CN115449305A - Anisotropic conductive adhesive film capable of being stored and transported at normal temperature and attaching method thereof - Google Patents
Anisotropic conductive adhesive film capable of being stored and transported at normal temperature and attaching method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/02—Copolymers with acrylonitrile
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0831—Gold
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
The invention relates to an anisotropic conductive film capable of being stored and transported at normal temperature and an attaching method thereof, belonging to the technical field of anisotropic conductive films. The invention discloses an anisotropic conductive adhesive film capable of being stored and transported at normal temperature, which comprises the following raw materials in parts by weight: 1 to 10 parts of initiator for coating the photosensitive layer, 30 to 60 parts of resin base material, 1 to 8 parts of conductive particles, 10 to 40 parts of first auxiliary agent and 3 to 25 parts of second auxiliary agent. The invention also discloses an attaching method of the anisotropic conductive adhesive film, which comprises the following steps: s1, carrying out UV illumination on a part of the anisotropic conductive adhesive film to be pre-bound to decompose a photosensitive shell layer and expose an initiator; s2, pre-binding the anisotropic conductive adhesive film and the first electrode; s3, stripping the release film by adopting a pressure head of a universal binding machine; s4, aligning the second electrode with the first electrode; and S5, carrying out main binding on the pre-bound anisotropic conductive film.
Description
Technical Field
The invention belongs to the technical field of anisotropic conductive films, and relates to an anisotropic conductive film capable of being stored and transported at normal temperature and an attaching method thereof.
Background
The traditional anisotropic conductive film belongs to a prefabricated material, an initiator is directly and uniformly distributed in the conductive film, strict temperature needs to be controlled in the transportation process, and freezing storage and cold chain packaging (multilayer heat-insulating layer and waterproof layer packaging) are mostly adopted; the use environment is also controlled when in use, and once the seal is unsealed, the seal is used up at one time; the shelf life is short and is generally not more than 6 months; the scrapping treatment step is complicated; therefore, the transportation cost and the use cost are high, and the phenomena of waste, pollution and the like exist, so that the manufactured electronic device has high selling price.
In response to the above problems, researchers have considered encapsulating the initiator and delaying the release of the initiator. As disclosed in the Chinese patent application publication (publication No. CN 105974695A), the conductive particles comprise a resin core, a conductive film, and a photosensitive insulating film, wherein the photosensitive insulating film comprises an oligomer and a photoinitiator, the photoinitiator generates free radicals under illumination to initiate the oligomer to generate a cross-linking reaction to generate a polymer, and the photoinitiator is a metal particle insulating layer photoreaction catalyst; and the conductive particles are used for preventing the plane of the anisotropic conductive adhesive film from being conducted and short-circuited when the small-size electrode is applied, and the normal-temperature storage and transportation of the anisotropic conductive adhesive film are not realized.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides an anisotropic conductive adhesive film which contains an initiator coated with a photosensitive layer and wraps the initiator through a photosensitive shell layer and can be stored and transported at normal temperature.
The purpose of the invention can be realized by the following technical scheme:
an anisotropic conductive film capable of being stored and transported at normal temperature comprises the following raw materials in parts by mass: 1 to 10 portions of initiator (1) coating the photosensitive layer, 30 to 60 portions of resin base material (2), 1 to 8 portions of conductive particles (3), 10 to 40 portions of first auxiliary agent and 3 to 25 portions of second auxiliary agent.
Preferably, the initiator (1) for coating the photosensitive layer comprises an initiator core (11) and a photosensitive shell layer (10), the thickness of the photosensitive shell layer (10) is 0.01-0.2 μm, and the size of the initiator core (11) is 0.1-10 μm.
Preferably, the mass ratio of the initiator core (11) to the photosensitive shell layer (10) in the initiator (1) for coating the photosensitive layer is 1: (0.05-50).
The initiator (1) for covering the photosensitive layer is prepared by a conventional method.
Preferably, the initiator in the initiator core (11) is one or more of p-menthane hydroperoxide, lauroyl peroxide, benzoyl peroxide, dicumyl peroxide and polyurethane.
Further preferably, the initiator is a compound of p-menthane hydroperoxide, lauroyl peroxide, benzoyl peroxide and dicumyl peroxide.
More preferably, the mass ratio of the hydrogen peroxide to the menthane peroxide, the lauroyl peroxide, the benzoyl peroxide and the dicumyl peroxide is (0.5-5): (0.5-5): (1-6): (0.5-4).
Preferably, the photosensitive material of the photosensitive shell layer (10) is a material with positive photosensitive characteristics, and specifically is a diazonium salt-containing photosensitive high molecular polymer.
The invention adopts the photosensitive material with positive photosensitive characteristic, and the photodissociation is carried out, namely, under the condition of illumination, the material generates physical or chemical change, so that the molecules are broken, the molecular weight is reduced and the dissolution change is generated. The initiator coated with the photosensitive layer is irradiated by light, then the photosensitive material on the surface is decomposed, the internal initiator is exposed, and the curing reaction with the periphery is started.
Preferably, the mass ratio of the initiator (1) and the resin base material (2) for coating the photosensitive layer is 1: (10-60).
Further preferably, the resin substrate (2) is one or more of butadiene cyanide rubber, liquid epoxy resin, solid epoxy resin, acrylic resin and chloroprene rubber.
More preferably, the resin base material (2) is a compound of butadiene cyanide rubber, liquid epoxy resin and solid epoxy resin.
More preferably, the mass ratio of the butadiene cyanide rubber to the liquid epoxy resin to the solid epoxy resin is (0.1-5): (0.1-10): (0.1-5).
The resin base material (2) adopted by the invention exists in the anisotropic conductive adhesive film in a solid and/or liquid form and reacts with an initiator to be cured.
Preferably, the conductive particles (3) are one or more of metal nickel balls, gold balls, nickel/gold balls, plastic core-coated nickel balls and plastic core-coated gold balls.
More preferably, the diameter of the conductive particles (3) is 2 to 10 μm.
More preferably, the conductive particles (3) are nickel/gold balls and plastic core coated nickel balls, and the diameter of the conductive particles is 3-10 microns; wherein the thickness of the metal layer of the plastic rubber core coated nickel ball is 0.1-0.3 μm, and the thickness of the shell layer is 0.1-0.3 μm.
Preferably, the first auxiliary agent is silicon dioxide.
Preferably, the second auxiliary agent is titanium dioxide.
The invention also discloses an attaching method of the anisotropic conductive adhesive film, which comprises the following steps:
s1, carrying out UV illumination on a part, needing to be pre-bound, of the anisotropic conductive adhesive film (4) to decompose a photosensitive shell layer and expose an initiator;
s2, pre-binding the anisotropic conductive adhesive film (4) and the first electrode (5);
s3, stripping the release film by adopting a pressure head of a universal binding machine;
s4, aligning the second electrode (7) and the first electrode (5);
and S5, carrying out main binding on the pre-bound anisotropic conductive film (41).
Preferably, the curing rate of the pre-bound anisotropic conductive adhesive film (41) is 5-50%; the anisotropic conductive film (42) is completely cured after the main binding.
Preferably, the first electrode (5) is connected with a display panel (6), and the display panel is provided with a plurality of first electrodes (5); the second electrode (7) is connected with an electronic device/chip (8), and a plurality of second electrodes (7) are arranged on the electronic device/chip (8); the number of the first electrodes (5) is the same as that of the second electrodes (7), and the first electrodes and the second electrodes are aligned one by one.
Preferably, the energy of the UV light irradiation is 50-1000 mW/cm 2 The time is 1 to 60s.
Preferably, the thickness of the peeled film is 10 to 100mm.
Preferably, the temperature of the pre-binding is 50-100 ℃, the binding pressure is 0.5-5 Mpa, and the time is 1-5 s.
Preferably, the temperature of the main binding is 100-200 ℃, the pressure is 1-100 Mpa, and the time is 2-20 s.
Compared with the prior art, the invention has the following beneficial effects:
1. the anisotropic conductive film prepared by the invention can realize normal-temperature storage and transportation due to the inclusion of the initiator which is wrapped by the photosensitive material and coats the photosensitive layer; and when the photosensitive coating is used, the photosensitive shell layer of the initiator coating the photosensitive layer can be decomposed by using light to expose the initiator.
2. The invention adopts the compound initiator, and can more quickly carry out curing reaction with the surroundings; and can adapt to different temperature environments.
3. According to the invention, multiple resins are compounded, so that liquid resin and solid resin particles exist in the anisotropic conductive adhesive film, and the anisotropic conductive adhesive film has good adhesive property after reacting with an initiator.
4. The attaching method can ensure that the device connected by the anisotropic conductive film which can be stored and transported at normal temperature has better adhesive force.
5. The invention has simple raw materials, convenient and efficient attaching process.
Drawings
Fig. 1 is a schematic view of an anisotropic conductive film capable of being stored and transported at room temperature according to example 1 of the present invention.
FIG. 2 is a schematic view showing that the UV irradiation process of example 1 decomposes the photosensitive layer of the initiator covering the photosensitive layer to expose the initiator core.
Fig. 3 is a schematic diagram of a pre-binding process in application embodiment 1 of the present invention.
Fig. 4 is a schematic diagram of an alignment process in application example 1 of the present invention.
Fig. 5 is a schematic diagram of a main binding process in application embodiment 1 of the present invention.
FIG. 6 is a flow chart showing the preparation of application example 1 of the present invention.
Detailed Description
The following are specific examples of the present invention and further describe the technical solutions of the present invention, but the present invention is not limited to these examples.
The following raw materials are all commercially available conventional materials.
Example 1
The raw materials of the anisotropic conductive film comprise 2 parts of initiator (1) for coating a photosensitive layer, 50 parts of resin base material (2), 5 parts of conductive particles (3), 30 parts of first auxiliary agent silicon dioxide and 3 parts of second auxiliary agent titanium dioxide; the initiator in the initiator coating the photosensitive layer is a compound of hydrogen peroxide p-menthane, lauroyl peroxide, benzoyl peroxide and dicumyl peroxide in a mass ratio of 1; the resin base material (2) comprises a resin base material and a resin base material, wherein the mass ratio of the resin base material to the resin base material is 1:3:3, butadiene cyanide rubber, liquid epoxy resin and solid epoxy resin; the conductive particles are nickel/gold balls and plastic core coated nickel balls with the mass ratio of 1. Then the material is prepared into the anisotropic conductive adhesive film according to a conventional method. The prepared anisotropic conductive adhesive film can be stably stored for 12 months at 0 ℃; can be kept for 6 months at 25 ℃ and can be stably stored for 60 days at 40-60 ℃.
Example 2
Compared with example 1, the difference is that in the initiator (1) for coating the photosensitive layer, the mass ratio of the initiator in the initiator (1) is 1. The prepared anisotropic conductive adhesive film can be stably stored for 12 months at 0 ℃; can be kept for 6 months at 25 ℃ and can be stably stored for 60 days at 40-60 ℃.
Example 3
Compared with example 1, the difference is that in the initiator (1) for coating the photosensitive layer, the mass ratio of the initiator in the initiator (1) is 1. The prepared anisotropic conductive adhesive film can be stably stored for 12 months at 0 ℃; can be kept for 6 months at 25 ℃ and can be stably stored for 60 days at 40-60 ℃.
Example 4
Compared with example 1, the difference is that the initiator (1) for coating the photosensitive layer comprises lauroyl peroxide, benzoyl peroxide and dicumyl peroxide in a mass ratio of 1. The prepared anisotropic conductive adhesive film can be stably stored for 12 months at 0 ℃; can be kept for 6 months at 25 ℃ and can be stably stored for 60 days at 40-60 ℃.
Example 5
Compared with the embodiment 1, the difference is that the initiator (1) for coating the photosensitive layer comprises the following components in mass ratio of 1. The prepared anisotropic conductive adhesive film can be stably stored for 12 months at 0 ℃; can be kept for 6 months at 25 ℃ and can be stably stored for 60 days at 40-60 ℃.
Example 6
The difference from example 1 is that the initiator (1) for covering the photosensitive layer contains lauroyl peroxide and benzoyl peroxide in a mass ratio of 1. The prepared anisotropic conductive adhesive film can be stably stored for 12 months at 0 ℃; can be kept for 6 months at 25 ℃ and can be stably stored for 60 days at 40-60 ℃.
Example 7
The difference from example 1 is that the initiator (1) covering the photosensitive layer is composed of lauroyl peroxide alone. The prepared anisotropic conductive adhesive film can be stably stored for 12 months at 0 ℃; can be kept for 6 months at 25 ℃ and can be stably stored for 60 days at 40-60 ℃.
Example 8
The difference from example 1 is that the amount of the initiator (1) to be added for covering the photosensitive layer is 1 part. The prepared anisotropic conductive adhesive film can be stably stored for 12 months at 0 ℃; can be kept for 6 months at 25 ℃ and can be stably stored for 50 days at 40-60 ℃.
Example 9
The difference from example 1 is that the amount of the initiator (1) to be added for covering the photosensitive layer is 5 parts. The prepared anisotropic conductive adhesive film can be stably stored for 12 months at 0 ℃; can be kept for 6 months at 25 ℃ and can be stably stored for 50 days at 40-60 ℃.
Example 10
Compared with example 1, the difference is that the resin base material (2) comprises a resin having a mass ratio of 1:1, liquid epoxy resin and solid epoxy resin. The prepared anisotropic conductive adhesive film can be stably stored for 10 months at 0 ℃; can be kept for 5 months at 25 ℃ and can be stably stored for 30 days at 40-60 ℃.
Example 11
The difference from example 1 is that the resin base material (2) is only a nitrile butadiene rubber. The prepared anisotropic conductive adhesive film can be stably stored for 8 months at 0 ℃; can be kept for 3 months at 25 ℃ and can be stably stored for 10 days at 40-60 ℃.
Example 12
The difference from example 1 is that the amount of the resin base material (2) added is 30 parts and the amount of the initiator (1) for covering the photosensitive layer added is 3 parts. The prepared anisotropic conductive adhesive film can be stably stored for 10 months at 0 ℃; can be kept for 3 months at 25 ℃ and can be stably stored for 10 days at 40-60 ℃.
Example 13
The difference from example 1 is that the amount of the resin base material (2) added is 60 parts and the amount of the initiator (1) for covering the photosensitive layer added is 1 part. The prepared anisotropic conductive adhesive film can be stably stored for 10 months at 0 ℃; can be kept for 2 months at 25 ℃ and can be stably stored for 10 days at 40-60 ℃.
Example 14
The difference from example 1 is that the amount of the initiator (1) to be added for covering the photosensitive layer was 11 parts. The prepared anisotropic conductive adhesive film can be stably stored for 9 months at 0 ℃; can be kept for 5 months at 25 ℃ and can be stably stored for 50 days at 40-60 ℃.
Example 15
The difference from example 1 is that the amount of the initiator (1) for coating the photosensitive layer was 0.5 part. The prepared anisotropic conductive adhesive film can be stably stored for 9 months at 0 ℃; can be kept for 5 months at 25 ℃ and can be stably stored for 50 days at 40-60 ℃.
Comparative example 1
The difference from example 1 is that the initiator (1) for covering the photosensitive layer is not added, and the initiator is directly added and mixed during the preparation. The prepared anisotropic conductive adhesive film needs to be stored at the temperature of below 0 ℃, and the shelf life is only 6 months; the shelf life is only 15 days at 25 ℃.
Application example 1
The anisotropic conductive film (1) prepared in example 1 is attached, and specifically includes: carrying out UV illumination on the part of the anisotropic conductive adhesive film to be pre-bound, wherein the UV illumination time is 2s and the intensity is 100mw; as shown in FIG. 2, the photosensitive shell (10) of the initiator (1) covering the photosensitive layer begins to decompose to expose the initiator core (11), and the initiator core (11) begins to perform a curing reaction with the surroundings. And then, pre-binding one surface of the anisotropic conductive film (1) with a plurality of first electrodes (5) connected with a display panel (6), wherein the schematic diagram is shown in fig. 3, the pre-binding temperature is 60 ℃, the binding pressure is 4Mpa, the time is 3s, and the curing rate of the anisotropic conductive film (41) after pre-binding is 10%. The release film (PET film) was peeled off with a pressure head of a general-purpose binding machine to a thickness of 30mm. Then, a plurality of second electrodes (7) connected to the electronic device/chip (8) are aligned with the first electrodes (5), and the number of the second electrodes (7) is the same as that of the first electrodes (5), as shown in fig. 4. And finally, carrying out main binding, wherein the schematic diagram is shown in fig. 5, the temperature is 160 ℃, the pressure is 70Mpa, the time is 15s, and the anisotropic conductive adhesive film (42) is completely cured after the main binding. The flow chart of the whole binding process is shown in fig. 6, and it can be found that the anisotropic conductive adhesive film prepared by the invention can be better connected with electrodes (devices and the like) by adopting the attaching method of the invention. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 15.2N/cm.
Application example 2
Compared with application example 1, the difference is that the anisotropic conductive film prepared in example 2 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 14.3N/cm.
Application example 3
Compared with application example 1, the difference is that the anisotropic conductive film prepared in example 3 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 14.8N/cm.
Application example 4
Compared with application example 1, the difference is that the anisotropic conductive film prepared in example 4 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 13.7N/cm.
Application example 5
Compared with application example 1, the difference is that the anisotropic conductive film prepared in example 5 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 13.8N/cm.
Application example 6
Compared with application example 1, the difference is that the anisotropic conductive film prepared in example 6 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 13.1N/cm.
Application example 7
Compared with application example 1, the difference is that the anisotropic conductive film prepared in example 7 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 13.0N/cm.
Application example 8
Compared to application example 1, the difference is that the anisotropic conductive film prepared in example 8 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 12.8N/cm.
Application example 9
Compared to application example 1, the difference is that the anisotropic conductive film prepared in example 9 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 12.8N/cm.
Application example 10
Compared with application example 1, the difference is that the anisotropic conductive film prepared in example 10 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 12.5N/cm.
Application example 11
Compared to application example 1, the difference is that the anisotropic conductive film prepared in example 11 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 12.1N/cm.
Application example 12
Compared with application example 1, the difference is that the anisotropic conductive film prepared in example 12 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 12.0N/cm.
Application example 13
Compared to application example 1, the difference is that the anisotropic conductive film prepared in example 13 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 12.0N/cm.
Application example 14
Compared to application example 1, the difference is that the anisotropic conductive film prepared in example 14 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 11.3N/cm.
Application example 15
Compared with application example 1, the difference is that the anisotropic conductive film prepared in example 15 is used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 11.0N/cm.
Application comparative example 1
Compared to application example 1, except that the anisotropic conductive film prepared in comparative example 1 was used. The adhesion test was carried out in accordance with a conventional method, and the adhesion was 14N/cm.
In conclusion, the anisotropic conductive film prepared by the invention can realize normal-temperature storage and transportation due to the inclusion of the initiator coated with the photosensitive layer and wrapped by the photosensitive material; and better adhesive property can be obtained by combining an attaching method.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments, or alternatives may be employed, by those skilled in the art, without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (10)
1. The anisotropic conductive adhesive film capable of being stored and transported at normal temperature is characterized by comprising the following raw materials in parts by mass: 1 to 10 parts of initiator for coating the photosensitive layer, 30 to 60 parts of resin base material, 1 to 8 parts of conductive particles, 10 to 40 parts of first auxiliary agent and 3 to 25 parts of second auxiliary agent.
2. The anisotropic conductive film of claim 1, wherein the initiator covering the photosensitive layer comprises an initiator core and a photosensitive shell layer, the photosensitive shell layer has a thickness of 0.01-0.2 μm, and the initiator core has a size of 0.1-10 μm.
3. The anisotropic conductive film according to claim 1 or 2, wherein the mass ratio of the initiator core to the photosensitive shell layer in the initiator coating the photosensitive layer is 1: (0.05-50).
4. The anisotropic conductive film of claim 3, wherein the initiator in the initiator core is one or more of p-menthane hydroperoxide, lauroyl peroxide, benzoyl peroxide, dicumyl peroxide, and polyurethane.
5. The anisotropic conductive film of claim 3, wherein the photosensitive material of the photosensitive shell layer is a positive photosensitive material, specifically a high molecular polymer containing a diazonium salt photosensitive group.
6. The anisotropic conductive film according to claim 1, wherein the mass ratio of the initiator and the resin substrate covering the photosensitive layer is 1: (10-60).
7. The anisotropic conductive film of claim 1 or 6, wherein the resin substrate is one or more of butadiene cyanide rubber, liquid epoxy resin, solid epoxy resin, acrylic resin, and neoprene rubber.
8. The anisotropic conductive film of claim 1, wherein the conductive particles are one or more of metal nickel balls, gold balls, nickel/gold balls, plastic core coated nickel balls, and plastic core coated gold balls.
9. The method of claim 1, wherein the method comprises:
s1, carrying out UV illumination on a part of the anisotropic conductive adhesive film to be pre-bound to decompose a photosensitive shell layer and expose an initiator;
s2, pre-binding the anisotropic conductive adhesive film and the first electrode;
s3, stripping the release film by adopting a pressure head of a universal binding machine;
s4, aligning the second electrode with the first electrode;
and S5, carrying out main binding on the pre-bound anisotropic conductive film.
10. The method of claim 9, wherein the curing rate of the pre-bound anisotropic conductive film is 5% to 50%; and completely curing the anisotropic conductive film after the main binding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210906112.8A CN115449305A (en) | 2022-07-29 | 2022-07-29 | Anisotropic conductive adhesive film capable of being stored and transported at normal temperature and attaching method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210906112.8A CN115449305A (en) | 2022-07-29 | 2022-07-29 | Anisotropic conductive adhesive film capable of being stored and transported at normal temperature and attaching method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090073564A (en) * | 2007-12-31 | 2009-07-03 | 주식회사 효성 | Anisotropic conductive film having thermochromic microcapsule or photochromic microcapsule |
| CN104698689A (en) * | 2015-04-07 | 2015-06-10 | 京东方科技集团股份有限公司 | Anisotropic conductive adhesive film, display device and repairing method thereof |
| CN105974695A (en) * | 2016-07-01 | 2016-09-28 | 深圳市华星光电技术有限公司 | Anisotropic conductive film and attaching method thereof |
| CN110452633A (en) * | 2019-08-19 | 2019-11-15 | 深圳市南科康达科技有限公司 | A kind of anisotropy conductiving glue and its preparation method and application |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090073564A (en) * | 2007-12-31 | 2009-07-03 | 주식회사 효성 | Anisotropic conductive film having thermochromic microcapsule or photochromic microcapsule |
| CN104698689A (en) * | 2015-04-07 | 2015-06-10 | 京东方科技集团股份有限公司 | Anisotropic conductive adhesive film, display device and repairing method thereof |
| CN105974695A (en) * | 2016-07-01 | 2016-09-28 | 深圳市华星光电技术有限公司 | Anisotropic conductive film and attaching method thereof |
| CN110452633A (en) * | 2019-08-19 | 2019-11-15 | 深圳市南科康达科技有限公司 | A kind of anisotropy conductiving glue and its preparation method and application |
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