CN115446493A - Sn-Ag-Cu lead-free solder with high wettability containing Bi, sb and Yb - Google Patents
Sn-Ag-Cu lead-free solder with high wettability containing Bi, sb and Yb Download PDFInfo
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- CN115446493A CN115446493A CN202211057016.7A CN202211057016A CN115446493A CN 115446493 A CN115446493 A CN 115446493A CN 202211057016 A CN202211057016 A CN 202211057016A CN 115446493 A CN115446493 A CN 115446493A
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- lead
- free solder
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 70
- 229910017944 Ag—Cu Inorganic materials 0.000 title claims abstract description 34
- 229910052797 bismuth Inorganic materials 0.000 title claims abstract description 25
- 229910052769 Ytterbium Inorganic materials 0.000 title claims abstract description 20
- 238000002844 melting Methods 0.000 claims abstract description 17
- 230000008018 melting Effects 0.000 claims abstract description 17
- 229910052718 tin Inorganic materials 0.000 claims abstract description 5
- 239000000126 substance Substances 0.000 claims abstract description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 20
- 238000003723 Smelting Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 4
- 238000005266 casting Methods 0.000 claims description 2
- 239000008187 granular material Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 36
- 239000002184 metal Substances 0.000 abstract description 36
- 239000010949 copper Substances 0.000 abstract description 14
- 238000003466 welding Methods 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 3
- 238000013461 design Methods 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 3
- 239000004332 silver Substances 0.000 abstract description 3
- 230000006698 induction Effects 0.000 abstract 1
- 239000012299 nitrogen atmosphere Substances 0.000 abstract 1
- 238000005219 brazing Methods 0.000 description 36
- 239000000945 filler Substances 0.000 description 33
- 230000000052 comparative effect Effects 0.000 description 13
- 229910045601 alloy Inorganic materials 0.000 description 11
- 239000000956 alloy Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 7
- 238000004100 electronic packaging Methods 0.000 description 5
- 238000003892 spreading Methods 0.000 description 5
- 230000007480 spreading Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 238000000113 differential scanning calorimetry Methods 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 229910002058 ternary alloy Inorganic materials 0.000 description 2
- 239000011573 trace mineral Substances 0.000 description 2
- 235000013619 trace mineral Nutrition 0.000 description 2
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001325 element alloy Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012803 optimization experiment Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910006640 β-Sn Inorganic materials 0.000 description 1
- 229910006632 β—Sn Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a Sn-Ag-Cu lead-free solder with high wettability containing Bi, sb and Yb, belonging to the technical field of solders. The lead-free solder comprises the following chemical components in percentage by mass: ag:2.8% -3.2%, cu:0.3% -0.7%, bi:1.8% -2.2%, sb:0.2% -1.0%, yb:0.02% -0.1% and the balance of Sn. Commercially available tin ingots, silver ingots, electrolytic copper, metal Bi, metal Sb and metal Yb are used, the components are proportioned according to the design, and the lead-free solder can be obtained by vacuum induction melting or melting under the protection of nitrogen atmosphere. The Sn-Ag-Cu lead-free solder containing Bi, sb and Yb has the advantages of lower melting point, better welding reliability, and good wettability, conductivity and mechanical property.
Description
Technical Field
The invention relates to a Sn-Ag-Cu lead-free solder with high wettability containing Bi, sb and Yb, which is mainly used in the fields of microelectronic packaging and surface assembly and belongs to brazing materials in the fields of metal materials and metallurgy.
Background
Under the background of the current global lead-free electronic packaging, the solder is developed for a long time, and the binary lead-free solder Sn-Ag, sn-Cu, sn-Bi, sn-In, sn-Zn series and ternary lead-free solder Sn-Ag-Cu series solder alloys are the solder alloys of the current global lead-free electronic packagingThe major lead-free solder alloy systems that have been developed internationally. Among them, sn-Ag-Cu solder systems have been the best substitute for Sn-Pb solders, but there are many disputes in the world about the components of Sn-Ag-Cu solders, sn-3.8Ag-0.7Cu is recommended by European Union as a commonly used lead-free solder, sn-3.9Ag-0.6Cu is considered to be the best by American NEMI, sn-3.0Ag-0.5Cu is proposed by Japanese JEITA, and Sn-Ag-Cu solder alloys have several outstanding problems during the use: (1) The melting point of the solder is higher than that of Sn-Pb solder, and the heat damage to the substrate is large when electronic packaging is carried out; (2) The wettability needs to be improved and coarse Ag is generated during soldering 3 The formation of Sn particles can deteriorate the performance of the lead-free solder, and cracks can propagate along its interface; (3) In the service process, intermetallic compounds between the brazing filler metal and the substrate excessively grow, so that the welding spot fails when being subjected to vibration and mechanical impact.
Meanwhile, with the continuous improvement of microelectronic packaging technology, the size of a welding spot tends to be miniaturized, and the welding spot needs to bear heavier electrical, mechanical and thermal loads, which provides a new challenge for developing a novel Sn-Ag-Cu brazing filler metal with high reliability and durability; therefore, the development of the novel high-performance lead-free solder has positive significance for promoting the lead-free process of electronic products, the development of electronic packaging technology and the protection of ecological environment.
Disclosure of Invention
The invention aims to overcome the defects of the existing Sn-Ag-Cu brazing filler metal and provide a Sn-Ag-Cu lead-free brazing filler metal with low melting point, high mechanical property and high wettability, wherein the lead-free brazing filler metal comprises the following raw materials in percentage by mass: ag:2.8% -3.2%, cu:0.3% -0.7%, bi:1.8% -2.2%, sb:0.2% -1.0%, yb:0.02% -0.1% and the balance of Sn, and the lead-free solder has excellent weldability, high wettability and good mechanical property.
As a further preferred aspect of the present invention, the Ag content is 3.0wt.%, the Cu content is 0.5wt.%, the Bi content is 2.0wt.%, the Sb content is 0.60 wt.%, the Yb content is 0.04wt.%, and the balance is Sn.
The Sn-Ag-Cu lead-free solder containing Bi, sb and Yb is a six-element alloy and contains a plurality of trace elements which are in the airThe method is stable, and the normal preparation of the brazing filler metal is not influenced; the trace elements Bi and Sb and the rare earth element Yb are mutually cooperated to improve the wettability, the thermal stability and the mechanical property of the brazing filler metal; bi element is formed by refining primary beta-Sn and eutectic phase (Ag) 3 Sn and Cu 6 Sn 5 ) The microstructure of the Sn-Ag-Cu brazing filler metal can be improved, the tensile strength of the brazing filler metal can be improved by l-3% of Bi, and high elongation is kept; the addition of Sb can improve the conductivity and wettability of the Sn-Ag-Cu brazing filler metal and refine the brazing filler metal structure; sb and Bi are both dissolved in Sn, so that the brazing alloy can be hardened; the rare earth element Yb as a surface active element can improve the wettability and the ultimate tensile strength of the Sn-Ag-Cu brazing filler metal; the simultaneous addition of the three elements can ensure that the Sn-Ag-Cu brazing filler metal has higher reliability and better meets the requirements of modern electronic packaging.
The Sn-Ag-Cu lead-free solder obtained by adding and optimizing the content of Bi, sb and Yb has good wettability and spreadability, excellent mechanical property and conductivity of a welding spot, and the melting point is controlled within the range of 210-227 ℃ lower than the temperature of 227 ℃ of Sn-Ag-Cu ternary alloy.
The brazing filler metal can be prepared by a conventional method, namely, commercially available tin ingots, silver ingots, electrolytic copper, metal Bi, metal Sb and metal Yb are proportioned according to design components, mixed and smelted under the protection of vacuum or nitrogen, bars are obtained after casting, wires are obtained by extrusion or drawing, and the wires are prepared into particles; pb is taken as an impurity element in raw materials such as tin ingots, silver ingots, electrolytic copper and the like, the total amount of the Pb is controlled within the range of 0.001-0.1%, and the Pb meets the regulation of the national standard GB/T20422-2006 lead-free solder of the people's republic of China.
Compared with the prior art, the invention has the beneficial effects that:
(1) Through a large number of component optimization experiments, the component proportion of the brazing filler metal with excellent performance is determined, and the ductility and the ultimate tensile strength of the brazing filler metal are greatly improved under the synergistic effect of Bi, sb and Yb.
(2) By optimizing the addition amounts of Bi, sb and Yb, the spreading performance and the conductivity of the lead-free solder are obviously improved, and the melting point of the lead-free solder is controlled within the range of 210-227 ℃ lower than the 227 ℃ of the Sn-Ag-Cu ternary alloy.
Drawings
Fig. 1 is a schematic view of a tensile specimen.
FIG. 2 is a graph of engineering stress strain for comparative examples and examples.
FIG. 3 is a Differential Scanning Calorimetry (DSC) curve of a solder alloy of comparative example 1 (a), example 1 (b), example 3 (c), and example 5 (d).
FIG. 4 is a comparison of spreading areas of Sn-Ag-Cu-Bi-Sb lead-free solder alloys with different Yb contents and Sn-Ag-Cu solders and Sn-Ag-Cu-Bi-Sb solders.
FIG. 5 is a histogram of resistivity for different Yb content Sn-Ag-Cu-Bi-Sb lead-free solder alloys.
Detailed Description
In order to make the technical solutions of the present invention better understood, the present invention is further described below with reference to the accompanying drawings.
Example 1
A Sn-Ag-Cu lead-free solder containing Bi, sb and Yb comprises the following components: the solder is prepared by mixing and smelting 2.8 wt% of Ag, 0.3 wt% of Cu, 1.8 wt% of Bi, 0.2 wt% of Sb and 0.02 wt% of Yb, and the balance of Sn, under the protection of nitrogen.
Example 2
The Sn-Ag-Cu lead-free solder containing Bi, sb and Yb comprises the following components: the solder is prepared by mixing and smelting 2.9 wt% of Ag, 0.5 wt% of Cu, 2.0 wt% of Bi, 0.8 wt% of Sb and 0.02 wt% of Yb, and the balance of Sn, under the protection of nitrogen.
Example 3
A Sn-Ag-Cu lead-free solder containing Bi, sb and Yb comprises the following components: 3.0 wt% of Ag, 0.5 wt% of Cu, 2.0 wt% of Bi, 0.6 wt% of Sb, 0.04 wt% of Yb and the balance of Sn, and mixing and smelting under the protection of nitrogen to prepare the brazing filler metal.
Example 4
A Sn-Ag-Cu lead-free solder containing Bi, sb and Yb comprises the following components: the solder is prepared by mixing and smelting 3.1 wt% of Ag, 0.4 wt% of Cu, 1.9 wt% of Bi, 0.4 wt% of Sb, 0.08 wt% of Yb and the balance of Sn under the protection of nitrogen.
Example 5
A Sn-Ag-Cu lead-free solder containing Bi, sb and Yb comprises the following components: the solder is prepared by mixing and smelting 3.2 wt% of Ag, 0.7 wt% of Cu, 2.2 wt% of Bi, 0.6 wt% of Sb, 0.10 wt% of Yb and the balance of Sn under the protection of nitrogen.
Comparative example 1
The Sn-Ag-Cu lead-free solder comprises the following components: and the solder is prepared by mixing and smelting 3.0 wt% of Ag, 0.5 wt% of Cu and the balance of Sn under the protection of nitrogen.
Comparative example 2
The Sn-Ag-Cu lead-free solder containing Bi comprises the following components: 3.0 wt% of Ag, 0.5 wt% of Cu, 2.0 wt% of Bi and the balance Sn, and the solder is prepared by mixing and smelting under the protection of nitrogen.
The examples 1 to 5 and the comparative examples 1 to 2 were subjected to tensile, wetting, melting and conductivity tests;
1. tensile sample test method: the gauge length of the sample to be measured is 10mm, and the stretching speed is 0.6mm/min.
2. Measuring the spreading area of the brazing filler metal by adopting CAD: preparing small balls with the mass of 0.2g, performing a wettability experiment on a copper plate, and preserving heat for 20s on a heating table at 250 ℃ by using common soldering flux.
3. And detecting a Differential Scanning Calorimetry (DSC) curve of the lead-free solder alloy in the processes of temperature rise and temperature drop. Taking a 5-10mg lead-free solder sample for differential scanning calorimetry analysis, rapidly heating to 150 ℃ at room temperature, heating to 250 ℃ at the speed of 5 ℃/min, testing the melting process of the lead-free solder, and cooling to room temperature at the speed of 5 ℃/min, and testing the solidification process of the lead-free solder.
4. And (3) carrying out resistivity test on the brazing filler metal alloy small square piece with the size of 6mm multiplied by 2mm by adopting a digital four-probe tester.
Table 1: data for testing the Performance of the examples and comparative examples
By observing the stress-strain curves (fig. 2) of the examples and comparative examples, it can be found that: the Sn-Ag-Cu lead-free solder containing Bi, sb and Yb in the design has higher ultimate tensile strength and good ductility, the SAC305 solder is used in a comparative example 1, the ultimate tensile strength is 45.8MPa, and the SAC305 solder with 2wt.% of Bi is used in a comparative example 2, so that the addition of Bi can further improve the ultimate tensile strength of the SAC305 solder, but the ductility is reduced, because the Bi-rich phase is precipitated in the SAC305 solder due to the addition of Bi element, and the Bi-rich phase hinders dislocation motion, so that the ultimate tensile strength of the solder is improved; compared with the single addition of Bi element, the simultaneous addition of Bi, sb and Yb elements can improve the ultimate tensile strength of the Sn-Ag-Cu brazing filler metal and greatly improve the ductility at certain composition points (such as examples 2 and 3); the synergistic effect of the three elements enables the brazing filler metal to show excellent mechanical properties, and the ultimate tensile strength of example 3 is improved by about 44% and the ductility is improved by about 52% compared with the conventional brazing filler metal SAC305 in comparative example 1.
As can be seen from FIG. 3, the comparative example 1 (SAC 305) base solder has a maximum melting onset temperature of 217.53 ℃, and the example 1 (b), example 3 (c) and example 5 (d) solders have lower melting temperatures than the conventional SAC305 solders, which are mainly caused by the fact that Sb and Bi can be solid-dissolved in Sn, and the solid-solution causes a change in the structure of β -Sn; meanwhile, the four solder alloys only have one heat absorption peak, which indicates that the lead-free solder alloy has a melting point eutectic substance and is beneficial to forming a reliable connecting welding spot in the brazing process.
Example 6
In order to further prove the influence of Yb element addition on the performance of the solder, lead-free solders with different Yb element contents are designed, and the method specifically comprises the following steps: 3.0 wt% of Ag, 0.5 wt% of Cu, 2.0 wt% of Bi, 0.6 wt% of Sb, 0.02 wt% of Yb, 0.04 wt% of Yb, 0.06 wt% of Yb, 0.08 wt% of Sb, 0.10 wt% of Yb and the balance of Sn, and mixing and smelting under the protection of nitrogen to prepare the brazing filler metal.
As shown in FIG. 4, after Bi and Sb are added into SAC305 brazing filler metal at the same time, the spreading area is improved, which is mainly benefited by the existence of Bi; as shown in table 1: the difference between the melting point of comparative example 2 (SAC 305-2Bi, the melting point is 212.6 ℃) and that of comparative example 1 (SAC 305, the melting point is 217.5 ℃), the melting point of the Sn-Ag-Cu brazing filler metal is greatly improved by adding the Bi element, and the fluidity of the brazing filler metal alloy is greatly improved by reducing the melting point, so that the spreadability of the brazing filler metal alloy is improved; the spreading performance of the brazing filler metal is further improved by adding the Yb element, because the rare earth element Yb is a surface active element, the surface tension can be reduced by adding the Yb element, and the wettability of the brazing filler metal is improved; compared with the traditional brazing filler metal SAC305, the wettability of the brazing filler metal SAC305 is obviously improved by adding the three elements (Bi, sb and Yb), and the wettability is improved by about 20 percent.
It can be seen in FIG. 5 that the new Sn-Ag-Cu-Bi-Sb-Yb solder has a lower resistivity than the conventional solder SAC 305; and along with the increase of Yb content, the resistivity is gradually reduced, and the improvement of the performance can enable the brazing filler metal to be better applied to electronic packaging, so that electronic devices which are packaged have better conductivity in the using process, the heating and scalding phenomena in the using process are reduced, and the brazing filler metal is more energy-saving and environment-friendly to use.
Claims (3)
1. A Sn-Ag-Cu lead-free solder with high wettability containing Bi, sb and Yb is characterized in that: the lead-free solder comprises the following chemical components in percentage by mass: ag:2.8% -3.2%, cu:0.3% -0.7%, bi:1.8% -2.2%, sb:0.2% -1.0%, yb:0.02% -0.1% and the balance of Sn.
2. The Sn-Ag-Cu lead-free solder with high wettability containing Bi, sb and Yb as claimed in claim 1, wherein: the Ag content was 3.0wt.%, the Cu content was 0.5wt.%, the Bi content was 2.0wt.%, the Sb content was 0.60 wt.%, the Yb content was 0.04wt.%, and the balance Sn, in weight percent.
3. The method for preparing Sn-Ag-Cu lead-free solder with high wettability containing Bi, sb and Yb as claimed in claim 1, which is characterized in that: mixing and smelting the raw materials under the protection of vacuum or nitrogen, wherein the highest smelting temperature is determined by the total melting of the added raw materials; casting to obtain bar, extruding or drawing to obtain wire, and making into granule.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211057016.7A CN115446493A (en) | 2022-08-31 | 2022-08-31 | Sn-Ag-Cu lead-free solder with high wettability containing Bi, sb and Yb |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211057016.7A CN115446493A (en) | 2022-08-31 | 2022-08-31 | Sn-Ag-Cu lead-free solder with high wettability containing Bi, sb and Yb |
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| CN115446493A true CN115446493A (en) | 2022-12-09 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020155024A1 (en) * | 2000-10-27 | 2002-10-24 | H-Technologies Group, Inc. | Lead-free solder compositions |
| JP2005254298A (en) * | 2004-03-12 | 2005-09-22 | Nippon Steel Corp | Solder alloy for semiconductor packaging and method for manufacturing the same, and solder ball and electronic member |
| CN114746209A (en) * | 2020-06-23 | 2022-07-12 | 千住金属工业株式会社 | Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device, and ECU electronic circuit device |
| CN114888481A (en) * | 2022-05-31 | 2022-08-12 | 杭州华光焊接新材料股份有限公司 | High-reliability lead-free solder alloy |
-
2022
- 2022-08-31 CN CN202211057016.7A patent/CN115446493A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020155024A1 (en) * | 2000-10-27 | 2002-10-24 | H-Technologies Group, Inc. | Lead-free solder compositions |
| JP2005254298A (en) * | 2004-03-12 | 2005-09-22 | Nippon Steel Corp | Solder alloy for semiconductor packaging and method for manufacturing the same, and solder ball and electronic member |
| CN114746209A (en) * | 2020-06-23 | 2022-07-12 | 千住金属工业株式会社 | Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device, and ECU electronic circuit device |
| CN114888481A (en) * | 2022-05-31 | 2022-08-12 | 杭州华光焊接新材料股份有限公司 | High-reliability lead-free solder alloy |
Non-Patent Citations (1)
| Title |
|---|
| 王宗杰, 路林, 王敏: "合金元素对Sn-Bi-Sb-Ag-Cu-Re系无铅钎料性能和组织的影响", 沈阳工业大学学报, no. 04 * |
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