel according to claim 2, wherein in the step of providing the mother board to be cut, the second cutting area further includes a second sub-area located on one side of the finished area and located between the finished area and the first cutting area;
the step of cutting the first substrate to be cut along the second direction to form the first substrate located in the finished product area includes:
cutting and removing the first substrate to be cut in the second sub-area, wherein the edge of one side, close to the second sub-area, of the first substrate exceeds the edge of one side, close to the second sub-area, of the second substrate;
and forming a driving assembly on one side of the first substrate close to the second sub-area.
8. The method according to claim 7, wherein the step of cutting off the first substrate to be cut in the second sub-region comprises:
cutting and removing the first substrate to be cut in the second sub-area along the first direction;
or cutting and removing the first substrate to be cut in the second sub-area along the second direction.
9. The method of claim 2, wherein a distance between the edge of the first substrate near the first sub-region and the edge of the second substrate near the first sub-region exceeds is less than or equal to 1 mm.
10. The utility model provides a display panel, its characterized in that, display panel includes relative first base plate and the second base plate that sets up, display panel still includes relative first side and the second side that sets up, and is in first side department reaches second side department, the edge of first base plate surpasss the edge of second base plate.
11. The display panel according to claim 10, wherein the first substrate comprises a first cross section at the first side, wherein the first cross section comprises a cut crack, and wherein the cut crack is located on a side of the first cross section adjacent to the second substrate.
12. The display panel according to claim 11, wherein the display panel further comprises an encapsulation adhesive layer disposed at a position where the first substrate and the second substrate are close to the first side edge, the second substrate comprises a second cross section at the first side edge, and the encapsulation adhesive layer continuously covers the first cross section and the second cross section.
13. The display panel according to claim 10, wherein a distance by which an edge of the first substrate exceeds an edge of the second substrate at the first side is less than or equal to 1 mm.
14. The display panel of claim 10, further comprising a driving component, wherein the driving component is disposed on the first substrate near the second side.
15. A display device, comprising the display panel according to any one of claims 10 to 14, wherein the first substrate is curved at the first side edge and the second side edge.
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| CN202210996264.1A CN115469475A (en) | 2022-08-19 | 2022-08-19 | Display panel, manufacturing method thereof and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210996264.1A CN115469475A (en) | 2022-08-19 | 2022-08-19 | Display panel, manufacturing method thereof and display device |
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| CN202210996264.1A Pending CN115469475A (en) | 2022-08-19 | 2022-08-19 | Display panel, manufacturing method thereof and display device |
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