CN115459724A - Semi-integrated miniaturized LC filter, preparation method and switch filtering set - Google Patents

Semi-integrated miniaturized LC filter, preparation method and switch filtering set Download PDF

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Publication number
CN115459724A
CN115459724A CN202211202168.1A CN202211202168A CN115459724A CN 115459724 A CN115459724 A CN 115459724A CN 202211202168 A CN202211202168 A CN 202211202168A CN 115459724 A CN115459724 A CN 115459724A
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filter
ceramic substrate
layer
capacitors
integrated
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蒲志勇
杨卫东
唐盘良
杨桃均
吕翼
杜雪松
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CETC 26 Research Institute
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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01Frequency selective two-port networks
    • H03H7/0115Frequency selective two-port networks comprising only inductors and capacitors
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021Constructional details
    • H03H2001/0085Multilayer, e.g. LTCC, HTCC, green sheets

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  • Power Engineering (AREA)
  • Filters And Equalizers (AREA)

Abstract

The invention discloses a semi-integrated miniaturized LC filter, a preparation method and a switch filter group, wherein the LC filter comprises a ceramic substrate, the ceramic substrate consists of a top layer, a middle layer and a bottom layer, the middle layer of the ceramic substrate is integrated with a plurality of capacitors through an LTCC process, a bonding pad is arranged on the surface of the top layer of the ceramic substrate, and a plurality of inductors are welded on the bonding pad; all inductors form required circuit connection through the bonding pads and the capacitor, rectangular bonding pads are arranged at the left end and the right end of the bottom layer of the ceramic substrate respectively and are used as input and output ports of signals of the LC filter, and a grounding bonding pad is arranged between the two rectangular bonding pads at the bottom layer of the ceramic substrate to ensure that the LC filter is well grounded. The invention integrates the capacitors in the ceramic substrate, saves the space occupied by the separation capacitors, and is simpler than the technology of a chip LC filter designed by a semi-lumped LC filter and an IPD technology; the Q value of the filter can be improved and the loss can be reduced by adopting a small-volume separation inductor to replace an integrated inductor.

Description

Semi-integrated miniaturized LC filter, preparation method and switch filtering set
Technical Field
The invention relates to the technical field of radio frequency communication, in particular to a semi-integrated miniaturized LC filter, a preparation method and a switch filter group, which are used for providing signal separation and interference suppression for radio frequency communication.
Background
The LC filter is a passive device formed by a capacitor and an inductor according to a certain transfer function. Filters with different transfer functions are applied to different locations corresponding to different frequency responses. Because the impedance of the capacitor and the inductor varies with the frequency of the signal, different combinations present little or great reactance to the signal of a specific frequency, and the LC filter utilizes the characteristic to pass the signal of a certain frequency smoothly or block the signal of a certain frequency, thereby playing the roles of selecting the signal of a certain frequency and filtering the signal of a certain frequency. LC filters are widely used in rf communication circuits due to their advantages, such as wide bandwidth coverage, flexible circuit structure, and low cost.
With the development of radio frequency communication technology, not only is modularity required for a radio frequency module, but also performance requirements are higher and higher. The traditional LC filter is a device which is designed according to circuit topology, wherein a separation inductor and a chip capacitor are welded on a circuit board and then are arranged in a metal cavity. Although the traditional LC filter has been reduced in size by continuously reducing the size of the separation inductor and the chip capacitor, the size is limited by the minimum size of the components, so that the miniaturization of the size is restricted. The LC filter in the current market is not generally large in size or reduced in size at the cost of performance loss, and cannot meet the requirements of small-size and high-performance places.
The inductor and the capacitor are integrated in the substrate by adopting the LTCC or HTCC process, the size of the LC filter can be successfully reduced, but the Q value of the LC filter is not high due to the influence of parasitic parameters, and the advantage of designing the LC filter by adopting the method below the P wave band can be avoided. An LC filter designed based on a silicon-based or gallium arsenide IPD process has a poor Q value as a result of a planar two-dimensional structure of a capacitor and an inductor, and cannot meet high-performance applications.
The semi-lumped or integrated LC filter prepared by LTCC process and the chip LC filter designed by IPD process greatly reduce the volume of the traditional LC filter. However, compared with the traditional LC filter, the filter designed by the methods has the defects of low Q value and poor suppression, and cannot meet the requirements of certain communication fields on miniaturization and high performance of the LC filter.
Disclosure of Invention
Aiming at the defects of the prior art, the technical problems to be solved by the invention are as follows: how to provide a semi-integrated miniaturized LC filter and a switch filter group which have small volume, high Q value of devices, small loss, high suppression and low cost.
In order to solve the technical problems, the invention adopts the following technical scheme:
a semi-integrated miniaturized LC filter comprises a ceramic substrate, wherein the ceramic substrate is composed of a top layer, an intermediate layer and a bottom layer, a plurality of capacitors are integrated in the intermediate layer of the ceramic substrate through an LTCC process, a bonding pad is arranged on the surface of the top layer of the ceramic substrate, and a plurality of inductors are welded on the bonding pad; all inductors form required circuit connection through pads and capacitors, rectangular pads are arranged at the left end and the right end of the bottom layer of the ceramic substrate respectively and used as input ports and output ports of signals of the LC filter, and a grounding pad is arranged between the two rectangular pads at the bottom layer of the ceramic substrate to ensure that the LC filter is well grounded.
Further, the intermediate layers of the ceramic substrate are multi-layered, so that the required capacitance value can be realized by increasing or decreasing the number of the intermediate layers.
Furthermore, by circuit design, the circuits of the LC filter are connected to form a circuit topology structure that all inductors are symmetrically arranged according to inductance values and all capacitors are symmetrically arranged according to capacitance values; a plurality of capacitors integrated in the middle layer of the ceramic substrate are symmetrically arranged on the uppermost middle layer in a left-right mode in an electrode mode according to capacitance values and are connected with the bonding pads on the top layer, and therefore the three-dimensional modeling simulation period is shortened.
Furthermore, reinforced ceramic layers are respectively arranged on the upper surface of the top layer and the lower surface of the bottom layer of the ceramic substrate, and electrodes which are correspondingly connected with the corresponding electrodes on the upper surface of the top layer and the lower surface of the bottom layer are arranged on the outer surfaces of the reinforced ceramic layers one by one so as to increase the mechanical strength of the ceramic substrate; the bonding pad sets up the reinforcing ceramic layer upper surface that is located the top layer top, and two rectangle bonding pads set up both ends about the reinforcing ceramic layer lower surface that is located the bottom below respectively, and the ground connection bonding pad sets up the reinforcing ceramic layer lower surface between two rectangle bonding pads.
Furthermore, a metal frame wraps the periphery of the ceramic substrate, the metal frame is of a rectangular structure with an upper opening and a lower opening, the opening end face of the metal frame and the bottom layer of the ceramic substrate are coplanar, the metal frame and the ceramic substrate are subjected to reflow soldering, and a cover plate is welded on the parallel seam of the other opening end face of the metal frame to improve the shielding performance of the filter.
The invention also provides a preparation method of the semi-integrated miniaturized LC filter, which comprises the following steps:
s1, designing a circuit topological structure with all inductors symmetrically arranged according to inductance values and all capacitors symmetrically arranged according to capacitance values according to filter performance indexes;
s2, integrating all capacitors into the ceramic substrate through an LTCC process, wherein all the capacitors are symmetrically arranged on the ceramic substrate in a left-right electrode mode according to capacitance values;
and S3, wrapping a metal frame around the ceramic substrate, performing reflux welding on the metal frame and the ceramic substrate, symmetrically welding all inductors on corresponding bonding pads of the ceramic substrate, and finally performing parallel seam welding on the cover plate.
The invention also provides a switch filtering group, which comprises a plurality of LC filters connected in parallel, wherein all the LC filters are the semi-integrated miniaturized LC filters, the input ports of the filters connected in parallel are connected with an input matching network through a switch, and the input matching network is used for being connected with an input radio frequency signal; the output port of the filter after parallel connection is connected with an output matching network through a switch, and the output matching network is used for outputting a radio frequency signal; the switch is used for controlling a channel through which the radio-frequency signal passes, and communication of signals with different frequencies is achieved.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention integrates the capacitors in the ceramic substrate, saves the space occupied by the separation capacitors, and is simpler than the integrated or semi-lumped LC filter prepared by LTCC process and the chip LC filter designed by IPD process.
2. The invention adopts the stacked plate technology to integrate a plurality of capacitors in the ceramic substrate and the small-volume separation inductor to replace an integrated inductor, can improve the Q value of the filter and reduce the loss, and compared with the traditional LC filter, IPD filter and LTCC integrated filter, especially in the frequency band below the P wave band, the LC filter of the invention not only has small volume, but also can keep the index of high performance.
3. The reinforced ceramic layers are respectively arranged on the upper surface of the top layer and the lower surface of the bottom layer of the ceramic substrate, so that the influence of the parasitic parameters of the integrated capacitor electrode to ground is reduced, and the mechanical strength of the ceramic substrate can be increased.
4. The inductors in the circuit topological structure are symmetrically arranged according to the inductance value, so that the specification of the inductors is reduced, the cost is reduced, high-performance indexes can be kept, the debugging amount is reduced, and the production efficiency is improved; the capacitor specification is reduced and the three-dimensional modeling simulation period is reduced by symmetrically setting the capacitance values in the circuit topological structure.
Drawings
For purposes of promoting a better understanding of the objects, aspects and advantages of the invention, reference will now be made in detail to the present invention as illustrated in the accompanying drawings, in which:
FIG. 1 is a top view of a semi-integrated miniaturized LC filter of the present invention;
FIG. 2 is a bottom view of FIG. 1;
FIG. 3 is a schematic view of a ceramic substrate of the integrated capacitor array of the present invention;
FIG. 4 is a schematic diagram of a bonding pad of the present invention;
FIG. 5 is a schematic diagram of the circuit topology of a semi-integrated miniaturized LC filter of the present invention;
FIG. 6 is a schematic diagram of the overall structure of a semi-integrated miniaturized LC filter according to the present invention;
fig. 7 is a schematic diagram of a filter bank of LC switches according to the present invention.
In the figure: 1. a ceramic substrate; 2. a pad; 3. an inductor; 4. a rectangular pad; 5. a ground pad; 6. a metal frame; 7. and a cover plate.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1, 2, 3 and 4, a semi-integrated miniaturized LC filter in this embodiment includes a ceramic substrate 1, the ceramic substrate is composed of a top layer, an intermediate layer and a bottom layer, wherein a plurality of capacitors are integrated in the intermediate layer of the ceramic substrate through LTCC process, a pad is disposed on the top layer of the ceramic substrate, a plurality of inductors are welded on the pad, all the inductors form a required circuit connection through the pad and the capacitors, rectangular pads are disposed at the left and right ends of the bottom layer of the ceramic substrate respectively for serving as an input port and an output port of a signal of the LC filter, and a ground pad is disposed between two rectangular pads on the bottom layer of the ceramic substrate to ensure that the LC filter is grounded well.
The capacitor is integrated in the ceramic substrate through the LTCC process in the scheme, the occupied space of the separation capacitor is saved, the capacitor is enabled to have high Q value and capacitance value consistency through stacking a flat plate technology, damage to the capacitor body caused by a capacitor assembling process is avoided, and the process of the semi-lumped LC filter prepared through the LTCC process and the process of the chip LC filter designed through the IPD process is simpler. The ceramic substrate is made of a ceramic material with a dielectric constant of 6.8 +/-0.3 @11GHz, a dielectric loss of 0.05@11GHz and a thermal expansion coefficient of 5.3 ppm/DEG C.
In this embodiment, the intermediate layers of the ceramic substrate are multiple layers, so that the required capacitance value can be realized in a three-dimensional structure only by increasing or decreasing the number of the intermediate layers or the electrode area of the intermediate layers according to the capacitance value of the filter with different frequencies, thereby sufficiently embodying the flexibility and the modular design.
Referring to fig. 5, in order to reduce the three-dimensional modeling simulation cycle, in this embodiment, the circuits of the filter are connected to form a circuit topology structure in which all inductors are symmetrically arranged according to inductance values and all capacitors are symmetrically arranged according to capacitance values through circuit design of the inductors and the capacitors; a plurality of capacitors integrated in the middle layers of the ceramic substrate are symmetrically arranged on the uppermost middle layer in a left-right mode in an electrode mode according to capacitance values and are connected with the bonding pads on the top layer, and therefore the three-dimensional modeling simulation period is shortened. In fig. 5, C denotes a capacitor and L denotes an inductor; in order to obtain high squareness, two transmission zeros are respectively introduced at the low end and the high end of the filter; all capacitors are symmetrically arranged according to capacitance values, namely C8 is taken as a symmetry axis, C1 and C15, C2 and C14, C3 and C13 \8230, inductance values are equally and symmetrically arranged, and finally the specifications of the capacitance values are reduced to 8; in order to reduce the number and specification of inductors in a circuit topological structure as much as possible and improve the production efficiency, all the inductors are symmetrically arranged according to equal inductance values, and finally the specification of the inductance values is reduced to 3, namely L1, L2 and L3.
Therefore, a plurality of capacitors can be integrated in the ceramic substrate by adopting the stacked flat plate technology, and the small-volume separation inductor replaces an integrated inductor, so that the Q value of the filter is improved, and the loss is reduced.
In order to further improve the Q value of the integrated capacitor, the capacitors C1, C2, C4, C5, C7, C9, C11, C12, C14 and C15 (namely capacitors on the non-main circuit) are modeled by approaching the grounding terminal electrode to the upper part of the grounding pad, and distancing the signal terminal electrode from the grounding pad.
In order to reduce the influence of the parasitic parameters of the electrode grounding of the integrated capacitor and increase the mechanical strength of the ceramic substrate, in this embodiment, the top surface and the bottom surface of the ceramic substrate are respectively provided with the enhanced ceramic layers, and the outer surfaces of the enhanced ceramic layers are provided with electrodes which are connected with the corresponding top surface electrodes and the bottom surface electrodes in a one-to-one correspondence manner, so that the mechanical strength of the ceramic substrate is increased, and the Q value of the capacitor in the integrated middle layer is increased. The welding disc is arranged on the upper surface of the reinforced ceramic layer above the top layer, the two rectangular welding discs are respectively arranged at the left end and the right end of the lower surface of the reinforced ceramic layer below the bottom layer, and the grounding welding disc is arranged on the lower surface of the reinforced ceramic layer between the two rectangular welding discs.
The thickness of the ceramic substrate is controlled to be 1mm, and the thickness of the ceramic substrate can be controlled by increasing and reducing the thickness of the reinforced ceramic layer.
Referring to fig. 6, in specific implementation, the periphery of the ceramic substrate is wrapped with a metal frame 6, the metal frame is a rectangular structure with an upper opening and a lower opening, an opening end face of one metal frame is coplanar with the bottom layer of the ceramic substrate, the metal frame and the ceramic substrate are subjected to reflow soldering, and a cover plate 7 is welded on the other opening end face of the metal frame in a parallel seam manner, so that the shielding performance of the filter is improved.
The key point of the semi-integrated miniaturized LC filter is that the LC filter has the advantages of high Q value, high squareness factor, high suppression and the like while keeping small volume. The invention has the advantages that the separated capacitors are stacked in the ceramic substrate by utilizing the LTCC process, the volume occupied by the separated capacitors is reduced, the capacitors have high Q value and capacitance value consistency in an integrated mode, and the damage of a capacitor ceramic body in a capacitor assembling process is avoided. While leaving the inductor separated, its Q value is not affected. Compared with the traditional LC filter, IPD filter and LTCC lumped filter, the size of the filter is reduced, and high performance indexes are kept. The LC filter is designed in the frequency band below the L band, and the advantages are very obvious.
The invention also provides a preparation method of the semi-integrated miniaturized LC filter, which comprises the following steps:
s1, designing a circuit topology structure with all inductors symmetrically arranged according to inductance values and all capacitors symmetrically arranged according to capacitance values according to filter performance indexes (filter frequency);
s2, integrating all capacitors into the ceramic substrate through an LTCC process, wherein all the capacitors are symmetrically arranged on the ceramic substrate in a left-right mode in an electrode mode according to capacitance values;
s3, wrapping a metal frame around the ceramic substrate, performing reflow soldering with the ceramic substrate, symmetrically soldering all inductors on corresponding pads of the ceramic substrate, debugging and gluing, and finally parallel seam welding the cover plate.
When the LC filter is specifically implemented, in the step S2, the ceramic substrate is composed of a top layer, a middle layer and a bottom layer, all capacitors are integrated in the middle layer of the ceramic substrate through an LTCC process, bonding pads are arranged on the surface of the top layer of the ceramic substrate, all inductors form required circuit connection through the bonding pads and the capacitors, rectangular bonding pads are arranged at the left end and the right end of the bottom layer of the ceramic substrate respectively and used as input ports and output ports of signals of the LC filter, and grounding bonding pads are arranged between the two rectangular bonding pads at the bottom layer of the ceramic substrate to guarantee good grounding of the LC filter.
The middle layer is a plurality of layers, so that the required capacitance value can be realized only by increasing or reducing the number of layers of the integrated middle layer in the three-dimensional structure according to the capacitance value of the filter with different frequency bands, and the flexibility of the integrated middle layer is fully embodied.
According to the index requirements of the LC filter, a circuit topological structure is designed, wherein all inductors are symmetrically arranged according to inductance values, all capacitors are symmetrically arranged according to capacitance values, all inductors are integrated into a ceramic substrate through an LTCC process, and all capacitors are symmetrically arranged on the ceramic substrate in a left-right electrode mode according to the capacitance values; and then, reflow soldering the metal frame on the ceramic substrate, manually soldering the inductor on a corresponding bonding pad of the substrate, debugging, gluing and curing, and finally parallel seam welding the cover plate. Therefore, for filters of different frequency bands, according to the capacitance value, the required value can be realized only by increasing or reducing the number of layers of the middle layer of the integrated ceramic substrate and the electrode area in the three-dimensional structure, and the flexibility and the modular design of the integrated ceramic substrate are fully embodied.
Referring to fig. 7, the present invention further provides a switch filtering group, which includes a plurality of LC filters connected in parallel, all of which are the above-mentioned semi-integrated miniaturized LC filter, an input port of the filter connected in parallel is connected to an input matching network through a switch, and the input matching network is used for connecting with an input radio frequency signal; the output port of the LC filter after parallel connection is connected with an output matching network through a switch, and the output matching network is used for outputting a radio frequency signal; the switch is used for controlling a channel through which the radio-frequency signal passes, and communication of signals with different frequencies is achieved. The switch filter group is mainly applied to equipment for multi-channel communication, such as a phase control radar receiver.
Finally, it is to be understood that the above embodiments are illustrative only and not restrictive, and that various changes in form and details may be made therein by those skilled in the art while having described the present invention with reference to the preferred embodiments thereof. All obvious changes which are introduced by the technical solution of the invention are still within the protective scope of the invention.

Claims (7)

1. A semi-integrated miniaturized LC filter is characterized by comprising a ceramic substrate, wherein the ceramic substrate consists of a top layer, an intermediate layer and a bottom layer, a plurality of capacitors are integrated in the intermediate layer of the ceramic substrate through an LTCC process, a bonding pad is arranged on the surface of the top layer of the ceramic substrate, and a plurality of inductors are welded on the bonding pad; all inductors form required circuit connection through pads and capacitors, rectangular pads are arranged at the left end and the right end of the bottom layer of the ceramic substrate respectively and used as an input port and an output port of signals of the LC filter, and a grounding pad is arranged between the two rectangular pads at the bottom layer of the ceramic substrate to ensure that the LC filter is well grounded.
2. A semi-integrated miniaturized LC filter according to claim 1, characterized in that the ceramic substrate intermediate layers are multi-layered to achieve the desired capacitance value by increasing or decreasing the number of layers of the intermediate layers.
3. The semi-integrated miniaturized LC filter of claim 1 or 2, characterized in that, by circuit design, the circuit connection of the LC filter forms a circuit topology structure in which all inductors are symmetrically arranged according to inductance value and all capacitors are symmetrically arranged according to capacitance value; a plurality of capacitors integrated in the middle layer of the ceramic substrate are symmetrically arranged on the uppermost middle layer in a left-right mode in an electrode mode according to capacitance values and are connected with the bonding pads on the top layer, and therefore the three-dimensional modeling simulation period is shortened.
4. The semi-integrated miniaturized LC filter of claim 3, wherein the ceramic substrate is provided with a reinforced ceramic layer on the top surface of the top layer and a reinforced ceramic layer on the bottom surface of the bottom layer, and the outer surface of the reinforced ceramic layer is provided with electrodes correspondingly connected with the corresponding electrodes on the top surface of the top layer and the bottom surface of the bottom layer in a one-to-one correspondence manner, so as to increase the mechanical strength of the ceramic substrate; the pad sets up the reinforcing ceramic layer upper surface that is located the top layer top, and two rectangle pads set up both ends about the reinforcing ceramic layer lower surface that is located the bottom below respectively, and the ground pad sets up the reinforcing ceramic layer lower surface between two rectangle pads.
5. The LC filter of claim 1, wherein the ceramic substrate is surrounded by a metal frame, the metal frame has a rectangular structure with upper and lower openings, one opening end surface of the metal frame is coplanar with the bottom layer of the ceramic substrate, the metal frame is reflow-welded to the ceramic substrate, and a cover plate is parallel-seam-welded to the other opening end surface of the metal frame to improve the shielding performance of the filter.
6. A preparation method of a semi-integrated miniaturized LC filter is characterized by comprising the following steps:
s1, designing a circuit topological structure with all inductors symmetrically arranged according to inductance values and all capacitors symmetrically arranged according to capacitance values according to filter performance indexes;
s2, integrating all capacitors into the ceramic substrate through an LTCC process, wherein all the capacitors are symmetrically arranged on the ceramic substrate in a left-right mode in an electrode mode according to capacitance values;
s3, wrapping a metal frame around the ceramic substrate, performing reflow soldering with the ceramic substrate, symmetrically soldering all inductors on corresponding pads of the ceramic substrate, and finally performing parallel seam welding on the cover plate.
7. A switch filter group is characterized by comprising a plurality of LC filters which are connected in parallel, wherein all the LC filters are the semi-integrated miniaturized LC filter disclosed by claim 1, an input port of each filter which is connected in parallel is connected with an input matching network through a switch, and the input matching network is used for being connected with an input radio-frequency signal; the output port of the filter after parallel connection is connected with an output matching network through a switch, and the output matching network is used for outputting a radio frequency signal; the switch is used for controlling a channel through which the radio-frequency signal passes, and signal communication of different frequencies is achieved.
CN202211202168.1A 2022-09-29 2022-09-29 Semi-integrated miniaturized LC filter, preparation method and switch filtering set Pending CN115459724A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115694394A (en) * 2023-01-04 2023-02-03 成都频岢微电子有限公司 IPD band-pass filter chip suitable for WIFI 5G frequency channel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115694394A (en) * 2023-01-04 2023-02-03 成都频岢微电子有限公司 IPD band-pass filter chip suitable for WIFI 5G frequency channel

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