CN115438763A - Electronic tag production process method and production device - Google Patents

Abstract

The invention discloses a production process method of an electronic tag, which at least comprises the following steps: processing a sizing material: stripping the covering films on the two rubber materials and cutting the rubber materials into rubber sheets with a first specification and rubber sheets with a second specification respectively; placing a first specification of film: placing a film of a first specification on a base film; placing an electronic chip: grabbing the electronic chip and placing the electronic chip on one side of the film with the first specification, which is back to the bottom film; placing a film of a second specification: laminating the films of the second specification on one side of the film of the first specification, which is back to the bottom film; laminating the films: and pressing the paired films of the first specification and the second specification. According to the invention, the glue stock is preprocessed into the films with two specifications to be used as a carrier for pressing the electronic chip to support the electronic tag, so that the waste of the glue stock in the process of subsequently cutting the electronic tag for use is avoided, and the production cost of the electronic tag is reduced. The invention also discloses an electronic tag production device suitable for the process method.

Description

Electronic tag production process method and production device

Technical Field

The invention relates to the technical field of electronic tag production, in particular to a production process method and a production device of an electronic tag.

Background

Under the background of global industrial intelligence and the rapid development of intelligent manufacturing in China, the Radio Frequency Identification (RFID) electronic tag for the tire is more and more widely applied to the tire industry, and the RFID electronic tag is implanted into the tire and used as related information of the tire, so that the RFID electronic tag has important significance for the standard production of the tire industry.

The RFID electronic tag for the tire needs to be preprocessed to a certain extent before being implanted into the tire, so that the electronic tag can be conveniently implanted, and the common processing mode is to encapsulate and press an RFID electronic chip into two layers of rubber materials with a special formula, press the two layers of rubber materials, and cut and process the rubber materials containing the RFID electronic chip into a style or specification which can be conveniently implanted into the tire. In the prior art, in the production process of the electronic tag, a plurality of electronic chips are packaged into two layers of sizing materials, then the sizing materials are cut, so that a plurality of two-layer sizing material structures laminated with the electronic chips are obtained, and subsequent implanting actions are carried out; on the other hand, after the electronic chip is wrapped by two layers of rubber materials, the positioning detection is difficult in the cutting process, and the electronic chip is easily cut by mistake due to the positioning deviation, so that the production loss is caused.

Therefore, how to reduce the production cost of the electronic tag becomes a technical problem that needs to be solved by those skilled in the art.

Disclosure of Invention

In view of the above, the present invention provides a method for manufacturing an electronic tag, so as to reduce the manufacturing cost of the electronic tag.

The invention also aims to provide an electronic tag production device which is suitable for the process method to produce the electronic tag.

In order to achieve the purpose, the invention provides the following technical scheme:

a production process method of an electronic tag at least comprises the following steps:

processing a sizing material: stripping the covering films on the two rubber materials, and respectively cutting the two rubber materials after stripping into a rubber sheet with a first specification and a rubber sheet with a second specification;

placing a first specification of film: placing the film of the first specification on a base film;

placing an electronic chip: grabbing an electronic chip and placing a single electronic chip on one side, back to the bottom film, of the film with the first specification;

placing a film of a second specification: after the electronic chip is placed, the films of the second specification are stacked on one side, back to the bottom film, of the films of the first specification;

laminating the films: the electronic chip is clamped between the paired films of the first specification and the second specification, and the paired films are borne by the bottom film to run so as to be pressed into an integral multilayer structure.

Preferably, in the above-mentioned process for producing electronic labels, the size of the film of the first specification is larger than that of the film of the second specification.

Preferably, in the above process for producing electronic labels, in the step of placing an electronic chip, the electronic chip is placed in the central position of the side of the film of the first specification opposite to the bottom film.

An electronic tag production device suitable for electronic tag production by the electronic tag production process method provided by any one of the above embodiments, comprising:

the two film stripping units are used for stripping the covering film on the sizing material;

a base film supply unit for supplying the base film;

the film cutting device comprises a first cutting and placing unit and a second cutting and placing unit, wherein the first cutting and placing unit is used for cutting the rubber material subjected to film stripping to obtain a film of a first specification, the film of the first specification is placed on the bottom film at intervals, the second cutting and placing unit is used for cutting the rubber material subjected to film stripping to obtain a film of a second specification, the film of the second specification is stacked and placed on one side, back to the bottom film, of the film of the first specification, and the placing position of the second cutting and placing unit is located at the downstream of the placing position of the first cutting and placing unit;

a pressing unit disposed downstream of the second cutting and placing unit to press a pair of the stacked films of the first and second specifications;

the chip placing unit is used for grabbing the electronic chip and placing the electronic chip on one side of a first specification or one side of a second specification, wherein the film is back to the bottom film, the placing position of the chip placing unit is located between the placing position of the first cutting placing unit and the placing position of the second cutting placing unit.

Preferably, in the electronic label producing apparatus, the films of the second format are stacked at an acute angle on a side of the films of the first format facing away from the base film.

Preferably, in the electronic tag production apparatus, the electronic tag production apparatus further comprises a chip supply unit, the chip supply unit is disposed upstream of the chip placement unit, and the chip supply unit is configured to arrange and convey the electronic chips at equal intervals to a grabbing position of the chip placement unit.

Preferably, in the electronic tag production apparatus, the electronic tag further includes a positioning sensor unit, a detection range of the positioning sensor unit at least includes a placement position of the chip placement unit, and the positioning sensor unit is configured to position and guide the chip placement unit to place the electronic chip at a central position of the film.

Preferably, in the above electronic tag production apparatus, the positioning sensor unit is an industrial vision camera, an eddy current sensor, or an optical sensor.

Preferably, in the electronic tag production apparatus, the pressing unit includes an upper pressing roller, a lower pressing roller and a driving motor, a gap between the upper pressing roller and the lower pressing roller is in interference fit with the stacked films of the first specification and the stacked films of the second specification, and the driving motor is in transmission connection with the upper pressing roller and the lower pressing roller to drive the upper pressing roller and the lower pressing roller to rotate.

Preferably, in the above electronic label producing apparatus, the first cutting and placing unit places the films of the first format on the base film at equal intervals.

According to the technical scheme, the production process method of the electronic tag at least comprises the following steps: the method comprises the steps of processing a rubber material, placing a rubber sheet with a first specification, placing an electronic chip, placing a rubber sheet with a second specification and laminating the rubber sheets, wherein in the step of processing the rubber material, the covering films on the two rubber materials are peeled off, and the two rubber materials with the peeled covering films are respectively cut into the rubber sheet with the first specification and the rubber sheet with the second specification, namely the rubber material is cut in the production process of the electronic tag, but the rubber material is not cut in the use process of the electronic tag in the prior art; in the step of placing the films of the first specification, a bottom film is used as a bearing piece of the films of the first specification, a single electronic chip is placed on one side, back to the bottom film, of the films of the first specification in the step of placing the electronic chip, after the placement of the electronic chip is completed, the films of the second specification are stacked on one side, back to the bottom film, of the films of the first specification, so that the electronic chip is clamped in cooperation with the films of the first specification, and in the step of laminating the films, the films of the first specification and the films of the second specification are pressed to form an integral multilayer structure, so that the electronic label is prepared.

According to the production process method of the electronic tag, the rubber materials are pre-cut into the rubber sheets with the first specification and the rubber sheets with the second specification, and the cut rubber sheets are used as carriers of the subsequent electronic tag to produce the electronic tag, compared with the technical means that a large amount of rubber materials are wasted due to the fact that the whole rubber materials are pressed into the electronic tag in the prior art, the rubber materials are cut and used immediately in the production stage and the use stage of the electronic tag, the rubber sheets formed by cutting the rubber materials are completely used, and the production cost of the electronic tag is reduced; meanwhile, in the electronic tag manufactured after the step of laminating the films is finished, the film structures of the electronic tag are arranged at intervals, so that when the electronic tag is required to be used, only the bottom films at two ends of a single electronic tag are required to be cut, the single electronic tag can be used, the cutting process is simple and transparent, the cut sizing material waste cannot be generated, the production loss is avoided, and the production cost of the electronic tag is further reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a flow chart of a manufacturing process of an electronic tag according to an embodiment of the present invention;

FIG. 2 is a schematic flow chart of a manufacturing process of an electronic tag according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an electronic tag production apparatus according to an embodiment of the present invention;

the device comprises a film peeling unit 10, a bottom film supplying unit 20, a bottom film 210, a first cutting and placing unit 30, a second cutting and placing unit 40, a chip placing unit 50, a laminating unit 60, an upper pressure roller 610, a lower pressure roller 620, a chip supplying unit 70, sizing material 810, film 820, an electronic chip 910 and an electronic label 920.

Detailed Description

The core of the invention is to disclose a production process method of the electronic tag, so as to reduce the production cost of the electronic tag.

The invention also aims to provide an electronic tag production device which is suitable for the process method to produce the electronic tag.

In order that those skilled in the art will better understand the solution of the present invention, embodiments of the present invention will be described below with reference to the accompanying drawings. The embodiments described below do not limit the contents of the invention described in the claims. The entire contents of the configurations shown in the following embodiments are not limited to those required as solutions of the inventions described in the claims.

As shown in fig. 1 and fig. 2, the electronic tag production process method provided in the embodiment of the present invention at least includes the steps of:

s01: processing a sizing material: stripping the covering films on the two rubber materials 810, and cutting the two rubber materials 810 stripped with the films into rubber sheets 820 with a first specification and rubber sheets 820 with a second specification respectively;

s02: placing a first specification of film: placing a first gauge of film 820 on a carrier film;

s03: placing an electronic chip: grabbing the electronic chip 910 and placing the single electronic chip 910 on the side of the film 820 of the first specification opposite to the base film 210;

s04: placing a film of a second specification: after the placement of the electronic chip 910 is completed, the second specification film 820 is stacked on the side of the first specification film 820 opposite to the bottom film 210;

s05: laminating the films: the pair of the first specification film 820 and the second specification film 820 sandwich the electronic chip 910 therebetween and are carried by the bottom film 210 to run so as to be laminated into an integral multi-layer structure.

It should be noted that in step S01, the sizing material 810 is cut in the production process of the electronic tag 920, rather than cutting the sizing material 810 in the use process of the electronic tag 920 in the prior art, the sizing material 810 is pre-cut in the invention to save the sizing material 810, and meanwhile, due to the pre-cutting of the sizing material 810, the electronic tag 920 cannot be mistakenly cut in the subsequent use, thereby saving the sizing material 810.

According to the production process method of the electronic tag, the rubber material 810 is cut into the rubber film 820 with the first specification and the rubber film 820 with the second specification in advance, the cut rubber film 820 is used as a carrier of the subsequent electronic tag 920 to produce the electronic tag 920, and compared with the technical means that a large amount of rubber material 810 is wasted due to the fact that the whole rubber material 810 is used for being pressed into the electronic tag 920 in the prior art, the production process method of the electronic tag achieves cutting and using of the rubber material 820 at the production stage and the use stage of the electronic tag 920, the rubber material 810 formed by cutting the rubber material 820 is completely used, and production cost of the electronic tag 920 is reduced.

On this basis, in the electronic tags 920 of making after the pressfitting film step is accomplished, because electronic tags 920's film 810 structure is the interval setting, only need decide the basement membrane 210 at single electronic tags 920 both ends when the use of electronic tags 920 is carried out in needs and can obtain single electronic tags 920 that can supply to use, the process of cutting is simple transparent, and can not produce the sizing material 820 waste material after cutting, has avoided production loss, has further reduced electronic tags 920's manufacturing cost.

Further, in an embodiment of the present invention, the size of the film 820 of the first specification is larger than that of the film 820 of the second specification, so that a certain error is generated when the film 820 of the second specification is stacked on the film 820 of the first specification, and the film 820 of the second specification is prevented from being placed askew and sliding off the film 820 of the first specification.

Further, in step S03, it is preferable that the electronic chip 910 is placed at a central position of a side of the film 820 with the first specification facing away from the bottom film 210, so that the electronic chip 910 is located at the central position of the film 820 with the first specification when the electronic tag 920 is formed, thereby ensuring that the electronic chip 910 is well implanted, the position of the electronic chip 910 is easily identified, and the electronic chip 910 is prevented from being cut by mistake when the electronic tag 920 is cut.

As shown in fig. 3, an electronic label producing apparatus for producing an electronic label by using the method of producing an electronic label provided in any of the above embodiments further includes a peeling unit 10, a bottom film supplying unit 20, a first cutting and placing unit 30, a second cutting and placing unit 40, a pressing unit 60, and a chip placing unit 50, where it is noted that the electronic label 920 has a structure in which a single electronic chip 910 is sandwiched between two layers of adhesive 810, in the electronic label producing apparatus provided in the embodiment of the present invention, the peeling unit 10 is used for peeling off a coating on the adhesive 810 to obtain an adhesive 810 that is not covered with the coating, and at least two peeling units 10 are provided to simultaneously perform a coating peeling operation of at least two layers of adhesive 810 in a subsequent process.

It should be noted that, in an embodiment of the present invention, the film peeling unit 10 drives the film peeling roller through the motor to peel the coated film of the sizing material 810, before peeling the coated film, an operator manually winds part of the coated film of the sizing material 810 around the film peeling roller, and then turns on the motor to peel the coated film of the sizing material 810 through rotation of the film peeling roller and drive the movement of the stripped sizing material 810.

After the sizing 810 finishes peeling off the coated film, one of the sizing 810 is cut by the first cutting and placing unit 30 to obtain a first specification of film 820, and the first specification of film 820 is placed on the base film 210 supplied by the base film supply unit 20 by the first cutting and placing unit 30; another piece of stock 810 is cut by the second cut and place unit 40 to obtain a second gauge of film 820.

It should be noted here that the matching manner of the film 820 of the first specification and the film 820 of the second specification is that after the first cutting and placing unit 30 places the film 820 of the first specification on the bottom film 210, the film 820 of the first specification moves along with the receiving rotation of the bottom film 210, and the second cutting and placing unit 40 places the film 820 of the second specification on the side of the film 820 of the first specification opposite to the bottom film 210 during the moving process, so as to complete the stacking arrangement of the two layers of films 820.

It should be further noted that the first cutting and placing unit 30 and the second cutting and placing unit 40 both cut by a cutter and are driven by a motor to move along a predetermined path and perform a placing operation, and the principle and structure thereof are common to those skilled in the art and therefore will not be described herein again.

In addition, the first cutting and placing unit 30 places the films 820 of the first specification on the bottom film 210 supplied by the bottom film supply unit 20 at intervals, it should be noted that the bottom film 210 is used for receiving and storing the films 820 conveniently, and places the films 820 of the first specification on the bottom film 210 at intervals so as to facilitate the independent cutting of the subsequent electronic labels 920, so that the distance between the adjacent films 820 on the bottom film 210 is convenient for the subsequent cutting of a single film 820.

The laminating unit 60 is disposed downstream of the second cutting and placing unit 40, and is configured to laminate the stacked films 820 and 820 of the first specification, and at the same time, a chip placing unit 50 is disposed upstream of the laminating unit 60, the chip placing unit 50 is configured to grasp the electronic chip 910, and place the electronic chip 910 on a side of the film 820 facing away from the bottom film 210, or place the electronic chip 910 on a side of the film 820 facing toward the bottom film 210, and the placing position of the chip placing unit 50 is located between the placing position of the first cutting and placing unit 30 and the placing position of the second cutting and placing unit 40, so as to form a structure in which the electronic chip 910 is sandwiched between the two films 820 after passing through the laminating unit 60, and meanwhile, since the films 820 of the first specification are spaced on the bottom film 210, after the laminating unit 60 completes the laminating operation, the electronic chips 910 on the bottom film 210 are also spaced to be collected into a roll, when the electronic label 920 is used, only the films 210 need to laminate the films 820 on the films 210, and the electronic label 920 can be produced by this processing method, and the cost of producing the electronic label can be saved by cutting waste material 810 to be used.

It should be further noted that, when the electronic tag 920 is implanted in a material obtained by the electronic tag production apparatus provided in the embodiment of the present invention, the transparent base film 210 is cut, and the cutting requirement only needs to ensure that a cutter does not contact the film 820 between the base films 210, and the cutting and positioning process is clear and convenient, whereas in the prior art, an opaque glue 810 needs to be cut, which easily causes a problem of mistakenly cutting the electronic chip 910 in the glue 810, thereby causing failure of the electronic tag 920, and therefore, the electronic tag production apparatus provided in the embodiment of the present invention has a significant meaning for accurately cutting the electronic tag 920, and can improve the yield of the electronic tag 920.

According to the electronic label production device provided by the invention, two sets of film peeling units 10 are used for peeling the covering films on two rubber materials 810, then a first cutting and placing unit 30 and a second cutting and placing unit 40 are used for respectively cutting the two rubber materials 810 to obtain the film 820 with the first specification and the film 820 with the second specification, the film 820 with the first specification is placed on the bottom film 210 supplied by the bottom film supply unit 20 through the first cutting and placing unit 30, the film 820 with the second specification is placed on the bottom film 210 through the second cutting and placing unit 40, the film 820 with the first specification is back to one side of the bottom film 210, meanwhile, the chip placing unit 50 is used for placing the film 820 with the first specification after the film 820 with the first specification is placed and before the film 820 with the second specification is placed, the electronic chip 910 is placed on one side, which is opposite to the bottom film 210, or the film 820 with the second specification faces to one side, so that the positions of the film 820 with the second specification are pressed into an integral structure, the film 820 with the first specification and the film 820 with the second specification are pressed into a structure, the electronic label packaging film 820, when the electronic label needs to be used later, a cutting tool, the electronic label 920 can be conveniently used for producing the electronic label 920, and the electronic label 920 can be produced by only when the adjacent cutting tool 920, so that the adjacent cutting tool 920 is needed, and the cost of the adjacent electronic label 920 can be saved.

Further, in order to avoid the electronic label 920 from being failed due to the existence of air between the two layers of films 820 in the electronic label 920, in an embodiment of the present invention, the films 820 of the second specification are stacked at an angle on the side of the film 820 of the first specification opposite to the bottom film 210 and are pressed by the pressing unit 60.

Further, in the electronic tag production apparatus provided in the embodiment of the present invention, the first cutting and placing unit 30 and the second cutting and placing unit 40 are used to simultaneously cut and process two rubber materials 810 to obtain a rubber sheet 820 of a first specification and a rubber sheet 820 of a second specification, it should be noted that the first specification and the second specification may be the same or different, and the first specification and the second specification are the same, so that the produced electronic tag 920 has a uniform shape and structure, and the front and back sides do not need to be distinguished in the implantation process, and the first specification and the second specification can be implanted toward the tire by using the side with a larger area when being different, so that the combination degree of the electronic tag 920 implanted with the tire is better, the quality of the electronic tag 920 implanted with the tire is ensured, and the first specification and the second specification can be determined according to the application requirements of an actual production machine.

Further, in an embodiment of the present invention, the electronic tag manufacturing apparatus further includes a chip supply unit 70 for supplying chips, the chip supply unit 70 is disposed at an upstream of the chip placement unit 50, the chip supply unit 70 is configured to arrange the electronic chips 910 at equal intervals and convey the electronic chips 910 to a grabbing position of the chip placement unit 50 through a conveying component such as a conveyor belt or a conveyor chain, and the chip supply unit 70 pre-arranges the electronic chips 910, so that the chip placement unit 50 only needs to perform a reciprocating motion between the grabbing position and the placement position of the electronic chips 910, and does not need to grab the electronic chips 910 after performing self-detection, thereby simplifying a structural form of the chip placement unit 50 and improving accuracy of the chip placement unit 50 in grabbing the electronic chips 910.

In order to ensure that the electronic chip 910 is accurately and perfectly placed on the film 820 by the chip placing unit 50, in a specific embodiment of the electronic tag production apparatus provided by the present invention, the apparatus further includes a positioning sensor unit, a detection range of the positioning sensor unit at least includes a placing position where the chip placing unit 50 places the electronic chip 910, the positioning sensor unit is used for detecting and positioning a central position of the film 820, and the feedback controller controls the chip placing unit 50 to guide the chip placing unit 50 to place the electronic chip 910 at the central position of the film 820 and place the electronic chip 910 at the central position of the film 820, so that the electronic chip 910 is better protected by two layers of the film 820 during the use of the electronic tag 920.

It should be noted that the positioning sensor unit is an industrial vision camera, an eddy current sensor or an optical sensor, and in a preferred embodiment of the present invention, the positioning sensor unit is an industrial vision camera.

Further, in an embodiment of the present invention, the pressing unit 60 includes one or more upper pressing rollers 610, lower pressing rollers 620 and a driving motor, where the driving motor is in transmission connection with both the upper pressing rollers 610 and the lower pressing rollers 620 to drive the upper pressing rollers 610 and the lower pressing rollers 620 to rotate through the driving motor, and at the same time, a gap between the upper pressing rollers 610 and the lower pressing rollers 620 and a pair of stacked films 820 of the first specification and films 820 of the second specification are in interference fit, so that the two layers 820 of films 820 on the bottom film 210 are tightly pressed into an integral structure when passing through the pressing unit 60, and the upper pressing rollers 610 and the lower pressing rollers 620 are arranged to drive the two layers 820 of films 820 to move backwards to perform a rolling and receiving action while achieving pressing of the two layers 820 of films.

In order to further optimize the above technical solution, in an embodiment of the present invention, the first cutting and placing unit 30 places the cut film 820 of the first specification on the bottom film 210 at equal intervals, so as to facilitate the accuracy of placing the electronic chip 910 by the subsequent chip placing unit 50 and the accuracy of cutting for cutting the electronic label 920.

The terms "first," "second," "left," and "right," etc. in the description and claims of the invention and the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not set forth for a listed step or element but may include other steps or elements not listed.

It should be understood that, if a "system," "apparatus," "unit" and/or "module" is used herein, it is merely a way to distinguish different components, elements, components, parts or assemblies at different levels. However, other words may be substituted by other expressions if they accomplish the same purpose. Wherein in the description of the embodiments of the present application, "/" indicates an inclusive meaning, for example, a/B may indicate a or B; "and/or" herein is merely an association describing an associated object, and means that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of the present application, "a plurality" means two or more than two.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A production process method of an electronic tag is characterized by at least comprising the following steps:

processing a sizing material: peeling off the covering films on the two rubber materials (810), and cutting the two peeled rubber materials (810) into a rubber sheet (820) with a first specification and a rubber sheet (820) with a second specification respectively;

placing a first specification of film: placing the film (820) of a first gauge on a carrier film (210);

placing an electronic chip: grabbing an electronic chip (910) and placing the electronic chip (910) on a side of the film (820) with a first specification, which faces away from the bottom film (210);

placing a film of a second specification: after the placement of the electronic chip (910) is finished, the film (820) with the second specification is stacked and placed on one side, opposite to the bottom film (210), of the film (820) with the first specification;

laminating the films: the pair of the film (820) with the first specification and the film (820) with the second specification clamps the electronic chip (910) in the middle, and is carried by the bottom film (210) to run so as to be pressed into an integral multi-layer structure.

2. The electronic label production process of claim 1 wherein said film (820) of a first gauge is larger in size than said film (820) of a second gauge.

3. The electronic label producing process according to claim 1, wherein in the electronic chip placing step, the electronic chip (910) is placed at a central position of a side of the film (820) of the first gauge facing away from the base film (210).

4. An electronic label production apparatus suitable for electronic label production by the process according to any one of claims 1 to 3, comprising:

two film stripping units (10), wherein the film stripping units (10) are used for stripping the covering film on the sizing material (810);

a base film supply unit (20) for supplying the base film (210);

a first cutting and placing unit (30) and a second cutting and placing unit (40), wherein the first cutting and placing unit (30) is used for cutting the rubber compound (810) after the film stripping to obtain the rubber sheet (820) with a first specification, and placing the rubber sheet (820) with the first specification on the bottom film (210) at intervals, the second cutting and placing unit (40) is used for cutting the rubber compound (810) after the film stripping to obtain the rubber sheet (820) with a second specification, and placing the rubber sheet (820) with the second specification on the side, opposite to the bottom film (210), of the rubber sheet (820) with the first specification in a stacking mode, and the placing position of the second cutting and placing unit (40) is located at the downstream of the placing position of the first cutting and placing unit (30);

a stitching unit (60), the stitching unit (60) being disposed downstream of the second slit placement unit (40) to stitch the stacked pair of the film sheets (820) of the first gauge and the film sheets (820) of the second gauge;

the chip placing unit (50) is used for grabbing the electronic chip (910) and placing the electronic chip (910) on one side of the film (820) with a first specification, which is back to the bottom film (210), or one side of the film (820) with a second specification, which faces the bottom film (210), and the placing position of the chip placing unit (50) is located between the placing position of the first cutting placing unit (30) and the placing position of the second cutting placing unit (40).

5. The apparatus for producing electronic labels according to claim 4, wherein said film (820) of the second format is stacked at an acute angle on a side of said film (820) of the first format facing away from said carrier film (210).

6. The electronic tag production apparatus according to claim 4, further comprising a chip supply unit (70), wherein the chip supply unit (70) is disposed upstream of the chip placement unit (50), and the chip supply unit (70) is configured to arrange and convey the electronic chips (910) at equal intervals to a gripping position of the chip placement unit (50).

7. The electronic label producing apparatus according to claim 4, further comprising a positioning sensor unit, a detection range of which includes at least a placement position of the chip placement unit (50), the positioning sensor unit being configured to position and guide the chip placement unit (50) to place the electronic chip (910) at a central position of the film (820).

8. The electronic label producing apparatus as claimed in claim 7, wherein said positioning sensor unit is an industrial vision camera, an eddy current sensor or an optical sensor.

9. The electronic label producing apparatus according to claim 4, wherein the pressing unit (60) includes an upper pressing roller (610), a lower pressing roller (620), and a driving motor, a gap between the upper pressing roller (610) and the lower pressing roller (620) is in interference fit with the laminated films (820) of the first specification and the films (820) of the second specification, and the driving motor is in driving connection with the upper pressing roller (610) and the lower pressing roller (620) to drive the upper pressing roller (610) and the lower pressing roller (620) to rotate.

10. The apparatus for producing electronic labels as claimed in any of claims 4-9, wherein said first cutting and placing unit (30) places said film (820) of a first format equally spaced on said base film (210).

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