CN115457992A - Three-dimensional digital frequency storage device with vertically stacked and interconnected structures - Google Patents
Three-dimensional digital frequency storage device with vertically stacked and interconnected structures Download PDFInfo
- Publication number
- CN115457992A CN115457992A CN202211028400.4A CN202211028400A CN115457992A CN 115457992 A CN115457992 A CN 115457992A CN 202211028400 A CN202211028400 A CN 202211028400A CN 115457992 A CN115457992 A CN 115457992A
- Authority
- CN
- China
- Prior art keywords
- circuit unit
- drfm
- signal
- storage device
- analog
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
- G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
Abstract
The invention discloses a three-dimensional digital frequency storage device with vertically stacked and interconnected, which comprises: DRFM digital circuit unit, analog circuit unit, power supply circuit unit and openable circuit unit; the DRFM digital circuit unit, the analog circuit unit, the power supply circuit unit and the power-on/off circuit unit are sequentially and three-dimensionally assembled into a module from bottom to top, each circuit stacking layer is connected through a via hole, the bottom of the module is provided with a ball grid array, and solder balls in the ball grid array can acquire electric energy and required signals through a circuit board. The invention carries out three-dimensional packaging combination by layering the digital circuit unit, the analog circuit unit, the power supply circuit unit and other circuit units which can be developed and utilized, the packaging size can be reduced to less than one fourth compared with the traditional DRFM device, and the digital part can possibly enlarge the circuit capacity no matter a broadband or narrowband DRFM component is adopted.
Description
Technical Field
The invention relates to the technical field of digital signal processing, in particular to a three-dimensional digital frequency storage device with vertically stacked and interconnected.
Background
Miniaturization and miniaturization are the most basic requirements of a weapon system, in order to deal with the threat of electronic attack, the DRFM technology is introduced into the precision guided weapon, the precision guided weapon is expected to have the self-protection capability of resisting the electronic attack of enemy, and the DRFM technology becomes another important progress node in the development history of intelligent weapons. Although the conventional DRFM equipment can partially solve the electronic protection problem of an attack target, the capacity of the DRFM equipment must be increased to deal with the electronic countermeasure target of multiple targets and multiple frequency bands, which is difficult to realize for guidance and the common plane DRFM of the self-defense pod of the small unmanned aerial vehicle.
Most space of the conventional DRFM module is used for laying analog components and related circuits, and the miniaturization is realized by reducing the number of devices, so that the module comprehensiveness is necessarily reduced. Current processing techniques are difficult to achieve hybrid integration on a single production platform if all of the devices of the assembly are integrated in die form. Meanwhile, the precise weapon platform has extremely high requirements for reinforcing devices, and must be capable of bearing tests of strong vibration, large acceleration, thermal shock, humidity, seawater or other destructive environments under various severe environments, and a bare chip integrated assembly is difficult to meet the requirements. The digital circuit part only occupies a small part of the space, and most of the space is occupied by the analog circuit. Therefore, the conventional DRFM interferes with the objects and the number of processing targets is limited.
Disclosure of Invention
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. In this section, as well as in the abstract and title of the application, simplifications or omissions may be made to avoid obscuring the purpose of the section, the abstract and the title, and such simplifications or omissions are not intended to limit the scope of the invention.
The present invention has been made keeping in mind the above problems occurring in the prior art.
In order to solve the technical problems, the invention provides the following technical scheme:
a vertically stacked interconnected three-dimensional digital frequency storage device, comprising: DRFM digital circuit unit, analog circuit unit, power supply circuit unit and openable circuit unit;
the DRFM digital circuit unit, the analog circuit unit, the power supply circuit unit and the power-on/off circuit unit are sequentially and three-dimensionally assembled into a module from bottom to top, each circuit stacking layer is connected through a via hole, the bottom of the module is provided with a ball grid array, and solder balls in the ball grid array can acquire electric energy and required signals through a circuit board.
As a preferable aspect of the vertically stacked and interconnected three-dimensional digital frequency storage device of the present invention, wherein: the DRFM digital circuit unit is a broadband DRFM circuit unit or a narrow-band DRFM circuit unit.
As a preferable aspect of the vertically stacked and interconnected three-dimensional digital frequency storage device of the present invention, wherein: the wideband DRFM circuit unit includes: the frequency mixer, the filter, the A/D converter, the memory and the D/A converter, the radio frequency signal is mixed with the local oscillator signal with fixed frequency to obtain the detection frequency which can be reached by the A/D converter, then the detection frequency is stored in the memory, the computer (or the signal processor) timely extracts the memory information according to the simulation target characteristic, the memory information is converted into the analog signal by the D/A converter, the same local oscillator signal is mixed by the frequency mixer of the output circuit, the time delay signal with the original radio frequency signal characteristic is recovered, and the time delay signal can be output after power amplification according to the requirement.
As a preferable aspect of the vertically stacked and interconnected three-dimensional digital frequency storage device of the present invention, wherein: the frequency mixer of the broadband DRFM circuit unit signal input circuit is also connected with a system local oscillator, and the frequency mixer of the signal output circuit is connected with the DRFM local oscillator.
As a preferable aspect of the vertically stacked and interconnected three-dimensional digital frequency storage device of the present invention, wherein: the narrow band DRFM circuit unit includes: the device comprises a mixer, a power divider, a filter, an A/D converter, a storage processor, a D/A converter and a power synthesizer, wherein an input signal is mixed by the mixer, then is distributed to different filters by the power divider, then is converted by the A/D converter and then is processed by the storage processor, then is converted into an analog signal by the D/A converter, passes through a filter of an output circuit, finally is output and synthesized by the power synthesizer, and is recovered to the frequency of the input signal after being converted (coherent).
As a preferable aspect of the vertically stacked and interconnected three-dimensional digital frequency storage device of the present invention, wherein: and a local oscillator is connected between the mixer of the narrow-band DRFM circuit unit signal input circuit and the mixer of the signal output circuit.
As a preferable aspect of the vertically stacked and interconnected three-dimensional digital frequency storage device of the present invention, wherein: the DRFM digital circuit unit, the analog circuit unit, the power supply circuit unit and the power-on circuit unit are assembled and cured by a setting curing agent, and the analog circuit unit and the power supply circuit unit adopt low-power and low-loss circuits.
The invention has the beneficial effects that: the invention carries out three-dimensional packaging combination by layers by the digital circuit unit, the analog circuit unit, the power supply circuit unit and other circuit units which can be developed and utilized, the packaging size can be reduced to less than one fourth compared with the traditional DRFM device, no matter a broadband or narrowband DRFM component is adopted, the digital part can possibly enlarge the circuit capacity, more than 15 digital storage units can be integrated in the original but reliable component space, the requirement of most processing intensive application programs can be supported, and therefore, lighter and more reliable multi-target electronic countermeasure conditions are provided for an accurate guidance warhead and a small mini unmanned aerial vehicle pod.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic diagram of a basic framework of a vertical stacked interconnected three-dimensional digital frequency storage device wideband DRFM circuit unit according to the present invention;
FIG. 2 is a schematic diagram of a basic framework of a vertical stacked interconnected three-dimensional digital frequency storage device narrow-band DRFM circuit cell according to the present invention;
fig. 3 is a schematic diagram of a stacked structure of a vertically stacked and interconnected three-dimensional digital frequency storage device according to the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanying figures of the present invention are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced otherwise than as specifically described herein, and it will be appreciated by those skilled in the art that the present invention may be practiced without departing from the spirit and scope of the present invention and that the present invention is not limited by the specific embodiments disclosed below.
Furthermore, reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
Furthermore, the present invention is described in detail with reference to the drawings, and in the detailed description of the embodiments of the present invention, the cross-sectional view illustrating the structure of the device is not enlarged partially according to the general scale for convenience of illustration, and the drawings are only exemplary and should not be construed as limiting the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
Example 1
Referring to fig. 1 and 3, for one embodiment of the present invention, there is provided a vertical stacked interconnected three-dimensional digital frequency storage device, the device comprising: DRFM digital circuit unit, analog circuit unit, power supply circuit unit and openable circuit unit;
the DRFM digital circuit unit, the analog circuit unit, the power supply circuit unit and the power-on/off circuit unit are sequentially and three-dimensionally assembled into a module from bottom to top, each circuit stacking layer is connected through a via hole, the bottom of the module is provided with a ball grid array, and solder balls in the ball grid array can obtain electric energy and required signals through the circuit board.
Wherein, the DRFM digital circuit unit is a broadband DRFM circuit unit, and the broadband DRFM circuit unit includes: the frequency mixer of the broadband DRFM circuit unit signal input circuit is also connected with a system local oscillator, the frequency mixer of the signal output circuit is connected with a DRFM local oscillator, phase coherence is kept by using the unique local oscillator of the system, frequency conversion and subsequent received signal recovery are carried out, and the bandwidth of the DRFM digital circuit unit memory is limited by the sampling rate of the analog-to-digital converter. There are multiple signals in the bandwidth and spur-free dynamic range needs to be taken into account. Thus, the analog-to-digital converter requires the maximum available number of digitized bits, and the wideband DRFM digital circuit unit can handle a frequency range containing multiple signals.
Specifically, the DRFM digital circuit unit, the analog circuit unit, the power supply circuit unit and the power-on/off circuit unit are assembled and cured by a setting curing agent, and the analog circuit unit and the power supply circuit unit adopt low-power and low-loss circuits.
Example 2
Referring to fig. 2 and 3, unlike the first embodiment, the DRFM digital circuit unit is a narrow band DRFM circuit unit, and the narrow band DRFM circuit unit includes: the device comprises a mixer, a power divider, a filter, an A/D converter, a storage processor, a D/A converter and a power synthesizer, wherein an input signal is mixed by the mixer, then is distributed to different filters by the power divider, then is converted by the A/D converter and then is processed by the storage processor, then is converted into an analog signal by the D/A converter, passes through a filter of an output circuit, and finally is output and synthesized by the power synthesizer, and is recovered to the frequency of the input signal after being converted (coherent), and a local oscillator is connected between the mixer of a signal input circuit and the mixer of a signal output circuit of a narrow band DRFM circuit unit.
The narrowband DRFM circuit unit needs only a wide enough bandwidth to process the widest bandwidth signal transmitted by the jammer, because each memory processor processes only one signal, and the narrowband DRFM circuit unit has an advantage in that false responses rarely occur, and in a multi-signal environment, a plurality of memory processors are needed to process the signals.
The invention carries out three-dimensional packaging combination by layering the digital circuit unit, the analog circuit unit, the power supply circuit unit and other circuit units which can be developed and utilized, the packaging size can be reduced to less than one fourth compared with the traditional DRFM device, no matter a broadband DRFM component or a narrowband DRFM component is adopted, the digital part can possibly enlarge the circuit capacity, more than 15 digital storage units can be integrated in the original but reliable component space, the requirement of most processing intensive application programs can be supported, and therefore, lighter and more reliable multi-target electronic countermeasure conditions are provided for precise guidance and small unmanned aerial vehicle pods.
It should be noted that the above-mentioned embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (7)
1. A vertically stacked interconnected three-dimensional digital frequency storage device, comprising: DRFM digital circuit unit, analog circuit unit, power supply circuit unit and openable circuit unit;
the DRFM digital circuit unit, the analog circuit unit, the power supply circuit unit and the power-on/off circuit unit are sequentially and three-dimensionally assembled into a module from bottom to top, each circuit stacking layer is connected through a via hole, the bottom of the module is provided with a ball grid array, and solder balls in the ball grid array can acquire electric energy and required signals through a circuit board.
2. The vertically stacked interconnected three-dimensional digital frequency storage device of claim 1, wherein: the DRFM digital circuit unit is a broadband DRFM circuit unit or a narrow-band DRFM circuit unit.
3. The three-dimensional digital frequency storage device of claim 2, wherein: the broadband DRFM circuit unit includes: the computer extracts the memory information in time according to the analog target characteristic, converts the memory information into an analog signal through the D/A converter, recovers the delay signal with the original radio frequency signal characteristic after the same local oscillator signal is subjected to frequency mixing through the frequency mixer of an output line, and outputs the delay signal after power amplification according to the requirement.
4. A vertically stacked interconnected three-dimensional digital frequency storage device as claimed in claim 3, wherein: the frequency mixer of the signal input circuit of the broadband DRFM circuit unit is also connected with a system local oscillator, and the frequency mixer of the signal output circuit is connected with the DRFM local oscillator.
5. The three-dimensional digital frequency storage device of claim 2, wherein: the narrow band DRFM circuit unit includes: the device comprises a mixer, a power divider, a filter, an A/D converter, a storage processor, a D/A converter and a power synthesizer, wherein an input signal is mixed by the mixer, is distributed to different filters through the power divider, is converted by the A/D converter and then is processed by the storage processor, is converted into an analog signal through the D/A converter, passes through a filter of an output circuit, is finally output and synthesized through the power synthesizer, and is recovered to the frequency of the input signal after conversion.
6. The three-dimensional digital frequency storage device of claim 5, wherein: and a local oscillator is connected between the mixer of the narrow-band DRFM circuit unit signal input circuit and the mixer of the signal output circuit.
7. The vertically stacked interconnected three-dimensional digital frequency storage device of claim 1, wherein: the DRFM digital circuit unit, the analog circuit unit, the power supply circuit unit and the power-on circuit unit are assembled and cured by a setting curing agent, and the analog circuit unit and the power supply circuit unit adopt low-power and low-loss circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211028400.4A CN115457992A (en) | 2022-08-25 | 2022-08-25 | Three-dimensional digital frequency storage device with vertically stacked and interconnected structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211028400.4A CN115457992A (en) | 2022-08-25 | 2022-08-25 | Three-dimensional digital frequency storage device with vertically stacked and interconnected structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115457992A true CN115457992A (en) | 2022-12-09 |
Family
ID=84298132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211028400.4A Pending CN115457992A (en) | 2022-08-25 | 2022-08-25 | Three-dimensional digital frequency storage device with vertically stacked and interconnected structures |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115457992A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080099887A1 (en) * | 2006-10-30 | 2008-05-01 | Samsung Electronics Co., Ltd. | Multi-ground shielding semiconductor package, method of fabricating the package, and method of preventing noise using multi-ground shielding |
| CN103902482A (en) * | 2012-12-28 | 2014-07-02 | 北京华清瑞达科技有限公司 | Two GHz bandwidth digital radio frequency memorizer and storage method |
| CN112820656A (en) * | 2020-12-31 | 2021-05-18 | 中国科学院空天信息创新研究院 | Three-dimensional integrated packaging method for millimeter wave miniature SAR system |
-
2022
- 2022-08-25 CN CN202211028400.4A patent/CN115457992A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080099887A1 (en) * | 2006-10-30 | 2008-05-01 | Samsung Electronics Co., Ltd. | Multi-ground shielding semiconductor package, method of fabricating the package, and method of preventing noise using multi-ground shielding |
| CN103902482A (en) * | 2012-12-28 | 2014-07-02 | 北京华清瑞达科技有限公司 | Two GHz bandwidth digital radio frequency memorizer and storage method |
| CN112820656A (en) * | 2020-12-31 | 2021-05-18 | 中国科学院空天信息创新研究院 | Three-dimensional integrated packaging method for millimeter wave miniature SAR system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2946226C (en) | Scalable planar packaging architecture for actively scanned phased array antenna system | |
| US11189918B2 (en) | Multi-beam phased-array antenna with redundancy | |
| CN109633568B (en) | Design method of all-digital array radar beam former based on optical fiber interface | |
| Lockyer et al. | Qualitative assessment of smart skins and avionic/structures integration | |
| US20050063137A1 (en) | Vertical capacitor apparatus, systems, and methods | |
| CN107015063A (en) | Wide band multi-channel Correlation receiver and method of reseptance | |
| CN115457992A (en) | Three-dimensional digital frequency storage device with vertically stacked and interconnected structures | |
| CN106980126B (en) | Three-diversity anti-interference satellite navigation receiver | |
| Wu | Digital array radar: Technology and trends | |
| Ruiter et al. | Development of a Vivaldi tile for the SKA mid frequency aperture array | |
| Ding et al. | Design and research on a power distribution system for airborne radar | |
| Kemkemian et al. | Wideband and very wideband thin structural tiles for airborne active antennas | |
| CN116502585B (en) | Stacked high-capacity signal acquisition and transmission system and design method thereof | |
| Tan et al. | Integrated design of X-band phased array antenna with LTCC 3D T/R module | |
| Axelsson | Generic packaging technologies for T/R-modules | |
| Ly et al. | Design, simulation, and testing of a miniaturized GPS dual-frequency (L1/L2) antenna array | |
| Wang et al. | Integrated design of active phased array for low‐altitude detection radar | |
| Johnson et al. | Packaging of a massively parallel signal processor for spaceflight | |
| Nakata et al. | Development of MMIC for the Three Dimensional Phased Array Antenna as Student Project | |
| Linshu et al. | Research on Satellite Communication Link Budget and Performance under the Influence of Multiple Factors | |
| Fischman | Development of a direct-sampling digital correlation radiometer for earth remote sensing applications | |
| CN212033012U (en) | Miniaturized radio frequency front end structure and system | |
| Liu et al. | A Ka-Band Four-Channel Receiver Module Based on BGA Packaging for Satellite Network | |
| Kang et al. | Influence and Analysis of Tolerance Design on Highly Integrated Tile-Type Module | |
| Szabo et al. | Advances in digital memory telemeters for artillery projectiles |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |