CN115460786A - Multi-layer thick copper plate glue filling process and equipment - Google Patents
Multi-layer thick copper plate glue filling process and equipment Download PDFInfo
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- CN115460786A CN115460786A CN202211223742.1A CN202211223742A CN115460786A CN 115460786 A CN115460786 A CN 115460786A CN 202211223742 A CN202211223742 A CN 202211223742A CN 115460786 A CN115460786 A CN 115460786A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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Abstract
The invention discloses a multilayer thick copper plate glue filling process and device, belongs to the field of thick copper plates, and comprises a workbench and a support frame fixedly connected to the top of the workbench, wherein the middle of the top of the workbench is fixedly connected with a placing table, four groups of sealing plates are arranged on the workbench, one of the four groups of sealing plates is provided with a moving block, the moving block is provided with a glue injection hole, the outer wall of one side of the workbench is provided with a glue supply assembly, the glue supply assembly is communicated with the glue injection hole, the four sides of the two groups of thick copper plates are sealed by driving the four groups of sealing plates through a driving assembly, glue injection Kong Gongjiao on the group of sealing plates is filled through the glue supply assembly, glue is filled between the two groups of thick copper plates, air between the two groups of thick copper plates is extruded while the glue is filled, so that the glue can completely fill gaps, the phenomenon that the glue cannot completely fill the holes to cause plate explosion is avoided, and the yield of production and the quality is improved.
Description
Technical Field
The invention relates to the technical field of thick copper plates, in particular to a glue filling process and glue filling equipment for a multilayer thick copper plate.
Background
In the solder resist manufacturing engineering of the printed circuit board, etching and pressing are the core processing processes of the printed circuit board, and now, in the industry, a thick copper circuit board appears, the copper layer of the thick copper circuit board has 4OZ, some copper layers even exceed 12OZ, and the thick copper board is generally applied to double-sided or 4-layer boards, for example, can be used as a connector.
However, when a thick copper circuit board is manufactured, some problems are easy to occur in glue filling, which is mainly reflected in that the circuit board is easy to crack, and the reliability of the circuit fails, because a plurality of thick copper plates need to be filled with glue by using a bonding sheet in a gap etched during pressing, and the thick copper plate needs a large amount of glue due to very thick thickness, but the mobility of the bonding sheet used in the industry at present is poor and the flowing time is limited, and whether the gap is filled with the glue of the bonding sheet or not within a limited time, the glue of the bonding sheet is cured under the action of temperature, so that the mobility is lost, a cavity is formed in the printed circuit board in an area which is not filled with the glue of the bonding sheet, and the cavity can crack due to gas expansion in the cavity when the printed circuit board is heated by reflow or at a temperature of more than 220 ℃ in a wave soldering machine in a subsequent assembling process, so that the printed circuit board is fatal to the printed circuit board.
Patent publication No. CN114173485A discloses thick copper plate preparation glue filling equipment and a method thereof, and the method comprises the following steps: the device comprises a rack, a plurality of telescopic mechanisms and a plurality of positioning devices, wherein the rack can be placed on a thick copper plate needing to be filled with glue, a movable frame is arranged inside the rack, and the bottom of the rack is provided with the plurality of telescopic mechanisms; the glue filling mechanism is arranged in the movable frame and is used for coating glue on the surface of the plate; the extruding mechanism is arranged on one side of the glue filling mechanism and communicated with the external glue barrel, and the extruding mechanism is arranged on the movable frame; the auxiliary mechanism is arranged between the rack and the movable frame, the pressure applied to the plate is uniformly transmitted on the same layer, and the prepreg flows more stably and uniformly in the laminating process, so that the integral plate thickness uniformity can be improved, the problem of poor glue filling of the thick copper plate can be effectively solved under the conditions of not increasing the cost and not affecting the efficiency, and the integral plate thickness uniformity is better.
However, when the brush roller is used, glue flows into the brush roller and is still prone to be uneven, and then the brush roller brushes the glue onto the thick copper plate, so that gaps are prone to occur.
Disclosure of Invention
In order to overcome the technical problems, the invention aims to provide a multi-layer thick copper plate glue filling process and equipment, wherein a group of thick copper plates are adsorbed by an adsorption assembly, then a lifting cylinder drives the thick copper plates to move, the distance between the two groups of thick copper plates is adjusted, the glue thickness glue filling accuracy is improved, then four groups of sealing plates are driven by a driving assembly to seal four sides of the two groups of thick copper plates, glue is filled between the two groups of thick copper plates by a glue supply assembly to glue injection Kong Gongjiao on the group of sealing plates, air between the two groups of thick copper plates is extruded while the glue is filled, so that the glue completely fills gaps, the problem that holes cannot be completely filled by the glue is avoided, the plate explosion is avoided, and the production yield and the production quality are improved.
The purpose of the invention can be realized by the following technical scheme:
the multi-layer thick copper plate glue filling equipment comprises a workbench and a support frame fixedly connected to the top of the workbench, wherein a placing table is fixedly connected to the middle of the top of the workbench, a lifting cylinder is fixedly connected to the top of the support frame, the output end of the lifting cylinder penetrates through the support frame and is fixedly connected with a fixed frame, and an adsorption assembly is arranged inside the fixed frame; the automatic glue injection device is characterized in that a driving assembly is arranged inside the workbench, four groups of lead screws are connected to the driving assembly in a transmission mode and are arranged at equal intervals along the circumference, one ends, far away from the driving assembly, of the four groups of lead screws are connected with the four sides of the inner wall of the workbench in a rotating mode respectively, sliding blocks are connected to the four groups of lead screws in a threaded mode, the tops of the four groups of sliding blocks penetrate through the workbench and are fixedly connected with a sealing plate, a moving block is arranged on one of the four groups of sealing plate, glue injection holes are formed in the moving block, a glue supply assembly is arranged on the outer wall of one side of the workbench, and the glue supply assembly is communicated with the glue injection holes.
As a further scheme of the invention: the adsorption component comprises a driving air cylinder, the driving air cylinder is fixedly connected inside the top of the fixing frame, the output end of the driving air cylinder is fixedly connected with a sliding plate, the bottom of the sliding plate is fixedly connected with a plurality of groups of connecting rods, a plurality of groups of suckers are arranged at the bottoms of the connecting rods, and a through groove corresponding to the plurality of groups of suckers is formed in the bottom of the fixing frame.
As a further scheme of the invention: the utility model discloses a quick-witted, including sucking disc, connecting rod outer wall cover, the sliding sleeve of sucking disc top fixedly connected with and the inside intercommunication of sucking disc, disappointing hole has been seted up to sliding sleeve one side bottom, the sealed pad of connecting rod bottom fixedly connected with, sealed pad sliding connection is inside the sliding sleeve, the connecting rod outer wall cover is equipped with first spring, the both ends of first spring offset with the sliding sleeve inner wall and sealed pad respectively.
As a further scheme of the invention: the driving assembly comprises a driving motor and a transmission rod, the output end of the driving motor is in transmission connection with the transmission rod through a bevel gear set, the top end of the transmission rod is fixedly connected with a first bevel gear, four groups of second bevel gears are in meshing connection with the first bevel gear, and the four groups of second bevel gears are respectively and fixedly connected with the four groups of screw rods.
As a further scheme of the invention: the sealing plate is characterized in that a first sliding groove is formed in the sealing plate close to one side of the glue supply assembly, the moving block is connected in the first sliding groove in a sliding mode, an adjusting cylinder is fixedly connected to the top of the sealing plate, and the output end of the adjusting cylinder penetrates through the sealing plate and is fixedly connected with the moving block.
As a further scheme of the invention: the glue supply assembly comprises a glue supply box, the glue supply box is fixedly connected to one side of the support frame, the bottom of the glue supply box is fixedly connected with a glue pump communicated with the glue supply box, the output end of the glue pump is fixedly connected with a glue outlet pipe, and one end, far away from the glue pump, of the glue outlet pipe is communicated with a glue injection hole.
As a further scheme of the invention: the improved glue feeding device is characterized in that a second sliding groove is formed in the sealing plate on the side, opposite to the glue feeding assembly, of the glue feeding assembly, a moving cylinder is fixedly connected to the top of the second sliding groove, the output end of the moving cylinder penetrates through the sealing plate and is fixedly connected with a control block, two sides of the control block are attached to inner walls of two sides of the second sliding groove, a groove is formed in the inner side of the control block, a supporting plate is fixedly connected to the middle of the groove, a sliding rod is slidably connected to the supporting plate, a baffle is fixedly connected to one end of the sliding rod, the outer side face of the baffle is parallel and level with the side face of the control block, a second spring is sleeved on the outer wall of the sliding rod, two ends of the second spring are respectively abutted to the baffle and the supporting plate, a push block is fixedly connected to the other end of the sliding rod, a contact switch is fixedly connected to the inner wall of the groove, and the push block is matched with the contact switch.
As a further scheme of the invention: the fixing frame and the workbench are internally provided with two groups of electric heating plates, and the electric heating plates are used for heating the thick copper plate.
The glue filling process for the multilayer thick copper plate comprises the following steps: the method comprises the following steps that firstly, thick copper plates are separated, two thick copper plates are placed on a placing table, four edges of the two thick copper plates are aligned with the placing table, then a driving air cylinder is started to drive a sucker to move downwards, one group of the upper sides of the two thick copper plates is adsorbed, then the driving air cylinder is started to reset to move upwards, and when the sucker drives the top of each thick copper plate to be attached to the bottom of a fixing frame, the driving air cylinder is stopped; adjusting the glue filling space, starting a lifting cylinder to drive a fixing frame to move downwards, enabling a thick copper plate at the bottom of the fixing frame to move downwards along with the fixing frame, and stopping the lifting cylinder when the space between the thick copper plate at the bottom of the fixing frame and the thick copper plate on a placing table reaches a set distance; step three, sealing the thick copper plate, starting a driving assembly, driving the four groups of screw rods to rotate by the driving assembly, driving the four groups of sealing plates to synchronously move inwards by sliding blocks on the four groups of screw rods, enabling the inner walls of the sealing plates to be attached to the placing table, the two groups of thick copper plates and the four outer side walls of the fixed frame, and sealing the glue filling gap between the two groups of thick copper plates with the glue filling gap adjusted; and step four, filling glue, namely starting a glue pump to pump out resin glue from the glue supply box, then sending the resin glue into the gap between the two groups of thick copper plates through a glue outlet pipe and a glue injection hole, and filling the glue in the gap between the two groups of thick copper plates in a flowing manner to finish the filling of the thick copper plates.
The invention has the beneficial effects that:
according to the invention, the adsorption component adsorbs one group of thick copper plates, the lifting cylinder drives the thick copper plates to move, the distance between the two groups of thick copper plates is adjusted, the accuracy of glue thickness filling is improved, the driving component drives the four groups of sealing plates to seal the four sides of the two groups of thick copper plates, the glue supply component fills the glue between the two groups of thick copper plates to the glue injection Kong Gongjiao on the group of sealing plates, air between the two groups of thick copper plates is extruded during glue filling, so that the glue is completely filled in gaps, cavities cannot be completely filled with the glue to avoid board explosion, and the yield of production and the quality of production are improved.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a front sectional structural schematic view of the present invention;
FIG. 2 is a schematic cross-sectional view of the inventive work bench;
FIG. 3 is a schematic view of a lead screw structure according to the present invention;
FIG. 4 is a schematic view of the connection structure of the connecting rod and the suction cup of the present invention;
FIG. 5 is a schematic view of the construction of the moving block of the present invention;
FIG. 6 is a block diagram illustrating the structure of the control block according to the present invention;
fig. 7 is an enlarged view of the portion a of fig. 6 according to the present invention.
In the figure: 1. a work table; 101. a support frame; 102. a placing table; 2. a lifting cylinder; 201. a fixed mount; 2011. a through groove; 3. an adsorption component; 301. a driving cylinder; 302. a slide plate; 303. a connecting rod; 3031. a gasket; 3032. a first spring; 304. a suction cup; 3041. a sliding sleeve; 3042. a gas release hole; 4. a drive assembly; 401. a drive motor; 402. a transmission rod; 403. a bevel gear set; 404. a first bevel gear; 405. a second bevel gear; 406. a limiting rod; 5. a screw rod; 501. a slider; 6. a sealing plate; 601. a first chute; 602. an adjusting cylinder; 603. a moving block; 6031. injecting glue holes; 604. a moving cylinder; 6041. a second chute; 605. a control block; 6051. a groove; 6052. a support plate; 6053. a slide bar; 603. a slide bar; 6054. a baffle plate; 6055. a push block; 6056. a second spring; 6057. an exhaust groove; 606. a contact switch; 7. a glue supply assembly; 701. a glue supply box; 702. a glue pump; 703. discharging the rubber tube; 8. an electric heating plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-7, the multilayer thick copper plate glue filling device comprises a workbench 1 and a support frame 101 fixedly connected to the top of the workbench 1, wherein a placing table 102 for placing a thick copper plate is fixedly connected to the middle of the top of the workbench 1, a lifting cylinder 2 is fixedly connected to the top of the support frame 101, an output end of the lifting cylinder 2 penetrates through the support frame 101 and is fixedly connected with a fixing frame 201, and an adsorption assembly 3 for adsorbing the thick copper plate is arranged inside the fixing frame 201; the inside drive assembly 4 that is provided with of workstation 1, the drive assembly 4 goes up the lead screw 5 that the transmission was connected with four group's circumference equidistance and sets up, four group's lead screw 5 one end of keeping away from drive assembly 4 rotates with workstation 1 inner wall four sides respectively and links to each other, equal threaded connection has slider 501 on four group's lead screw 5, workstation 1 and fixedly connected with closing plate 6 are all run through to four group's slider 501 tops, four group's closing plate 6 synchronous motion, the centre gripping is sealed to the thick copper on placing the platform 102, be provided with movable block 603 on one of them of four group's closing plate 6, multiunit injecting glue hole 6031 has been seted up on the movable block 603, 1 one side outer wall of workstation is provided with and supplies gluey subassembly 7, it is linked together with injecting glue hole 6031 to supply gluey subassembly 7, be used for carry out the injecting glue between two sets of thick copper through injecting glue hole 6031.
As shown in fig. 1 and 4, adsorption component 3 is including driving actuating cylinder 301, it is inside at mount 201 top to drive actuating cylinder 301 fixed connection, drive actuating cylinder 301 output fixedly connected with slide 302, slide 302 bottom fixedly connected with multiunit connecting rod 303, connecting rod 303 bottom is provided with multiunit sucking disc 304, logical groove 2011 that corresponds with multiunit sucking disc 304 is seted up to mount 201 bottom, it drives slide 302 and moves down to drive actuating cylinder 301, slide 302 drives sucking disc 304 downstream through connecting rod 303 and adsorbs a set of thick copper board of upside, multiunit connecting rod 303 is five groups, fixed connection is in slide 302 four corners and centre respectively, be convenient for fix thick copper board.
As shown in fig. 1 and 4, a sliding sleeve 3041 communicated with the inside of the suction cup 304 is fixedly connected to the top of the suction cup 304, a release hole 3042 is formed in the bottom of one side of the sliding sleeve 3041, a sealing gasket 3031 is fixedly connected to the bottom of the connecting rod 303, the sealing gasket 3031 is slidably connected to the inside of the sliding sleeve 3041, a first spring 3032 is sleeved on the outer wall of the connecting rod 303, two ends of the first spring 3032 respectively abut against the inner wall of the sliding sleeve 3041 and the sealing gasket 3031, so that the sealing gasket 3031 keeps abutting against the release hole 3042, and air cannot be adsorbed by the sliding sleeve 3041, meanwhile, the adsorption force of the suction cup 304 is greater than the tension of the first spring 3032, when the suction cup 304 adsorbs a thick copper plate, the driving cylinder 301 pulls the connecting rod 303 to move upwards through the 302 sliding plate to abut against the bottom of the fixing frame 201, so as long as to continue to drive the connecting rod 303 to move upwards, the connecting rod 303 drives the sealing gasket 3031 to move away from the release hole 3042, air outside of the sliding sleeve 3041 to enter the suction cup 304, and the negative pressure state is released, and the suction cup 304 no longer adsorbs the thick copper plate.
As shown in fig. 1, 2 and 3, the driving assembly 4 includes a driving motor 401 and a transmission rod 402, an output end of the driving motor 401 is in transmission connection with the transmission rod 402 through a bevel gear set 403, a first bevel gear 404 is fixedly connected to a top end of the transmission rod 402, four sets of second bevel gears 405 are in meshing connection with the first bevel gear 404, the four sets of second bevel gears 405 are respectively and fixedly connected with four sets of screw rods 5, the bevel gear set 403 includes two sets of transmission bevel gears, the two sets of transmission bevel gears are respectively and fixedly connected with an output end of the driving motor 401 and a bottom of the transmission rod 402, the two sets of transmission bevel gears are in meshing connection with each other, four sets of limiting rods 406 with equal circumference are fixedly connected inside the workbench 1, and four sets of sliders 501 respectively slide on the four sets of limiting rods 406.
As shown in fig. 1 and 5, a first chute 601 is formed inside the sealing plate 6 close to one side of the glue supply assembly 7, the moving block 603 is slidably connected in the first chute 601, an adjusting cylinder 602 is fixedly connected to the top of the sealing plate 6, the output end of the adjusting cylinder 602 penetrates through the sealing plate 6 and is fixedly connected with the moving block 603, the adjusting cylinder 602 is started to drive the moving block 603 to move up and down, the position of the glue injection hole 6031 is adjusted, convenience in filling different glue filling thicknesses is facilitated, and when the glue injection hole is moved up and down simultaneously, the first chute 601 is sealed through the moving block 603.
As shown in fig. 1, the glue supply assembly 7 includes a glue supply box 701, the glue supply box 701 is fixedly connected to one side of the support frame 101, a glue pump 702 is fixedly connected to the bottom of the glue supply box 701 and communicated with the glue supply box 701, a glue outlet pipe 703 is fixedly connected to an output end of the glue pump 702, one end of the glue outlet pipe 703, which is far away from the glue pump 702, is communicated with a glue injection hole 6031, glue is supplied to the glue injection hole 6031, and the glue outlet pipe 703 is a telescopic pipe.
As shown in fig. 1, 6 and 7, a sealing plate 6 on a side opposite to the glue supply assembly 7 is provided with a second chute 6041, a moving cylinder 604 is fixedly connected to a top of the second chute 6041, an output end of the moving cylinder 604 penetrates through the sealing plate 6 and is fixedly connected with a control block 605, two sides of the control block 605 are attached to inner walls of two sides of the second chute 6041, a groove 6051 is provided inside the control block 605, a support plate 6052 is fixedly connected to a middle of the groove 6051, a sliding rod 6053 is slidably connected to the support plate 6052, one end of the sliding rod 6053 is fixedly connected to a baffle 6054, an outer side surface of the baffle 6054 is flush with a side surface of the control block 605, a second spring 6056 is sleeved on an outer wall of the sliding rod 6053, two ends of the second spring 6056 respectively abut against the baffle 6054 and the support plate 6052, a push block 6055 is fixedly connected to the other end of the sliding rod 6053, a contact switch 606 is fixedly connected to an inner wall of the groove 6051, the push block 6055 is matched with the contact switch 606, and an exhaust groove 6057 is provided on one side of the control block 605.
The glue filling process for the multilayer thick copper plate comprises the following steps: the method comprises the steps that firstly, thick copper plates are separated, two thick copper plates are placed on a placing table 102, four sides of the two thick copper plates are aligned with the placing table 102, then a driving air cylinder 301 is started to drive a sucking disc 304 to move downwards, one group of the upper sides of the two thick copper plates is adsorbed, then the driving air cylinder 301 is started to reset and move upwards, and when the sucking disc 304 drives the top of each thick copper plate to be attached to the bottom of a fixing frame 201, the driving air cylinder 301 is stopped;
adjusting the glue filling distance, starting the lifting cylinder 2 to drive the fixing frame 201 to move downwards, enabling the thick copper plate at the bottom of the fixing frame 201 to move downwards along with the fixing frame 201, stopping the lifting cylinder 2 when the distance between the thick copper plate at the bottom of the fixing frame 201 and the thick copper plate on the placing table 102 reaches a set distance, and manually adjusting the set distance between two groups of thick copper plates according to the thickness of the thick copper plates;
step three, sealing the thick copper plate, starting a driving assembly 4, driving the driving assembly 4 to drive four groups of screw rods 5 to rotate, driving four groups of sealing plates 6 to synchronously move inwards by sliding blocks 501 on the four groups of screw rods 5, enabling the inner walls of the sealing plates 6 to be attached to the placing table 102, the two groups of thick copper plates and the four outer side walls of the fixing frame 201, and sealing the glue filling gap between the two groups of thick copper plates with the glue filling gap adjusted;
and step four, filling glue, namely starting a glue pump 702 to pump out resin glue from the glue supply box 701, then feeding the resin glue into a gap between the two groups of thick copper plates through a glue outlet pipe 703 and a glue injection hole 6031, and filling the glue in the gap between the two groups of thick copper plates in a flowing manner to finish the filling of the thick copper plates.
The working principle of the invention is as follows: when a user uses the device, two groups of thick copper plates are placed on the placing table 102, the four edges of the two groups of thick copper plates are aligned with the four edges of the placing table 102, then the driving cylinder 301 is started, the output end of the driving cylinder 301 drives the sliding plate 302 to move downwards, the connecting rod 303 at the bottom of the sliding plate 302 drives the sucker 304 to move out of the through groove 2011 at the bottom of the fixing frame 201, so that the sucker 304 is adsorbed and fixed on the upper surface of one group of thick copper plates at the upper side in the two groups of thick copper plates, then the driving cylinder 301 is started again to reset, the driving cylinder 301 drives the thick copper plates to move upwards through the sucker 304, when the upper surfaces of the thick copper plates are attached to the bottom of the fixing frame 201, the driving cylinder 301 is stopped, then the lifting cylinder 2 is started again, the lifting cylinder 2 drives the fixing frame 201 to move downwards, the fixing frame 201 drives one group of thick copper plates fixed at the bottom to move downwards, when the distance between the two groups of thick copper plates reaches the thickness setting of glue filling, stopping the lifting cylinder 2, starting the driving motor 401, driving the driving motor 401 to drive the driving rod 402 to rotate through the bevel gear set 403, driving the driving rod 402 to drive the first bevel gear 404 to rotate and engage with the four sets of second bevel gears 405, driving the four sets of screw rods 5 to rotate through the four sets of second bevel gears 405, driving the four sets of sliding blocks 501 on the four sets of screw rods 5 to drive the four sets of sealing plates 6 to synchronously move inwards, stopping the driving motor 401 when the inner sides of the four sets of sealing plates 6 are attached to the placing table 102, the two sets of thick copper plates and the fixing frame 201, sealing the four sides of the two sets of thick copper plates through the four sets of sealing plates 6, starting the glue pump 702, pumping glue out of the glue supply box 701 by the glue pump 702, entering the glue injection hole 6031 through the glue outlet pipe 703, filling glue into the gap between the two sets of thick copper plates through the glue injection hole 6031, and filling the glue between the two sets of thick copper plates when flowing in the gap, air in the gap is exhausted through an exhaust groove 6057 on the side wall of a control block 605, air is prevented from being remained in glue to form bubbles, when the glue is completely filled in the gap between two groups of thick copper plates, the gap is continuously filled, the pressure in the gap is increased, a baffle 6054 is pushed to move through the pressure of the glue, the baffle 6054 drives a sliding rod 6053 to move in a groove 6051, a pushing block 6055 at one end, away from the baffle 6054, of the sliding rod 6053 moves to abut against a contact switch 606, the contact switch 606 controls a glue pump 702 to stop supplying the glue, then a lifting cylinder 2 is started to drive a fixing frame 201 to continuously move downwards, the two groups of thick copper plates and the glue are subjected to pressing and fixing, a driving motor 401 is started to rotate reversely after the pressing and fixing, the driving motor 401 drives four groups of sealing plates 6 to move outwards through the four groups of sliding blocks 501 to separate from the thick copper plates, a driving cylinder 301 is started, the driving cylinder 301 drives the connecting rod 303 to drive the connecting rod 303 to move upwards through the sliding plate 302, the connecting rod 303 pulls a sealing gasket 3031 to move upwards in the sliding sleeve 3041, the sliding sleeve 3041 to remove the air outside of the sliding sleeve 3041, then enters the sliding sleeve 3041, the sucking disc is not to remove the state of the thick copper plates, and the sucking disc, the sucking disc is removed from the sucking disc moving cylinder 304, and the sucking disc 2, and the sucking disc is removed from the thick copper plate lifting cylinder, and the sucking disc 2, and the sucking disc is removed from the thick copper plate.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (9)
1. The multi-layer thick copper plate glue filling equipment comprises a workbench (1) and a support frame (101) fixedly connected to the top of the workbench (1), and is characterized in that a placing table (102) is fixedly connected to the middle of the top of the workbench (1), a lifting cylinder (2) is fixedly connected to the top of the support frame (101), the output end of the lifting cylinder (2) penetrates through the support frame (101) and is fixedly connected with a fixed frame (201), and an adsorption assembly (3) is arranged inside the fixed frame (201);
workstation (1) is inside to be provided with drive assembly (4), the transmission is connected with lead screw (5) that four groups of circumference equidistance set up on drive assembly (4), four groups the one end that drive assembly (4) were kept away from in lead screw (5) rotates with workstation (1) inner wall four sides respectively and links to each other, four groups equal threaded connection has slider (501), four groups slider (501) top all runs through workstation (1) and fixedly connected with closing plate (6), four groups wherein be provided with movable block (603) on a set of in closing plate (6), glue injection hole (6031) have been seted up on movable block (603), workstation (1) one side outer wall is provided with and supplies gluey subassembly (7), it is linked together with glue injection hole (6031) to supply gluey subassembly (7).
2. The glue filling equipment for the multilayer thick copper plates according to claim 1, wherein the adsorption assembly (3) comprises a driving cylinder (301), the driving cylinder (301) is fixedly connected inside the top of the fixing frame (201), a sliding plate (302) is fixedly connected to the output end of the driving cylinder (301), a plurality of groups of connecting rods (303) are fixedly connected to the bottom of the sliding plate (302), a plurality of groups of suckers (304) are arranged at the bottom of the connecting rods (303), and a through groove (2011) corresponding to the plurality of groups of suckers (304) is formed at the bottom of the fixing frame (201).
3. The multi-layer thick copper plate glue filling equipment according to claim 2, wherein a sliding sleeve (3041) communicated with the inside of the sucking disc (304) is fixedly connected to the top of the sucking disc (304), a gas leakage hole (3042) is formed in the bottom of one side of the sliding sleeve (3041), a sealing gasket (3031) is fixedly connected to the bottom of the connecting rod (303), the sealing gasket (3031) is slidably connected to the inside of the sliding sleeve (3041), a first spring (3032) is sleeved on the outer wall of the connecting rod (303), and two ends of the first spring (3032) are respectively abutted against the inner wall of the sliding sleeve (3041) and the sealing gasket (3031).
4. The glue filling equipment for the multilayer thick copper plate according to claim 1, wherein the driving assembly (4) comprises a driving motor (401) and a transmission rod (402), the output end of the driving motor (401) is in transmission connection with the transmission rod (402) through a bevel gear set (403), a first bevel gear (404) is fixedly connected to the top end of the transmission rod (402), four groups of second bevel gears (405) are in meshing connection with the first bevel gear (404), and the four groups of second bevel gears (405) are respectively and fixedly connected with the four groups of screw rods (5).
5. The multilayer thick copper plate glue filling device according to claim 1, wherein a first sliding groove (601) is formed in the sealing plate (6) close to one side of the glue supply assembly (7), the moving block (603) is slidably connected in the first sliding groove (601), an adjusting cylinder (602) is fixedly connected to the top of the sealing plate (6), and an output end of the adjusting cylinder (602) penetrates through the sealing plate (6) and is fixedly connected with the moving block (603).
6. The glue filling equipment for the multilayer thick copper plate according to claim 1, wherein the glue supply assembly (7) comprises a glue supply box (701), the glue supply box (701) is fixedly connected to one side of the support frame (101), a glue pump (702) communicated with the glue supply box (701) is fixedly connected to the bottom of the glue supply box (701), a glue outlet pipe (703) is fixedly connected to an output end of the glue pump (702), and one end, far away from the glue pump (702), of the glue outlet pipe (703) is communicated with the glue injection hole (6031).
7. The glue filling equipment for the multilayer thick copper plate according to claim 1, wherein a second sliding groove (6041) is formed in the sealing plate (6) on the side opposite to the glue supply assembly (7), a moving cylinder (604) is fixedly connected to the top of the second sliding groove (6041), the output end of the moving cylinder (604) penetrates through the sealing plate (6) and is fixedly connected with a control block (605), two sides of the control block (605) are attached to inner walls of two sides of the second sliding groove (6041), a groove (6051) is formed in the inner side of the control block (605), a supporting plate (6052) is fixedly connected to the middle of the groove (6051), a sliding rod (6053) is slidably connected to the supporting plate (6052), one end of the sliding rod (6053) is fixedly connected with a baffle (6054), the outer side face of the baffle (6054) is flush with the side face of the control block (605), a second spring (6056) is sleeved on the outer wall of the sliding rod (6053), two ends of the second spring (6056) respectively abut against the baffle (6054) and the supporting plate (6052) and a contact point (6055) is connected with a switch contact point (6055), and a switch contact point (6055) is matched with the inner wall (6055).
8. The multilayer thick copper plate glue filling equipment according to claim 1, characterized in that two groups of electric heating plates (8) are arranged inside the fixed frame (201) and the workbench (1), and the electric heating plates (8) are used for heating the thick copper plates.
9. The glue filling process for the multilayer thick copper plate is characterized by comprising the following steps of:
the method comprises the steps that firstly, thick copper plates are separated, two thick copper plates are placed on a placing table (102), four sides of the two thick copper plates are aligned with the placing table (102), then a driving air cylinder (301) is started to drive a sucker (304) to move downwards, a group of upper sides of the two thick copper plates is adsorbed, then the driving air cylinder (301) is started to reset to move upwards, and when the sucker (304) drives the top of the thick copper plate to be attached to the bottom of a fixing frame (201), the driving air cylinder (301) is stopped;
adjusting the glue filling space, starting the lifting cylinder (2) to drive the fixing frame (201) to move downwards, enabling the thick copper plate at the bottom of the fixing frame (201) to move downwards along with the fixing frame (201), and stopping the lifting cylinder (2) when the space between the thick copper plate at the bottom of the fixing frame (201) and the thick copper plate on the placing table (102) reaches a set distance;
step three, sealing the thick copper plate, starting a driving assembly (4), driving four groups of screw rods (5) to rotate by the driving assembly (4), driving four groups of sealing plates (6) to synchronously move inwards by sliding blocks (501) on the four groups of screw rods (5), enabling the inner walls of the sealing plates (6) to be attached to the placing table (102), the two groups of thick copper plates and the outer walls of the four sides of the fixing frame (201), and sealing the glue filling gaps between the two groups of thick copper plates with the glue filling gaps adjusted;
and step four, filling glue, namely starting a glue pump (702) to pump out resin glue from the glue supply box (701), then sending the resin glue into a gap between the two groups of thick copper plates through a glue outlet pipe (703) and a glue injection hole (6031), and filling the glue in the gap between the two groups of thick copper plates in a flowing manner to finish the glue filling of the thick copper plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211223742.1A CN115460786A (en) | 2022-10-08 | 2022-10-08 | Multi-layer thick copper plate glue filling process and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211223742.1A CN115460786A (en) | 2022-10-08 | 2022-10-08 | Multi-layer thick copper plate glue filling process and equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115460786A true CN115460786A (en) | 2022-12-09 |
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ID=84309242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211223742.1A Withdrawn CN115460786A (en) | 2022-10-08 | 2022-10-08 | Multi-layer thick copper plate glue filling process and equipment |
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| Country | Link |
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| CN (1) | CN115460786A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115802628A (en) * | 2023-02-07 | 2023-03-14 | 广州弘高科技股份有限公司 | Laminating equipment and laminating process for copper-clad circuit board |
-
2022
- 2022-10-08 CN CN202211223742.1A patent/CN115460786A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115802628A (en) * | 2023-02-07 | 2023-03-14 | 广州弘高科技股份有限公司 | Laminating equipment and laminating process for copper-clad circuit board |
| CN115802628B (en) * | 2023-02-07 | 2023-05-02 | 广州弘高科技股份有限公司 | Laminating equipment and laminating process of copper-clad circuit board |
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Application publication date: 20221209 |
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