CN115440624A - Pneumatic huge transfer device and method based on micropore array - Google Patents
Pneumatic huge transfer device and method based on micropore array Download PDFInfo
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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Abstract
The invention discloses a pneumatic mass transfer device and method based on a micropore array. The invention utilizes the ceramic substrate with the oriented vertical micropores as the bearing plate of the elastic layer, adopts an array pneumatic transfer mode to drive the elastic layer to generate physical bubbling to finish chip transfer, does not generate any chemical heat action in the chip transfer process, has uniform and controllable transfer acting force, does not cause damage to the chip, does not generate excess substances, and can repeatedly use the transfer membrane. In addition, the array pneumatic transfer further improves the transfer speed of the chip, reduces the pore diameter of the micropore to be less than 20 microns, improves the density of the micropore, and can be used for realizing the mass transfer of the chip of the Micro LED.
Description
Technical Field
The invention relates to a micro light-emitting diode mass transfer technology, in particular to a pneumatic mass transfer device and method based on a micropore array.
Background
The electronic display screen transmits information in various forms such as characters, images, videos and the like, serves as a bridge for connecting people and machines, is a link for man-machine information exchange and transmission, and plays an important role in the production and consumption fields. In order to meet the consumption requirements and actual production requirements of people, the display industry continuously iteratively updates the technology.
In 1987, a CRT (Cathode Ray Tube) display screen of braun invention realized various patterns and characters display by using electron beams to touch phosphors to generate images. The CRT display screen has the defects of large volume, high power consumption, large radiation and the like, and is difficult to meet the requirements of large-screen flat-type ground display and slowly fades out of the market. In order to reduce the volume of the Display screen and realize flat panel Display, the first LCD (Liquid Crystal Display) in the world was born in 1964, and the market was rapidly occupied with the advantages of high definition, light weight, thinness, low energy consumption, low radiation, long service life and the like. The LCD display screen uses a backlight layer as a liquid crystal matrix light-emitting source and has the defects of slow response time, low conversion efficiency, poor uniformity, low color saturation and the like. In 1987, the company Istman Kodak invented OLED (Organic Light-Emitting Diode) display screen. The OLED display screen adopts a self-luminous display technology, has the advantages of wide viewing angle, high contrast, power saving, high response speed and the like, but adopts organic materials, has short service life, is easy to have the problems of dead spots, color deviation and the like, and seriously influences the display effect. In 2018, the Mini/Micro LED display screen is bright in the public with a brand-new form of 'subverting tradition and surpassing imagination', micron-scale three-color light-emitting chips are arranged on a circuit substrate as a pixel high-density array by utilizing the Micro-scaling and matrixing technology, and the Micro/Micro LED display screen has the advantages of high efficiency, good weather resistance, long service life, high resolution and the like, and is a new generation display screen with great potential. Compared with the traditional LCD display screen and OLED display screen, the Mini/Micro LED display screen has smaller LED chip size and more transfer quantity, and challenges are provided for the precision and speed of LED chip transfer. Numerous methods for transferring LED chips have been proposed.
The mass transfer method mainly comprises the steps of elastic seal, fluid self-assembly, accurate pick-up and release and laser release. The elastic seal finishes the picking and releasing of the chip by regulating and controlling the adhesive force between the elastic seal and the chip interface. This process needs the moving speed and the angle of accurate control elastic seal, and the control degree of difficulty is great, and needs the chip support plate very level and smooth to there is the clearance in elastic seal and chip, reduces chip transfer efficiency. Fluid self-assembly places the chip and receiving substrate in a fluid-filled container, and the chip is moved by fluid force to transfer to a receiving position, which requires special processing of the chip and receiving substrate to form a structural complement. The precise pick-up and release is classified into electrostatic force, electromagnetic force, swing arm type and needle type according to the difference of acting force. The electrostatic force and the electromagnetic force are charged with static electricity or magnetism by using the transfer head to grab the chip, and the electrostatic electricity or the magnetism is removed after the chip reaches a specified position, so that the chip is released. Both methods require special handling of the chip, increasing the risk of damage to the chip. Laser release the lift-off layer by laser irradiation and photo-thermal or photochemical reaction occurs on the surface of the lift-off layer, causing the chip to peel off onto the receiving substrate.
In the LED chip transfer method and the light source board described in chinese patent No. 20201082828204.x, the lift-off layer is ablated by laser to reduce the adhesion between the lift-off layer and the adhesive layer, so that the LED chip is peeled off from the receiving substrate. However, the high energy of the laser easily causes chip damage, and the adhesive layer is also melted during the laser irradiation process to generate excess materials, which cover the LED chip and affect the light emitting effect of the LED.
In the method and the device for transferring a huge amount of micro LEDs based on high-speed scanning laser transfer printing described in chinese patent No. 202110019640.7, bubbles generated between a substrate and a peeling layer by femtosecond laser push LED chips to a receiving substrate, and the bubbles are exploded by high-pressure gas acting force with unstable size and direction generated in the process, which causes chip damage and generates redundancy, thus polluting working environment. In both schemes, the chips are peeled by means of chemical reaction generated on the surface of the peeling layer by the laser beams, the repeatability is poor, and only one chip can be transferred at a time for laser single-point irradiation, so that the improvement of the transfer speed is limited.
The Mini/Micro LED chip pneumatic bulk transfer device described in chinese patent 202210631736.3 adopts the electromagnetic valve, the pressure regulating valve and the air nozzle to generate controllable bubbles on the elastic membrane and the through hole bottom plate, and pushes the chip to transfer to the receiving substrate, thereby avoiding the defects of instability of laser bulk transfer thermochemical action and easy damage of the chip, and realizing the reuse of the transfer membrane without generating excess. However, due to the limitation of the material of the through hole substrate, it is difficult to process through holes with smaller size and higher density, and smaller chips cannot be transferred.
In view of the above, the present invention is particularly proposed.
Disclosure of Invention
The present invention provides a pneumatic bulk transfer device and method based on micro-pore array, so as to solve the above technical problems in the prior art.
The purpose of the invention is realized by the following technical scheme:
the invention relates to a pneumatic huge transfer device based on a micropore array, which mainly comprises a ceramic substrate 1, a first bonding layer 2, an elastic layer 3, a second bonding layer 4, a clamping ring 5, a sub-clamping groove 6A, a mother clamping groove 6B, a pneumatic device 7, a chip 8, a receiving substrate 9 and solder paste/conductive adhesive 10, wherein the ceramic substrate 1 is positioned above the first bonding layer 2, the elastic layer 3 and the second bonding layer 4, the first bonding layer 2 and the elastic layer 3 are positioned below the ceramic substrate 1 and above the second bonding layer 4, the first bonding layer 2 is adhered to the lower surface of the ceramic substrate 1, the elastic layer 3 is adhered to the lower surface of the first bonding layer 2 through the adhesiveness of the first bonding layer 2, the second bonding layer 4 is positioned below the elastic layer 3, and through the lower surface of self viscidity laminating at elastic layer 3, the snap ring 5 is located 1 top of ceramic substrate, and fix at 1 upper surface of ceramic substrate, daughter card groove 6A and female card groove 6B are located ceramic substrate 1, first tie coat 2, elastic layer 3, the outside of second tie coat 4 and snap ring 5, and fix on snap ring 5 through the cooperation of the draw-in groove position of daughter card groove 6A and female card groove 6B, pneumatic means 7 is located 1 top of ceramic substrate, chip 8 array arranges in second tie coat 4 below, and the viscidity adhesion through second tie coat 4 is at the lower surface of second tie coat 4, it is located chip 8 below to receive base plate 9, tin cream/conducting resin 10 is the one-to-one with chip 8, and coat in and receive base plate 9 upper surface.
The ceramic substrate 1 is one of alumina, zirconia, silicon carbide, boron carbide and aluminum carbide, and the thickness of the ceramic substrate is 0.1mm-3mm.
The ceramic substrate 1 has oriented vertical micropores with a diameter of 0.1 μm to 20 μm.
The first bonding layer 2 and the second bonding layer 4 are one of organic silicon adhesives, epoxy resin adhesives and polyurethane adhesives, the adhesive force of the first bonding layer 2 is 0.5N/25mm-10N/25mm, and the adhesive force of the second bonding layer 4 is 0.01N/25mm-2N/25mm.
The elastic layer 3 is one of PDMS, TPE, TPEE, TPU, PU and TPR materials with good recoverable deformation capability.
The ceramic substrate 1, the first bonding layer 2, the elastic layer 3 and the second bonding layer 4 are combined into a transfer crystal film, and the manufacturing process comprises the following steps:
s101: pouring the ceramic slurry into the micro-bump mould 11, and vibrating to ensure uniform filling;
s102: sintering the ceramic slurry, and taking out after completely solidifying;
s103: coating the first adhesive layer 2 on the upper surface of the elastic layer 3;
s104: after the first bonding layer 2 is cured, the protective layer 13 is attached to the first bonding layer 2;
s105: the elastic layer 3 is turned over and the other side of the elastic layer is coated with a second bonding layer 4;
s106: after the second bonding layer 4 is cured, the protective layer 13 is attached to the second bonding layer 4;
s107: removing irregularities along the set cutting line 14;
s108: tearing off the protective film 13 of the first bonding layer 2 and attaching the protective film to the ceramic substrate 1;
s109: and placing the transferred crystal film into a vacuum container, vacuumizing to discharge bubbles between the ceramic substrate 1 and the first bonding layer 2, realizing close contact and ensuring the smoothness.
The pneumatic device 7 is provided with air nozzles 703 arranged in an array, the distance between every two adjacent air nozzles 703 is integral multiple of the distance between every two adjacent chips 8, and the gap between the lower ends of the air nozzles 703 and the ceramic substrate 1 is 10-500 micrometers.
The chips 8 are arranged in an array, the light emitting surfaces of the chips face the second bonding layer 4, and the gaps between the lower surfaces of the chips 8 and the upper surfaces of the solder paste/conductive adhesive 10 are 10-500 micrometers.
The invention discloses a pneumatic huge transfer method based on a micropore array, which uses the pneumatic huge transfer device based on the micropore array to transfer a chip and comprises the following steps:
s201: tearing off the protective film of the second bonding layer 4, and adhering the chip 8 to the second bonding layer 4;
s202: adjusting the gap between the air tap 703 and the ceramic substrate 1 and the gap between the chip 8 and the solder paste/conductive adhesive 10;
s203: aligning the air tap 703 with the chip 8;
s204: aligning the chip 8 with the solder paste/conductive adhesive 10;
s204: observing the corresponding situation of the air tap 703 and the chip 8;
s205: selectively opening the electromagnetic valve 702 to blow air according to whether the air nozzle 703 is aligned with the chip 8, so that the chip 8 is transferred to the receiving substrate 9 to complete the transfer of the chip 8;
s206: steps S203-S205 are repeated until all chips 8 have completed the transfer.
Compared with the prior art, the pneumatic huge transfer device and method based on the micropore array have the advantages that no heat is generated, the deformation quantity is controllable, the transfer crystal film can be recycled, the device can be used for transferring the LED chip to a receiving welding point quickly and accurately without damage and pollution, and the matched use equipment is low in cost. The chip is not damaged, no excess is left, the transfer crystal film can be repeatedly used, and the transfer of the array Micro LED chip with smaller size can be realized.
Drawings
FIG. 1 is a schematic diagram of a pneumatic bulk transfer device according to an embodiment of the present invention;
FIG. 2 is an exploded view of a transfer die, a snap ring, a sub-card slot and a mother card slot according to an embodiment of the present invention;
FIG. 3 is a schematic view of a pneumatic actuator according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a micro-bump mold according to an embodiment of the invention;
FIG. 5a is a schematic view of a first adhesive layer applied according to an embodiment of the present invention;
FIG. 5b is a schematic view of a first adhesive layer of an embodiment of the present invention;
FIG. 5c is a schematic view of a protective film covering the first adhesive layer according to an embodiment of the present invention;
FIG. 6a is a schematic view of a second adhesive layer applied according to an embodiment of the present invention;
FIG. 6b is a schematic view of a second adhesive layer of an embodiment of the present invention;
FIG. 6c is a schematic view of a protective film covering the second adhesive layer according to an embodiment of the present invention;
FIG. 7 is a schematic cut away view of a first adhesive layer, an elastic layer, and a second adhesive layer in accordance with an embodiment of the present invention;
FIG. 8 is a schematic view of a first adhesive layer bond according to an embodiment of the present invention;
FIG. 9 is a schematic view of a snap ring, daughter card slot and female card slot assembly of an embodiment of the present invention;
FIG. 10 is a schematic diagram showing the relative positions of the air nozzle, the chip and the solder paste/conductive adhesive according to the embodiment of the invention;
fig. 11 is a schematic diagram illustrating a transfer method according to an embodiment of the present invention.
Detailed Description
The technical scheme in the embodiment of the invention is clearly and completely described below by combining the attached drawings in the embodiment of the invention; it is to be understood that the described embodiments are merely exemplary of the invention, and are not intended to limit the invention to the particular forms disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
The terms that may be used herein are first described as follows:
the term "and/or" means that either or both can be achieved, for example, X and/or Y means that both cases include "X" or "Y" as well as three cases including "X and Y".
The terms "comprising," "including," "containing," "having," or other similar terms of meaning should be construed as non-exclusive inclusions. For example: including a feature (e.g., material, component, ingredient, carrier, formulation, material, dimension, part, component, mechanism, device, process, procedure, method, reaction condition, processing condition, parameter, algorithm, signal, data, product, or article of manufacture), is to be construed as including not only the particular feature explicitly listed but also other features not explicitly listed as such which are known in the art.
The term "consisting of 8230% \8230%," consisting of 8230indicates the exclusion of any technical characteristic elements not explicitly listed. If used in a claim, the term shall render the claim closed except for the usual impurities associated therewith which do not include the technical features other than those explicitly listed. If the term occurs in only one clause of the claims, it is defined only to the elements explicitly recited in that clause, and elements recited in other clauses are not excluded from the overall claims.
Unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly, as for example: can be fixedly connected, can also be detachably connected or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms herein can be understood by those of ordinary skill in the art as appropriate.
The terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in an orientation or positional relationship that is indicated based on the orientation or positional relationship shown in the drawings for ease of description and simplicity of description only, and are not intended to imply or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting herein.
Details which are not described in detail in the embodiments of the invention belong to the prior art which is known to a person skilled in the art. Those not specifically mentioned in the examples of the present invention were carried out according to the conventional conditions in the art or conditions suggested by the manufacturer. The reagents or instruments used in the examples of the present invention are not specified by manufacturers, and are all conventional products available by commercial purchase.
The invention discloses a pneumatic huge transfer device based on a micropore array, which mainly comprises a ceramic substrate 1, a first bonding layer 2, an elastic layer 3, a second bonding layer 4, a clamping ring 5, a sub-clamping groove 6A, a mother clamping groove 6B, a pneumatic device 7, a chip 8, a receiving substrate 9 and solder paste/conductive adhesive 10, wherein the ceramic substrate 1 is positioned above the first bonding layer 2, the elastic layer 3 and the second bonding layer 4, the first bonding layer 2 and the elastic layer 3 are positioned below the ceramic substrate 1 and above the second bonding layer 4, the first bonding layer 2 is adhered to the lower surface of the ceramic substrate 1, the elastic layer 3 is adhered to the lower surface of the first bonding layer 2 through the adhesion of the first bonding layer 2, the second bonding layer 4 is positioned below the elastic layer 3, and through the lower surface of self viscidity laminating at elastic layer 3, the snap ring 5 is located 1 top of ceramic substrate, and fix at 1 upper surface of ceramic substrate, daughter card groove 6A and female card groove 6B are located ceramic substrate 1, first tie coat 2, elastic layer 3, the outside of second tie coat 4 and snap ring 5, and fix on snap ring 5 through the cooperation of the draw-in groove position of daughter card groove 6A and female card groove 6B, pneumatic means 7 is located 1 top of ceramic substrate, chip 8 array arranges in second tie coat 4 below, and the viscidity adhesion through second tie coat 4 is at the lower surface of second tie coat 4, it is located chip 8 below to receive base plate 9, tin cream/conducting resin 10 is the one-to-one with chip 8, and coat in and receive base plate 9 upper surface.
The ceramic substrate 1 is one of alumina, zirconia, silicon carbide, boron carbide and aluminum carbide, and the thickness of the ceramic substrate is 0.1mm-3mm.
The ceramic substrate 1 is provided with oriented vertical micropores, and the diameter of the micropores is 0.1-20 μm.
The first bonding layer 2 and the second bonding layer 4 are one of organic silicon adhesives, epoxy resin adhesives and polyurethane adhesives, the adhesive force of the first bonding layer 2 is 0.5N/25mm-10N/25mm, and the adhesive force of the second bonding layer 4 is 0.01N/25mm-2N/25mm.
The elastic layer 3 is one of PDMS, TPE, TPEE, TPU, PU and TPR materials with good recoverable deformability.
The ceramic substrate 1, the first bonding layer 2, the elastic layer 3 and the second bonding layer 4 are combined into a transfer crystal film, and the manufacturing process comprises the following steps:
s101: pouring the ceramic slurry into the micro-bump mould 11, and vibrating to ensure uniform filling;
s102: sintering the ceramic slurry, and taking out after completely solidifying;
s103: coating the first adhesive layer 2 on the upper surface of the elastic layer 3;
s104: after the first bonding layer 2 is cured, the protective layer 13 is attached to the first bonding layer 2;
s105: the elastic layer 3 is turned over and the other side of the elastic layer is coated with a second bonding layer 4;
s106: after the second bonding layer 4 is cured, the protective layer 13 is attached to the second bonding layer 4;
s107: removing irregularities along the set cut line 14;
s108: tearing off the protective film 13 of the first bonding layer 2 and attaching the protective film to the ceramic substrate 1;
s109: and (3) putting the transferred crystal film into a vacuum container, vacuumizing to discharge bubbles between the ceramic substrate 1 and the first bonding layer 2, realizing close contact and ensuring the flatness.
The pneumatic device 7 is provided with air nozzles 703 arranged in an array, the distance between every two adjacent air nozzles 703 is integral multiple of the distance between every two adjacent chips 8, and the gap between the lower ends of the air nozzles 703 and the ceramic substrate 1 is 10-500 micrometers.
The chips 8 are arranged in an array, the light emitting surfaces of the chips face the second bonding layer 4, and the gaps between the lower surfaces of the chips 8 and the upper surfaces of the solder paste/conductive adhesive 10 are 10-500 micrometers.
The invention discloses a pneumatic huge transfer method based on a micropore array, which uses the pneumatic huge transfer device based on the micropore array to transfer a chip and comprises the following steps:
s201: tearing off the protective film of the second bonding layer 4, and adhering the chip 8 to the second bonding layer 4;
s202: adjusting the gap between the air tap 703 and the ceramic substrate 1 and the gap between the chip 8 and the solder paste/conductive adhesive 10;
s203: aligning the air tap 703 with the chip 8;
s204: aligning the chip 8 with the solder paste/conductive adhesive 10;
s204: observing the corresponding situation of the air faucet 703 and the chip 8;
s205: selectively opening the electromagnetic valve 702 according to whether the air nozzle 703 is aligned with the chip 8 or not, and blowing air to transfer the chip 8 to the receiving substrate 9 to finish the transfer of the chip 8;
s206: steps S203-S205 are repeated until all chips 8 have completed the transfer.
In the step S203: aligning an air nozzle 703 with a chip 8 and a solder paste/conductive adhesive 10, wherein a high-precision alignment platform is adopted for alignment, and the functions of plane translation, rotation and space vertical motion are realized; s204: the corresponding situation of the air nozzle 703 and the chip 8 is observed, and an industrial CCD camera and visual analysis software are adopted for observation.
The principle of the scheme is as follows:
as shown in fig. 1, when the pneumatic huge transfer device based on the micropore array works, after the air nozzle array and the Micro LED chip array are aligned, the electromagnetic valve array is selectively opened, the air nozzle array is controlled to blow high-pressure gas into the ceramic substrate with the Micro through holes, so that the first bonding layer and the elastic layer generate bubbling, the chip positioned on the lower surface of the second bonding layer is pushed to move towards the receiving substrate, when the chip array contacts with tin paste/conductive adhesive on the receiving substrate, the electromagnetic valve is closed, the air pressure in the ceramic substrate with the Micro through holes is reduced, the elastic layer drives the second bonding layer to recover, the transfer of the single chip array is completed, the electromagnetic valve array is opened again, and the chip array can be repeatedly transferred. And when each Micro LED chip has no position deviation, all the electromagnetic valves are opened to complete the transfer of all the chip arrays. When partial chips have position deviation, the corresponding electromagnetic valves are not opened during transferring, namely, the chips with the position deviation at present are not transferred, and after the chips without the position deviation are transferred, the chips with the position deviation are corrected and then transferred.
Compared with the prior art, the invention has the advantages that:
according to the invention, the ceramic substrate with the oriented vertical micropores is used as the bearing plate of the elastic layer, an array pneumatic transfer mode is adopted, the elastic layer is driven to generate physical bubbling, and Micro LED chip transfer is completed, compared with a laser release mode, no chemical heat action is generated in the chip transfer process, the transfer acting force is uniform and controllable, no damage is caused to the chip, no excess is generated, and the transfer membrane can be repeatedly used; compared with a single-point transfer mode, the array pneumatic transfer further improves the transfer speed of the chip; compared with the micropore base plate processed by laser and chemical etching, the micropore size is further reduced to be less than 20 microns, the micropore density is improved, and the micropore base plate can be used for mass transfer of Micro LED chips.
In conclusion, the pneumatic huge transfer device and method based on the micropore array do not damage the chip, have no excess, and can realize the transfer of the array Micro LED chip with smaller size, and the transfer crystal film can be reused.
In order to more clearly show the technical solutions and the technical effects provided by the present invention, the following detailed description is provided for the embodiments of the present invention with specific embodiments.
Example 1
As shown in fig. 1 and 2, a pneumatic huge transfer device based on micro-pore array comprises a ceramic substrate 1, a first bonding layer 2, an elastic layer 3, a second bonding layer 4, a snap ring 5, a sub-card slot 6A, a mother card slot 6B, a pneumatic device 7, a chip 8, a receiving substrate 9 and a solder paste/conductive adhesive 10, wherein the ceramic substrate 1 is positioned above the first bonding layer 2, the elastic layer 3 and the second bonding layer 4, the first bonding layer 2 and the elastic layer 3 are positioned below the ceramic substrate 1 and above the second bonding layer 4, the first bonding layer 2 is adhered to the lower surface of the ceramic substrate 1, the elastic layer 3 is adhered to the lower surface of the first bonding layer 2 through the adhesiveness of the first bonding layer 2, the second bonding layer 4 is positioned below the elastic layer 3, and through the lower surface of self viscidity laminating at elastic layer 3, the snap ring 5 is located 1 top of ceramic substrate, and fix at 1 upper surface of ceramic substrate, daughter card groove 6A and female card groove 6B are located ceramic substrate 1, first tie coat 2, elastic layer 3, the outside of second tie coat 4 and snap ring 5, and fix on snap ring 5 through the cooperation of the draw-in groove position of daughter card groove 6A and female card groove 6B, pneumatic means 7 is located 1 top of ceramic substrate, chip 8 array arranges in second tie coat 4 below, and the viscidity adhesion through second tie coat 4 is at the lower surface of second tie coat 4, it is located chip 8 below to receive base plate 9, tin cream/conducting resin 10 is the one-to-one with chip 8, and coat in and receive base plate 9 upper surface. The ceramic substrate 1 is one of alumina, zirconia, silicon carbide, boron carbide and aluminum carbide, has a thickness of 0.1mm to 3mm, has oriented vertical micropores, and has a diameter of 0.1 μm to 20 μm. The first bonding layer 2 and the second bonding layer 4 are one of organic silicon adhesive, epoxy resin adhesive and polyurethane adhesive, the adhesive force of the first bonding layer 2 is 0.5N/25mm-10N/25mm, and the adhesive force of the second bonding layer 4 is 0.01N/25mm-2N/25mm. The elastic layer 3 is one of PDMS, TPE, TPEE, TPU, PU and TPR materials with good recoverable deformability.
Fig. 3 is a schematic structural diagram of a pneumatic actuator 7 according to the technical solution of the present invention, the pneumatic actuator 7 mainly includes a support plate 701, an electromagnetic valve 702, and air nozzles 703, the support plate 701 is located below the electromagnetic valve 702 and above the air nozzles 703, the electromagnetic valves 702 are located above the support plate 701 and are mounted on the upper surface of the support plate 701 in an array arrangement manner, one end of each of the electromagnetic valves 702 is connected to an external air source, the other end of each of the electromagnetic valves 702 is connected to the air nozzles 703 and can receive a control signal to control the on/off of the valve, and the air nozzles 703 are located below the support plate 701 and the electromagnetic valves 702 and are connected to the electromagnetic valves 702.
Fig. 4 is a schematic structural diagram of a micro-bump mold 11 according to the technical solution of the present invention. The micro-bump mold 11 has micro-bumps arranged in an array, and the micro-bumps can be used for forming micropores after ceramic slurry is solidified when the ceramic substrate 1 is manufactured.
Fig. 5a is a schematic diagram of coating a first adhesive layer 2 according to the technical solution of the present invention, fig. 5b is a schematic diagram of the first adhesive layer 2 according to the technical solution of the present invention after coating, fig. 5c is a schematic diagram of the first adhesive layer 2 according to the technical solution of the present invention after coating a protective film 13, the first adhesive layer 2 is uniformly coated on the upper surface of the elastic layer 3 by using an automatic coater 12, and after the first adhesive layer 2 is cured, the protective film 13 is covered on the upper surface of the first adhesive layer 2 to protect the first adhesive layer from contamination.
Fig. 6a is a schematic view of coating the second adhesive layer 4 according to the technical solution of the present invention, fig. 6b is a schematic view of completing coating the second adhesive layer 4 according to the technical solution of the present invention, fig. 6c is a schematic view of covering the second adhesive layer 4 with the protective film 13 according to the technical solution of the present invention, turning over the elastic layer 3 coated with the first adhesive layer 2, uniformly coating the second adhesive layer 4 on the upper surface of the elastic layer 3 by using the automatic coating machine 12, and covering the protective film 13 on the upper surface of the second adhesive layer 4 after the second adhesive layer 4 is cured to protect the second adhesive layer 4 from contamination.
Fig. 7 is a schematic diagram of cutting a first adhesive layer 2, an elastic layer 3 and a second adhesive layer 4 according to the technical solution of the present invention, where the first adhesive layer 2 and the second adhesive layer 4 have a defect of uneven coating at edge portions, which greatly affects chip transfer, a cutting line 14 is defined according to the size of a ceramic substrate 1, the edge portions of the first adhesive layer 2 and the second adhesive layer 4 are removed along the cutting line 14, and the first adhesive layer 2, the elastic layer 3 and the second adhesive layer 4 are divided into the same size as the ceramic substrate 1.
Fig. 8 is a schematic view of the adhesion of the first adhesive layer 2 according to the technical solution of the present invention. Tear the protection film 13 of first tie coat 2 top, aim at 1 edge of ceramic substrate with 2 edges of first tie coat, apply certain pressure and laminate, later put into vacuum vessel, the bubble between evacuation discharge ceramic substrate 1 and first tie coat 2 realizes in close contact with and ensures to level.
Fig. 9 is an assembly schematic diagram of a snap ring 5, a sub-card slot 6A and a mother card slot 6B according to the technical solution of the present invention, where the snap ring 5 has a snap ring position in an outward convex shape, the sub-card slot 6A and the mother card slot 6B have card slot positions in an inward concave shape, and the sub-card slot 6A and the mother card slot 6B are respectively pushed into the snap ring 5 from both sides and are fixed on the snap ring 5 by the card slot positions in a matching manner.
Fig. 10 is a schematic diagram of relative positions of the air nozzles 703, the chips 8, and the solder paste/conductive adhesive 10 according to the technical solution of the present invention, where the distance between adjacent air nozzles 703, the distance between adjacent chips 8, and the distance between an adjacent group of solder paste/conductive adhesive 10 are integer multiples of each other, so as to match positions during array transfer, and in practical situations, an angle inclination and a position deviation may exist in each chip 8.
Fig. 11 is a schematic diagram of the principle of the transfer method according to the technical solution of the present invention, after the alignment operation is completed, if the distance between the adjacent air nozzles 703, the distance between the adjacent chips 8, and the distance between the adjacent set of solder paste/conductive adhesive 10 are integer multiples of each other, i.e. there is no chip 8 with an angle inclination and a position deviation, the pneumatic device 7 is completely turned on, and the array high-pressure gas is blown out to peel the first bonding layer 2 from the ceramic substrate 1, the elastic layer 3 is deformed to form a protrusion downward, the lower surface of the chip 8 adhered to the second bonding layer 4 contacts the solder paste or conductive adhesive 10 on the receiving substrate 9, because the adhesion force between the upper surface of the chip 8 and the second bonding layer 4 is much smaller than the adhesion force between the upper surface of the chip 8 and the solder paste or conductive adhesive 10, the chip 8 is peeled off to the receiving substrate 9, and the transfer of the chip is completed, at this time, the pneumatic device 7 moves to the next working position, and the above steps are repeated to complete the mass transfer of the chip 8. If the individual chip 8 has an angle inclination and a position deviation, the pneumatic device 7 is partially opened, only the chip 8 with the correct position is transferred, after all the chips 8 with the correct position are transferred, the position is corrected, and the chips 8 which are not transferred are used for completing the vacant position. In addition, the deformation of the elastic layer 3 is controlled by adjusting the pressure of the blown gas by the pneumatic actuator 7 according to the elastic modulus of the elastic layer 3 and the gap between the chip 8 and the solder paste/conductive adhesive 10, so as to achieve better transfer effect.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Claims (10)
1. The utility model provides a pneumatic huge transfer device based on micropore array, mainly by ceramic substrate (1), first tie coat (2), elastic layer (3), second tie coat (4), snap ring (5), daughter card groove (6A), female draw-in groove (6B), pneumatic means (7), chip (8), receive base plate (9) and tin cream/conducting resin (10) and constitute its characterized in that:
the ceramic substrate (1) is positioned above a first bonding layer (2), an elastic layer (3) and a second bonding layer (4), the first bonding layer (2), the elastic layer (3) is positioned below the ceramic substrate (1) and above the second bonding layer (4), the first bonding layer (2) is adhered to the lower surface of the ceramic substrate (1), the elastic layer (3) is adhered to the lower surface of the first bonding layer (2) through the viscosity of the first bonding layer (2), the second bonding layer (4) is positioned below the elastic layer (3) and is adhered to the lower surface of the elastic layer (3) through the viscosity of the elastic layer, a clamping ring (5) is positioned above the ceramic substrate (1) and is fixed on the upper surface of the ceramic substrate (1), a sub-clamping groove (6A) and a mother clamping groove (6B) are positioned on the ceramic substrate (1), the first bonding layer (2), the elastic layer (3), the second bonding layer (4) and the clamping ring (5) are positioned on the outer sides of the clamping groove (5), the sub-clamping groove (6A) and the mother clamping groove (6B) is positioned on the ceramic substrate (7), the clamping groove is positioned above a pneumatic device (7) and is positioned below the second clamping groove (8), a chip array receiving device (8) through the chip (8), the solder paste/conductive adhesive (10) and the chip (8) are in one-to-one correspondence and coated on the upper surface of the receiving substrate (9).
2. The microwell array based pneumatic bulk transfer device of claim 1, wherein: the ceramic substrate (1) is made of one of alumina, zirconia, silicon carbide, boron carbide and aluminum carbide, and the thickness of the ceramic substrate is 0.1mm-3mm.
3. The microwell array based pneumatic bulk transfer device of claim 1, wherein: the ceramic substrate (1) is provided with oriented vertical micropores, and the diameter of the oriented vertical micropores is 0.1-20 mu m.
4. The microwell array based pneumatic bulk transfer device and method of claim 1, wherein: the first bonding layer (2) and the second bonding layer (4) are one of organic silicon adhesives, epoxy resin adhesives and polyurethane adhesives, the adhesive force of the first bonding layer (2) is 0.5N/25mm-10N/25mm, and the adhesive force of the second bonding layer (4) is 0.01N/25mm-2N/25mm.
5. The microwell array based pneumatic bulk transfer device of claim 1, wherein: the elastic layer (3) is one of PDMS, TPE, TPEE, TPU, PU and TPR materials with good recoverable deformation capability.
6. The microwell array based pneumatic bulk transfer device of claim 1, wherein: the transfer crystal film is formed by combining the ceramic substrate (1), the first bonding layer (2), the elastic layer (3) and the second bonding layer (4), and the manufacturing process is as follows:
s101: pouring the ceramic slurry into a micro-bump mould (11), and vibrating to ensure uniform filling;
s102: sintering the ceramic slurry, and taking out after the ceramic slurry is completely solidified;
s103: coating the first bonding layer (2) on the upper surface of the elastic layer (3);
s104: after the first bonding layer (2) is solidified, attaching the protective layer (13) to the first bonding layer (2);
s105: the elastic layer (3) is turned over, and the other surface of the elastic layer is coated with a second bonding layer (4);
s106: after the second bonding layer (4) is solidified, attaching the protective layer (13) to the second bonding layer (4);
s107: removing irregularities along a set cutting line (14);
s108: tearing off the protective film (13) of the first bonding layer (2) and attaching the protective film to the ceramic substrate (1);
s109: and placing the transfer crystal film into a vacuum container, vacuumizing to discharge bubbles between the ceramic substrate (1) and the first bonding layer (2), and realizing close contact and ensuring the smoothness.
7. The microwell array based pneumatic bulk transfer device of claim 1, wherein: the pneumatic device (7) is provided with air nozzles (703) which are arranged in an array, the distance between every two adjacent air nozzles (703) is integral multiple of the distance between every two adjacent chips (8), and the gap between the lower ends of the air nozzles (703) and the ceramic substrate (1) is 10-500 mu m.
8. The microwell array based pneumatic bulk transfer device of claim 1, wherein: the chips (8) are arranged in an array, the light emitting surfaces of the chips face the second bonding layer (4), and gaps between the lower surfaces of the chips (8) and the upper surfaces of the solder paste/conductive adhesive (10) are 10-500 micrometers.
9. A pneumatic bulk transfer method based on a micro well array, characterized in that the pneumatic bulk transfer device based on a micro well array according to any one of claims 1 to 8 is used for chip transfer, and the steps are as follows:
s201: tearing off the protective film of the second bonding layer (4) and adhering the chip (8) to the second bonding layer (4);
s202: adjusting the gap between the air tap (703) and the ceramic substrate (1) and the gap between the chip (8) and the solder paste/conductive adhesive (10);
s203: aligning the air nozzle (703) with the chip (8);
s204: aligning the chip (8) with the solder paste/conductive adhesive (10);
s204: observing the corresponding situation of the air nozzle (703) and the chip (8);
s205: selectively opening the electromagnetic valve (702) according to whether the air nozzle (703) is aligned with the chip (8) or not, and blowing air to transfer the chip (8) to the receiving substrate (9) to finish the transfer of the chip (8);
s206: steps S203-S205 are repeated until all chips (8) have completed the transfer.
10. The microwell array-based pneumatic macro transfer method of claim 9, wherein:
in the step S203: aligning an air nozzle (703) with a chip (8) and a solder paste/conductive adhesive (10), wherein a high-precision alignment platform is adopted for alignment work, and the functions of plane translation, rotation and space vertical motion are realized; s204: and observing the corresponding condition of the air nozzle (703) and the chip (8), wherein an industrial CCD camera and visual analysis software are adopted for observation.
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